Hynix GM72V66841EXX 2,097,152 word x 8 bit x 4 bank synchronous dynamic ram Datasheet

GM72V66841ET/ELT
2,097,152 WORD x 8 BIT x 4 BANK
SYNCHRONOUS DYNAMIC RAM
Description
The GM72V66841ET/ELT is a synchronous
dynamic random access memory comprised of
67,108,864 memory cells and logic including
input and output circuits operating synchronously
by referring to the positive edge of the externally
provided Clock.
The GM72V66841ET/ELT provides four banks
of 2,097,152 word by 8 bit to realize high
bandwidth with the Clock frequency up to 143
Mhz.
Features
* PC133/PC100/PC66 Compatible
-7(143MHz)/-75(133MHz)/-8(125MHz)
-7K(PC100,2-2-2)/-7J(PC100,3-2-2)
* 3.3V single Power supply
* LVTTL interface
* Max Clock frequency
143/133/125/100MHz
* 4,096 refresh cycle per 64 ms
* Two kinds of refresh operation
Auto refresh / Self refresh
* Programmable burst access capability ;
- Sequence:Sequential / Interleave
- Length :1/2/4/8/FP
* Programmable CAS latency : 2/3
* 4 Banks can operate independently or
simultaneously
* Burst read/burst write or burst read/single
write operation capability
* Input and output masking by DQM input
* One Clock of back to back read or write
command interval
* Synchronous Power down and Clock
suspend capability with one Clock latency
for both entry and exit
* JEDEC Standard 54Pin 400mil TSOP II
Package
Pin Configuration
VCC
DQ0
VCCQ
NC
DQ1
VSSQ
NC
DQ2
VCCQ
NC
DQ3
VSSQ
NC
VCC
NC
/WE
/CAS
/RAS
/CS
BA0/A13
BA1/A12
A10,AP
A0
A1
A2
A3
VCC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
JEDEC STANDARD
400 mil 54 PIN TSOP II
(TOP VIEW)
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
VSS
DQ7
VSSQ
NC
DQ6
VCCQ
NC
DQ5
VSSQ
NC
DQ4
VCCQ
NC
VSS
NC
DQM
CLK
CKE
NC
A11
A9
A8
A7
A6
A5
A4
VSS
Pin Name
CLK
CKE
CS
RAS
CAS
WE
A0~A9,A11
A10 / AP
BA0/A13
~BA1/A12
DQ0~DQ7
DQM
VCCQ
VSSQ
VCC
VSS
NC
Clock
Clock Enable
Chip Select
Row Address Strobe
Column Address Strobe
Write Enable
Address input
Address input or Auto Precharge
Bank select
Data input / Data output
Data input / output Mask
V CC for DQ
V SS for DQ
Power for internal circuit
Ground for internal circuit
No Connection
This document is a general product description and is subject to change without notice. Hynix semiconductor does not assume
any
-1responsibility for use of circuits described. No patent licenses are implied.
Rev. 1.1/Apr.01
GM72V66841ET/ELT
Block Diagram
A0 to A13
A0 to A8
4096 row
x 512 column
x 8 bit
Bank 3
4096 row
x 512 column
x 8 bit
Control logic &
timing generator
DQM
Output
buffer
DQ0 to DQ7
Rev. 1.1/Apr.01
Bank 2
Memory array
CAS
Input
buffer
Column decoder
Sense amplifier & I/O bus
4096 row
x 512 column
x 8 bit
Memory array
RAS
Bank 1
Row decoder
CS
4096 row
x 512 column
x 8 bit
Memory array
CKE
Bank 0
Refresh
counter
Row decoder
Column decoder
Sense amplifier & I/O bus
Memory array
Row decoder
Column decoder
Sense amplifier & I/O bus
Column decoder
Sense amplifier & I/O bus
Row decoder
Row address
counter
WE
Column address
buffer
CLK
Column address
counter
A0 to A13
-2-
GM72V66841ET/ELT
Absolute Maximum Ratings
Parameter
Symbol
Value
Unit
Note
Voltage on any pin relative to VSS
VT
-0.5 to Vcc+0.5
(<= 4.6 (max))
V
1
Supply voltage relative to V SS
V CC
-0.5 to +4.6
V
1
Short circuit output current
I OUT
50
mA
PT
1.0
W
Operating temperature
Topr
0 to +70
C
Storage temperature
Tstg
-55 to +125
C
Power dissipation
Notes : 1. Respect to VS S
Recommended DC Operating Conditions (Ta = 0 to + 70C)
Parameter
Symbol
Min
Max
Unit
Note
V CC, VCCQ
3.0
3.6
V
1
V SS, VSSQ
0
0
V
Input high voltage
V IH
2.0
Vcc+0.3
V
1, 2
Input low voltage
V IL
-0.3
0.8
V
1,3
Supply voltage
Notes : 1. All voltage referred to V SS.
2. V IH (max) = 5.6V for pulse width <= 3ns
3. V IL (min) = -2.0V for pulse width <= 3ns
Rev. 1.1/Apr.01
-3-
GM72V66841ET/ELT
DC Characteristics (Ta = 0 to 70C, VCC , VCCQ = 3.3 V +/- 0.3 V, VSS, VSSQ= 0 V)
Parameter
Operating
current
I CC1
Standby current in
power down
I CC2P
Standby current in
power down
(input signal stable)
Standby current in
non power down
(CAS Latency=2)
Standby current in
non power down
(input signal stable)
-7
- 75
-8
-7K
-7J
Max
Max
Max
Max
Max
85
85
80
80
80
Symbol
Unit Test conditions
2
mA
mA
2
I CC2PS
mA
0.4
Burst length= 1
t RC = min
CKE = V IL,
t CK = 12 ns
CKE=V IL,
t CK= infinity
6
6,8
mA
CKE,CS = V IH,
t CK = 12ns
4
I CC2NS
12
mA
CKE = V IH,
t CK = infinity
4
1,2,5
2,6
I CC3P
6
mA
Active standby current
in power down
(input signal stable)
I CC3PS
5
mA
CKE = V IL,
t CK = infinity
I CC3N
30
mA
CKE,CS = V IH,
t CK = 12 ns,
DQ = High-Z
Active standby current
in non power down
I CC3NS
(input signal stable)
20
mA
CKE = V IH,
t CK = infinity
120
mA
t CK = min
( CL= 2 )
I CC4
( CL= 3 )
I CC4
Refresh current
I CC5
Self refresh current
I CC6
150
150
150
160
120
120
mA
0.4
BL = 4
1,2,4
2,9
1,2,3
mA
t RC = min
3
V IH >=VCC - 0.2
V IL <=0.2V
7
mA
1
Rev. 1.1/Apr.01
5
15
CKE = V IL,
t CK = 12 ns,
DQ = High-Z
Burst
operating
current
1, 2, 3
I CC2N
Active standby current
in power down
Active standby current
in non power down
Notes
7,8
-4-
GM72V66841ET/ELT
DC Characteristics (Ta = 0 to 70C, VCC , VCCQ = 3.3 V +/- 0.3 V, VSS, VSSQ= 0 V)
(Continued)
- 7, - 75, - 8, - 7K, - 7J
Parameter
Symbol
Unit Test conditions
Min
Max
Input leakage current
I LI
-1
1
uA
0 <=Vin <=VCC
Output leakage current
I LO
-1.5
1.5
uA
0<=Vout<=VCC
DQ = disable
Output high voltage
V OH
2.4
-
V
I OH = -2 mA
Output low voltage
V OL
-
0.4
V
I OL =2 mA
Notes
Notes : 1. ICC depends on output load condition when the device is selected. I CC ( max) is specified at the
output open condition.
2. One bank operation.
3. Addresses are changed once per one cycle.
4. Addresses are changed once per two cycles.
5. After Power down mode, CLK operating current.
6. After Power down mode, no CLK operating current.
7. After self refresh mode set, self refresh current.
8. L-Version.
9. Input signals are VI H or V IL fixed.
Capacitance (Ta = 25C, VCC, VCCQ = 3.3 V +/-0.3 V)
Parameter
Symbol
Min.
Max.
Unit
Notes
Input capacitance (CLK)
CI1
2.5
4
pF
1, 3, 4
Input capacitance (Signals)
CI2
2.5
5
pF
1, 3, 4
Output capacitance (DQ)
CO
4.0
6.5
pF
1, 2, 3, 4
Notes : 1. Capacitance measured with Boonton Meter or effective capacitance measuring method.
2. DQM = VI H to disable Dout.
3. This parameter is sampled and not 100% tested.
4. Measured with 1.4 V bias and 200mV swing at the pin under measurement.
Rev. 1.1/Apr.01
-5-
GM72V66841ET/ELT
AC Characteristics (Ta = 0 to 70C, VCC, VCCQ = 3.3 V +/- 0.3 V, VSS, VSSQ = 0 V)
-7
Parameter
- 75
-8
- 7K
- 7J
Symbol
Unit Notes
Min Max Min Max Min Max Min Max Min Max
(CL=2)
t CK
t CK
t CKH
t CKL
t AC
t AC
t OH
10
-
10
-
10
-
10
-
15
-
7
-
7.5
-
8
-
10
-
10
-
2.5
-
2.5
-
3
-
3
-
3
2.5
-
2.5
-
3
-
3
-
-
6
-
6
-
6
-
-
5.4
-
5.4
-
6
2.7
-
2.7
-
3
t LZ
1.5
-
1.5
-
t HZ
-
5.4
-
1.5
-
0.8
CKE setup time
t DS
t DH
t AS
t AH
t CES
CKE setup time for
power down exit
System clock
cycle time
ns
1
-
ns
1
3
-
ns
1
6
-
8
ns
1, 2
-
6
-
6
-
3
-
3
-
ns
1, 2
2
-
2
-
2
-
ns
1, 2, 3
5.4
-
6
-
6
-
6
ns
1, 4
1.5
-
2
-
2
-
2
-
ns
1
-
0.8
-
1
-
1
-
1
-
ns
1
1.5
-
1.5
-
2
-
2
-
2
-
ns
1
0.8
-
0.8
-
1
-
1
-
1
-
ns
1
1.5
-
1.5
-
2
-
2
-
2
-
ns
1, 5
t CESP
1.5
-
1.5
-
2
-
2
-
2
-
ns
1
CKE hold time
t CEH
0.8
-
0.8
-
1
-
1
-
1
-
ns
1
Command (CS, RAS,
CAS, WE, DQM)
setup time
t CS
1.5
-
1.5
-
2
-
2
-
2
-
ns
1
Command (CS, RAS,
CAS, WE, DQM)
hold time
t CH
0.8
-
0.8
-
1
-
1
-
1
-
ns
1
t RC
62
-
65
-
68
-
70
-
70
-
ns
1
t RAS
42
120000
45
120000
48
120000
50
120000
50
120000
ns
1
t RCD
20
-
20
-
20
-
20
-
20
-
ns
1
t RP
20
-
20
-
20
-
20
-
20
-
ns
1
(CL=3)
CLK high pulse width
CLK low pulse width
Access time
from CLK
(CL=2)
(CL=3)
Data-out hold time
CLK to Data-out low
impedance
CLK to Data-out
high impedance
( CL = 2,3 )
Data-in setup time
Data-in hold time
Address setup time
Address hold time
Ref/Active to Ref/Active
command period
Active to Precharge
command period
Active command to
column command
(same bank)
Precharge to active
command period
Rev. 1.1/Apr.01
-6-
GM72V66841ET/ELT
AC Characteristics (Ta = 0 to 70C, VCC, VCCQ = 3.3 V +/-0.3 V, VSS, VSSQ = 0 V)
(Continued)
-7
Parameter
- 75
-8
- 7K
- 7J
Symbol
Unit Notes
Min Max Min Max Min Max Min Max Min Max
Write recovery or data-in
to precharge lead time
Active (a) to Active (b)
command period
Refresh period
t RWL
7
-
7.5
-
8
-
10
-
10
-
ns
1
t RRD
14
-
15
-
16
-
20
-
20
-
ns
1
t REF
-
64
-
64
-
64
-
64
-
64
ms
Notes : 1. AC measurement assumes t T = 1ns. Reference level for timing of input signals is 1.40V.
If tT is longer than 1ns,transition time compensation should be considered.
2. Access time is measured at 1.40V. Load condition is C L = 50pF without termination.
3. t LZ (min)defines the time at which the outputs achieves the low impedance state.
4. t HZ (max)defines the time at which the outputs achieves the high impedance state.
5. t CES define CKE setup time to CKE rising edge except Power down exit command.
Test Condition
• Input and output-timing reference levels: 1.4V
• Input waveform and output load: See following figures
I/O
input
2.4V
80%
0.4V
20%
OPEN
CL
tT
Rev. 1.1/Apr.01
tT
-7-
GM72V66841ET/ELT
Relationship Between Frequency and Minimum Latency
-7
Parameter
frequency(MHz)
Symbol
tCK (ns)
-75
-8
-7K
-7J
143 100 133 100 125 100 100 100 100
66
Notes
7
10
7.5
10
8
10
10
10
10
15
l RCD
3
2
3
2
3
2
2
2
2
2
1
l RC
9
7
9
7
9
7
7
7
7
6
= [l RAS
+ lRP ], 1
l RAS
6
5
6
5
6
5
5
5
5
4
1
l RP
3
2
3
2
3
2
2
2
2
2
1
l RWL
1
1
1
1
1
1
1
1
1
1
1
l RRD
2
2
2
2
2
2
2
2
2
2
1
l SREX
1
1
1
1
1
2
1
1
1
2
l APW
4
3
4
3
4
3
3
3
3
3
= [l RWL
+ lRP ], 1
l SEC
9
7
9
7
9
7
7
7
7
6
= [l RC ]
l HZP
l HZP
-
2
-
2
-
2
2
2
-
2
3
3
3
3
3
3
3
3
3
3
l APR
1
1
1
1
1
1
1
1
1
1
l EP
l EP
-
-1
-
-1
-
-1
-1
-1
-
-1
-2
-2
-2
-2
-2
-2
-2
-2
-2
-2
l CCD
1
1
1
1
1
1
1
1
1
1
l WCD
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
2
2
2
2
2
2
2
2
2
2
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
CS to command disable
l DID
l DOD
l CLE
l RSA
l CDD
0
0
0
0
0
0
0
0
0
0
Power down exit to command
input
l PEC
1
1
1
1
1
1
1
1
1
1
Active command to column
command (same bank)
Active command to active
command (same bank)
Active command to Precharge
command (same bank)
Precharge command to active
command (same bank)
Write recovery or last data-in to
Precharge command (same bank)
Active command to active
command (different bank)
Self refresh exit time
Last data in to active command
(Auto Precharge, same bank)
Self refresh exit to command
input
Precharge
(CL=2)
command to
(CL=3)
high impedance
Last data out to active
command
(auto Precharge) (same bank)
Last data out to
(CL=2)
Precharge
(CL=3)
(early Precharge)
Column command to column
command
Write command to data in
latency
DQM to data in
DQM to data out
CKE to CLK disable
Register set to active command
Rev. 1.1/Apr.01
-8-
GM72V66841ET/ELT
Relationship Between Frequency and Minimum Latency
Parameter
-7
-8
- 7K
- 7J
Symbol 143 100 133 100 125 100 100 100 100
frequency(MHz)
tCK (ns)
Burst stop to
output valid
data hold
Burst stop to
output high
impedance
-75
(CL=2)
(CL=3)
(CL=2)
(CL=3)
Burst stop to write data ignore
l BSR
l BSR
l BSH
l BSH
l BSW
66
7
10
7.5
10
8
10
10
10
10
15
-
1
-
1
-
1
1
1
-
1
2
2
2
2
2
2
2
2
2
2
-
2
-
2
-
2
2
2
-
2
3
3
3
3
3
3
3
3
3
3
0
0
0
0
0
0
0
0
0
0
Notes
Notes : 1. l RCD to l RRD are recommended value.
Rev. 1.1/Apr.01
-9-
GM72V66841ET/ELT
Package Dimensions
GM72V66841ET/ELT Series (TTP-54D)
Unit: (mm)
Preliminary
22.22
22.72 Max
28
10.16
54
1
0.80
27
+0.10
- 0.05
0.30
0.28 +/- 0.05
0.13 M
0.80
11.76 +/- 0.20
0.91 MAX
Dimension including the plating thickness
Base material dimension
Rev. 1.1/Apr.01
0.50 +/- 0.10
Hitachi Code
TTP-54D
JEDEC Code
-
EIAJ Code
-
Weight(reference value)
0.53g
0.68
0.13 +/- 0.05
0.125 +/- 0.04
0.10
0.145 +/- 0.05
1.20 MAX
0 ~。
5
-10-
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