Intersil FSYA250D3 27a, 200v, 0.100 ohm, rad hard, segr resistant, n-channel power mosfet Datasheet

FSYA250D,
FSYA250R
27A, 200V, 0.100 Ohm, Rad Hard,
SEGR Resistant, N-Channel Power MOSFETs
June 1998
Features
Description
• 27A, 200V, rDS(ON) = 0.100Ω
The Discrete Products Operation of Intersil Corporation has
developed a series of Radiation Hardened MOSFETs specifically designed for commercial and military space applications. Enhanced Power MOSFET immunity to Single Event
Effects (SEE), Single Event Gate Rupture (SEGR) in particular, is combined with 100K RADS of total dose hardness to
provide devices which are ideally suited to harsh space environments. The dose rate and neutron tolerance necessary
for military applications have not been sacrificed.
• Total Dose
- Meets Pre-RAD Specifications to 100K RAD (Si)
• Single Event
- Safe Operating Area Curve for Single Event Effects
- SEE Immunity for LET of 36MeV/mg/cm2 with
VDS up to 80% of Rated Breakdown and
VGS of 10V Off-Bias
• Dose Rate
- Typically Survives 3E9 RAD (Si)/s at 80% BVDSS
- Typically Survives 2E12 if Current Limited to IDM
This MOSFET is an enhancement-mode silicon-gate power
field-effect transistor of the vertical DMOS (VDMOS) structure. It is specially designed and processed to be radiation
tolerant. The MOSFET is well suited for applications
exposed to radiation environments such as switching regulation, switching converters, motor drives, relay drivers and
drivers for high-power bipolar switching transistors requiring
high speed and low gate drive power. This type can be operated directly from integrated circuits.
• Photo Current
- 12nA Per-RAD(Si)/s Typically
• Neutron
- Maintain Pre-RAD Specifications
for 1E13 Neutrons/cm2
- Usable to 1E14 Neutrons/cm2
Ordering Information
RAD LEVEL
The Intersil portfolio of SEGR resistant radiation hardened
MOSFETs includes N-Channel and P-Channel devices in a
variety of voltage, current and on-resistance ratings.
Numerous packaging options are also available.
SCREENING LEVEL
PART NUMBER/BRAND
10K
Commercial
FSYA250D1
10K
TXV
FSYA250D3
100K
Commercial
FSYA250R1
100K
TXV
FSYA250R3
100K
Space
FSYA250R4
Reliability screening is available as either commercial, TXV
equivalent of MIL-S-19500, or Space equivalent of
MIL-S-19500. Contact Intersil for any desired deviations
from the data sheet.
Symbol
D
G
Formerly available as type TA17657.
S
Package
SMD1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
http://www.intersil.com or 407-727-9207 | Copyright © Intersil Corporation 1999
3-125
File Number
4313.1
FSYA250D, FSYA250R
Absolute Maximum Ratings
TC = 25oC, Unless Otherwise Specified
Drain to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .VDS
Drain to Gate Voltage (RGS = 20kΩ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDGR
Continuous Drain Current
TC = 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ID
TC = 100oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ID
Pulsed Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IDM
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .VGS
Maximum Power Dissipation
TC = 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PT
TC = 100oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PT
Linear Derating Factor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Single Pulsed Avalanche Current, L = 100µH, (See Test Figure). . . . . . . . . . . . . . . . . . . . . . IAS
Continuous Source Current (Body Diode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IS
Pulsed Source Current (Body Diode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ISM
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TJ, TSTG
Lead Temperature (During Soldering) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TL
(Distance >0.063in (1.6mm) from Case, 10s Max)
FSYA250D,
FSYA250R
200
200
UNITS
V
V
27
17
81
±20
A
A
A
V
150
60
1.20
81
27
81
-55 to 150
300
W
W
W/ oC
A
A
A
oC
oC
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
Electrical Specifications
TC = 25oC, Unless Otherwise Specified
PARAMETER
SYMBOL
TEST CONDITIONS
Drain to Source Breakdown Voltage
BVDSS
ID = 1mA, VGS = 0V
Gate Threshold Voltage
VGS(TH)
VGS = VDS,
ID = 1mA
Zero Gate Voltage Drain Current
Gate to Source Leakage Current
Drain to Source On-State Voltage
Drain to Source On Resistance
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Total Gate Charge
IDSS
IGSS
VDS(ON)
rDS(ON)12
td(ON)
tr
VDS = 160V,
VGS = 0V
VGS = ±20V
MIN
TYP
UNITS
200
-
-
V
TC = -55oC
-
-
5.0
V
TC = 25oC
1.5
-
4.0
V
TC = 125oC
TC = 25oC
TC = 125oC
TC = 25oC
TC = 125oC
0.5
-
-
V
-
-
25
µA
-
-
250
µA
-
-
100
nA
-
200
nA
-
2.84
V
TC = 25oC
-
0.080
0.100
Ω
TC = 125oC
-
-
0.182
Ω
-
-
45
ns
VGS = 12V, ID = 27A
ID = 17A,
VGS = 12V
MAX
VDD = 100V, ID = 27A,
RL = 3.70Ω, VGS 12V,
RGS = 2.35Ω
-
-
110
ns
td(OFF)
-
-
90
ns
tf
-
-
25
ns
-
-
230
nC
-
130
150
nC
-
-
11
nC
Qg(TOT)
VGS = 0V to 20V
Gate Charge at 12V
Qg(12)
VGS = 0V to 12V
Threshold Gate Charge
Qg(TH)
VGS = 0V to 2V
VDD = 100V,
ID = 27A
Gate Charge Source
Qgs
-
26
40
nC
Gate Charge Drain
Qgd
-
65
78
nC
Plateau Voltage
V(PLATEAU)
ID = 27A, VDS = 15V
-
8
-
V
Input Capacitance
CISS
-
3200
-
pF
Output Capacitance
COSS
VDS = 25V, VGS = 0V,
f = 1MHz
-
625
-
pF
Reverse Transfer Capacitance
CRSS
-
170
-
pF
0.83
oC/W
Thermal Resistance Junction to Case
RθJC
-
3-126
-
FSYA250D, FSYA250R
Source to Drain Diode Specifications
PARAMETER
SYMBOL
Forward Voltage
TEST CONDITIONS
ISD = 27A
VSD
Reverse Recovery Time
trr
MIN
TYP
MAX
UNITS
0.6
-
1.8
V
-
-
550
ns
ISD = 27A, dISD/dt = 100A/µs
TC = 25oC, Unless Otherwise Specified
Electrical Specifications up to 100K RAD
PARAMETER
SYMBOL
TEST CONDITIONS
MIN
MAX
UNITS
Drain to Source Breakdown Volts
(Note 3)
BVDSS
VGS = 0, ID = 1mA
200
-
V
Gate to Source Threshold Volts
(Note 3)
VGS(TH)
VGS = VDS, ID = 1mA
1.5
4.0
V
Gate to Body Leakage
(Notes 2, 3)
IGSS
VGS = ±20V, VDS = 0V
-
100
nA
Zero Gate Leakage
(Note 3)
IDSS
VGS = 0, VDS = 160V
-
25
µA
Drain to Source On-State Volts
(Notes 1, 3)
VDS(ON)
VGS = 12V, ID = 27A
-
2.84
V
Drain to Source On Resistance
(Notes 1, 3)
rDS(ON)12
VGS = 12V, ID = 17A
-
0.100
Ω
NOTES:
1. Pulse test, 300µs Max.
2. Absolute value.
3. Insitu Gamma bias must be sampled for both VGS = 12V, VDS = 0V and VGS = 0V, VDS = 80% BVDSS .
Single Event Effects (SEB, SEGR) (Note 4)
ENVIRONMENT (NOTE 5)
TEST
Single Event Effects Safe Operating
Area
(NOTE 6)
MAXIMUM
VDS BIAS
(V)
SYMBOL
ION
SPECIES
TYPICAL LET
(MeV/mg/cm)
TYPICAL
RANGE (µ)
APPLIED
VGS BIAS
(V)
SEESOA
Ni
26
43
-20
200
Br
37
36
-5
200
Br
37
36
-10
160
Br
37
36
-15
100
Br
37
36
-20
40
NOTES:
4. Testing conducted at Brookhaven National Labs; sponsored by Naval Surface Warfare Center (NSWC), Crane, IN.
5. Fluence = 1E5 ions/cm2 (typical), T = 25oC.
6. Does not exhibit Single Event Burnout (SEB) or Single Event Gate Rupture (SEGR).
Typical Performance Curves
Unless Otherwise Specified
LET = 26MeV/mg/cm2, RANGE = 43µ
LET = 37MeV/mg/cm2, RANGE = 36µ
1E-3
LIMITING INDUCTANCE (HENRY)
FLUENCE = 1E5 IONS/cm2 (TYPICAL)
200
VDS (V)
160
120
80
40
TEMP = 25oC
0
0
-5
1E-4
ILM = 10A
30A
1E-5
100A
300A
1E-6
1E-7
-10
-15
-20
-25
VGS (V)
10
30
100
300
DRAIN SUPPLY (V)
FIGURE 1. SINGLE EVENT EFFECTS SAFE OPERATING AREA
3-127
FIGURE 2. DRAIN INDUCTANCE REQUIRED TO LIMIT
GAMMA DOT CURRENT TO IAS
1000
FSYA250D, FSYA250R
Typical Performance Curves
Unless Otherwise Specified
(Continued)
HEAT SINK REQUIRED
100
ID , DRAIN CURRENT (A)
30
ID , DRAIN (A)
20
10
0
-50
0
50
100
100µs
10
1ms
10ms
1
0.1
150
100ms
OPERATION IN THIS
AREA MAY BE
LIMITED BY rDS(ON)
10
1
TC , CASE TEMPERATURE (oC)
100
600
VDS , DRAIN TO SOURCE VOLTAGE (V)
FIGURE 3. MAXIMUM CONTINUOUS DRAIN CURRENT vs
TEMPERATURE
FIGURE 4. FORWARD BIAS SAFE OPERATING AREA
2.5
PULSE DURATION = 250ms, VGS = 12V, ID = 17A
2.0
QGS
NORMALIZED rDS(ON)
QG
12V
QGD
VG
1.5
1.0
0.5
0.0
-80
CHARGE
-40
0
40
80
120
160
TJ , JUNCTION TEMPERATURE (oC)
NORMALIZED
THERMAL RESPONSE (ZθJC)
FIGURE 5. BASIC GATE CHARGE WAVEFORM
FIGURE 6. NORMALIZED rDS(ON) vs JUNCTION TEMPERATURE
1
0.5
0.2
0.1
0.1
0.05
0.02
0.01
PDM
SINGLE PULSE
0.01
0.001
10-5
t1
NOTES:
DUTY FACTOR: D = t1/t2
PEAK TJ = PDM x ZθJC + TC
10-4
10-3
10-2
t2
10-1
t, RECTANGULAR PULSE DURATION (s)
FIGURE 7. NORMALIZED MAXIMUM TRANSIENT THERMAL RESPONSE
3-128
100
101
FSYA250D, FSYA250R
Typical Performance Curves
Unless Otherwise Specified
(Continued)
IAS , AVALANCHE CURRENT (A)
300
100
STARTING TJ = 25oC
STARTING TJ = 150oC
10
IF R = 0
tAV = (L) (IAS) / (1.3 RATED BVDSS - VDD)
1
0.01
IF R ≠ 0
tAV = (L/R) ln [(IAS*R) / (1.3 RATED BVDSS - VDD) + 1]
10
0.1
1
tAV , TIME IN AVALANCHE (ms)
FIGURE 8. UNCLAMPED INDUCTIVE SWITCHING
Test Circuits and Waveforms
ELECTRONIC SWITCH OPENS
WHEN IAS IS REACHED
VDS
L
BVDSS
+
CURRENT I
TRANSFORMER AS
tP
-
VARY tP TO OBTAIN
REQUIRED PEAK IAS
VDD
50V-150V
DUT
tP
VDD
+
50Ω
VGS ≤ 20V
0V
VDS
IAS
50Ω
tAV
FIGURE 9. UNCLAMPED ENERGY TEST CIRCUIT
FIGURE 10. UNCLAMPED ENERGY WAVEFORMS
tON
VDD
tOFF
td(ON)
td(OFF)
tr
RL
VDS
tf
90%
90%
VDS
VGS = 12V
10%
DUT
10%
0V
90%
RGS
50%
VGS
50%
PULSE WIDTH
10%
FIGURE 11. RESISTIVE SWITCHING TEST CIRCUIT
FIGURE 12. RESISTIVE SWITCHING WAVEFORMS
3-129
FSYA250D, FSYA250R
Screening Information
Screening is performed in accordance with the latest revision in effect of MIL-S-19500, (Screening Information Table).
Delta Tests and Limits (JANTXV Equivalent, JANS Equivalent) TC = 25oC, Unless Otherwise Specified
PARAMETER
SYMBOL
TEST CONDITIONS
MAX
UNITS
Gate to Source Leakage Current
IGSS
VGS = ±20V
±20 (Note 7)
nA
Zero Gate Voltage Drain Current
IDSS
VDS = 80% Rated Value
Drain to Source On Resistance
rDS(ON)
TC = 25oC at Rated ID
Gate Threshold Voltage
VGS(TH)
ID = 1.0mA
±25 (Note 7)
µA
±20% (Note 8)
Ω
±20% (Note 8)
V
NOTES:
7. Or 100% of Initial Reading (whichever is greater).
8. Of Initial Reading.
Screening Information
TEST
JANTXV EQUIVALENT
JANS EQUIVALENT
Gate Stress
VGS = 30V, t = 250µs
VGS = 30V, t = 250µs
Pind
Optional
Required
Pre Burn-In Tests (Note 9)
MIL-S-19500 Group A,
Subgroup 2 (All Static Tests at 25oC)
MIL-S-19500 Group A,
Subgroup 2 (All Static Tests at 25oC)
Steady State Gate
Bias (Gate Stress)
MIL-STD-750, Method 1042, Condition B
VGS = 80% of Rated Value,
TA = 150oC, Time = 48 hours
MIL-STD-750, Method 1042, Condition B
VGS = 80% of Rated Value,
TA = 150oC, Time = 48 hours
Interim Electrical Tests (Note 9)
All Delta Parameters Listed in the Delta Tests
and Limits Table
All Delta Parameters Listed in the Delta Tests
and Limits Table
Steady State Reverse
Bias (Drain Stress)
MIL-STD-750, Method 1042, Condition A
VDS = 80% of Rated Value,
TA = 150oC, Time = 160 hours
MIL-STD-750, Method 1042, Condition A
VDS = 80% of Rated Value,
TA = 150oC, Time = 240 hours
PDA
10%
5%
Final Electrical Tests (Note 9)
MIL-S-19500, Group A, Subgroup 2
MIL-S-19500, Group A,
Subgroups 2 and 3
NOTE:
9. Test limits are identical pre and post burn-in.
Additional Screening Tests
PARAMETER
MAX
UNITS
VDS = 160V, t = 10ms
2.2
A
IAS
VGS(PEAK) = 15V, L = 0.1mH
81
A
Thermal Response
∆VSD
tH = 10ms; VH = 20V; IH = 4A
70 (Note 10)
mV
Thermal Impedance
∆VSD
tH = 500ms; VH = 20V; IH = 4A
159 (Note 10)
mV
Safe Operating Area
Unclamped Inductive Switching
SYMBOL
SOA
TEST CONDITIONS
NOTE:
10. Heat sink required.
3-130
FSYA250D, FSYA250R
Rad Hard Data Packages - Intersil Power Transistors
TXV Equivalent
E. Preconditioning Attributes Data Sheet
Hi-Rel Lot Traveler
HTRB - Hi Temp Gate Stress Post Reverse
Bias Data and Delta Data
HTRB - Hi Temp Drain Stress Post Reverse
Bias Delta Data
1. Rad Hard TXV Equivalent - Standard Data Package
A. Certificate of Compliance
B. Assembly Flow Chart
C. Preconditioning - Attributes Data Sheet
D. Group A
- Attributes Data Sheet
F. Group A
- Attributes Data Sheet
- Attributes Data Sheet
- Attributes Data Sheet
G. Group B
F. Group C
- Attributes Data Sheet
H. Group C
- Attributes Data Sheet
G. Group D
- Attributes Data Sheet
I. Group D
- Attributes Data Sheet
E. Group B
2. Rad Hard Max. “S” Equivalent - Optional Data Package
2. Rad Hard TXV Equivalent - Optional Data Package
A. Certificate of Compliance
A. Certificate of Compliance
B. Assembly Flow Chart
B. Serialization Records
C. Preconditioning - Attributes Data Sheet
- Precondition Lot Traveler
- Pre and Post Burn-In Read and Record
Data
C. Assembly Flow Chart
D. SEM Photos and Report
D. Group A
- Attributes Data Sheet
- Group A Lot Traveler
E. Group B
- Attributes Data Sheet
- Group B Lot Traveler
- Pre and Post Read and Record Data for
Intermittent Operating Life (Subgroup B3)
- Bond Strength Data (Subgroup B3)
- Pre and Post High Temperature Operating
Life Read and Record Data (Subgroup B6)
F. Group C
G. Group D
- Attributes Data Sheet
- Group C Lot Traveler
- Pre and Post Read and Record Data for
Intermittent Operating Life (Subgroup C6)
- Bond Strength Data (Subgroup C6)
- Attributes Data Sheet
- Group D Lot Traveler
- Pre and Post RAD Read and Record Data
Class S - Equivalents
1. Rad Hard “S” Equivalent - Standard Data Package
A. Certificate of Compliance
B. Serialization Records
C. Assembly Flow Chart
D. SEM Photos and Report
3-131
E. Preconditioning - Attributes Data Sheet
- Hi-Rel Lot Traveler
- HTRB - Hi Temp Gate Stress Post
Reverse Bias Data and Delta Data
- HTRB - Hi Temp Drain Stress Post
Reverse Bias Delta Data
- X-Ray and X-Ray Report
F. Group A
- Attributes Data Sheet
- Hi-Rel Lot Traveler
- Subgroups A2, A3, A4, A5 and A7 Data
G. Group B
- Attributes Data Sheet
- Hi-Rel Lot Traveler
- Subgroups B1, B3, B4, B5 and B6 Data
H. Group C
- Attributes Data Sheet
- Hi-Rel Lot Traveler
- Subgroups C1, C2, C3 and C6 Data
I. Group D
- Attributes Data Sheet
- Hi-Rel Lot Traveler
- Pre and Post Radiation Data
FSYA250D, FSYA250R
SMD1
3 PAD CERAMIC LEADLESS CHIP CARRIER
INCHES
E
MILLIMETERS
SYMBOL
MIN
MAX
MIN
MAX
NOTES
A
0.129
0.139
3.27
3.53
-
D
b
0.135
0.145
3.43
3.68
-
D
0.445
0.455
11.30
11.55
-
D1
0.370
0.380
9.39
9.65
-
D2
0.100
0.110
2.54
2.79
-
E
0.620
0.630
15.74
16.00
-
E1
0.410
0.420
10.41
10.66
-
E2
0.152
0.162
3.86
4.11
-
NOTES:
A
1. No current JEDEC outline for this package.
2. Controlling dimension: INCH.
3. Revision 1 dated 5-97.
E1
E2
D2
D1
b
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate
and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
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3-132
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