Fairchild H11G2300W High voltage photodarlington optocoupler Datasheet

HIGH VOLTAGE
PHOTODARLINGTON OPTOCOUPLERS
H11G1
H11G2
H11G3
DESCRIPTION
The H11GX series are photodarlington-type optically coupled optocouplers. These devices have a
gallium arsenide infrared emitting diode coupled with a silicon darlington connected phototransistor
which has an integral base-emitter resistor to optimize elevated temperature characteristics.
FEATURES
• High BVCEO
- Minimum 100 V for H11G1
- Minimum 80 V for H11G2
- Minimum 55 V for H11G3
• High sensitivity to low input current
Minimum 500 percent CTR at IF = 1 mA
• Low leakage current at elevated temperature
(maximum 100 µA at 80°C)
• Underwriters Laboratory (UL) recognized File# E90700
APPLICATIONS
•
•
•
•
•
CMOS logic interface
Telephone ring detector
Low input TTL interface
Power supply isolation
Replace pulse transformer
ANODE 1
CATHODE 2
N/C 3
6 BASE
5 COLLECTOR
4 EMITTER
NOTE
All dimensions are in inches (millimeters)
ABSOLUTE MAXIMUM RATINGS
Parameter
TOTAL DEVICE
Storage Temperature
Operating Temperature
Lead Solder Temperature
Total Device Power Dissipation @ TA = 25°C
Derate above 25°C
Input-Output Isolation Voltage
EMITTER
Forward Input Current
Reverse Input Voltage
Forward Current - Peak (1µs pulse, 300pps)
LED Power Dissipation @ TA = 25°C
Derate above 25°C
DETECTOR
Collector-Emitter Voltage
H11G1
H11G2
H11G3
Detector Power Dissipation @ TA = 25°C
Derate above 25°C
Symbol
Value
Units
TSTG
-55 to +150
°C
TOPR
TSOL
VISO
-55 to +100
260 for 10 sec
260
3.5
5300
°C
°C
mW
mW/°C
Vac(rms)
IF
60
mA
VR
IF(pk)
6.0
3.0
100
1.8
V
A
mW
mW/°C
100
80
55
200
2.67
V
PD
PD
VCEO
PD
mW
mW/°C
7/21/00
200045A
HIGH VOLTAGE
PHOTODARLINGTON OPTOCOUPLERS
H11G1, H11G2, H11G3
ELECTRICAL CHARACTERISTICS
(TA = 25°C Unless otherwise specified.)
INDIVIDUAL COMPONENT CHARACTERISTICS
Characteristic
Test Conditions
EMITTER
(IF = 10 mA)
Forward Voltage
Symbol
Device
VF
Forward Voltage Temp.
VF
Coefficient
TA
Reverse Breakdown Voltage
Junction Capacitance
(IR = 10 µA)
(VF = 0 V, f = 1 MHz)
(VF = 1 V, f = 1 MHz)
Reverse Leakage Current
(VR = 3.0 V)
BVR
CJ
IR
DETECTOR
Breakdown Voltage
(IC = 1.0 mA, IF = 0)
BVCEO
Collector to Emitter
Collector to Base
(IC = 100 µA)
Emitter to Base
BVCBO
BVEBO
(VCE = 80 V, IF = 0)
Collector to Emitter
(VCE = 30 V, IF = 0)
Max
Unit
ALL
1.3
1.50
V
ALL
-1.8
3.0
ALL
25
V
50
pF
ALL
65
ALL
0.001
H11G1
100
H11G2
80
H11G3
55
H11G1
100
H11G2
80
H11G3
55
ALL
7
mV/°C
pF
10
µA
V
10
H11G1
(VCE = 60 V, IF = 0)
Leakage Current
Typ**
ALL
Min
H11G2
ICEO
100
nA
100
µA
Max
Unit
H11G3
(VCE = 80 V, IF = 0, TA = 80°C)
H11G1
(VCE = 60 V, IF = 0, TA = 80°C)
H11G2
TRANSFER CHARACTERISTICS
DC Characteristic
Test Conditions
Symbol
Device
Min
Typ**
EMITTER
Current Transfer Ratio
(IF = 10 mA, VCE = 1 V)
H11G1/2 100 (1000)
CTR
Collector to Emitter
(IF = 1 mA, VCE = 5 V)
Saturation Voltage
mA (%)
H11G1/2
5 (500)
H11G3
2 (200)
(IF = 16 mA, IC = 50 mA)
H11G1/2
0.85
1.0
(IF = 1 mA, IC = 1 mA)
VCE (SAT) H11G1/2
0.75
1.0
0.85
1.2
Typ**
Max
(IF = 20 mA, IC = 50 mA)
H11G3
V
TRANSFER CHARACTERISTICS
Characteristic
Test Conditions
Symbol
Device
(RL = 100 1, IF = 10 mA)
ton
ALL
5
(VCE = 5 V) Pulse Width 6300 µs, f 630 Hz)
toff
ALL
100
SWITCHING TIMES
Turn-on Time
Turn-off Time
Min
Unit
µs
** All typical values at TA = 25°C
7/21/00
200045A
HIGH VOLTAGE
PHOTODARLINGTON OPTOCOUPLERS
H11G1, H11G2, H11G3
Fig. 2 Normalized Output Current vs. Temperature
Fig. 1 Output Current vs. Input Current
100
1
Normalized to:
VCE = 5 V
IF = 1 mA
0.1
0.01
0.001
0.1
1
IC - NORMALIZED OUTPUT CURRENT
IC - NORMALIZED OUTPUT CURRENT
10
IF = 50 mA
10
IF = 5 mA
IF = 1 mA
1
IF = 0.5 mA
0.1
0.01
-60
10
-40
Fig. 3 Output Current vs. Collector - Emitter Voltage
0
20
40
60
80
100
120
90
100
Fig. 4 Collector-Emitter Dark Current
vs. Ambient Temperature
1000
100
Normalized to:
VCE = 5 V
IF = 1 mA
TA = 25˚C
ICEO - DARK CURRENT (nA)
IF = 50 mA
IF = 10 mA
IF = 2 mA
IF = 1 mA
1
IF = 0.5 mA
0.1
VCE = 80V
100
VCE = 30V
10
VCE = 10V
1
0.1
0.01
0.01
1
0
10
10
20
30
40
50
60
70
80
TA - AMBIENT TEMPERATURE (˚C)
VCE - COLLECTOR - EMITTER VOLTAGE (V)
Fig. 5 Input Current
vs. Total Switching Speed (Typical Values)
10
IF - FORWARD CURRENT (mA)
IC - NORMALIZED OUTPUT CURRENT
-20
TA - AMBIENT TEMPERATURE (˚C)
IF - LED INPUT CURRENT(mA)
10
Normalized to:
VCE = 5 V
IF = 1 mA
TA = 25˚C
RL = 10 Ω
RL = 100 Ω
RL = 1k Ω
1
Normalized to:
VCC = 5 V
IF = 10 mA
RL = 100 Ω
0.1
0.1
1
10
ton + toff - TOTAL SWITCHING SPEED (NORMALIZED)
7/21/00
200045A
HIGH VOLTAGE
PHOTODARLINGTON OPTOCOUPLERS
H11G1, H11G2, H11G3
Package Dimensions (Through Hole)
3
2
1
Package Dimensions (Surface Mount)
0.350 (8.89)
0.330 (8.38)
PIN 1
ID.
3
2
PIN 1
ID.
1
0.270 (6.86)
0.240 (6.10)
0.270 (6.86)
0.240 (6.10)
SEATING PLANE
4
5
6
0.350 (8.89)
0.330 (8.38)
4
5
0.070 (1.78)
0.045 (1.14)
6
0.300 (7.62)
TYP
0.070 (1.78)
0.045 (1.14)
0.200 (5.08)
0.135 (3.43)
0.200 (5.08)
0.165 (4.18)
0.016 (0.41)
0.008 (0.20)
0.020 (0.51)
MIN
0.154 (3.90)
0.100 (2.54)
0.016 (0.40)
0.008 (0.20)
0.022 (0.56)
0.016 (0.41)
0° to 15°
0.100 (2.54)
TYP
0.300 (7.62)
TYP
0.100 (2.54)
TYP
2
1
Recommended Pad Layout for
Surface Mount Leadform
PIN 1
ID.
5
0.070 (1.78)
0.060 (1.52)
6
SEATING PLANE
0.350 (8.89)
0.330 (8.38)
0.415 (10.54)
0.070 (1.78)
0.045 (1.14)
0.200 (5.08)
0.135 (3.43)
0.315 (8.00)
MIN
0.405 (10.30)
MAX
0.270 (6.86)
0.240 (6.10)
4
0.016 (0.40) MIN
Lead Coplanarity : 0.004 (0.10) MAX
Package Dimensions (0.4”Lead Spacing)
3
0.020 (0.51)
MIN
0.022 (0.56)
0.016 (0.41)
0.100 (2.54)
0.295 (7.49)
0.030 (0.76)
0.004 (0.10)
MIN
0.154 (3.90)
0.100 (2.54)
0.016 (0.40)
0.008 (0.20)
0° to 15°
0.022 (0.56)
0.016 (0.41)
0.100 (2.54) TYP
0.400 (10.16)
TYP
NOTE
All dimensions are in inches (millimeters)
7/21/00
200045A
HIGH VOLTAGE
PHOTODARLINGTON OPTOCOUPLERS
H11G1, H11G2, H11G3
ORDERING INFORMATION
Order Entry Identifier
Option
S
.S
Description
Surface Mount Lead Bend
SD
.SD
Surface Mount; Tape and reel
W
.W
0.4” Lead Spacing
300
.300
VDE 0884
300W
.300W
VDE 0884, 0.4” Lead Spacing
3S
.3S
VDE 0884, Surface Mount
3SD
.3SD
VDE 0884, Surface Mount, Tape & Reel
QT Carrier Tape Specifications (“D” Taping Orientation)
12.0 ± 0.1
4.85 ± 0.20
4.0 ± 0.1
0.30 ± 0.05
4.0 ± 0.1
Ø1.55 ± 0.05
1.75 ± 0.10
7.5 ± 0.1
16.0 ± 0.3
13.2 ± 0.2
9.55 ± 0.20
0.1 MAX
10.30 ± 0.20
Ø1.6 ± 0.1
User Direction of Feed
NOTE
All dimensions are in millimeters
7/21/00
200045A
MARKING INFORMATION
1
H11G1
2
V XX YY K
6
3
5
4
Definitions
1
Fairchild logo
2
Device number
3
VDE mark (Note: Only appears on parts ordered with VDE
option – See order entry table)
4
Two digit year code, e.g., ‘03’
5
Two digit work week ranging from ‘01’ to ‘53’
6
Assembly package code
Reflow Profile (Black Package, No Suffix)
Temperature (°C)
300
215°C, 10–30 s
250
225 C peak
200
150
Time above 183°C, 60–150 sec
100
50
Ramp up = 3C/sec
0
0
0.5
1
1.5
2
2.5
Time (Minute)
3
3.5
4
4.5
• Peak reflow temperature: 225°C (package surface temperature)
• Time of temperature higher than 183°C for 60–150 seconds
• One time soldering reflow is recommended
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DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY
PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY
ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT
CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
2. A critical component is any component of a life
1. Life support devices or systems are devices or
support device or system whose failure to perform can
systems which, (a) are intended for surgical implant into
be reasonably expected to cause the failure of the life
the body, or (b) support or sustain life, or (c) whose
support device or system, or to affect its safety or
failure to perform when properly used in accordance
with instructions for use provided in the labeling, can be
effectiveness.
reasonably expected to result in significant injury to the
user.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification
Product Status
Definition
Advance Information
Formative or
In Design
This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
Preliminary
First Production
This datasheet contains preliminary data, and
supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.
No Identification Needed
Full Production
This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.
Obsolete
Not In Production
This datasheet contains specifications on a product
that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.
Rev. I13
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