NEC FP1L2Q On-chip resistor pnp silicon epitaxial transistor for mid-speed switching Datasheet

DATA SHEET
COMPOUND TRANSISTOR
FP1 SERIES
on-chip resistor PNP silicon epitaxial transistor
For mid-speed switching
FEATURES
PACKAGE DRAWING (UNIT: mm)
• Up to 0.7 A current drive available
• On-chip bias resistor
• Low power consumption during drive
QUALITY GRADES
• Standard
Please refer to “Quality Grades on NEC Semiconductor
Devices” (Document No. C11531E) published by NEC Corporation
to know the specification of quality grade on the devices and its
recommended applications.
FP1 SERIES LISTS
Products
Marking
R1 (KΩ)
R2 (KΩ)
FP1A4A
S30
−
10
FP1L2Q
S31
0.47
4.7
FP1A3M
S32
1.0
1.0
FP1F3P
S33
2.2
10
FP1J3P
S36
3.3
10
FP1L3N
S34
4.7
10
FP1A4M
S35
10
10
ABSOLUTE MAXIMUM RATINGS (Ta = 25°°C)
Parameter
Symbol
Ratings
Unit
Collector to base voltage
VCBO
−25
V
Collector to emitter voltage
VCEO
−25
V
Emitter to base voltage
VEBO
−10
V
IC(DC)
−0.7
A
IC(pulse) *
−1.0
A
IB(DC)
−20
mA
PT
200
mW
Collector current (DC)
Collector current (Pulse)
Base current (DC)
Total power dissipation
Junction temperature
Tj
150
°C
Storage temperature
Tstg
−55 to +150
°C
* PW ≤ 10 ms, duty cycle ≤ 50 %
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for
availability and additional information.
Document No. D16181EJ1V0DS00 (1st edition)
Date Published April 2002 N CP(K)
Printed in Japan
©
2002
1998
FP1 SERIES
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Data Sheet D16181EJ1V0DS
FP1 SERIES
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Data Sheet D16181EJ1V0DS
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FP1 SERIES
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Data Sheet D16181EJ1V0DS
FP1 SERIES
TYPICAL CHARACTERISTICS (Ta = 25°°C)
Data Sheet D16181EJ1V0DS
5
FP1 SERIES
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions.
For soldering methods and conditions other than those recommended below, contact an NEC sales representative.
Surface MOUNTING TYPE
For details of the recommended soldering conditions, refer to the document Semiconductor Device Mounting
Technology Manual (C10535E).
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* After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
Cautions 1. Do not use different soldering methods together (except for partial heating).
2. Prevent the resin surface temperature from being higher than the board temperature by 20°°C or
more.
6
Data Sheet D16181EJ1V0DS
FP1 SERIES
[MEMO]
Data Sheet D16181EJ1V0DS
7
FP1 SERIES
• The information in this document is current as of July, 2001. The information is subject to change
without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data
books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products
and/or types are available in every country. Please check with an NEC sales representative for
availability and additional information.
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M8E 00. 4
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