GMT G926C Dual 500ma ldo regulator Datasheet

G926
Global Mixed-mode Technology Inc.
Dual 500mA LDO Regulator
General Description
Features
„
„
„
„
„
„
„
The G926A is a dual low dropout regulator with VOUT1
2.5V/500mA and VOUT2 3.3V/500mA, G926B is with
VOUT1 1.8V/500mA and VOUT2 3.3V/500mA, G926C
is with VOUT1 3.3V/500mA and VOUT2 2.5V/ 500mA
and G926D is with VOUT1 3.3V/500mA and VOUT2
1.8V/500mA. The dropout voltage is typically 1V with
500mA load. A low quiescent current is typical 200µA.
Wide Input Voltage Range: 4.3V~6.5V
IO = 500mA, VOUT1 and VOUT2 Dropout Voltage
Typically 1V
Output Current in Excess of 500mA
Output Voltage Accuracy ±2%
Quiescent Current, Typically 200µA
Internal Short Circuit Current Limit
Internal Over Temperature Protection
Familiar regulator features such as over temperature and
current limit protection circuits are provided to prevent it
from being damaged by abnormal operating conditions.
Applications
The G926 comes in a SOP-8 and SOP-8 (FD) with
power-pad package.
„
CD/DVD-ROM, CD/RW
„ Wireless LAN Card/Keyboard/Mouse
„ Battery-Powered Equipment
„ XDSL Router
Ordering Information
ORDER
NUMBER
MARKING
VOUT1
VOUT2
TEMP.
RANGE
PACKAGE
(Pb free)
G926AP1U
G926BP1U
G926A
G926B
2.5V
1.8V
3.3V
3.3V
-40°C~ +85°C
-40°C~ +85°C
SOP-8
SOP-8
G926CP1U
G926C
3.3V
2.5V
-40°C~ +85°C
SOP-8
G926DP1U
G926AF1U
G926D
G926A
3.3V
2.5V
1.8V
3.3V
-40°C~ +85°C
-40°C~ +85°C
SOP-8
SOP-8 (FD)
G926BF1U
G926CF1U
G926DF1U
G926B
G926C
G926D
1.8V
3.3V
3.3V
3.3V
2.5V
1.8V
-40°C~ +85°C
-40°C~ +85°C
-40°C~ +85°C
SOP-8 (FD)
SOP-8 (FD)
SOP-8 (FD)
Note: P1: SOP-8
F1: SOP-8 (FD)
U: Tape & Reel
Pin Configuration
Typical Application Circuit
G926
G926
8
VOUT1 1
GND
8
VOUT1 1
NC
VIN
VIN
VOUT1
VIN
2
7
GND
VIN
2
7
GND
VIN
3
6
GND
VIN
3
6
NC
VOUT2
4
5
SOP-8
G926
VOUT2
GND
GND
VOUT2
4
5
VOUT1
10µF
10µF
VOUT2
10µF
NC
SOP-8 (FD)
TEL: 886-3-5788833
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Ver: 0.3 Preliminary
Oct 19, 2006
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G926
Global Mixed-mode Technology Inc.
Absolute Maximum Ratings
(Note 1)
Input Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V
Power Dissipation Internally Limited
(Note2)
Maximum Junction Temperature . . . . . . . . . . . .150°C
Storage Temperature Range . . . .-65°C ≤ TJ ≤+150°C
Reflow Temperature (soldering, 10sec) . . . . . . 260°C
Thermal Resistance Junction to Ambient
SOP-8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . .162°C/W
SOP-8(FD) . . . . . . . . . . . . . . . . . . . . . . . . . . .75°C/W
Thermal Resistance Junction to Case
SOP-8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31°C/W
SOP-8(FD) . . . . . . . . . . . . . . . . . . . . . . . . . . . .5°C/W
Operating Conditions
(Note 1)
Input Voltage. . . . . . . . . . . . . . . . . . . . . . . .4.3V ~ 6.5V
Temperature Range. . . . . . . . . . . . . .-40°C ≤ TA ≤85°C
Electrical Characteristics
VIN =5V, IO = 500mA, CIN=1µF, COUT =1µF. All specifications apply for TA = TJ = 25°C. [Note 3]
PARAMETER
Input Voltage
SYMBOL
CONDITION
VIN
G926A
Output Voltage1
VOUT1
G926B
G926C
G926D
G926A
Output Voltage 2
Line Regulation
Load Regulation
Quiescent Current
VOUT2
Vline
Vload
IQ
Ripple Rejection
PSRR
Dropout Voltage
VD
Short Circuit Current
Ishort
G926B
G926C
IO = 50mA
10mA < IO < 500mA
10mA < IO < 500mA
IO = 50mA
G926D
4V < VIN < 6.5V, IO = 10mA
10mA < IO < 500mA
MIN
TYP
MAX
UNIT
4.3
2.450
--2.5
6.5
2.550
V
1.764
3.234
1.8
3.3
1.836
3.366
3.234
3.234
3.3
3.3
3.366
3.366
3.234
2.450
3.3
2.5
3.366
2.550
1.764
-----
1.8
0.3
0.5
1.836
1
1
%
%
V
V
VIN = 5V
---
200
500
µA
fi=120Hz, VP-P = 1V, VO = 3.3V
fi=120Hz, VP-P = 1V, VO = 2.5V
-----
53
53
-----
dB
fi=120Hz, VP-P = 1V, VO = 1.8V
IO=500mA
VOUT1
-------
53
1
650
--1.2
---
VOUT2
VOUT1
--550
650
800
-----
VOUT2
800
150
-----
25
---
Current Limit
Ilim
Over Temperature Threshold
TOT
550
---
Over Temperature Hysterisis
Thys
---
V
mA
mA
°C
°C
Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Conditions are conditions under which the device functions but the specifications might not be guaranteed. For guaranteed specifications and
test conditions see the Electrical Characteristics.
Note2: The maximum power dissipation is a function of the maximum junction temperature, TJmax ; total thermal resistance, θJA,
and ambient temperature TA. The maximum allowable power dissipation at any ambient temperature is Tjmax-TA / θJA. If this
dissipation is exceeded, the die temperature will rise above 150°C and IC will go into thermal shutdown. For the G926 in
SOP-8 package, θJA is 162°C/W. For in SOP-8 (FD) with power-pad package, θJA is 75°C/W.
Note3: Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible.
Note4: The type of output capacitor should be tantalum, aluminum or ceramic.
TEL: 886-3-5788833
http://www.gmt.com.tw
Ver: 0.3 Preliminary
Oct 19, 2006
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G926
Global Mixed-mode Technology Inc.
Pin Description
PIN
NAME
SOP-8
SOP-8(FD)
1
1
VOUT1
2,3
2,3
VIN
4
4
VOUT2
5,6,7,8
5,6,8
7
NC
GND
I/O
FUNCTION
O
VOUT1 output voltage 2.5V in G926A, 1.8V in G926B or 3.3V in G926C and
G926D, and source up to 500mA.
Input voltage
I
O
VOUT2 output voltage 3.3V in G926A and G926B, 2.5V in G926C or 1.8V in
G926D, and source up to 500mA.
I
I
No Connection
Ground also function as heat-sink.
Definitions
Dropout Voltage
The input/output Voltage differential at which the regulator output no longer maintains regulation against
further reductions in input voltage. Measured when the
output drops 100mV below its nominal value, dropout
voltage is affected by junction temperature, load current and minimum input supply requirements.
Load Regulation
The change in output voltage for a change in load
current at constant chip temperature. The measurement is made under conditions of low dissipation or by
using pulse techniques such that average chip temperature is not significantly affected.
Maximum Power Dissipation
The maximum total device dissipation for which the
regulator will operate within specifications.
Line Regulation
The change in output voltage for a change in input voltage. The measurement is made under conditions of low
dissipation or by using pulse techniques such that average chip temperature is not significantly affected.
Quiescent Bias Current
Current which is used to operate the regulator chip
and is not delivered to the load.
TEL: 886-3-5788833
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Ver: 0.3 Preliminary
Oct 19, 2006
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G926
Global Mixed-mode Technology Inc.
Typical Performance Characteristics
(VIN=5V, CIN=1µF, COUT =1µF, TA=25°C, unless otherwise noted.)
Line Transient Response
Line Transient Response
Load Transient Response
Load Transient Response
Short Circuit Current
Ripple Rejection
60
IL=10mA
IL=100mA
Ripply Rejection(dB)
50
40
IL=500mA
30
20
CIN=10µF;
COUT =10µF
10
0
10
100
1000
10000
100000
Frequency (Hz)
TEL: 886-3-5788833
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Ver: 0.3 Preliminary
Oct 19, 2006
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G926
Global Mixed-mode Technology Inc.
Typical Performance Characteristics (continued)
Overcurrent Protection Characteristics
Overcurrent Protection Characteristics
Start-up
Start-up
Output Voltage vs. VIN
Output Voltage vs. IL
1.809
TA =25°C ; IL=10mA
1.807
3.312
1.802
3.31
1.801
1.800
Output Voltage (V)
Outpur Voltage (V)
3.308
1.805
3.306
V O1
1.803
3.304
3.302
1.801
3.3
1.799
V O2
1.797
1.795
2.5
3
3.5
4
4.5
V IN (V)
5
5.5
3.31
V IN=4.0V;V O1
3.30
V IN=5.0V;V O2
1.799
1.798
3.30
1.797
V IN=4.0V;V O2
1.796
1.795
3.298
1.794
3.296
1.793
3.294
1.792
V IN=3.3V;V O1
3.29
0
6
3.29
100
200
300
IL (mA)
400
3.28
500
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Ver: 0.3 Preliminary
Oct 19, 2006
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G926
Global Mixed-mode Technology Inc.
Typical Performance Characteristics (continued)
Quiescent Current vs. VIN
Dropout Voltage vs. IL
250
1.0
TA=25°C
0.8
Dropout Voltage (V)
Quiescent Current (µA)
0.9
200
150
100
50
0.7
VO1
0.6
0.5
0.4
0.3
0.2
TA=25°C
V O2
0.1
0
0.0
2.5
3
3.5
4
4.5
VIN (V)
5
5.5
6
0
3.324
400
500
2.5
Max. Dissipation Power (W)
3.314
1.807
Output Voltage (V)
200
300
IL (mA)
G926 Max. Power Dissipation
vs. PCB Top Copper Area
Output Voltage vs. Temperature
1.809
100
3.304
VIN=5V;VO2
1.805
3.294
3.284
1.803
VIN=4V;VO1
3.274
1.801
3.264
1.799
3.254
1.797
IL=10mA
5
1
0.5
0
3.234
-5
1.5
3.244
1.795
-25 -15
2
15
25
35
45
55
65
75
85
0
1
2
3
4
5
2
PCB Top Copper Area (in )
Temperature (°C)
G926 Max. Power Dissipation
vs. TAMB (still air)
Recommended Minimum Footprint
Unit:in2
2.5
SOP-8/SOP-8 (FD)
A=0.1
Max. Dissipation Power (W)
SOP-8 Package
A=0.2
2
A=0.3
A=0.4
A=0.5
1.5
A=1.0
A=1.5
A=2.0
1
A=2.5
A=3.0
A=3.5
0.5
A=4.0
A=4.5
A=5.0
0
25
35
45
55
65
TAMB (°C)
75
85
TEL: 886-3-5788833
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Ver: 0.3 Preliminary
Oct 19, 2006
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G926
Global Mixed-mode Technology Inc.
Package Information
C
E
H
L
D
θ
7 °(4X)
A2
A
A1
y
e
B
SOP-8 Package
Note:
1. Package body sizes exclude mold flash and gate burrs
2. Dimension L is measured in gage plane
3. Tolerance 0.10mm unless otherwise specified
4. Controlling dimension is millimeter converted inch dimensions are not necessarily exact.
5. Followed from JEDEC MS-012
MIN.
DIMENSION IN MM
NOM.
MAX.
MIN.
DIMENSION IN INCH
NOM.
MAX.
A
A1
1.35
0.10
1.60
-----
1.75
0.25
0.053
0.004
0.063
-----
0.069
0.010
A2
B
----0.33
1.45
-----
----0.51
----0.013
0.057
-----
----0.020
C
0.19
-----
0.25
0.007
-----
0.010
D
E
e
4.80
3.80
-----
--------1.27
5.00
4.00
-----
0.189
0.150
-----
--------0.050
0.197
0.157
-----
H
L
y
θ
5.80
0.40
-----
-------------
6.20
1.27
0.10
0.228
0.016
-----
-------------
0.244
0.050
0.004
0°
-----
8°
0°
-----
8°
SYMBOL
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Ver: 0.3 Preliminary
Oct 19, 2006
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G926
Global Mixed-mode Technology Inc.
D1
0.008TYP
E1
E
H
L
D
θ
0.015x45º
A2
A
SEATING PLANE
A1
0.004MAX.
e
B
SOP-8 (FD) Package
Note:
1. JEDEC Outline: MS-012 AA/E.P. Version: N/A
2. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusions and gate burrs shall not exceed .15mm (.006in) per side.
3. Dimensions “E” does not include inter-lead flash, or protrusions inter-lead flash and protrusions shall not exceed .25mm
(.010in) per side.
SYMBOL
DIMENSION IN MM
MIN
DIMENSION IN INCH
MIN
MAX
MAX
A
1.35
1.75
0.053
0.069
A1
A2
B
D
E
0.00
-----
0.13
1.50
0.000
-----
0.005
0.059
4.80
3.81
4.98
3.99
0.189
0.150
e
H
5.80
6.20
0.228
0.244
0.41
1.27
0.016
0.050
0°
---------
8°
2.29
2.29
0°
---------
8°
0.090
0.090
L
θ
D1
E1
0.41TYP
0.016TYP
1.27TYP
0.196
0.157
0.05TYP
Taping Specification
PACKAGE
Q’TY/REEL
SOP-8
SOP-8 (FD)
2,500 ea
2,500 ea
Feed Direction
Typical SOP Package Orientation
GMT Inc. does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and GMT Inc. reserves the right at any time without notice to change said circuitry and specifications.
TEL: 886-3-5788833
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Ver: 0.3 Preliminary
Oct 19, 2006
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