GMT G914H 300ma low-noise ldo regulator Datasheet

G914X
Global Mixed-mode Technology Inc.
300mA Low-Noise LDO Regulators
Features
General Description
30µV (rms)
„Ultra Low Output Noise
„Ultra Low 55µA No-Load Supply Current
„Ultra Low Dropout 70mV @ 50mA Load
„Guarantee 300mA Output Current
„Over-Temperature and Short-Circuit Protection
„Fixed: 2.70V (G914A), 2.80V (G914B)
The G914X is a low supply current, low dropout linear
regulator that comes in a space saving SOT23-5
package. The supply current at no-load is 55µA. In the
shutdown mode, the maximum supply current is less
than 1µA. Operating voltage range of the G914X is
from 2.5V to 5.5V. The over-current protection limit is
set at 500mA typical and 400mA minimum. An
over-temperature protection circuit is built-in in the
G914X to prevent thermal overload. These power
saving features make the G914X ideal for use in the
battery-powered applications such as notebook computers, cellular phones, and PDA’s.
3.00V (G914C), 3.30V (G914D)
2.50V (G914E), 2.85V (G914F)
1.50V(G914G), 1.80V(G914H)
„Max. Supply Current in Shutdown Mode < 1µA
„Stable with low cost ceramic capacitors
Applications
„
„
„
„
„
Ordering Information
Notebook Computers
Cellular Phones
PDA
Hand-Held Devices
Battery-Powered Application
ORDER
MARKING VOLTAGE
NUMBER
G914A
G914B
G914C
G914D
G914E
G914F
G914G
G914H
Pin Configuration
IN
1
GND
2
4Axx
4Bxx
4Cxx
4Dxx
4Exx
4Fxx
4Gxx
4Hxx
2.70V
2.80V
3.00V
3.30V
2.50V
2.85V
1.50V
1.80V
5
OUT
IN
+C
IN
G914X
BATTERY
4
3
PACKAGE
-40°C~ +85°C
-40°C~ +85°C
-40°C~ +85°C
-40°C~ +85°C
-40°C~ +85°C
-40°C~ +85°C
-40°C~ +85°C
-40°C~ +85°C
SOT 23-5
SOT 23-5
SOT 23-5
SOT 23-5
SOT 23-5
SOT 23-5
SOT 23-5
SOT 23-5
Typical Operating Circuit
_ 1µF
G914X
COUT
1µF
SHDN
BYP
BYP
SOT23-5
OUTPUT
VOLTAGE
OUT
GND
SHDN
TEMP.
RANGE
CBYP
10nF
Fixed mode
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G914X
Operating Temperature Range….…….-40°C to +85°C
Junction Temperature……………………………+150°C
(1)
θJA …....……………….……………….…..240°C/Watt
Storage Temperature Range…………-65°C to +160°C
Lead Temperature (soldering, 10sec)...….……+260°C
Absolute Maximum Ratings
VIN to GND……..………………..….….………-0.3V to +7V
Output Short-Circuit Duration.…..….……..…….….Infinite
All Other Pins to GND……….……….-0.3V to (VIN + 0.3V)
Continuous Power Dissipation (TA = +25°C)
SOT 23-5 …………………………..…………...…..520 mW
Note (1): See Recommended Minimum Footprint (Figure 2)
Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the
specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Electrical Characteristics
(VIN=VOUT(STD)+1V, V SHDN =VIN, TA=TJ =25°C, unless otherwise noted.) (Note 1)
PARAMETER
SYMBOL
CONDITIONS
Input Voltage (Note 2)
VIN
Output Voltage Accuracy
VOUT
Maximum Output Current
Current Limit (Note 3)
ILIM
Ground Pin Current
IQ
MIN TYP MAX UNITS
Note2
Variation from specified VOUT, IOUT=1mA,VOUT≥2.5V version -2
For G914H, IOUT=1mA
-3
For G914G, IOUT=1mA
-4
VIN =3.6V
ILOAD = 0mA
ILOAD = 50mA
ILOAD = 300mA
5.5
V
2
%
3
4
300
mA
500
mA
55
120
µA
145
265
2
70
230
250
380
mV
510
450 600
500 660
760 960
910 1220
0.1 0.28 %/V
0.35
%
2
57
dB
30
ppm/°C
52
35
µVRMS
30
26
IOUT = 1mA
IOUT = 50mA, VOUT ≥ 2.7V Version
VO (NOM) ≥ 3.0V
2.5V≤VO (NOM) ≤2.85V
IOUT = 150mA
VO (NOM) = 1.8V
Dropout Voltage (Note 4)
VDROP
VO (NOM) = 1.5V
VO (NOM) ≥ 3.0V
2.5V≤VO (NOM) ≤2.85V
IOUT =300mA
VO (NOM) = 1.8V
VO (NOM) = 1.5V
Line Regulation
∆VLNR VIN=VOUT+100mV to 5.5V, IOUT = 1mA
IOUT = 1mA to 150mA
Load Regulation (Note 5)
∆VLDR
IOUT = 1mA to 300mA
Power Supply Rejection Ratio
PSRR IOUT = 30mA CBYP = 10nF, f = 120HZ
Output Voltage Temperature Coefficient ΔVO/ΔT IOUT = 50mA, TJ = 25°C to 125°C
COUT = 1µF, IOUT = 150mA, CBYP=1nF
Output Voltage Noise
COUT = 1µF, IOUT = 150mA, CBYP=10nF
(10Hz to 100kHz)
en
VIN=VOUT+1V
COUT = 1µF, IOUT = 150mA, CBYP = 100nF
(G914H)
COUT = 1µF, IOUT = 1mA, CBYP = 10nF
SHUTDOWN
VIH
Regulator enabled
VIN- 0.7
SHDN Input Threshold
Regulator shutdown
VIL
ISHDN
V SHDN = VIN TA = +25°C
0.003
SHDN Input Bias Current
Shutdown Supply Current
IQ SHDN VOUT = 0V
TA = +25°C
THERMAL PROTECTION
Thermal Shutdown Temperature
TSHDN
150
Thermal Shutdown Hysteresis
15
∆TSHDN
0.4
0.1
1
V
µA
°C
°C
Note 1: Limits is 100% production tested at T A = +25°C. Low duty pulse techniques are used during test to
maintain junction temperature as close to ambient as possible.
Note 2: VIN (min)=VOUT (STD)+VDROPOUT
Note 3: Not tested. For design purposes, the current limit should be considered 400mA minimum to 600mA maximum.
Note 4: The dropout voltage is defined as (VIN - VOUT) when VOUT is 100mV below the value of VOUT for VIN = VOUT +1V. The
performance of every G914X version, see “Typical Performance Characteristics”.
Note 5: Regulation is measured at constant junction temperature using low duty cycle pulse testing. Parts are tested for
load regulation in the load range from 1mA to 300mA. Changes in output due to heating effects are covered by the
thermal regulation specification.
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Global Mixed-mode Technology Inc.
Typical Performance Characteristics
(VIN = V O+1V, CIN=1µF, COUT=1µF, V SHDN = VIN, G914D, TA =25°C, unless otherwise noted.)
Output Voltage vs. Load Current
Ground Current vs. Load Current
3.340
400
3.330
G914D
350
Ground Current (µA)
Output Voltage (V)
3.320
3.310
3.300
3.290
3.280
3.270
3.260
VIN=3.6V
No Load
300
250
200
150
100
50
3.250
3.240
0
0
50
100
150
200
250
300
0
50
Output Voltage vs. Input Voltage
150
200
250
300
Supply Current vs. Input Voltage
3.5
400
350
3.0
No Load
2.0
1.5
1.0
250
200
100
50
0.0
0
1
2
3
4
5
ILOAD=50mA
150
0.5
0
ILOAD=300mA
300
2.5
Supply Current (µA)
Output Voltage (V)
100
Load Current (mA)
Load Current (mA)
ILOAD=0mA
0
6
1
2
3
4
5
6
Input Voltage (V)
Input Voltage (V)
Dropout Voltage vs. Load Current
Ouptut Noise 10HZ to 100KHZ
1000
TA=25°C
Dropout Voltage (mV)
900
800
G914H
700
600
G914E
G914G
500
400
Top to down
G914A
G914B
G914F
G914C
G914D
300
200
100
0
0
50
100
150
200
250
300
Loading (mA)
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Global Mixed-mode Technology Inc.
Typical Performance Characteristics (continued)
SHDN Input Bias Current vs. Temperature
Ground Current vs. Temperature
80
0.20
G914D
VIN = 4.3V
IOUT =0A
SHDN Input Bias Current (µA)
Ground Current (µA)
100
60
40
20
0.10
0.00
-0.10
-0.20
0
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 10 11 12 13
0 0 0 0
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 10 11 12 13
0 0 0 0
Junction Temperature TJ (°C)
Junction Temperature TJ (°C)
Shutdown Supply Current vs. Temperature
Output Voltage vs. Temperature
3.36
G914D
VIN = 4.3V
3.34
Output Voltage (V)
Shutdown Supply Current(µA)
1.00
0.60
G914D
VIN=4.3V
VSHDN=VIN
0.20
-0.20
-0.60
G914D
ILOAD=1mA
VIN=5.5V
3.32
3.30
VIN=4.3V
3.28
VIN=3.4V
3.26
3.24
-1.00
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 10 11 12 13
0 0 0 0
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 10 11 12 13
0 0 0 0
Junction Temperature TJ (°C)
Junction Temperature TJ (°C)
Dropout Voltage vs. Temperature
400
Dropout Voltage (mV)
350
G914D
300
250
ILOAD=150mA
200
150
100
ILOAD=50mA
50
ILOAD=0mA
0
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 10 11 12 13
0 0 0 0
Junction Temperature TJ (°C)
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Global Mixed-mode Technology Inc.
Typical Performance Characteristics (continued)
Line Transient
Load Transient
Load Transient
Power Supply Rejection Ripple
80
G914F
VIN=5V +2V(p-p)
RL=100Ω
CBYP=10nF
Power Supply Rejection
Ratio(db)
70
60
50
40
30
20
10
0
0.1
1
10
100
Frequency(KHZ)
Output Noise vs. Bypass Capacitance
Output Noise vs. Load Current
70
70
50
G914H
VIN=2.8V
TA=25°C
COUT=1µF
40
30
20
10
0
0.001
G914H
VIN=2.8V
TA=25°C
60
Output Noise (µVrms)
Output Noise (µVrms)
60
50
COUT=1µF
40
30
20
10
0
0.01
0.1
1
10
100
1000
Load Current (mA)
Bypass Capacitance (µF)
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Global Mixed-mode Technology Inc.
Typical Performance Characteristics (continued)
Power On Response Waveform
Power Off Response Waveform
Shutdown Delay Waveform
Shutdown Delay Waveform
Turn-On Time vs. Bypass Capacitance
Turn-Off Time vs. Bypass Capacitance
100000
1000
Propagation Delay Time
Propagation Delay Time
Time (µs)
Time (µs)
10000
1000
G914D
ILOAD =150mA
CIN=COUT=1µF
VIN=4.3V power already
VSHDN=0 to 4.3V
100
10
Rise Time
100
Fall Time
10
1
G914D
ILOAD =150mA
CIN=COUT=1µF
VIN=4.3V power already
VSHDN=4.3V to 0V
1
0.1
1
10
Bypass Capactor (nF)
100
0.1
1
10
100
Bypass Capacitor (nF)
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G914X
Pin Description
PIN
NAME
FUNCTION
1
IN
2
GND
3
SHDN
4
BYP
5
OUT
Regulator Input. Supply voltage can range from +2.5V to +5.5V. Bypass with 1µF to GND.
Ground. This pin also functions as a heatsink. Solder to large pads or the circuit board ground
plane to maximize thermal dissipation.
Active-High Enable Input. A logic low reduces the supply current to less than 1µA. Connect to IN for
normal operation.
This is a reference bypass pin. It should connect external 10nF capacitor to GND to reduce output noise. Bypass capacitor must be no less than 1nF. (CBYP≥ 1nF)
Regulator Output. Sources up to 150mA. Bypass with a 1µF, <0.2Ω typical ESR capacitor to
GND.
Detailed Description
Similarly, when the feedback voltage is less than
1.25V, the error amplifier causes the output PMOS to
conduct more current to pull the feedback voltage up
to 1.25V. Thus, through this feedback action, the error
amplifier, output PMOS, and the voltage divider effectively form a unity-gain amplifier with the feedback
voltage force to be the same as the 1.25V bandgap
reference. The output voltage, VOUT, is then given by
the following equation:
VOUT = 1.25 (1 + R1/R2).
(1)
Alternatively, the relationship between R1 and R2 is
given by:
R1 = R2 (VOUT / 1.25 + 1).
(2)
For the output voltage versions of G914X, the output
voltages are 2.7V for G914A, 2.8V for G914B, 3.0V for
G914C, 3.3V for G914D, and 2.5V for G914E, 2.85V
for G914F, 1.50V for G914G and 1.80V for G914H.
The block diagram of the G914X is shown in Figure 1.
It consists of an error amplifier, 1.25V bandgap reference, PMOS output transistor, internal feedback voltage divider, shutdown logic, over current protection
circuit, and over temperature protection circuit.
The internal feedback voltage divider’s central tap is
connected to the non-inverting input of the error amplifier. The error amplifier compares non-inverting input
with the 1.25V bandgap reference. If the feedback
voltage is higher than 1.25V, the error amplifier’s output becomes higher so that the PMOS output transistor has a smaller gate-to-source voltage (VGS). This
reduces the current carrying capability of the PMOS
output transistor, as a result the output voltage decreases until the feedback voltage is equal to 1.25V.
IN
SHDN
-
ERROR
AMP
SHUTDOWN
LOGIC
+
OVER CURRENT
PROTECT & DYNAMIC
FEEDBACK
OUT
BYP
R1
OVER TEMP.
PROTECT
CBYP
1.25V
Vref
R2
GND
Figure 1. Functional Diagram
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Over Current Protection
The G914X use a current mirror to monitor the output
current. A small portion of the PMOS output transistor’s
current is mirrored onto a resistor such that the voltage
across this resistor is proportional to the output current.
This voltage is compared against the 1.25V reference.
Once the output current exceeds the limit, the PMOS
output transistor is turned off. Once the output transistor
is turned off, the current monitoring voltage decreases
to zero, and the output PMOS is turned on again. If the
over current condition persist, the over current protection circuit will be triggered again. Thus, when the output
is shorted to ground, the output current will be alternating between 0 and the over current limit. The typical
over current limit of the G914X is set to 500mA. Note
that the input bypass capacitor of 1µF must be used in
this case to filter out the input voltage spike caused by
the surge current due to the inductive effect of the
package pin and the printed circuit board’s routing wire.
Otherwise, the actual voltage at the IN pin may exceed
the absolute maximum rating.
The die attachment area of the G914X’s lead frame is
connected to pin 2, which is the GND pin. Therefore,
the GND pin of G914X can carry away the heat of the
G914X die very effectively. To improve the power dissipation, connect the GND pin to ground using a large
ground plane near the GND pin.
Applications Information
Capacitor Selection and Regulator Stability
Normally, use a 1µF capacitor on the input and a 1µF
capacitor on the output of the G914X. Larger input capacitor values and lower ESR provide better supply-noise rejection and transient response. A highervalue input capacitor (10µF) may be necessary if large,
fast transients are anticipated and the device is located
several inches from the power source. For stable operation over the full temperature range, with load currents
up to 120mA, a minimum of 1µF is recommended.
Power-Supply Rejection and Operation from
Sources Other than Batteries
The G914X is designed to deliver low dropout voltages
and low quiescent currents in battery powered systems. Power-supply rejection is 57dB at low frequencies as the frequency increases above 20kHz; the
output capacitor is the major contributor to the rejection of power-supply noise.
Over Temperature Protection
To prevent abnormal temperature from occurring, the
G914X has a built-in temperature monitoring circuit.
When it detects the temperature is above 150oC, the
output transistor is turned off. When the IC is cooled
down to below 135oC, the output is turned on again. In
this way, the G914X will be protected against abnormal junction temperature during operation.
When operating from sources other than batteries,
improve supply-noise rejection and transient response
by increasing the values of the input and output capacitors, and using passive filtering techniques.
Shutdown Mode
When the SHDN pin is connected a logic low voltage,
the G914X enters shutdown mode. All the analog circuits are turned off completely, which reduces the current consumption to only the leakage current. The output is disconnected from the input. When the output has
no load at all, the output voltage will be discharged to
ground through the internal resistor voltage divider.
Load Transient Considerations
The G914X load-transient response graphs show two
components of the output response: a DC shift of the
output voltage due to the different load currents, and
the transient response. Typical overshoot for step
changes in the load current from 0mA to 100mA is
12mV. Increasing the output capacitor's value and
decreasing its ESR attenuates transient spikes.
Operating Region and Power Dissipation
Since the G914X is a linear regulator, its power dissipation is always given by P = IOUT (VIN – VOUT). The
maximum power dissipation is given by:
Input-Output (Dropout) Voltage
A regulator's minimum input-output voltage differential
(or dropout voltage) determines the lowest usable
supply voltage. In battery-powered systems, this will
determine the useful end-of-life battery voltage. Because the G914X use a P-channel MOSFET pass
transistor, their dropout voltage is a function of RDS(ON)
multiplied by the load current cause the G914X use a
P-channel MOSFET pass transistor, their dropout
voltage is a function of RDS(ON) multiplied by the load
current.
PDMAX = (TJ – TA)/θJA = (150-25) / 240 = 520mW
Where (TJ – TA) is the temperature difference the
G914X die and the ambient air, θJA, is the thermal
resistance of the chosen package to the ambient air.
For surface mount device, heat sinking is accomplished by using the heat spreading capabilities of the
PC board and its copper traces. In the case of a
SOT23-5 package, the thermal resistance is typically
240oC/Watt. (See Recommended Minimum Footprint)
[Figure 2]. Refer to Figure 3 is the G914X valid operating region (Safe Operating Area) & refer to Figure 4
is maximum power dissipation of SOT 23-5.
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Layout Guide
An input capacitance of ≅ 1µF is required between the
G914X input pin and ground (the amount of the capacitance may be increased without limit), This capacitor must be located a distance of not more than
1cm from the input and return to a clean analog
ground.
routing wire. Otherwise, the actual voltage at the IN
pin may exceed the absolute maximum rating.
The output capacitor also must be located a distance
of not more than 1cm from output to a clean analog
ground. Because it can filter out the output spike
caused by the surge current due to the inductive effect
of the package pin and the printed circuit board’s
routing wire. Figure 5 is G914X PCB recommended
layout.
Input capacitor can filter out the input voltage spike
caused by the surge current due to the inductive effect
of the package pin and the printed circuit board’s
Figure 2. Recommended Minimum Footprint
Safe Operating Area [Power Dissipation Limit]
Maximum Power Dissipation of SOT-23-5
400
0.7
Maximum Recommended Output Current
350
Still air
300
0.5
Power Dissipation (W)
Output Current (mA)
Still Air
1oz Copper on SOT-23-5 Package
Mounted on recommended mimimum footprint (RθJA=240°C/W)
0.6
250
TA=85°C
200
TA=55°C
150
TA=25°C
100
1oz Copper on SOT-23-5 Package
Mounted on recommended mimimum
footprint (RJA=240°C/W)
50
0.4
0.3
0.2
0.1
0
0
0.1
0.4
0.7
1.0
1.3
1.6
1.9
25
2.2
35
45
Input-Output Voltage Differential VIN-VOUT (V)
55
65
75
85
95
105
115
125
Amibent Temperature TA (°C)
Note: VIN(max) <= 5.5V
Figure 3. Safe Operating Area
Figure 4. Power Dissipation vs. Temperature
Figure 4 Safe Operating Area
Figure 5. Fixed Mode
*Distance between pin & capacitor must no more than 1cm
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Package Information
C
D
L
E
H
θ1
e1
e
A
A2
A1
b
Note:
1. Package body sizes exclude mold flash protrusions or gate burrs
2. Tolerance ±0.1000 mm (4mil) unless otherwise specified
3. Coplanarity: 0.1000mm
4. Dimension L is measured in gage plane
SYMBOLS
A
A1
A2
b
C
D
E
e
e1
H
L
θ1
MIN
DIMENSIONS IN MILLIMETERS
NOM
1.00
0.00
0.70
0.35
0.10
2.70
1.40
--------2.60
0.37
1º
1.10
----0.80
0.40
0.15
2.90
1.60
1.90(TYP)
0.95
2.80
-----5º
MAX
1.30
0.10
0.90
0.50
0.25
3.10
1.80
--------3.00
----9º
Taping Specification
Feed Direction
SOT23-5 Package Orientation
GMT Inc. does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and GMT Inc. reserves the right at any time without notice to change said circuitry and specifications.
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