DB Lectro FSMD050 Surface mount ptc fsmd sery Datasheet

Surface Mount PTC FSMD Series
FUZETEC
Application:
All high-density boards
Product Features:
Small surface mount, Solid state
Faster time to trip than standard SMD devices
Lower resistance than standard SMD devices
Operation Current: 140mA~1.6A
Maximum Voltage: 6V~60V
Temperature Range: -40 to 85
Agency Approvals: UL(E211981),
C-ULTUV pending
Electrical Characteristics(23)
Part
Number
FSMD014
FSMD020
FSMD035
FSMD050
FSMD075
FSMD110
FSMD160
Hold
Trip
Rated
Max Typical Max Time to Trip
Current Current Voltage Current Power Current
Time
IH,A
0.14
0.20
0.35
0.50
0.75
1.10
1.60
IT,A
0.30
0.40
0.70
1.00
1.50
2.20
3.20
VMAX,Vdc IMAX, A Pd, W
60
10
0.8
30
10
0.8
16
40
0.8
16
40
0.8
16
40
0.8
6
40
0.8
6
40
0.8
Amp
8.0
8.0
8.0
8.0
8.0
8.0
8.0
Sec
0.02
0.02
0.10
0.15
0.02
0.30
0.5
Resistance Tolerance
RMIN
R1MAX
Ω
1.50
0.80
0.32
0.15
0.11
0.04
0.03
Ω
6.50
5.00
1.50
1.00
0.45
0.21
0.10
IH=Hold current-maximum current at which the device will not trip at 23still air.
IT=Trip current-minimum current at which the device will always trip at 23 still air.
V MAX=Maximum voltage device can withstand without damage at it rated current.(I max)
I MAX= Maximum fault current device can withstand without damage at rated voltage (V max).
Pd=Typical power dissipated-type amount of power dissipated by the device when in the tripped state in 23 still air environment.
RMIN=Minimum device resistance at 23 prior to tripping.
R1MAX=Maximum device resistance at 23 measured 1 hour post trip.
Termination pad characteristics
Termination pad materials : solder-plated copper
1
DB LECTRO Inc., 3600-I, boulevard Matte, Brossard, QC J4Y 2Z2
Surface Mount PTC FSMD Series
FUZETEC
FSMD Product Dimensions (Millimeters)
PART
NUMBER
FSMD014
FSMD020
FSMD035
FSMD050
FSMD075
FSMD110
FSMD160
A
Min
4.37
4.37
4.37
4.37
4.37
4.37
4.37
B
Max
4.73
4.73
4.73
4.73
4.73
4.73
4.73
Min
3.07
3.07
3.07
3.07
3.07
3.07
3.07
C
Max
3.41
3.41
3.41
3.41
3.41
3.41
3.41
Min
0.7
0.4
0.4
0.4
0.4
0.4
0.4
Max
1.0
0.7
0.7
0.7
0.7
0.7
0.7
D
Min
0.35
0.35
0.35
0.35
0.35
0.35
0.35
Thermal Derating Curve
Thermal Derating Curve, FSMD Series
Percent of Rated Hold and Trip
Current
200%
150%
100%
50%
A= FSMD 075, 100 &160
B= FSMD 014, 020, 035
0%
& 050
-40
-20
0
20
40
60
80
Ambient Temperature (C)
2
DB LECTRO Inc., 3600-I, boulevard Matte, Brossard, QC J4Y 2Z2
Surface Mount PTC FSMD Series
FUZETEC
Typical Time-To-Trip at 23
A =FSMD014
B =FSMD020
C =FSMD035
D =FSMD050
E =FSMD075
F =FSMD110
G =FSMD160
A B
C
DE F
G
100
Time-to-trip (S)
10
1
0.1
0.01
0.001
0.1
1
10
100
Fault current (A)
Part Numbering System
Part Marking System
FSMD F110
F
Part Identification
Current rating
Example
Fuzetec Logo
Standard Package
P/N
Pcs /Bag
Reel/Tape
FSMD014
--------
2K
FSMD020
--------
2K
FSMD035
--------
2K
FSMD050
--------
2K
P/N
Pcs /Bag
Reel/Tape
FSMD075
--------
2K
FSMD110
--------
2K
FSMD160
--------
2K
3
DB LECTRO Inc., 3600-I, boulevard Matte, Brossard, QC J4Y 2Z2
Surface Mount PTC FSMD Series
FUZETEC
Pad LayoutsSolder Reflow and Rework Recommendations
The dimension in the table below provide the recommended pad layout for each FSMD device
Pad dimensions(millimeters)
Device
FSMD014
FSMD020
FSMD035
FSMD050
FSMD075
FSMD110
FSMD160
A
Nominal
3.45
3.45
3.45
3.45
3.45
3.45
3.45
B
Nominal
1.78
1.78
1.78
1.78
1.78
1.78
1.78
C
Nominal
3.15
3.15
3.15
3.15
3.15
3.15
3.15
Solder reflow
1Recommended reflow methods; IR , vapor phase
oven, hot air oven.
2The FSMD014FSMD020 FSMD035
FSMD050 FSMD075FSMD110 and FSMD160
devices are suitable for use with wave-solder
application methods.
3Recommended maximum paste thickness is
0.25mm.
4Devices can be cleaned using standard industry
methods and solvents.
CAUTION:
If reflow temperatures exceed the recommended
Profile, devices may not meet the performance
requirements.
Rework:
Use standard industry practices.
4
DB LECTRO Inc., 3600-I, boulevard Matte, Brossard, QC J4Y 2Z2
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