Fairchild HCPL4503TVM High speed transistor optocoupler Datasheet

HIGH SPEED
TRANSISTOR OPTOCOUPLERS
HCPL4503M
PACKAGE
SCHEMATIC
N/C 1
8 VCC
+ 2
7 N/C
8
1
V
F
_
8
8
1
3
N/C 4
6 VO
5 GND
1
DESCRIPTION
The HCPL4503M optocoupler consists of an AlGaAs LED optically coupled to a high speed photodetector transistor.
A separate connection for the bias of the photodiode improves the speed by several orders of magnitude over conventional
phototransistor optocouplers by reducing the base-collector capacitance of the input transistor. The base of the phototransistor is
not bonded out to a pin for improved noise immunity.
An internal noise shield provides superior common mode rejection of 15kV/µs minimum.
FEATURES
•
•
•
•
•
•
•
VISO = 5kV RMS is standard for all devices
High speed-1 MBit/s
Superior CMR, CMH = 50 kV/ms (typical); CML = 30 kV/ms (typical)
No base connection for improved noise immunity
CTR guaranteed 0-70°C
U.L. recognized (File # E90700, Vol 2)
VDE approval pending
APPLICATIONS
•
•
•
•
Line receivers
Pulse transformer replacement
Output interface to CMOS-LSTTL-TTL
Wide bandwidth analog coupling
© 2004 Fairchild Semiconductor Corporation
Page 1 of 12
4/29/04
HIGH SPEED
TRANSISTOR OPTOCOUPLERS
HCPL4503M
ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise specified)
Parameter
Symbol
Value
Units
Storage Temperature
TSTG
-40 to +125
°C
Operating Temperature
TOPR
-40 to +100
°C
Lead Solder Temperature
TSOL
260 for 10 sec
°C
DC/Average Forward Input Current
IF (avg)
25
mA
Peak Forward Input Current (50% duty cycle, 1 ms P.W.)
IF (pk)
50
mA
IF (trans)
1.0
A
EMITTER
Peak Transient Input Current - (≤1 µs P.W., 300 pps)
Reverse Input Voltage
VR
5
V
Input Power Dissipation
PD
100
mW
Average Output Current
IO (avg)
8
mA
Peak Output Current
DETECTOR
IO (pk)
16
mA
Supply Voltage
VCC
-0.5 to 30
V
Output Voltage
VO
-0.5 to 20
V
Output power dissipation
PD
100
mW
© 2004 Fairchild Semiconductor Corporation
Page 2 of 12
4/29/04
HIGH SPEED
TRANSISTOR OPTOCOUPLERS
HCPL4503M
ELECTRICAL CHARACTERISTICS (TA = 0 to 70°C Unless otherwise specified)
INDIVIDUAL COMPONENT CHARACTERISTICS
Parameter
EMITTER
Test Conditions
Symbol
(IF = 16 mA, TA =25°C)
Min
VF
Input Forward Voltage
(IF = 16 mA)
Input Reverse Breakdown Voltage
(IR = 10 µA)
BVR
Temperature coefficient of
forward voltage
(IF = 16 mA)
(∆VF/∆TA)
Typ**
Max
1.45
1.7
1.8
5.0
Unit
V
V
-1.6
mV/°C
DETECTOR
(IF = 0 mA, VO = VCC = 5.5 V)
(TA =25°C)
Logic high output current
(IF = 0 mA, VO = VCC = 15 V)
(TA =25°C)
IOH
0.001
0.5
0.005
1
(IF = 0 mA, VO = VCC = 15 V)
Logic low supply current
Logic high supply current
(IF = 16 mA, VO = Open)
(VCC = 15 V)
(IF = 0 mA, VO = Open, VCC = 15 V)
(TA =25°C)
(IF = 0 mA, VO = Open)
(VCC = 15 V)
µA
50
ICCL
120
200
µA
1
µA
ICCH
2
** All Typicals at TA = 25°C
© 2004 Fairchild Semiconductor Corporation
Page 3 of 12
4/29/04
HIGH SPEED
TRANSISTOR OPTOCOUPLERS
HCPL4503M
TRANSFER CHARACTERISTICS (TA = 0 to 70°C Unless otherwise specified)
Parameter
COUPLED
Current transfer ratio
(Note 5)
Test Conditions
Symbol
(IF = 16 mA, VO = 0.4 V)
(Note 1) (VCC = 4.5 V, TA =25°C)
(IF = 16 mA, IO = 3 mA)
(VCC = 4.5 V, TA =25°C)
(IF = 16 mA, IO = 2.4 mA)
(VCC = 4.5 V)
Typ**
Max
19
27
50
CTR
(IF = 16 mA, VCC = 4.5 V, VOL=0.5V)
Logic low output voltage
output voltage
Min
Unit
%
15
30
0.5
V
VOL
0.5
** All Typicals at TA = 25°C
SWITCHING CHARACTERISTICS (TA = 0 to 70°C unless otherwise specified., VCC = 5 V)
Parameter
Propagation delay
time to logic low
Propagation delay
time to logic high
Test Conditions
Symbol
(RL = 1.9 kΩ, IF = 16 mA) (Note 2) (Fig. 7)
TA = 25°C
Min
TPHL
Typ**
Max
Unit
0.45
0.8
µs
1.0
µs
0.8
µs
1.0
µs
(RL = 1.9 kΩ, IF = 16 mA) (Note 2) (Fig. 7)
(RL = 1.9 kΩ, IF = 16 mA) (Note 2) (Fig. 7)
TA = 25°C
0.3
TPLH
(RL = 1.9 kΩ, IF = 16 mA) (Note 2) (Fig. 7)
Common mode
transient
immunity at
logic high
(IF = 0 mA, VCM = 1,500 VP-P)
TA = 25°C, (RL = 1.9 kΩ)
(Note 3) (Fig. 8)
|CMH|
15,000
50,000
V/µs
Common mode
transient
immunity at
logic low
(IF = 16 mA, VCM = 1,500 VP-P)
(RL = 1.9 kΩ)
(Note 3) (Fig. 8)
|CML|
15,000
30,000
V/µs
** All Typicals at TA = 25°C
© 2004 Fairchild Semiconductor Corporation
Page 4 of 12
4/29/04
HIGH SPEED
TRANSISTOR OPTOCOUPLERS
HCPL4503M
ISOLATION CHARACTERISTICS (TA = 0 to 70°C Unless otherwise specified)
Characteristics
Input-output
insulation leakage current
Withstand insulation test voltage
Resistance (input to output)
Capacitance (input to output)
Test Conditions
(Relative humidity = 45%)
(TA = 25°C, t = 5 s)
(VI-O = 3000 VDC)
(Note 4)
Symbol
Min
Typ**
II-O
Max
Unit
1.0
µA
(RH ≤ 50%, TA = 25°C)
(Note 4) ( t = 1 min.)
VISO
(Note 9) (VI-O = 500 VDC)
RI-O
1012
Ω
(Note 4) (f = 1 MHz)
CI-O
0.6
pF
5,000
VRMS
Notes
1. Current Transfer Ratio is defined as a ratio of output collector current, IO, to the forward LED input current, IF, times 100%.
2. The 1.9 kΩ load represents 1 TTL unit load of 1.6 mA and 5.6 kΩ pull-up resistor.
3. Common mode transient immunity in logic high level is the maximum tolerable (positive) dVcm/dt on the leading edge of the
common mode pulse signal VCM, to assure that the output will remain in a logic high state (i.e., VO>2.0 V). Common mode
transient immunity in logic low level is the maximum tolerable (negative) dVcm/dt on the trailing edge of the common mode
pulse signal, VCM, to assure that the output will remain in a logic low state (i.e., VO<0.8 V).
4. Device is considered a two terminal device: Pins 1, 2, 3 and 4 are shorted together and Pins 5, 6, 7 and 8 are shorted
together.
© 2004 Fairchild Semiconductor Corporation
Page 5 of 12
4/29/04
HIGH SPEED
TRANSISTOR OPTOCOUPLERS
HCPL4503M
Fig. 2 Normalized CTR vs. Temperature
1.2
1.0
1.0
NORMALIZED CTR
NORMALIZED CTR
Fig. 1 Normalized CTR vs. Forward Current
1.2
0.8
0.6
0.4
VO = 0.4 V
VCC = 5 V
TA = 25°C
Normalized to:
IF = 16 mA
0.2
0.0
0.1
1
0.8
0.6
0.4
10
0.0
-60
100
-40
-20
IF - FORWARD CURRENT (mA)
20
40
60
80
100
80
100
Fig. 4 Logic High Output Current
vs. Temperature
1000
TA = 25°C
VCC = 5 V
14
IOH - LOGIC HIGH OUTPUT CURRENT (nA)
16
IO - OUTPUT CURRENT (mA)
0
TA - TEMPERATURE (°C)
Fig. 3 Output Current vs. Output Voltage
IF = 40 mA
IF = 35 mA
12
IF = 30 mA
10
IF = 25 mA
8
IF = 20 mA
6
IF = 15 mA
4
IF = 10 mA
2
IF = 5 mA
0
2
4
6
8
10
12
14
16
18
IF = 0 mA
VCC = 5 V
VO = 5 V
100
10
1
0.1
-60
0
20
-40
-20
20
40
60
Fig. 6 Propagation Delay vs. Load Resistance
Fig. 5 Propagation Delay vs. Temperature
800
10000
700
RL = 4.1 K (TPLH)
TP - PROPAGATION DELAY (ns)
600
0
TA - TEMPERATURE (°C)
VO - OUTPUT VOLTAGE (V)
Tp - PROPAGATION DELAY (ns)
IF = 16mA
VCC = 5 V
VO = 0.4 V
Normalized to:
TA = 25°C
0.2
RL = 4.1 K (TPLH)
500
400
300
200
RL = 1.9 K (TPHL)
IF = 16 mA
VCC = 5 V
RL = 1.9 K (TPLH)
100
IF - 16 mA (TPHL)
IF - 10 mA (TPHL)
1000
IF - 16 mA (TPLH)
IF - 10 mA (TPLH)
0
-60
-40
-20
0
20
40
60
80
100
100
TA - TEMPERATURE (°C)
© 2004 Fairchild Semiconductor Corporation
VCC = 5 V
TA = 25°C
1
10
RL = LOAD RESISTANCE (kΩ)
Page 6 of 12
4/29/04
HIGH SPEED
TRANSISTOR OPTOCOUPLERS
HCPL4503M
1
Pulse
Generator I
F
tr = 5ns
Z O = 50 Ω
10% D.C.
I/f < 100µs
Noise
Shield
8
VCC
+5 V
+
2
7
VF
-
3
6
N/C
RL
VO
VO
0.1 µF
I F Monitor
4
Rm
5
C L = 1.5 µF
GND
IF
0
5V
VO
1.5 V
1.5 V
VOL
TPHL
TPLH
Fig. 7 Switching Time Test Circuit
IF
1
Noise
Shield
8
VCC
+5 V
+
2
7
3
6
VF
-
A
B
N/C
VO
RL
VO
0.1 µF
VFF
4
5
GND
-
VCM
+
-
Pulse Gen
VCM 10 V
0V
90%
90%
10%
10%
tr
tf
VO
5V
Switch at A : IF = 0 mA
VO
VOL
Switch at A : IF = 16 mA
Fig. 8 Common Mode Immunity Test Circuit
© 2004 Fairchild Semiconductor Corporation
Page 7 of 12
4/29/04
HIGH SPEED
TRANSISTOR OPTOCOUPLERS
HCPL4503M
Package Dimensions (Through Hole)
Package Dimensions (Surface Mount)
0.390 (9.91)
0.370 (9.40)
PIN 1
ID.
4
3
2
4
3
2
1
0.270 (6.86)
0.250 (6.35)
5
6
7
PIN 1
ID.
1
0.270 (6.86)
0.250 (6.35)
8
5
6
8
7
SEATING PLANE
0.390 (9.91)
0.370 (9.40)
0.020 (0.51)
MIN
0.020 (0.51) MIN
0.200 (5.08)
0.140 (3.55)
0.154 (3.90)
0.120 (3.05)
0.022 (0.56)
0.016 (0.41)
0.016 (0.40)
0.008 (0.20)
0.100 (2.54) TYP
15° MAX
3
2
0.405 (10.30)
MIN
Lead Coplanarity : 0.004 (0.10) MAX
8 - Pin Dip
PIN 1
ID.
1
0.315 (8.00)
MIN
0.100 (2.54)
TYP
0.300 (7.62)
TYP
0.070 (1.78)
0.270 (6.86)
0.250 (6.35)
5
6
7
0.060 (1.52)
8
0.100 (2.54)
0.390 (9.91)
0.370 (9.40)
SEATING PLANE
0.016 (0.41)
0.008 (0.20)
0.045 [1.14]
0.022 (0.56)
0.016 (0.41)
Package Dimensions (0.4"Lead Spacing)
4
0.300 (7.62)
TYP
0.070 (1.78)
0.045 (1.14)
0.070 (1.78)
0.045 (1.14)
0.295 (7.49)
0.415 (10.54)
0.070 (1.78)
0.045 (1.14)
0.030 (0.76)
0.004 (0.10) MIN
0.200 (5.08)
0.140 (3.55)
0.154 (3.90)
0.120 (3.05)
0.022 (0.56)
0.016 (0.41)
0.016 (0.40)
0.008 (0.20)
0.100 (2.54) TYP
0° to 15°
0.400 (10.16)
TYP
NOTE
All dimensions are in inches (millimeters)
© 2004 Fairchild Semiconductor Corporation
Page 8 of 12
4/29/04
HIGH SPEED
TRANSISTOR OPTOCOUPLERS
HCPL4503M
ORDERING INFORMATION
Option
Example Part Number
S
HCPL4503SM
SD
HCPL4503SDM
Description
Surface Mount Lead Bend
Surface Mount; Tape and reel (1,000 units per reel)
T
HCPL4503TM
0.4" Lead Spacing
V
HCPL4503VM
VDE0884 (approval pending)
TV
HCPL4503TVM
VDE0884 (approval pending); 0.4” lead spacing
SV
HCPL4503SVM
VDE0884 (approval pending); surface mount
SDV
HCPL4503SDVM
VDE0884 (approval pending); surface mount; tape and reel
(1,000 units per reel)
MARKING INFORMATION
1
V
3
4503
2
XX YY TB
6
4
5
Definitions
1
Fairchild logo
2
Device number
3
VDE mark (Note: Only appears on parts ordered with VDE
option – See order entry table)
4
Two digit year code, e.g., ‘03’
5
Two digit work week ranging from ‘01’ to ‘53’
6
Assembly package code
© 2004 Fairchild Semiconductor Corporation
Page 9 of 12
4/29/04
HIGH SPEED
TRANSISTOR OPTOCOUPLERS
HCPL4503M
Carrier Tape Specifications
P0
t
K0
P2
D0
E
F
A0
W1
W
B0
d
Description
Tape Width
Tape Thickness
P
User Direction of Feed
D1
Symbol
Dimension in mm
W
16.0 ± 0.3
t
0.30 ± 0.05
Sprocket Hole Pitch
P0
4.0 ± 0.1
Sprocket Hole Diameter
D0
1.55 ± 0.05
Sprocket Hole Location
E
1.75 ± 0.10
F
7.5 ± 0.1
Pocket Location
P2
4.0 ± 0.1
P
12.0 ± 0.1
A0
10.30 ±0.20
Pocket Dimensions
B0
10.30 ±0.20
K0
4.90 ±0.20
Cover Tape Width
W1
1.6 ± 0.1
d
0.1 max
Pocket Pitch
Cover Tape Thickness
Max. Component Rotation or Tilt
Min. Bending Radius
© 2004 Fairchild Semiconductor Corporation
10°
R
Page 10 of 12
30
4/29/04
HIGH SPEED
TRANSISTOR OPTOCOUPLERS
HCPL4503M
Reflow Profile
245 C, 10–30 s
Temperature (°C)
300
260 C peak
250
200
150
Time above 183C, <160 sec
100
50
Ramp up = 2–10C/sec
0
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
Time (Minute)
• Peak reflow temperature: 260 C (package surface temperature)
• Time of temperature higher than 183 C for 160 seconds or less
• One time soldering reflow is recommended
© 2004 Fairchild Semiconductor Corporation
Page 11 of 12
4/29/04
HIGH SPEED
TRANSISTOR OPTOCOUPLERS
HCPL4503M
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO
ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME
ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN;
NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES
OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR
CORPORATION. As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the body, or
(b) support or sustain life, and (c) whose failure to perform
when properly used in accordance with instructions for use
provided in the labeling, can be reasonably expected to
result in a significant injury of the user.
© 2004 Fairchild Semiconductor Corporation
2. A critical component in any component of a life support
device or system whose failure to perform can be
reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
Page 12 of 12
4/29/04
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