AVAGO HCNW139 Low input current, high gain optocoupler Datasheet

6N139, 6N138, HCPL-0701, HCPL-0700,
HCNW138, HCNW139
Low Input Current, High Gain Optocouplers
Data Sheet
Lead (Pb) Free
RoHS 6 fully
compliant
RoHS 6 fully compliant options available;
-xxxE denotes a lead-free product
Description
Features
These high gain series couplers use a Light Emitting
Diode and an integrated high gain photodetector to
provide extremely high current transfer ratio between
input and output. Separate pins for the photodiode
and output stage result in TTL compatible saturation
voltages and high speed operation. Where desired the
VCC and VO terminals may be tied together to achieve
conven tional photodarlington operation. A base
access terminal allows a gain bandwidth adjustment to
be made.
 High current transfer ratio – 2000% typical (4500 %
typical for HCNW139/138)
 Low input current requirements – 0.5 mA
 TTL compatible output – 0.1 V VOL typical
 Performance guaranteed over temperature 0°C
to 70°C
 Base access allows gain bandwidth adjustment
 High output current – 60 mA
 Safetyapproval
UL recognized – 3750 V rms for 1 minute and 5000 V
rms* for 1 minute per UL 1577
CSA approved
IEC/EN/DIN EN 60747-5-2 approved with VIORM = 1414
Vpeak for HCNW139 and HCNW138
 Available in 8-Pin DIP or SOIC-8 footprint or widebody
package
 MIL-PRF-38534 hermetic version available
(HCPL-5700/1)
The 6N139, HCPL-0701, and CNW139 are for use in CMOS,
LSTTL or other low power applications. A 400% minimum current transfer ratio is guaranteed over 0 to 70°C
operating range for only 0.5 mA of LED current.
The 6N138, HCPL-0700, and HCNW138 are designed for
use mainly in TTL applications. Current Transfer Ratio
(CTR) is 300% minimum over 0 to 70°C for an LED current
of 1.6 mA (1 TTL Unit load ). A 300% minimum CTR
enables operation with 1 TTL Load using a 2.2 kΩ
pull-up resistor.
Applications
Functional Diagram
NC 1
8
VCC
ANODE 2
7
VB
CATHODE 3
NC 4
6 VO
TRUTH TABLE
LED
VO
ON
LOW
OFF
HIGH
5 GND
 Ground isolate most logic families – TTL/TTL, CMOS/
TTL, CMOS/CMOS, LSTTL/TTL, CMOS/LSTTL
 Low input current line receiver
 High voltage insulation (HCNW139/138)
 EIA RS-232C line receiver
 Telephone ring detector
 117 V ac line voltage status indicator – low input
power dissipation
 Low power systems – ground isolation
*5000 V rms/1 minute rating is for HCNW139/138 and Option 020
(6N139/138) products only.
A 0.1 μF bypass capacitor connected between pins 8 and 5 is
recommended.
CAUTION: It is advised that normal static precautions be taken in handling and assembly
of this component to prevent damage and/or degradation which may be induced by ESD.
Selection for lower input current down to 250 μA is
available upon request.
The HCPL-0701 and HCPL-0700 are surface mount devices
packaged in an industry standard SOIC-8 footprint.
The SOIC-8 does not require “through holes” in a PCB.
This package occupies approximately one-third the
footprint area of the standard dual-in-line package. The
lead profile is designed to be compatible with standard
surface mount processes.
The HCNW139 and HCNW138 are packaged in a
widebody encapsulation that provides creepage and
clearance dimensions suitable for safety approval by
regulatory agencies worldwide.
Selection Guide
8-Pin DIP
(300 Mil)
Small Outline SO-8
Single
Dual
Channel
Channel
Package
Package
HCPLHCPL-
Single
Channel
Package
Dual
Channel
Package
HCPL-
6N139
2731[1]
0701
6N138
[1]
0700
2730
[1]
HCPL-4701
[1]
4731
[1]
070A
Note:
1. Technical data are on separate Avago publications.
2
Widebody
Package
(400 mil)
Single
Channel
Package
Minimum
Input ON
Current
(IF)
Minimum
CTR
Absolute
Maximum
VCC
0731
HCNW139
0.5 mA
400%
18 V
0730
HCNW138
1.6 mA
300%
7V
40 μA
800%
18 V
0.5 mA
300%
20 V
[1]
073A
Hermetic
Single and
Dual
Channel
Packages
HCPL-
5701[1]
5700[1]
5731[1]
5730[1]
Ordering Information
6N138, 6N139, HCPL-0700 and HCPL-0701 are UL Recognized with 3750 Vrms for 1 minute per UL1577 and are approved under CSA Component Acceptance Notice #5, File CA 88324.
Option
Part
Number
6N138
6N139
HCPL-0700
HCPL-0701
HCNW138
HCNW139
RoHS
non RoHS
Compliant Compliant
Package
Surface
Mount
Gull
Wing
-000E
no option
-300E
#300
X
X
-500E
#500
X
X
-020E
#020
-320E
#320
-520E
#520
-060E
#060
-360E
#360
UL 5000 Vrms/
1 Minute
IEC/EN/DIN
rating
EN 60747-5-2 Quantity
Tape
& Reel
50 per tube
300 mil
DIP-8
X
X
X
X
X
X
X
-560E
#560
X
-000E
no option
X
-500E
#500
-060E
#060
-560E
#560
-000E
no option
-300E
#300
-500E
#500
SO-8
50 per tube
X
X
50 per tube
X
50 per tube
X
1000 per reel
X
X
50 per tube
X
50 per tube
X
1000 per reel
100 per tube
X
X
1500 per reel
X
X
400 mil
Widebody
DIP-8
1000 per reel
X
X
X
100 per tube
X
1500 per reel
42 per tube
X
X
X
X
To order, choose a part number from the part number
column and combine with the desired option from
the option column to form an order entry.
42 per tube
X
750 per reel
Schematic
V CC
8
Example 1:
6N138-560E to order product of 300 mil DIP Gull Wing
Surface Mount package in Tape and Reel packaging
with IEC/EN/DIN EN 60747-5-2 Safety Approval and
RoHS compliant.
Example 2:
HCPL-0700 to order product of 300 mil DIP package in
Tube packaging and non RoHS compliant.
I CC
2
ANODE
IF
+
VF
CATHODE
–
IO
3
VO
Option datasheets are available. Contact your Avago sales
representative or authorized distributor for information.
Remarks: The notation ‘#XXX’ is used for existing
products, while (new) products launched since July 15,
2001 and RoHS compliant will use ‘–XXXE.’
3
6
5
SHIELD
IB
7
VB
GND
Package Outline Drawings
8-Pin DIP Package (6N139/6N138)**
7.62 ± 0.25
(0.300 ± 0.010)
9.65 ± 0.25
(0.380 ± 0.010)
8
TYPE NUMBER
7
6
5
6.35 ± 0.25
(0.250 ± 0.010)
OPTION CODE*
DATE CODE
A XXXXZ
YYWW RU
1
2
3
4
UL
RECOGNITION
1.78 (0.070) MAX.
1.19 (0.047) MAX.
5° TYP.
3.56 ± 0.13
(0.140 ± 0.005)
4.70 (0.185) MAX.
+ 0.076
0.254 - 0.051
+ 0.003)
(0.010 - 0.002)
0.51 (0.020) MIN.
2.92 (0.115) MIN.
DIMENSIONS IN MILLIMETERS AND (INCHES).
* MARKING CODE LETTER FOR OPTION NUMBERS
"L" = OPTION 020
OPTION NUMBERS 300 AND 500 NOT MARKED.
0.65 (0.025) MAX.
1.080 ± 0.320
(0.043 ± 0.013)
2.54 ± 0.25
(0.100 ± 0.010)
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
**JEDEC Registered Data.
8-Pin DIP Package with Gull Wing Surface Mount Option 300 (6N139/6N138)
LAND PATTERN RECOMMENDATION
9.65 ± 0.25
(0.380 ± 0.010)
8
7
6
1.016 (0.040)
5
6.350 ± 0.25
(0.250 ± 0.010)
1
2
3
10.9 (0.430)
4
1.27 (0.050)
1.19
(0.047)
MAX.
1.780
(0.070)
MAX.
9.65 ± 0.25
(0.380 ± 0.010)
7.62 ± 0.25
(0.300 ± 0.010)
3.56 ± 0.13
(0.140 ± 0.005)
1.080 ± 0.320
(0.043 ± 0.013)
0.635 ± 0.130
2.54
(0.025 ± 0.005)
(0.100)
BSC
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
4
2.0 (0.080)
0.635 ± 0.25
(0.025 ± 0.010)
+ 0.076
0.254 - 0.051
+ 0.003)
(0.010 - 0.002)
12° NOM.
Small Outline SO-8 Package (HCPL-0701/HCPL-0700)
LAND PATTERN RECOMMENDATION
8
7
6
5
XXX
YWW
3.937 ± 0.127
(0.155 ± 0.005)
5.994 ± 0.203
(0.236 ± 0.008)
TYPE NUMBER
(LAST 3 DIGITS)
7.49 (0.295)
DATE CODE
PIN ONE
1
2
3
4
1.9 (0.075)
0.406 ± 0.076
(0.016 ± 0.003)
1.270 BSC
(0.050)
0.64 (0.025)
* 5.080 ± 0.127
(0.200 ± 0.005)
3.175 ± 0.127
(0.125 ± 0.005)
7°
1.524
(0.060)
45° X
0.432
(0.017)
0 ~ 7°
0.228 ± 0.025
(0.009 ± 0.001)
0.203 ± 0.102
(0.008 ± 0.004)
* TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH)
5.207 ± 0.254 (0.205 ± 0.010)
0.305 MIN.
(0.012)
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES) MAX.
NOTE: FLOATING LEAD PROTRUSION IS 0.15 mm (6 mils) MAX.
8-Pin Widebody DIP Package (HCNW139/HCNW138)
11.00 MAX.
(0.433)
11.23 ± 0.15
(0.442 ± 0.006)
8
7
6
5
TYPE NUMBER
A
HCNWXXXX
9.00 ± 0.15
(0.354 ± 0.006)
DATE CODE
YYWW
1
2
3
4
10.16 (0.400)
TYP.
1.55
(0.061)
MAX.
7° TYP.
5.10 MAX.
(0.201)
3.10 (0.122)
3.90 (0.154)
+ 0.076
0.254 - 0.0051
+ 0.003)
(0.010 - 0.002)
0.51 (0.021) MIN.
2.54 (0.100)
TYP.
1.80 ± 0.15
(0.071 ± 0.006)
0.40 (0.016)
0.56 (0.022)
DIMENSIONS IN MILLIMETERS (INCHES).
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
5
8-Pin Widebody DIP Package with Gull Wing Surface Mount Option 300 (HCNW139/HCNW138)
11.23 ± 0.15
(0.442 ± 0.006)
8
7
6
LAND PATTERN RECOMMENDATION
5
9.00 ± 0.15
(0.354 ± 0.006)
1
2
3
13.56
(0.534)
4
2.29
(0.09)
1.3
(0.051)
12.30 ± 0.30
(0.484 ± 0.012)
1.55
(0.061)
MAX.
11.00 MAX.
(0.433)
4.00 MAX.
(0.158)
1.80 ± 0.15
(0.071 ± 0.006)
0.75 ± 0.25
(0.030 ± 0.010)
2.54
(0.100)
BSC
1.00 ± 0.15
(0.039 ± 0.006)
+ 0.076
0.254 - 0.0051
+ 0.003)
(0.010 - 0.002)
DIMENSIONS IN MILLIMETERS (INCHES).
7° NOM.
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
Solder Reflow Temperature Profile
300
PREHEATING RATE 3 °C + 1 °C/–0.5 °C/SEC.
REFLOW HEATING RATE 2.5 °C ± 0.5 °C/SEC.
200
PEAK
TEMP.
245 °C
PEAK
TEMP.
240 °C
TEMPERATURE (°C)
2.5 C ± 0.5 °C/SEC.
30
SEC.
160 °C
150 °C
140 °C
SOLDERING
TIME
200 °C
30
SEC.
3 °C + 1 °C/–0.5 °C
100
PREHEATING TIME
150 °C, 90 + 30 SEC.
50 SEC.
TIGHT
TYPICAL
LOOSE
ROOM
TEMPERATURE
0
0
50
100
150
TIME (SECONDS)
NOTE: NON-HALIDE FLUX SHOULD BE USED.
6
PEAK
TEMP.
230 °C
200
250
Recommended Pb-Free IR Profile
tp
Tp
TEMPERATURE
TL
Tsmax
* 260 +0/-5 °C
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE
15 SEC.
217 °C
150 - 200 °C
RAMP-UP
3 °C/SEC. MAX.
NOTES:
THE TIME FROM 25 °C to PEAK
TEMPERATURE = 8 MINUTES MAX.
Tsmax = 200 °C, Tsmin = 150 °C
RAMP-DOWN
6 °C/SEC. MAX.
Tsmin
ts
PREHEAT
60 to 180 SEC.
25
tL
NOTE: NON-HALIDE FLUX SHOULD BE USED.
60 to 150 SEC.
* RECOMMENDED PEAK TEMPERATURE FOR
WIDEBODY 400mils PACKAGE IS 245 °C
t 25 °C to PEAK
TIME
Regulatory Information
The 6N139/138, HCNW139/138, and HCPL-0701/0700 have been approved by the following organizations:
UL
IEC/EN/DIN EN 60747-5-2
Recognized under UL 1577, Component Recognition
Program, File E55361.
Approved under
IEC 60747-5-2:1997 + A1:2002
EN 60747-5-2:2001 + A1:2002
DIN EN 60747-5-2 (VDE 0884 Teil 2):2003-01
(HCNW139/138 only)
CSA
Approved under CSA Component Acceptance Notice
#5, File CA 88324.
Insulation and Safety Related Specifications
Parameter
Symbol
8-Pin DIP
(300 Mil)
Value
Units
Conditions
Minimum External
Air Gap (External
Clearance)
L(101)
7.1
4.9
9.6
mm
Measured from input terminals
to output terminals, shortest
distance through air.
Minimum External
Tracking (External
Creepage)
L(102)
7.4
4.8
10.0
mm
Measured from input terminals
to output terminals, shortest
distance path along body.
Minimum Internal
Plastic Gap
(Internal Clearance)
0.08
0.08
1.0
mm
Through insulation distance,
conductor to conductor, usually
the direct distance between the
photoemitter and photodetector
inside the optocoupler cavity.
Minimum Internal
Tracking (Internal
Creepage)
NA
NA
4.0
mm
Measured from input terminals
to output terminals, along
internal cavity.
200
200
200
Volts
DIN IEC 112/VDE 0303 Part 1
IIIa
IIIa
IIIa
Tracking Resistance
(Comparative
Tracking Index)
Isolation Group
CTI
SO-8
Value
Widebody
(400 Mil)
Value
Option 300 - surface mount classification is Class A in accordance with CECC 00802.
7
Material Group
(DIN VDE 0110, 1/89, Table 1)
IEC/EN/DIN EN 60747-5-2 Insulation Related Characteristics (HCNW139 and HCNW138)
Description
Symbol
Installation Classification per DIN VDE 0110/1.89, Table 1
for rated mains voltage ≤600 V rms
Characteristic
Units
I-IV
for rated mains voltage ≤1000 V rms
I-III
Climatic Classification
55/100/21
Pollution Degree (DIN VDE 0110/1.89)
2
VIORM
1414
Vpeak
Input to Output Test Voltage, Method b*
VPR = 1.875 x VIORM, 100% Production Test with tP = 1 sec,
Partial Discharge < 5 pC
VPR
2652
Vpeak
Input to Output Test Voltage, Method a*
VPR = 1.5 x VIORM, Type and Sample Test,
tP = 60 sec, Partial Discharge < 5 pC
VPR
2121
Vpeak
VIOTM
8000
Vpeak
TS
IS,INPUT
PS,OUTPUT
175
400
700
°C
mA
mW
RS
> 109

Maximum Working Insulation Voltage
Highest Allowable Overvoltage*
(Transient Overvoltage, tini = 10 sec)
Safety Limiting Values
(Maximum values allowed in the event of a failure,
also see Figure 11, Thermal Derating curve.)
Case Temperature
Current (Input Current IF, PS = 0)
Output Power
Insulation Resistance at TS, VIO = 500 V
*Refer to the front of the optocoupler section of the current catalog, under Product Safety Regulations section, IEC/EN/DIN EN 60747-5-2, for a
detailed description.
Note: Isolation characteristics are guaranteed only within the safety maximum ratings which must be ensured by protective circuits in application.
8
Absolute Maximum Ratings* (No Derating Required up to 85°C)
Parameter
Storage Temperature
Operating Temperature**
Average Forward Input Current
Peak Forward Input Current
(50% Duty Cycle, 1 ms Pulse Width)
Peak Transient Input Current
(<1 μs Pulse Width, 300 pps)
Reverse Input Voltage
Symbol
Min.
Max.
Units
TS
-55
125
°C
TA
-40
85
°C
IF(AVG)
20
mA
IFPK
40
mA
IF(TRAN)
1.0
A
VR
5
V
3
V
35
mW
HCNW139/138
Input Power Dissipation
PI
Output Current (Pin 6)
IO
60
mA
Emitter Base Reverse Voltage (Pin 5-7)
VEB
0.5
V
Supply Voltage and Output Voltage
(6N139, HCPL-0701, HCNW139)
VCC
-0.5
18
V
Supply Voltage and Output Voltage
(6N138, HCPL-0700, HCNW138)
VCC
-0.5
7
V
Output Power Dissipation
PO
100
mW
Total Power Dissipation
PT
135
mW
Lead Solder Temperature (for Through Hole Devices)
260°C for 10 sec., 1.6 mm below seating plane
HCNW139/138
260°C for 10 sec., up to seating plane
Reflow Temperature Profile
(for SOIC-8 and Option #300)
See Package Outline Drawings section
*JEDEC Registered Data for 6N139 and 6N138.
**0°C to 70°C on JEDEC Registration.
Recommended Operating Conditions
Parameter
Symbol
Min.
Max.
Units
Power Supply Voltage
VCC
4.5
18
V
Forward Input Current (ON)
IF(ON)
0.5
12.0
mA
Forward Input Voltage (OFF)
VF(OFF)
0
0.8
V
TA
0
70
°C
Operating Temperature
9
Electrical Specifications
0°C ≤ TA ≤ 70°C, 4.5 V ≤ VCC ≤ 18 V, 0.5 mA ≤ IF(ON) ≤ 12 mA, 0 V ≤ VF(OFF) ≤ 0.8 V, unless otherwise specified.
All Typicals at TA = 25°C. See Note 7.
Parameter
Sym.
Device
Min. Typ.** Max. Units
Test ConditionsFig.
Current Transfer
Ratio
Logic Low Output
Voltage
CTR
VOL
6N139
HCPL-0701
HCNW139
6N139
HCPL-0701
HCNW139
6N138
HCPL-0700
HCNW138
6N139
HCPL-0701
HCNW139
400*
2000
5000
%
400
500*
4500
1600
2600
IF = 1.6 mA
500
300
200
300*
3000
1600
850
1600
2600
IF = 5.0 mA
IF = 12 mA
IF = 1.6 mA
1500
0.1
0.4
V
Logic High
Output Current
Logic Low Supply
Current
Logic High
Supply Current
Input Forward
Voltage
IOH
ICCL
ICCH
VF
Input Reverse
Breakdown Voltage
BVR
Temperature
Coefficient of
Forward Voltage
Input
Capacitance
ΔVF
ΔTA
HCNW139
HCNW138
CIN
HCNW139
HCNW138
0.1
0.05
100
0.1
250
0.4
1.5
0.5
2
0.01
10
2, 3
1, 2,
4
VCC = 4.5
1
2
μA
VO = VCC = 18 V
IF = 0 mA
2
VO = VCC = 7 V
mA
IF = 1.6 mA, VO = Open,
VCC = 18 V
μA
IF = 0 mA, VO = Open,
VCC = 18 V
V
TA = 25°C
10
1.25
1.40
1.7*
IF = 1.6 mA
4, 8
1.75
1.0
1.45
0.95
5.0*
3.0
TA = 25°C
1.85
1.95
V
-1.8
mV/°C
60
90
pF
IR = 10 μA, TA = 25°C
IR = 100 μA, TA = 25°C
IF = 1.6 mA
f = 1 MHz, VF = 0 V
2
2
1
* JEDEC Registered Data for 6N139 and 6N138.
**All typical values at TA = 25°C and VCC = 5 V, unless otherwise noted.
10
IF = 0.5 mA,
IO = 2 mA
Note
VCC = 4.5
VO = 0.4 V
IF = 1.6 mA,
IO = 8 mA
IF = 5.0 mA,
IO = 15 mA
IF = 12 mA,
IO = 24 mA
IF = 1.6 mA,
IO = 4.8 mA
0.2
6N138
HCPL-0700
HCNW138
6N139
HCPL-0701
HCNW139
6N138
HCPL-0700
HCNW138
6N138/139
HCPL-0701/
0700
HCNW139
HCNW138
6N138/139
HCPL-0701/
0700
HCNW139
HCNW138
6N138
6N139
HCPL-0701
HCPL-0700
HCNW139
HCNW138
IF = 0.5 mA
8
Switching Specifications (AC)
Over recommended operating conditions (TA = 0 to 70°C), VCC = 5 V, unless otherwise specified.
Parameter
Sym.
Device
Propagation
Delay Time
to Logic Low
at Output
tPHL
6N139
HCPL-0701
HCNW139
6N139
HCPL-0701
HCNW139
6N138
HCPL-0700
HCNW138
6N139
HCPL-0701
HCNW139
6N139
HCPL-0701
HCNW139
6N138
HCPL-0700
HCNW138
Propagation
Delay Time
to Logic High
at Output
Common Mode
Transient
Immunity at
Logic High
Output
Common Mode
Transient
Immunity at
Logic Low
Output
tPLH
Min.
Typ.**
Max.
TA =25°C
5
25*
30
s
IF = 0.5 mA,
Rl = 4.7 k
0.2
1*
2
s
IF = 12 mA,
Rl = 270 
1.6
10*
11
15
s
IF = 1.6 mA,
Rl = 2.2 k
18
60*
11
90
s
IF = 0.5 mA,
Rl = 4.7 k
2
7*
115
10
s
IF = 12 mA,
Rl = 270 
10
35*
11
50
s
IF = 1.6 mA,
Rl = 2.2 k
IF = 0 mA,
TA = 25°C
Rl = 2.2 k
|VCM| = 10
Vp-p
IF = 1.6 mA,
TA = 25°C
Rl = 2.2 k
|VCM| = 10
Vp-p
Fig.
Note
5, 6,
7, 9,
12
2, 4
5, 6,
7, 9,
12
2, 4
13
5, 6
13
5, 6
70
|CMH|
1000
10000
V/s
|CML|
1000
10000
V/s
* JEDEC Registered Data for 6N139 and 6N138.
**All typical values at TA = 25°C and VCC = 5 V, unless otherwise noted.
11
Units Test Conditions
Package Characteristics
Parameter
Sym.
Min.
Input-Output Momentary
Withstand Voltage†
VISO
3750
Option 020
HCNW139
HCNW138
Typ.**
Max.
Units
Test Conditions
V rms
RH < 50%, t = 1 min.,
TA = 25°C
5000
Fig.
Note
3, 8
3, 9
Resistance (Input-Output)
RI-O
1012

VI-O = 500 Vdc
RH < 45%
3
Capacitance (Input-Output)
CI-O
0.6
pF
f = 1 MHz
3
**All typicals at TA = 25°C, unless otherwise noted.
†The Input-Output Momentary Withstand Voltage is a dielectric voltage rating that should not be interpreted as an input-output continuous voltage rating.
For the continuous voltage rating refer to the IEC/EN/DIN EN 60747-5-2 Insulation Characteristics Table (if applicable), your equipment level safety
specification or Avago Application Note 1074 entitled “Optocoupler Input-Output Endurance Voltage.”
Notes:
1. DC CURRENT TRANSFER RATIO (CTR) is defined as the ratio of output collector current, IO, to the forward LED input current, IF, times 100%.
2. Pin 7 Open.
3. Device considered a two-terminal device. Pins 1, 2, 3, and 4 shorted together and Pins 5, 6, 7, and 8 shorted together.
4. Use of a resistor between pin 5 and 7 will decrease gain and delay time. Significant reduction in overall gain can occur when using resistor values
below 47 k. For more information, please contact your local Avago Components representative.
5. Common mode transient immunity in a Logic High level is the maximum tolerable (positive) dVCM /dt of the common mode pulse, VCM, to assure
that the output will remain in a Logic High state (i.e., VO > 2.0 V). Common mode transient immunity in a Logic Low level is the maximum tolerable
(negative) dVCM /dt of the common mode pulse, VCM, to assure that the output will remain in a Logic Low state (i.e., VO < 0.8 V).
6. In applications where dV/dt may exceed 50,000 V/μs (such as static discharge) a series resistor, RCC, should be included to protect the
detector IC from destructively high surge currents. The recommended value is RCC = 220 .
7. Use of a 0.1 F bypass capacitor connected between pins 8 and 5 adjacent to the device is recommended.
8. In accordance with UL 1577, each optocoupler is proof tested by applying an insulation test voltage 4500 V rms for 1 second (leakage detection
current limit, II-O < 5 A). This test is per formed before the 100% production test shown in the IEC/EN/DIN EN 60747-5-2 Insulation Related Characteristics Table, if applicable.
9. In accordance with UL 1577, each optocoupler is proof tested by applying an insulation test voltage > 6000 V rms for 1 second (leakage detection
current limit, II-O < 5 A). This test is per formed before the 100% production test for partial discharge (method b) shown in the IEC/EN/DIN EN
60747-5-2 Insulation Related Characteristics Table, if applicable.
12
A
1.5 m
25
1.0 mA
0.5 mA
VCC = 5 V
TA = 25° C
0
1.0
2.0
800
400
0
0.1
+
VF
–
TA = 85°C
TA = 70°C
0.1
TA = 25°C
0.001
1.1
TA = 0°C
TA = -40°C
1.2
1.3
1.4
1.5
tP – PROPAGATION DELAY – μs
IF – FORWARD CURRENT – mA
40
IF
0.01
35
tPLH
1
tPHL
0
20
40 60
80 100
TA – TEMPERATURE – °C
Figure 7. Propagation delay vs. temperature
13
TA = 85° C
1.0
25
20
15
10
tPHL
5
0
20
40 60
10
1
Figure 3. 6N138/6N139 output current vs. input
diode forward current
21
IF = 1.6 mA
RL = 2.2 kΩ
1/f = 50 μs
tPLH
18
15
12
9
6
tPHL
3
0
-60 -40 -20
80 100
Figure 5. Propagation delay vs. temperature
0.1
IF – INPUT DIODE FORWARD CURRENT – mA
24
tPLH
TA = 70° C
TA = 25° C
TA = 0° C
TA = -40° C
0.1
0
40 60
20
80 100
TA – TEMPERATURE – °C
Figure 6. Propagation delay vs. temperature
1.6
2
0
-60 -40 -20
10
TA – TEMPERATURE – °C
VF – FORWARD VOLTAGE – V
tP – PROPAGATION DELAY – μs
3
100
0.01
0.01
10
IF = 0.5 mA
RL = 4.7 kΩ
1/f = 50 μs
0
-60 -40 -20
1.6
Figure 4. Input diode forward current vs.
forward voltage
IF = 12 mA
RL = 270 kΩ
1/f = 50 μs
1.0
30
VF – FORWARD VOLTAGE – V
4
VCC = 5 V
VO = 0.4 V
Figure 2. Current transfer ratio vs. forward
current 6N138/6N139
10
1.0
-40°C
IF – FORWARD CURRENT – mA
Figure 1. 6N138/6N139 DC transfer characteristics
100
70°C
1200
VO – OUTPUT VOLTAGE – V
1000
25°C
1600
100
IF = 1.6 mA
TA = 25° C
tf
1.5
TIME – μs
0
70°C
tP – PROPAGATION DELAY – μs
4.0 mA
85°C
2000
IO – OUTPUT CURRENT – mA
A
3.5 m
A
3.0 m
A
2.5 m
A
2.0 m
CTR – CURRENT TRANSFER RATIO – %
IO – OUTPUT CURRENT – mA
5.0 mA
50 4.5 mA
1.4
tr
10
1.3
IF – ADJUSTED FOR VOL = 2 V
1.2
-60 -40 -20
0
20
40 60
80 100
TA – TEMPERATURE – °C
Figure 8. Forward voltage vs. temperature
1
0.1
1.0
10
RL – LOAD RESISTANCE – kΩ
Figure 9. Nonsaturated rise and fall times vs.
load resistance
OUTPUT POWER – PS, INPUT CURRENT – IS
ICCL – LOGIC LOW SUPPLY CURRENT – mA
0.8
0.7
0.6
0.5
VCC = 18 V
0.4
VCC = 5 V
0.3
0.2
0.1
0
0
4
2
6
8
12
10
14
16
WIDEBODY
1000
PS (mW)
900
IS (mA)
800
700
600
500
400
300
200
100
0
0
25
50
75
100 125 150 175
TS – CASE TEMPERATURE – °C
IF – FORWARD CURRENT
Figure 10. Logic low supply current vs. forward current
Figure 11. Thermal derating curve, dependence of safety limiting value
with case temperature per IEC/EN/DIN EN 60747-5-2
IF
0
5V
VO
(SATURATED
RESPONSE)
1.5 V
1.5 V
VOL
t PHL
t PLH
IF
PULSE
GEN.
ZO = 50 Ω
tr = 5 ns
10% DUTY CYCLE
I/f < 100 μs
1
8
2
7
3
6
+5 V
RL
VO
0.1 μF
IF MONITOR
5
4
CL = 15 pF*
RM
VO
90%
(NON-SATURATED
RESPONSE)
5V
90%
10%
* INCLUDES PROBE AND
FIXTURE CAPACITANCE
10%
tf
tr
Figure 12. Switching test circuit
VCM
10 V
0V
10%
90%
90%
tr
VO
tf
A
SWITCH AT A: I F = 0 mA
SWITCH AT B: I F = 1.6 mA
1
8
R CC (SEE NOTE 6)
+5 V
2
7
RL
3
6
4
5
B
10%
5V
VO
IF
tr, tf = 16 ns
VFF
VCM
+
–
VOL
PULSE GEN.
Figure 13. Test circuit for transient immunity and typical waveforms
For product information and a complete list of distributors, please go to our website:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries.
Data subject to change. Copyright © 2005-2012 Avago Technologies Limited. All rights reserved. Obsoletes AV01-0543EN
AV02-1359EN - July 27, 2012
VO
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