Seoul FR104-II1 1.6*0.8*0.4mm untinted, diffused flat mold dominant wavelength: 625nm Datasheet

Technical Data Sheet
Pb Free
Specification
FR104-II1
SSC
Drawn
Approval
Customer
Approval
Rev. 08
January 2012
WWW.SEOULSEMICON.COM
서식번호 : SSC- QP- 7- 07- 25 (Rev.0.0)
Technical Data Sheet
[ Contents ]
1. Description
2. Absolute maximum ratings
3. Electro-Optical characteristics
4. Characteristic diagrams
5. Reliability result
6. Rank
7. Outline Dimension
8. Material
9. Reel Structure
10. Packing
11. Soldering profile
12. Precaution for Use
Rev. 08
January 2012
WWW.SEOULSEMICON.COM
서식번호 : SSC- QP- 7- 07- 25 (Rev.0.0)
Technical Data Sheet
FR104-II1
-
1. Description
Features
Small size suitable for compact
•
1.6 X 0.8 X 0.4 mm
•
Untinted, Diffused flat
appliances.
-
FR104-II1
Surface-mounted chip LED
mold
device.
•
-
Pb-free and RoHS complaint
Dominant Wavelength :
625nm
component.
-
High brightness, High efficiency
-
Tape and Reel packing.
Applications
-
Increases the life time of battery.
Cellular phone’s keypad
lightning
Information Boards
Rev. 08
January 2012
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서식번호 : SSC- QP- 7- 07- 25 (Rev.0.0)
Technical Data Sheet
2. Absolute maximum ratings
℃
(Ta=25 )
Parameter
Symbol
Value
Unit
Power Dissipation
Pd
69
mW
Forward Current
IF
30
mA
Peak Forward Current
IFM *1
100
mA
Reverse Voltage
VR
5
V
Operating Temperature
Topr.
-40 ~ 85
Storage Temperature
Tstg.
-40 ~ 100
℃
℃
≤ 1msec and Duty ratio≤1/10.
*1 IFM conditions: Pulse width Tw
3. Electro-Optical Characteristics
℃
(Ta=25 )
Parameter
Symbol
Condition
Forward Voltage
VF
IF=5
Reverse Current
IR
VR=5V
Luminous Intensity*2
Iv
IF=5
λ
Δλ
2θ
Wavelength
d
Spectral Bandwidth
Viewing Angle*3 (Y)
1/2
Min
Typ
Max
Unit
1.8
2.0
2.3
V
-
-
10
uA
16
26
44
mcd
F
619
625
629
nm
F
-
15
-
nm
F
-
120
-
˚
㎃
㎃
I =5㎃
I =5㎃
I =5㎃
*2 The luminous intensity IV is measured at the peak of the spatial pattern which may not be aligned with the
mechanical axis of the LED package.
*3 1/2 is the off-axis where the luminous intensity is 1/2 the peak intensity.
θ
[Note] All measurements were made under the standardized environment of SSC.
(Tolerance : Iv ± 10 %,
λ
d
± 2 nm, VF ± 0.1 V)
Rev. 08
January 2012
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서식번호 : SSC- QP- 7- 07- 25 (Rev.0.0)
Technical Data Sheet
4. Characteristic Diagrams
Ta = 25o
Forward Current vs.
Forward Voltage
Relative Luminous Intensity vs.
Forward Current
6
Relative Luminous Intensity [a.u.]
30
20
15
10
5
0
1.7
1.8
1.9
2.0
2.1
2.2
5
4
3
2
1
0
0
2.3
Forward Voltage [V]
5
10
15
20
25
30
Forward Current [mA]
Forward Current vs.
Ambient Temperature
Spectrum
Relative Emission Intensity [a.u.]
35
30
Forward Current [mA]
Forward Current [mA]
25
25
20
15
10
5
0
-25
0
25
50
Ambient Temperature [
℃]
75
100
1.0
0.8
0.6
0.4
0.2
0.0
400
500
600
Wavelength [nm]
700
Rev. 08
January 2012
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서식번호 : SSC- QP- 7- 07- 25 (Rev.0.0)
Technical Data Sheet
Radiation Diagram
Ta = 25o
90
120
60
150
30
180
0
X
Y
Rev. 08
January 2012
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서식번호 : SSC- QP- 7- 07- 25 (Rev.0.0)
Technical Data Sheet
5. Reliability Test
Item
Duration
/ Cycle
Number Of
Damaged
℃
500 hrs
0/22
℃
500 hrs
0/22
500 hrs
0/22
100 cycle
0/22
1 time
0/22
Test Conditions
Operating at Room
temperature
5mA, @25
Operating at High
temperature
5mA, @85
Operating at High
temperature
/ High humidity
℃
5mA, @60 ,90%
℃ Shift (2hr/cycle)
Thermal shock test
Thermal resistance
Test
-40~85
℃
85 , 85% 24hrs Reflow 3 times
(Max 260 10sec) Thermal shock
30 cycle
℃
℃
MSL : 2a (30 , 60% : 4 weeks)
*Criterion
OK
Iv
> Initial value * 0.5
VF
Initial value ± 0.1V
Rev. 08
January 2012
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서식번호 : SSC- QP- 7- 07- 25 (Rev.0.0)
Technical Data Sheet
6. Rank
IF = 5mA
BIN
IV [mcd]
VF [V]
WD [nm]
01
16~26
1.8~1.9
619~629
02
16~26
1.9~2.0
619~629
03
16~26
2.0~2.1
619~629
04
16~26
2.1~2.2
619~629
05
16~26
2.2~2.3
619~629
06
26~44
1.8~1.9
619~629
07
26~44
1.9~2.0
619~629
08
26~44
2.0~2.1
619~629
09
26~44
2.1~2.2
619~629
10
26~44
2.2~2.3
619~629
Rev. 08
January 2012
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서식번호 : SSC- QP- 7- 07- 25 (Rev.0.0)
Tolerance ± 0.1, Unit :
0.3
0.18
Cathode
1.1
1.2
㎜
Polarity Mark
Resin
1.6
PCB
0.4 ± 0.05
Anode
2.4
0.8
0.8
0.3
Technical Data Sheet
7. Outline Dimension
0.8
[Recommended Solder Pattern]
8. Material
Item
Substrate
chip
wire
Encapsulate
Electrode
Material
BT-Resin PCB
AlInGaP
Gold
Epoxy
Au Plated
Rev. 08
January 2012
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서식번호 : SSC- QP- 7- 07- 25 (Rev.0.0)
± 0.1
± 0.2
(2.75)
8.0
± 0.05
± 0.05
0.2
1.75
2.0 ± 0.05
+0.1
-0
± 0.05
1.5
± 0.1
3.5
4.0
1.85
4.0
± 0.1
0.5 ± 0.08
180
0.95
± 0.05
0.5
± 0.05
11.4
+0
-3
9
± 0.2
+0.2
-0
2
± 0.3
60
Technical Data Sheet
9. Reel Structure
22
13 ± 0.2
Label
(1) Quantity : 4000pcs/Reel
(2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ± 0.2mm
(3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the
cover tape is turned off from the carrier tape at 10 angle to be the carrier tape
(4) Package : P/N, Manufacturing data Code No. and quantity to be indicated on a
damp proof Package
℃
Rev. 08
January 2012
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서식번호 : SSC- QP- 7- 07- 25 (Rev.0.0)
Technical Data Sheet
10. Packing
Reel
RANK:
XXX
QUANTITY : XXXX
LOT NUMBER : XXXXXXXXXX
PART NUMBER :
XXXXXX
SEOUL SEMICONDUCTOR CO., LTD.
HUMIDITY INDICATOR
####
Aluminum Vinyl Bag
###
DESI PAK
###
###
#######
RANK:
XXX
QUANTITY : XXXX
LOT NUMBER : XXXXXXXXXX
PART NUMBER :
XXXXXX
SEOUL SEMICONDUCTOR CO., LTD.
Outer Box Structure
1 SIDE
RANK:
QUANTITY : XXXX
c
LOT NUMBER : XXXXXXXXXX
PART NUMBER :
1
XXXXXX
2
SEOUL SEMICONDUCTOR CO., LTD.
2 SIDE
RoHS
b
a
LOT NUMBER
Rank
QTY
Material : Paper(SW3B(B))
SIZE (mm)
TYPE
a
c
b
7inch 245 220 142
SEOUL SEMICONDUCTOR CO., LTD.
Rev. 08
January 2012
WWW.SEOULSEMICON.COM
서식번호 : SSC- QP- 7- 07- 25 (Rev.0.0)
Technical Data Sheet
11. Soldering profile
(1) Lead Solder
Lead Solder
Lead Solder
℃
Pre-heat
120~150
Pre-heat time
120 sec. Max.
℃ Max.
Peak-Temperature
240
Soldering time
Condition
10 sec. Max.
2.5~5 o C / sec.
2.5~5 C / sec.
Pre-heating
120~150 oC
240 oC Max.
10 sec. Max.
60sec. Max.
Above 200 oC
120sec. Max.
(2) Lead-Free Solder
Lead Free Solder
Lead-frame Solder
℃
Pre-heat
150~200
Pre-heat time
120 sec. Max.
℃ Max.
Peak-Temperature
260
Soldering time
Condition
10 sec. Max.
1~5 o C / sec.
1~5 o C / sec.
Pre-heating
150~200 o C
260 oC Max.
10 sec. Max.
60sec. Max.
Above 220 oC
120sec. Max.
(3) Hand Soldering conditions
Do not exceed 3 seconds at maximum 280ºC under soldering iron.
Note : In case that the soldered products are reused in soldering process,
we don’t guarantee the products.
Rev. 08
January 2012
WWW.SEOULSEMICON.COM
서식번호 : SSC- QP- 7- 07- 25 (Rev.0.0)
Technical Data Sheet
12. Precaution for Use
(1) Storage
LEDs must be stored at clean atmosphere. If the LEDs are stored for 3 months or more
after shipment from SSC, storage in a sealed container with a nitrogen atmosphere is
recommended. To avoid absorption of moisture, it is recommended to store in a dry box
(or a desiccator) with a desiccant.
* Shelf Life : 12 months at < 40ºC and 90%RH
(2) Attention after open.
LED is correspond to SMD, when LED be soldered dip, interfacial separation may affect
the light transmission efficiency, causing the light intensity to drop. After opened and
mounted the soldering shall be quickly.
* Within 672 hours at factory conditions of equal to or less than 30ºC/60%RH, or
Stored at < 10% RH
(3) Repack unused products with anti-moisture packing, fold to close any opening and
then store in a dry place.
(4) In the case of change color of indicator on desiccant, components shall be dried
10-12hr at 60± 5ºC.
(5) When the LED is operating, the driving current should be determined after considering
the maximum ambient temperature requirements.
(6) When using multiple LEDs, It is recommended to connect a resistor on each LED.
Otherwise, LEDs may vary due to variation in forward voltage of the LEDs.
(7) The driving circuit must be designed to allow forward voltage only when it is ON or
OFF. If the reverse voltage is applied to LED, migration can be generated resulting
in LED damage
(8) Any mechanical force or excessive vibration should be avoided during temperature
cooling process to normal temperature after reflow.
(9) Rapid cooling shall be avoided.
(10) LED should not be placed on a flexible area on the PCB.
(11) This device should not be used in any type of fluid such as water, oil, organic solvent
etc. When washing is required, IPA should be used.
(12) Anti radioactive ray design is not considered for the products.
(13) Damage prevention from ESD or Surge.
It is highly recommended to use the wrist-band or anti electrostatic gloves when handling
the LED’s All devices, equipments and machines mush be properly grounded
(14) The appearance and specifications of the product may be modified for improvement
without notice.
Rev. 08
January 2012
WWW.SEOULSEMICON.COM
서식번호 : SSC- QP- 7- 07- 25 (Rev.0.0)
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