Renesas HAT2206C-EL-E Silicon n channel mos fet power switching Datasheet

HAT2206C
Silicon N Channel MOS FET
Power Switching
REJ03G1238-0500
Rev.5.00
Jan 26, 2006
Features
• Low on-resistance
RDS (on) = 65 mΩ typ. (at VGS = 4.5 V)
• Low drive current.
• High density mounting
• 1.8 V gate drive devices.
Outline
RENESAS Package code: PWSF0006JA-A
(Package name: CMFPAK-6)
Indexband
6
5
2 3 4 5
DD D D
4
1
2
3
6
G
1. Source
2. Drain
3. Drain
4. Drain
5. Drain
6. Gate
S
1
Absolute Maximum Ratings
(Ta = 25°C)
Item
Symbol
Drain to source voltage
VDSS
Gate to source voltage
VGSS
Drain current
ID
Drain peak current
ID (pulse)Note1
Body - Drain diode reverse drain current
IDR
Channel dissipation
PchNote 2
Channel temperature
Tch
Storage temperature
Tstg
Notes: 1. PW ≤ 10 µs, duty cycle ≤ 1%
2. When using the glass epoxy board. (FR4 40 × 40 × 1.6 mm)
Rev.5.00 Jan 26, 2006 page 1 of 6
Ratings
12
±8
2
8
2
830
150
–55 to +150
Unit
V
V
A
A
A
mW
°C
°C
HAT2206C
Electrical Characteristics
(Ta = 25°C)
Item
Drain to Source breakdown voltage
Gate to Source breakdown voltage
Gate to Source leakage current
Drain to Source leakage current
Gate to Source cutoff voltage
Drain to Source on state resistance
Forward transfer admittance
Input capacitance
Output capacitance
Reverse transfer capacitance
Total gate charge
Gate to Source charge
Gate to Drain charge
Turn - on delay time
Rise time
|yfs|
Ciss
Coss
Crss
Qg
Qgs
Qgd
td(on)
tr
Min
12
±8
—
—
0.3
—
—
—
3.5
—
—
—
—
—
—
—
—
Turn - off delay time
Fall time
Body - Drain diode forward voltage
Notes: 3. Pulse test
td(off)
tf
VDF
—
—
—
Rev.5.00 Jan 26, 2006 page 2 of 6
Symbol
V(BR)DSS
V(BR)GSS
IGSS
IDSS
VGS(th)
RDS(on)
Typ
—
—
—
—
—
65
81
113
5.5
260
46
22
3.5
0.7
0.7
4
7
Max
—
—
±10
1
1.2
85
114
170
—
—
—
—
—
—
—
—
—
Unit
V
V
µA
µA
V
mΩ
mΩ
mΩ
S
pF
pF
pF
nC
nC
nC
ns
ns
43
3
0.8
—
—
1.1
ns
ns
V
Test Conditions
ID = 10 mA, VGS = 0
IG = ±10 µA, VDS = 0
VGS = ±6.4 V, VDS = 0
VDS = 10 V, VGS = 0
VDS = 10 V, ID = 1mA
ID = 1 A, VGS = 4.5 V Note3
ID = 1 A, VGS = 2.5 V Note3
ID = 1 A, VGS = 1.8 V Note3
ID = 1 A, VGS = 10 V Note3
VGS = 0, f = 1 MHz,
VDS = 10 V
VGS = 4.5 V, VDS = 10 V,
ID =2 A
VGS = 4.5V, ID = 1 A,
VDD = 10 V, RL = 10 Ω,
Rg = 4.7 Ω
IF =2 A, VGS = 0 Note3
HAT2206C
Main Characteristics
Maximum Safe Operation Area
Power vs. Temperature Derating
100
Test Condition :
When using the glass epoxy board
(FR4 40 x 40 x 1.6 mm), Ta = 25°C
1.2
3
1
s
m
n
Operation in this area
is limited by RDS(on)
0.1
s
m
io
at
er
0.3
10
1
0.03
0
50
100
150
Ambient Temperature
0.01 0.03 0.1 0.3
200
3
10 30 100
Typical Transfer Characteristics
10
10
2.5 V
4.5 V
2.2 V
2.0 V
10 V
6
1.8 V
4
1.5 V
2
1.3 V
Tc = 75°C
VDS = 10 V
Pulse Test
Pulse Test
Drain Current ID (A)
8
1
Drain to Source Voltage VDS (V)
Ta (°C)
Typical Output Characteristics
Drain Current ID (A)
100 µs
op
0.4
10 µs
10
=
0.8
Ta = 25°C,1shot pulse
When using the FR4 board.
PW
Drain Current ID (A)
30
DC
Channel Dissipation
Pch (W)
1.6
25°C
8
–25°C
6
4
2
VGS = 1.0 V
2
4
6
8
0
10
1
2
3
4
5
Drain to Source Voltage VDS (V)
Gate to Source Voltage VGS (V)
Drain to Source Saturation Voltage vs.
Gate to Source Voltage
Static Drain to Source on State Resistance
vs. Drain Current
400
Pulse Test
300
200
ID = 2.0 A
100
1.0 A
0.5 A
0
2
4
6
8
10
Gate to Source Voltage VGS (V)
Rev.5.00 Jan 26, 2006 page 3 of 6
Drain to Source On State Resistance
RDS(on) (mΩ)
Drain to Source Voltage VDS(on) (mV)
0
1000
Pulse Test
1.8 V
2.5 V
100
VGS = 4.5 V
10
0.1
1
10
Drain Current ID (A)
100
Forward Transfer Admittance vs.
Drain Current
Static Drain to Source on State Resistance
vs. Temperature
Forward Transfer Admittance |yfs| (S)
Static Drain to Source on State Resistance
RDS(on) (mΩ)
HAT2206C
200
0.5 A
2A
160
1A
2A
120
1.8 V
0.5 A
1A
V
2.5
80
ID = 0.5, 1, 2 A
40
VGS = 4.5 V
0
–25
Pulse Test
0
25
50
75
100 125 150
Case Temperature
Tc
100
30
Tc = –25°C
10
3
0.3
0.1
0.1
8
4
4
2
VDD = 12 V
10 V
5V
0
4
100
Coss
Crss
30
10
1
0
4
2
6
8
10
12
Gate Charge Qg (nc)
Drain to Source Voltage VDS (V)
Reverse Drain Current vs.
Source to Drain Voltage
Switching Characteristics
1000
4.5 V
Switching Time t (ns)
Reverse Drain Current IDR (A)
100
VGS = 0
f = 1 MHz
Ciss
300
5
2.5V
6
VGS = 0, –5 V
4
2
Pulse Test
0
30
3
10
8
10
1000
Capacitance C (pF)
6
Gate to Source Voltage VGS (V)
Drain to Source Voltage VDS (V)
VDD = 12 V
10 V
5V
3
3
1
Typical Capacitance vs.
Drain to Source Voltage
8
2
0.3
Drain Current ID (A)
ID = 2 A
1
VDS = 10 V
Pulse Test
(°C)
16
0
75°C
1
Dynamic Input Characteristics
12
25°C
0.4
0.8
1.2
1.6
2.0
Source to Drain Voltage VSD (V)
Rev.5.00 Jan 26, 2006 page 4 of 6
VGS = 4.5 V, VDD = 10 V
Rg = 4.7 Ω
100
tr
td(off)
10
td(on)
tf
1
0.01 0.03
0.1
0.3
1
3
Drain Current ID (A)
10
HAT2206C
Switching Time Test Circuit
Waveform
90%
Vout
Monitor
Vin Monitor
D.U.T.
RL
4.7 Ω
Vin
4.5 V
Vin
Vout
VDD
= 10 V
10%
10%
90%
td(on)
Rev.5.00 Jan 26, 2006 page 5 of 6
10%
tr
90%
td(off)
tf
HAT2206C
Package Dimensions
JEITA Package Code

Package Name
CMFPAK-6
RENESAS Code
PWSF0006JA-A
Previous Code
CMFPAK-6 / CMFPAK-6V
MASS[Typ.]
0.0065g
D
A
e
c
E
A
HE
A
x M
LP
L
b
S A
Reference
Symbol
e
A2
A
A1
y S
S
e1
b
b1
l1
c1
b2
c
Pattern of terminal position areas
A-A Section
A
A1
A2
b
b1
c
c1
D
E
e
HE
L
LP
x
y
b2
e1
l1
Dimension in Millimeters
Min
0.6
0
0.7
0.15
0.1
1.9
1.6
2.05
0.1
0.15
Nom
0.22
0.2
0.13
0.11
2.0
1.7
0.65
2.1
0.2
Max
0.8
0.01
0.79
0.3
0.15
2.1
1.8
2.15
0.3
0.45
0.05
0.05
0.35
1.65
0.5
Ordering Information
Part Name
HAT2206C-EL-E
Quantity
3000 pcs
Shipping Container
Taping
Note: For some grades, production may be terminated. Please contact the Renesas sales office to check the state of
production before ordering the product.
Rev.5.00 Jan 26, 2006 page 6 of 6
Sales Strategic Planning Div.
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
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