CYStech Electronics Corp. Spec. No. : C223S6-R Issued Date : 2005.06.29 Revised Date : Page No. : 1/5 Low Vcesat NPN Epitaxial Planar Transistor HBN2444S6R (Dual Transistors) Features • Two BTD2444 chips in a SOT-363 package. • Mounting possible with SOT-323 automatic mounting machines. • Transistor elements are independent, eliminating interference. • Mounting cost and area can be cut in half. • Low VCE(sat), VCE(sat)=40mV (typical), at IC / IB = 50mA / 2.5mA • Pb-free package Equivalent Circuit Outline HBN2444S6R Tr1 SOT-363 Tr2 The following characteristics apply to both Tr1 and Tr2 Absolute Maximum Ratings (Ta=25°C) Parameter Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Collector Current (DC) Collector Current (Pulse) Power Dissipation Junction Temperature Storage Temperature Symbol VCBO VCEO VEBO IC ICP Pd Tj Tstg Limits 40 25 6 800 1.5 (Note 1) 200 (total) (Note 2) 150 -55~+150 Unit V V V mA A mW °C °C Note : 1.Single pulse, Pw=10ms 2.150mW per element must not be exceeded. HBN2444S6R CYStek Product Specification CYStech Electronics Corp. Spec. No. : C223S6-R Issued Date : 2005.06.29 Revised Date : Page No. : 2/5 Characteristics (Ta=25°C) Symbol BVCBO BVCEO BVEBO ICBO IEBO *VCE(sat)1 *VCE(sat)2 *VCE(sat)3 *VBE(on) *hFE1 *hFE2 *hFE3 fT Cob Min. 40 25 6 180 40 82 - Typ. 40 0.2 0.3 150 15 Max. 0.5 0.5 60 0.3 0.5 1 560 - Unit V V V µA µA mV V V V MHz pF Test Conditions IC=100µA, IE=0 IC=2mA, IB=0 IE=100µA, IC=0 VCB=30V, IE=0 VEB=6V, IC=0 IC=50mA, IB=2.5mA IC=400mA, IB=20mA IC=800mA, IB=80mA VCE=1V, IC=10mA VCE=1V, IC=100mA VCE=1V, IC=500mA VCE=2V, IC=50mA VCE=5V, IC=50mA, f=100MHz VCB=10V, f=1MHz *Pulse Test : Pulse Width ≤380µs, Duty Cycle≤2% Ordering Information Device HBN2444S6R HBN2444S6R Package SOT-363 (Pb-free) Shipping Marking 3000 pcs / Tape & Reel BS CYStek Product Specification CYStech Electronics Corp. Spec. No. : C223S6-R Issued Date : 2005.06.29 Revised Date : Page No. : 3/5 Characteristic Curves Current Gain vs Collector Current Saturation Voltage vs Collector Current 1000 1000 Saturation Voltage---(mV) Current Gain---HFE VCE = 3V 100 VCE = 1V 100 VCE(SAT) @ IC=20IB 10 VCE(SAT) @ IC=10IB 1 10 1 10 100 Collector Current---IC(mA) 1 1000 10 100 1000 Collector Current---IC(mA) Saturation Voltage vs Collector Current On Voltage vs Collector Current 1000 On Voltage---(mV) Saturation Voltage---(mV) 1000 VBE(SAT) @ IC=10IB 100 VBE(ON) @ VCE=1V 100 1 10 100 Collector Current---IC(mA) 1000 1 10 100 Collector Current---IC(mA) 1000 Power Derating Curves Power Dissipation---PD(mW) 250 200 Dual 150 Single 100 50 0 0 50 100 150 200 Ambient Temperature---TA(℃) HBN2444S6R CYStek Product Specification CYStech Electronics Corp. Spec. No. : C223S6-R Issued Date : 2005.06.29 Revised Date : Page No. : 4/5 Reel Dimension Carrier Tape Dimension HBN2444S6R CYStek Product Specification CYStech Electronics Corp. Spec. No. : C223S6-R Issued Date : 2005.06.29 Revised Date : Page No. : 5/5 SOT-363 Dimension Style: Pin 1. Emitter1 (E1) Pin 2. Base1 (B1) Pin 3. Collector2 (C2) Pin 4. Emitter2 (E2) Pin 5. Base2 (B2) Pin 6. Collector1 (C1) Marking: BS 6-Lead SOT-363 Plastic Surface Mounted Package CYStek Package Code: S6 *:Typical Inches Min. Max. 0.071 0.087 0.045 0.053 0.031 0.043 0.004 0.012 0.026BSC 0.004 DIM A B C D G H Millimeters Min. Max. 1.8 2.2 1.15 1.35 0.8 1.1 0.1 0.3 0.65BSC 0.1 DIM J K N S Y Inches Min. Max. 0.004 0.010 0.004 0.012 0.008 REF 0.079 0.087 0.012 0.016 Millimeters Min. Max. 0.1 0.25 0.1 0.30 0.20 REF 2.00 2.40 0.30 0.40 Notes : 1.Controlling dimension : millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material : • Lead : 42 Alloy ; solder plating • Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. HBN2444S6R CYStek Product Specification