Sharp GP2S27CJ000F Smt, detecting distance : 0.7mm phototransistor output, compact refl ective photointerrupter Datasheet

GP2S27J0000F Series
GP2S27J0000F
Series
SMT, Detecting Distance : 0.7mm
Phototransistor Output,
Compact Reflective
Photointerrupter
■ Description
■ Agency approvals/Compliance
GP2S27J0000F Series is a compact-package, phototransistor output, reflective photointerrupter, with emitter
and detector facing the same direction in a molding that
provides non-contact sensing. The compact package
series is a result of unique technology, combing transfer
and injection molding, that also blocks visible light to
minimize false detection.
This photointerrupter can be ordered in different CTR
ranks, and comes in a surface-mount, gullwing lead
package, suitable for reflow soldering.
1. Compliant with RoHS directive
■ Applications
1. Detection of object presence or motion.
2. Example : printer, optical storage
■ Features
1. Reflective with Phototransistor Output
2. Highlights :
• Compact Size
• Surface Mount Type (SMT), reflow soldering, with
gullwing leads
• Optional Tape and Reel (T&R) 1 000 pcs per reel
3. Key Parameters :
• Optimal Sensing Distance : 0.7mm
• Package : 4×3×1.7mm
• Visible light cut resin to prevent
4. Lead free and RoHS directive compliant
Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
1
Sheet No.: D3-A01901EN
Date Oct. 3. 2005
© SHARP Corporation
GP2S27J0000F Series
■ Internal Connection Diagram
1
2
1
2
3
4
3
Anode
Emitter
Collector
Cathode
4
(0.4) Detector center
■ Outline Dimensions
(Unit : mm)
2
1
3
4
(0.2) Emitter center
C0.7
1.75
+0.2
+0.2
1.7
0.15−0.1
+0.2
3−0.1
0.75
4−0.1
(0.4)
0.4
5
MAX.
• Tolerance : ±0.15mm.
• ( ) : Reference dimensions.
• The parallerism in 4 leads are 0.15mm.
• The dimensions shown do not include
burr.
Burr's dimension : 0.15mm MAX.
• The shaded portion has no SnCu plating.
Date code mark
Product mass : approx. 0.03g
Plating material : SnCu (Cu : TYP. 2%)
Sheet No.: D3-A01901EN
2
GP2S27J0000F Series
Date code (Symbol)
January
July
February
August
March
September
April
October
May
November
June
December
Rank mark
There is no rank indicator.
Country of origin
Japan
Sheet No.: D3-A01901EN
3
GP2S27J0000F Series
■ Absolute Maximum Ratings
Parameter
Forward current
Input Reverse voltage
Power dissipation
Collector-emitter voltage
Emitter-collector voltage
Output
Collector current
Collector power dissipation
Total power dissipation
Operating temperature
Storage temperature
∗1
Soldering temperature
Symbol
Rating
IF
50
VR
6
P
75
VCEO
35
VECO
6
20
IC
75
PC
100
Ptot
Topr
−25 to +85
Tstg
−40 to +100
Tsol
260
(Ta=25˚C)
Unit
mA
V
mW
V
V
mA
mW
mW
˚C
˚C
˚C
Soldering area:
The hatched area more than
0.5mm away from the lower
edge of package as shown
in the figure below.
0.5mm
0.5mm
∗
1 For 5s or less
■ Electro-optical Characteristics
Parameter
Forward voltage
Input
Reverse current
Output Collector dark current
∗2
Collector Current
Transfer
Rise time
Response time
characFall time
teristics ∗3
Leak current
∗
∗
Symbol
VF
IR
ICEO
IC
tr
tf
ILEAK
Condition
IF=20mA
VR=6V
VCE=20V
IF=4mA, VCE=2V
VCE=2V, IC=100μA,
RL=1kΩ, d=1mm
IF=4mA, VCE=2V
MIN.
−
−
−
20
−
−
−
TYP.
1.2
−
1
45
20
20
−
(Ta=25˚C)
MAX.
Unit
1.4
V
10
μA
100
nA
120
μA
100
μs
100
100
nA
2 The condition and arrangement of the reflective object are shown below.
The rank splitting of collector current (IC) shall be executed according to the table below.
Rank
Collector current, IC [μA]
(IF=4mA, VCE=2V)
A
20 to 42
Yellow
B
34 to 71
Transparent
C
58 to 120
Green
Package oleeve color
3 Without reflective object.
● Test Condition and Arrangement for Collector Current
Al evaporation
d=1mm glass plate
Sheet No.: D3-A01901EN
4
GP2S27J0000F Series
■ Model Line-up
Package
Model No
∗
Sleeve
50 pcs/sleeve
GP2S27J0000F
GP2S27BJ000F
GP2S27CJ000F
GP2S27ABJ00F
GP2S27BCJ00F
Taping
1 000 pcs/reel
GP2S27TJ000F
GP2S27T2J00F
GP2S27T3J00F
GP2S27T5J00F
GP2S27T6J00F
Rank
A, B or C
B
C
A or B
B or C
Collector current IC[μA]
(IF=4mA, VCE=2V, Ta=25˚C)
20 to 120
34 to 71
58 to 120
20 to 71
34 to 120
The ratio of each rank can not be guaranteed.
Please contact a local SHARP sales representative to see the actial status of the produiction.
Sheet No.: D3-A01901EN
5
GP2S27J0000F Series
Fig.2 Power Dissipation vs.
Ambient Temperature
60
120
50
100
Power dissipation P (mW)
Forward current IF (mA)
Fig.1 Forward Current vs. Ambient
Temperature
40
30
20
Ptot
80
75
P, PC
60
40
20
15
10
0
−25
0
25
50
75 85
0
−25
100
0
25
50
75 85
Ambient temperature Ta (˚C)
Ambient temperature Ta (˚C)
Fig.4 Collector Current vs.
Forward Current
Fig.3 Forward Current vs. Forward
Voltage
100
VCE=2V
Ta=25˚C
600
0˚C
−25˚C
Collector current IC (μA)
Forward current IF (mA)
700
Ta =75˚C
50˚C
25˚C
100
10
500
400
300
200
100
1
0
0.5
1
1.5
2
Forward voltage VF (V)
2.5
0
3
0
Fig.5 Collector Current vs.
Collector-Emitter Voltage
Ta=
25˚C
Collector current IC (μA)
300
120
IF=15mA
250
10mA
200
150
10
15
20
Forward current IF (mA)
25
30
Fig.6 Relative Collector Current vs.
Ambient Temperature
Relative collector current IC (%)
350
5
7mA
100
4mA
50
100
IF=4mA
VCE=2V
80
60
40
20
2mA
0
0
2
4
6
8
10
Collector-emitter voltage VCE (V)
0
−25
12
0
25
50
75
Ambient temperature Ta (˚C)
100
Sheet No.: D3-A01901EN
6
GP2S27J0000F Series
Fig.7 Collector Dark Current vs.
Ambient Temperature
1 000
10 −6
VCE =20V
VCE =2V
IC =100μA
Ta =25˚C
10 −7
10 −8
tf
td
10
ts
1
10 −9
10 −10
0
0.1
0.1
100
25
50
75
Ambient temperature Ta (˚C)
1
Input
Output
Relative collector current (%)
RD
VCC
RL
1 000
100
Fig.10 Relative Collector Current vs.
Distance (Reference value)
100
Reflector
Plate
10
Load resistance RL (kΩ)
Fig.9 Test Circuit for Response Time
Input
tr
100
Response time (μs)
Collector dark current ICEO (A)
Fig.8 Response Time vs. Load
Resistance
10%
Output
90%
td
tr
ts
tf
IF=4mA
VCE=2V
Ta=25˚C
80
60
40
20
0
0
1
2
3
4
5
Distance between sensor and Al evaporation glass d (mm)
Fig.11 Detecting Position Characteristics (1)
Fig.12 Detecting Position Characteristics (2)
100
IF=4mA
VCE=2V
d=1mm
Ta=25˚C
80
Relative collector current (%)
Relative collector current (%)
100
60
40
20
0
−2
−1
0
2
4
1
3
5
Card moving distance L (mm)
6
80
60
40
20
0
−3
7
IF=4mA
VCE=2V
d=1mm
Ta=25˚C
−2
−1
1
3
0
2
4
Card moving distance L (mm)
5
6
Sheet No.: D3-A01901EN
7
GP2S27J0000F Series
Fig.13 Test Condition for Distance &
Detecting Position Characteristics
Fig.14 Freauency Response
5
Al evaporated glass
Correspond to Fig.10
d
Correspond to Fig.12
Test condition
IF = 4mA
VCE = 2V
d = 1mm
Test condition
IF = 4mA
VCE = 2V
d = 1mm
OMS card
OMS card
Black
d
1mm
−
L=0
White
Black
d
+
Voltage gain AV (dB)
0
Correspond to Fig.11
White
L=0
−5
1kΩ
RL =10kΩ
−10
−15
1mm
−
VCE =2V
IC =100μA
Ta =25˚C
−20
102
103
104
Frequency f (Hz)
105
106
+
Fig.15 Spectral Sensitivity (Detecting Side)
100
Ta =25˚C
Relative sensitivity (%)
80
60
40
20
0
600
700
800
900
1 000
Wavelength λ (nm)
1 100
1 200
Remarks : Please be aware that all data in the graph are just for reference and not for guarantee.
Sheet No.: D3-A01901EN
8
GP2S27J0000F Series
■ Design Considerations
● Design guide
1) Prevention of detection error
To prevent photointerrupter from faulty operation caused by external light, do not set the detecting face to
the external light.
2) Distance characteristic
Please refer to Fig.10 (Relative collector current vs. Distance) to set the distance of the photointerrupter
and the object.
This product is not designed against irradiation and incorporates non-coherent IRED.
● Degradation
In general, the emission of the IRED used in photointerrupter will degrade over time.
In the case of long term operation, please take the general IRED degradation (50% degradation over 5
years) into the design consideration.
● Parts
This product is assembled using the below parts.
• Photodetector (qty. : 1)
Category
Material
Maximum Sensitivity
wavelength (nm)
Sensitivity
wavelength (nm)
Response time (μs)
Phototransister
Silicon (Si)
930
700 to 1 200
20
• Photo emitter (qty. : 1)
Category
Material
Maximum light emitting
wavelength (nm)
I/O Frequency (MHz)
Infrared emitting diode
(non-coherent)
Gallium arsenide (GaAs)
950
0.3
• Material
Case
Lead frame
Lead frame plating
Black polyphenylene
sulfide resin
42Alloy
SnCu plating
Sheet No.: D3-A01901EN
9
GP2S27J0000F Series
■ Manufacturing Guidelines
● Storage and management after open
Storage condition
Storage temp.: 5 to 30˚C, Storage humidity : 70%RH or less at regular packaging.
Treatment after opening the moisture-proof package
After opening, you should mount the products while keeping them on the condition of 5 to 25˚C and 70%RH
or less in humidity within 4 days.
After opening the bag once even if the prolonged storage is necessary, you should mount the products within
two weeks.
And when you store the rest of products you should put into a DRY BOX. Otherwise after the rest of products
and silicagel are sealed up again, you should keep them under the condition of 5 to 30˚C and 70%RH or
less in humidity.
Baking before mounting
When the above-mentioned storage method could not be executed, please process the baking treatment
before mounting the products.
However the baking treatment is permitted within one time.
Recommended condition : 125˚C, 16 to 24 hours
∗Do not process the baking treatment with the product wrapped. When the baking treatment processing, you
should move the products to a metallic tray or fix temporarily the products to substrate.
● Soldering Method
Reflow Soldering:
Reflow soldering should follow the temperature profile shown below.
Soldering should not exceed the curve of temperature profile and time.
Please solder within one time.
MAX
240˚C
1 to 4˚C/s
200˚C
MAX
160˚C
1 to 4˚C/s
1 to 4˚C/s
25˚C
MAX10s
MAX120s
MAX60s
MAX90s
Sheet No.: D3-A01901EN
10
GP2S27J0000F Series
Other notice
Please test the soldering method in actual condition and make sure the soldering works fine, since the
impact on the junction between the device and PCB varies depending on the cooling and soldering
conditions.
Lead pin
Lead terminals of this product are tin copper alloy plated. Before usage, please evaluate solderability with
actual conditions and confirm. And the uniformity in color for the lead terminals are not specified.
● Cleaning instructions
Solvent cleaning :
Solvent temperature should be 45˚C or below. Immersion time should be 3 minutes or less.
Ultrasonic cleaning :
Do not execute ultrasonic cleaning.
Recommended solvent materials :
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol.
● Presence of ODC
This product shall not contain the following materials.
And they are not used in the production process for this product.
Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)
Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.
This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC).
•Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated
diphenyl ethers (PBDE).
Sheet No.: D3-A01901EN
11
GP2S27J0000F Series
■ Package specification
● Sleeve package
Package materials
Sleeve : Polystyrene
Stopper : Styrene-Butadiene
Aluminum laminated bag : Nylone, Polyethylene, Aluminum
Package method
MAX. 50 pcs. of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and tabless
stoppers.
MAX. 40 sleeves in one case.
Color of sleeve
Rank classification is distinguished by the color of the sleeve as shown in the table below.
But the ratio of each rank can not be guaranteed.
Rank
A
B
C
Color of sleeve
Yellow
Transparent
Green
● Tape and Reel package
Package materials
Carrier tape : A-PET (with anti-static material)
Cover tape : PET (three layer system)
Reel : PS
Package method
1 000 pcs of products shall be packaged in a reel. One reel with silicagel is encased in aluminum laminated
bag. After sealing up the bag, it encased in one case (5 bags/case).
Sheet No.: D3-A01901EN
12
GP2S27J0000F Series
Carrier tape structure and Dimensions
G
F
E
K
J
D
H
I
5˚
X.
MA
I
B
A
C
M
Dimensions List
A
B
12±0.3
7.6+0.3
−0
H
I
φ1.5+0.1
4.4±0.1
−0
C
5.5±0.05
J
0.3±0.05
D
1.75±0.1
K
2±0.1
E
8±0.1
L
5.2±0.1
(Unit : mm)
F
G
2±0.05
4±0.1
M
φ1.6+0.1
−0
Reel structure and Dimensions
e
d
c
g
Dimensions List
a
b
180
13±0.8
e
f
±0.8
21
15.4±1
f
a
b
(Unit : mm)
d
c
±0.2
13
60+0.5
−0
g
2+0.3
−0
Direction of product insertion
Pull-out direction
[Packing : 1 000pcs/reel]
Storage method
Storage conditions should follow the condition shown below.
Storage temperature : 5 to 30˚C
Storage hunidity : 70%RH or less
Sheet No.: D3-A01901EN
13
GP2S27J0000F Series
■ Important Notices
· The circuit application examples in this publication
are provided to explain representative applications of
SHARP devices and are not intended to guarantee any
circuit design or license any intellectual property rights.
SHARP takes no responsibility for any problems related
to any intellectual property right of a third party resulting
from the use of SHARP's devices.
with equipment that requires higher reliability such as:
--- Transportation control and safety equipment (i.e.,
aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii) SHARP devices shall not be used for or in
connection with equipment that requires an extremely
high level of reliability and safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g.,
scuba).
· Contact SHARP in order to obtain the latest device
specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the
specifications, characteristics, data, materials, structure,
and other contents described herein at any time
without notice in order to improve design or reliability.
Manufacturing locations are also subject to change
without notice.
· If the SHARP devices listed in this publication fall
within the scope of strategic products described in the
Foreign Exchange and Foreign Trade Law of Japan, it
is necessary to obtain approval to export such SHARP
devices.
· Observe the following points when using any devices
in this publication. SHARP takes no responsibility for
damage caused by improper use of the devices which
does not meet the conditions and absolute maximum
ratings to be used specified in the relevant specification
sheet nor meet the following conditions:
(i) The devices in this publication are designed for use
in general electronic equipment designs such as:
--- Personal computers
--- Office automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
(ii) Measures such as fail-safe function and redundant
design should be taken to ensure reliability and safety
when SHARP devices are used for or in connection
· This publication is the proprietary product of SHARP
and is copyrighted, with all rights reserved. Under
the copyright laws, no part of this publication may be
reproduced or transmitted in any form or by any means,
electronic or mechanical, for any purpose, in whole or in
part, without the express written permission of SHARP.
Express written permission is also required before any
use of this publication may be made by a third party.
· Contact and consult with a SHARP representative
if there are any questions about the contents of this
publication.
[H144]
Sheet No.: D3-A01901EN
14
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