Fairchild FPF1003A Intellimaxâ ¢ advanced load management product Datasheet

FPF1003A / FPF1004
IntelliMAX™ Advanced Load Management Products
Features
Description


The FPF1003A and FPF1004 are low RDS P-channel
MOSFET load switches with controlled turn-on. The
input voltage range operates from 1.2 V to 5.5 V to fulfill
today's ultra-portable device supply requirements.
Switch control is accomplished with a logic input (ON)
capable of interfacing directly with low-voltage control
signal. In FPF1004, a 120 Ω on-chip load resistor is
added for output quick discharge when the switch is
turned off.
1.2 V to 5.5 V Input Voltage Operating Range
Typical RDS(ON):
- 30 mΩ at VIN=5.5 V
-


35 mΩ at VIN=3.3 V
ESD Protected: Above 8000 V HBM
ROHS Compliant
Both FPF1003A and FPF1004 are available in a spacesaving 1.0x1.5 mm2 wafer-level chip-scale package.
Applications







PDA’s
Cell Phones
GPS Devices
MP3 Players
Digital Cameras
Peripheral Ports
Hot Swap Supplies
Ordering Information
Part Number Top Mark
FPF1003A
FPF1004
Q2
Q3
© 2007 Fairchild Semiconductor Corporation
FPF1003A / FPF1004 • Rev. 1.0.6
Switch
30 mΩ,
PMOS
Input
Buffer
Output
Discharge
ON Pin
Activity
NA
Active
HIGH
120Ω
Active
HIGH
Schmitt
Package
1.0 x 1.5 mm2 Wafer-Level
Chip-Scale Package (WLCSP),
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FPF1003A / FPF1004 — IntelliMAX™ Advanced Load Management Products
August 2012
VIN
OFF ON
ON
VOUT
To Load
GND
Figure 1. Typical Application
Block Diagram
Figure 2. Functional Block Diagram
© 2007 Fairchild Semiconductor Corporation
FPF1003A / FPF1004 • Rev. 1.0.6
www.fairchildsemi.com
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FPF1003A / FPF1004 — IntelliMAX™ Advanced Load Management Products
Application Diagram
Figure 3. WLCSP Bumps Facing UP
Figure 4. WLCSP Bumps Facing Down
Figure 5. 1.0mm x 1.5mm WLCSP Pin Assignments (Bottom View)
Pin Definitions
Pin #
Name
Description
A2, B2
VIN
Input to the power switch and the supply voltage for the IC
C2
ON
ON Control Input
A1, B1
VOUT
Output of the power switch
C1
GND
Ground
© 2007 Fairchild Semiconductor Corporation
FPF1003A / FPF1004 • Rev. 1.0.6
www.fairchildsemi.com
3
FPF1003A / FPF1004 — IntelliMAX™ Advanced Load Management Products
Pin Configurations
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only.
Symbol
Parameter
Min.
Max.
Unit
-0.3
6.0
V
VIN
VIN, VOUT, ON to GND
ISW
Maximum Continuous Switch Current
2.0
A
PD
Power Dissipation at TA=25°C(1)
1.2
W
TSTG
Storage Junction Temperature
-65
+150
°C
TA
Operating Temperature Range
-40
+125
°C
ΘJA
Thermal Resistance, Junction-to-Ambient
85
°C/W
ESD
Electrostatic Discharge Capability
Human Body Model, JESD22-A114
5500
Charged Device Model, JESD22-C101
1500
V
Note:
1. Package power dissipation on one square inch pad, 2 oz.
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to Absolute Maximum Ratings.
Symbol
Parameter
Min.
Max.
Unit
VIN
Supply Voltage
1.2
5.5
V
TA
Ambient Operating Temperature
-40
+85
°C
© 2007 Fairchild Semiconductor Corporation
FPF1003A / FPF1004 • Rev. 1.0.6
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FPF1003A / FPF1004 — IntelliMAX™ Advanced Load Management Products
Absolute Maximum Ratings
Unless otherwise noted, VIN=1.2 to 5.0V, TA=-40 to +85°C; typical values are at VIN=3.3V and TA=25°C.
Symbol
Parameter
Conditions
Min.
Typ.
Max.
Units
5.5
V
VON=GND, OUT=Open
1
μA
VON=GND, VOUT=0 at VIN=5.5, TA=85°C
1
μA
100
nA
1
μA
Basic Operation
VIN
IQ(OFF)
Supply Voltage
Off Supply Current
ISD
Shutdown Current
IQ
Quiescent Current
RON
On-Resistance
1.2
VON=GND, VOUT=0 at VIN=3.3, TA=85°C
10
IOUT=0 mA, VIN=VON
VIN=5.5 V, IOUT=1 A, TA=25°C
20
30
VIN=3.3 V, IOUT=1 A, TA=25°C
25
35
VIN=1.5 V, IOUT=1 A, TA=25°C
50
75
VIN=1.2 V, IOUT=1 A, TA=25°C
95
150
VIN=3.3 V, IOUT=1 A, TA=85°C
30
42
VIN=3.3 V, IOUT=1 A, TA=40°C to 85°C
12
mΩ
42
RPD
Output Pull-Down
Resistance
VIH
ON Input Logic High
Voltage
VIN=1.2 V
VIL
ON Input Logic Low
Voltage
VIN=2.7 V to 5.5 V
0.8
VIN=1.2 V
0.35
ION
ON Input Leakage
VON=VIN or GND
VIN=3.3 V, VON=0 V, TA=25°C, FPF1004
VIN=1.2 V to 5.5 V
75
120
Ω
2
V
0.8
1
V
μA
Dynamic Characteristics
tON
tOFF
tR
tF
Turn-On Time
Turn-Off Time
VOUT Rise Time
VOUT Fall Time
© 2007 Fairchild Semiconductor Corporation
FPF1003A / FPF1004 • Rev. 1.0.6
VIN=3.3 V, RL=500 Ω, CL=0.1 µF,
TA=25°C
13
VIN=3.3 V, RL=500 Ω, CL=0.1 µF,
TA=25°C, FPF1003A
45
VIN=3.3 V, RL=500 Ω, CL=0.1 µF,
RL_CHIP=120 Ω, TA=25°C, FPF1004
15
VIN=3.3 V, RL=500 Ω, CL=0.1 µF,
TA=25°C
13
VIN=3.3 V, RL=500 Ω, CL=0.1 µF,
TA=25°C, FPF1003A
113
VIN=3.3 V, RL=500 Ω, CL=0.1 µF,
RL_CHIP=120 Ω, TA=25°C, FPF1004
10
μs
μs
μs
μs
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FPF1003A / FPF1004 — IntelliMAX™ Advanced Load Management Products
Electrical Characteristics
Typical Performance Characteristics
Figure 6. Quiescent Current vs. VIN
Figure 7. ON Threshold vs. VIN
Figure 8. Quiescent Current vs. Temperature
Figure 9. Quiescent Current (OFF) vs. Temperature
Figure 10. ISWITCH-OFF Current vs. Temperature
Figure 11. ISWITCH-OFF Current vs. VIN
© 2007 Fairchild Semiconductor Corporation
FPF1003A / FPF1004 • Rev. 1.0.6
www.fairchildsemi.com
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Figure 12. RON vs. VIN
Figure 13. RON vs. Temperature
Figure 14. tON/tOFF vs. Temperature
Figure 15. tR/tF vs. Temperature
Figure 16. FPF1003A tON Response
Figure 17. FPF1003A tOFF Response
© 2007 Fairchild Semiconductor Corporation
FPF1003A / FPF1004 • Rev. 1.0.6
FPF1003A / FPF1004 — IntelliMAX™ Advanced Load Management Products
Typical Performance Characteristics
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Figure 18. FPF1003A tON Response
Figure 19. FPF1003A tOFF Response
Figure 20. FPF1004 tON Response
Figure 21. FPF1004 tOFF Response
Figure 22. FPF1004 tON Response
Figure 23. FPF1004 tOFF Response
© 2007 Fairchild Semiconductor Corporation
FPF1003A / FPF1004 • Rev. 1.0.6
FPF1003A / FPF1004 — IntelliMAX™ Advanced Load Management Products
Typical Performance Characteristics
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1.2 to 5.5 V. Switch control is accomplished with a logic
input (ON) capable of interfacing directly with lowvoltage control signal. In FPF1004, a 120 Ω on-chip load
resistor is added for output quick discharge when the
switch is turned off.
Input Capacitor
FPF1003A and FPF1004 are low-RDS(ON) P-channel
load switches with controlled turn-on. The core of each
device is a 30 mΩ P-Channel MOSFET and a controller
capable of functioning over an input operating range of
Application Information
Figure 24. Typical Application
PMOS switch, a CIN greater than COUT is recommended.
A COUT greater than CIN can cause VOUT to exceed VIN
when the system supply is removed. This could result in
current flow through the body diode from VOUT to VIN.
Input Capacitor
To limit the voltage drop on the input supply caused by
transient inrush currents when the switch turns on into a
discharged load capacitor or short-circuit, a capacitor
needs to be placed between VIN and GND. A 0.1 μF
ceramic capacitor, CIN, must be placed close to the VIN
pin. A higher value of CIN can be used to further reduce
the voltage drop experienced as the switch is turned on
into a large capacitive load.
Board Layout
For best performance, all traces should be as short as
possible. To be most effective, the input and output
capacitors should be placed close to the device to
minimize the effects that parasitic trace inductances
may have on normal and short-circuit operation. Using
wide traces for VIN, VOUT, and GND minimizes the
parasitic electrical effects and case-to-ambient thermal
impedance.
Output Capacitor
A 0.1 μF capacitor, COUT, should be placed between
VOUT and GND. This capacitor prevents parasitic board
inductance from forcing VOUT below GND when the
switch turns off. Due to the integral body diode in the
© 2007 Fairchild Semiconductor Corporation
FPF1003A / FPF1004 • Rev. 1.0.6
FPF1003A / FPF1004 — IntelliMAX™ Advanced Load Management Products
Description of Operation
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9
0.03 C
E
2X
F
A
(Ø0.350)
SOLDER MASK
OPENING
B
(Ø0.250)
Cu Pad
A1
(1.00)
BALL A1
INDEX AREA
D
(0.50)
0.03 C
2X
TOP VIEW
RECOMMENDED LAND PATTERN
(NSMD PAD TYPE)
0.06 C
0.625
0.539
0.05 C
C
0.332±0.018
0.250±0.025
E
SEATING PLANE
D
SIDE VIEWS
NOTES:
A. NO JEDEC REGISTRATION APPLIES.
0.005
Ø0.315 +/- .025
6X
0.50
C
1.00
B
A
0.50
(Y) ±0.018
1 2
F
(X) ±0.018
BOTTOM VIEW
C A B
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS AND TOLERANCE
PER ASMEY14.5M, 1994.
D. DATUM C IS DEFINED BY THE SPHERICAL
CROWNS OF THE BALLS.
E. PACKAGE NOMINAL HEIGHT IS 582 MICRONS
±43 MICRONS (539-625 MICRONS).
F. FOR DIMENSIONS D, E, X, AND Y SEE
PRODUCT DATASHEET.
FPF1003A / FPF1004 — IntelliMAX™ Advanced Load Management Products
Physical Dimensions
G. DRAWING FILNAME: MKT-UC006AFrev2.
Figure 25. 1.0 x 1.5 mm2 Wafer-Level Chip-Scale Package (WLCSP)
Product-Specific Dimensions
Product
D
E
X
Y
FPF1003A
1480 µm ± 30 µm
980 µm ± 30 µm
240 µm
240 µm
FPF1004
1480 µm ± 30 µm
980 µm ± 30 µm
240 µm
240 µm
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the
warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
© 2007 Fairchild Semiconductor Corporation
FPF1003A / FPF1004 • Rev. 1.0.6
www.fairchildsemi.com
10
FPF1003A / FPF1004 — IntelliMAX™ Advanced Load Management Products
© 2007 Fairchild Semiconductor Corporation
FPF1003A / FPF1004 • Rev. 1.0.6
www.fairchildsemi.com
11
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