Fairchild H11N3-M 6-pin dip high speed logic optocoupler Datasheet

6-PIN DIP
HIGH SPEED LOGIC OPTOCOUPLERS
H11N1-M
H11N2-M
H11N3-M
PACKAGE
SCHEMATIC
6 VCC
ANODE 1
6
6
CATHODE 2
5 GND
1
1
4 VO
3
6
1
DESCRIPTION
Truth Table
The H11NX-M series has a high speed integrated circuit detector optically
coupled to an AlGaAs infrared emitting diode. The output incorporates a
Schmitt trigger, which provides hysteresis for noise immunity and pulse s
haping. The detector circuit is optimized for simplicity of operation and utilizes
an open collector output for maximum application flexibility.
Input
Output
H
L
L
H
FEATURES
•
•
•
•
•
•
•
•
•
•
High data rate, 5 MHz typical (NRZ)
Free from latch up and oscilliation throughout voltage and temperature ranges.
Microprocessor compatible drive
Logic compatible output sinks 16 mA at 0.5 V maximum
Guaranteed on/off threshold hysteresis
Wide supply voltage capability, compatible with all popular logic systems
High common mode transient immunity, 2000 V/µs minimum
Fast switching t r = 7.5ns typical, t f = 12ns typical
Underwriter Laboratory (UL) recognized—file #E90700
VDE recognized – File#102497 – Add option V (e.g., H11N1VM)
APPLICATIONS
•
•
•
•
•
•
Logic to logic isolator
Programmable current level sensor
Line receiver—eliminate noise and transient problems
A.C. to TTL conversion—square wave shaping
Interfaces computers with peripherals
Isolated power MOS driver for power supplies
© 2003 Fairchild Semiconductor Corporation
Page 1 of 9
4/14/03
6-PIN DIP
HIGH SPEED LOGIC OPTOCOUPLERS
H11N1-M
H11N2-M
H11N3-M
ABSOLUTE MAXIMUM RATINGS
Parameters
Symbol
Device
Value
Units
Storage Temperature
TSTG
All
-55 to +150
°C
Operating Temperature
TOPR
All
-40 to +85
°C
Lead Solder Temperature
TSOL
All
260 for 10 sec
°C
PD
All
Continuous Forward Current
IF
Reverse Voltage
TOTAL DEVICE
Total Device Power Dissipation @ 25°C
250
mW
2.94
mW/°C
All
30
mA
VR
All
6
V
IF(pk)
All
1.0
A
PD
All
120
mW
1.41
mW/°C
PD
All
V45 Allowed Range
VO
V65 Allowed Range
Derate Above 25°C
EMITTER
Forward Current - Peak (1 µs pulse, 300 pps)
LED Power Dissipation 25°C Ambient
Derate Linearly From 25°C
DETECTOR
150
mW
1.76
mW/°C
All
0 to 16
V
VCC
All
0 to 16
V
IO
All
50
mA
Detector Power Dissipation @ 25°C
Derate Linearly from 25°C
I4 Output Current
ELECTRICAL CHARACTERISTICS (TA = 0-70°C Unless otherwise specified.)
INDIVIDUAL COMPONENT CHARACTERISTICS
Parameters
Test Conditions
Symbol
Device
VF
All
Min
Typ*
Max
1.4
2
Units
EMITTER
Input Forward Voltage
IF = 10 mA
IF = 0.3 mA
0.75
1.25
V
Reverse Current
VR = 5 V
IR
All
10
µA
Capacitance
V = 0, f = 1.0 MHz
CJ
All
100
pF
VCC
All
15
V
ICC(off)
All
10
mA
IOH
All
100
µA
DETECTOR
Operating Voltage Range
Supply Current
IF = 0, VCC = 5V
Output Current, High
IF = 0.3mA, VCC = VO = 15V
4
6
*Typical values at TA = 25°C
© 2003 Fairchild Semiconductor Corporation
Page 2 of 9
4/14/03
6-PIN DIP
HIGH SPEED LOGIC OPTOCOUPLERS
H11N1-M
H11N2-M
H11N3-M
TRANSFER CHARACTERISTICS
DC Characteristics
Test Conditions
Symbol
Device
ICC(on)
All
All
Supply Current
IF = 10mA, VCC = 5V
Output Voltage, low
RL=270Ω,VCC=5V, IF=IF(on) max.
VOL
Turn-On Threshold Current
RL=270Ω, VCC = 5V
note 1
IF(on)
Min
Units
6.5
10
mA
0.5
V
0.8
3.2
H11N2-M
2.3
5
H11N3-M
4.1
10
RL=270Ω, VCC = 5V
IF(off)
All
0.3
Hysteresis Ratio
RL=270Ω, VCC = 5V
IF(off)/IF(on)
All
0.65
Symbol
Device
Min
Test Conditions
Max
H11N1-M
Turn-Off Threshold Current
AC Characteristics
Typ*
mA
mA
0.95
Typ
Max
Units
330
ns
SWITCHING SPEED
Propagation delay time
High to Low
C=120pF, tP=1µs, RE: Note 2
Fig. 1
tPHL
All
100
Rise Time
C=120pF, tP=1µs, RE: Note 2
Fig. 1
tr
All
7.5
Propagation delay time
Low to High
C=120pF, tP=1µs, RE: Note 2
Fig. 1
tPLH
All
150
Fall time
C=120pF, tP=1µs, RE: Note 2
Fig. 1
tf
All
12
ns
All
5
MHz
Data Rate
ns
330
ns
ISOLATION CHARACTERISTICS
Parameters
Test Conditions
Symbol
Min
7500
Input-Output Isolation Voltage
f = 60 Hz, t =1 sec.
VISO
Isolation Capacitance
VI-O = 0V, f = 1 MHz
CISO
Isolation Resistance
VI-O = ±500 VDC
RISO
Typ*
Units
VPEAK
0.4
1011
Max
0.6
pF
Ω
*Typical values at TA = 25°C
NOTES:
1. Maximum IF(ON) is the maximum current required to trigger the output. For example, a 3.2mA maximum trigger current would
require the LED to be driven at a current greater than 3.2mA to guarantee the device will turn on. A 10% guard band is
recommended to account for degradation of the LED over its lifetime. The maximum allowable LED drive current is 30mA.
2. H11N1: RE = 910Ω
H11N2: RE = 560Ω
H11N3: RE = 240Ω
© 2003 Fairchild Semiconductor Corporation
Page 3 of 9
4/14/03
6-PIN DIP
HIGH SPEED LOGIC OPTOCOUPLERS
H11N1-M
H11N2-M
C
I6
6
RL
270Ω
4
VIN
tr = tf ≤ 0.01µS
Z = 50Ω
50%
0
1 H11N1-M
RE
VIN 5V
5V
IF
H11N3-M
5
2
VO
toff
ton
0.1µF
10%
VO
90%
tf
tr
Figure 1. Switching Test Circuit and Waveforms
Figure 2. Transfer Characteristics
Figure 3. Threshold Current vs. Supply Voltage
1.4
VOH
5
VO - OUTPUT VOLTAGE (V)
IF - NORMALIZED THRESHOLD CURRENT
6
VCC = 5V
RL = 270Ω
TA = 25°C
4
3
IF(OFF)
IF(ON)
2
Hysteresis area
shaded for illustration
1
VOL
1
2
1.0
0.8
TURN OFF THRESHOLD
0.6
0.4
NORMALIZED TO::
TURN ON THRESHOLD AT
VCC = 5V, TA = 25°C
0.2
0.0
0
0
TURN ON THRESHOLD
D
1.2
3
0
4
2
4
6
8
10
12
14
16
VCC - SUPPLY VOLTAGE (V)
IF - INPUT CURRENT (mA)
Figure 4. Threshold Current vs. Temperature
Figure 5. Load Current vs. Output Voltage
100
1.0
IF(On)
IO - LOAD CURRENT (mA)
NORMALIZED THRESHOLD
CURRENT IF(On), IF(Off)
1.2
IF(Off)
0.8
0.6
0.4
NORMALIZED TO :
VCC = 5V
TA = 25°C
0.2
0.0
0
10
20
30
40
50
60
1
0.0
70
TA - TEMPERATURE (°C)
© 2003 Fairchild Semiconductor Corporation
IF = IF(ON)
VCC = 5V
10
0.2
0.4
0.6
0.8
1.0
VO - OUTPUT VOLTAGE, LOW (V)
Page 4 of 9
4/14/03
6-PIN DIP
HIGH SPEED LOGIC OPTOCOUPLERS
H11N1-M
H11N2-M
H11N3-M
Figure 6. Supply Current vs. Supply Voltage
Figure 7. LED Forward Voltage vs. Forward Current
100
12
IC - SUPPLY CURRENT (mA)
IF - FORWARD CURRENT (mA)
TA = -25°C
10
8
TA = 25°C
6
TA = 85°C
4
TA = 85°C
TA = -25°C
TA = 25°C
10
ON STATE I F = 10mA
2
OFF STATE I F = 0
1
0
2
4
6
8
10
12
14
16
1.2
1.4
1.6
1.8
2.0
VF - FORWARD VOLTAGE (V)
VCC - SUPPLY VOLTAGE (V)
© 2003 Fairchild Semiconductor Corporation
1.0
Page 5 of 9
4/14/03
6-PIN DIP
HIGH SPEED LOGIC OPTOCOUPLERS
H11N1-M
H11N2-M
Package Dimensions (Through Hole)
H11N3-M
Package Dimensions (Surface Mount)
0.350 (8.89)
0.320 (8.13)
0.350 (8.89)
0.320 (8.13)
0.260 (6.60)
0.240 (6.10)
0.070 (1.77)
0.040 (1.02)
0.260 (6.60)
0.240 (6.10)
0.390 (9.90)
0.332 (8.43)
0.070 (1.77)
0.040 (1.02)
0.320 (8.13)
0.014 (0.36)
0.010 (0.25)
0.320 (8.13)
0.014 (0.36)
0.010 (0.25)
0.200 (5.08)
0.115 (2.93)
0.200 (5.08)
0.115 (2.93)
0.100 (2.54)
0.015 (0.38)
0.012 (0.30)
0.008 (0.20)
0.025 (0.63)
0.020 (0.51)
0.020 (0.50)
0.016 (0.41)
0.100 (2.54)
0.100 [2.54]
15°
0.035 (0.88)
0.006 (0.16)
0.020 (0.50)
0.016 (0.41)
0.012 (0.30)
Package Dimensions (0.4” Lead Spacing)
Recommended Pad Layout for
Surface Mount Leadform
0.350 (8.89)
0.320 (8.13)
0.070 (1.78)
0.260 (6.60)
0.240 (6.10)
0.060 (1.52)
0.070 (1.77)
0.040 (1.02)
0.014 (0.36)
0.010 (0.25)
0.425 (10.79)
0.100 (2.54)
0.305 (7.75)
0.200 (5.08)
0.115 (2.93)
0.030 (0.76)
0.100 (2.54)
0.015 (0.38)
0.020 (0.50)
0.016 (0.41)
0.100 [2.54]
0.012 (0.30)
0.008 (0.21)
0.425 (10.80)
0.400 (10.16)
© 2003 Fairchild Semiconductor Corporation
Page 6 of 9
4/14/03
6-PIN DIP
HIGH SPEED LOGIC OPTOCOUPLERS
H11N1-M
H11N2-M
H11N3-M
ORDERING INFORMATION
Option/Order Entry Identifier
Description
S
Surface Mount Lead Bend
SR2
Surface Mount; Tape and reel
T
0.4" Lead Spacing
V
VDE 0884
TV
VDE 0884, 0.4" Lead Spacing
SV
VDE 0884, Surface Mount
SR2V
VDE 0884, Surface Mount, Tape & Reel
MARKING INFORMATION
1
V
3
H11N1
2
X YY Q
6
5
4
Definitions
1
Fairchild logo
2
Device number
3
VDE mark (Note: Only appears on parts ordered with VDE
option – See order entry table)
4
One digit year code, e.g., ‘3’
5
Two digit work week ranging from ‘01’ to ‘53’
6
Assembly package code
*Note – Parts that do not have the ‘V’ option (see definition 3 above) that are marked with
date code ‘325’ or earlier are marked in portrait format.
© 2003 Fairchild Semiconductor Corporation
Page 7 of 9
4/14/03
6-PIN DIP
HIGH SPEED LOGIC OPTOCOUPLERS
H11N1-M
H11N2-M
H11N3-M
Carrier Tape Specifications
12.0 ± 0.1
4.5 ± 0.20
2.0 ± 0.05
4.0 ± 0.1
0.30 ± 0.05
Ø1.5 MIN
1.75 ± 0.10
11.5 ± 1.0
21.0 ± 0.1
9.1 ± 0.20
10.1 ± 0.20
0.1 MAX
24.0 ± 0.3
Ø1.5 ± 0.1/-0
User Direction of Feed
NOTE
All dimensions are in inches (millimeters)
Reflow Profile (White Package, -M Suffix)
Temperature (°C)
300
230°C, 10–30 s
250
245°C peak
200
150
Time above 183°C, 120–180 sec
100
Ramp up = 2–10°C/sec
50
• Peak reflow temperature: 245°C (package surface temperature)
• Time of temperature higher than 183°C for 120–180 seconds
• One time soldering reflow is recommended
0
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
Time (Minute)
© 2003 Fairchild Semiconductor Corporation
Page 8 of 9
4/14/03
6-PIN DIP
HIGH SPEED LOGIC OPTOCOUPLERS
H11N1-M
H11N2-M
H11N3-M
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO
ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME
ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN;
NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES
OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR
CORPORATION. As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the body, or
(b) support or sustain life, and (c) whose failure to perform
when properly used in accordance with instructions for use
provided in the labeling, can be reasonably expected to
result in a significant injury of the user.
© 2003 Fairchild Semiconductor Corporation
2. A critical component in any component of a life support
device or system whose failure to perform can be
reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
Page 9 of 9
4/14/03
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