FSGYE230R TM Data Sheet Radiation Hardened, SEGR Resistant N-Channel Power MOSFET Intersil Star*Power Rad Hard MOSFETs have been specifically developed for high performance applications in a commercial or military space environment. Star*Power MOSFETs offer the system designer both extremely low rDS(ON) and Gate Charge allowing the development of low loss Power Subsystems. Star*Power Gold FETs combine this electrical capability with total dose radiation hardness up to 100K RADs while maintaining the guaranteed performance for SEE (Single Event Effects) which the Intersil FS families have always featured. TM The Intersil family of Star*Power FETs includes a series of devices in various voltage, current and package styles. The portfolio consists of Star*Power and Star*Power Gold products. Star*Power FETs are optimized for total dose and rDS(ON) while exhibiting SEE capability at full rated voltage up to an LET of 37. Star*Power Gold FETs have been optimized for SEE and Gate Charge combining SEE performance to 80% of the rated voltage for an LET of 82 with extremely low gate charge characteristics. This MOSFET is an enhancement-mode silicon-gate power field effect transistor of the vertical DMOS (VDMOS) structure. It is specifically designed and processed to be radiation tolerant. The MOSFET is well suited for applications exposed to radiation environments such as switching regulation, switching converters, power distribution, motor drives and relay drivers as well as other power control and conditioning applications. As with conventional MOSFETs these Radiation Hardened MOSFETs offer ease of voltage control, fast switching speeds and ability to parallel switching devices. May 2000 File Number 4853.1 Features • 12A, 200V, rDS(ON) = 0.150Ω • UIS Rated • Total Dose - Meets Pre-RAD Specifications to 100K RAD (Si) • Single Event - Safe Operating Area Curve for Single Event Effects - SEE Immunity for LET of 82MeV/mg/cm2 with VDS up to 80% of Rated Breakdown and VGS of 5V Off-Bias • Dose Rate - Typically Survives 3E9 RAD (Si)/s at 80% BVDSS - Typically Survives 2E12 if Current Limited to IAS • Photo Current - 3.0nA Per-RAD (Si)/s Typically • Neutron - Maintain Pre-RAD Specifications for 1E13 Neutrons/cm2 - Usable to 1E14 Neutrons/cm2 Symbol D G S Packaging SMD.5 Reliability screening is available as either TXV, or Space equivalent of MIL-S-19500. Formerly available as type TA45230W. Ordering Information RAD LEVEL SCREENING LEVEL PART NUMBER/BRAND 10K Engineering Samples FSGYE230D1 100K TXV FSGYE230R3 100K Space FSGYE230R4 1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. Star*Power™ is a trademark of Intersil Corporation. 1-888-INTERSIL or 321-724-7143 | Intersil and Design is a trademark of Intersil Corporation. | Copyright © Intersil Corporation 2000 FSGYE230R Absolute Maximum Ratings TC = 25oC, Unless Otherwise Specified Drain to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDS Drain to Gate Voltage (RGS = 20kΩ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .VDGR Continuous Drain Current TC = 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .ID TC = 100oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .ID Pulsed Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IDM Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VGS Maximum Power Dissipation TC = 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PT TC = 100oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PT Linear Derating Factor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Single Pulsed Avalanche Current, L = 100µH, (See Test Figure) . . . . . . . . . . . . . . . . . . . . . .IAS Continuous Source Current (Body Diode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IS Pulsed Source Current (Body Diode). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ISM Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TJ, TSTG Lead Temperature (During Soldering) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TL (Distance >0.063in (1.6mm) from Case, 10s Max) Weight (Typical) FSGYE230R 200 200 UNITS V V 12 7 40 ±30 A A A V 42 17 0.33 36 12 40 -55 to 150 300 W W W/ oC A A A oC oC 1.0 (Typ) g CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. TC = 25oC, Unless Otherwise Specified Electrical Specifications PARAMETER SYMBOL TEST CONDITIONS Drain to Source Breakdown Voltage BVDSS ID = 1mA, VGS = 0V Gate Threshold Voltage VGS(TH) VGS = VDS, ID = 1mA Zero Gate Voltage Drain Current IDSS Gate to Source Leakage Current IGSS Drain to Source On-State Voltage Drain to Source On Resistance VDS(ON) rDS(ON)12 Turn-On Delay Time td(ON) Rise Time tr Turn-Off Delay Time td(OFF) Fall Time VDS = 160V, VGS = 0V VGS = ±30V Qg(12) Gate Charge Source Qgs Gate Charge Drain Qgd UNITS - - V - - 5.5 V TC = 25oC TC = 125oC TC = 25oC TC = 125oC TC = 25oC TC = 125oC 2.0 - 4.5 V 1.0 - - V - - 25 µA - - 250 µA - - 100 nA - - 200 nA - - 1.86 V TC = 25oC - 0.120 0.150 Ω TC = 125oC VDD = 100V, ID = 12A, RL = 8.3Ω, VGS = 12V, RGS = 7.5Ω VGS = 0V to 12V MAX 200 tf Total Gate Charge TYP TC = -55oC VGS = 12V, ID = 12A ID = 7A, VGS = 12V MIN VDD = 100V, ID = 12A - - 0.285 Ω - - 20 ns - - 25 ns - - 30 ns - - 15 ns - 26 28 nC - 10 12 nC - 8 10 nC Gate Charge at 20V Qg(20) VGS = 0V to 20V - 40 - nC Threshold Gate Charge Qg(TH) VGS = 0V to 2V - 3 - nC Plateau Voltage V(PLATEAU) Input Capacitance CISS Output Capacitance COSS Reverse Transfer Capacitance CRSS Thermal Resistance Junction to Case 2 RθJC ID = 12A, VDS = 15V - 7 - V VDS = 25V, VGS = 0V, f = 1MHz - 1300 - pF - 230 - pF - 8 - pF 3.0 oC/W - - FSGYE230R Source to Drain Diode Specifications PARAMETER SYMBOL Forward Voltage VSD Reverse Recovery Time trr Reverse Recovery Charge TEST CONDITIONS MIN TYP MAX UNITS ISD = 12A - - 1.2 V ISD = 12A, dISD/dt = 100A/µs - - 210 ns - 1.4 - µC QRR Electrical Specifications up to 100K RAD TC = 25oC, Unless Otherwise Specified PARAMETER SYMBOL TEST CONDITIONS MIN MAX UNITS Drain to Source Breakdown Volts (Note 3) BVDSS VGS = 0, ID = 1mA 200 - V Gate to Source Threshold Volts (Note 3) VGS(TH) VGS = VDS, ID = 1mA 2.0 4.5 V Gate to Body Leakage (Notes 2, 3) IGSS VGS = ±30V, VDS = 0V - 100 nA Zero Gate Leakage (Note 3) IDSS VGS = 0, VDS = 160V - 25 µA Drain to Source On-State Volts (Notes 1, 3) VDS(ON) VGS = 12V, ID = 12A - 1.86 V Drain to Source On Resistance (Notes 1, 3) rDS(ON)12 VGS = 12V, ID = 7A - 0.150 Ω NOTES: 1. Pulse test, 300µs Max. 2. Absolute value. 3. In situ Gamma bias must be sampled for both VGS = 12V, VDS = 0V and VGS = 0V, VDS = 80% BVDSS . Single Event Effects (SEB, SEGR) Note 4 ENVIRONMENT (NOTE 5) TYPICAL LET (MeV/mg/cm) TYPICAL RANGE (µ) APPLIED VGS BIAS (V) (NOTE 6) MAXIMUM VDS BIAS (V) TEST SYMBOL ION SPECIES Single Event Effects Safe Operating Area SEESOA Br 37 36 -20 200 I 60 32 -10 200 Au 82 28 -5 160 Au 82 28 -10 120 NOTES: 4. Testing conducted at Brookhaven National Labs. 5. Fluence = 1E5 ions/cm2 (typical), T = 25oC. 6. Does not exhibit Single Event Burnout (SEB) or Single Event Gate Rupture (SEGR). Performance Curves Unless Otherwise Specified LET = 37MeV/mg/cm2, RANGE = 36µ LET = 60MeV/mg/cm2, RANGE = 32µ LET = 82MeV/mg/cm2, RANGE = 28µ 240 LET = 37 BROMINE FLUENCE = 1E5 IONS/cm2 (TYPICAL) 200 200 160 VDS (V) VDS (V) 160 120 120 LET = 82 GOLD 80 80 LET = 60 IODINE 40 40 TEMP = 25oC 0 0 0 -5 -10 -15 -20 -25 VGS (V) FIGURE 1. SINGLE EVENT EFFECTS SAFE OPERATING AREA 3 0 -5 -10 -15 -20 -25 -30 -35 VGS (V) FIGURE 2. TYPICAL SEE SIGNATURE CURVE -40 FSGYE230R Performance Curves Unless Otherwise Specified (Continued) LIMITING INDUCTANCE (HENRY) 1E-3 14 12 1E-4 10 ID , DRAIN (A) ILM = 10A 30A 1E-5 100A 300A 8 6 4 1E-6 2 0 -50 1E-7 10 100 30 1000 300 0 DRAIN SUPPLY (V) FIGURE 3. DRAIN INDUCTANCE REQUIRED TO LIMIT GAMMA DOT CURRENT TO IAS ID , DRAIN CURRENT (A) 100 100 150 FIGURE 4. MAXIMUM CONTINUOUS DRAIN CURRENT vs TEMPERATURE TC = 25oC 10 12V QG 100µs 1ms 1 OPERATION IN THIS AREA MAY BE LIMITED BY rDS(ON) 0.1 1 QGS VG 10ms 10 QGD 1000 100 VDS , DRAIN TO SOURCE VOLTAGE (V) CHARGE FIGURE 5. FORWARD BIAS SAFE OPERATING AREA FIGURE 6. BASIC GATE CHARGE WAVEFORM 2.5 200 ID, DRAIN TO SOURCE CURRENT (A) PULSE DURATION = 250ms, VGS = 12V, ID = 7A 2.0 NORMALIZED rDS(ON) 50 TC , CASE TEMPERATURE (oC) 1.5 1.0 0.5 0.0 -80 DESCENDING ORDER VGS = 14V VGS = 12V VGS = 10V VGS = 8V 160 120 80 40 VGS = 6V 0 -40 0 40 80 120 160 TJ , JUNCTION TEMPERATURE (oC) FIGURE 7. TYPICAL NORMALIZED rDS(ON) vs JUNCTION TEMPERATURE 4 0 2 4 6 8 VDS, DRAIN TO SOURCE VOLTAGE (V) FIGURE 8. TYPICAL OUTPUT CHARACTERISTICS 10 FSGYE230R NORMALIZED THERMAL RESPONSE (ZθJC) Performance Curves Unless Otherwise Specified (Continued) 10 1 0.5 0.2 0.1 0.05 0.02 0.01 0.1 SINGLE PULSE 0.01 PDM NOTES: DUTY FACTOR: D = t1/t2 PEAK TJ = PDM x ZθJC + TC 0.001 10-5 10-4 10-3 10-2 10-1 t1 t2 100 101 t, RECTANGULAR PULSE DURATION (s) FIGURE 9. NORMALIZED MAXIMUM TRANSIENT THERMAL RESPONSE IAS , AVALANCHE CURRENT (A) 100 STARTING TJ = 25oC 10 STARTING TJ = 150oC 1 IF R = 0 tAV = (L) (IAS) / (1.3 RATED BVDSS - VDD) IF R ≠ 0 tAV = (L/R) ln [(IAS*R) / (1.3 RATED BVDSS - VDD) + 1] 0.1 0.01 0.1 1 10 tAV, TIME IN AVALANCHE (ms) FIGURE 10. UNCLAMPED INDUCTIVE SWITCHING Test Circuits and Waveforms ELECTRONIC SWITCH OPENS WHEN IAS IS REACHED VDS L BVDSS + CURRENT I TRANSFORMER AS tP - VARY tP TO OBTAIN REQUIRED PEAK IAS VDD DUT tP VDD + 50Ω VGS ≤ 20V 0V VDS IAS 50V-150V 50Ω tAV FIGURE 11. UNCLAMPED ENERGY TEST CIRCUIT 5 FIGURE 12. UNCLAMPED ENERGY WAVEFORMS FSGYE230R Test Circuits and Waveforms (Continued) tON VDD tOFF td(ON) tr VDS RL td(OFF) tf 90% 90% VDS VGS = 12V 10% DUT 10% 0V 90% RGS 50% VGS 50% PULSE WIDTH 10% FIGURE 13. RESISTIVE SWITCHING TEST CIRCUIT FIGURE 14. RESISTIVE SWITCHING WAVEFORMS Screening Information Screening is performed in accordance with the latest revision in effect of MIL-S-19500, (Screening Information Table). Delta Tests and Limits (JANTXV Equivalent, JANS Equivalent) TC = 25oC, Unless Otherwise Specified PARAMETER SYMBOL Gate to Source Leakage Current TEST CONDITIONS IGSS VGS = ±30V IDSS VDS = 80% Rated Value MAX UNITS ±20 (Note 7) nA ±25 (Note 7) µA Drain to Source On Resistance rDS(ON) TC = 25oC at Rated ID ±20% (Note 8) Ω Gate Threshold Voltage VGS(TH) ID = 1.0mA ±20% (Note 8) V Zero Gate Voltage Drain Current NOTES: 7. Or 100% of Initial Reading (whichever is greater). 8. Of Initial Reading. Screening Information TEST JANTXV EQUIVALENT JANS EQUIVALENT Unclamped Inductive Switching VGS(PEAK) = 20V, L = 0.1mH; Limit = 36A VGS(PEAK) = 20V, L = 0.1mH; Limit = 36A Thermal Response tH = 10ms; VH = 15V; IH = 1A; LIMIT = 74mV tH = 10ms; VH = 15V; IH = 1A; LIMIT = 74mV Gate Stress VGS = 45V, t = 250µs VGS = 45V, t = 250µs Pind Optional Required Pre Burn-In Tests (Note 9) MIL-S-19500 Group A, Subgroup 2 (All Static Tests at 25oC) MIL-S-19500 Group A, Subgroup 2 (All Static Tests at 25oC) Steady State Gate Bias (Gate Stress) MIL-STD-750, Method 1042, Condition B VGS = 80% of Rated Value, TA = 150oC, Time = 48 hours MIL-STD-750, Method 1042, Condition B VGS = 80% of Rated Value, TA = 150oC, Time = 48 hours Interim Electrical Tests (Note 9) All Delta Parameters Listed in the Delta Tests and Limits Table All Delta Parameters Listed in the Delta Tests and Limits Table Steady State Reverse Bias (Drain Stress) MIL-STD-750, Method 1042, Condition A VDS = 80% of Rated Value, TA = 150oC, Time = 160 hours MIL-STD-750, Method 1042, Condition A VDS = 80% of Rated Value, TA = 150oC, Time = 240 hours PDA 10% 5% Final Electrical Tests (Note 9) MIL-S-19500, Group A, Subgroup 2 MIL-S-19500, Group A, Subgroups 2 and 3 NOTE: 9. Test limits are identical pre and post burn-in. Additional Tests MAX UNITS Safe Operating Area PARAMETER SYMBOL SOA VDS = 160V, t = 10ms 0.45 A Thermal Impedance ∆VSD tH = 100ms; VH = 25V; IH = 1A 165 mV 6 TEST CONDITIONS FSGYE230R Rad Hard Data Packages - Intersil Power Transistors TXV Equivalent Class S - Equivalents 1. RAD HARD TXV EQUIVALENT - STANDARD DATA PACKAGE 1. RAD HARD “S” EQUIVALENT - STANDARD DATA PACKAGE A. Certificate of Compliance A. Certificate of Compliance B. Assembly Flow Chart B. Serialization Records C. Preconditioning - Attributes Data Sheet C. Assembly Flow Chart D. Group A - Attributes Data Sheet D. SEM Photos and Report E. Group B - Attributes Data Sheet F. Group C - Attributes Data Sheet G. Group D - Attributes Data Sheet E. Preconditioning - Attributes Data Sheet - HTRB - Hi Temp Gate Stress Post Reverse Bias Data and Delta Data - HTRB - Hi Temp Drain Stress Post Reverse Bias Delta Data 2. RAD HARD TXV EQUIVALENT - OPTIONAL DATA PACKAGE A. Certificate of Compliance B. Assembly Flow Chart C. Preconditioning - Attributes Data Sheet - Pre and Post Burn-In Read and Record Data D. Group A - Attributes Data Sheet E. Group B - Attributes Data Sheet - Pre and Post Read and Record Data for Intermittent Operating Life (Subgroup B3) - Bond Strength Data (Subgroup B3) - Pre and Post High Temperature Operating Life Read and Record Data (Subgroup B6) F. Group C - Attributes Data Sheet - Pre and Post Read and Record Data for Intermittent Operating Life (Subgroup C6) - Bond Strength Data (Subgroup C6) G. Group D - Attributes Data Sheet - Pre and Post RAD Read and Record Data F. Group A G. Group B - Attributes Data Sheet H. Group C - Attributes Data Sheet I. Group D - Attributes Data Sheet 2. RAD HARD MAX. “S” EQUIVALENT - OPTIONAL DATA PACKAGE A. Certificate of Compliance B. Serialization Records C. Assembly Flow Chart D. SEM Photos and Report E. Preconditioning - Attributes Data Sheet - HTRB - Hi Temp Gate Stress Post Reverse Bias Data and Delta Data - HTRB - Hi Temp Drain Stress Post Reverse Bias Delta Data - X-Ray and X-Ray Report F. Group A - Attributes Data Sheet - Subgroups A2, A3, A4, A5 and A7 Data G. Group B - Attributes Data Sheet - Subgroups B1, B3, B4, B5 and B6 Data H. Group C - Attributes Data Sheet - Subgroups C1, C2, C3 and C6 Data I. Group D 7 - Attributes Data Sheet - Attributes Data Sheet - Pre and Post Radiation Data FSGYE230R SMD2 3 PAD CERAMIC LEADLESS CHIP CARRIER INCHES E MILLIMETERS SYMBOL MIN MAX MIN MAX NOTES A 0.130 0.142 3.30 3.60 3 D b 0.135 0.145 3.43 3.68 - D 0.520 0.530 13.20 13.46 - D1 0.435 0.445 11.05 11.30 - D2 0.115 0.125 2.92 3.17 - E 0.685 0.695 17.40 17.65 - E1 0.470 0.480 11.94 12.19 - E2 0.152 0.162 3.86 4.11 - NOTES: A 1. 2. 3. 4. E2 E1 No current JEDEC outline for this package. Controlling dimension: INCH. Measurement prior to pre-solder coating the mounting pads. Revision 3 dated 5-00. 2 D1 D2 3 1 b 1 - GATE 2 - SOURCE 3 - DRAIN All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification. Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. 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