HI-SINCERITY Spec. No. : IC200407 Issued Date : 2003.04.01 Revised Date : 2005.03.25 Page No. : 1/7 MICROELECTRONICS CORP. H34063AP / H34063AS DC-TO-DC CONVERTER INTEGRATE CIRCUIT DEVICES 8-Lead Plastic DIP-8 Package Code: P Description The H34063A Series is a monolithic control circuit containing the primary functions required for DC-to-DC converters. These devices consist of an internal temperature compensated reference, comparator, controlled duty cycle oscillator with an active current limit circuit, driver and high current output switch. This series was specifically by Hi-Sincerity Microelectronics Corp. • 8-Lead Plastic SO-8 Package Code: S Features • 3V to 40V Input Voltage Operation • Internal 1.6A Peak Current Switch • Internal ±1.8% Reference • Low Quiescent Current at 1.6mA • Frequency Operation from 100Hz~100KHz • Output Voltage Adjustable • Active Current Limiting • Step-Up, Step-Down or Inverting Switching Regulators Pin Connections 8 1 7 2 6 3 5 4 Pin1: Switch Collector (SWC) Pin5: Comparator Inverting Input (FB) Pin2: Switch Emitter (SWE) Pin6: Voltage Supply (Vcc) Pin3: Timing Capacitor (TC) Pin7: Ipk Sense (Ipk) Pin4: Ground (GND) Pin8: Voltage Driver Collector (DRC) Absolute Maxium Rating Parameter Symbol Value Unit Power Supply Voltage VCC 40 V Comparator Input Voltage Range Vir -0.3~+40 V Switch Collector Voltage VC(SW) 40 V Switch Emitter Voltage VSWE 40 V Switch Emitter to Collector Voltage VCE 40 V VC(DR) 40 V Switch Current ISW 1.5 A Power Dissipation at TJ=20oC PD Operating Ambient Temperature Range Topr Driver Collector Voltage Storage Temperature Range Tstg Operating Junction Temperature Topj Thermal Resistance Junction-ambient θJA H34063AP, H34063AS DIP-8 1.25 SO-8 0.625 W 0~+70 o C -65~+150 o C 120 o C 125 o C/W HSMC Product Specification HI-SINCERITY Spec. No. : IC200407 Issued Date : 2003.04.01 Revised Date : 2005.03.25 Page No. : 2/7 MICROELECTRONICS CORP. Electrical Characteristics (VCC=5V,TA=0~70°C, unless otherwise specified) Parameter Symbol Test Condition Min. Typ. Max. Unit 10 25 40 uA 140 190 240 uA 28 33 40 KHz 5.2 6 7.5 250 300 350 mV Oscillator Charging Current VCC=5~40V, Ta=25oC Ichg Discharge Current o Idischg Frequency VCC=5~40V, Ta=25 C o fOSC Discharge to Charge Current Ratio Current Limit Sense Voltage VPIN5=0, CT=1nF, Ta=25 C Idischg/Ichg o VPIN7=VCC, Ta=25 C o VIPK Idischg=Ichg, Ta=25 C Output Switch Saturation Voltage, Darlington Connection Saturation Voltage DC Current Gain VCE(sat) 1 ISW =1A, VC(SW)=VC(DR) - 1 1.3 V VCE(sat) 2 ISW =1A, IC(DR)=50mA - 0.4 0.7 V 35 120 - - 10 100 uA 1.23 1.25 1.27 V VCC=5~40V - 1.5 6 mV IIB VIN=0V - 40 400 nA ICC VCC=5~40V, VPIN7=VCC, VPin5>VFB, CT=0.001uF, Pin7=GND, Remaining pins open - 1.6 3 mA hFE Collector Off-State Current ICC(off) ISW =1A, VCE=5V o VCE=40V, Ta=25 C Comparator Threshold Voltage VFB Threshold Voltage Line Regulation Input Bias Current ∆VFB Total Device Supply Current Block Diagram DRI SC Pin8: Driver Collector Pin1: 1.6A Switch Collector Q Q2 Q1 S R 80Ω IPK SE Pin2: Darlington Switch Emitter IPK CT Pin7: Highside Current Sense Input, VCC-VIPK=300mV Oscillator VCC TC Comparator Pin3: Oscilletor Timing Capacitor 1.25V Reference Voltage GND Pin4: Power GND H34063AP, H34063AS Pin6: Power Supply Input + FB Pin5: Feedback Comparator Inverting Input HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : IC200407 Issued Date : 2003.04.01 Revised Date : 2005.03.25 Page No. : 3/7 Application Information Design Formula Table Calculation Step-Down Step-Up Voltage-Inverting ton/toff (Vout+VF)/(Vin(min) -Vsat-Vout) (Vout+VF-Vin(min))/(Vin(min)-Vsat) (|Vout|+VF)/(Vin(max)-Vsat) (ton+toff) max 1/Fmin 1/Fmin 1/Fmin -5 -5 CT 4*10 ton 4*10 ton 4*10-5ton IC(sw) 2*Iout(max) 2*Iout(max)(ton+toff/toff) 2*Iout(max)(ton+toff/toff) RS 0.3/IC(sw) 0.3/IC(sw) 0.3/IC(sw) L(min) (Vin(min)-Vsat/Ipk(sw))*ton(max) (Vin(min)-Vsat/Ipk(sw))*ton(max) (Vin(min)-Vsat/Ipk(sw))*ton(max) CO (Ipk(sw)*(ton+toff))/(8*Vripple(P-P)) Iout*ton/Vripple(P-P) Iout*ton/Vripple(P-P) Vsat: Saturation voltage of the output switch. VF: Forward voltage drop of the ringback rectifier. The following power supply characteristics must be chosen: Vin: Nominal input voltage. Vout: Desired output voltage. |Vout|=1.25*(1+RB/RA) Iout: Desired output current Fmin: Minimum desired output switching frequency at the selected values for Vin and Iout. Vripple(P-P): Desired peak to peak output ripple voltage in practice, the calculated value will need to be increased due to the capacitor equivalent series resistance and board layout. The ripple voltage should be kept to a low value since it will directly effect the line and load regulation. H34063AP, H34063AS HSMC Product Specification HI-SINCERITY Spec. No. : IC200407 Issued Date : 2003.04.01 Revised Date : 2005.03.25 Page No. : 4/7 MICROELECTRONICS CORP. Application Information (Continuos) Fig.2 Step-Up Converter D1 L1 200uH R1 150Ω H1N5819 H34063A RSC 0.22 Vin C1 100uF 8 1 7 2 6 3 5 4 Vout 28V / 200mA Cout 220uF CT 680pF RB 47kΩ RA 2.2kΩ Line Regulation: 100mV (Vin=8V~16V, @Io=200mA) Load Regulation: 5mV (Vin=12V, @Io=80mA~200mA) Fig.3 Step-Up Converter With External NPN Switch L1 R1 Vout D1 H34063A RSC Vin C1 8 1 7 2 6 3 5 4 Q1 CT Cout R2 RB RA Fig.4 Step-Down Converter L1 200uH H34063A RSC 0.25 Vin 8 1 7 2 6 3 5 4 D1 Vout 5V / 500mA Cout 470uF H1N5819 CT 470pF RB C1 100uF RA 3.6kΩ 1.2kΩ Line Regulation: 40mV (Vin=10V~20V, @Io=500mA) Load Regulation: 5mV (Vin=15V, @Io=10mA~500mA) Short Circuit Current: 1.3A (Vin=15V, @RL=0.1Ω H34063AP, H34063AS HSMC Product Specification HI-SINCERITY Spec. No. : IC200407 Issued Date : 2003.04.01 Revised Date : 2005.03.25 Page No. : 5/7 MICROELECTRONICS CORP. Fig.5 Step-Down Converter With External PNP Saturation Switch R1 H34063A RSC Vin 8 1 7 2 6 3 5 4 R2 Q1 L1 Vout CT D1 Cout RB C1 RA Fig.6 Voltage Inverting Converter D1 H34063A RSC 0.25 Vin 4.5V-6V H1N5819 Vout -12V / 100mA 8 1 7 2 L1 Cout 6 3 100uH 470uF 4 5 C1 CT 680pF RA 100uF 953Ω RB 8.2kΩ Line Regulation: 20mV (Vin=4.5V~6V, @Io=100mA) Load Regulation: 100mV (Vin=5V, @Io=10mA~100mA) Fig.7 Voltage Inverting Converter With External PNP Saturation Switch H34063A RSC Vin 8 1 7 2 6 3 5 4 R2 R1 Q1 L1 D1 CT RA Vout C1 RB H34063AP, H34063AS Cout HSMC Product Specification HI-SINCERITY Spec. No. : IC200407 Issued Date : 2003.04.01 Revised Date : 2005.03.25 Page No. : 6/7 MICROELECTRONICS CORP. DIP-8 Dimension DIM A B C D E F G H I J K L M α1 Marking: 8 6 7 5 Pb Free Mark Pb-Free: " . " (Note) Normal: None A 1 2 3 4 H 3 4 0 6 3 A P Control Code Date Code B J Note: Green label is used for pb-free packing Pin Style: 1.SWC 2.SWE 3.TC 4.GND 5.FB 6.VCC 7.Ipk 8.DRC F E C α1 K G Max. 6.40 9.32 *1.52 *1.27 *0.99 3.35 3.55 0.53 2.79 7.74 *3.00 8.81 0.381 97o *: Typical, Unit: mm M H D I Material: • Lead solder plating: Sn60/Pb40 (Normal), Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free) • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Min. 6.29 9.22 3.25 3.17 0.38 2.28 7.49 8.56 0.229 94o L 8-Lead DIP-8 Plastic Package HSMC Package Code: P SO-8 Dimension A DIM A B C D E F G H I J K L M N O Marking: G Pb Free Mark 8 7 B 6 5 C Pin1 Index 2 3 Pb-Free: " . " (Note) H Normal: None I Pin 1 Index Date Code H Pin Style: 1.SWC 2.SWE 3.TC 4.GND 5.FB 6.VCC 7.Ipk 8.DRC K E Part A Part A Control Code Note: Green label is used for pb-free packing 4 J D S 3 4 0 6 3 A M L N Material: • Lead solder plating: Sn60/Pb40 (Normal), Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free) • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Min. 4.85 3.85 5.80 1.22 0.37 3.74 1.45 4.80 0.05 0.30 0.19 0.37 0.23 0.08 0.00 Max. 5.10 3.95 6.20 1.32 0.47 3.88 1.65 5.10 0.20 0.70 0.25 0.52 0.28 0.13 0.15 *: Typical, Unit: mm O F 8-Lead SO-8 Plastic Surface Mounted Package HSMC Package Code: S Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. • HSMC reserves the right to make changes to its products without notice. • HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory: • Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 • Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931 H34063AP, H34063AS HSMC Product Specification HI-SINCERITY Spec. No. : IC200407 Issued Date : 2003.04.01 Revised Date : 2005.03.25 Page No. : 7/7 MICROELECTRONICS CORP. Soldering Methods for HSMC’s Products 1. Storage environment: Temperature=10oC~35oC Humidity=65%±15% 2. Reflow soldering of surface-mount devices Figure 1: Temperature profile tP Critical Zone TL to TP TP Ramp-up TL tL Temperature Tsmax Tsmin tS Preheat Ramp-down 25 t 25oC to Peak Time Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly <3 C/sec <3oC/sec - Temperature Min (Tsmin) 100oC 150oC - Temperature Max (Tsmax) 150oC 200oC 60~120 sec 60~180 sec <3oC/sec <3oC/sec 183oC 217oC 60~150 sec 60~150 sec 240oC +0/-5oC 260oC +0/-5oC 10~30 sec 20~40 sec <6oC/sec <6oC/sec <6 minutes <8 minutes Peak temperature Dipping time 245 C ±5 C 5sec ±1sec Average ramp-up rate (TL to TP) o Preheat - Time (min to max) (ts) Tsmax to TL - Ramp-up Rate Time maintained above: - Temperature (TL) - Time (tL) Peak Temperature (TP) Time within 5oC of actual Peak Temperature (tP) Ramp-down Rate Time 25oC to Peak Temperature 3. Flow (wave) soldering (solder dipping) Products Pb devices. Pb-Free devices. H34063AP, H34063AS o o o o 260 C +0/-5 C 5sec ±1sec HSMC Product Specification