Fairchild FSUSB23L10X Low power hi-speed usb 2.0 (480mbps) switch Datasheet

Revised August 2005
FSUSB23
Low Power Hi-Speed USB 2.0 (480Mbps) Switch
General Description
The FSUSB23 is a low power high bandwidth analog switch
specifically designed for high speed USB 2.0 applications. The
FSUSB23 features very low quiescent current even when the
control voltage is lower than the VCC supply. This feature services mobile handset applications well allowing for direct interface with the baseband processor general purpose I/Os. Typical
applications involve switching in portables and consumer applications such as cell phones, digital cameras, and notebooks
with hubs or controllers. The wide bandwidth (>720MHz) of this
switch exceeds the bandwidth needed to pass the 3rd harmonic
which results in signals with minimum edge and phase distortion. Superior channel-to-channel crosstalk results in minimal
interference.
Features
O 10PA maximum ICCT current over an expanded control
voltage range (VIN = 2.6V, VCC = 3.6V)
O Lower Capacitance: Con = 9pF Typ
O 7: typical On Resistance (RON)
O 3dB bandwidth: > 720MHz
O Low power consumption (1PA maximum)
O Packaged in:
Pb-Free 10-lead MicroPak¥ (1.6mm by 2.1mm)
Pb-Free 16-lead DQFN
O 7kV I/O to GND ESD performance
Applications
O Cell phone, PDA, Digital Camera, and Notebook
O LCD Monitor, TV, and Set-top Box
Ordering Code:
Order
Package
Number
Number
FSUSB23L10X
MAC010A
Pb-Free 10-Lead MicroPak, 1.6 mm x 2.1mm
FSUSB23BQX
MLP016E
Pb-Free 16-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC MO-241,
2.5 x 3.5mm
Package Description
Pb-Free package per JEDEC J-STD-020B.
MicroPak¥ is a trademark of Fairchild Semiconductor Corporation.
© 2005 Fairchild Semiconductor Corporation
DS500925
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FSUSB23 Low Power Hi-Speed USB 2.0 (480Mbps) Switch
August 2005
FSUSB23
Analog Symbol
Connection Diagrams
Pad Assignments for MicroPak
Pin Descriptions
(Top View)
Pad Assignments for DQFN
Pin Name
Description
OE
Bus Switch Enable
S
Select Input
D+, D, Dn+, Dn
Data Ports
Truth Table
S
OE
Function
X
H
Disconnect
L
L
D+, D = D1n
H
L
D+, D = D2n
(Top Through View)
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2
Recommended Operating Conditions
(Note 3)
0.5V to +4.6V
Supply Voltage (VCC)
0.5V to VCC + 0.5V
DC Switch Voltage (Note 2)
DC Input Voltage (VIN) (Note 2)
Supply Voltage VCC
0.5v to +4.6V
Control Input Voltage
50mA
Switch Input Voltage
DC Input Diode Current
DC Output Current
0V to VCC
0V to VCC
40qC to +85qC
Operating Temperature
50mA
65qC to +150qC
Storage Temperature
3.0V to 3.6V
Thermal Resistance
250qC/w
10 MicroPak
ESD (Human Body Model)
All Pins
7 KV
I/O to GND
7 KV
Note 1: The Absolute Maximum Ratings are those values beyond which the safety of
the device cannot be guaranteed. The device should not be operated at these limits.
The parametric values defined in the Electrical Characteristics tables are not guaranteed at the absolute maximum rating. The Recommended Operating Conditions
tables will define the conditions for actual device operation.
Note 2: The input and output negative voltage ratings may be exceeded if the input
and output diode current ratings are observed. DC switch voltage may never exceed
4.6V.
Note 3: Control input must be held HIGH or LOW and it must not float.
DC Electrical Characteristics (All typical values are @ 25qC unless otherwise specified.)
Symbol
Parameter
TA = 40qC to +85qC
VCC
(V)
VIK
Clamp Diode Voltage
VIH
Input Voltage HIGH
3.0 to 3.6
VIL
Input Voltage LOW
3.0 to 3.6
IIN
Control Input Leakage
IOZ
OFF State Leakage
RON
Switch On Resistance
Min
Typ
Units
1.2
3.0
V
1.2
3.6
0.50
V
r1.0
r1.0
PA
PA
6.0
9.0
7.0
10.0
:
3.0
Delta RON (Note 5)
IIN = 18mA
V
(Note 4)
'RON
Conditions
Max
3.0
0.3
2.0
RON Flatness
RON Flatness (Note 4)
3.0
ICC
Quiescent Supply Current
3.6
1.0
ICCT
Increase in ICC Current per
3.6
10.0
:
:
PA
PA
Control Voltage and VCC Levels
VIN = 0V to VCC
0 d Dn, D1n, D2n d VCC
VIN = 0.4V, ION = 8mA
VIN = 0.8V, ION = 8mA
VIN = 0.8V, ION = 8mA
VIN = 0.0V 1.0V, ION = 8mA
VIN = 0.0V or VCC, IOUT = 0
VIN = 2.6V
VCC = 3.6V
Note 4: Measured by the voltage drop between Dn, D1n, D2n pins at the indicated current through the switch. On Resistance is determined by the lower of the voltage on the two
ports.
Note 5: Guaranteed by characterization.
AC Electrical Characteristics (All typical values are for VCC = 3.3v @ 25qC unless otherwise specified.)
Symbol
Parameter
VCC
(V)
TA = 40qC to +85qC
Min
Typ
Max
Figure
Units
Conditions
Number
tON
Turn On Time
S, OE to Output
3.0 to 3.6
10.0
13.0
ns
VD1n, D2n = 0.8V, RL = 50:CL = 10:
tOFF
Turn OFF Time S, OE to Output
3.0 to 3.6
8.0
11.0
ns
VD1n, D2n = 0.8V, RL = 50:CL = 10:
tPD
Propagation Delay (Note 6)
3.3
0.25
ns
CL = 10 pF
Figure 5
Figure 5
Figures 3,
4
OIRR
OFF Isolation (Non-Adjacent)
3.0 to 3.6
f = 250MHz, RL = 50:
Non-Adjacent Channel Crosstalk
3.0 to 3.6
30.0
43.0
dB
Xtalk
dB
RL = 50:, f = 250MHz
Figure 9
BW
3dB Bandwidth
3.0 to 3.6
720
MHz
RL = 50:
Figure 7
Figure 8
Note 6: Guaranteed by characterization
3
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FSUSB23
Absolute Maximum Ratings(Note 1)
FSUSB23
USB Related AC Electrical Characteristics
Symbol
Parameter
VCC
(V)
TA = 40qC to +85qC
Min
Typ
Figure
Units
Conditions
Max
Number
tSK(O)
Channel-to-Channel Skew (Note 7)
3.0 to 3.6
40.0
ps
CL = 10pF
Figures
3, 6
tSK(P)
Skew of Opposite Transitions of
the Same Output (Note 7)
3.0 to 3.6
20.0
ps
CL = 10pF
Figures
3, 6
tJ
Total Jitter (Note 7)
3.0 to 3.6
150
ps
RL = 50:, CL = 10pF,
tR = tF = 750ps at 480 Mbps
(PRBS = 215 1)
Note 7: Guaranteed by design.
Capacitance
Symbol
TA = 40qC to +85qC
Parameter
Min
Typ
Figure
Units
Conditions
Max
Number
CIN
Control Pin Input Capacitance
2.0
pF
VCC = 0V
Figure
11
CON
D1n, D2n, Dn ON Capacitance
9.0
pF
VCC = 3.3, OE = 0V
Figure
10
COFF
D1n, D2n OFF Capacitance
4.0
pF
VCC and OE = 3.3
Figure
11
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4
FSUSB23
Test Diagrams
Note: Each switch port is tested separately.
FIGURE 1. On Resistance
FIGURE 2. OFF Leakage
Note: RL, RS, and CL are functions of application environment
(See AC Electrical table for specific values).
FIGURE 4. Switch Propagation Delay Waveforms
Note: CL includes test fixture and stray capacitance.
FIGURE 3. AC Test Circuit Load
FIGURE 5. Turn ON/ Turn OFF Waveform
5
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FSUSB23
FIGURE 6. Switch Skew Tests
Note: RS and RT are functions of application environment (See AC Electrical Tables for specific values).
FIGURE 7. Bandwidth
FIGURE 8. Channel OFF Isolation
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6
FSUSB23
FIGURE 9. Non-Adjacent Channel-to-Channel Crosstalk
FIGURE 11. Channel OFF Capacitance
FIGURE 10. Channel ON Capacitance
7
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FSUSB23
Tape and Reel Specification
TAPE FORMAT for MircoPak
Package
Tape
Number
Cavity
Cover Tape
Designator
Section
Cavities
Status
Status
Leader (Start End)
125 (typ)
Empty
Sealed
Carrier
5000
Filled
Sealed
Trailer (Hub End)
75 (typ)
Empty
Sealed
L10X
TAPE DIMENSIONS inches (millimeters)
REEL DIMENSIONS inches (millimeters)
Tape Size
8 mm
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A
B
C
D
N
W1
W2
W3
7.0
0.059
0.512
0.795
2.165
0.331 + 0.059/0.000
0.567
W1 + 0.078/0.039
(177.8)
(1.50)
(13.00)
(20.20)
(55.00)
(8.40 + 1.50/0.00)
(14.40)
(W1 + 2.00/1.00)
8
Package
Tape
Number
Cavity
Cover Tape
Designator
Section
Cavities
Status
Status
Leader (Start End)
125 (typ)
Empty
Sealed
Carrier
2500/3000
Filled
Sealed
Trailer (Hub End)
75 (typ)
Empty
Sealed
BQX
TAPE DIMENSIONS inches (millimeters)
REEL DIMENSIONS inches (millimeters)
Tape Size
12 mm
A
B
C
D
N
W1
W2
13.0
0.059
0.512
0.795
7.008
0.488
0.724
(330)
(1.50)
(13.00)
(20.20)
(178)
(12.4)
(18.4)
9
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FSUSB23
Tape Format for DQFN
FSUSB23
Physical Dimensions inches (millimeters) unless otherwise noted
Pb-Free 10-Lead MicroPak, 1.6 mm x 2.1mm
Package Number MAC010A
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10
FSUSB23
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
Pb-Free 16-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC MO-241, 2.5 x 3.5mm
Package Number MLP016E
11
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FSUSB23 Low Power Hi-Speed USB 2.0 (480Mbps) Switch
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY
PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY
ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT
CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES
OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION
As used herein:
provided in the labeling, can be reasonably expected to
result in significant injury to the user.
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the body, or
2. A critical component is any component of a life support
(b) support or sustain life, or (c) whose failure to perform
device or system whose failure to perform can be reasonwhen properly used in accordance with instructions for use
ably expected to cause the failure of the life support device
or system, or to affect its safety or effectiveness.
PRODUCT STATUS DEFINITIONS
Definition of terms
Datasheet Identification Product Status
Definition
Advance Information
Formative or In Design
This datasheet contains the design specifications for product development. Specifications may change in any manner without notice.
Preliminary
First Production
This datasheet contains preliminary data, and supplementary data will
be published at a later date. Fairchild Semiconductor reserves the right
to make changes at any time without notice in order to improve design.
No Identification Needed
Full Production
This datasheet contains final specifications. Fairchild Semiconductor
reserves the right to make changes at any time without notice in order
to improve design.
Obsolete
Not In Production
This datasheet contains specifications on a product that has been discontinued by Fairchild Semiconductor. The datasheet is printed for reference information only.
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