Revised June 2003 FIN1027 • FIN1027A 3.3V LVDS 2-Bit High Speed Differential Driver General Description Features This dual driver is designed for high speed interconnects utilizing Low Voltage Differential Signaling (LVDS) technology. The driver translates LVTTL signal levels to LVDS levels with a typical differential output swing of 350 mV which provides low EMI at ultra low power dissipation even at high frequencies. This device is ideal for high speed transfer of clock or data. ■ Greater than 600Mbs data rate The FIN1027 or FIN1027A can be paired with its companion receiver, the FIN1028, or with any other LVDS receiver. ■ Meets or exceeds the TIA/EIA-644 LVDS standard ■ 3.3V power supply operation ■ 0.5ns maximum differential pulse skew ■ 1.5ns maximum propagation delay ■ Low power dissipation ■ Power-Off protection ■ Flow-through pinout simplifies PCB layout ■ 8-Lead SOIC, US8, and 8-terminal MLP packages save space Ordering Code: Order Number Package Number Package Description FIN1027M M08A 8-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow [TUBE] FIN1027MX M08A 8-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow [TAPE and REEL] FIN1027K8X MAB08A 8-Lead US8, JEDEC MO-187, Variation CA 3.1mm Wide [TAPE and REEL] FIN1027MPX (Preliminary) MLP08C 8-Terminal Molded Leadless Package (MLP) Dual, JEDEC MO-229, 2mm Square [TAPE and REEL] FIN1027AM M08A 8-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow [TUBE] FIN1027AMX M08A 8-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow [TAPE and REEL] © 2003 Fairchild Semiconductor Corporation DS500501 www.fairchildsemi.com FIN1027 • FIN1027A 3.3V LVDS 2-Bit High Speed Differential Driver April 2001 FIN1027 • FIN1027A Connection Diagrams Pin Assignments for SOIC FIN1027 Pin Assignments for US8 for FIN1027 (Top View) (Top View) Pin Assignments for SOIC FIN1027A Terminal Assignments for MLP FIN1027 (Top Through View) (Top View) Pin Descriptions Pin Name DIN1, DIN2 Function Table Description Input LVTTL Data Inputs Outputs DIN DOUT+ DOUT− H DOUT1+, DOUT2+ Non-inverting Driver Outputs L L DOUT1−, DOUT2− Inverting Driver Outputs H H L OPEN L H VCC Power Supply GND Ground www.fairchildsemi.com H = HIGH Logic Level L = LOW Logic Level X = Don’t Care 2 Supply Voltage (VCC) −0.5V to +4.6V DC Input Voltage (DIN) −0.5V to +6.0V DC Output Voltage (DOUT ) −0.5V to +4.7V Driver Short Circuit Current (IOSD) Storage Temperature Range (TSTG) Recommended Operating Conditions Supply Voltage (VCC) 3.0V to 3.6V Input Voltage (VIN) Continuous 0 to VCC −40°C to +85°C Operating Temperature (TA) −65°C to +150°C 150°C Max Junction Temperature (TJ) Lead Temperature (TL) (Soldering, 10 seconds) 260°C ESD (Human Body Model) ≥ 6500V Note 1: The “Absolute Maximum Ratings”: are those values beyond which damage to the device may occur. The databook specifications should be met, without exception, to ensure that the system design is reliable over its power supply, temperature and output/input loading variables. Fairchild does not recommend operation of circuits outside databook specification. ≥ 400V ESD (Machine Model) DC Electrical Characteristics Over supply voltage and operating temperature ranges, unless otherwise specified Symbol Parameter VOD Output Differential Voltage ∆VOD VOD Magnitude Change from VOS Offset Voltage ∆VOS Offset Magnitude Change from Differential LOW-to-HIGH Test Conditions RL = 100 Ω, See Figure 1 Min Typ Max (Note 2) Units 250 350 450 mV 25 mV 1.125 1.25 1.375 V 25 mV µA Differential LOW-to-HIGH IOFF Power Off Output Current VCC = 0V, VOUT = 0V or 3.6V ±20 IOS Short Circuit Output Current VOUT = 0V −8 VIH Input HIGH Voltage 2.0 VCC V VIL Input LOW Voltage GND 0.8 V IIN Input Current VIN = 0V or VCC ±20 µA II(OFF) Power-Off Input Current VCC = 0V, VIN = 0V or 3.6V ±20 µA VIK Input Clamp Voltage IIK = −18 mA ICC Power Supply Current No Load, VIN = 0V or VCC 12.5 mA 17.0 mA CIN Input Capacitance 4 pF COUT Output Capacitance 6 pF VOD = 0V ±8 −1.5 mA V RL = 100 Ω, VIN = 0V or VCC Note 2: All typical values are at TA = 25°C and with VCC = 3.3V. 3 www.fairchildsemi.com FIN1027 • FIN1027A Absolute Maximum Ratings(Note 1) FIN1027 • FIN1027A AC Electrical Characteristics Over supply voltage and operating temperature ranges, unless otherwise specified Symbol tPLHD Parameter Test Conditions Differential Propagation Delay LOW-to-HIGH tPHLD Differential Propagation Delay HIGH-to-LOW Min Typ Max (Note 3) Units 0.5 1.5 ns 0.5 1.5 ns ns tTLHD Differential Output Rise Time (20% to 80%) RL = 100 Ω, CL = 10pF, 0.4 1.0 tTHLD Differential Output Fall Time (80% to 20%) 0.4 1.0 ns tSK(P) Pulse Skew |tPLH - tPHL| 0.5 ns 0.3 ns 1.0 ns tSK(LH), Channel-to-Channel Skew tSK(HL) (Note 4) tSK(PP) Part-to-Part Skew (Note 5) See Figure 2 and Figure 3 Note 3: All typical values are at TA = 25°C and with VCC = 3.3V. Note 4: tSK(LH), tSK(HL) is the skew between specified outputs of a single device when the outputs have identical loads and are switching in the same direction. Note 5: tSK(PP) is the magnitude of the difference in propagation delay times between any specified terminals of two devices switching in the same direction (either LOW-to-HIGH or HIGH-to-LOW) when both devices operate with the same supply voltage, same temperature, and have identical test circuits. Note A: All input pulses have frequency = 10 MHz, tR or tF = 2 ns Note B: C L includes all probe and fixture capacitances FIGURE 2. Differential Driver Propagation Delay and Transition Time Test Circuit FIGURE 1. Differential Driver DC Test Circuit FIGURE 3. AC Waveforms www.fairchildsemi.com 4 FIN1027 • FIN1027A DC / AC Typical Performance Curves FIGURE 4. Output High Voltage vs. Power Supply Voltage FIGURE 5. Output Low Voltage vs. Power Supply Voltage FIGURE 6. Output Short Circuit Current vs. Power Supply Voltage FIGURE 7. Differential Output Voltage vs. Power Supply Voltage FIGURE 8. Differential Output Voltage vs. Load Resistor FIGURE 9. Offset Voltage vs. Power Supply Voltage 5 www.fairchildsemi.com FIN1027 • FIN1027A DC / AC Typical Performance Curves (Continued) FIGURE 10. Power Supply Current vs. Frequency FIGURE 11. Power Supply Current vs. Power Supply Voltage FIGURE 12. Power Supply Current vs. Ambient Temperature FIGURE 13. Differential Propagation Delay vs. Power Supply FIGURE 14. Differential Propagation Delay vs. Ambient Temperature FIGURE 15. Differential Skew (tPLH - tPHL) vs. Power Supply www.fairchildsemi.com 6 FIGURE 16. Differential Pulse Skew (tPLH - tPHL) vs. Ambient Temperature FIN1027 • FIN1027A DC / AC Typical Performance Curves (Continued) FIGURE 17. Transition Time vs. Power Supply Voltage FIGURE 18. Transition Time vs. Ambient Temperature 7 www.fairchildsemi.com FIN1027 • FIN1027A Tape and Reel Specification TAPE FORMAT for US8 Package Tape Number Cavity Section Cavities Status Status Leader (Start End) 125 (typ) Empty Sealed Designator K8X Cover Tape Carrier 250 Filled Sealed Trailer (Hub End) 75 (typ) Empty Sealed TAPE DIMENSIONS inches (millimeters) REEL DIMENSIONS inches (millimeters) Tape Size 8 mm A B C D N W1 W2 W3 7.0 0.059 0.512 0.795 2.165 0.331 + 0.059/−0.000 0.567 W1 + 0.078/−0.039 (177.8) (1.50) (13.00) (20.20) (55.00) (8.40 + 1.50/−0.00) (14.40) (W1 + 2.00/−1.00) www.fairchildsemi.com 8 TAPE FORMAT for MLP Ao Bo Package ±0.10 ±0.10 2x2 2.30 2.30 D D1 E F Ko P1 Po P2 T TC W Wc ±0.05 Min ±0.1 ±0.1 ±0.1 TYP TYP ±0/05 TYP ±0.005 ±0.3 TYP 1.55 1.0 1.75 3.5 1.0 8.0 4.0 2.0 0.3 0.06 8.0 5.3 MLP Embossed Tape Dimensions (Dimensions are in millimeters) REEL DIMENSIONS (millimeters) Tape Width Dia A Max Dim B Min Dia C +0.5/−0.2 Dia D Min Dim N Min Dim W1 +2/−0 Dim W2 Max Dim W3 (LSL - USL) 8 mm 330 1.5 13 20.2 178 8.4 14.4 7.9 ∼ 10.4 9 www.fairchildsemi.com FIN1027 • FIN1027A Tape and Reel Specification FIN1027 • FIN1027A Physical Dimensions inches (millimeters) unless otherwise noted 8-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow Package Number M08A www.fairchildsemi.com 10 FIN1027 • FIN1027A Physical Dimensions inches (millimeters) unless otherwise noted (Continued) 8-Lead US8, JEDEC MO-187, Variation CA 3.1mm Wide Package Number MAB08A 11 www.fairchildsemi.com FIN1027 • FIN1027A 3.3V LVDS 2-Bit High Speed Differential Driver Physical Dimensions inches (millimeters) unless otherwise noted (Continued) 8-Terminal Molded Leadless Package (MLP) Dual, JEDEC MO-229, 2mm Square Package Number MLP08C (Preliminary) Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. www.fairchildsemi.com www.fairchildsemi.com 12