Renesas HD64F2398TE20T 16-bit single-chip microcomputer h8s family h8s-2100 sery Datasheet

REJ09B0138-0600H
The revision list can be viewed directly by clicking the title page.
The revision list summarizes the locations of revisions and additions.
Details should always be checked by referring to the relevant text.
16
H8S/2357 Group, H8S/2357F-ZTATTM,
H8S/2398F-ZTATTM
Hardware Manual
Renesas 16-Bit Single-chip Microcomputer
H8S Family / H8S/2300 Series
Rev. 6.00
Revision date: Oct. 28, 2004
www.renesas.com
Keep safety first in your circuit designs!
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and
more reliable, but there is always the possibility that trouble may occur with them. Trouble with
semiconductors may lead to personal injury, fire or property damage.
Remember to give due consideration to safety when making your circuit designs, with appropriate
measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or
(iii) prevention against any malfunction or mishap.
Notes regarding these materials
1. These materials are intended as a reference to assist our customers in the selection of the Renesas
Technology Corp. product best suited to the customer's application; they do not convey any license
under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or
a third party.
2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any thirdparty's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or
circuit application examples contained in these materials.
3. All information contained in these materials, including product data, diagrams, charts, programs and
algorithms represents information on products at the time of publication of these materials, and are
subject to change by Renesas Technology Corp. without notice due to product improvements or
other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or
an authorized Renesas Technology Corp. product distributor for the latest product information before
purchasing a product listed herein.
The information described here may contain technical inaccuracies or typographical errors.
Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising
from these inaccuracies or errors.
Please also pay attention to information published by Renesas Technology Corp. by various means,
including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com).
4. When using any or all of the information contained in these materials, including product data,
diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total
system before making a final decision on the applicability of the information and products. Renesas
Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the
information contained herein.
5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or
system that is used under circumstances in which human life is potentially at stake. Please contact
Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when
considering the use of a product contained herein for any specific purposes, such as apparatus or
systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use.
6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in
whole or in part these materials.
7. If these products or technologies are subject to the Japanese export control restrictions, they must
be exported under a license from the Japanese government and cannot be imported into a country
other than the approved destination.
Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the
country of destination is prohibited.
8. Please contact Renesas Technology Corp. for further details on these materials or the products
contained therein.
General Precautions on Handling of Product
1. Treatment of NC Pins
Note: Do not connect anything to the NC pins.
The NC (not connected) pins are either not connected to any of the internal circuitry or are they are used as test
pins or to reduce noise. If something is connected to the NC pins, the operation of the LSI is not guaranteed.
2. Treatment of Unused Input Pins
Note: Fix all unused input pins to high or low level.
Generally, the input pins of CMOS products are high-impedance input pins. If unused pins are in their open states,
intermediate levels are induced by noise in the vicinity, a pass-through current flows internally, and a malfunction
may occur.
3. Processing before Initialization
Note: When power is first supplied, the product’s state is undefined.
The states of internal circuits are undefined until full power is supplied throughout the chip and a low level is
input on the reset pin. During the period where the states are undefined, the register settings and the output state
of each pin are also undefined. Design your system so that it does not malfunction because of processing while it
is in this undefined state. For those products which have a reset function, reset the LSI immediately after the
power supply has been turned on.
4. Prohibition of Access to Undefined or Reserved Addresses
Note: Access to undefined or reserved addresses is prohibited.
The undefined or reserved addresses may be used to expand functions, or test registers may have been be allocated
to these addresses. Do not access these registers; the system’s operation is not guaranteed if they are accessed.
Preface
This LSI is a single-chip microcomputer with a 32-bit H8S/2000 CPU core, and a set of on-chip peripheral functions
required for system configuration.
This LSI is equipped with ROM, RAM, a bus controller, a data transfer controller (DTC), a programmable pulse generator
(PPG), three types of timers, a serial communication interface (SCI), a D/A converter, an A/D converter, and I/O ports as
on-chip peripheral functions. This LSI is suitable for use as an embedded microcomputer for high-level control systems.
Its on-chip ROM is flash memory (F-ZTAT TM*), PROM (ZTAT*), or masked ROM that provides flexibility as it can be
reprogrammed in no time to cope with all situations from the early stages of mass production to full-scale mass
production. This is particularly applicable to application devices with specifications that will most probably change.
Note: * F-ZTAT is a trademark of Renesas Technology, Corp.
ZTAT is a registered trademark of Renesas Technology, Corp.
Target Users: This manual was written for users who will be using the H8S/2357 Group in the design of application
systems. Members of this audience are expected to understand the fundamentals of electrical circuits,
logical circuits, and microcomputers.
Objective:
This manual was written to explain the hardware functions and electrical characteristics of the H8S/2357
Group to the above audience.
Refer to the H8S/2600 Series, H8S/2000 Series Programming Manual for a detailed description of the
instruction set.
Notes on reading this manual:
• In order to understand the overall functions of the chip
Read the manual according to the contents. This manual can be roughly categorized into parts on the CPU, system
control functions, peripheral functions, and electrical characteristics.
• In order to understand the details of the CPU's functions
Read the H8S/2600 Series, H8S/2000 Series Programming Manual.
• In order to understand the details of a register when its name is known
The addresses, bits, and initial values of the registers are summarized in Appendix B, Internal I/O Register.
Examples:
Bit order:
The MSB is on the left and the LSB is on the right.
Related Manuals:
The latest versions of all related manuals are available from our web site. Please ensure you have the
latest versions of all documents you require.
http://www.renesas.com/eng/
H8S/2357 Group user's manuals:
Manual Title
Document No.
H8S/2357 Group Hardware Manual
This manual
H8S/2600 Series, H8S/2000 Series Programming Manual
REJ09B0139
Rev.6.00 Oct.28.2004 page i of xxiv
REJ09B0138-0600H
User's manuals for development tools:
Manual Title
Document No.
H8S, H8/300 Series C/C++ Compiler, Assembler, Optimized Linkage Editor
User's Manual
REJ10B0058
H8S, H8/300 Series Simulator/Debugger (for Windows) User's Manual
ADE-702-037
H8S, H8/300 Series High-performance Embedded Workshop User's Manual
ADE-702-201
Application Note:
Manual Title
Document No.
H8S Family Technical Q & A
REJ05B0397
Rev.6.00 Oct.28.2004 page ii of xxiv
REJ09B0138-0600H
Main Revisions for This Edition
Item
Page
Revision (See Manual for Details)
1.1 Overview
5
Product lineup
HD64F2398F20T*3 and HD64F2398TE20T*3 added
Table 1-1 Overview
5V version
F-ZTAT
Version*
HD64F2357F20
HD64F2398F20
HD64F2357TE20
HD64F2398TE20
HD64F2398F20T * 3
HD64F2398TE20T* 3
Note 3 added as follows
Note: 3. For the HD64F2398F20T and HD64F2398TE20T only, the
maximum number of times the flash memory can be reprogrammed is
1,000.
4.1.3 Exception Vector Table
72
Description amended
In modes 6 and 7 the on-chip ROM ...In this case, clearing the EAE
bit in BCRL enables the 128-kbyte (256-kbytes)* area comprising
address H’000000 to H’01FFFF (H’03FFFF)* to be used.
6.6.1 When DDS = 1
149
Figure 6-28 DACK Output Timing
when DDS = 1 (Example of DRAM
Access)
Figure 6-28 amended
HWR, (WE)
Write
D15 to D0
6.6.2 When DDS = 0
150
Figure 6-29 DACK Output Timing
when DDS = 0 (Example of DRAM
Access)
Figure 6-29 amended
HWR, (WE)
Write
D15 to D0
6.8.2 Usage Notes
Figure 6-35(a) Example of Idle Cycle
Operation in RAS Down Mode (ICIS1
= 1)
Figure 6-35(b) Example of Idle Cycle
Operation in RAS Down Mode (ICIS0
= 1)
156
Figure 6-35(a) amended
External read
TI
T1
T2
DRAM
T3
TcI
Figure 6-35(b) amended
External read
TI
T1
T2
DRAM
T3
TcI
Rev.6.00 Oct.28.2004 page iii of xxiv
REJ09B0138-0600H
Item
Page
Revision (See Manual for Details)
9.8.2 Register Configuration
303
Note added
Port A MOS Pull-Up Control Register (PAPCR) (ON-Chip ROM
Version Only)
Bit
:
7
6
5
4
3
2
1
0
PA7PCR PA6PCR PA5PCR PA4PCR PA3PCR PA2PCR PA1PCR PA0PCR
Initial value :
R/W
Note:
304
:
0
0
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Setting is prohibited in the H8S/2352, H8S/2394, H8S/2392, and H8S/2390.
Port A Open Drain Control Register (PAODR) (ON-Chip ROM Version
Only)
Bit
:
7
6
5
4
3
2
1
0
PA7ODR PA6ODR PA5ODR PA4ODR PA3ODR PA2ODR PA1ODR PA0ODR
Initial value :
R/W
Note:
9.9.2 Register Configuration (OnChip ROM Version Only)
309
:
0
0
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Setting is prohibited in the H8S/2352, H8S/2394, H8S/2392, and H8S/2390.
Note added
Port B MOS Pull-Up Control Register (PBPCR) (ON-Chip ROM
Version Only)
Bit
:
7
6
5
4
3
2
1
0
PB7PCR PB6PCR PB5PCR PB4PCR PB3PCR PB2PCR PB1PCR PB0PCR
Initial value :
R/W
Note:
9.10.2 Register Configuration (OnChip ROM Version Only)
314
:
0
0
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Setting is prohibited in the H8S/2352, H8S/2394, H8S/2392, and H8S/2390.
Note added
Port C MOS Pull-Up Control Register (PCPCR) (ON-Chip ROM
Version Only)
Bit
:
7
6
5
4
3
2
1
0
PC7PCR PC6PCR PC5PCR PC4PCR PC3PCR PC2PCR PC1PCR PC0PCR
Initial value :
R/W
Note:
9.11.2 Register Configuration (OnChip ROM Version Only)
319
:
0
0
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Setting is prohibited in the H8S/2352, H8S/2394, H8S/2392, and H8S/2390.
Note added
Port D MOS Pull-Up Control Register (PDPCR) (ON-Chip ROM
Version Only)
Bit
:
7
6
5
4
3
2
1
0
PD7PCR PD6PCR PD5PCR PD4PCR PD3PCR PD2PCR PD1PCR PD0PCR
Initial value :
R/W
Note:
Rev.6.00 Oct.28.2004 page iv of xxiv
REJ09B0138-0600H
:
0
0
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Setting is prohibited in the H8S/2352, H8S/2394, H8S/2392, and H8S/2390.
Item
Page
Revision (See Manual for Details)
9.12.2 Register Configuration
324
Note added
Port E MOS Pull-Up Control Register (PEPCR) (ON-Chip ROM
Version Only)
Bit
:
7
6
5
4
3
2
1
0
PE7PCR PE6PCR PE5PCR PE4PCR PE3PCR PE2PCR PE1PCR PE0PCR
Initial value :
R/W
Note:
10.4.5 Cascaded Operation
383
0
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Setting is prohibited in the H8S/2352, H8S/2394, H8S/2392, and H8S/2390.
Figure 10-23 amended
(Before) TCLKB → (After) TCLKD
409
Figure 10-57 Contention between
TCNT Write and Overflow
11.3.1 Overview
0
R/W
(Before) TCLKA → (After) TCLKC
Figure10-23 Example of Cascaded
Operation (2)
10.7 Usage Note
:
Figure 10-57 amended
TCFV flag
423
Prohibited
Figure 11-2 amended
Figure 11-2 PPG Output Operation
DDR
14.2.8 Bit Rate Register (BRR)
481
Note deleted form table 14-4
619
• Reprogramming capability
Table 14-4 BRR Setting for Various
Bit Rates (Clocked Synchronous
Mode)
19.15.1 Features
Description amended
Depending on the product, the maximum number of times the flash
memory can be reprogrammed is either 100 or 1,000.
 Reprogrammable up to 100 times: HD64F2398TE, HD64F2398F
 Reprogrammable up to 1,000 times: HD64F2398TET,
HD64F2398FT
Rev.6.00 Oct.28.2004 page v of xxiv
REJ09B0138-0600H
Item
Page
Revision (See Manual for Details)
19.18.2 Program-Verify Mode
639
Figure 19-48 amended, note *6 added
Figure 19-48 Program/ProgramVerify Flowchart
Write pulse application subroutine
Start of programming
Sub-routine write pulse
Start
Enable WDT
Set SWE bit in FLMCR1
Wait (x) µs
*6
Store 128-byte program data in program
data area and reprogram data area
*4
Set PSU bit in FLMCR1
Wait (y) µs
*6
Perform programming in the erased state.
Do not perform additional programming
on previously programmed addresses.
Set P bit in FLMCR1
n=1
Wait (z1) µs or (z2) µs or (z3) µs
*5*6
m=0
Clear P bit in FLMCR1
Wait (α) µs
Write 128-byte data in RAM reprogram *1
data area consecutively to flash memory
*6
Sub-routine-call
Clear PSU bit in FLMCR1
Wait (β) µs
See note 7 regarding pulse width
switching.
*6
Write pulse
(z1) µs or (z2) µs
*6
Disable WDT
Set PV bit in FLMCR1
Wait (γ) µs
End sub
*6
H'FF dummy write to verify address
Note: 7 Write Pulse Width
Number of Writes (n)
Write Time (z) µs
1
z1
2
z1
3
z1
4
z1
5
z1
6
z1
7
z2
8
z2
9
z2
10
z2
11
z2
12
z2
13
z2
.
.
.
.
.
.
998
z2
999
z2
1000
z2
Increment address
Note: Use a (z3) µs write pulse for additional
programming.
RAM
*6
*2
6≥n?
m=1
NG
OK
Additional program data computation
Transfer additional program data to
additional program data area
*4
Reprogram data computation
*3
Transfer reprogram data to reprogram
data area
*4
128-byte
data verification
completed?
OK
Clear PV bit in FLMCR1
Wait (η) µs
*6
Reprogram data area
(128 bytes)
6≥n?
Additional program data
area (128 bytes)
OK
Sequentially write 128-byte data in
additional program data area in RAM to
flash memory
NG
Write Pulse
(z3 µs additional write pulse)
m = 0?
*1
*6
NG
n ≥ N?
Clear SWE bit in FLMCR1
Clear SWE bit in FLMCR1
Wait (θ) µs
End of programming
724
Table 22-21 title amended
726
Table 22-22 added
Table 22-21 Flash Memory
Characteristics (HD64F2398F20,
HD64F2398TE20)
Table 22-22 Flash Memory
Characteristics (HD64F2398F20T,
HD64F2398TE20T)
Rev.6.00 Oct.28.2004 page vi of xxiv
REJ09B0138-0600H
NG
OK
OK
22.3.6 Flash Memory
Characteristics
n←n+1
NG
Read data = verify
data?
OK
NG
Program data area
(128 bytes)
Wait (ε) µs
Read verify data
*6
Wait (θ) µs
Programming failure
*6
Instruction
1
Advanced R:W NEXT
Advanced R:W 2nd
JSR @@aa:8 Advanced R:W NEXT
JSR @ERn
JSR @aa:24
3
R:W aa:8
4
5
Internal operation, R:W EA
1 state
R:W EA
W:W:M stack (H) W:W stack (L)
Internal operation, R:W EA
W:W:M stack (H) W:W stack (L)
1 state
R:W:M aa:8 R:W aa:8
W:W:M stack (H) W:W stack (L)
2
R:W:M aa:8
R:W EA
6
7
8
9
Table A-6 Instruction Execution
Cycles
JMP @@aa:8 Advanced R:W NEXT
Item
Page
Revision (See Manual for Details)
A.5 Bus States during Instruction
Execution
827
Table A-6 amended
Rev.6.00 Oct.28.2004 page vii of xxiv
REJ09B0138-0600H
Item
Page
Revision (See Manual for Details)
G. Product Code Lineup
1014
Table G-2 amended
Table G-2 H8S/2398, H8S/2394,
H8S/2392, H8S/2390 Group Product
Code Lineup
Product Type
H8S/2398 Masked ROM
F-ZTAT
H. Package Dimensions
Figure H-1 TFP-120 Package
Dimension
Rev.6.00 Oct.28.2004 page viii of xxiv
REJ09B0138-0600H
1015
Figure H-1 replaced
Product Code Mark Code
Package (Package Code)
HD6432398
HD6432398TE*1 120-pin TQFP (TFP-120)
128-pin QFP (FP-128B)
HD6432398F*1
HD64F2398
HD64F2398TE*1 120-pin TQFP (TFP-120)
128-pin QFP (FP-128B)
HD64F2398F*1
HD64F2398TET 120-pin TQFP (TFP-120)
HD64F2398FT
128-pin QFP (FP-128B)
Contents
Section 1 Overview...............................................................................................................................1
1.1
1.2
1.3
Overview....................................................................................................................................................................... 1
Block Diagram..............................................................................................................................................................6
Pin Description ............................................................................................................................................................. 7
1.3.1 Pin Arrangement ............................................................................................................................................. 7
1.3.2 Pin Functions in Each Operating Mode......................................................................................................... 11
1.3.3 Pin Functions................................................................................................................................................. 15
Section 2 CPU.....................................................................................................................................21
2.1
Overview..................................................................................................................................................................... 21
2.1.1 Features ......................................................................................................................................................... 21
2.1.2 Differences between H8S/2600 CPU and H8S/2000 CPU ........................................................................... 22
2.1.3 Differences from H8/300 CPU......................................................................................................................22
2.1.4 Differences from H8/300H CPU................................................................................................................... 23
2.2 CPU Operating Modes ............................................................................................................................................... 23
2.2.1 Advanced Mode............................................................................................................................................. 23
2.3 Address Space............................................................................................................................................................. 26
2.4 Register Configuration ............................................................................................................................................... 27
2.4.1 Overview ....................................................................................................................................................... 27
2.4.2 General Registers........................................................................................................................................... 27
2.4.3 Control Registers........................................................................................................................................... 28
2.4.4 Initial Register Values ................................................................................................................................... 29
2.5 Data Formats............................................................................................................................................................... 30
2.5.1 General Register Data Formats ..................................................................................................................... 30
2.5.2 Memory Data Formats................................................................................................................................... 32
2.6 Instruction Set............................................................................................................................................................. 33
2.6.1 Overview ....................................................................................................................................................... 33
2.6.2 Instructions and Addressing Modes ..............................................................................................................34
2.6.3 Table of Instructions Classified by Function................................................................................................. 35
2.6.4 Basic Instruction Formats..............................................................................................................................41
2.7 Addressing Modes and Effective Address Calculation ..............................................................................................41
2.7.1 Addressing Mode........................................................................................................................................... 41
2.7.2 Effective Address Calculation....................................................................................................................... 44
2.8 Processing States ........................................................................................................................................................47
2.8.1 Overview ....................................................................................................................................................... 47
2.8.2 Reset State ..................................................................................................................................................... 48
2.8.3 Exception-Handling State ............................................................................................................................. 48
2.8.4 Program Execution State ............................................................................................................................... 50
2.8.5 Bus-Released State ........................................................................................................................................50
2.8.6 Power-Down State......................................................................................................................................... 50
2.9 Basic Timing............................................................................................................................................................... 51
2.9.1 Overview ....................................................................................................................................................... 51
2.9.2 On-Chip Memory (ROM, RAM) ..................................................................................................................51
2.9.3 On-Chip Supporting Module Access Timing................................................................................................52
2.9.4 External Address Space Access Timing........................................................................................................53
2.10 Usage Note ................................................................................................................................................................. 53
2.10.1 TAS Instruction ............................................................................................................................................. 53
Rev.6.00 Oct.28.2004 page ix of xxiv
REJ09B0138-0600H
Section 3 MCU Operating Modes ......................................................................................................55
3.1
3.2
3.3
3.4
3.5
Overview..................................................................................................................................................................... 55
3.1.1 Operating Mode Selection (H8S/2357 F-ZTAT Only) ................................................................................. 55
3.1.2 Operating Mode Selection (ZTAT, Masked ROM, ROMless Version, and H8S/2398 F-ZTAT) ............... 56
3.1.3 Register Configuration ..................................................................................................................................57
Register Descriptions..................................................................................................................................................57
3.2.1 Mode Control Register (MDCR)................................................................................................................... 57
3.2.2 System Control Register (SYSCR) ............................................................................................................... 57
3.2.3 System Control Register 2 (SYSCR2) (F-ZTAT Version Only) ..................................................................58
Operating Mode Descriptions..................................................................................................................................... 60
3.3.1 Mode 1........................................................................................................................................................... 60
3.3.2 Mode 2 (H8S/2398 F-ZTAT Only) ............................................................................................................... 60
3.3.3 Mode 3 (H8S/2398 F-ZTAT Only) ............................................................................................................... 60
3.3.4 Mode 4 (On-Chip ROM Disabled Expansion Mode) ................................................................................... 60
3.3.5 Mode 5 (On-Chip ROM Disabled Expansion Mode) ................................................................................... 60
3.3.6 Mode 6 (On-Chip ROM Enabled Expansion Mode)..................................................................................... 60
3.3.7 Mode 7 (Single-Chip Mode) ......................................................................................................................... 61
3.3.8 Modes 8 and 9 ............................................................................................................................................... 61
3.3.9 Mode 10 (H8S/2357 F-ZTAT Only) ............................................................................................................. 61
3.3.10 Mode 11 (H8S/2357 F-ZTAT Only) ............................................................................................................. 61
3.3.11 Modes 12 and 13 (H8S/2357 F-ZTAT Only)................................................................................................61
3.3.12 Mode 14 (H8S/2357 F-ZTAT Only) ............................................................................................................. 61
3.3.13 Mode 15 (H8S/2357 F-ZTAT Only)............................................................................................................. 61
Pin Functions in Each Operating Mode......................................................................................................................62
Memory Map in Each Operating Mode......................................................................................................................62
Section 4 Exception Handling ............................................................................................................71
4.1
4.2
4.3
4.4
4.5
4.6
4.7
Overview..................................................................................................................................................................... 71
4.1.1 Exception Handling Types and Priority ........................................................................................................71
4.1.2 Exception Handling Operation ......................................................................................................................72
4.1.3 Exception Vector Table................................................................................................................................. 72
Reset ........................................................................................................................................................................... 74
4.2.1 Overview ....................................................................................................................................................... 74
4.2.2 Reset Types ................................................................................................................................................... 74
4.2.3 Reset Sequence..............................................................................................................................................75
4.2.4 Interrupts after Reset ..................................................................................................................................... 76
4.2.5 State of On-Chip Supporting Modules after Reset Release ..........................................................................76
Traces ......................................................................................................................................................................... 76
Interrupts..................................................................................................................................................................... 77
Trap Instruction ..........................................................................................................................................................78
Stack Status after Exception Handling ....................................................................................................................... 78
Notes on Use of the Stack........................................................................................................................................... 79
Section 5 Interrupt Controller.............................................................................................................81
5.1
5.2
Overview..................................................................................................................................................................... 81
5.1.1 Features ......................................................................................................................................................... 81
5.1.2 Block Diagram............................................................................................................................................... 82
5.1.3 Pin Configuration ..........................................................................................................................................82
5.1.4 Register Configuration ..................................................................................................................................83
Register Descriptions..................................................................................................................................................83
5.2.1 System Control Register (SYSCR) ............................................................................................................... 83
Rev.6.00 Oct.28.2004 page x of xxiv
REJ09B0138-0600H
5.3
5.4
5.5
5.6
5.2.2 Interrupt Priority Registers A to K (IPRA to IPRK) ..................................................................................... 84
5.2.3 IRQ Enable Register (IER) ........................................................................................................................... 85
5.2.4 IRQ Sense Control Registers H and L (ISCRH, ISCRL)..............................................................................86
5.2.5 IRQ Status Register (ISR) ............................................................................................................................. 86
Interrupt Sources......................................................................................................................................................... 87
5.3.1 External Interrupts......................................................................................................................................... 87
5.3.2 Internal Interrupts ..........................................................................................................................................88
5.3.3 Interrupt Exception Handling Vector Table ..................................................................................................88
Interrupt Operation ..................................................................................................................................................... 91
5.4.1 Interrupt Control Modes and Interrupt Operation ......................................................................................... 91
5.4.2 Interrupt Control Mode 0............................................................................................................................... 93
5.4.3 Interrupt Control Mode 2............................................................................................................................... 95
5.4.4 Interrupt Exception Handling Sequence ....................................................................................................... 97
5.4.5 Interrupt Response Times..............................................................................................................................98
Usage Notes ................................................................................................................................................................99
5.5.1 Contention between Interrupt Generation and Disabling..............................................................................99
5.5.2 Instructions that Disable Interrupts ............................................................................................................... 99
5.5.3 Times when Interrupts are Disabled............................................................................................................100
5.5.4 Interrupts during Execution of EEPMOV Instruction................................................................................. 100
DTC and DMAC Activation by Interrupt................................................................................................................. 100
5.6.1 Overview ..................................................................................................................................................... 100
5.6.2 Block Diagram............................................................................................................................................. 101
5.6.3 Operation ..................................................................................................................................................... 101
5.6.4 Note on Use ................................................................................................................................................. 102
Section 6 Bus Controller...................................................................................................................103
6.1
6.2
6.3
6.4
Overview................................................................................................................................................................... 103
6.1.1 Features ....................................................................................................................................................... 103
6.1.2 Block Diagram............................................................................................................................................. 105
6.1.3 Pin Configuration ........................................................................................................................................106
6.1.4 Register Configuration ................................................................................................................................107
Register Descriptions................................................................................................................................................108
6.2.1 Bus Width Control Register (ABWCR) ......................................................................................................108
6.2.2 Access State Control Register (ASTCR)..................................................................................................... 109
6.2.3 Wait Control Registers H and L (WCRH, WCRL)..................................................................................... 110
6.2.4 Bus Control Register H (BCRH)................................................................................................................. 113
6.2.5 Bus Control Register L (BCRL)..................................................................................................................114
6.2.6 Memory Control Register (MCR) ............................................................................................................... 116
6.2.7 DRAM Control Register (DRAMCR)......................................................................................................... 118
6.2.8 Refresh Timer/Counter (RTCNT) ............................................................................................................... 119
6.2.9 Refresh Time Constant Register (RTCOR)................................................................................................. 120
Overview of Bus Control..........................................................................................................................................121
6.3.1 Area Partitioning ......................................................................................................................................... 121
6.3.2 Bus Specifications ....................................................................................................................................... 122
6.3.3 Memory Interfaces....................................................................................................................................... 123
6.3.4 Advanced Mode........................................................................................................................................... 123
6.3.5 Chip Select Signals ..........................................................................................................................................124
Basic Bus Interface................................................................................................................................................... 125
6.4.1 Overview ..................................................................................................................................................... 125
6.4.2 Data Size and Data Alignment ....................................................................................................................125
6.4.3 Valid Strobes ..............................................................................................................................................127
6.4.4 Basic Timing ............................................................................................................................................... 128
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6.4.5 Wait Control ................................................................................................................................................136
6.5 DRAM Interface....................................................................................................................................................... 138
6.5.1 Overview ..................................................................................................................................................... 138
6.5.2 Setting DRAM Space ..................................................................................................................................138
6.5.3 Address Multiplexing ..................................................................................................................................138
6.5.4 Data Bus ......................................................................................................................................................138
6.5.5 Pins Used for DRAM Interface ................................................................................................................... 139
6.5.6 Basic Timing ............................................................................................................................................... 140
6.5.7 Precharge State Control............................................................................................................................... 141
6.5.8 Wait Control ................................................................................................................................................141
6.5.9 Byte Access Control ....................................................................................................................................143
6.5.10 Burst Operation ........................................................................................................................................... 144
6.5.11 Refresh Control ........................................................................................................................................... 147
6.6 DMAC Single Address Mode and DRAM Interface................................................................................................149
6.6.1 When DDS = 1 ............................................................................................................................................149
6.6.2 When DDS = 0 ............................................................................................................................................150
6.7 Burst ROM Interface ................................................................................................................................................150
6.7.1 Overview ..................................................................................................................................................... 150
6.7.2 Basic Timing ............................................................................................................................................... 151
6.7.3 Wait Control ................................................................................................................................................152
6.8 Idle Cycle..................................................................................................................................................................153
6.8.1 Operation ..................................................................................................................................................... 153
6.8.2 Usage Notes................................................................................................................................................. 155
6.8.3 Pin States in Idle Cycle ............................................................................................................................... 157
6.9 Write Data Buffer Function ......................................................................................................................................158
6.10 Bus Release............................................................................................................................................................... 159
6.10.1 Overview ..................................................................................................................................................... 159
6.10.2 Operation ..................................................................................................................................................... 159
6.10.3 Pin States in External Bus Released State................................................................................................... 160
6.10.4 Transition Timing........................................................................................................................................161
6.10.5 Usage Note ..................................................................................................................................................161
6.11 Bus Arbitration ......................................................................................................................................................... 162
6.11.1 Overview ..................................................................................................................................................... 162
6.11.2 Operation ..................................................................................................................................................... 162
6.11.3 Bus Transfer Timing ................................................................................................................................... 163
6.11.4 External Bus Release Usage Note ............................................................................................................... 163
6.12 Resets and the Bus Controller................................................................................................................................... 164
Section 7 DMA Controller................................................................................................................165
7.1
7.2
7.3
Overview................................................................................................................................................................... 165
7.1.1 Features ....................................................................................................................................................... 165
7.1.2 Block Diagram............................................................................................................................................. 166
7.1.3 Overview of Functions ................................................................................................................................167
7.1.4 Pin Configuration ........................................................................................................................................169
7.1.5 Register Configuration ................................................................................................................................170
Register Descriptions (1) (Short Address Mode) ..................................................................................................... 171
7.2.1 Memory Address Registers (MAR)............................................................................................................. 172
7.2.2 I/O Address Register (IOAR)......................................................................................................................172
7.2.3 Execute Transfer Count Register (ETCR)................................................................................................... 173
7.2.4 DMA Control Register (DMACR)..............................................................................................................174
7.2.5 DMA Band Control Register (DMABCR)..................................................................................................177
Register Descriptions (2) (Full Address Mode) ....................................................................................................... 181
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7.4
7.5
7.6
7.7
7.3.1 Memory Address Register (MAR) ..............................................................................................................181
7.3.2 I/O Address Register (IOAR)......................................................................................................................181
7.3.3 Execute Transfer Count Register (ETCR)................................................................................................... 181
7.3.4 DMA Control Register (DMACR)..............................................................................................................183
7.3.5 DMA Band Control Register (DMABCR)..................................................................................................186
Register Descriptions (3) ..........................................................................................................................................190
7.4.1 DMA Write Enable Register (DMAWER) ................................................................................................. 190
7.4.2 DMA Terminal Control Register (DMATCR)............................................................................................192
7.4.3 Module Stop Control Register (MSTPCR) ................................................................................................. 193
Operation ..................................................................................................................................................................194
7.5.1 Transfer Modes ........................................................................................................................................... 194
7.5.2 Sequential Mode..........................................................................................................................................196
7.5.3 Idle Mode..................................................................................................................................................... 199
7.5.4 Repeat Mode ............................................................................................................................................... 201
7.5.5 Single Address Mode ..................................................................................................................................204
7.5.6 Normal Mode............................................................................................................................................... 207
7.5.7 Block Transfer Mode................................................................................................................................... 210
7.5.8 DMAC Activation Sources ......................................................................................................................... 215
7.5.9 Basic DMAC Bus Cycles ............................................................................................................................217
7.5.10 DMAC Bus Cycles (Dual Address Mode) ..................................................................................................218
7.5.11 DMAC Bus Cycles (Single Address Mode) ............................................................................................... 226
7.5.12 Write Data Buffer Function......................................................................................................................... 230
7.5.13 DMAC Multi-Channel Operation ............................................................................................................... 231
7.5.14 Relation between External Bus Requests, Refresh Cycles, the DTC, and the DMAC ............................... 232
7.5.15 NMI Interrupts and DMAC......................................................................................................................... 233
7.5.16 Forced Termination of DMAC Operation................................................................................................... 234
7.5.17 Clearing Full Address Mode ....................................................................................................................... 235
Interrupts................................................................................................................................................................... 236
Usage Notes ..............................................................................................................................................................237
Section 8 Data Transfer Controller ...................................................................................................241
8.1
8.2
8.3
Overview................................................................................................................................................................... 241
8.1.1 Features ....................................................................................................................................................... 241
8.1.2 Block Diagram............................................................................................................................................. 242
8.1.3 Register Configuration ................................................................................................................................243
Register Descriptions................................................................................................................................................244
8.2.1 DTC Mode Register A (MRA)....................................................................................................................244
8.2.2 DTC Mode Register B (MRB) ....................................................................................................................245
8.2.3 DTC Source Address Register (SAR)......................................................................................................... 246
8.2.4 DTC Destination Address Register (DAR) ................................................................................................. 246
8.2.5 DTC Transfer Count Register A (CRA) ..................................................................................................... 246
8.2.6 DTC Transfer Count Register B (CRB) ......................................................................................................246
8.2.7 DTC Enable Registers (DTCER) ................................................................................................................247
8.2.8 DTC Vector Register (DTVECR) ............................................................................................................... 247
8.2.9 Module Stop Control Register (MSTPCR) ................................................................................................. 248
Operation ..................................................................................................................................................................249
8.3.1 Overview ..................................................................................................................................................... 249
8.3.2 Activation Sources....................................................................................................................................... 251
8.3.3 DTC Vector Table ....................................................................................................................................... 252
8.3.4 Location of Register Information in Address Space ................................................................................... 255
8.3.5 Normal Mode............................................................................................................................................... 256
8.3.6 Repeat Mode ............................................................................................................................................... 257
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8.4
8.5
8.3.7 Block Transfer Mode................................................................................................................................... 258
8.3.8 Chain Transfer............................................................................................................................................. 259
8.3.9 Operation Timing ........................................................................................................................................260
8.3.10 Number of DTC Execution States............................................................................................................... 261
8.3.11 Procedures for Using DTC ..........................................................................................................................262
8.3.12 Examples of Use of the D7TC..................................................................................................................... 262
Interrupts................................................................................................................................................................... 264
Usage Notes ..............................................................................................................................................................264
Section 9 I/O Ports............................................................................................................................265
9.1
9.2
Overview................................................................................................................................................................... 265
Port 1......................................................................................................................................................................... 269
9.2.1 Overview ..................................................................................................................................................... 269
9.2.2 Register Configuration ................................................................................................................................269
9.2.3 Pin Functions............................................................................................................................................... 271
9.3 Port 2......................................................................................................................................................................... 279
9.3.1 Overview ..................................................................................................................................................... 279
9.3.2 Register Configuration ................................................................................................................................279
9.3.3 Pin Functions............................................................................................................................................... 281
9.4 Port 3......................................................................................................................................................................... 289
9.4.1 Overview ..................................................................................................................................................... 289
9.4.2 Register Configuration................................................................................................................................. 289
9.4.3 Pin Functions............................................................................................................................................... 291
9.5 Port 4......................................................................................................................................................................... 293
9.5.1 Overview ..................................................................................................................................................... 293
9.5.2 Register Configuration ................................................................................................................................293
9.5.3 Pin Functions............................................................................................................................................... 293
9.6 Port 5......................................................................................................................................................................... 294
9.6.1 Overview ..................................................................................................................................................... 294
9.6.2 Register Configuration ................................................................................................................................294
9.6.3 Pin Functions............................................................................................................................................... 296
9.7 Port 6......................................................................................................................................................................... 297
9.7.1 Overview ..................................................................................................................................................... 297
9.7.2 Register Configuration ................................................................................................................................297
9.7.3 Pin Functions............................................................................................................................................... 299
9.8 Port A........................................................................................................................................................................301
9.8.1 Overview ..................................................................................................................................................... 301
9.8.2 Register Configuration ................................................................................................................................302
9.8.3 Pin Functions............................................................................................................................................... 304
9.8.4 MOS Input Pull-Up Function (On-Chip ROM Version Only) ................................................................... 306
9.9 Port B ........................................................................................................................................................................307
9.9.1 Overview ..................................................................................................................................................... 307
9.9.2 Register Configuration (On-Chip ROM Version Only)..............................................................................308
9.9.3 Pin Functions............................................................................................................................................... 310
9.9.4 MOS Input Pull-Up Function (On-Chip ROM Version Only) ................................................................... 311
9.10 Port C ........................................................................................................................................................................312
9.10.1 Overview ..................................................................................................................................................... 312
9.10.2 Register Configuration (On-Chip ROM Version Only)..............................................................................313
9.10.3 Pin Functions............................................................................................................................................... 315
9.10.4 MOS Input Pull-Up Function (On-Chip ROM Version Only) ................................................................... 316
9.11 Port D........................................................................................................................................................................317
9.11.1 Overview ..................................................................................................................................................... 317
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9.11.2 Register Configuration (On-Chip ROM Version Only)..............................................................................318
9.11.3 Pin Functions............................................................................................................................................... 320
9.11.4 MOS Input Pull-Up Function (On-Chip ROM Version Only)....................................................................321
9.12 Port E ........................................................................................................................................................................322
9.12.1 Overview ..................................................................................................................................................... 322
9.12.2 Register Configuration ................................................................................................................................323
9.12.3 Pin Functions............................................................................................................................................... 325
9.12.4 MOS Input Pull-Up Function (On-Chip ROM Version Only) ................................................................... 326
9.13 Port F ........................................................................................................................................................................327
9.13.1 Overview ..................................................................................................................................................... 327
9.13.2 Register Configuration ................................................................................................................................328
9.13.3 Pin Functions............................................................................................................................................... 330
9.14 Port G........................................................................................................................................................................332
9.14.1 Overview ..................................................................................................................................................... 332
9.14.2 Register Configuration ................................................................................................................................332
9.14.3 Pin Functions............................................................................................................................................... 335
Section 10 16-Bit Timer Pulse Unit (TPU).......................................................................................337
10.1 Overview................................................................................................................................................................... 337
10.1.1 Features ....................................................................................................................................................... 337
10.1.2 Block Diagram............................................................................................................................................. 341
10.1.3 Pin Configuration ........................................................................................................................................342
10.1.4 Register Configuration ................................................................................................................................343
10.2 Register Descriptions................................................................................................................................................345
10.2.1 Timer Control Register (TCR) ....................................................................................................................345
10.2.2 Timer Mode Register (TMDR) ................................................................................................................... 349
10.2.3 Timer I/O Control Register (TIOR) ............................................................................................................351
10.2.4 Timer Interrupt Enable Register (TIER) ..................................................................................................... 361
10.2.5 Timer Status Register (TSR) ....................................................................................................................... 363
10.2.6 Timer Counter (TCNT) ............................................................................................................................... 366
10.2.7 Timer General Register (TGR) ................................................................................................................... 366
10.2.8 Timer Start Register (TSTR)....................................................................................................................... 366
10.2.9 Timer Synchro Register (TSYR)................................................................................................................. 367
10.2.10 Module Stop Control Register (MSTPCR) ................................................................................................. 368
10.3 Interface to Bus Master............................................................................................................................................. 369
10.3.1 16-Bit Registers........................................................................................................................................... 369
10.3.2 8-Bit Registers............................................................................................................................................. 370
10.4 Operation ..................................................................................................................................................................371
10.4.1 Overview ..................................................................................................................................................... 371
10.4.2 Basic Functions ........................................................................................................................................... 372
10.4.3 Synchronous Operation ............................................................................................................................... 377
10.4.4 Buffer Operation ......................................................................................................................................... 379
10.4.5 Cascaded Operation..................................................................................................................................... 382
10.4.6 PWM Modes ............................................................................................................................................... 383
10.4.7 Phase Counting Mode ................................................................................................................................. 388
10.5 Interrupts................................................................................................................................................................... 394
10.5.1 Interrupt Sources and Priorities................................................................................................................... 394
10.5.2 DTC/DMAC Activation ..............................................................................................................................396
10.5.3 A/D Converter Activation ........................................................................................................................... 396
10.6 Operation Timing ..................................................................................................................................................... 397
10.6.1 Input/Output Timing ................................................................................................................................... 397
10.6.2 Interrupt Signal Timing ............................................................................................................................... 401
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10.7 Usage Notes ..............................................................................................................................................................404
Section 11 Programmable Pulse Generator (PPG) ...........................................................................411
11.1 Overview................................................................................................................................................................... 411
11.1.1 Features ....................................................................................................................................................... 411
11.1.2 Block Diagram............................................................................................................................................. 412
11.1.3 Pin Configuration ........................................................................................................................................413
11.1.4 Registers ......................................................................................................................................................414
11.2 Register Descriptions................................................................................................................................................415
11.2.1 Next Data Enable Registers H and L (NDERH, NDERL)..........................................................................415
11.2.2 Output Data Registers H and L (PODRH, PODRL) ................................................................................... 416
11.2.3 Next Data Registers H and L (NDRH, NDRL)........................................................................................... 416
11.2.4 Notes on NDR Access................................................................................................................................. 416
11.2.5 PPG Output Control Register (PCR)........................................................................................................... 418
11.2.6 PPG Output Mode Register (PMR)............................................................................................................. 419
11.2.7 Port 1 Data Direction Register (P1DDR) ....................................................................................................421
11.2.8 Port 2 Data Direction Register (P2DDR) ....................................................................................................421
11.2.9 Module Stop Control Register (MSTPCR) ................................................................................................. 422
11.3 Operation ..................................................................................................................................................................423
11.3.1 Overview ..................................................................................................................................................... 423
11.3.2 Output Timing ............................................................................................................................................. 424
11.3.3 Normal Pulse Output ................................................................................................................................... 425
11.3.4 Non-Overlapping Pulse Output ................................................................................................................... 426
11.3.5 Inverted Pulse Output ..................................................................................................................................429
11.3.6 Pulse Output Triggered by Input Capture ................................................................................................... 430
11.4 Usage Notes ..............................................................................................................................................................431
Section 12 8-Bit Timers....................................................................................................................433
12.1 Overview................................................................................................................................................................... 433
12.1.1 Features ....................................................................................................................................................... 433
12.1.2 Block Diagram............................................................................................................................................. 434
12.1.3 Pin Configuration ........................................................................................................................................435
12.1.4 Register Configuration ................................................................................................................................435
12.2 Register Descriptions................................................................................................................................................436
12.2.1 Timer Counters 0 and 1 (TCNT0, TCNT1)................................................................................................. 436
12.2.2 Time Constant Registers A0 and A1 (TCORA0, TCORA1) ......................................................................436
12.2.3 Time Constant Registers B0 and B1 (TCORB0, TCORB1)....................................................................... 437
12.2.4 Time Control Registers 0 and 1 (TCR0, TCR1) ......................................................................................... 437
12.2.5 Timer Control/Status Registers 0 and 1 (TCSR0, TCSR1)......................................................................... 439
12.2.6 Module Stop Control Register (MSTPCR) ................................................................................................. 441
12.3 Operation ..................................................................................................................................................................442
12.3.1 TCNT Incrementation Timing..................................................................................................................... 442
12.3.2 Compare Match Timing ..............................................................................................................................443
12.3.3 Timing of External RESET on TCNT......................................................................................................... 444
12.3.4 Timing of Overflow Flag (OVF) Setting..................................................................................................... 444
12.3.5 Operation with Cascaded Connection ......................................................................................................... 445
12.4 Interrupts................................................................................................................................................................... 446
12.4.1 Interrupt Sources and DTC Activation........................................................................................................446
12.4.2 A/D Converter Activation ........................................................................................................................... 446
12.5 Sample Application ..................................................................................................................................................447
12.6 Usage Notes ..............................................................................................................................................................448
12.6.1 Contention between TCNT Write and Clear............................................................................................... 448
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12.6.2
12.6.3
12.6.4
12.6.5
12.6.6
Contention between TCNT Write and Increment ....................................................................................... 449
Contention between TCOR Write and Compare Match ............................................................................. 450
Contention between Compare Matches A and B ........................................................................................450
Switching of Internal Clocks and TCNT Operation................................................................................... 451
Interrupts and Module Stop Mode............................................................................................................... 452
Section 13 Watchdog Timer .............................................................................................................453
13.1 Overview................................................................................................................................................................... 453
13.1.1 Features ....................................................................................................................................................... 453
13.1.2 Block Diagram............................................................................................................................................. 454
13.1.3 Pin Configuration ........................................................................................................................................454
13.1.4 Register Configuration ................................................................................................................................455
13.2 Register Descriptions................................................................................................................................................456
13.2.1 Timer Counter (TCNT) ............................................................................................................................... 456
13.2.2 Timer Control/Status Register (TCSR) ....................................................................................................... 456
13.2.3 Reset Control/Status Register (RSTCSR) ................................................................................................... 457
13.2.4 Notes on Register Access ............................................................................................................................459
13.3 Operation ..................................................................................................................................................................460
13.3.1 Watchdog Timer Operation......................................................................................................................... 460
13.3.2 Interval Timer Operation............................................................................................................................. 461
13.3.3 Timing of Setting Overflow Flag (OVF)..................................................................................................... 461
13.3.4 Timing of Setting of Watchdog Timer Overflow Flag (WOVF) ................................................................462
13.4 Interrupts................................................................................................................................................................... 462
13.5 Usage Notes ..............................................................................................................................................................463
13.5.1 Contention between Timer Counter (TCNT) Write and Increment ............................................................463
13.5.2 Changing Value of CKS2 to CKS0............................................................................................................. 463
13.5.3 Switching between Watchdog Timer Mode and Interval Timer Mode....................................................... 463
13.5.4 System Reset by WDTOVF Signal ............................................................................................................. 463
13.5.5 Internal Reset in Watchdog Timer Mode ....................................................................................................464
Section 14 Serial Communication Interface (SCI) ...........................................................................465
14.1 Overview................................................................................................................................................................... 465
14.1.1 Features ....................................................................................................................................................... 465
14.1.2 Block Diagram............................................................................................................................................. 467
14.1.3 Pin Configuration ........................................................................................................................................467
14.1.4 Register Configuration ................................................................................................................................468
14.2 Register Descriptions................................................................................................................................................469
14.2.1 Receive Shift Register (RSR)......................................................................................................................469
14.2.2 Receive Data Register (RDR) ..................................................................................................................... 469
14.2.3 Transmit Shift Register (TSR)..................................................................................................................... 469
14.2.4 Transmit Data Register (TDR) ....................................................................................................................470
14.2.5 Serial Mode Register (SMR)....................................................................................................................... 470
14.2.6 Serial Control Register (SCR)..................................................................................................................... 472
14.2.7 Serial Status Register (SSR)........................................................................................................................475
14.2.8 Bit Rate Register (BRR)..............................................................................................................................478
14.2.9 Smart Card Mode Register (SCMR) ........................................................................................................... 485
14.2.10 Module Stop Control Register (MSTPCR) ................................................................................................. 486
14.3 Operation ..................................................................................................................................................................487
14.3.1 Overview ..................................................................................................................................................... 487
14.3.2 Operation in Asynchronous Mode............................................................................................................... 489
14.3.3 Multiprocessor Communication Function................................................................................................... 499
14.3.4 Operation in Clocked Synchronous Mode ..................................................................................................505
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14.4 SCI Interrupts ........................................................................................................................................................... 512
14.5 Usage Notes ..............................................................................................................................................................514
Section 15 Smart Card Interface.......................................................................................................517
15.1 Overview................................................................................................................................................................... 517
15.1.1 Features ....................................................................................................................................................... 517
15.1.2 Block Diagram............................................................................................................................................. 518
15.1.3 Pin Configuration ........................................................................................................................................518
15.1.4 Register Configuration ................................................................................................................................519
15.2 Register Descriptions................................................................................................................................................520
15.2.1 Smart Card Mode Register (SCMR) ........................................................................................................... 520
15.2.2 Serial Status Register (SSR)........................................................................................................................521
15.2.3 Serial Mode Register (SMR)....................................................................................................................... 522
15.2.4 Serial Control Register (SCR)..................................................................................................................... 523
15.3 Operation ..................................................................................................................................................................524
15.3.1 Overview ..................................................................................................................................................... 524
15.3.2 Pin Connections........................................................................................................................................... 524
15.3.3 Data Format................................................................................................................................................. 525
15.3.4 Register Settings..........................................................................................................................................526
15.3.5 Clock ........................................................................................................................................................... 527
15.3.6 Data Transfer Operations ............................................................................................................................529
15.3.7 Operation in GSM Mode............................................................................................................................. 534
15.4 Usage Notes ..............................................................................................................................................................535
Section 16 A/D Converter ................................................................................................................539
16.1 Overview................................................................................................................................................................... 539
16.1.1 Features ....................................................................................................................................................... 539
16.1.2 Block Diagram............................................................................................................................................. 540
16.1.3 Pin Configuration ........................................................................................................................................540
16.1.4 Register Configuration ................................................................................................................................541
16.2 Register Descriptions................................................................................................................................................542
16.2.1 A/D Data Registers A to D (ADDRA to ADDRD)..................................................................................... 542
16.2.2 A/D Control/Status Register (ADCSR)....................................................................................................... 542
16.2.3 A/D Control Register (ADCR)....................................................................................................................544
16.2.4 Module Stop Control Register (MSTPCR) ................................................................................................. 545
16.3 Interface to Bus Master............................................................................................................................................. 546
16.4 Operation ..................................................................................................................................................................546
16.4.1 Single Mode (SCAN = 0) ............................................................................................................................546
16.4.2 Scan Mode (SCAN = 1) ..............................................................................................................................548
16.4.3 Input Sampling and A/D Conversion Time................................................................................................. 549
16.4.4 External Trigger Input Timing ....................................................................................................................550
16.5 Interrupts................................................................................................................................................................... 550
16.6 Usage Notes ..............................................................................................................................................................551
Section 17 D/A Converter ................................................................................................................555
17.1 Overview................................................................................................................................................................... 555
17.1.1 Features ....................................................................................................................................................... 555
17.1.2 Block Diagram............................................................................................................................................. 555
17.1.3 Pin Configuration ........................................................................................................................................556
17.1.4 Register Configuration ................................................................................................................................556
17.2 Register Descriptions................................................................................................................................................557
17.2.1 D/A Data Registers 0 and 1 (DADR0, DADR1)......................................................................................... 557
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17.2.2 D/A Control Register (DACR)....................................................................................................................557
17.2.3 Module Stop Control Register (MSTPCR) ................................................................................................. 558
17.3 Operation ..................................................................................................................................................................559
Section 18 RAM................................................................................................................................561
18.1 Overview................................................................................................................................................................... 561
18.1.1 Block Diagram ............................................................................................................................................561
18.1.2 Register Configuration ................................................................................................................................561
18.2 Register Descriptions................................................................................................................................................562
18.2.1 System Control Register (SYSCR) ............................................................................................................. 562
18.3 Operation ..................................................................................................................................................................562
18.4 Usage Note ............................................................................................................................................................... 562
Section 19 ROM................................................................................................................................563
19.1 Overview................................................................................................................................................................... 563
19.1.1 Block Diagram............................................................................................................................................. 563
19.1.2 Register Configuration ................................................................................................................................563
19.2 Register Descriptions................................................................................................................................................564
19.2.1 Mode Control Register (MDCR)................................................................................................................. 564
19.2.2 Bus Control Register L (BCRL)..................................................................................................................564
19.3 Operation ..................................................................................................................................................................565
19.4 PROM Mode (H8S/2357 ZTAT) ............................................................................................................................. 566
19.4.1 PROM Mode Setting................................................................................................................................... 566
19.4.2 Socket Adapter and Memory Map ..............................................................................................................567
19.5 Programming (H8S/2357 ZTAT) ............................................................................................................................. 569
19.5.1 Overview ..................................................................................................................................................... 569
19.5.2 Programming and Verification ....................................................................................................................570
19.5.3 Programming Precautions ........................................................................................................................... 572
19.5.4 Reliability of Programmed Data ................................................................................................................. 573
19.6 Overview of Flash Memory (H8S/2357 F-ZTAT)................................................................................................... 574
19.6.1 Features ....................................................................................................................................................... 574
19.6.2 Block Diagram............................................................................................................................................. 575
19.6.3 Flash Memory Operating Modes................................................................................................................. 576
19.6.4 Pin Configuration ........................................................................................................................................581
19.6.5 Register Configuration ................................................................................................................................581
19.7 Register Descriptions................................................................................................................................................582
19.7.1 Flash Memory Control Register 1 (FLMCR1)............................................................................................582
19.7.2 Flash Memory Control Register 2 (FLMCR2)............................................................................................584
19.7.3 Erase Block Registers 1 and 2 (EBR1, EBR2)............................................................................................585
19.7.4 System Control Register 2 (SYSCR2) ........................................................................................................586
19.7.5 RAM Emulation Register (RAMER) ..........................................................................................................586
19.8 On-Board Programming Modes ............................................................................................................................... 588
19.8.1 Boot Mode................................................................................................................................................... 588
19.8.2 User Program Mode ....................................................................................................................................592
19.9 Programming/Erasing Flash Memory....................................................................................................................... 594
19.9.1 Program Mode............................................................................................................................................. 594
19.9.2 Program-Verify Mode ................................................................................................................................. 594
19.9.3 Erase Mode..................................................................................................................................................596
19.9.4 Erase-Verify Mode ......................................................................................................................................596
19.10 Flash Memory Protection ......................................................................................................................................... 598
19.10.1 Hardware Protection....................................................................................................................................598
19.10.2 Software Protection ..................................................................................................................................... 599
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REJ09B0138-0600H
19.11
19.12
19.13
19.14
19.15
19.16
19.17
19.18
19.19
19.20
19.21
19.22
19.10.3 Error Protection ........................................................................................................................................... 599
Flash Memory Emulation in RAM........................................................................................................................... 601
19.11.1 Emulation in RAM ......................................................................................................................................601
19.11.2 RAM Overlap ..............................................................................................................................................602
Interrupt Handling when Programming/Erasing Flash Memory ..............................................................................603
Flash Memory Programmer Mode ........................................................................................................................... 604
19.13.1 Programmer Mode Setting ..........................................................................................................................604
19.13.2 Socket Adapters and Memory Map............................................................................................................. 604
19.13.3 Programmer Mode Operation......................................................................................................................605
19.13.4 Memory Read Mode....................................................................................................................................606
19.13.5 Auto-Program Mode ................................................................................................................................... 609
19.13.6 Auto-Erase Mode......................................................................................................................................... 611
19.13.7 Status Read Mode........................................................................................................................................612
19.13.8 Status Polling............................................................................................................................................... 613
19.13.9 Programmer Mode Transition Time............................................................................................................613
19.13.10 Notes on Memory Programming ............................................................................................................... 614
Flash Memory Programming and Erasing Precautions ............................................................................................614
Overview of Flash Memory (H8S/2398 F-ZTAT)................................................................................................... 619
19.15.1 Features ....................................................................................................................................................... 619
19.15.2 Overview ..................................................................................................................................................... 620
19.15.3 Flash Memory Operating Modes................................................................................................................. 621
19.15.4 On-Board Programming Modes ..................................................................................................................622
19.15.5 Flash Memory Emulation in RAM..............................................................................................................624
19.15.6 Differences between Boot Mode and User Program Mode......................................................................... 625
19.15.7 Block Configuration ....................................................................................................................................625
19.15.8 Pin Configuration ........................................................................................................................................626
19.15.9 Register Configuration ................................................................................................................................626
Register Descriptions................................................................................................................................................627
19.16.1 Flash Memory Control Register 1 (FLMCR1)............................................................................................627
19.16.2 Flash Memory Control Register 2 (FLMCR2)............................................................................................629
19.16.3 Erase Block Register 1 (EBR1)................................................................................................................... 629
19.16.4 Erase Block Registers 2 (EBR2) ................................................................................................................. 630
19.16.5 System Control Register 2 (SYSCR2) ........................................................................................................630
19.16.6 RAM Emulation Register (RAMER) ..........................................................................................................631
On-Board Programming Modes ............................................................................................................................... 632
19.17.1 Boot Mode................................................................................................................................................... 633
19.17.2 User Program Mode ....................................................................................................................................637
Programming/Erasing Flash Memory....................................................................................................................... 638
19.18.1 Program Mode............................................................................................................................................. 638
19.18.2 Program-Verify Mode ................................................................................................................................. 638
19.18.3 Erase Mode..................................................................................................................................................640
19.18.4 Erase-Verify Mode ......................................................................................................................................640
Flash Memory Protection ......................................................................................................................................... 642
19.19.1 Hardware Protection....................................................................................................................................642
19.19.2 Software Protection ..................................................................................................................................... 643
19.19.3 Error Protection ........................................................................................................................................... 644
Flash Memory Emulation in RAM........................................................................................................................... 645
19.20.1 Emulation in RAM ......................................................................................................................................645
19.20.2 RAM Overlap ..............................................................................................................................................646
Interrupt Handling when Programming/Erasing Flash Memory ..............................................................................647
Flash Memory Programmer Mode ........................................................................................................................... 647
19.22.1 Programmer Mode Setting ..........................................................................................................................647
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REJ09B0138-0600H
19.22.2 Socket Adapters and Memory Map............................................................................................................. 648
19.22.3 Programmer Mode Operation......................................................................................................................650
19.22.4 Memory Read Mode....................................................................................................................................651
19.22.5 Auto-Program Mode ................................................................................................................................... 653
19.22.6 Auto-Erase Mode......................................................................................................................................... 655
19.22.7 Status Read Mode........................................................................................................................................656
19.22.8 Status Polling............................................................................................................................................... 657
19.22.9 Programmer Mode Transition Time............................................................................................................657
19.22.10 Notes on Memory Programming ............................................................................................................... 658
19.23 Flash Memory Programming and Erasing Precautions ............................................................................................658
Section 20 Clock Pulse Generator ....................................................................................................661
20.1 Overview................................................................................................................................................................... 661
20.1.1 Block Diagram............................................................................................................................................. 661
20.1.2 Register Configuration ................................................................................................................................661
20.2 Register Descriptions................................................................................................................................................662
20.2.1 System Clock Control Register (SCKCR) ..................................................................................................662
20.3 Oscillator................................................................................................................................................................... 663
20.3.1 Connecting a Crystal Resonator ..................................................................................................................663
20.3.2 External Clock Input ................................................................................................................................... 664
20.4 Duty Adjustment Circuit........................................................................................................................................... 665
20.5 Medium-Speed Clock Divider..................................................................................................................................665
20.6 Bus Master Clock Selection Circuit ......................................................................................................................... 665
Section 21 Power-Down Modes .......................................................................................................667
21.1 Overview................................................................................................................................................................... 667
21.1.1 Register Configuration ................................................................................................................................668
21.2 Register Descriptions................................................................................................................................................669
21.2.1 Standby Control Register (SBYCR) ........................................................................................................... 669
21.2.2 System Clock Control Register (SCKCR) ..................................................................................................670
21.2.3 Module Stop Control Register (MSTPCR) ................................................................................................. 671
21.3 Medium-Speed Mode ............................................................................................................................................... 672
21.4 Sleep Mode............................................................................................................................................................... 672
21.5 Module Stop Mode ................................................................................................................................................... 673
21.5.1 Module Stop Mode ......................................................................................................................................673
21.5.2 Usage Notes................................................................................................................................................. 674
21.6 Software Standby Mode ........................................................................................................................................... 675
21.6.1 Software Standby Mode ..............................................................................................................................675
21.6.2 Clearing Software Standby Mode ............................................................................................................... 675
21.6.3 Setting Oscillation Stabilization Time after Clearing Software Standby Mode ......................................... 675
21.6.4 Software Standby Mode Application Example ........................................................................................... 676
21.6.5 Usage Notes................................................................................................................................................. 677
21.7 Hardware Standby Mode ..........................................................................................................................................678
21.7.1 Hardware Standby Mode............................................................................................................................. 678
21.7.2 Hardware Standby Mode Timing ................................................................................................................678
21.8 ø Clock Output Disabling Function..........................................................................................................................679
Section 22 Electrical Characteristics.................................................................................................681
22.1 Electrical Characteristics of Masked ROM Version (H8S/2398) and
ROMless Versions (H8S/2394, H8S/2392, and H8S/2390)..................................................................................... 681
22.1.1 Absolute Maximum Ratings........................................................................................................................681
22.1.2 DC Characteristics....................................................................................................................................... 682
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REJ09B0138-0600H
22.2
22.3
22.4
22.5
22.6
22.7
22.8
22.1.3 AC Characteristics....................................................................................................................................... 684
22.1.4 A/D Conversion Characteristics ..................................................................................................................701
22.1.5 D/A Conversion Characteristics ..................................................................................................................702
Usage Note (Internal Voltage Step Down for the H8S/2398, H8S/2394, H8S/2392, and H8S/2390) ................... 702
Electrical Characteristics of H8S/2398 F-ZTAT......................................................................................................703
22.3.1 Absolute Maximum Ratings........................................................................................................................703
22.3.2 DC Characteristics....................................................................................................................................... 704
22.3.3 AC Characteristics....................................................................................................................................... 706
22.3.4 A/D Conversion Characteristics ..................................................................................................................723
22.3.5 D/A Conversion Characteristics ..................................................................................................................724
22.3.6 Flash Memory Characteristics..................................................................................................................... 724
Notes on Use............................................................................................................................................................. 727
Usage Note (Internal Voltage Step Down for the H8S/2398 F-ZTAT) ..................................................................727
Electrical Characteristics of H8S/2357 Masked ROM and ZTAT Versions, and H8S/2352................................... 728
22.6.1 Absolute Maximum Ratings........................................................................................................................728
22.6.2 DC Characteristics....................................................................................................................................... 728
22.6.3 AC Characteristics....................................................................................................................................... 734
22.6.4 A/D Conversion Characteristics ..................................................................................................................753
22.6.5 D/A Convervion Characteristics ................................................................................................................. 754
Electrical Characteristics of H8S/2357 F-ZTAT Version ........................................................................................755
22.7.1 Absolute Maximum Ratings........................................................................................................................755
22.7.2 DC Characteristics....................................................................................................................................... 755
22.7.3 AC Characteristics....................................................................................................................................... 759
22.7.4 A/D Conversion Characteristics ..................................................................................................................764
22.7.5 D/A Conversion Characteristics ..................................................................................................................765
22.7.6 Flash Memory Characteristics..................................................................................................................... 765
Usage Note ............................................................................................................................................................... 768
Appendix A Instruction Set ..............................................................................................................769
A.1
A.2
A.3
A.4
A.5
A.6
Instruction List..........................................................................................................................................................769
Instruction Codes ......................................................................................................................................................792
Operation Code Map................................................................................................................................................. 806
Number of States Required for Instruction Execution ............................................................................................. 810
Bus States during Instruction Execution................................................................................................................... 820
Condition Code Modification................................................................................................................................... 834
Appendix B Internal I/O Register.....................................................................................................839
B.1
B.2
Addresses..................................................................................................................................................................839
Functions................................................................................................................................................................... 847
Appendix C I/O Port Block Diagrams..............................................................................................968
C.1
C.2
C.3
C.4
C.5
C.6
C.7
C.8
C.9
C.10
C.11
Port 1 Block Diagram............................................................................................................................................... 968
Port 2 Block Diagram............................................................................................................................................... 971
Port 3 Block Diagram............................................................................................................................................... 975
Port 4 Block Diagram............................................................................................................................................... 978
Port 5 Block Diagram ..............................................................................................................................................979
Port 6 Block Diagram............................................................................................................................................... 983
Port A Block Diagram ..............................................................................................................................................989
Port B Block Diagram ..............................................................................................................................................992
Port C Block Diagram ..............................................................................................................................................993
Port D Block Diagram ..............................................................................................................................................994
Port E Block Diagram............................................................................................................................................... 995
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REJ09B0138-0600H
C.12 Port F Block Diagram............................................................................................................................................... 996
C.13 Port G Block Diagram ............................................................................................................................................1004
Appendix D Pin States ....................................................................................................................1007
D.1
Port States in Each Mode ....................................................................................................................................... 1007
Appendix E Pin States at Power-On ...............................................................................................1011
E.1
E.2
When Pins Settle from an Indeterminate State at Power-On ................................................................................. 1011
When Pins Settle from the High-Impedance State at Power-On............................................................................1012
Appendix F Timing of Transition to and Recovery from Hardware Standby Mode........................1013
F.1
F.2
Timing of Transition to Hardware Standby Mode ................................................................................................. 1013
Timing of Recovery from Hardware Standby Mode..............................................................................................1013
Appendix G Product Code Lineup..................................................................................................1014
Appendix H Package Dimensions...................................................................................................1015
Rev.6.00 Oct.28.2004 page xxiii of xxiv
REJ09B0138-0600H
Rev.6.00 Oct.28.2004 page xxiv of xxiv
REJ09B0138-0600H
Section 1 Overview
1.1
Overview
The H8S/2357 Group is a series of microcomputers (MCUs: microcomputer units), built around the H8S/2000 CPU,
employing Renesas proprietary architecture, and equipped with peripheral functions on-chip.
The H8S/2000 CPU has an internal 32-bit architecture, is provided with sixteen 16-bit general registers and a concise,
optimized instruction set designed for high-speed operation, and can address a 16-Mbyte linear address space. The
instruction set is upward-compatible with H8/300 and H8/300H CPU instructions at the object-code level, facilitating
migration from the H8/300, H8/300L, or H8/300H Series.
On-chip peripheral functions required for system configuration include DMA controller (DMAC) and data transfer
controller (DTC) bus masters, ROM and RAM memory, a 16-bit timer-pulse unit (TPU), programmable pulse generator
(PPG), 8-bit timer, watchdog timer (WDT), serial communication interface (SCI), A/D converter, D/A converter, and I/O
ports.
Single-power-supply flash memory (F-ZTAT*1), PROM (ZTAT*2), and masked ROM versions are available, providing a
quick and flexible response to conditions from ramp-up through full-scale volume production, even for applications with
frequently changing specifications.
The features of the H8S/2357 Group are shown in table 1-1.
Notes: 1. F-ZTAT is a trademark of Renesas Technology, Corp.
2. ZTAT is a registered trademark of Renesas Technology, Corp.
Rev.6.00 Oct.28.2004 page 1 of 1016
REJ09B0138-0600H
Table 1-1
Overview
Item
Specification
CPU
•
•
•
•
•
General-register machine
 Sixteen 16-bit general registers (also usable as sixteen 8-bit registers
or eight 32-bit registers)
High-speed operation suitable for realtime control
 Maximum clock rate: 20 MHz
 High-speed arithmetic operations
8/16/32-bit register-register add/subtract: 50 ns
16 × 16-bit register-register multiply:
1000 ns
32 ÷ 16-bit register-register divide:
1000 ns
Instruction set suitable for high-speed operation
 Sixty-five basic instructions
 8/16/32-bit move/arithmetic and logic instructions
 Unsigned/signed multiply and divide instructions
 Powerful bit-manipulation instructions
CPU operating modes
 Advanced mode: 16-Mbyte address space
•
Address space divided into 8 areas, with bus specifications settable
independently for each area
Chip select output possible for each area
Choice of 8-bit or 16-bit access space for each area
2-state or 3-state access space can be designated for each area
Number of program wait states can be set for each area
Burst ROM directly connectable
Maximum 8-Mbyte DRAM directly connectable (or use of interval timer
possible)
External bus release function
DMA controller
(DMAC)
•
•
•
•
•
•
Choice of short address mode or full address mode
4 channels in short address mode
2 channels in full address mode
Transfer possible in repeat mode, block transfer mode, etc.
Single address mode transfer possible
Can be activated by internal interrupt
Data transfer
controller (DTC)
•
•
Can be activated by internal interrupt or software
Multiple transfers or multiple types of transfer possible for one activation
source
Transfer possible in repeat mode, block transfer mode, etc.
Request can be sent to CPU for interrupt that activated DTC
Bus controller
•
•
•
•
•
•
•
•
Rev.6.00 Oct.28.2004 page 2 of 1016
REJ09B0138-0600H
Item
Specification
16-bit timer-pulse
unit (TPU)
•
•
•
6-channel 16-bit timer on-chip
Pulse I/O processing capability for up to 16 pins
Automatic 2-phase encoder count capability
Programmable
pulse generator
(PPG)
•
•
•
•
Maximum 16-bit pulse output possible with TPU as time base
Output trigger selectable in 4-bit groups
Non-overlap margin can be set
Direct output or inverse output setting possible
8-bit timer
2 channels
•
•
•
8-bit up-counter (external event count capability)
Two time constant registers
Two-channel connection possible
Watchdog timer
•
Watchdog timer or interval timer selectable
Serial
communication
interface (SCI)
3 channels
•
•
•
Asynchronous mode or synchronous mode selectable
Multiprocessor communication function
Smart card interface function
A/D converter
•
•
•
•
•
•
Resolution: 10 bits
Input: 8 channels
High-speed conversion: 6.7 µs minimum conversion time
(at 20 MHz operation)
Single or scan mode selectable
Sample and hold circuit
A/D conversion can be activated by external trigger or timer trigger
D/A converter
•
•
Resolution: 8 bits
Output: 2 channels
I/O ports
•
87 I/O pins, 8 input-only pins
Memory
•
•
Flash memory, PROM, Masked ROM
High-speed static RAM
Product Name
ROM
RAM
H8S/2357
128 kbytes
8 kbytes
H8S/2352
—
8 kbytes
H8S/2398
256 kbytes
8 kbytes
H8S/2394
—
32 kbytes
H8S/2392
—
8 kbytes
H8S/2390
—
4 kbytes
Rev.6.00 Oct.28.2004 page 3 of 1016
REJ09B0138-0600H
Item
Specification
Interrupt controller
•
•
•
Nine external interrupt pins (NMI, IRQ0 to IRQ7)
52 internal interrupt sources
Eight priority levels settable
Power-down state
•
•
•
•
•
Medium-speed mode
Sleep mode
Module stop mode
Software standby mode
Hardware standby mode
Operating modes
•
Eight MCU operating modes (H8S/2357 F-ZTAT)
External Data Bus
CPU
Operating
Mode Mode
Description
On-Chip Initial
ROM
Value
Maximum
Value
0
—
—
—
—
—
1
2
3
4
5
Advanced On-chip ROM disabled
expansion mode
6
On-chip ROM enabled
expansion mode
7
Single-chip mode
8
—
—
Disabled 16 bits
16 bits
8 bits
16 bits
8 bits
16 bits
—
—
—
—
—
Enabled
8 bits
16 bits
—
—
—
—
—
Enabled
8 bits
16 bits
—
—
Enabled
9
10
Advanced Boot mode
11
12
—
—
13
14
15
Rev.6.00 Oct.28.2004 page 4 of 1016
REJ09B0138-0600H
Advanced User program mode
Item
Operating
modes
Specification
• Four MCU operating modes (H8S/2398 F-ZTAT, masked ROM, ROMless, and
ZTAT)
Mode
0
1
2* 1
3* 1
4* 2
CPU
Operating
Mode
—
Description
—
On-Chip
ROM
—
External Data Bus
Initial
Maximum
Value
Value
—
—
Advanced
On-chip ROM disabled
Disabled 16 bits 16 bits
expansion mode
5* 2
On-chip ROM disabled
Disabled 8 bits
16 bits
expansion mode
6
On-chip ROM enabled
Enabled
8 bits
16 bits
expansion mode
7
Single-chip mode
Enabled
—
—
Notes: 1. In the H8S/2398 F-ZTAT, modes 2 and 3 indicate boot mode. For details
on boot mode of the H8S/2398 F-ZTAT, refer to table 19-35 in section
19.17, On-Board Programming Modes.
In addition, for details on user program mode, refer also to tables 19-35
in section 19.17, On-Board Programming Modes.
2. In ROMless version, only modes 4 and 5 are available.
Clock pulse • On-chip duty correction circuit
generator
• 120-pin plastic TQFP (TFP-120)
Packages
• 128 pin plastic QFP (FP-128B)
Product
5 V version
3.3 V version 3 V version
lineup
Operating
5 V ± 10%
3.0 to 5.5 V
2.7 to 5.5 V
Supply Voltage
Operating
2 to 20 MHz
10 to 20 MHz
2 to 13 MHz
2 to 10 MHz
Frequency
ROMless
HD6412352F20
HD6412394F20
HD6412352F13
HD6412352F10
Version
HD6412352TE20
HD6412394TE20
HD6412352TE13
HD6412352TE10
HD6412392F20
HD6412392TE20
HD6412390F20
HD6412390TE20
Masked ROM
Version* 1
F-ZTAT
Version* 2
HD6432357(A**)F HD6432398(A**)F
HD6432357(A**)TE HD6432398(A**)TE
HD64F2357F20
HD64F2357TE20
HD64F2398F20
HD64F2357VF13
HD64F2398TE20
HD64F2357VTE13
HD64F2398F20T* 3
HD64F2398TE20T* 3
—
ZTAT Version
HD6472357F20
HD6472357TE20
—
HD6472357F10
HD6472357TE10
HD6432357(M**)F HD6432357(K**)F
HD6432357(M**)TE HD6432357(K**)TE
HD6472357F13
HD6472357TE13
Packages
FP-128B
FP-128B
FP-128B
TFP-120
TFP-120
TFP-120
Notes: 1. In masked ROM versions, (**) is the ROM code.
2. See sections 22.3.6 and 22.7.6, Flash Memory Characteristics, for FZTAT version operating supply voltage and temperature range for
programming/erasing.
3. For the HD64F2398F20T and HD64F2398TE20T only, the maximum
number of times the flash memory can be reprogrammed is 1,000.
Rev.6.00 Oct.28.2004 page 5 of 1016
REJ09B0138-0600H
1.2
Block Diagram
Port
C
PC7 / A7
PC6 / A6
PC5 / A5
PC4 / A4
PC3 / A3
PC2 / A2
PC1 / A1
PC0 / A0
Port
3
P35 / SCK1
P34 / SCK0
P33 / RxD1
P32 / RxD0
P31 / TxD1
P30 / TxD0
Port
5
P50 / TxD2
P51 / RxD2
P52 / SCK2
P53 / ADTRG
WDT
Port
G
8-bit timer
SCI
TPU
D/A converter
Port
6
PPG
Port 2
P10 /PO8/TIOCA0/DACK0
P11 /PO9/TIOCB0/DACK1
P12 /PO10/TIOCC0/TCLKA
P13 /PO11/TIOCD0/TCLKB
P14 /PO12/TIOCA1
P15 /PO13/TIOCB1/TCLKC
P16 /PO14/TIOCA2
P17 /PO15/TIOCB2/TCLKD
Port 1
A/D converter
Port 4
P47 /AN7/DA1
P46 /AN6/DA0
P45 /AN5
P44 /AN4
P43 /AN3
P42 /AN2
P41 /AN1
P40 /AN0
P67 / CS7 / IRQ3
P66 / CS6 / IRQ2
P65 / IRQ1
P64 / IRQ0
P63 / TEND1
P62 / DREQ1
P61 / TEND0 / CS5
P60 / DREQ0 / CS4
Port
B
PB7 / A15
PB6 / A14
PB5 / A13
PB4 / A12
PB3 / A11
PB2 / A10
PB1 / A9
PB0 / A8
RAM
Vref
AVCC
AVSS
PG4 / CS0
PG3 / CS1
PG2 / CS2
PG1 / CS3
PG0 / CAS
DMAC
ROM*2
Port
F
P20 /PO0/TIOCA3
P21 /PO1/TIOCB3
P22 /PO2/TIOCC3/TMRI0
P23 /PO3/TIOCD3/TMCI0
P24 /PO4/TIOCA4/TMRI1
P25 /PO5/TIOCB4/TMCI1
P26 /PO6/TIOCA5/TMO0
P27 /PO7/TIOCB5/TMO1
PF7 / ø
PF6 / AS
PF5 / RD
PF4 / HWR
PF3 / LWR
PF2 /LCAS/WAIT/BREQO
PF1 / BACK
PF0 / BREQ
DTC
Peripheral data bus
Interrupt controller
Internal data bus
H8S/2000 CPU
Port
A
PA7 / A23 / IRQ7
PA6 / A22 / IRQ6
PA5 / A21 / IRQ5
PA4 / A20 / IRQ4
PA3 / A19
PA2 / A18
PA1 / A17
PA0 / A16
Peripheral address bus
Port E
Bus controller
PE7 /D7
PE6 /D6
PE5 /D5
PE4 /D4
PE3 /D3
PE2 /D2
PE1 /D1
PE0 /D0
Port D
Internal address bus
Clock pulse
generator
MD2
MD1
MD0
EXTAL
XTAL
STBY
RES
WDTOVF (FWE, VCL)*1
NMI
PD7 /D15
PD6 /D14
PD5 /D13
PD4 /D12
PD3 /D11
PD2 /D10
PD1 /D9
PD0 /D8
VCC
VCC
VCC
VCC
VCC
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
Figure 1-1 shows an internal block diagram of the H8S/2357 Group.
Notes: 1. This pin functions as the WDTOVF pin function in ZTAT, and masked ROM products, and in the H8S/2352.
In the H8S/2357F-ZTAT, the WDTOVF pin function is not available, because this pin is used as the FWE
pin.
In the H8S/2398, H8S/2394, H8S/2392, and H8S/2390, the WDTOVF pin function is not available,
because this pin is used as the VCL pin.
2. In ROMless version, ROM is not supported.
Figure 1-1 Block Diagram
Rev.6.00 Oct.28.2004 page 6 of 1016
REJ09B0138-0600H
1.3
Pin Description
1.3.1
Pin Arrangement
P20 /PO0/TIOCA3
P21 /PO1/TIOCB3
P22 /PO2/TIOCC3/TMRI0
P23 /PO3/TIOCD3/TMCI0
P24 /PO4/TIOCA4/TMRI1
P25 /PO5/TIOCB4/TMCI1
P26 /PO6/TIOCA5/TMO0
P27 /PO7/TIOCB5/TMO1
P63 /TEND1
P62 /DREQ1
P61 /TEND0/CS5
90
89
88
87
86
85
84
83
82
81
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
P51 /RxD2
P50 /TxD2
PF0 /BREQ
PF1 /BACK
PF2 /LCAS/WAIT/BREQO
PF3 /LWR
PF4 /HWR
PF5 /RD
PF6 /AS
VCC
PF7 /ø
VSS
EXTAL
XTAL
VCC
STBY
NMI
RES
WDTOVF (FWE)*
Figures 1-2 and 1-3 show the pin arrangement for the H8S/2357, H8S/2352 and figures 1-4 and
1-5 show the pin arrangements for the H8S/2398, H8S/2394, H8S/2392, and H8S/2390.
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
91
92
93
94
95
96
97
98
99
100
101
102
103
104
105
106
107
108
109
110
111
112
113
114
115
116
117
118
119
120
P60 / DREQ0 / CS4
VSS
P35 / SCK1
P34 / SCK0
P33 / RxD1
P32 / RxD0
P31 / TxD1
P30 / TxD0
VCC
PD7 / D15
PD6 / D14
PD5 / D13
PD4 / D12
VSS
PD3 / D11
PD2 / D10
PD1 / D9
PD0 / D8
PE7 / D7
PE6 / D6
PE5 / D5
PE4 / D4
VSS
PE3 / D3
PE2 / D2
PE1 / D1
PE0 / D0
VCC
P64 / IRQ0
P65 / IRQ1
VCC
PC0 /A0
PC1 /A1
PC2 /A2
PC3 /A3
VSS
PC4 /A4
PC5 /A5
PC6 /A6
PC7 /A7
PB0 /A8
PB1 /A9
PB2 /A10
PB3 /A11
VSS
PB4 /A12
PB5 /A13
PB6 /A14
PB7 /A15
PA0 /A16
PA1 /A17
PA2 /A18
PA3 /A19
VSS
PA4 /A20 /IRQ4
PA5 /A21 /IRQ5
PA6 /A22 /IRQ6
PA7 /A23 /IRQ7
P67 /CS7/IRQ3
P66 /CS6/IRQ2
SCK2 / P52
ADTRG / P53
AVCC
Vref
AN0 / P40
AN1 / P41
AN2 / P42
AN3 / P43
AN4 / P44
AN5 / P45
DA0 / AN6 / P46
DA1 / AN7 / P47
AVSS
VSS
TCLKD / TIOCB2 / PO15 / P17
TIOCA2 / PO14 / P16
TCLKC / TIOCB1 / PO13 / P15
TIOCA1 / PO12 / P14
TCLKB / TIOCD0 / PO11 / P13
TCLKA / TIOCC0 / PO10 / P12
DACK1 / TIOCB0 / PO9 / P11
DACK0 / TIOCA0 / PO8 / P10
MD0
MD1
MD2
CAS / PG0
CS3 / PG1
CS2 / PG2
CS1 / PG3
CS0 / PG4
Note: * This pin has the WDTOVF pin function in the ZTAT, masked ROM, and ROMless
versions. In the F-ZTAT version, the WDTOVF pin function is not available, and
this pin is the FWE pin.
Figure 1-2 H8S/2357, H8S/2352 Pin Arrangement (TFP-120: Top View)
Rev.6.00 Oct.28.2004 page 7 of 1016
REJ09B0138-0600H
P53 /ADTRG
P52 /SCK2
VSS
VSS
P51 /RxD2
P50 /TxD2
PF0 /BREQ
PF1 /BACK
PF2 /LCAS/WAIT/BREQO
PF3 /LWR
PF4 /HWR
PF5 /RD
PF6 /AS
VCC
PF7 /ø
VSS
EXTAL
XTAL
VCC
STBY
NMI
RES
WDTOVF (FWE*)
P20 /PO0/TIOCA3
P21 /PO1/TIOCB3
P22 /PO2/TIOCC3/TMRI0
P23 /PO3/TIOCD3/TMCI0
P24 /PO4/TIOCA4/TMRI1
P25 /PO5/TIOCB4/TMCI1
P26 /PO6/TIOCA5/TMO0
P27 /PO7/TIOCB5/TMO1
P63 /TEND1
P62 /DREQ1
P61 /TEND0/CS5
VSS
VSS
P60 /DREQ0/CS4
VSS
102
101
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
103
104
105
106
107
108
109
110
111
112
113
114
115
116
117
118
119
120
121
122
123
124
125
126
127
128
PG3 /CS1
PG4 /CS0
VSS
NC
VCC
PC0 /A0
PC1 /A1
PC2 /A2
PC3 /A3
VSS
PC4 /A4
PC5 /A5
PC6 /A6
PC7 /A7
PB0 /A8
PB1 /A9
PB2 /A10
PB3 /A11
VSS
PB4 /A12
PB5 /A13
PB6 /A14
PB7 /A15
PA0 /A16
PA1 /A17
PA2 /A18
PA3 /A19
VSS
PA4 /A20 /IRQ4
PA5 /A21 /IRQ5
PA6 /A22 /IRQ6
PA7 /A23 /IRQ7
P67 /CS7/IRQ3
P66 /CS6/IRQ2
VSS
VSS
P65 /IRQ1
P64 /IRQ0
AVCC
Vref
AN0 / P40
AN1 / P41
AN2 / P42
AN3 / P43
AN4 / P44
AN5 / P45
DA0 / AN6 / P46
DA1 / AN7 / P47
AVSS
VSS
TCLKD / TIOCB2 / PO15 / P17
TIOCA2 / PO14 / P16
TCLKC / TIOCB1 / PO13 / P15
TIOCA1 / PO12 / P14
TCLKB / TIOCD0 / PO11 / P13
TCLKA / TIOCC0 / PO10 / P12
DACK1 / TIOCB0 / PO9 / P11
DACK0 / TIOCA0 / PO8 / P10
MD0
MD1
MD2
CAS / PG0
CS3 / PG1
CS2 / PG2
Note: * This pin has the WDTOVF pin function in the ZTAT, masked ROM, and ROMless versions.
In the F-ZTAT version, the WDTOVF pin function is not available, and this pin is the FWE pin.
Figure 1-3 H8S/2357, H8S/2352 Pin Arrangement (FP-128B: Top View)
Rev.6.00 Oct.28.2004 page 8 of 1016
REJ09B0138-0600H
P35 / SCK1
P34 / SCK0
P33 / RxD1
P32 / RxD0
P31 / TxD1
P30 / TxD0
VCC
PD7 / D15
PD6 / D14
PD5 / D13
PD4 / D12
VSS
PD3 / D11
PD2 / D10
PD1 / D9
PD0 / D8
PE7 / D7
PE6 / D6
PE5 / D5
PE4 / D4
VSS
PE3 / D3
PE2 / D2
PE1 / D1
PE0 / D0
VCC
P51 /RxD2
P50 /TxD2
PF0 /BREQ
PF1 /BACK
PF2 /LCAS/WAIT/BREQO
PF3 /LWR
PF4 /HWR
PF5 /RD
PF6 /AS
VCC
PF7 /ø
VSS
EXTAL
XTAL
VCC
STBY
NMI
RES
VCL
P20 /PO0/TIOCA3
P21 /PO1/TIOCB3
P22 /PO2/TIOCC3/TMRI0
P23 /PO3/TIOCD3/TMCI0
P24 /PO4/TIOCA4/TMRI1
P25 /PO5/TIOCB4/TMCI1
P26 /PO6/TIOCA5/TMO0
P27 /PO7/TIOCB5/TMO1
P63 /TEND1
P62 /DREQ1
P61 /TEND0/CS5
90
89
88
87
86
85
84
83
82
81
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
91
92
93
94
95
96
97
98
99
100
101
102
103
104
105
106
107
108
109
110
111
112
113
114
115
116
117
118
119
120
P60 / DREQ0 / CS4
VSS
P35 / SCK1
P34 / SCK0
P33 / RxD1
P32 / RxD0
P31 / TxD1
P30 / TxD0
VCC
PD7 / D15
PD6 / D14
PD5 / D13
PD4 / D12
VSS
PD3 / D11
PD2 / D10
PD1 / D9
PD0 / D8
PE7 / D7
PE6 / D6
PE5 / D5
PE4 / D4
VSS
PE3 / D3
PE2 / D2
PE1 / D1
PE0 / D0
VCC
P64 / IRQ0
P65 / IRQ1
VCC
PC0 /A0
PC1 /A1
PC2 /A2
PC3 /A3
VSS
PC4 /A4
PC5 /A5
PC6 /A6
PC7 /A7
PB0 /A8
PB1 /A9
PB2 /A10
PB3 /A11
VSS
PB4 /A12
PB5 /A13
PB6 /A14
PB7 /A15
PA0 /A16
PA1 /A17
PA2 /A18
PA3 /A19
VSS
PA4 /A20 /IRQ4
PA5 /A21 /IRQ5
PA6 /A22 /IRQ6
PA7 /A23 /IRQ7
P67 /CS7/IRQ3
P66 /CS6/IRQ2
SCK2 / P52
ADTRG / P53
AVCC
Vref
AN0 / P40
AN1 / P41
AN2 / P42
AN3 / P43
AN4 / P44
AN5 / P45
DA0 / AN6 / P46
DA1 / AN7 / P47
AVSS
VSS
TCLKD / TIOCB2 / PO15 / P17
TIOCA2 / PO14 / P16
TCLKC / TIOCB1 / PO13 / P15
TIOCA1 / PO12 / P14
TCLKB / TIOCD0 / PO11 / P13
TCLKA / TIOCC0 / PO10 / P12
DACK1 / TIOCB0 / PO9 / P11
DACK0 / TIOCA0 / PO8 / P10
MD0
MD1
MD2
CAS / PG0
CS3 / PG1
CS2 / PG2
CS1 / PG3
CS0 / PG4
Figure 1-4 H8S/2398, H8S/2394, H8S/2392, H8S/2390 Pin Arrangement (FP-120: Top View)
Rev.6.00 Oct.28.2004 page 9 of 1016
REJ09B0138-0600H
P53 /ADTRG
P52 /SCK2
VSS
VSS
P51 /RxD2
P50 /TxD2
PF0 /BREQ
PF1 /BACK
PF2 /LCAS/WAIT/BREQO
PF3 /LWR
PF4 /HWR
PF5 /RD
PF6 /AS
VCC
PF7 /ø
VSS
EXTAL
XTAL
VCC
STBY
NMI
RES
VCL
P20 /PO0/TIOCA3
P21 /PO1/TIOCB3
P22 /PO2/TIOCC3/TMRI0
P23 /PO3/TIOCD3/TMCI0
P24 /PO4/TIOCA4/TMRI1
P25 /PO5/TIOCB4/TMCI1
P26 /PO6/TIOCA5/TMO0
P27 /PO7/TIOCB5/TMO1
P63 /TEND1
P62 /DREQ1
P61 /TEND0/CS5
VSS
VSS
P60 /DREQ0/CS4
VSS
102
101
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
103
104
105
106
107
108
109
110
111
112
113
114
115
116
117
118
119
120
121
122
123
124
125
126
127
128
PG3 /CS1
PG4 /CS0
VSS
NC
VCC
PC0 /A0
PC1 /A1
PC2 /A2
PC3 /A3
VSS
PC4 /A4
PC5 /A5
PC6 /A6
PC7 /A7
PB0 /A8
PB1 /A9
PB2 /A10
PB3 /A11
VSS
PB4 /A12
PB5 /A13
PB6 /A14
PB7 /A15
PA0 /A16
PA1 /A17
PA2 /A18
PA3 /A19
VSS
PA4 /A20 /IRQ4
PA5 /A21 /IRQ5
PA6 /A22 /IRQ6
PA7 /A23 /IRQ7
P67 /CS7/IRQ3
P66 /CS6/IRQ2
VSS
VSS
P65 /IRQ1
P64 /IRQ0
AVCC
Vref
AN0 / P40
AN1 / P41
AN2 / P42
AN3 / P43
AN4 / P44
AN5 / P45
DA0 / AN6 / P46
DA1 / AN7 / P47
AVSS
VSS
TCLKD / TIOCB2 / PO15 / P17
TIOCA2 / PO14 / P16
TCLKC / TIOCB1 / PO13 / P15
TIOCA1 / PO12 / P14
TCLKB / TIOCD0 / PO11 / P13
TCLKA / TIOCC0 / PO10 / P12
DACK1 / TIOCB0 / PO9 / P11
DACK0 / TIOCA0 / PO8 / P10
MD0
MD1
MD2
CAS / PG0
CS3 / PG1
CS2 / PG2
Figure 1-5 H8S/2398, H8S/2394, H8S/2392, H8S/2390 Pin Arrangement
(FP-128B: Top View)
Rev.6.00 Oct.28.2004 page 10 of 1016
REJ09B0138-0600H
P35 / SCK1
P34 / SCK0
P33 / RxD1
P32 / RxD0
P31 / TxD1
P30 / TxD0
VCC
PD7 / D15
PD6 / D14
PD5 / D13
PD4 / D12
VSS
PD3 / D11
PD2 / D10
PD1 / D9
PD0 / D8
PE7 / D7
PE6 / D6
PE5 / D5
PE4 / D4
VSS
PE3 / D3
PE2 / D2
PE1 / D1
PE0 / D0
VCC
1.3.2
Pin Functions in Each Operating Mode
Table 1-2 shows the pin functions of the H8S/2357 Group in each of the operating modes.
Table 1-2
Pin Functions in Each Operating Mode
Pin No.
Pin Name
Flash Memory
Programmer
Mode
TFP-120
FP-128B
Mode 4*1
Mode 5*1
Mode 6
Mode 7
PROM
Mode
1
5
VCC
VCC
VCC
VCC
VCC
VCC
2
6
A0
A0
PC0/A 0
PC0
A0
A0
3
7
A1
A1
PC1/A 1
PC1
A1
A1
4
8
A2
A2
PC2/A 2
PC2
A2
A2
5
9
A3
A3
PC3/A 3
PC3
A3
A3
6
10
VSS
VSS
VSS
VSS
VSS
VSS
7
11
A4
A4
PC4/A 4
PC4
A4
A4
8
12
A5
A5
PC5/A 5
PC5
A5
A5
9
13
A6
A6
PC6/A 6
PC6
A6
A6
10
14
A7
A7
PC7/A 7
PC7
A7
A7
11
15
A8
A8
PB 0/A 8
PB 0
A8
A8
12
16
A9
A9
PB 1/A 9
PB 1
OE
NC (A9)*3
13
17
A10
A10
PB 2/A 10
PB 2
A10
A10
14
18
A11
A11
PB 3/A 11
PB 3
A11
A11
15
19
VSS
VSS
VSS
VSS
VSS
VSS
16
20
A12
A12
PB 4/A 12
PB 4
A12
A12
17
21
A13
A13
PB 5/A 13
PB 5
A13
A13
18
22
A14
A14
PB 6/A 14
PB 6
A14
A14
19
23
A15
A15
PB 7/A 15
PB 7
A15
A15
20
24
A16
A16
PA 0/A 16
PA 0
A16
A16
21
25
A17
A17
PA 1/A 17
PA 1
VCC
NC (A17)*3
22
26
A18
A18
PA 2/A 18
PA 2
VCC
NC (A18)*3
23
27
A19
A19
PA 3/A 19
PA 3
NC
NC
24
28
VSS
VSS
VSS
VSS
VSS
VSS
25
29
A20
A20
PA 4/A 20 /
IRQ4
PA 4/IRQ4
NC
NC
26
30
PA 5/A 21 /
IRQ5
PA 5/A 21 /
IRQ5
PA 5/A 21 /
IRQ5
PA 5/IRQ5
NC
NC
27
31
PA 6/A 22 /
IRQ6
PA 6/A 22 /
IRQ6
PA 6/A 22 /
IRQ6
PA 6/IRQ6
NC
NC
28
32
PA 7/A 23 /
IRQ7
PA 7/A 23 /
IRQ7
PA 7/A 23 /
IRQ7
PA 7/IRQ7
NC
NC
29
33
P67/IRQ3/
CS7
P67/IRQ3/
CS7
P67/IRQ3/
CS7
P67/IRQ3
NC
NC
30
34
P66/IRQ2/
CS6
P66/IRQ2/
CS6
P66/IRQ2/
CS6
P66/IRQ2
NC
VCC
—
35
VSS
VSS
VSS
VSS
VSS
VSS
—
36
VSS
VSS
VSS
VSS
VSS
VSS
Rev.6.00 Oct.28.2004 page 11 of 1016
REJ09B0138-0600H
Pin No.
Pin Name
Flash
Memory
Programmer
Mode
TFP-120
FP-128B
Mode 4*1
Mode 5*1
Mode 6
Mode 7
PROM
Mode
31
37
P65/IRQ1
P65/IRQ1
P65/IRQ1
P65/IRQ1
NC
VSS
32
38
P64/IRQ0
P64/IRQ0
P64/IRQ0
P64/IRQ0
NC
VSS
33
39
VCC
VCC
VCC
VCC
VCC
VCC
34
40
PE 0/D0
PE 0/D0
PE 0/D0
PE 0
NC
NC
35
41
PE 1/D1
PE 1/D1
PE 1/D1
PE 1
NC
NC
36
42
PE 2/D2
PE 2/D2
PE 2/D2
PE 2
NC
NC
37
43
PE 3/D3
PE 3/D3
PE 3/D3
PE 3
NC
NC
38
44
VSS
VSS
VSS
VSS
VSS
VSS
39
45
PE 4/D4
PE 4/D4
PE 4/D4
PE 4
NC
NC
40
46
PE 5/D5
PE 5/D5
PE 5/D5
PE 5
NC
NC
41
47
PE 6/D6
PE 6/D6
PE 6/D6
PE 6
NC
NC
42
48
PE 7/D7
PE 7/D7
PE 7/D7
PE 7
NC
NC
43
49
D8
D8
D8
PD0
D0
I/O0
44
50
D9
D9
D9
PD1
D1
I/O1
45
51
D10
D10
D10
PD2
D2
I/O2
46
52
D11
D11
D11
PD3
D3
I/O3
47
53
VSS
VSS
VSS
VSS
VSS
VSS
48
54
D12
D12
D12
PD4
D4
I/O4
49
55
D13
D13
D13
PD5
D5
I/O5
50
56
D14
D14
D14
PD6
D6
I/O6
51
57
D15
D15
D15
PD7
D7
I/O7
52
58
VCC
VCC
VCC
VCC
VCC
VCC
53
59
P30/TxD0
P30/TxD0
P30/TxD0
P30/TxD0
NC
NC
54
60
P31/TxD1
P31/TxD1
P31/TxD1
P31/TxD1
NC
NC
55
61
P32/RxD0
P32/RxD0
P32/RxD0
P32/RxD0
NC
NC (VCC)*3
56
62
P33/RxD1
P33/RxD1
P33/RxD1
P33/RxD1
NC
NC
57
63
P34/SCK0
P34/SCK0
P34/SCK0
P34/SCK0
NC
NC
58
64
P35/SCK1
P35/SCK1
P35/SCK1
P35/SCK1
NC
NC
59
65
VSS
VSS
VSS
VSS
VSS
VSS
60
66
P60/ DREQ0/ P60/ DREQ0/ P60/ DREQ0/ P60/DREQ0
CS4
CS4
CS4
NC
NC
—
67
VSS
VSS
VSS
VSS
VSS
VSS
—
68
VSS
VSS
VSS
VSS
VSS
VSS
61
69
P61/TEND0/
CS5
P61/TEND0/
CS5
P61/TEND0/
CS5
P61/TEND0
NC
NC
62
70
P62/DREQ1
P62/DREQ1
P62/DREQ1
P62/DREQ1
NC
NC
63
71
P63/TEND1
P63/TEND1
P63/TEND1
P63/TEND1
NC
NC
64
72
P27/PO7/
TIOCB5/
TMO1
P27/PO7/
TIOCB5/
TMO1
P27/PO7/
TIOCB5/
TMO1
P27/PO7/
TIOCB5/
TMO1
NC
NC
65
73
P26/PO6/
TIOCA5/
TMO0
P26/PO6/
TIOCA5/
TMO0
P26/PO6/
TIOCA5/
TMO0
P26/PO6/
TIOCA5/
TMO0
NC
NC
Rev.6.00 Oct.28.2004 page 12 of 1016
REJ09B0138-0600H
Pin No.
Pin Name
PROM
Mode
Flash
Memory
Programmer
Mode
TFP-120
FP-128B
Mode 4*1
Mode 5*1
Mode 6
Mode 7
66
74
P25/PO5/
TIOCB4/
TMCI 1
P25/PO5/
TIOCB4/
TMCI 1
P25/PO5/
TIOCB4/
TMCI 1
P25/PO5/
TIOCB4/
TMCI 1
NC
VCC (VSS )*3
67
75
P24/PO4/
TIOCA4/
TMRI 1
P24/PO4/
TIOCA4/
TMRI 1
P24/PO4/
TIOCA4/
TMRI 1
P24/PO4/
TIOCA4/
TMRI 1
NC
WE
68
76
P23/PO3/
TIOCD3/
TMCI 0
P23/PO3/
TIOCD3/
TMCI 0
P23/PO3/
TIOCD3/
TMCI 0
P23/PO3/
TIOCD3/
TMCI 0
NC
CE
69
77
P22/PO2/
TIOCC3/
TMRI 0
P22/PO2/
TIOCC3/
TMRI 0
P22/PO2/
TIOCC3/
TMRI 0
P22/PO2/
TIOCC3/
TMRI 0
NC
OE
70
78
P21/PO1/
TIOCB3
P21/PO1/
TIOCB3
P21/PO1/
TIOCB3
P21/PO1/
TIOCB3
NC
NC
71
79
P20/PO0/
TIOCA3
P20/PO0/
TIOCA3
P20/PO0/
TIOCA3
P20/PO0/
TIOCA3
NC
NC
72
80
WDTOVF
(FWE)*2
(VCL)*2
WDTOVF
(FWE)*2
(VCL)*2
WDTOVF
(FWE)*2
(VCL)*2
WDTOVF
(FWE)*2
(VCL)*2
NC
FWE (VCL)*2
73
81
RES
RES
RES
RES
VPP
RES
74
82
NMI
NMI
NMI
NMI
A9
A9 (VCC)*3
75
83
STBY
STBY
STBY
STBY
VSS
VCC
76
84
VCC
VCC
VCC
VCC
VCC
VCC
77
85
XTAL
XTAL
XTAL
XTAL
NC
XTAL
78
86
EXTAL
EXTAL
EXTAL
EXTAL
NC
EXTAL
79
87
VSS
VSS
VSS
VSS
VSS
VSS
80
88
PF7/ø
PF7/ø
PF7/ø
PF7/ø
NC
NC
81
89
VCC
VCC
VCC
VCC
VCC
VCC
82
90
AS
AS
AS
PF6
NC
NC
83
91
RD
RD
RD
PF5
NC
NC
84
92
HWR
HWR
HWR
PF4
NC
NC
85
93
LWR
LWR
LWR
PF3
NC
NC
86
94
PF2/LCAS/
WAIT/
BREQO
PF2/LCAS/
WAIT/
BREQO
PF2/LCAS/
WAIT/
BREQO
PF2
CE
NC
87
95
PF1/BACK
PF1/BACK
PF1/BACK
PF1
PGM
NC
88
96
PF0/BREQ
PF0/BREQ
PF0/BREQ
PF0
NC
NC
89
97
P50/TxD2
P50/TxD2
P50/TxD2
P50/TxD2
NC
NC
90
98
P51/RxD2
P51/RxD2
P51/RxD2
P51/RxD2
NC
VCC (NC)*3
—
99
VSS
VSS
VSS
VSS
VSS
VSS
—
100
VSS
VSS
VSS
VSS
VSS
VSS
91
101
P52/SCK2
P52/SCK2
P52/SCK2
P52/SCK2
NC
NC
92
102
P53/ADTRG
P53/ADTRG
P53/ADTRG
P53/ADTRG
NC
NC
93
103
AV CC
AV CC
AV CC
AV CC
VCC
VCC
94
104
Vref
Vref
Vref
Vref
VCC
VCC
95
105
P40/AN0
P40/AN0
P40/AN0
P40/AN0
NC
NC
96
106
P41/AN1
P41/AN1
P41/AN1
P41/AN1
NC
NC
Rev.6.00 Oct.28.2004 page 13 of 1016
REJ09B0138-0600H
Pin No.
Pin Name
Flash
Memory
Programmer
Mode
TFP-120
FP-128B
Mode 4*1
Mode 5*1
Mode 6
Mode 7
PROM
Mode
97
107
P42/AN2
P42/AN2
P42/AN2
P42/AN2
NC
NC
98
108
P43/AN3
P43/AN3
P43/AN3
P43/AN3
NC
NC
99
109
P44/AN4
P44/AN4
P44/AN4
P44/AN4
NC
NC
100
110
P45/AN5
P45/AN5
P45/AN5
P45/AN5
NC
NC
101
111
P46/AN6/
DA0
P46/AN6/
DA0
P46/AN6/
DA0
P46/AN6/
DA0
NC
NC
102
112
P47/AN7/
DA1
P47/AN7/
DA1
P47/AN7/
DA1
P47/AN7/
DA1
NC
NC
103
113
AV SS
AV SS
AV SS
AV SS
VSS
VSS
104
114
VSS
VSS
VSS
VSS
VSS
VSS
105
115
P17/PO15/
TIOCB2/
TCLKD
P17/PO15/
TIOCB2/
TCLKD
P17/PO15/
TIOCB2/
TCLKD
P17/PO15/
TIOCB2/
TCLKD
NC
NC
106
116
P16/PO14/
TIOCA2
P16/PO14/
TIOCA2
P16/PO14/
TIOCA2
P16/PO14/
TIOCA2
NC
NC
107
117
P15/PO13/
TIOCB1/
TCLKC
P15/PO13/
TIOCB1/
TCLKC
P15/PO13/
TIOCB1/
TCLKC
P15/PO13/
TIOCB1/
TCLKC
NC
NC
108
118
P14/PO12/
TIOCA1
P14/PO12/
TIOCA1
P14/PO12/
TIOCA1
P14/PO12/
TIOCA1
NC
NC
109
119
P13/PO11/
TIOCD0/
TCLKB
P13/PO11/
TIOCD0/
TCLKB
P13/PO11/
TIOCD0/
TCLKB
P13/PO11/
TIOCD0/
TCLKB
NC
NC
110
120
P12/PO10/
TIOCC0/
TCLKA
P12/PO10/
TIOCC0/
TCLKA
P12/PO10/
TIOCC0/
TCLKA
P12/PO10/
TIOCC0/
TCLKA
NC
NC
111
121
P11/PO9/
TIOCB0/
DACK1
P11/PO9/
TIOCB0/
DACK1
P11/PO9/
TIOCB0/
DACK1
P11/PO9/
TIOCB0/
DACK1
NC
NC
112
122
P10/PO8/
TIOCA0/
DACK0
P10/PO8/
TIOCA0/
DACK0
P10/PO8/
TIOCA0/
DACK0
P10/PO8/
TIOCA0/
DACK0
NC
NC
113
123
MD0
MD0
MD0
MD0
VSS
VSS
114
124
MD1
MD1
MD1
MD1
VSS
VSS
115
125
MD2
MD2
MD2
MD2
VSS
VSS
116
126
PG 0/CAS
PG 0/CAS
PG 0/CAS
PG 0
NC
NC
117
127
PG 1/CS3
PG 1/CS3
PG 1/CS3
PG 1
NC
NC
118
128
PG 2/CS2
PG 2/CS2
PG 2/CS2
PG 2
NC
NC
119
1
PG 3/CS1
PG 3/CS1
PG 3/CS1
PG 3
NC
NC
120
2
PG 4/CS0
PG 4/CS0
PG 4/CS0
PG 4
NC
NC
—
3
VSS
VSS
VSS
VSS
VSS
VSS
—
4
NC
NC
NC
NC
NC
NC
Notes: NC pins should be connected to VSS or left open.
1. In ROMless version, only modes 4 and 5 are available.
2. This pin functions as the WDTOVF pin function in ZTAT, and masked ROM products, and in the H8S/2352. In
the H8S/2357F-ZTAT, the WDTOVF pin function is not available, because this pin is used as the FWE pin. In
the H8S/2398, H8S/2394, H8S/2392, and H8S/2390, the WDTOVF pin function is not available, because this
pin is used as the V CL pin.
3. The pin names in parentheses are available other than the H8S/2357 F-ZTAT.
Rev.6.00 Oct.28.2004 page 14 of 1016
REJ09B0138-0600H
1.3.3
Pin Functions
Table 1-3 outlines the pin functions of the H8S/2357 Group.
Table 1-3
Pin Functions
Pin No.
Type
Symbol
TFP-120
FP-128B I/O
Name and Function
Power
VCC
81, 76,
52, 33,
1
89, 84,
58, 39,
5,
Power supply: For connection to the
power supply. All V CC pins should be
connected to the system power
supply.
VSS
104, 79,
59, 47,
38, 24,
15, 6,
114, 100, Input
99, 87,
68, 67,
65, 53,
44, 36,
35, 28,
19, 10,
3
Internal voltage VCL*1
step-down drop
pin
72
80
INPUT Connects an external capacitor
between this pin and the ground pin
(0 V). This pin should never be
connected to VCC.
Clock
XTAL
77
85
Input
Connects to a crystal oscillator.
See section 20, Clock Pulse
Generator, for typical connection
diagrams for a crystal oscillator and
external clock input.
EXTAL
78
86
Input
Connects to a crystal oscillator.
The EXTAL pin can also input an
external clock.
See section 20, Clock Pulse
Generator, for typical connection
diagrams for a crystal oscillator and
external clock input.
ø
80
88
Output System clock: Supplies the system
clock to an external device.
Input
Ground: For connection to ground
(0 V). All VSS pins should be
connected to the system power
supply (0 V).
Rev.6.00 Oct.28.2004 page 15 of 1016
REJ09B0138-0600H
Pin No.
Type
Symbol
Operating mode MD2 to
control
MD0
TFP-120
FP-128B I/O
Name and Function
115 to
113
125 to
123
Mode pins: These pins set the
operating mode.
The relation between the settings of
pins MD2 to MD0 and the operating
mode is shown below. These pins
should not be changed while the
H8S/2357 Group is operating.
Input
MD2
MD1
MD0
Operating
Mode
0
0
0
—
1
—
0
—
1
—
0
Mode 4*
1
Mode 5*
0
Mode 6
1
Mode 7
1
1
0
1
Note: * In ROMless version, only
modes 4 and 5 are available.
System control
Interrupts
RES
73
81
Input
Reset input: When this pin is driven
low, the chip is reset. The type of
reset can be selected according to
the NMI input level. At power-on, the
NMI pin input level should be set
high.
STBY
75
83
Input
Standby: When this pin is driven low,
a transition is made to hardware
standby mode.
BREQ
88
96
Input
Bus request: Used by an external
bus master to issue a bus request to
the H8S/2357 Group.
BREQO
86
94
Output Bus request output: The external
bus request signal used when an
internal bus master accesses
external space in the external busreleased state.
BACK
87
95
Output Bus request acknowledge:
Indicates that the bus has been
released to an external bus master.
FWE* 2
72
80
Input
Flash write enable:
Enables/disables flash memory
programming.
NMI
74
82
Input
Nonmaskable interrupt: Requests a
nonmaskable interrupt. When this pin
is not used, it should be fixed high.
IRQ7 to
IRQ0
32 to 29,
28 to 25
38, 37,
34, 33,
32 to 29
Input
Interrupt request 7 to 0: These pins
request a maskable interrupt.
Rev.6.00 Oct.28.2004 page 16 of 1016
REJ09B0138-0600H
Pin No.
Type
Symbol
TFP-120
FP-128B I/O
Address bus
A23 to
A0
28 to 25,
23 to 16,
14 to 7,
5 to 2
32 to 29,
27 to 20,
18 to 11,
9 to 6
Output Address bus: These pins output an
address.
Data bus
D15 to
D0
51 to 48,
46 to 39,
37 to 34
57 to 54,
52 to 45,
43 to 40
I/O
Bus control
CS7 to
CS0
120 to 117 128, 127, Output Chip select: Signals for selecting
areas 7 to 0.
61, 60,
69, 66,
30, 29
34, 33,
2, 1
AS
82
90
Output Address strobe: When this pin is
low, it indicates that address output
on the address bus is enabled.
RD
83
91
Output Read: When this pin is low, it
indicates that the external address
space can be read.
HWR
84
92
Output High write/write enable:
A strobe signal that writes to external
space and indicates that the upper
half (D15 to D8) of the data bus is
enabled.
The 2CAS type DRAM write enable
signal.
LWR
85
93
Output Low write:
A strobe signal that writes to external
space and indicates that the lower
half (D7 to D0) of the data bus is
enabled.
CAS
116
126
Output Upper column address
strobe/column address strobe:
The 2CAS type DRAM upper column
address strobe signal.
WAIT
86
94
Input
LCAS
86
94
Output Lower column address strobe: The
2-CAS type DRAM lower column
address strobe signal
DREQ1,
DREQ0
62, 60
70, 66
Input
TEND1,
TEND0
63, 61
71, 69
Output DMA transfer end 1 and 0: These
pins indicate the end of DMAC data
transfer.
DACK1,
DACK0
112, 111
122, 121
Output DMA transfer acknowledge 1 and
0: These are the DMAC single
address transfer acknowledge pins.
DMA controller
(DMAC)
Name and Function
Data bus: These pins constitute a
bidirectional data bus.
Wait: Requests insertion of a wait
state in the bus cycle when
accessing external 3-state address
space.
DMA request 1 and 0: These pins
request DMAC activation.
Rev.6.00 Oct.28.2004 page 17 of 1016
REJ09B0138-0600H
Pin No.
Type
Symbol
TFP-120
FP-128B I/O
Name and Function
16-bit timerpulse unit
(TPU)
TCLKD to
TCLKA
110, 109, 120, 119, Input
107, 105 117, 115
Clock input D to A: These pins input
an external clock.
TIOCA0,
TIOCB0,
TIOCC0,
TIOCD0
112 to
109
122 to
119
I/O
Input capture/ output compare
match A0 to D0: The TGR0A to
TGR0D input capture input or output
compare output, or PWM output pins.
TIOCA1,
TIOCB1
108, 107
118, 117
I/O
Input capture/ output compare
match A1 and B1: The TGR1A and
TGR1B input capture input or output
compare output, or PWM output pins.
TIOCA2,
TIOCB2
106, 105
116, 115
I/O
Input capture/ output compare
match A2 and B2: The TGR2A and
TGR2B input capture input or output
compare output, or PWM output pins.
TIOCA3,
TIOCB3,
TIOCC3,
TIOCD3
71 to 68
79 to 76
I/O
Input capture/ output compare
match A3 to D3: The TGR3A to
TGR3D input capture input or output
compare output, or PWM output pins.
TIOCA4,
TIOCB4
67, 66
75, 74
I/O
Input capture/ output compare
match A4 and B4: The TGR4A and
TGR4B input capture input or output
compare output, or PWM output pins.
TIOCA5,
TIOCB5
65, 64
73, 72
I/O
Input capture/ output compare
match A5 and B5: The TGR5A and
TGR5B input capture input or output
compare output, or PWM output pins.
Programmable PO15 to
pulse generator PO0
(PPG)
112 to
105,
71 to 64
122 to
115,
79 to 72
Output Pulse output 15 to 0: Pulse output
pins.
8-bit timer
TMO0,
TMO1
65, 64
73, 72
Output Compare match output: The
compare match output pins.
TMCI0,
TMCI1
68, 66
76, 74
Input
Counter external clock input: Input
pins for the external clock input to the
counter.
TMRI0,
TMRI1
69, 67
77, 75
Input
Counter external reset input: The
counter reset input pins.
Watchdog
timer (WDT)
WDTOVF* 3 72
80
Output Watchdog timer overflows: The
counter overflows signal output pin in
watchdog timer mode.
Serial
communication
interface (SCI)
and Smart Card
interface
TxD2,
TxD1,
TxD0
89, 54,
53
97, 60,
59
Output Transmit data (channel 0, 1, 2):
Data output pins.
RxD2,
RxD1,
RxD0
90, 56,
55
98, 62,
61
Input
Receive data (channel 0, 1, 2):
Data input pins.
SCK2,
SCK1,
SCK0
91, 58,
57
101, 64,
63
I/O
Serial clock (channel 0, 1, 2):
Clock I/O pins.
Rev.6.00 Oct.28.2004 page 18 of 1016
REJ09B0138-0600H
Pin No.
Type
Symbol
TFP-120
FP-128B I/O
Name and Function
A/D converter
AN7 to
AN0
102 to
95
112 to
105
Input
Analog 7 to 0: Analog input pins.
ADTRG
92
102
Input
A/D conversion external trigger
input: Pin for input of an external
trigger to start A/D conversion.
D/A converter
DA1, DA0
102, 101
112, 111
Output Analog output: D/A converter
analog output pins.
A/D converter
and D/A
converter
AVCC
93
103
Input
This is the power supply pin for the
A/D converter and D/A converter.
When the A/D converter and D/A
converter are not used, this pin
should be connected to the system
power supply (+5 V).
AVSS
103
113
Input
This is the ground pin for the A/D
converter and D/A converter.
This pin should be connected to the
system power supply (0 V).
Vref
94
104
Input
This is the reference voltage input pin
for the A/D converter and D/A
converter.
When the A/D converter and D/A
converter are not used, this pin
should be connected to the system
power supply (+5 V).
P17 to
P10
112 to
105
122 to
115
I/O
Port 1: An 8-bit I/O port. Input or
output can be designated for each bit
by means of the port 1 data direction
register (P1DDR).
P27 to
P20
71 to 64
79 to 72
I/O
Port 2: An 8-bit I/O port. Input or
output can be designated for each bit
by means of the port 2 data direction
register (P2DDR).
P35 to
P30
58 to 53
64 to 59
I/O
Port 3: A 6-bit I/O port. Input or
output can be designated for each bit
by means of the port 3 data direction
register (P3DDR).
P47 to
P40
102 to
95
112 to
105
Input
Port 4: An 8-bit input port.
P53 to
P50
92 to 89
102, 101, I/O
98, 97
Port 5: A 4-bit I/O port. Input or
output can be designated for each bit
by means of the port 5 data direction
register (P5DDR).
P67 to
P60
63 to 60,
32 to 29
71 to 69, I/O
66, 38, 37,
34, 33
Port 6: An 8-bit I/O port. Input or
output can be designated for each bit
by means of the port 6 data direction
register (P6DDR).
PA7 to
PA0
28 to 25,
23 to 20
32 to 29,
27 to 24
Port A: An 8-bit I/O port. Input or
output can be designated for each bit
by means of the port A data direction
register (PADDR).
I/O ports
I/O
Rev.6.00 Oct.28.2004 page 19 of 1016
REJ09B0138-0600H
Pin No.
Notes: 1.
2.
3.
4.
Type
Symbol
TFP-120
FP-128B I/O
Name and Function
I/O ports
PB7 to
PB0
19 to 16,
14 to 11
23 to 20,
18 to 15
I/O
Port B* 4: An 8-bit I/O port. Input or
output can be designated for each bit
by means of the port B data direction
register (PBDDR).
PC 7 to
PC 0
10 to 7,
5 to 2
14 to 11,
9 to 6
I/O
Port C* 4: An 8-bit I/O port. Input or
output can be designated for each bit
by means of the port C data direction
register (PCDDR).
PD 7 to
PD 0
51 to 48,
46 to 43
57 to 54,
52 to 49
I/O
Port D* 4: An 8-bit I/O port. Input or
output can be designated for each bit
by means of the port D data direction
register (PDDDR).
PE7 to
PE0
42 to 39,
37 to 34
48 to 45,
43 to 40
I/O
Port E: An 8-bit I/O port. Input or
output can be designated for each bit
by means of the port E data direction
register (PEDDR).
PF 7 to
PF 0
88 to 82,
80
96 to 90,
88
I/O
Port F: An 8-bit I/O port. Input or
output can be designated for each bit
by means of the port F data direction
register (PFDDR).
PG4 to
PG0
120 to
116
128 to
126,
2, 1
I/O
Port G: A 5-bit I/O port. Input or
output can be designated for each bit
by means of the port G data direction
register (PGDDR).
Applies to the H8S/2398, H8S/2394, H8S/2392, and H8S/2390 only.
Applies to the H8S/2357F-ZTAT only.
Not available in the F-ZTAT version, H8S/2398, H8S/2394, H8S/2392, H8S/2390.
Applies to the on-chip ROM version only.
Rev.6.00 Oct.28.2004 page 20 of 1016
REJ09B0138-0600H
Section 2 CPU
2.1
Overview
The H8S/2000 CPU is a high-speed central processing unit with an internal 32-bit architecture that is upward-compatible
with the H8/300 and H8/300H CPUs. The H8S/2000 CPU has sixteen 16-bit general registers, can address a 16-Mbyte
(architecturally 4-Gbyte) linear address space, and is ideal for realtime control.
2.1.1
Features
The H8S/2000 CPU has the following features.
• Upward-compatible with H8/300 and H8/300H CPUs
 Can execute H8/300 and H8/300H object programs
• General-register architecture
 Sixteen 16-bit general registers (also usable as sixteen 8-bit registers or eight 32-bit registers)
• Sixty-five basic instructions
 8/16/32-bit arithmetic and logic instructions
 Multiply and divide instructions
 Powerful bit-manipulation instructions
• Eight addressing modes
 Register direct [Rn]
 Register indirect [@ERn]
 Register indirect with displacement [@(d:16,ERn) or @(d:32,ERn)]
 Register indirect with post-increment or pre-decrement [@ERn+ or @–ERn]
 Absolute address [@aa:8, @aa:16, @aa:24, or @aa:32]
 Immediate [#xx:8, #xx:16, or #xx:32]
 Program-counter relative [@(d:8,PC) or @(d:16,PC)]
 Memory indirect [@@aa:8]
• 16-Mbyte address space
 Program: 16 Mbytes
 Data:
16 Mbytes (architecturally 4-Gbyte)
• High-speed operation
 All frequently-used instructions execute in one or two states
 Maximum clock rate
: 20 MHz
 8/16/32-bit register-register add/subtract : 50 ns
 8 × 8-bit register-register multiply
: 600 ns
 16 ÷ 8-bit register-register divide
: 600 ns
 16 × 16-bit register-register multiply
: 1000 ns
 32 ÷ 16-bit register-register divide
: 1000 ns
• CPU operating mode
 Advanced mode
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• Power-down state
 Transition to power-down state by SLEEP instruction
 CPU clock speed selection
2.1.2
Differences between H8S/2600 CPU and H8S/2000 CPU
The differences between the H8S/2600 CPU and the H8S/2000 CPU are as shown below.
• Register configuration
The MAC register is supported only by the H8S/2600 CPU.
• Basic instructions
The four instructions MAC, CLRMAC, LDMAC, and STMAC are supported only by the H8S/2600 CPU.
• Number of execution states
The number of exection states of the MULXU and MULXS instructions.
Internal Operation
Instruction
Mnemonic
H8S/2600
H8S/2000
MULXU
MULXU.B Rs, Rd
3
12
MULXU.W Rs, ERd
4
20
MULXS.B Rs, Rd
4
13
MULXS.W Rs, ERd
5
21
MULXS
There are also differences in the address space, CCR and EXR functions, power-down state, etc., depending on the
product.
2.1.3
Differences from H8/300 CPU
In comparison to the H8/300 CPU, the H8S/2000 CPU has the following enhancements.
• More general registers and control registers
 Eight 16-bit expanded registers, and one 8-bit control register, have been added.
• Expanded address space
 Advanced mode supports a maximum 16-Mbyte address space.
• Enhanced addressing
 The addressing modes have been enhanced to make effective use of the 16-Mbyte address space.
• Enhanced instructions
 Addressing modes of bit-manipulation instructions have been enhanced.
 Signed multiply and divide instructions have been added.
 2-bit shift instructions have been added.
 Instructions for saving and restoring multiple registers have been added.
 A test and set instruction has been added.
• Higher speed
 Basic instructions execute twice as fast.
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2.1.4
Differences from H8/300H CPU
In comparison to the H8/300H CPU, the H8S/2000 CPU has the following enhancements.
• Additional control register
 One 8-bit control register has been added.
• Enhanced instructions
 Addressing modes of bit-manipulation instructions have been enhanced.
 Two-bit shift instructions have been added.
 Instructions for saving and restoring multiple registers have been added.
 A test and set instruction has been added.
• Higher speed
 Basic instructions execute twice as fast.
2.2
CPU Operating Modes
The H8S/2357 Group CPU has advanced operating mode. Advanced mode supports a maximum 16-Mbyte total address
space (architecturally a maximum 16-Mbyte program area and a maximum of 4 Gbytes for program and data areas
combined). The mode is selected by the mode pins of the microcontroller.
2.2.1
Advanced Mode
Address Space: Linear access is provided to a 16-Mbyte maximum address space (architecturally a maximum 16-Mbyte
program area and a maximum 4-Gbyte data area, with a maximum of 4 Gbytes for program and data areas combined).
Extended Registers (En): The extended registers (E0 to E7) can be used as 16-bit registers, or as the upper 16-bit
segments of 32-bit registers or address registers.
Instruction Set: All instructions and addressing modes can be used.
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Exception Vector Table and Memory Indirect Branch Addresses: In advanced mode the top area starting at
H'00000000 is allocated to the exception vector table in units of 32 bits. In each 32 bits, the upper 8 bits are ignored and a
branch address is stored in the lower 24 bits (figure 2-1). For details of the exception vector table, see section 4, Exception
Handling.
H'00000000
Reserved
Power-on reset exception vector
H'00000003
H'00000004
Reserved
Manual reset exception vector*
H'00000007
H'00000008
Exception vector table
H'0000000B
(Reserved for system use)
H'0000000C
H'00000010
Reserved
Exception vector 1
Note: * Manual reset is only supported in the H8S/2357 ZTAT.
Figure 2-1 Exception Vector Table (Advanced Mode)
The memory indirect addressing mode (@@aa:8) employed in the JMP and JSR instructions uses an 8-bit absolute
address included in the instruction code to specify a memory operand that contains a branch address. In advanced mode
the operand is a 32-bit longword operand, providing a 32-bit branch address. The upper 8 bits of these 32 bits are a
reserved area that is regarded as H'00. Branch addresses can be stored in the area from H'00000000 to H'000000FF. Note
that the first part of this range is also the exception vector table.
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Stack Structure: In advanced mode, when the program counter (PC) is pushed onto the stack in a subroutine call, and the
PC, condition-code register (CCR), and extended control register (EXR) are pushed onto the stack in exception handling,
they are stored as shown in figure 2-2. When EXR is invalid, it is not pushed onto the stack. For details, see section 4,
Exception Handling.
EXR*1
Reserved*1*3
CCR
SP
SP
Reserved
PC
(24 bits)
(a) Subroutine Branch
*2
(SP
)
PC
(24 bits)
(b) Exception Handling
Notes: 1. When EXR is not used it is not stored on the stack.
2. SP when EXR is not used.
3. Ignored when returning.
Figure 2-2 Stack Structure in Advanced Mode
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2.3
Address Space
Figure 2-3 shows a memory map of the H8S/2000 CPU. The H8S/2000 CPU provides linear access to a maximum 16Mbyte (architecturally 4-Gbyte) address space in advanced mode.
H'00000000
Program area
H'00FFFFFF
Data area
Cannot be
used by the
H8S/2357
Group
H'FFFFFFFF
Advanced Mode
Figure 2-3 Memory Map
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2.4
Register Configuration
2.4.1
Overview
The CPU has the internal registers shown in figure 2-4. There are two types of registers: general registers and control
registers.
General Registers (Rn) and Extended Registers (En)
15
07
07
0
ER0
E0
R0H
R0L
ER1
E1
R1H
R1L
ER2
E2
R2H
R2L
ER3
E3
R3H
R3L
ER4
E4
R4H
R4L
ER5
E5
R5H
R5L
ER6
E6
R6H
R6L
ER7 (SP)
E7
R7H
R7L
Control Registers (CR)
23
0
PC
7 6 5 4 3 2 1 0
EXR T — — — — I2 I1 I0
7 6 5 4 3 2 1 0
CCR I UI H U N Z V C
Legend:
SP:
Stack pointer
PC:
Program counter
EXR:
Extended control register
T:
Trace bit
I2 to I0: Interrupt mask bits
CCR:
Condition-code register
I:
Interrupt mask bit
UI:
User bit or interrupt mask bit*
H:
U:
N:
Z:
V:
C:
Half-carry flag
User bit
Negative flag
Zero flag
Overflow flag
Carry flag
Note: * In the H8S/2357 Group, this bit cannot be used as an interrupt mask.
Figure 2-4 CPU Registers
2.4.2
General Registers
The CPU has eight 32-bit general registers. These general registers are all functionally alike and can be used as both
address registers and data registers. When a general register is used as a data register, it can be accessed as a 32-bit, 16-bit,
or 8-bit register. When the general registers are used as 32-bit registers or address registers, they are designated by the
letters ER (ER0 to ER7).
The ER registers divide into 16-bit general registers designated by the letters E (E0 to E7) and R (R0 to R7). These
registers are functionally equivalent, providing a maximum sixteen 16-bit registers. The E registers (E0 to E7) are also
referred to as extended registers.
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The R registers divide into 8-bit general registers designated by the letters RH (R0H to R7H) and RL (R0L to R7L). These
registers are functionally equivalent, providing a maximum sixteen 8-bit registers.
Figure 2-5 illustrates the usage of the general registers. The usage of each register can be selected independently.
• Address registers
• 32-bit registers
• 16-bit registers
• 8-bit registers
E registers (extended registers)
(E0 to E7)
RH registers
(R0H to R7H)
ER registers
(ER0 to ER7)
R registers
(R0 to R7)
RL registers
(R0L to R7L)
Figure 2-5 Usage of General Registers
General register ER7 has the function of stack pointer (SP) in addition to its general-register function, and is used
implicitly in exception handling and subroutine calls. Figure 2-6 shows the stack.
Free area
SP (ER7)
Stack area
Figure 2-6 Stack
2.4.3
Control Registers
The control registers are the 24-bit program counter (PC), 8-bit extended control register (EXR), and 8-bit condition-code
register (CCR).
(1) Program Counter (PC): This 24-bit counter indicates the address of the next instruction the CPU will execute. The
length of all CPU instructions is 2 bytes (one word), so the least significant PC bit is ignored. (When an instruction is
fetched, the least significant PC bit is regarded as 0.)
(2) Extended Control Register (EXR): This 8-bit register contains the trace bit (T) and three interrupt mask bits (I2 to
I0).
Bit 7—Trace Bit (T): Selects trace mode. When this bit is cleared to 0, instructions are executed in sequence. When this
bit is set to 1, a trace exception is generated each time an instruction is executed.
Bits 6 to 3—Reserved: These bits are reserved. They are always read as 1.
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Bits 2 to 0—Interrupt Mask Bits (I2 to I0): These bits designate the interrupt mask level (0 to 7). For details, refer to
section 5, Interrupt Controller.
Operations can be performed on the EXR bits by the LDC, STC, ANDC, ORC, and XORC instructions. All interrupts,
including NMI, are disabled for three states after one of these instructions is executed, except for STC.
(3) Condition-Code Register (CCR): This 8-bit register contains internal CPU status information, including an interrupt
mask bit (I) and half-carry (H), negative (N), zero (Z), overflow (V), and carry (C) flags.
Bit 7—Interrupt Mask Bit (I): Masks interrupts other than NMI when set to 1. (NMI is accepted regardless of the I bit
setting.) The I bit is set to 1 by hardware at the start of an exception-handling sequence. For details, refer to section 5,
Interrupt Controller.
Bit 6—User Bit or Interrupt Mask Bit (UI): Can be written and read by software using the LDC, STC, ANDC, ORC,
and XORC instructions. With the H8S/2357 Group, this bit cannot be used as an interrupt mask bit.
Bit 5—Half-Carry Flag (H): When the ADD.B, ADDX.B, SUB.B, SUBX.B, CMP.B, or NEG.B instruction is executed,
this flag is set to 1 if there is a carry or borrow at bit 3, and cleared to 0 otherwise. When the ADD.W, SUB.W, CMP.W,
or NEG.W instruction is executed, the H flag is set to 1 if there is a carry or borrow at bit 11, and cleared to 0 otherwise.
When the ADD.L, SUB.L, CMP.L, or NEG.L instruction is executed, the H flag is set to 1 if there is a carry or borrow at
bit 27, and cleared to 0 otherwise.
Bit 4—User Bit (U): Can be written and read by software using the LDC, STC, ANDC, ORC, and XORC instructions.
Bit 3—Negative Flag (N): Stores the value of the most significant bit (sign bit) of data.
Bit 2—Zero Flag (Z): Set to 1 to indicate zero data, and cleared to 0 to indicate non-zero data.
Bit 1—Overflow Flag (V): Set to 1 when an arithmetic overflow occurs, and cleared to 0 at other times.
Bit 0—Carry Flag (C): Set to 1 when a carry occurs, and cleared to 0 otherwise. Used by:
• Add instructions, to indicate a carry
• Subtract instructions, to indicate a borrow
• Shift and rotate instructions, to store the value shifted out of the end bit
The carry flag is also used as a bit accumulator by bit manipulation instructions.
Some instructions leave some or all of the flag bits unchanged. For the action of each instruction on the flag bits, refer to
Appendix A.1, Instruction List.
Operations can be performed on the CCR bits by the LDC, STC, ANDC, ORC, and XORC instructions. The N, Z, V, and
C flags are used as branching conditions for conditional branch (Bcc) instructions.
2.4.4
Initial Register Values
Reset exception handling loads the CPU's program counter (PC) from the vector table, clears the trace bit in EXR to 0, and
sets the interrupt mask bits in CCR and EXR to 1. The other CCR bits and the general registers are not initialized. In
particular, the stack pointer (ER7) is not initialized. The stack pointer should therefore be initialized by an MOV.L
instruction executed immediately after a reset.
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2.5
Data Formats
The CPU can process 1-bit, 4-bit (BCD), 8-bit (byte), 16-bit (word), and 32-bit (longword) data. Bit-manipulation
instructions operate on 1-bit data by accessing bit n (n = 0, 1, 2, …, 7) of byte operand data. The DAA and DAS decimaladjust instructions treat byte data as two digits of 4-bit BCD data.
2.5.1
General Register Data Formats
Figure 2-7 shows the data formats in general registers.
Data Type
Register Number
Data Format
1-bit data
RnH
7
0
7 6 5 4 3 2 1 0
Don’t care
Don’t care
7
0
7 6 5 4 3 2 1 0
1-bit data
RnL
RnH
4-bit BCD data
4 3
7
Upper
4-bit BCD data
0
Lower
Don’t care
RnL
Byte data
RnH
4 3
7
Upper
Don’t care
7
0
Lower
0
Don’t care
MSB
Byte data
LSB
RnL
7
0
Don’t care
MSB
Figure 2-7 General Register Data Formats
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LSB
Data Type
Register Number
Word data
Rn
Data Format
15
0
MSB
Word data
En
15
0
MSB
Longword data
LSB
ERn
31
MSB
LSB
16 15
En
0
LSB
Rn
Legend:
ERn: General register ER
En:
General register E
Rn:
General register R
RnH: General register RH
RnL: General register RL
MSB: Most significant bit
LSB: Least significant bit
Figure 2-7 General Register Data Formats (cont)
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2.5.2
Memory Data Formats
Figure 2-8 shows the data formats in memory. The CPU can access word data and longword data in memory, but word or
longword data must begin at an even address. If an attempt is made to access word or longword data at an odd address, no
address error occurs but the least significant bit of the address is regarded as 0, so the access starts at the preceding
address. This also applies to instruction fetches.
Data Type
Data Format
Address
7
1-bit data
Address L
Byte data
Address L MSB
Word data
7
0
6
5
4
2
1
0
LSB
Address 2M MSB
Address 2M + 1
Longword data
3
LSB
Address 2N MSB
Address 2N + 1
Address 2N + 2
Address 2N + 3
LSB
Figure 2-8 Memory Data Formats
When ER7 is used as an address register to access the stack, the operand size should be word size or longword size.
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2.6
Instruction Set
2.6.1
Overview
The H8S/2000 CPU has 65 types of instructions. The instructions are classified by function in table 2-1.
Table 2-1
Instruction Classification
Function
Instructions
Data transfer
MOV
1
POP* , PUSH*
1
Arithmetic
operations
Types
BWL
5
WL
LDM, STM
MOVFPE, MOVTPE*
Size
L
3
B
ADD, SUB, CMP, NEG
BWL
ADDX, SUBX, DAA, DAS
B
INC, DEC
BWL
ADDS, SUBS
L
MULXU, DIVXU, MULXS, DIVXS
BW
EXTU, EXTS
WL
TAS*
4
19
B
Logic operations
AND, OR, XOR, NOT
BWL
4
Shift
SHAL, SHAR, SHLL, SHLR, ROTL, ROTR, ROTXL, ROTXR BWL
8
Bit manipulation
BSET, BCLR, BNOT, BTST, BLD, BILD, BST, BIST, BAND,
BIAND, BOR, BIOR, BXOR, BIXOR
B
14
Branch
Bcc* 2, JMP, BSR, JSR, RTS
—
5
System control
TRAPA, RTE, SLEEP, LDC, STC, ANDC, ORC, XORC, NOP —
9
Block data transfer
EEPMOV
1
Total:
—
65
Legend:
B: Byte size
W: Word size
L: Longword size
Notes: 1. POP.W Rn and PUSH.W Rn are identical to MOV.W @SP+, Rn and MOV.W Rn, @-SP. POP.L ERn and
PUSH.L ERn are identical to MOV.L @SP+, ERn and MOV.L ERn, @-SP.
2. Bcc is the general name for conditional branch instructions.
3. Cannot be used in the H8S/2357 Group.
4. Only register ER0, ER1, ER4, or ER5 should be used when using the TAS instruction.
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2.6.2
Instructions and Addressing Modes
Table 2-2 indicates the combinations of instructions and addressing modes that the H8S/2600 CPU can use.
Table 2-2
Combinations of Instructions and Addressing Modes
BWL
BWL
B
BWL
—
BWL
—
—
—
—
—
—
—
—
—
—
—
—
—
—
WL
LDM, STM
—
—
—
—
—
—
—
—
—
—
—
—
—
L
MOVFPE,
—
—
—
—
—
—
—
B
—
—
—
—
—
—
MOVTPE*1
ADD, CMP
Arithmetic
operations
BWL
BWL
—
—
—
—
—
—
—
—
—
—
—
—
SUB
WL
BWL
—
—
—
—
—
—
—
—
—
—
—
—
ADDX, SUBX
B
B
—
—
—
—
—
—
—
—
—
—
—
—
ADDS, SUBS
—
L
—
—
—
—
—
—
—
—
—
—
—
—
INC, DEC
—
BWL
—
—
—
—
—
—
—
—
—
—
—
—
DAA, DAS
—
B
—
—
—
—
—
—
—
—
—
—
—
—
MULXU,
DIVXU
MULXS,
DIVXS
—
BW
—
—
—
—
—
—
—
—
—
—
—
—
—
BW
—
—
—
—
—
—
—
—
—
—
—
—
NEG
—
BWL
—
—
—
—
—
—
—
—
—
—
—
—
EXTU, EXTS
—
WL
—
—
—
—
—
—
—
—
—
—
—
—
TAS*2
—
—
B
—
—
—
—
—
—
—
—
—
—
Logic
operations
—
AND, OR,
XOR
BWL
BWL
—
—
—
—
—
—
—
—
—
—
—
—
NOT
@aa:8
@ERn
Rn
—
@(d:16,PC)
BWL
—
@@aa:8
@(d:8,PC)
BWL
—
@aa:32
BWL
—
#xx
Data
transfer
@aa:24
BWL
POP, PUSH
Instruction
@aa:16
@–ERn/@ERn+
MOV
Function
@(d:16,ERn)
@(d:32,ERn)
Addressing Modes
—
BWL
—
—
—
—
—
—
—
—
—
—
—
—
Shift
—
BWL
—
—
—
—
—
—
—
—
—
—
—
—
Bit manipulation
—
B
B
—
—
—
B
B
—
B
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Branch
System
control
Bcc, BSR
JMP, JSR
—
—
—
—
—
—
—
—
—
—
—
RTS
—
—
—
—
—
—
—
—
—
—
—
—
—
TRAPA
—
—
—
—
—
—
—
—
—
—
—
—
—
RTE
—
—
—
—
—
—
—
—
—
—
—
—
—
SLEEP
—
—
—
—
—
—
—
—
—
—
—
—
—
LDC
B
B
W
W
W
W
—
W
—
W
—
—
—
—
STC
—
B
W
W
W
W
—
W
—
W
—
—
—
—
ANDC,
ORC, XORC
B
—
—
—
—
—
—
—
—
—
—
—
—
—
NOP
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Block data transfer
Legend:
B: Byte
W: Word
L: Longword
Notes: 1. Cannot be used in the H8S/2357 Group.
2. Only register ER0, ER1, ER4, or ER5 should be used when using the TAS instruction.
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—
BW
2.6.3
Table of Instructions Classified by Function
Table 2-3 summarizes the instructions in each functional category. The notation used in table 2-3 is defined below.
Operation Notation
Rd
General register (destination)*
Rs
General register (source)*
Rn
General register*
ERn
General register (32-bit register)
(EAd)
Destination operand
(EAs)
Source operand
EXR
Extended control register
CCR
Condition-code register
N
N (negative) flag in CCR
Z
Z (zero) flag in CCR
V
V (overflow) flag in CCR
C
C (carry) flag in CCR
PC
Program counter
SP
Stack pointer
#IMM
Immediate data
disp
Displacement
+
Addition
–
Subtraction
×
Multiplication
÷
Division
∧
Logical AND
∨
Logical OR
⊕
Logical exclusive OR
→
Move
¬
NOT (logical complement)
:8/:16/:24/:32
8-, 16-, 24-, or 32-bit length
Note: * General registers include 8-bit registers (R0H to R7H, R0L to R7L), 16-bit registers (R0 to R7, E0 to E7), and 32-bit
registers (ER0 to ER7).
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Table 2-3
Instructions Classified by Function
Type
Instruction
Size* 1
Function
Data transfer
MOV
B/W/L
(EAs) → Rd, Rs → (Ead)
Moves data between two general registers or between a
general register and memory, or moves immediate data
to a general register.
MOVFPE
B
Cannot be used in the H8S/2357 Group.
MOVTPE
B
Cannot be used in the H8S/2357 Group.
POP
W/L
@SP+ → Rn
Pops a register from the stack. POP.W Rn is identical to
MOV.W @SP+, Rn. POP.L ERn is identical to MOV.L
@SP+, ERn.
PUSH
W/L
Rn → @–SP
Pushes a register onto the stack. PUSH.W Rn is
identical to MOV.W Rn, @–SP. PUSH.L ERn is identical
to MOV.L ERn, @–SP.
LDM
L
@SP+ → Rn (register list)
Pops two or more general registers from the stack.
STM
L
Rn (register list) → @–SP
Pushes two or more general registers onto the stack.
ADD
SUB
B/W/L
Rd ± Rs → Rd, Rd ± #IMM → Rd
Performs addition or subtraction on data in two general
registers, or on immediate data and data in a general
register. (Immediate byte data cannot be subtracted from
byte data in a general register. Use the SUBX or ADD
instruction.)
ADDX
SUBX
B
Rd ± Rs ± C → Rd, Rd ± #IMM ± C → Rd
Performs addition or subtraction with carry or borrow on
byte data in two general registers, or on immediate data
and data in a general register.
INC
DEC
B/W/L
Rd ± 1 → Rd, Rd ± 2 → Rd
Increments or decrements a general register by 1 or 2.
(Byte operands can be incremented or decremented by
1 only.)
ADDS
SUBS
L
Rd ± 1 → Rd, Rd ± 2 → Rd, Rd ± 4 → Rd
Adds or subtracts the value 1, 2, or 4 to or from data in a
32-bit register.
DAA
DAS
B
Rd decimal adjust → Rd
Decimal-adjusts an addition or subtraction result in a
general register by referring to the CCR to produce 4-bit
BCD data.
MULXU
B/W
Rd × Rs → Rd
Performs unsigned multiplication on data in two general
registers: either 8 bits × 8 bits → 16 bits or 16 bits ×
16 bits → 32 bits.
MULXS
B/W
Rd × Rs → Rd
Performs signed multiplication on data in two general
registers: either 8 bits × 8 bits → 16 bits or 16 bits ×
16 bits → 32 bits.
Arithmetic
operations
Rev.6.00 Oct.28.2004 page 36 of 1016
REJ09B0138-0600H
Type
Instruction
Size* 1
Function
Arithmetic
operations
DIVXU
B/W
Rd ÷ Rs → Rd
Performs unsigned division on data in two general
registers: either 16 bits ÷ 8 bits → 8-bit quotient and 8-bit
remainder or 32 bits ÷ 16 bits → 16-bit quotient and 16bit remainder.
DIVXS
B/W
Rd ÷ Rs → Rd
Performs signed division on data in two general
registers: either 16 bits ÷ 8 bits → 8-bit quotient and 8-bit
remainder or 32 bits ÷ 16 bits → 16-bit quotient and 16bit remainder.
CMP
B/W/L
Rd – Rs, Rd – #IMM
Compares data in a general register with data in another
general register or with immediate data, and sets CCR
bits according to the result.
NEG
B/W/L
0 – Rd → Rd
Takes the two's complement (arithmetic complement) of
data in a general register.
EXTU
W/L
Rd (zero extension) → Rd
Extends the lower 8 bits of a 16-bit register to word size,
or the lower 16 bits of a 32-bit register to longword size,
by padding with zeros on the left.
EXTS
W/L
Rd (sign extension) → Rd
Extends the lower 8 bits of a 16-bit register to word size,
or the lower 16 bits of a 32-bit register to longword size,
by extending the sign bit.
TAS
B
@ERd – 0, 1 → (<bit 7> of @ERd)* 2
Tests memory contents, and sets the most significant bit
(bit 7) to 1.
AND
B/W/L
Rd ∧ Rs → Rd, Rd ∧ #IMM → Rd
Performs a logical AND operation on a general register
and another general register or immediate data.
OR
B/W/L
Rd ∨ Rs → Rd, Rd ∨ #IMM → Rd
Performs a logical OR operation on a general register
and another general register or immediate data.
XOR
B/W/L
Rd ⊕ Rs → Rd, Rd ⊕ #IMM → Rd
Performs a logical exclusive OR operation on a general
register and another general register or immediate data.
NOT
B/W/L
¬ (Rd) → (Rd)
Takes the one's complement of general register
contents.
SHAL
SHAR
B/W/L
Rd (shift) → Rd
Performs an arithmetic shift on general register contents.
1-bit or 2-bit shift is possible.
SHLL
SHLR
B/W/L
Rd (shift) → Rd
Performs a logical shift on general register contents.
1-bit or 2-bit shift is possible.
ROTL
ROTR
B/W/L
Rd (rotate) → Rd
Rotates general register contents.
1-bit or 2-bit rotation is possible.
ROTXL
ROTXR
B/W/L
Rd (rotate) → Rd
Rotates general register contents through the carry flag.
1-bit or 2-bit rotation is possible.
Logic
operations
Shift
operations
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REJ09B0138-0600H
Type
Instruction
Size* 1
Function
Bitmanipulation
instructions
BSET
B
1 → (<bit-No.> of <EAd>)
Sets a specified bit in a general register or memory
operand to 1. The bit number is specified by 3-bit
immediate data or the lower three bits of a general
register.
BCLR
B
0 → (<bit-No.> of <EAd>)
Clears a specified bit in a general register or memory
operand to 0. The bit number is specified by 3-bit
immediate data or the lower three bits of a general
register.
BNOT
B
¬ (<bit-No.> of <EAd>) → (<bit-No.> of <EAd>)
Inverts a specified bit in a general register or memory
operand. The bit number is specified by 3-bit immediate
data or the lower three bits of a general register.
BTST
B
¬ (<bit-No.> of <EAd>) → Z
Tests a specified bit in a general register or memory
operand and sets or clears the Z flag accordingly. The
bit number is specified by 3-bit immediate data or the
lower three bits of a general register.
BAND
B
C ∧ (<bit-No.> of <EAd>) → C
ANDs the carry flag with a specified bit in a general
register or memory operand and stores the result in the
carry flag.
BIAND
B
C ∧ ¬ (<bit-No.> of <EAd>) → C
ANDs the carry flag with the inverse of a specified bit in
a general register or memory operand and stores the
result in the carry flag.
The bit number is specified by 3-bit immediate data.
BOR
B
C ∨ (<bit-No.> of <EAd>) → C
ORs the carry flag with a specified bit in a general
register or memory operand and stores the result in the
carry flag.
BIOR
B
C ∨ ¬ (<bit-No.> of <EAd>) → C
ORs the carry flag with the inverse of a specified bit in a
general register or memory operand and stores the
result in the carry flag.
The bit number is specified by 3-bit immediate data.
BXOR
B
C ⊕ (<bit-No.> of <EAd>) → C
Exclusive-ORs the carry flag with a specified bit in a
general register or memory operand and stores the
result in the carry flag.
BIXOR
B
C ⊕ ¬ (<bit-No.> of <EAd>) → C
Exclusive-ORs the carry flag with the inverse of a
specified bit in a general register or memory operand
and stores the result in the carry flag.
The bit number is specified by 3-bit immediate data.
BLD
B
(<bit-No.> of <EAd>) → C
Transfers a specified bit in a general register or memory
operand to the carry flag.
BILD
B
¬ (<bit-No.> of <EAd>) → C
Transfers the inverse of a specified bit in a general
register or memory operand to the carry flag.
The bit number is specified by 3-bit immediate data.
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REJ09B0138-0600H
Type
Instruction
Size* 1
Function
Bitmanipulation
instructions
BST
B
C → (<bit-No.> of <EAd>)
Transfers the carry flag value to a specified bit in a
general register or memory operand.
BIST
B
¬ C → (<bit-No.> of <EAd>)
Transfers the inverse of the carry flag value to a
specified bit in a general register or memory operand.
The bit number is specified by 3-bit immediate data.
Bcc
—
Branches to a specified address if a specified condition
is true. The branching conditions are listed below.
Branch
instructions
Mnemonic
Description
Condition
BRA(BT)
Always (true)
Always
BRN(BF)
Never (false)
Never
BHI
High
C∨Z=0
BLS
Low or same
C∨Z=1
BCC(BHS)
Carry clear
(high or same)
C=0
BCS(BLO)
Carry set (low)
C=1
BNE
Not equal
Z=0
BEQ
Equal
Z=1
BVC
Overflow clear
V=0
BVS
Overflow set
V=1
BPL
Plus
N=0
BMI
Minus
N=1
BGE
Greater or equal
N⊕V=0
BLT
Less than
N⊕V=1
BGT
Greater than
Z∨(N ⊕ V) = 0
BLE
Less or equal
Z∨(N ⊕ V) = 1
JMP
—
Branches unconditionally to a specified address.
BSR
—
Branches to a subroutine at a specified address.
JSR
—
Branches to a subroutine at a specified address.
RTS
—
Returns from a subroutine.
System control TRAPA
instructions
RTE
—
Starts trap-instruction exception handling.
—
Returns from an exception-handling routine.
SLEEP
—
Causes a transition to a power-down state.
LDC
B/W
(EAs) → CCR, (EAs) → EXR
Moves the source operand contents or immediate data
to CCR or EXR. Although CCR and EXR are 8-bit
registers, word-size transfers are performed between
them and memory. The upper 8 bits are valid.
STC
B/W
CCR → (EAd), EXR → (EAd)
Transfers CCR or EXR contents to a general register or
memory. Although CCR and EXR are 8-bit registers,
word-size transfers are performed between them and
memory. The upper 8 bits are valid.
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REJ09B0138-0600H
Type
Size* 1
Function
B
CCR ∧ #IMM → CCR, EXR ∧ #IMM → EXR
Logically ANDs the CCR or EXR contents with
immediate data.
ORC
B
CCR ∨ #IMM → CCR, EXR ∨ #IMM → EXR
Logically ORs the CCR or EXR contents with immediate
data.
XORC
B
CCR ⊕ #IMM → CCR, EXR ⊕ #IMM → EXR
Logically exclusive-ORs the CCR or EXR contents with
immediate data.
NOP
—
PC + 2 → PC
Only increments the program counter.
EEPMOV.B
—
if R4L ≠ 0 then
Repeat @ER5+ → @ER6+
R4L–1 → R4L
Until R4L = 0
else next;
EEPMOV.W
—
if R4 ≠ 0 then
Repeat @ER5+ → @ER6+
R4–1 → R4
Until R4 = 0
else next;
Instruction
System control ANDC
instructions
Block data
transfer
instruction
Transfers a data block according to parameters set in
general registers R4L or R4, ER5, and ER6.
R4L or R4: size of block (bytes)
ER5: starting source address
ER6: starting destination address
Execution of the next instruction begins as soon as the
transfer is completed.
Notes: 1. Size refers to the operand size.
B: Byte
W: Word
L: Longword
2. Only register ER0, ER1, ER4, or ER5 should be used when using the TAS instruction.
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REJ09B0138-0600H
2.6.4
Basic Instruction Formats
The CPU instructions consist of 2-byte (1-word) units. An instruction consists of an operation field (op), a register field
(r), an effective address extension (EA), and a condition field (cc).
Figure 2-9 shows examples of instruction formats.
(1) Operation field only
op
NOP, RTS, etc.
(2) Operation field and register fields
op
rm
rn
ADD.B Rn, Rm, etc.
(3) Operation field, register fields, and effective address extension
op
rn
rm
MOV.B @(d:16, Rn), Rm, etc.
EA (disp)
(4) Operation field, effective address extension, and condition field
op
cc
EA (disp)
BRA d:16, etc.
Figure 2-9 Instruction Formats (Examples)
(1) Operation Field: Indicates the function of the instruction, the addressing mode, and the operation to be carried out on
the operand. The operation field always includes the first 4 bits of the instruction. Some instructions have two operation
fields.
(2) Register Field: Specifies a general register. Address registers are specified by 3 bits, data registers by 3 bits or 4 bits.
Some instructions have two register fields. Some have no register field.
(3) Effective Address Extension: Eight, 16, or 32 bits specifying immediate data, an absolute address, or a displacement.
(4) Condition Field: Specifies the branching condition of Bcc instructions.
2.7
Addressing Modes and Effective Address Calculation
2.7.1
Addressing Mode
The CPU supports the eight addressing modes listed in table 2-4. Each instruction uses a subset of these addressing modes.
Arithmetic and logic instructions can use the register direct and immediate modes. Data transfer instructions can use all
addressing modes except program-counter relative and memory indirect. Bit manipulation instructions use register direct,
register indirect, or absolute addressing mode to specify an operand, and register direct (BSET, BCLR, BNOT, and BTST
instructions) or immediate (3-bit) addressing mode to specify a bit number in the operand.
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REJ09B0138-0600H
Table 2-4
Addressing Modes
No.
Addressing Mode
Symbol
1
Register direct
Rn
2
Register indirect
@ERn
3
Register indirect with displacement
@(d:16,ERn)/@(d:32,ERn)
4
Register indirect with post-increment
Register indirect with pre-decrement
@ERn+
@–ERn
5
Absolute address
@aa:8/@aa:16/@aa:24/@aa:32
6
Immediate
#xx:8/#xx:16/#xx:32
7
Program-counter relative
@(d:8,PC)/@(d:16,PC)
8
Memory indirect
@@aa:8
(1) Register Direct—Rn: The register field of the instruction specifies an 8-, 16-, or 32-bit general register containing the
operand. R0H to R7H and R0L to R7L can be specified as 8-bit registers. R0 to R7 and E0 to E7 can be specified as 16-bit
registers. ER0 to ER7 can be specified as 32-bit registers.
(2) Register Indirect—@ERn: The register field of the instruction code specifies an address register (ERn) which
contains the address of the operand on memory. If the address is a program instruction address, the lower 24 bits are valid
and the upper 8 bits are all assumed to be 0 (H'00).
(3) Register Indirect with Displacement—@(d:16, ERn) or @(d:32, ERn): A 16-bit or 32-bit displacement contained
in the instruction is added to an address register (ERn) specified by the register field of the instruction, and the sum gives
the address of a memory operand. A 16-bit displacement is sign-extended when added.
(4) Register Indirect with Post-Increment or Pre-Decrement—@ERn+ or @-ERn:
• Register indirect with post-increment—@ERn+
The register field of the instruction code specifies an address register (ERn) which contains the address of a memory
operand. After the operand is accessed, 1, 2, or 4 is added to the address register contents and the sum is stored in the
address register. The value added is 1 for byte access, 2 for word transfer instruction, or 4 for longword transfer
instruction. For word or longword transfer instruction, the register value should be even.
• Register indirect with pre-decrement—@-ERn
The value 1, 2, or 4 is subtracted from an address register (ERn) specified by the register field in the instruction code,
and the result becomes the address of a memory operand. The result is also stored in the address register. The value
subtracted is 1 for byte access, 2 for word transfer instruction, or 4 for longword transfer instruction. For word or
longword transfer instruction, the register value should be even.
(5) Absolute Address—@aa:8, @aa:16, @aa:24, or @aa:32: The instruction code contains the absolute address of a
memory operand. The absolute address may be 8 bits long (@aa:8), 16 bits long (@aa:16), 24 bits long (@aa:24), or 32
bits long (@aa:32).
To access data, the absolute address should be 8 bits (@aa:8), 16 bits (@aa:16), or 32 bits (@aa:32) long. For an 8-bit
absolute address, the upper 24 bits are all assumed to be 1 (H'FFFF). For a 16-bit absolute address the upper 16 bits are a
sign extension. A 32-bit absolute address can access the entire address space.
A 24-bit absolute address (@aa:24) indicates the address of a program instruction. The upper 8 bits are all assumed to be 0
(H'00).
Table 2-5 indicates the accessible absolute address ranges.
Rev.6.00 Oct.28.2004 page 42 of 1016
REJ09B0138-0600H
Table 2-5
Absolute Address Access Ranges
Absolute Address
Advanced Mode
Data address
Program instruction address
8 bits (@aa:8)
H'FFFF00 to H'FFFFFF
16 bits (@aa:16)
H'000000 to H'007FFF,
H'FF8000 to H'FFFFFF
32 bits (@aa:32)
H'000000 to H'FFFFFF
24 bits (@aa:24)
(6) Immediate—#xx:8, #xx:16, or #xx:32: The instruction contains 8-bit (#xx:8), 16-bit (#xx:16), or 32-bit (#xx:32)
immediate data as an operand.
The ADDS, SUBS, INC, and DEC instructions contain immediate data implicitly. Some bit manipulation instructions
contain 3-bit immediate data in the instruction code, specifying a bit number. The TRAPA instruction contains 2-bit
immediate data in its instruction code, specifying a vector address.
(7) Program-Counter Relative—@(d:8, PC) or @(d:16, PC): This mode is used in the Bcc and BSR instructions. An
8-bit or 16-bit displacement contained in the instruction is sign-extended and added to the 24-bit PC contents to generate a
branch address. Only the lower 24 bits of this branch address are valid; the upper 8 bits are all assumed to be 0 (H'00). The
PC value to which the displacement is added is the address of the first byte of the next instruction, so the possible
branching range is –126 to +128 bytes (–63 to +64 words) or –32766 to +32768 bytes (–16383 to +16384 words) from the
branch instruction. The resulting value should be an even number.
(8) Memory Indirect—@@aa:8: This mode can be used by the JMP and JSR instructions. The instruction code contains
an 8-bit absolute address specifying a memory operand. This memory operand contains a branch address. The upper bits
of the absolute address are all assumed to be 0, so the address range is 0 to 255 (H'000000 to H'0000FF).
Note that the first part of the address range is also the exception vector area. For further details, refer to section 4,
Exception Handling.
Specified
by @aa:8
Reserved
Branch address
Advanced Mode
Figure 2-10 Branch Address Specification in Memory Indirect Mode
If an odd address is specified in word or longword memory access, or as a branch address, the least significant bit is
regarded as 0, causing data to be accessed or instruction code to be fetched at the address preceding the specified address.
(For further information, see section 2.5.2, Memory Data Formats.)
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Rev.6.00 Oct.28.2004 page 44 of 1016
REJ09B0138-0600H
4
3
rm
rn
r
r
disp
r
op
r
• Register indirect with pre-decrement @–ERn
op
Register indirect with post-increment or
pre-decrement
• Register indirect with post-increment @ERn+
op
Register indirect with displacement
@(d:16, ERn) or @(d:32, ERn)
op
Register indirect (@ERn)
op
Register direct (Rn)
Addressing Mode and Instruction Format
disp
1
2
4
0
1, 2, or 4
General register contents
Byte
Word
Longword
0
0
0
0
1, 2, or 4
General register contents
Sign extension
General register contents
General register contents
Operand Size Value added
31
31
31
31
31
Effective Address Calculation
24 23
24 23
24 23
24 23
Don’t care
31
Don’t care
31
Don’t care
31
Don’t care
31
Operand is general register contents.
Effective Address (EA)
0
0
0
0
Table 2-6
2
1
No.
2.7.2
Effective Address Calculation
Table 2-6 indicates how effective addresses are calculated in each addressing mode.
Effective Address Calculation
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6
op
op
abs
op
Immediate
#xx:8/#xx:16/#xx:32
@aa:32
op
@aa:24
@aa:16
op
abs
abs
IMM
abs
Absolute address
5
@aa:8
Addressing Mode and Instruction Format
No.
Effective Address Calculation
24 23
24 23
24 23
Operand is immediate data.
Don’t care
31
Don’t care
31
H'FFFF
16 15
24 23
Sign
extension
Don’t care
31
Don’t care
31
87
Effective Address (EA)
0
0
0
0
Rev.6.00 Oct.28.2004 page 46 of 1016
REJ09B0138-0600H
8
7
No.
op
abs
• Advanced mode
Memory indirect @@aa:8
op
@(d:8, PC)/@(d:16, PC)
Program-counter relative
disp
Addressing Mode and Instruction Format
31
31
Memory contents
H'000000
87
disp
PC contents
Sign
extension
23
23
abs
Effective Address Calculation
0
0
0
0
24 23
24 23
Don’t care
31
Don’t care
31
Effective Address (EA)
0
0
2.8
Processing States
2.8.1
Overview
The CPU has five main processing states: the reset state, exception handling state, program execution state, bus-released
state, and power-down state. Figure 2-11 shows a diagram of the processing states. Figure 2-12 indicates the state
transitions.
Reset state
The CPU and all on-chip supporting modules have been
initialized and are stopped.
Exception-handling
state
A transient state in which the CPU changes the normal
processing flow in response to a reset, interrupt, or trap
instruction.
Processing
states
Program execution
state
The CPU executes program instructions in sequence.
Bus-released state
The external bus has been released in response to a bus
request signal from a bus master other than the CPU.
Sleep mode
Power-down state
CPU operation is stopped
to conserve power.*
Software standby
mode
Hardware standby
mode
Note: * The power-down state also includes a medium-speed mode, module stop mode etc.
Figure 2-11 Processing States
Rev.6.00 Oct.28.2004 page 47 of 1016
REJ09B0138-0600H
End of bus request
Bus request
Program execution
state
End of bus
request
Bus
request
SLEEP
instruction
with
SSBY = 1
Bus-released state
End of
exception
handling
SLEEP
instruction
with
SSBY = 0
Request for
exception
handling
Sleep mode
Interrupt
request
Exception-handling state
External interrupt
Software standby mode
RES = high
Reset state*1
STBY = high, RES = low
Hardware standby mode*2
Power-down state
Notes: 1. From any state except hardware standby mode, a transition to the reset state occurs whenever RES
goes low. A transition can also be made to the reset state when the watchdog timer overflows.
2. From any state, a transition to hardware standby mode occurs when STBY goes low.
Figure 2-12 State Transitions
2.8.2
Reset State
When the RES input goes low all current processing stops and the CPU enters the reset state. The CPU enters the poweron reset state when the NMI pin is high, or the manual reset* state when the NMI pin is low. All interrupts are masked in
the reset state. Reset exception handling starts when the RES signal changes from low to high.
The reset state can also be entered by a watchdog timer overflow. For details, refer to section 13, Watchdog Timer.
Note: * Manual reset is only supported in the H8S/2357 ZTAT.
2.8.3
Exception-Handling State
The exception-handling state is a transient state that occurs when the CPU alters the normal processing flow due to a reset,
interrupt, or trap instruction. The CPU fetches a start address (vector) from the exception vector table and branches to that
address.
(1) Types of Exception Handling and Their Priority
Exception handling is performed for traces, resets, interrupts, and trap instructions. Table 2-7 indicates the types of
exception handling and their priority. Trap instruction exception handling is always accepted, in the program execution
state.
Exception handling and the stack structure depend on the interrupt control mode set in SYSCR.
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Table 2-7
Exception Handling Types and Priority
Priority
Type of Exception
Detection Timing
Start of Exception Handling
High
Reset
Synchronized with clock
Exception handling starts
immediately after a low-to-high
transition at the RES pin, or
when the watchdog timer
overflows.
Trace
End of instruction
execution or end of
exception-handling
sequence* 1
When the trace (T) bit is set to
1, the trace starts at the end of
the current instruction or current
exception-handling sequence
Interrupt
End of instruction
execution or end of
exception-handling
sequence* 2
When an interrupt is requested,
exception handling starts at the
end of the current instruction or
current exception-handling
sequence
Trap instruction
When TRAPA instruction
is executed
Exception handling starts when
a trap (TRAPA) instruction is
executed* 3
Low
Notes: 1. Traces are enabled only in interrupt control mode 2. Trace exception-handling is not executed at the end of the
RTE instruction.
2. Interrupts are not detected at the end of the ANDC, ORC, XORC, and LDC instructions, or immediately after
reset exception handling.
3. Trap instruction exception handling is always accepted, in the program execution state.
(2) Reset Exception Handling
After the RES pin has gone low and the reset state has been entered, when RES goes high again, reset exception handling
starts. The CPU enters the power-on reset state when the NMI pin is high, or the manual reset* state when the NMI pin is
low. When reset exception handling starts the CPU fetches a start address (vector) from the exception vector table and
starts program execution from that address. All interrupts, including NMI, are disabled during reset exception handling
and after it ends.
Note : * Manual reset is only supported in the H8S/2357 ZTAT.
(3) Traces
Traces are enabled only in interrupt control mode 2. Trace mode is entered when the T bit of EXR is set to 1. When trace
mode is established, trace exception handling starts at the end of each instruction.
At the end of a trace exception-handling sequence, the T bit of EXR is cleared to 0 and trace mode is cleared. Interrupt
masks are not affected.
The T bit saved on the stack retains its value of 1, and when the RTE instruction is executed to return from the trace
exception-handling routine, trace mode is entered again. Trace exception-handling is not executed at the end of the RTE
instruction.
Trace mode is not entered in interrupt control mode 0, regardless of the state of the T bit.
(4) Interrupt Exception Handling and Trap Instruction Exception Handling
When interrupt or trap-instruction exception handling begins, the CPU references the stack pointer (ER7) and pushes the
program counter and other control registers onto the stack. Next, the CPU alters the settings of the interrupt mask bits in
the control registers. Then the CPU fetches a start address (vector) from the exception vector table and program execution
starts from that start address.
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Figure 2-13 shows the stack after exception handling ends.
Advanced mode
SP
SP
EXR
Reserved*
CCR
CCR
PC
(24 bits)
PC
(24 bits)
(c) Interrupt control mode 0
(d) Interrupt control mode 2
Note: *Ignored when returning.
Figure 2-13 Stack Structure after Exception Handling (Examples)
2.8.4
Program Execution State
In this state the CPU executes program instructions in sequence.
2.8.5
Bus-Released State
This is a state in which the bus has been released in response to a bus request from a bus master other than the CPU. While
the bus is released, the CPU halts.
There is two more bus masters in addition to the CPU: the DMA contraler (DMAC) and data transfer controller (DTC).
For further details, refer to section 6, Bus Controller.
2.8.6
Power-Down State
The power-down state includes both modes in which the CPU stops operating and modes in which the CPU does not stop.
There are three modes in which the CPU stops operating: sleep mode, software standby mode, and hardware standby
mode. There are also two other power-down modes: medium-speed mode, and module stop mode. In medium-speed mode
the CPU and other bus masters operate on a medium-speed clock. Module stop mode permits halting of the operation of
individual modules, other than the CPU. For details, refer to section 21, Power-Down Modes.
(1) Sleep Mode: A transition to sleep mode is made if the SLEEP instruction is executed while the software standby bit
(SSBY) in the standby control register (SBYCR) is cleared to 0. In sleep mode, CPU operations stop immediately after
execution of the SLEEP instruction. The contents of CPU registers are retained.
(2) Software Standby Mode: A transition to software standby mode is made if the SLEEP instruction is executed while
the SSBY bit in SBYCR is set to 1. In software standby mode, the CPU and clock halt and all MCU operations stop. As
long as a specified voltage is supplied, the contents of CPU registers and on-chip RAM are retained. The I/O ports also
remain in their existing states.
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(3) Hardware Standby Mode: A transition to hardware standby mode is made when the STBY pin goes low. In
hardware standby mode, the CPU and clock halt and all MCU operations stop. The on-chip supporting modules are reset,
but as long as a specified voltage is supplied, on-chip RAM contents are retained.
2.9
Basic Timing
2.9.1
Overview
The CPU is driven by a system clock, denoted by the symbol ø. The period from one rising edge of ø to the next is
referred to as a "state." The memory cycle or bus cycle consists of one, two, or three states. Different methods are used to
access on-chip memory, on-chip supporting modules, and the external address space.
2.9.2
On-Chip Memory (ROM, RAM)
On-chip memory is accessed in one state. The data bus is 16 bits wide, permitting both byte and word transfer instruction.
Figure 2-14 shows the on-chip memory access cycle. Figure 2-15 shows the pin states.
Bus cycle
T1
ø
Internal address bus
Read
access
Address
Internal read signal
Internal data bus
Read data
Internal write signal
Write
access
Internal data bus
Write data
Figure 2-14 On-Chip Memory Access Cycle
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Bus cycle
T1
ø
Address bus
Unchanged
AS
High
RD
High
HWR, LWR
High
Data bus
High-impedance state
Figure 2-15 Pin States during On-Chip Memory Access
2.9.3
On-Chip Supporting Module Access Timing
The on-chip supporting modules are accessed in two states. The data bus is either 8 bits or 16 bits wide, depending on the
particular internal I/O register being accessed. Figure 2-16 shows the access timing for the on-chip supporting modules.
Figure 2-17 shows the pin states.
Bus cycle
T2
T1
ø
Internal address bus
Address
Internal read signal
Read
access
Internal data bus
Read data
Internal write signal
Write
access
Internal data bus
Write data
Figure 2-16 On-Chip Supporting Module Access Cycle
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Bus cycle
T1
T2
ø
Address bus
Unchanged
AS
High
RD
High
HWR, LWR
High
Data bus
High-impedance state
Figure 2-17 Pin States during On-Chip Supporting Module Access
2.9.4
External Address Space Access Timing
The external address space is accessed with an 8-bit or 16-bit data bus width in a two-state or three-state bus cycle. In
three-state access, wait states can be inserted. For further details, refer to section 6, Bus Controller.
2.10
Usage Note
2.10.1
TAS Instruction
Only register ER0, ER1, ER4, or ER5 should be used when using the TAS instruction. The TAS instruction is not
generated by the Renesas H8S and H8/300 Series C/C++ compilers. If the TAS instruction is used as a user-defined
intrinsic function, ensure that only register ER0, ER1, ER4, or ER5 is used.
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Section 3 MCU Operating Modes
3.1
Overview
3.1.1
Operating Mode Selection (H8S/2357 F-ZTAT Only)
The H8S/2357 F-ZTAT has eight operating modes (modes 4 to 7, 10, 11, 14 and 15). These modes are determined by the
mode pin (MD2 to MD0) and flash write enable pin (FWE) settings. The CPU operating mode and initial bus width can be
selected as shown in table 3-1.
Table 3-1 lists the MCU operating modes.
Table 3-1
MCU Operating Mode Selection (H8S/2357 F-ZTAT Only)
External Data
Bus
MCU
CPU
Operating
Operating
Mode
FWE MD2 MD1 MD0 Mode
Description
On-Chip Initial
ROM
Width
Max.
Width
0
—
—
0
0
0
1
1
3
1
0
5
1
7
1
0
0
9
0
Advanced On-chip ROM disabled, Disabled 16 bits 16 bits
expanded mode
8 bits 16 bits
0
On-chip ROM enabled, Enabled 8 bits
expanded mode
16 bits
1
Single-chip mode
—
—
—
—
0
—
—
—
1
10
1
11
0
Advanced Boot mode
Enabled 8 bits
1
1
0
13
15
—
0
1
6
14
—
1
4
12
—
1
2
8
0
0
—
—
—
16 bits
—
—
—
—
1
1
0
Advanced User program mode
1
Enabled 8 bits
—
16 bits
—
The CPU's architecture allows for 4 Gbytes of address space, but the H8S/2357 Group actually accesses a maximum of 16
Mbytes.
Modes 4 to 6 are externally expanded modes that allow access to external memory and peripheral devices.
The external expansion modes allow switching between 8-bit and 16-bit bus modes. After program execution starts, an 8bit or 16-bit address space can be set for each area, depending on the bus controller setting. If 16-bit access is selected for
any one area, 16-bit bus mode is set; if 8-bit access is selected for all areas, 8-bit bus mode is set.
Note that the functions of each pin depend on the operating mode.
Modes 10, 11, 14, and 15 are boot modes and user program modes in which the flash memory can be programmed and
erased. For details, see section 19, ROM.
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The H8S/2357 F-ZTAT can only be used in modes 4 to 7, 10, 11, 14, and 15. This means that the flash write enable pin
and mode pins must be set to select one of these modes.
Do not change the inputs at the mode pins during operation.
3.1.2
Operating Mode Selection (ZTAT, Masked ROM, ROMless Version, and H8S/2398 F-ZTAT)
The H8S/2357 Group has four operating modes (modes 4 to 7). These modes enable selection of the CPU operating mode,
enabling/disabling of on-chip ROM, and the initial bus width setting, by setting the mode pins (MD 2 to MD0).
Table 3-2 lists the MCU operating modes.
Table 3-2
MCU Operating Mode Selection (ZTAT, Masked ROM, ROMless , and H8S/2398 F-ZTAT)
External Data Bus
MCU
CPU
Operating
Operating
Description
Mode
MD2 MD1 MD0 Mode
On-Chip Initial
ROM
Width
Max.
Width
0
—
—
0
0
1
2*
3*
1
4*
2
5*
2
7
—
—
—
1
1
6
0
1
0
1
1
0
0
1
1
Advanced On-chip ROM disabled, Disabled 16 bits
expanded mode
8 bits
16 bits
16 bits
0
On-chip ROM enabled, Enabled 8 bits
expanded mode
16 bits
1
Single-chip mode
—
—
Notes: 1. In the H8S/2398 F-ZTAT, modes 2 and 3 indicate boot mode. For details on boot mode of the H8S/2398 FZTAT version, refer to table 19-35 in section 19.17, On-Board Programming Modes.
In addition, for details on user program mode, refer also to tables 19-35 in section 19.17, On-Board
Programming Modes.
2. In ROMless version, only modes 4 and 5 are available.
The CPU's architecture allows for 4 Gbytes of address space, but the H8S/2357 Group actually accesses a maximum of 16
Mbytes.
Modes 4 to 6 are externally expanded modes that allow access to external memory and peripheral devices.
The external expansion modes allow switching between 8-bit and 16-bit bus modes. After program execution starts, an 8bit or 16-bit address space can be set for each area, depending on the bus controller setting. If 16-bit access is selected for
any one area, 16-bit bus mode is set; if 8-bit access is selected for all areas, 8-bit bus mode is set.
Note that the functions of each pin depend on the operating mode.
The H8S/2357 Group cannot be used in modes 4 to 7. This means that the mode pins must be set to select 4 to 7 modes.
Do not change the inputs at the mode pins during operation.
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3.1.3
Register Configuration
The H8S/2357 Group has a mode control register (MDCR) that indicates the inputs at the mode pins (MD2 to MD0), and a
system control register (SYSCR) and a system control register 2 (SYSCR2)*2 that control the operation of the H8S/2357
Group. Table 3-3 summarizes these registers.
Table 3-3
MCU Registers
Name
Abbreviation
R/W
Initial Value
Address* 1
Mode control register
MDCR
R
Undetermined
H'FF3B
SYSCR
R/W
H'01
H'FF39
SYSCR2
R/W
H'00
H'FF42
System control register
System control register 2*
2
Notes: 1. Lower 16 bits of the address.
2. The SYSCR2 register can only be used in the F-ZTAT version. In the masked ROM and ZTAT versions, this
register cannot be written to and will return an undefined value if read.
3.2
Register Descriptions
3.2.1
Mode Control Register (MDCR)
Bit
:
7
6
5
4
3
2
1
0
—
—
—
—
—
MDS2
MDS1
MDS0
Initial value :
1
0
0
0
0
—*
—*
—*
R/W
—
—
—
—
—
R
R
R
:
Note: * Determined by pins MD2 to MD0.
MDCR is an 8-bit read-only register that indicates the current operating mode of the H8S/2357 Group.
Bit 7—Reserved: This bit cannot be modified and is always read as 1.
Bits 6 to 3—Reserved: These bits cannot be modified and are always read as 0.
Bits 2 to 0—Mode Select 2 to 0 (MDS2 to MDS0): These bits indicate the input levels at pins MD2 to MD0 (the current
operating mode). Bits MDS2 to MDS0 correspond to MD2 to MD0. MDS2 to MDS0 are read-only bits, they cannot be
written to. The mode pin (MD2 to MD0) input levels are latched into these bits when MDCR is read. These latches are
canceled by a power-on reset, but are retained after a manual reset.*
Note: * Manual reset is only supported in the H8S/2357 ZTAT.
3.2.2
Bit
System Control Register (SYSCR)
:
Initial value :
R/W
:
7
6
5
4
3
2
1
0
—
—
INTM1
INTM0
NMIEG
—
—
RAME
0
0
0
0
0
0
0
1
R/W
—
R/W
R/W
R/W
—*
R/W
R/W
Note: * R/W in the H8S/2390, H8S/2392, H8S/2394, and H8S/2398.
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Bit 7—Reserved: Only 0 should be written to this bit.
Bit 6—Reserved: This bit cannot be modified and is always read as 0.
Bits 5 and 4—Interrupt Control Mode 1 and 0 (INTM1, INTM0): These bits select the control mode of the interrupt
controller. For details of the interrupt control modes, see section 5.4.1, Interrupt Control Modes and Interrupt Operation.
Bit 5
INTM1
Bit 4
INTM0
Interrupt Control
Mode
Description
0
0
0
Control of interrupts by I bit
1
—
Setting prohibited
0
2
Control of interrupts by I2 to I0 bits and IPR
1
—
Setting prohibited
1
(Initial value)
Bit 3—NMI Edge Select (NMIEG): Selects the valid edge of the NMI interrupt input.
Bit 3
NMIEG
Description
0
An interrupt is requested at the falling edge of NMI input
1
An interrupt is requested at the rising edge of NMI input
(Initial value)
Bit 2—Reserved: This bit cannot be modified and is always read as 0.
This bit is reserved in the H8S/2390, H8S/2392, H8S/2394, and H8S/2398. Only 0 should be written to
this bit.
Bit 1—Reserved: Only 0 should be written to this bit.
Bit 0—RAM Enable (RAME): Enables or disables the on-chip RAM. The RAME bit is initialized when the reset status
is released. It is not initialized in software standby mode.
3.2.3
Bit
Bit 0
RAME
Description
0
On-chip RAM is disabled
1
On-chip RAM is enabled
(Initial value)
System Control Register 2 (SYSCR2) (F-ZTAT Version Only)
:
7
6
5
4
3
2
1
0
—
—
—
—
FLSHE
—
—
—
Initial value :
0
0
0
0
0
0
0
0
R/W
—
—
—
—
R/W
—
—
—
:
SYSCR2 is an 8-bit readable/writable register that performs on-chip flash memory control.
SYSCR2 is initialized to H'00 by a reset and in hardware standby mode.
SYSCR2 can only be accessed in the F-ZTAT version. In other versions, this register cannot be written to and will return
an undefined value if read.
Bits 7 to 4—Reserved: These bits cannot be modified and are always read as 0.
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Bit 3—Flash Memory Control Register Enable (FLSHE): Controls CPU access to the flash memory control registers
(FLMCR1, FLMCR2, EBR1, and EBR2). For details, see section 19, ROM.
Bit 3
FLSHE
Description
0
Flash control registers are not selected for addresses H'FFFFC8 to H'FFFFCB
(Initial value)
1
Flash control registers are selected for addresses H'FFFFC8 to H'FFFFCB
Bits 2 to 0—Reserved: These bits cannot be modified and are always read as 0.
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3.3
Operating Mode Descriptions
3.3.1
Mode 1
Mode 1 is not supported in this LSI, and must not be set.
3.3.2
Mode 2 (H8S/2398 F-ZTAT Only)
This is a flash memory boot mode. For details, see section 19, ROM.
MCU operation is the same as in mode 6.
3.3.3
Mode 3 (H8S/2398 F-ZTAT Only)
This is a flash memory boot mode. For details, see section 19, ROM.
MCU operation is the same as in mode 7.
3.3.4
Mode 4 (On-Chip ROM Disabled Expansion Mode)
The CPU can access a 16-Mbyte address space in advanced mode. The on-chip ROM is disabled.
Ports A, B and C function as an address bus, ports D and E function as a data bus, and part of port F carries bus control
signals.
The initial bus mode after a reset is 16 bits, with 16-bit access to all areas. However, note that if 8-bit access is designated
by the bus controller for all areas, the bus mode switches to 8 bits.
3.3.5
Mode 5 (On-Chip ROM Disabled Expansion Mode)
The CPU can access a 16-Mbyte address space in advanced mode. The on-chip ROM is disabled.
Ports A, B and C function as an address bus, ports D and E function as a data bus, and part of port F carries bus control
signals.
The initial bus mode after a reset is 8 bits, with 8-bit access to all areas. However, note that if at least one area is
designated for 16-bit access by the bus controller, the bus mode switches to 16 bits and port E becomes a data bus.
3.3.6
Mode 6 (On-Chip ROM Enabled Expansion Mode)
The CPU can access a 16-Mbyte address space in advanced mode. The on-chip ROM is enabled.
Ports A, B and C function as input ports immediately after a reset. They can each be set to output addresses by setting the
corresponding bits in the data direction register (DDR) to 1. Port D functions as a data bus, and part of port F carries bus
control signals.
The initial bus mode after a reset is 8 bits, with 8-bit access to all areas. However, note that if at least one area is
designated for 16-bit access by the bus controller, the bus mode switches to 16 bits and port E becomes a data bus.
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3.3.7
Mode 7 (Single-Chip Mode)
The CPU can access a 16-Mbyte address space in advanced mode. The on-chip ROM is enabled, but external addresses
cannot be accessed.
All I/O ports are available for use as input-output ports.
3.3.8
Modes 8 and 9
Modes 8 and 9 are not supported in the H8S/2357 Group, and must not be set.
3.3.9
Mode 10 (H8S/2357 F-ZTAT Only)
This is a flash memory boot mode. For details, see section 19, ROM.
MCU operation is the same as in mode 6.
3.3.10
Mode 11 (H8S/2357 F-ZTAT Only)
This is a flash memory boot mode. For details, see section 19, ROM.
MCU operation is the same as in mode 7.
3.3.11
Modes 12 and 13 (H8S/2357 F-ZTAT Only)
Modes 12 and 13 are not supported in the H8S/2357 Group, and must not be set.
3.3.12
Mode 14 (H8S/2357 F-ZTAT Only)
This is a flash memory user program mode. For details, see section 19, ROM.
MCU operation is the same as in mode 6.
3.3.13
Mode 15 (H8S/2357 F-ZTAT Only)
This is a flash memory user program mode. For details, see section 19, ROM.
MCU operation is the same as in mode 7.
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3.4
Pin Functions in Each Operating Mode
The pin functions of ports A to F vary depending on the operating mode. Table 3-4 shows their functions in each
operating mode.
Table 3-4
Pin Functions in Each Mode
Mode
2* 4
Port
Port A PA7 to PA 5 P* 1/A
Mode
3* 4
Mode
4* 2
Mode
5* 2
Mode
6
Mode
7
Mode
10* 3
Mode
11* 3
Mode
14* 3
Mode
15* 3
P
P* 1/A
P* 1/A
P* 1/A
P
P* 1/A
P
P* 1/A
P
A
A
A
A
P* 1/A
P
P* 1/A
P
P* 1/A
P
A
1
P* /A
P
1
P* /A
P
1
P* /A
P
D
P
D
P
D
P
PA4 to PA 0
1
Port B
P* /A
Port C
1
P* /A
P
A
Port D
D
P
D
1
Port E
P* /D
Port F PF 7
P/C*
1
PF 6 to PF3 C
P
P
P/C*
P
1
PF 2 to PF0 P* /C
1
D
P/D*
1
P* /D
P* /D
P/C*
1
1
1
C
1
P/C*
C
1
P* /C
1
P/C*
C
1
P* /C
1
P
P* /D
1
P* /C
P/C*
P
C
1
P* /C
1
1
P* /C
1
P
P* /D
1
P* /C
P/C*
P
C
1
P* /C
Memory Map in Each Operating Mode
Figures 3-1 to 3-5 show memory maps for each of the operating modes.
The address space is 16 Mbytes in modes 4 to 7.
The address space is divided into eight areas for modes 4 to 7. For details, see section 6, Bus Controller.
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P* 1/C
P
1
Legend:
P:
I/O port
A:
Address bus output
D:
Data bus I/O
C:
Control signals, clock I/O
Notes: 1. After reset
2. In ROMless version, only modes 4 and 5 are available.
3. Applies to the H8S/2357 F-ZTAT only.
4. Applies to the H8S/2398 F-ZTAT only.
3.5
P
Modes 4 and 5*4
(advanced expanded modes
with on-chip ROM disabled)
H'000000
Mode 6
(advanced expanded mode
with on-chip ROM enabled)
H'000000
Mode 7
(advanced single-chip
mode)
H'000000
On-chip ROM
External address
space
On-chip ROM
H'00FFFF
H'010000
H'010000
On-chip ROM/
external address
space*1
On-chip ROM/
reserved area*2
H'01FFFF
H'020000
H'FFDC00
External address
space
H'FFDC00
On-chip
RAM*3
H'FFDC00
On-chip
RAM*3
On-chip RAM
H'FFFBFF
H'FFFC00 External address
space
H'FFFE40
Internal
I/O registers
H'FFFF08 External address
space
H'FFFF28
Internal
I/O registers
H'FFFFFF
Notes: 1.
2.
3.
4.
H'FFFC00
H'FFFE40
H'FFFF08
H'FFFF28
H'FFFFFF
External address
space
Internal
I/O registers
External address
space
Internal
I/O registers
H'FFFE40
H'FFFF07
Internal
I/O registers
H'FFFF28
H'FFFFFF
Internal
I/O registers
External addresses when EAE = 1 in BCRL; on-chip ROM when EAE = 0.
Reserved area when EAE = 1 in BCRL; on-chip ROM when EAE = 0.
External addresses can be accessed by clearing the RAME bit in SYSCR to 0.
Only modes 4 and 5 are provided in the H8S/2352.
Figure 3-1 Memory Map in Each Operating Mode (H8S/2357, H8S/2352) (1)
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Mode 10*4 Boot Mode
(advanced expanded mode
with on-chip ROM enabled)
H'000000
Mode 11*4 Boot Mode
(advanced single-chip
mode)
H'000000
On-chip ROM
H'010000
On-chip ROM
H'010000
On-chip ROM/
external address
space*1
On-chip ROM/
reserved area*2
H'01FFFF
H'020000
External address
space
H'FFDC00
H'FFDC00
*3
On-chip RAM*3
On-chip RAM
H'FFFBFF
H'FFFC00 External address
space
H'FFFE40
Internal
I/O registers
H'FFFF08 External address
space
H'FFFF28
Internal
I/O registers
H'FFFFFF
H'FFFE40
H'FFFF07
Internal
I/O registers
H'FFFF28
H'FFFFFF
Internal
I/O registers
Notes: 1. External addresses when EAE = 1 in BCRL; on-chip ROM when EAE = 0.
2. Reserved area when EAE = 1 in BCRL; on-chip ROM when EAE = 0.
3. On-chip RAM is used for flash memory programming. Do not clear the RAME bit to 0 in
SYSCR.
4. Modes 10 and 11 are provided in the F-ZTAT version only.
Figure 3-1 Memory Map in Each Operating Mode (H8S/2357, H8S/2352) (2)
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Mode 14*4 User Program Mode
(advanced expanded mode
with on-chip ROM enabled)
H'000000
Mode 15*4 User Program Mode
(advanced single-chip
mode)
H'000000
On-chip ROM
H'010000
On-chip ROM
H'010000
On-chip ROM/
external address
space*1
On-chip ROM/
reserved area*2
H'01FFFF
H'020000
External address
space
H'FFDC00
H'FFDC00
*3
On-chip RAM*3
On-chip RAM
H'FFFBFF
H'FFFC00 External address
space
H'FFFE40
Internal
I/O registers
H'FFFF08 External address
space
H'FFFF28
Internal
I/O registers
H'FFFFFF
H'FFFE40
H'FFFF07
Internal
I/O registers
H'FFFF28
H'FFFFFF
Internal
I/O registers
Notes: 1. External addresses when EAE = 1 in BCRL; on-chip ROM when EAE = 0.
2. Reserved area when EAE = 1 in BCRL; on-chip ROM when EAE = 0.
3. On-chip RAM is used for flash memory programming. Do not clear the RAME bit to 0 in
SYSCR.
4. Modes 14 and 15 are provided in the F-ZTAT version only.
Figure 3-1 Memory Map in Each Operating Mode (H8S/2357, H8S/2352) (3)
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Modes 4 and 5
(advanced expanded modes
with on-chip ROM disabled)
H'000000
External address
space
H'FFDC00
H'FFEC00
Reserved space*1
On-chip RAM*2
H'FFFC00 External address
space
H'FFFE40
Internal
I/O registers
H'FFFF08 External address
space
H'FFFF28
Internal
I/O registers
H'FFFFFF
Notes: 1. This is a reserved space. Access to this space is inhibited. The space can be
made available for use as an external address space by clearing the RAME bit of
the SYSCR to 0.
2. External addresses can be accessed by clearing the RAME bit in SYSCR to 0.
Figure 3-2 Memory Map in Each Operating Mode (H8S/2390)
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Modes 4 and 5
(advanced expanded modes
with on-chip ROM disabled)
H'000000
External address
space
H'FFDC00
On-chip RAM*
H'FFFC00 External address
space
H'FFFE40
Internal
I/O registers
H'FFFF08 External address
space
H'FFFF28
Internal
I/O registers
H'FFFFFF
Note:
*
External addresses can be accessed by clearing the RAME bit in SYSCR to 0.
Figure 3-3 Memory Map in Each Operating Mode (H8S/2392)
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Modes 4 and 5
(advanced expanded modes
with on-chip ROM disabled)
H'000000
External address
space
H'FF7C00
On-chip RAM*
H'FFFC00 External address
space
H'FFFE40
Internal
I/O registers
H'FFFF08 External address
space
H'FFFF28
Internal
I/O registers
H'FFFFFF
Note:
*
External addresses can be accessed by clearing the RAME bit in SYSCR to 0.
Figure 3-4 Memory Map in Each Operating Mode (H8S/2394)
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Mode 2*5
(advanced expanded mode
with on-chip ROM enabled)
H'000000
Mode 3*5
(advanced single-chip
mode)
H'000000
On-chip ROM
H'010000
On-chip ROM
H'010000
On-chip ROM/
external address
space*1
On-chip ROM/
reserved area*2*4
H'03FFFF
H'040000
External address
space
H'FFDC00
H'FFDC00
On-chip
On-chip RAM*3
RAM*3
H'FFFBFF
H'FFFC00
H'FFFE40
H'FFFF08
H'FFFF28
H'FFFFFF
External address
space
Internal
I/O registers
External address
space
Internal
I/O registers
H'FFFE40
H'FFFF07
Internal
I/O registers
H'FFFF28
H'FFFFFF
Internal
I/O registers
Notes: 1. External addresses when EAE = 1 in BCRL; on-chip ROM when EAE = 0.
2. Reserved area when EAE = 1 in BCRL; on-chip ROM when EAE = 0.
3. The on-chip RAM is used when programming and erasing flash memory.
Do not clear the RAME bit in SYSCR to 0.
4. Access to the reserved area is inhibited.
5. Modes 2 and 3 are provided in the F-ZTAT version only.
Figure 3-5 Memory Map in Each Operating Mode (H8S/2398) (1)
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Modes 4 and 5
(advanced expanded modes
with on-chip ROM disabled)
H'000000
Mode 6
(advanced expanded mode
with on-chip ROM enabled)
H'000000
Mode 7
(advanced single-chip
mode)
H'000000
On-chip ROM
External address
space
On-chip ROM
H'00FFFF
H'010000
H'010000
On-chip ROM/
external address
space*1
On-chip ROM/
reserved area*2*4
H'03FFFF
H'040000
H'FFDC00
External address
space
H'FFDC00
On-chip
RAM*3
H'FFDC00
On-chip
RAM*3
On-chip RAM
H'FFFBFF
H'FFFC00 External address
space
H'FFFE40
Internal
I/O registers
H'FFFF08 External address
space
H'FFFF28
Internal
I/O registers
H'FFFFFF
Notes: 1.
2.
3.
4.
H'FFFC00
H'FFFE40
H'FFFF08
H'FFFF28
H'FFFFFF
External address
space
Internal
I/O registers
External address
space
Internal
I/O registers
H'FFFE40
H'FFFF07
Internal
I/O registers
H'FFFF28
H'FFFFFF
Internal
I/O registers
External addresses when EAE = 1 in BCRL; on-chip ROM when EAE = 0.
Reserved area when EAE = 1 in BCRL; on-chip ROM when EAE = 0.
External addresses can be accessed by clearing the RAME bit in SYSCR to 0.
Access to the reserved area is inhibited.
Figure 3-5 Memory Map in Each Operating Mode (H8S/2398) (2)
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Section 4 Exception Handling
4.1
Overview
4.1.1
Exception Handling Types and Priority
As table 4-1 indicates, exception handling may be caused by a reset, trap instruction, or interrupt. Exception handling is
prioritized as shown in table 4-1. If two or more exceptions occur simultaneously, they are accepted and processed in
order of priority. Trap instruction exceptions are accepted at all times, in the program execution state.
Exception handling sources, the stack structure, and the operation of the CPU vary depending on the interrupt control
mode set by the INTM0 and INTM1 bits of SYSCR.
Table 4-1
Exception Types and Priority
Priority
Exception Type
Start of Exception Handling
High
Reset
Starts immediately after a low-to-high transition at the RES
pin, or when the watchdog timer overflows. The CPU enters
the power-on reset state when the NMI pin is high, or the
manual reset* 4 state when the NMI pin is low.
Trace* 1
Starts when execution of the current instruction or exception
handling ends, if the trace (T) bit is set to 1
Interrupt
Starts when execution of the current instruction or exception
handling ends, if an interrupt request has been issued* 2
Low
Trap instruction (TRAPA)*3 Started by execution of a trap instruction (TRAPA)
Notes: 1. Traces are enabled only in interrupt control mode 2. Trace exception handling is not executed after execution
of an RTE instruction.
2. Interrupt detection is not performed on completion of ANDC, ORC, XORC, or LDC instruction execution, or on
completion of reset exception handling.
3. Trap instruction exception handling requests are accepted at all times in program execution state.
4. Manual reset is only supported in the H8S/2357 ZTAT.
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4.1.2
Exception Handling Operation
Exceptions originate from various sources. Trap instructions and interrupts are handled as follows:
1. The program counter (PC), condition code register (CCR), and extended register (EXR) are pushed onto the stack.
2. The interrupt mask bits are updated. The T bit is cleared to 0.
3. A vector address corresponding to the exception source is generated, and program execution starts from that address.
For a reset exception, steps 2 and 3 above are carried out.
4.1.3
Exception Vector Table
The exception sources are classified as shown in figure 4-1. Different vector addresses are assigned to different exception
sources.
Table 4-2 lists the exception sources and their vector addresses.
Reset
Trace
Exception
sources
Power-on reset
Manual reset*
External interrupts: NMI, IRQ7 to IRQ0
Interrupts
Internal interrupts: 52 interrupt sources in
on-chip supporting modules
Trap instruction
Note: * Manual reset is only supported in the H8S/2357 ZTAT.
Figure 4-1 Exception Sources
In modes 6 and 7 the on-chip ROM available for use after a power-on reset is the 64-kbyte area comprising addresses
H'000000 to H'00FFFF. Care is required when setting vector addresses. In this case, clearing the EAE bit in BCRL enables
the 128-kbyte (256-kbyte)* area comprising address H'000000 to H'01FFFF (H'03FFFF)* to be used.
Note: * Since these values are different according to the on-chip ROM capacitance, see section 3.5, Memory Map in Each
Operating Mode.
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Table 4-2
Exception Vector Table
Vector Address* 1
Exception Source
Vector Number
Advanced Mode
Power-on reset
0
H'0000 to H'0003
3
1
H'0004 to H'0007
2
H'0008 to H'000B
3
H'000C to H'000F
4
H'0010 to H'0013
Trace
5
H'0014 to H'0017
Reserved for system use
6
H'0018 to H'001B
External interrupt
7
H'001C to H'001F
8
H'0020 to H'0023
9
H'0024 to H'0027
10
H'0028 to H'002B
11
H'002C to H'002F
12
H'0030 to H'0033
13
H'0034 to H'0037
14
H'0038 to H'003B
15
H'003C to H'003F
IRQ0
16
H'0040 to H'0043
IRQ1
17
H'0044 to H'0047
IRQ2
18
H'0048 to H'004B
IRQ3
19
H'004C to H'004F
IRQ4
20
H'0050 to H'0053
IRQ5
21
H'0054 to H'0057
IRQ6
22
H'0058 to H'005B
IRQ7
23
H'005C to H'005F
24

91
H'0060 to H'0063

H'016C to H'016F
Manual reset*
Reserved for system use
NMI
Trap instruction (4 sources)
Reserved for system use
External interrupt
Internal interrupt*
2
Notes: 1. Lower 16 bits of the address.
2. For details of internal interrupt vectors, see section 5.3.3, Interrupt Exception Handling Vector Table.
3. Manual reset is only supported in the H8S/2357 ZTAT.
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4.2
Reset
4.2.1
Overview
A reset has the highest exception priority.
When the RES pin goes low, all processing halts and the H8S/2357 Group enters the reset state. A reset initializes the
internal state of the CPU and the registers of on-chip supporting modules. Immediately after a reset, interrupt control
mode 0 is set.
Reset exception handling begins when the RES pin changes from low to high.
In the F-ZTAT, masked ROM, and ROMless versions, a reset is always a power-on reset, regardless of the NMI pin level
at the time. Also, a reset caused by the watchdog timer is always a power-on reset, regardless of the setting of the RSTS
bit in the RSTCR register.
In the ZTAT version, a reset may be either a power-on reset or a manual reset*, according to the NMI pin level at the time.
A reset caused by the watchdog timer, also, may be either a power-on reset or a manual reset*.
For details see section 13, Watchdog Timer.
Note: * Manual reset is only supported in the H8S/2357 ZTAT.
4.2.2
Reset Types
A reset can be of either of two types: a power-on reset or a manual reset*. Reset types are shown in table 4-3. A power-on
reset should be used when powering on.
The internal state of the CPU is initialized by either type of reset. A power-on reset also initializes all the registers in the
on-chip supporting modules, while a manual reset* initializes all the registers in the on-chip supporting modules except
for the bus controller and I/O ports, which retain their previous states.
With a manual reset*, since the on-chip supporting modules are initialized, ports used as on-chip supporting module I/O
pins are switched to I/O ports controlled by DDR and DR.
Table 4-3
Reset Types
Reset Transition
Conditions
Internal State
NMI
RES
CPU
Power-on reset High
Low
Initialized Initialized
Manual reset*
Low
Initialized Initialized, except for bus controller and I/O ports
Type
Low
On-Chip Supporting Modules
A reset caused by the watchdog timer can also be of either of two types: a power-on reset or a manual reset*.
Note: * Manual reset is only supported in the H8S/2357 ZTAT.
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4.2.3
Reset Sequence
The H8S/2357 Group enters the reset state when the RES pin goes low.
To ensure that the H8S/2357 Group is reset, hold the RES pin low for at least 20 ms at power-up. To reset the H8S/2357
Group during operation, hold the RES pin low for at least 20 states.
When the RES pin goes high after being held low for the necessary time, the H8S/2357 Group starts reset exception
handling as follows:
1. The internal state of the CPU and the registers of the on-chip supporting modules are initialized, the T bit is cleared to
0 in EXR, and the I bit is set to 1 in EXR and CCR.
2. The reset exception handling vector address is read and transferred to the PC, and program execution starts from the
address indicated by the PC.
Figure 4-2 show examples of the reset sequence.
Vector fetch
Internal
Prefetch of first
processing program instruction
*
*
*
(1)
(3)
(5)
ø
RES
Address bus
RD
High
HWR, LWR
D15 to D0
(2)
(4)
(6)
(1) (3) Reset exception handling vector address ((1) = H'000000, (3) = H'000002)
(2) (4) Start address (contents of reset exception handling vector address)
(5) Start address ((5) = (2) (4))
(6) First program instruction
Note: * 3 program wait states are inserted.
Figure 4-2 Reset Sequence (Mode 4)
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4.2.4
Interrupts after Reset
If an interrupt is accepted after a reset but before the stack pointer (SP) is initialized, the PC and CCR will not be saved
correctly, leading to a program crash. To prevent this, all interrupt requests, including NMI, are disabled immediately after
a reset. Since the first instruction of a program is always executed immediately after the reset state ends, make sure that
this instruction initializes the stack pointer (example: MOV.L #xx:32, SP).
4.2.5
State of On-Chip Supporting Modules after Reset Release
After reset release, MSTPCR is initialized to H'3FFF and all modules except the DMAC and DTC enter module stop
mode. Consequently, on-chip supporting module registers cannot be read or written to. Register reading and writing is
enabled when module stop mode is exited.
4.3
Traces
Traces are enabled in interrupt control mode 2. Trace mode is not activated in interrupt control mode 0, irrespective of the
state of the T bit. For details of interrupt control modes, see section 5, Interrupt Controller.
If the T bit in EXR is set to 1, trace mode is activated. In trace mode, a trace exception occurs on completion of each
instruction.
Trace mode is canceled by clearing the T bit in EXR to 0. It is not affected by interrupt masking.
Table 4-4 shows the state of CCR and EXR after execution of trace exception handling.
Interrupts are accepted even within the trace exception handling routine.
The T bit saved on the stack retains its value of 1, and when control is returned from the trace exception handling routine
by the RTE instruction, trace mode resumes.
Trace exception handling is not carried out after execution of the RTE instruction.
Table 4-4
Status of CCR and EXR after Trace Exception Handling
CCR
Interrupt Control Mode
I
0
2
Legend:
1: Set to 1
0: Cleared to 0
—: Retains value prior to execution.
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UI
EXR
I2 to I0
T
Trace exception handling cannot be used.
1
—
—
0
4.4
Interrupts
Interrupt exception handling can be requested by nine external sources (NMI, IRQ7 to IRQ0) and 52 internal sources in
the on-chip supporting modules. Figure 4-3 classifies the interrupt sources and the number of interrupts of each type.
The on-chip supporting modules that can request interrupts include the watchdog timer (WDT), refresh timer, 16-bit
timer-pulse unit (TPU), 8-bit timer, serial communication interface (SCI), data transfer controller (DTC), DMA controller
(DMAC), and A/D converter. Each interrupt source has a separate vector address.
NMI is the highest-priority interrupt. Interrupts are controlled by the interrupt controller. The interrupt controller has two
interrupt control modes and can assign interrupts other than NMI to eight priority/mask levels to enable multiplexed
interrupt control.
For details of interrupts, see section 5, Interrupt Controller.
External
interrupts
Interrupts
Internal
interrupts
Notes:
NMI (1)
IRQ7 to IRQ0 (8)
WDT*1 (1)
Refresh timer*2 (1)
TPU (26)
8-bit timer (6)
SCI (12)
DTC (1)
DMAC (4)
A/D converter (1)
Numbers in parentheses are the numbers of interrupt sources.
1. When the watchdog timer is used as an interval timer, it generates
an interrupt request at each counter overflow.
2. When the refresh timer is used as an interval timer, it generates an
interrupt request at each compare match.
Figure 4-3 Interrupt Sources and Number of Interrupts
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4.5
Trap Instruction
Trap instruction exception handling starts when a TRAPA instruction is executed. Trap instruction exception handling can
be executed at all times in the program execution state.
The TRAPA instruction fetches a start address from a vector table entry corresponding to a vector number from 0 to 3, as
specified in the instruction code.
Table 4-5 shows the status of CCR and EXR after execution of trap instruction exception handling.
Table 4-5
Status of CCR and EXR after Trap Instruction Exception Handling
CCR
EXR
Interrupt Control Mode
I
UI
I2 to I0
T
0
1
—
—
—
2
1
—
—
0
Legend:
1: Set to 1
0: Cleared to 0
—: Retains value prior to execution.
4.6
Stack Status after Exception Handling
Figure 4-4 shows the stack after completion of trap instruction exception handling and interrupt exception handling.
SP
SP
CCR
EXR
Reserved*
CCR
PC
(24 bits)
PC
(24 bits)
(a) Interrupt control mode 0
(b) Interrupt control mode 2
Note: * Ignored on return.
Figure 4-4 Stack Status after Exception Handling (Advanced Modes)
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4.7
Notes on Use of the Stack
When accessing word data or longword data, the H8S/2357 Group assumes that the lowest address bit is 0. The stack
should always be accessed by word transfer instruction or longword transfer instruction, and the value of the stack pointer
(SP, ER7) should always be kept even. Use the following instructions to save registers:
PUSH.W
Rn
(or MOV.W Rn, @-SP)
PUSH.L
ERn
(or MOV.L ERn, @-SP)
Use the following instructions to restore registers:
POP.W
Rn
(or MOV.W @SP+, Rn)
POP.L
ERn
(or MOV.L @SP+, ERn)
Setting SP to an odd value may lead to a malfunction. Figure 4-5 shows an example of what happens when the SP value is
odd.
CCR
SP
R1L
SP
PC
PC
SP
H'FFFEFA
H'FFFEFB
H'FFFEFC
H'FFFEFD
H'FFFEFF
TRAPA instruction executed MOV.B R1L, @–ER7
SP set to H'FFFEFF
Data saved above SP
Contents of CCR lost
Legend:
CCR: Condition code register
PC: Program counter
R1L: General register R1L
SP: Stack pointer
Note: This diagram illustrates an example in which the interrupt control mode
is 0, in advanced mode.
Figure 4-5 Operation when SP Value is Odd
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Section 5 Interrupt Controller
5.1
Overview
5.1.1
Features
The H8S/2357 Group controls interrupts by means of an interrupt controller. The interrupt controller has the following
features:
• Two interrupt control modes
 Any of two interrupt control modes can be set by means of the INTM1 and INTM0 bits in the system control
register (SYSCR).
• Priorities settable with IPR
 An interrupt priority register (IPR) is provided for setting interrupt priorities. Eight priority levels can be set for
each module for all interrupts except NMI.
 NMI is assigned the highest priority level of 8, and can be accepted at all times.
• Independent vector addresses
 All interrupt sources are assigned independent vector addresses, making it unnecessary for the source to be
identified in the interrupt handling routine.
• Nine external interrupts
 NMI is the highest-priority interrupt, and is accepted at all times. Rising edge or falling edge can be selected for
NMI.
 Falling edge, rising edge, or both edge detection, or level sensing, can be selected for IRQ7 to IRQ0.
• DTC and DMAC control
 DTC and DMAC activation is performed by means of interrupts.
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5.1.2
Block Diagram
A block diagram of the interrupt controller is shown in Figure 5-1.
CPU
INTM1, INTM0
SYSCR
NMIEG
NMI input
NMI input unit
IRQ input
IRQ input unit
ISR
ISCR
Interrupt
request
Vector
number
Priority
determination
IER
I
Internal interrupt
request
SWDTEND to TEI
I2 to I0
CCR
EXR
IPR
Interrupt controller
Legend:
ISCR: IRQ sense control register
IRQ enable register
IER:
IRQ status register
ISR:
Interrupt priority register
IPR:
SYSCR: System control register
Figure 5-1 Block Diagram of Interrupt Controller
5.1.3
Pin Configuration
Table 5-1 summarizes the pins of the interrupt controller.
Table 5-1
Interrupt Controller Pins
Name
Symbol
I/O
Function
Nonmaskable interrupt
NMI
Input
Nonmaskable external interrupt; rising or
falling edge can be selected
External interrupt
requests 7 to 0
IRQ7 to IRQ0 Input
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Maskable external interrupts; rising, falling, or
both edges, or level sensing, can be selected
5.1.4
Register Configuration
Table 5-2 summarizes the registers of the interrupt controller.
Table 5-2
Interrupt Controller Registers
Name
Abbreviation
R/W
Initial Value
Address* 1
System control register
SYSCR
R/W
H'01
H'FF39
IRQ sense control register H
ISCRH
R/W
H'00
H'FF2C
IRQ sense control register L
ISCRL
R/W
H'00
H'FF2D
IRQ enable register
IER
R/W
H'00
H'FF2E
H'00
H'FF2F
2
IRQ status register
ISR
R/(W)*
Interrupt priority register A
IPRA
R/W
H'77
H'FEC4
Interrupt priority register B
IPRB
R/W
H'77
H'FEC5
Interrupt priority register C
IPRC
R/W
H'77
H'FEC6
Interrupt priority register D
IPRD
R/W
H'77
H'FEC7
Interrupt priority register E
IPRE
R/W
H'77
H'FEC8
Interrupt priority register F
IPRF
R/W
H'77
H'FEC9
Interrupt priority register G
IPRG
R/W
H'77
H'FECA
Interrupt priority register H
IPRH
R/W
H'77
H'FECB
Interrupt priority register I
IPRI
R/W
H'77
H'FECC
Interrupt priority register J
IPRJ
R/W
H'77
H'FECD
Interrupt priority register K
IPRK
R/W
H'77
H'FECE
Notes: 1. Lower 16 bits of the address.
2. Can only be written with 0 for flag clearing.
5.2
Register Descriptions
5.2.1
System Control Register (SYSCR)
Bit
:
Initial value :
R/W
:
7
6
5
4
3
2
1
0
—
—
INTM1
INTM0
NMIEG
—
—
RAME
0
0
0
0
0
0
0
1
R/W
—
R/W
R/W
R/W
—*
R/W
R/W
Note: * R/W in the H8S/2390, H8S/2392, H8S/2394, and H8S/2398.
SYSCR is an 8-bit readable/writable register that selects the interrupt control mode, and the detected edge for NMI.
Only bits 5 to 3 are described here; for details of the other bits, see section 3.2.2, System Control Register (SYSCR).
SYSCR is initialized to H'01 by a reset and in hardware standby mode. It is not initialized in software standby mode.
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Bits 5 and 4—Interrupt Control Mode 1 and 0 (INTM1, INTM0): These bits select one of two interrupt control modes
for the interrupt controller.
Bit 5
INTM1
Bit 4
INTM0
Interrupt
Control Mode
Description
0
0
0
Interrupts are controlled by I bit
1
—
Setting prohibited
0
2
Interrupts are controlled by bits I2 to I0, and IPR
1
—
Setting prohibited
1
(Initial value)
Bit 3—NMI Edge Select (NMIEG): Selects the input edge for the NMI pin.
5.2.2
Bit
Bit 3
NMIEG
Description
0
Interrupt request generated at falling edge of NMI input
1
Interrupt request generated at rising edge of NMI input
(Initial value)
Interrupt Priority Registers A to K (IPRA to IPRK)
:
7
6
5
4
3
2
1
0
—
IPR6
IPR5
IPR4
—
IPR2
IPR1
IPR0
Initial value :
0
1
1
1
0
1
1
1
R/W
—
R/W
R/W
R/W
—
R/W
R/W
R/W
:
The IPR registers are eleven 8-bit readable/writable registers that set priorities (levels 7 to 0) for interrupts other than
NMI.
The correspondence between IPR settings and interrupt sources is shown in table 5-3.
The IPR registers set a priority (levels 7 to 0) for each interrupt source other than NMI.
The IPR registers are initialized to H'77 by a reset and in hardware standby mode.
Bits 7 and 3—Reserved: These bits cannot be modified and are always read as 0.
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Table 5-3
Correspondence between Interrupt Sources and IPR Settings
Bits
Register
6 to 4
2 to 0
IPRA
IRQ0
IRQ1
IPRB
IRQ2
IRQ3
IRQ4
IRQ5
IPRC
IRQ6
IRQ7
DTC
IPRD
Watchdog timer
Refresh timer
IPRE
—*
A/D converter
IPRF
TPU channel 0
TPU channel 1
IPRG
TPU channel 2
TPU channel 3
IPRH
TPU channel 4
TPU channel 5
IPRI
8-bit timer channel 0
8-bit timer channel 1
IPRJ
DMAC
SCI channel 0
IPRK
SCI channel 1
SCI channel 2
Note: * Reserved bits. These bits cannot be modified and are always read as 1.
As shown in table 5-3, multiple interrupts are assigned to one IPR. Setting a value in the range from H'0 to H'7 in the 3-bit
groups of bits 6 to 4 and 2 to 0 sets the priority of the corresponding interrupt. The lowest priority level, level 0, is
assigned by setting H'0, and the highest priority level, level 7, by setting H'7.
When interrupt requests are generated, the highest-priority interrupt according to the priority levels set in the IPR registers
is selected. This interrupt level is then compared with the interrupt mask level set by the interrupt mask bits (I2 to I0) in
the extend register (EXR) in the CPU, and if the priority level of the interrupt is higher than the set mask level, an interrupt
request is issued to the CPU.
5.2.3
IRQ Enable Register (IER)
Bit
:
7
6
5
4
3
2
1
0
IRQ7E
IRQ6E
IRQ5E
IRQ4E
IRQ3E
IRQ2E
IRQ1E
IRQ0E
0
0
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Initial value :
R/W
:
IER is an 8-bit readable/writable register that controls enabling and disabling of interrupt requests IRQ7 to IRQ0.
IER is initialized to H'00 by a reset and in hardware standby mode.
Bits 7 to 0—IRQ7 to IRQ0 Enable (IRQ7E to IRQ0E): These bits select whether IRQ7 to IRQ0 are enabled or
disabled.
Bit n
IRQnE
Description
0
IRQn interrupts disabled
1
IRQn interrupts enabled
(Initial value)
(n = 7 to 0)
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5.2.4
IRQ Sense Control Registers H and L (ISCRH, ISCRL)
ISCRH
Bit
:
15
14
13
12
11
10
9
8
IRQ7SCB IRQ7SCA IRQ6SCB IRQ6SCA IRQ5SCB IRQ5SCA IRQ4SCB IRQ4SCA
Initial value :
R/W
0
0
0
0
0
0
0
0
:
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
:
7
6
5
4
3
2
1
0
ISCRL
Bit
IRQ3SCB IRQ3SCA IRQ2SCB IRQ2SCA IRQ1SCB IRQ1SCA IRQ0SCB IRQ0SCA
Initial value :
R/W
:
0
0
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
ISCR registers are 16-bit readable/writable registers that select rising edge, falling edge, or both edge detection, or level
sensing, for the input at pins IRQ7 to IRQ0.
ISCR registers are initialized to H'0000 by a reset and in hardware standby mode.
Bits 15 to 0: IRQ7 Sense Control A and B (IRQ7SCA, IRQ7SCB) to IRQ0 Sense Control A and B (IRQ0SCA,
IRQ0SCB)
Bits 15 to 0
IRQ7SCB to
IRQ0SCB
IRQ7SCA to
IRQ0SCA
0
0
Interrupt request generated at IRQ7 to IRQ0 input low level
(Initial value)
1
Interrupt request generated at falling edge of IRQ7 to IRQ0 input
0
Interrupt request generated at rising edge of IRQ7 to IRQ0 input
1
Interrupt request generated at both falling and rising edges of
IRQ7 to IRQ0 input
1
5.2.5
Bit
IRQ Status Register (ISR)
:
Initial value :
R/W
Description
:
7
6
5
4
3
2
1
0
IRQ7F
IRQ6F
IRQ5F
IRQ4F
IRQ3F
IRQ2F
IRQ1F
IRQ0F
0
0
0
0
0
0
0
0
R/(W)*
R/(W)*
R/(W)*
R/(W)*
R/(W)*
R/(W)*
R/(W)*
R/(W)*
Note: * Only 0 can be written, to clear the flag.
ISR is an 8-bit readable/writable register that indicates the status of IRQ7 to IRQ0 interrupt requests.
ISR is initialized to H'00 by a reset and in hardware standby mode.
Bits 7 to 0—IRQ7 to IRQ0 flags (IRQ7F to IRQ0F): These bits indicate the status of IRQ7 to IRQ0 interrupt requests.
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Bit n
IRQnF
Description
0
[Clearing conditions]
1
(Initial value)
•
Cleared by reading IRQnF flag when IRQnF = 1, then writing 0 to IRQnF flag
•
When interrupt exception handling is executed when low-level detection is set
(IRQnSCB = IRQnSCA = 0) and IRQn input is high
•
When IRQn interrupt exception handling is executed when falling, rising, or both-edge
detection is set (IRQnSCB = 1 or IRQnSCA = 1)
•
When the DTC is activated by an IRQn interrupt, and the DISEL bit in MRB of the
DTC is cleared to 0
[Setting conditions]
•
When IRQn input goes low when low-level detection is set (IRQnSCB = IRQnSCA =
0)
•
When a falling edge occurs in IRQn input when falling edge detection is set
(IRQnSCB = 0, IRQnSCA = 1)
•
When a rising edge occurs in IRQn input when rising edge detection is set
(IRQnSCB = 1, IRQnSCA = 0)
•
When a falling or rising edge occurs in IRQn input when both-edge detection is set
(IRQnSCB = IRQnSCA = 1)
(n = 7 to 0)
5.3
Interrupt Sources
Interrupt sources comprise external interrupts (NMI and IRQ7 to IRQ0) and internal interrupts (52 sources).
5.3.1
External Interrupts
There are nine external interrupts: NMI and IRQ7 to IRQ0. Of these, NMI and IRQ2 to IRQ0 can be used to restore the
H8S/2357 Group from software standby mode.
NMI Interrupt: NMI is the highest-priority interrupt, and is always accepted by the CPU regardless of the status of the
CPU interrupt mask bits. The NMIEG bit in SYSCR can be used to select whether an interrupt is requested at a rising edge
or a falling edge on the NMI pin.
The vector number for NMI interrupt exception handling is 7.
IRQ7 to IRQ0 Interrupts: Interrupts IRQ7 to IRQ0 are requested by an input signal at pins IRQ7 to IRQ0. Interrupts
IRQ7 to IRQ0 have the following features:
• Using ISCR, it is possible to select whether an interrupt is generated by a low level, falling edge, rising edge, or both
edges, at pins IRQ7 to IRQ0.
• Enabling or disabling of interrupt requests IRQ7 to IRQ0 can be selected with IER.
• The interrupt priority level can be set with IPR.
• The status of interrupt requests IRQ7 to IRQ0 is indicated in ISR. ISR flags can be cleared to 0 by software.
A block diagram of interrupts IRQ7 to IRQ0 is shown in figure 5-2.
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REJ09B0138-0600H
IRQnE
IRQnSCA, IRQnSCB
IRQnF
Edge/level
detection circuit
IRQn interrupt
S
Q
request
R
IRQn input
Clear signal
Note: n=7 to 0
Figure 5-2 Block Diagram of Interrupts IRQ7 to IRQ0
Figure 5-3 shows the timing of setting IRQnF.
ø
IRQn
input pin
IRQnF
Figure 5-3 Timing of Setting IRQnF
The vector numbers for IRQ7 to IRQ0 interrupt exception handling are 23 to 16.
Detection of IRQ7 to IRQ0 interrupts does not depend on whether the relevant pin has been set for input or output.
However, when a pin is used as an external interrupt input pin, do not clear the corresponding DDR to 0 and use the pin as
an I/O pin for another function.
5.3.2
Internal Interrupts
There are 52 sources for internal interrupts from on-chip supporting modules.
• For each on-chip supporting module there are flags that indicate the interrupt request status, and enable bits that select
enabling or disabling of these interrupts. If both of these are set to 1 for a particular interrupt source, an interrupt
request is issued to the interrupt controller.
• The interrupt priority level can be set by means of IPR.
• The DMAC and DTC can be activated by a TPU, SCI, or other interrupt request. When the DMAC or DTC is activated
by an interrupt, the interrupt control mode and interrupt mask bits are not affected.
5.3.3
Interrupt Exception Handling Vector Table
Table 5-4 shows interrupt exception handling sources, vector addresses, and interrupt priorities. For default priorities, the
lower the vector number, the higher the priority.
Priorities among modules can be set by means of the IPR. The situation when two or more modules are set to the same
priority, and priorities within a module, are fixed as shown in table 5-4.
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Table 5-4
Interrupt Sources, Vector Addresses, and Interrupt Priorities
Interrupt Source
NMI
IRQ0
Origin of
Interrupt
Source
External
pin
Vector
Address*
Vector
Number
Advanced
Mode
IPR
Priority
7
H'001C
—
High
16
H'0040
IPRA6 to 4
IRQ1
17
H'0044
IPRA2 to 0
IRQ2
IRQ3
18
19
H'0048
H'004C
IPRB6 to 4
IRQ4
IRQ5
20
21
H'0050
H'0054
IPRB2 to 0
IRQ6
IRQ7
22
23
H'0058
H'005C
IPRC6 to 4
SWDTEND (software activation
interrupt end)
DTC
24
H'0060
IPRC2 to 0
WOVI (interval timer)
Watchdog
timer
25
H'0064
IPRD6 to 4
CMI (compare match)
Refresh
controller
26
H'0068
IPRD2 to 0
Reserved
—
27
H'006C
IPRE6 to 4
ADI (A/D conversion end)
A/D
28
H'0070
IPRE2 to 0
Reserved
—
29
30
31
H'0074
H'0078
H'007C
TGI0A (TGR0A input capture/
compare match)
TPU
channel 0
32
H'0080
TGI0B (TGR0B input capture/
compare match)
33
H'0084
TGI0C (TGR0C input capture/
compare match)
34
H'0088
TGI0D (TGR0D input capture/
compare match)
35
H'008C
TCI0V (overflow 0)
36
H'0090
Reserved
—
37
38
39
H'0094
H'0098
H'009C
TGI1A (TGR1A input capture/
compare match)
TPU
channel 1
40
H'00A0
TGI1B (TGR1B input capture/
compare match)
41
H'00A4
TCI1V (overflow 1)
42
H'00A8
TCI1U (underflow 1)
43
H'00AC
44
H'00B0
TGI2B (TGR2B input capture/
compare match)
45
H'00B4
TCI2V (overflow 2)
46
H'00B8
TCI2U (underflow 2)
47
H'00BC
TGI2A (TGR2A input capture/
compare match)
TPU
channel 2
IPRF6 to 4
IPRF2 to 0
IPRG6 to 4
Low
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REJ09B0138-0600H
Interrupt Source
Origin of
Interrupt
Source
TGI3A (TGR3A input capture/
compare match)
TPU
channel 3
Vector
Address*
Vector
Number
Advanced
Mode
IPR
Priority
48
H'00C0
IPRG2 to 0
High
TGI3B (TGR3B input capture/
compare match)
49
H'00C4
TGI3C (TGR3C input capture/
compare match)
50
H'00C8
TGI3D (TGR3D input capture/
compare match)
51
H'00CC
TCI3V (overflow 3)
52
H'00D0
Reserved
—
53
54
55
H'00D4
H'00D8
H'00DC
TGI4A (TGR4A input capture/
compare match)
TPU
channel 4
56
H'00E0
TGI4B (TGR4B input capture/
compare match)
57
H'00E4
TCI4V (overflow 4)
58
H'00E8
TCI4U (underflow 4)
59
H'00EC
60
H'00F0
TGI5B (TGR5B input capture/
compare match)
61
H'00F4
TCI5V (overflow 5)
62
H'00F8
63
H'00FC
64
H'0100
65
H'0104
66
H'0108
TGI5A (TGR5A input capture/
compare match)
TPU
channel 5
TCI5U (underflow 5)
CMIA0 (compare match A0)
CMIB0 (compare match B0)
8-bit timer
channel 0
OVI0 (overflow 0)
Reserved
—
67
H'010C
CMIA1 (compare match A1)
8-bit timer
channel 1
68
H'0110
69
H'0114
70
H'0118
CMIB1 (compare match B1)
OVI1 (overflow 1)
Reserved
—
71
H'011C
DEND0A (channel 0/channel 0A
transfer end)
DMAC
72
H'0120
DEND0B (channel 0B transfer
end)
73
H'0124
DEND1A (channel 1/channel 1A
transfer end)
74
H'0128
DEND1B (channel 1B transfer
end)
75
H'012C
76
77
78
79
H'0130
H'0134
H'0138
H'013C
Reserved
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REJ09B0138-0600H
—
IPRH6 to 4
IPRH2 to 0
IPRI6 to 4
IPRI2 to 0
IPRJ6 to 4
Low
Origin of
Interrupt
Source
Vector
Address*
Vector
Number
Advanced
Mode
IPR
Priority
80
H'0140
IPRJ2 to 0
High
81
H'0144
TXI0 (transmit data empty 0)
82
H'0148
TEI0 (transmission end 0)
83
H'014C
84
H'0150
85
H'0154
86
H'0158
87
H'015C
88
H'0160
Interrupt Source
ERI0 (receive error 0)
RXI0 (reception data full 0)
ERI1 (receive error 1)
RXI1 (reception data full 1)
SCI
channel 0
SCI
channel 1
TXI1 (transmit data empty 1)
TEI1 (transmission end 1)
ERI2 (receive error 2)
RXI2 (reception data full 2)
SCI
channel 2
89
H'0164
TXI2 (transmit data empty 2)
90
H'0168
TEI2 (transmission end 2)
91
H'016C
IPRK6 to 4
IPRK2 to 0
Low
Note: * Lower 16 bits of the start address.
5.4
Interrupt Operation
5.4.1
Interrupt Control Modes and Interrupt Operation
Interrupt operations in the H8S/2357 Group differ depending on the interrupt control mode.
NMI interrupts are accepted at all times except in the reset state and the hardware standby state. In the case of IRQ
interrupts and on-chip supporting module interrupts, an enable bit is provided for each interrupt. Clearing an enable bit to
0 disables the corresponding interrupt request. Interrupt sources for which the enable bits are set to 1 are controlled by the
interrupt controller.
Table 5-5 shows the interrupt control modes.
The interrupt controller performs interrupt control according to the interrupt control mode set by the INTM1 and INTM0
bits in SYSCR, the priorities set in IPR, and the masking state indicated by the I and UI bits in the CPU’s CCR, and bits I2
to I0 in EXR.
Table 5-5
Interrupt Control Modes
SYSCR
Interrupt
Priority Setting
Control Mode INTM1 INTM0 Registers
Interrupt
Mask Bits Description
0
0
—
2
—
1
0
—
I
Interrupt mask control is
performed by the I bit.
1
—
—
Setting prohibited
0
IPR
I2 to I0
8-level interrupt mask control
is performed by bits I2 to I0.
8 priority levels can be set with
IPR.
1
—
—
Setting prohibited
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REJ09B0138-0600H
Figure 5-4 shows a block diagram of the priority decision circuit.
Interrupt
control
mode 0
I
Interrupt
acceptance
control
Default priority
determination
Interrupt source
Vector number
8-level
mask control
IPR
I2 to I0
Interrupt control mode 2
Figure 5-4 Block Diagram of Interrupt Control Operation
(1) Interrupt Acceptance Control
In interrupt control mode 0, interrupt acceptance is controlled by the I bit in CCR.
Table 5-6 shows the interrupts selected in each interrupt control mode.
Table 5-6
Interrupts Selected in Each Interrupt Control Mode (1)
Interrupt Mask Bits
Interrupt Control Mode
I
Selected Interrupts
0
0
All interrupts
1
NMI interrupts
×
All interrupts
2
× : Don't care
(2) 8-Level Control
In interrupt control mode 2, 8-level mask level determination is performed for the selected interrupts in interrupt
acceptance control according to the interrupt priority level (IPR).
The interrupt source selected is the interrupt with the highest priority level, and whose priority level set in IPR is higher
than the mask level.
Table 5-7
Interrupts Selected in Each Interrupt Control Mode (2)
Interrupt Control Mode
Selected Interrupts
0
All interrupts
2
Highest-priority-level (IPR) interrupt whose priority level is greater
than the mask level (IPR > I2 to I0).
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(3) Default Priority Determination
When an interrupt is selected by 8-level control, its priority is determined and a vector number is generated.
If the same value is set for IPR, acceptance of multiple interrupts is enabled, and so only the interrupt source with the
highest priority according to the preset default priorities is selected and has a vector number generated.
Interrupt sources with a lower priority than the accepted interrupt source are held pending.
Table 5-8 shows operations and control signal functions in each interrupt control mode.
Table 5-8
Operations and Control Signal Functions in Each Interrupt Control Mode
Interrupt
Control Setting
Mode
INTM1 INTM0
0
2
0
1
Interrupt
Acceptance Control
I
0
IM
0
× —*
Default
8-Level Control Priority
I2 to I0 IPR
Determination
× —
1
IM
T
(Trace)
—* 2
—
PR
T
Legend
: Interrupt operation control performed
×: No operation. (All interrupts enabled)
IM: Used as interrupt mask bit
PR: Sets priority
—: Not used
Notes: 1. Set to 1 when interrupt is accepted.
2. Keep the initial setting.
5.4.2
Interrupt Control Mode 0
Enabling and disabling of IRQ interrupts and on-chip supporting module interrupts can be set by means of the I bit in the
CPU’s CCR. Interrupts are enabled when the I bit is cleared to 0, and disabled when set to 1.
Figure 5-5 shows a flowchart of the interrupt acceptance operation in this case.
[1] If an interrupt source occurs when the corresponding interrupt enable bit is set to 1, an interrupt request is sent to the
interrupt controller.
[2] The I bit is then referenced. If the I bit is cleared to 0, the interrupt request is accepted. If the I bit is set to 1, only an
NMI interrupt is accepted, and other interrupt requests are held pending.
[3] Interrupt requests are sent to the interrupt controller, the highest-ranked interrupt according to the priority system is
accepted, and other interrupt requests are held pending.
[4] When an interrupt request is accepted, interrupt exception handling starts after execution of the current instruction has
been completed.
[5] The PC and CCR are saved to the stack area by interrupt exception handling. The PC saved on the stack shows the
address of the first instruction to be executed after returning from the interrupt handling routine.
[6] Next, the I bit in CCR is set to 1. This masks all interrupts except NMI.
[7] A vector address is generated for the accepted interrupt, and execution of the interrupt handling routine starts at the
address indicated by the contents of that vector address.
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Program execution status
No
Interrupt generated?
Yes
Yes
NMI
No
No
I=0
Hold pending
Yes
No
IRQ0
Yes
IRQ1
No
Yes
TEI2
Yes
Save PC and CCR
I←1
Read vector address
Branch to interrupt handling routine
Figure 5-5 Flowchart of Procedure Up to Interrupt Acceptance in Interrupt Control Mode 0
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5.4.3
Interrupt Control Mode 2
Eight-level masking is implemented for IRQ interrupts and on-chip supporting module interrupts by comparing the
interrupt mask level set by bits I2 to I0 of EXR in the CPU with IPR.
Figure 5-6 shows a flowchart of the interrupt acceptance operation in this case.
[1] If an interrupt source occurs when the corresponding interrupt enable bit is set to 1, an interrupt request is sent to the
interrupt controller.
[2] When interrupt requests are sent to the interrupt controller, the interrupt with the highest priority according to the
interrupt priority levels set in IPR is selected, and lower-priority interrupt requests are held pending. If a number of
interrupt requests with the same priority are generated at the same time, the interrupt request with the highest priority
according to the priority system shown in table 5-4 is selected.
[3] Next, the priority of the selected interrupt request is compared with the interrupt mask level set in EXR. An interrupt
request with a priority no higher than the mask level set at that time is held pending, and only an interrupt request with
a priority higher than the interrupt mask level is accepted.
[4] When an interrupt request is accepted, interrupt exception handling starts after execution of the current instruction has
been completed.
[5] The PC, CCR, and EXR are saved to the stack area by interrupt exception handling. The PC saved on the stack shows
the address of the first instruction to be executed after returning from the interrupt handling routine.
[6] The T bit in EXR is cleared to 0. The interrupt mask level is rewritten with the priority level of the accepted interrupt.
If the accepted interrupt is NMI, the interrupt mask level is set to H'7.
[7] A vector address is generated for the accepted interrupt, and execution of the interrupt handling routine starts at the
address indicated by the contents of that vector address.
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Program execution status
Interrupt generated?
No
Yes
Yes
NMI
No
Level 7 interrupt?
No
Yes
Mask level 6
or below?
Yes
Level 6 interrupt?
No
No
Yes
Mask level 5
or below?
Level 1 interrupt?
No
No
Yes
Yes
Mask level 0
No
Yes
Save PC, CCR, and EXR
Hold pending
Clear T bit to 0
Update mask level
Read vector address
Branch to interrupt handling routine
Figure 5-6 Flowchart of Procedure Up to Interrupt Acceptance in Interrupt Control Mode 2
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REJ09B0138-0600H
(1)
(2)
(4)
(3)
Instruction
prefetch
Internal
operation
Instruction prefetch address (Not executed.
This is the contents of the saved PC, the return address.)
(2) (4) Instruction code (Not executed.)
(3)
Instruction prefetch address (Not executed.)
(5)
SP-2
(7)
SP-4
(1)
Internal
data bus
Internal
write signal
Internal
read signal
Internal
address bus
Interrupt
request signal
ø
Interrupt level determination
Wait for end of instruction
Interrupt
acceptance
(5)
(7)
(8)
(9)
(10)
Vector fetch
(12)
(11)
Internal
operation
(14)
(13)
Interrupt service
routine instruction
prefetch
(6) (8)
Saved PC and saved CCR
(9) (11) Vector address
(10) (12) Interrupt handling routine start address (vector
address contents)
(13)
Interrupt handling routine start address ((13) = (10) (12))
(14)
First instruction of interrupt handling routine
(6)
Stack
5.4.4
Interrupt Exception Handling Sequence
Figure 5-7 shows the interrupt exception handling sequence. The example shown is for the case where interrupt control
mode 0 is set in advanced mode, and the program area and stack area are in on-chip memory.
Figure 5-7 Interrupt Exception Handling
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5.4.5
Interrupt Response Times
The H8S/2357 Group is capable of fast word transfer instruction to on-chip memory, and the program area is provided in
on-chip ROM and the stack area in on-chip RAM, enabling high-speed processing.
Table 5-9 shows interrupt response times - the interval between generation of an interrupt request and execution of the
first instruction in the interrupt handling routine. The execution status symbols used in table 5-9 are explained in table 510.
Table 5-9
Interrupt Response Times
Advanced Mode
No.
Execution Status
INTM1 = 0
INTM1 = 1
1
Interrupt priority determination* 1
3
3
2
Number of wait states until executing
instruction ends* 2
1 to (19+2·SI)
1 to (19+2·SI)
3
PC, CCR, EXR stack save
2·S K
3·S K
4
Vector fetch
2·S I
2·S I
2·S I
2·S I
2
2
12 to 32
13 to 33
5
6
Instruction fetch*
3
Internal processing*
4
Total (using on-chip memory)
Notes: 1.
2.
3.
4.
Two states in case of internal interrupt.
Refers to MULXS and DIVXS instructions.
Prefetch after interrupt acceptance and interrupt handling routine prefetch.
Internal processing after interrupt acceptance and internal processing after vector fetch.
Table 5-10 Number of States in Interrupt Handling Routine Execution Statuses
Object of Access
External Device
8-Bit Bus
Symbol
Instruction fetch
SI
Branch address read
SJ
Stack manipulation
SK
Internal
Memory
2-State
Access
3-State
Access
2-State
Access
3-State
Access
1
4
6 + 2m
2
3+m
Legend:
m: Number of wait states in an external device access.
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16-Bit Bus
5.5
Usage Notes
5.5.1
Contention between Interrupt Generation and Disabling
When an interrupt enable bit is cleared to 0 to disable interrupts, the disabling becomes effective after execution of the
instruction.
In other words, when an interrupt enable bit is cleared to 0 by an instruction such as BCLR or MOV, if an interrupt is
generated during execution of the instruction, the interrupt concerned will still be enabled on completion of the instruction,
and so interrupt exception handling for that interrupt will be executed on completion of the instruction. However, if there
is an interrupt request of higher priority than that interrupt, interrupt exception handling will be executed for the higherpriority interrupt, and the lower-priority interrupt will be ignored.
The same also applies when an interrupt source flag is cleared.
Figure 5-8 shows an example in which the TGIEA bit in the TPU’s TIER0 register is cleared to 0.
TIER0 write cycle by CPU
TGI0A exception handling
ø
Internal
address bus
TIER0 address
Internal
write signal
TGIEA
TGFA
TGI0A
interrupt signal
Figure 5-8 Contention between Interrupt Generation and Disabling
The above contention will not occur if an enable bit or interrupt source flag is cleared to 0 while the interrupt is masked.
5.5.2
Instructions that Disable Interrupts
Instructions that disable interrupts are LDC, ANDC, ORC, and XORC. After any of these instructions is executed, all
interrupts including NMI are disabled and the next instruction is always executed. When the I bit is set by one of these
instructions, the new value becomes valid two states after execution of the instruction ends.
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5.5.3
Times when Interrupts are Disabled
There are times when interrupt acceptance is disabled by the interrupt controller.
The interrupt controller disables interrupt acceptance for a 3-state period after the CPU has updated the mask level with an
LDC, ANDC, ORC, or XORC instruction.
5.5.4
Interrupts during Execution of EEPMOV Instruction
Interrupt operation differs between the EEPMOV.B instruction and the EEPMOV.W instruction.
With the EEPMOV.B instruction, an interrupt request (including NMI) issued during the transfer is not accepted until the
move is completed.
With the EEPMOV.W instruction, if an interrupt request is issued during the transfer, interrupt exception handling starts at
a break in the transfer cycle. The PC value saved on the stack in this case is the address of the next instruction.
Therefore, if an interrupt is generated during execution of an EEPMOV.W instruction, the following coding should be
used.
L1:
EEPMOV.W
MOV.W
R4,R4
BNE
L1
5.6
DTC and DMAC Activation by Interrupt
5.6.1
Overview
The DTC and DMAC can be activated by an interrupt. In this case, the following options are available:
•
•
•
•
Interrupt request to CPU
Activation request to DTC
Activation request to DMAC
Selection of a number of the above
For details of interrupt requests that can be used with to activate the DTC or DMAC, see section 8, Data Transfer
Controller, and section 7, DMA Controller.
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5.6.2
Block Diagram
Figure 5-9 shows a block diagram of the DTC and DMAC interrupt controller.
Interrupt
request
IRQ
interrupt
Interrupt source
On-chip clear signal
supporting
module
Clear signal
Disable signal
DMAC
DTC activation
request vector
number
Selection
circuit
Select
signal
Clear signal
DTCER
Control logic
DTC
Clear signal
DTVECR
SWDTE
clear signal
Interrupt controller
Determination of
priority
CPU interrupt
request vector
number
CPU
I, I2 to I0
Figure 5-9 Interrupt Control for DTC and DMAC
5.6.3
Operation
The interrupt controller has three main functions in DTC and DMAC control.
Selection of Interrupt Source: With the DMAC, the activation source is input directly to each channel. The activation
source for each DMAC channel is selected with bits DTF3 to DTF0 in DMACR. Whether the selected activation source is
to be managed by the DMAC can be selected with the DTA bit of DMABCR. When the DTA bit is set to 1, the interrupt
source constituting that DMAC activation source is not a DTC activation source or CPU interrupt source.
For interrupt sources other than interrupts managed by the DMAC, it is possible to select DTC activation request or CPU
interrupt request with the DTCE bit of DTCERA to DTCERF in the DTC.
After a DTC data transfer, the DTCE bit can be cleared to 0 and an interrupt request sent to the CPU in accordance with
the specification of the DISEL bit of MRB in the DTC.
When the DTC has performed the specified number of data transfers and the transfer counter value is zero, the DTCE bit
is cleared to 0 and an interrupt request is sent to the CPU after the DTC data transfer.
Determination of Priority: The DTC activation source is selected in accordance with the default priority order, and is not
affected by mask or priority levels. See section 7.6, Interrupts, and section 8.3.3, DTC Vector Table, for the respective
priorities.
With the DMAC, the activation source is input directly to each channel.
Operation Order: If the same interrupt is selected as a DTC activation source and a CPU interrupt source, the DTC data
transfer is performed first, followed by CPU interrupt exception handling.
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If the same interrupt is selected as a DMAC activation source and a DTC activation source or CPU interrupt source,
operations are performed for them independently according to their respective operating statuses and bus mastership
priorities.
Table 5-11 summarizes interrupt source selection and interrupt source clearance control according to the settings of the
DTA bit of DMABCR in the DMAC, the DTCE bit of DTCERA to DTCERF in the DTC and the DISEL bit of MRB in
the DTC.
Table 5-11 Interrupt Source Selection and Clearing Control
Settings
DMAC
DTC
Interrupt Source Selection/Clearing Control
DTA
DTCE
DISEL
0
0
1
DMAC
DTC
CPU
*
×
∆
0
∆
×
∆
1
1
*
*
∆
×
×
Legend:
∆ : The relevant interrupt is used. Interrupt source clearing is performed.
(The CPU should clear the source flag in the interrupt handling routine.)
: The relevant interrupt is used. The interrupt source is not cleared.
× : The relevant bit cannot be used.
* : Don't care
5.6.4
Note on Use
SCI and A/D converter interrupt sources are cleared when the DMAC or DTC reads or writes to the prescribed register,
and are not dependent upon the DTA bit or DISEL bit.
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Section 6 Bus Controller
6.1
Overview
The H8S/2357 Group has a on-chip bus controller (BSC) that manages the external address space divided into eight areas.
The bus specifications, such as bus width and number of access states, can be set independently for each area, enabling
multiple memories to be connected easily.
The bus controller also has a bus arbitration function, and controls the operation of the internal bus masters: the CPU,
DMA controller (DMAC), and data transfer controller (DTC).
6.1.1
Features
The features of the bus controller are listed below.
• Manages external address space in area units
 In advanced mode, manages the external space as 8 areas of 2-Mbytes
 Bus specifications can be set independently for each area
 DRAM/burst ROM interfaces can be set
• Basic bus interface
 Chip select (CS0 to CS7) can be output for areas 0 to 7
 8-bit access or 16-bit access can be selected for each area
 2-state access or 3-state access can be selected for each area
 Program wait states can be inserted for each area
• DRAM interface
 DRAM interface can be set for areas 2 to 5 (in advanced mode)
 Row address/column address multiplexed output (8/9/10 bits)
 Two byte access methods (2-CAS)
 Burst operation (fast page mode)
 TP cycle insertion to secure RAS precharging time
 Choice of CAS-before-RAS refreshing or self-refreshing
• Burst ROM interface
 Burst ROM interface can be set for area 0
 Choice of 1- or 2-state burst access
• Idle cycle insertion
 An idle cycle can be inserted in case of an external read cycle between different areas
 An idle cycle can be inserted in case of an external write cycle immediately after an external read cycle
• Write buffer functions
 External write cycle and internal access can be executed in parallel
 DMAC single-address mode and internal access can be executed in parallel
• Bus arbitration function
 Includes a bus arbiter that arbitrates bus mastership among the CPU, DMAC, and DTC
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• Other features
 Refresh counter (refresh timer) can be used as an interval timer
 External bus release function
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6.1.2
Block Diagram
Figure 6-1 shows a block diagram of the bus controller.
CS0 to CS7
Internal
address bus
Area decoder
ABWCR
External bus control signals
ASTCR
BCRH
BCRL
BREQ
BACK
Bus controller
Internal control
signals
BREQO
WAIT
Wait controller
WCRH
WCRL
DRAM controller
Internal data bus
Bus mode signal
MCR
External DRAM
signals
DRAMCR
RTCNT
RTCOR
CPU bus request signal
DTC bus request signal
Bus arbiter
DMAC bus request signal
CPU bus acknowledge signal
DTC bus acknowledge signal
DMAC bus acknowledge signal
Figure 6-1 Block Diagram of Bus Controller
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6.1.3
Pin Configuration
Table 6-1 summarizes the pins of the bus controller.
Table 6-1
Bus Controller Pins
Name
Symbol I/O
Function
Address strobe
AS
Output
Strobe signal indicating that address output on
address bus is enabled.
Read
RD
Output
Strobe signal indicating that external space is
being read.
High write/write enable
HWR
Output
Strobe signal indicating that external space is to
be written, and upper half (D 15 to D8) of data bus is
enabled.
2-CAS DRAM write enable signal.
Low write
LWR
Output
Strobe signal indicating that external space is to
be written, and lower half (D7 to D0) of data bus is
enabled.
Chip select 0
CS0
Output
Strobe signal indicating that area 0 is selected.
Chip select 1
CS1
Output
Strobe signal indicating that area 1 is selected.
Chip select 2/row address
strobe 2
CS2
Output
Strobe signal indicating that area 2 is selected.
DRAM row address strobe signal when area 2 is
in DRAM space.
Chip select 3/row address
strobe 3
CS3
Output
Strobe signal indicating that area 3 is selected.
DRAM row address strobe signal when area 3 is
in DRAM space.
Chip select 4/row address
strobe 4
CS4
Output
Strobe signal indicating that area 4 is selected.
DRAM row address strobe signal when area 4 is
in DRAM space.
Chip select 5/row address
strobe 5
CS5
Output
Strobe signal indicating that area 5 is selected.
DRAM row address strobe signal when area 5 is
in DRAM space.
Chip select 6
CS6
Output
Strobe signal indicating that area 6 is selected.
Chip select 7
CS7
Output
Strobe signal indicating that area 7 is selected.
Upper column address strobe
CAS
Output
2-CAS DRAM upper column address strobe
signal.
Lower column strobe
LCAS
Output
DRAM lower column address strobe signal.
Wait
WAIT
Input
Wait request signal when accessing external 3state access space.
Bus request
BREQ
Input
Request signal that releases bus to external
device.
Bus request acknowledge
BACK
Output
Acknowledge signal indicating that bus has been
released.
Bus request output
BREQO Output
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External bus request signal used when internal
bus master accesses external space when
external bus is released.
6.1.4
Register Configuration
Table 6-2 summarizes the registers of the bus controller.
Table 6-2
Bus Controller Registers
Initial Value
Name
Abbreviation
R/W
Power-On
Reset
Manual
Reset* 3
Address* 1
Bus width control register
ABWCR
R/W
H'FF/H'00* 2
Retained
H'FED0
Access state control register
ASTCR
R/W
H'FF
Retained
H'FED1
Wait control register H
WCRH
R/W
H'FF
Retained
H'FED2
Wait control register L
WCRL
R/W
H'FF
Retained
H'FED3
Bus control register H
BCRH
R/W
H'D0
Retained
H'FED4
Bus control register L
BCRL
R/W
H'3C
Retained
H'FED5
Memory control register
MCR
R/W
H'00
Retained
H'FED6
DRAM control register
DRAMCR
R/W
H'00
Retained
H'FED7
Refresh timer/counter
RTCNT
R/W
H'00
Retained
H'FED8
Refresh time constant register
RTCOR
R/W
H'FF
Retained
H'FED9
Notes: 1. Lower 16 bits of the address.
2. Determined by the MCU operating mode.
3. Manual reset is only supported in the H8S/2357 ZTAT.
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6.2
Register Descriptions
6.2.1
Bus Width Control Register (ABWCR)
Bit
:
7
6
5
4
3
2
1
0
ABW7
ABW6
ABW5
ABW4
ABW3
ABW2
ABW1
ABW0
1
1
1
1
1
1
1
1
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
0
0
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Modes 5 to 7
Initial value :
R/W
:
Mode 4
Initial value :
R/W
:
ABWCR is an 8-bit readable/writable register that designates each area for either 8-bit access or 16-bit access.
ABWCR sets the data bus width for the external memory space. The bus width for on-chip memory and internal I/O
registers is fixed regardless of the settings in ABWCR.
After a power-on reset and in hardware standby mode, ABWCR is initialized to H'FF in modes 5 to 7,*1 and to H'00 in
mode 4. It is not initialized by a manual reset*2 or in software standby mode.
Notes: 1. In ROMless version, modes 6 and 7 are not available.
2. Manual reset is only supported in the H8S/2357 ZTAT.
Bits 7 to 0—Area 7 to 0 Bus Width Control (ABW7 to ABW0): These bits select whether the corresponding area is to
be designated for 8-bit access or 16-bit access.
Bit n
ABWn
Description
0
Area n is designated for 16-bit access
1
Area n is designated for 8-bit access
(n = 7 to 0)
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6.2.2
Access State Control Register (ASTCR)
Bit
:
Initial value :
R/W
:
7
6
5
4
3
2
1
0
AST7
AST6
AST5
AST4
AST3
AST2
AST1
AST0
1
1
1
1
1
1
1
1
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
ASTCR is an 8-bit readable/writable register that designates each area as either a 2-state access space or a 3-state access
space.
ASTCR sets the number of access states for the external memory space. The number of access states for on-chip memory
and internal I/O registers is fixed regardless of the settings in ASTCR.
ASTCR is initialized to H'FF by a power-on reset and in hardware standby mode. It is not initialized by a manual reset* or
in software standby mode.
Note: * Manual reset is only supported in the H8S/2357 ZTAT.
Bits 7 to 0—Area 7 to 0 Access State Control (AST7 to AST0): These bits select whether the corresponding area is to
be designated as a 2-state access space or a 3-state access space.
Wait state insertion is enabled or disabled at the same time.
Bit n
ASTn
Description
0
Area n is designated for 2-state access
Wait state insertion in area n external space is disabled
1
Area n is designated for 3-state access
Wait state insertion in area n external space is enabled
(Initial value)
(n = 7 to 0)
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6.2.3
Wait Control Registers H and L (WCRH, WCRL)
WCRH and WCRL are 8-bit readable/writable registers that select the number of program wait states for each area.
Program waits are not inserted in the case of on-chip memory or internal I/O registers.
WCRH and WCRL are initialized to H'FF by a power-on reset and in hardware standby mode. They are not initialized by
a manual reset* or in software standby mode.
Note: * Manual reset is only supported in the H8S/2357 ZTAT.
(1) WCRH
Bit
:
Initial value :
R/W
:
7
6
5
4
3
2
1
0
W71
W70
W61
W60
W51
W50
W41
W40
1
1
1
1
1
1
1
1
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Bits 7 and 6—Area 7 Wait Control 1 and 0 (W71, W70): These bits select the number of program wait states when area
7 in external space is accessed while the AST7 bit in ASTCR is set to 1.
Bit 7
W71
Bit 6
W70
Description
0
0
Program wait not inserted when external space area 7 is accessed
1
1 program wait state inserted when external space area 7 is accessed
0
2 program wait states inserted when external space area 7 is accessed
1
3 program wait states inserted when external space area 7 is accessed
(Initial value)
1
Bits 5 and 4—Area 6 Wait Control 1 and 0 (W61, W60): These bits select the number of program wait states when area
6 in external space is accessed while the AST6 bit in ASTCR is set to 1.
Bit 5
W61
Bit 4
W60
Description
0
0
Program wait not inserted when external space area 6 is accessed
1
1 program wait state inserted when external space area 6 is accessed
0
2 program wait states inserted when external space area 6 is accessed
1
3 program wait states inserted when external space area 6 is accessed
(Initial value)
1
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Bits 3 and 2—Area 5 Wait Control 1 and 0 (W51, W50): These bits select the number of program wait states when area
5 in external space is accessed while the AST5 bit in ASTCR is set to 1.
Bit 3
W51
Bit 2
W50
Description
0
0
Program wait not inserted when external space area 5 is accessed
1
1 program wait state inserted when external space area 5 is accessed
0
2 program wait states inserted when external space area 5 is accessed
1
3 program wait states inserted when external space area 5 is accessed
(Initial value)
1
Bits 1 and 0—Area 4 Wait Control 1 and 0 (W41, W40): These bits select the number of program wait states when area
4 in external space is accessed while the AST4 bit in ASTCR is set to 1.
Bit 1
W41
Bit 0
W40
Description
0
0
Program wait not inserted when external space area 4 is accessed
1
1 program wait state inserted when external space area 4 is accessed
0
2 program wait states inserted when external space area 4 is accessed
1
3 program wait states inserted when external space area 4 is accessed
(Initial value)
1
(2) WCRL
Bit
:
Initial value :
R/W
:
7
6
5
4
3
2
1
0
W31
W30
W21
W20
W11
W10
W01
W00
1
1
1
1
1
1
1
1
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Bits 7 and 6—Area 3 Wait Control 1 and 0 (W31, W30): These bits select the number of program wait states when area
3 in external space is accessed while the AST3 bit in ASTCR is set to 1.
Bit 7
W31
Bit 6
W30
Description
0
0
Program wait not inserted when external space area 3 is accessed
1
1 program wait state inserted when external space area 3 is accessed
0
2 program wait states inserted when external space area 3 is accessed
1
3 program wait states inserted when external space area 3 is accessed
(Initial value)
1
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Bits 5 and 4—Area 2 Wait Control 1 and 0 (W21, W20): These bits select the number of program wait states when area
2 in external space is accessed while the AST2 bit in ASTCR is set to 1.
Bit 5
W21
Bit 4
W20
Description
0
0
Program wait not inserted when external space area 2 is accessed
1
1 program wait state inserted when external space area 2 is accessed
0
2 program wait states inserted when external space area 2 is accessed
1
3 program wait states inserted when external space area 2 is accessed
(Initial value)
1
Bits 3 and 2—Area 1 Wait Control 1 and 0 (W11, W10): These bits select the number of program wait states when area
1 in external space is accessed while the AST1 bit in ASTCR is set to 1.
Bit 3
W11
Bit 2
W10
Description
0
0
Program wait not inserted when external space area 1 is accessed
1
1 program wait state inserted when external space area 1 is accessed
0
2 program wait states inserted when external space area 1 is accessed
1
3 program wait states inserted when external space area 1 is accessed
(Initial value)
1
Bits 1 and 0—Area 0 Wait Control 1 and 0 (W01, W00): These bits select the number of program wait states when area
0 in external space is accessed while the AST0 bit in ASTCR is set to 1.
Bit 1
W01
Bit 0
W00
Description
0
0
Program wait not inserted when external space area 0 is accessed
1
1 program wait state inserted when external space area 0 is accessed
0
2 program wait states inserted when external space area 0 is accessed
1
3 program wait states inserted when external space area 0 is accessed
(Initial value)
1
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6.2.4
Bus Control Register H (BCRH)
Bit
:
Initial value :
R/W
:
7
6
5
4
ICIS1
ICIS0
1
1
0
1
R/W
R/W
R/W
R/W
3
2
1
0
RMTS2
RMTS1
RMTS0
0
0
0
0
R/W
R/W
R/W
R/W
BRSTRM BRSTS1 BRSTS0
BCRH is an 8-bit readable/writable register that selects enabling or disabling of idle cycle insertion, and the memory
interface for areas 2 to 5 and area 0.
BCRH is initialized to H'D0 by a power-on reset and in hardware standby mode. It is not initialized by a manual reset* or
in software standby mode.
Note: * Manual reset is only supported in the H8S/2357 ZTAT.
Bit 7—Idle Cycle Insert 1 (ICIS1): Selects whether or not one idle cycle state is to be inserted between bus cycles when
successive external read cycles are performed in different areas.
Bit 7
ICIS1
Description
0
Idle cycle not inserted in case of successive external read cycles in different areas
1
Idle cycle inserted in case of successive external read cycles in different areas
(Initial value)
Bit 6—Idle Cycle Insert 0 (ICIS0): Selects whether or not one idle cycle state is to be inserted between bus cycles when
successive external read and external write cycles are performed .
Bit 6
ICIS0
Description
0
Idle cycle not inserted in case of successive external read and external write cycles
1
Idle cycle inserted in case of successive external read and external write cycles
(Initial value)
Bit 5—Burst ROM Enable (BRSTRM): Selects whether area 0 is used as a burst ROM interface.
Bit 5
BRSTRM
Description
0
Area 0 is basic bus interface
1
Area 0 is burst ROM interface
(Initial value)
Bit 4—Burst Cycle Select 1 (BRSTS1): Selects the number of burst cycles for the burst ROM interface.
Bit 4
BRSTS1
Description
0
Burst cycle comprises 1 state
1
Burst cycle comprises 2 states
(Initial value)
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Bit 3—Burst Cycle Select 0 (BRSTS0): Selects the number of words that can be accessed in a burst ROM interface burst
access.
Bit 3
BRSTS0
Description
0
Max. 4 words in burst access
1
Max. 8 words in burst access
(Initial value)
Bits 2 to 0—RAM Type Select (RMTS2 to RMTS0): These bits select the memory interface for areas 2 to 5 in advanced
mode.
When DRAM space is selected, the relevant area is designated as DRAM interface.
Bit 2
RMTS2
Bit 1
RMTS1
Bit 0
RMTS0
Description
Area 5
0
0
0
Normal space
1
Normal space
0
Normal space
1
DRAM space
—
—
1
1
—
Area 4
Area 3
Area 2
DRAM space
DRAM space
Note: When areas selected in DRAM space are all 8-bit space, the PF 2 pin can be used as an I/O port, BREQO, or WAIT.
6.2.5
Bus Control Register L (BCRL)
Bit
:
Initial value :
R/W
:
7
6
5
4
3
2
1
0
BRLE
BREQOE
EAE
LCASS
DDS
—
WDBE
WAITE
0
0
1
1
1
1
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
BCRL is an 8-bit readable/writable register that performs selection of the external bus-released state protocol, the LCAS
signal, DMAC single address transfer, enabling or disabling of the write data buffer function, and enabling or disabling of
WAIT pin input.
BCRL is initialized to H'3C by a power-on reset and in hardware standby mode. It is not initialized by a manual reset* or
in software standby mode.
Note: * Manual reset is only supported in the H8S/2357 ZTAT.
Bit 7—Bus Release Enable (BRLE): Enables or disables external bus release.
Bit 7
BRLE
Description
0
External bus release is disabled. BREQ, BACK, and BREQO can be used as I/O ports.
(Initial value)
1
External bus release is enabled.
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Bit 6—BREQO Pin Enable (BREQOE): Outputs a signal that requests the external bus master to drop the bus request
signal (BREQ) in the external bus release state, when an internal bus master performs an external space access, or when a
refresh request is generated.
Bit 6
BREQOE
Description
0
BREQO output disabled. BREQO can be used as I/O port.
1
BREQO output enabled.
(Initial value)
Bit 5—External Address Enable (EAE): Selects whether addresses H'010000 to H'01FFFF*2 are to be internal addresses
or external addresses.
Bit 5
EAE
Description
0
Addresses H'010000 to H'01FFFF* 2 are in on-chip ROM
1
Addresses H'010000 to H'01FFFF* 2 are external addresses (external expansion mode)
or a reserved area* 1 (single-chip mode)
(Initial value)
Notes: 1. Reserved areas should not be accessed.
2. Addresses H'010000 to H'01FFFF are in the H8S/2357. Addresses H'010000 to H'03FFFF are in the H8S/2398.
Bit 4—LCAS Select (LCASS): Write 0 to this bit when using the DRAM interface.
LCAS pin used for 2-CAS type DRAM interface LCAS signal. BREQO output and WAIT input cannot be used when
LCAS signal is used.
Bit 3—DACK Timing Select (DDS): Selects the DMAC single address transfer bus timing for the DRAM interface.
Bit 3
DDS
0
Description
When DMAC single address transfer is performed in DRAM space, full access is
always executed
DACK signal goes low from T r or T1 cycle
1
Burst access is possible when DMAC single address transfer is performed in DRAM
space
DACK signal goes low from T c1 or T2 cycle
(Initial value)
Bit 2—Reserved: Only 1 should be written to this bit.
Bit 1—Write Data Buffer Enable (WDBE): Selects whether or not the write buffer function is used for an external write
cycle or DMAC single address cycle.
Bit 1
WDBE
Description
0
Write data buffer function not used
1
Write data buffer function used
(Initial value)
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Bit 0—WAIT Pin Enable (WAITE): Selects enabling or disabling of wait input by the WAIT pin.
6.2.6
Bit 0
WAITE
Description
0
Wait input by WAIT pin disabled. WAIT pin can be used as I/O port.
1
Wait input by WAIT pin enabled
(Initial value)
Memory Control Register (MCR)
Bit
:
Initial value :
R/W
:
7
6
5
4
3
2
1
0
TPC
BE
RCDM
CW2
MXC1
MXC0
RLW1
RLW0
0
0
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
MCR is an 8-bit readable/writable register that selects the DRAM strobe control method, number of precharge cycles,
access mode, address multiplexing shift size, and the number of wait states inserted during refreshing, when areas 2 to 5
are designated as DRAM interface.
MCR is initialized to H'00 by a power-on reset and in hardware standby mode. It is not initialized by a manual reset* or in
software standby mode.
Note: * Manual reset is only supported in the H8S/2357 ZTAT.
Bit 7—TP Cycle Control (TPC): Selects whether a 1-state or 2-state precharge cycle (TP) is to be used when areas 2 to 5
designated as DRAM space are accessed.
Bit 7
TPC
Description
0
1-state precharge cycle is inserted
1
2-state precharge cycle is inserted
(Initial value)
Bit 6—Burst Access Enable (BE): Selects enabling or disabling of burst access to areas 2 to 5 designated as DRAM
space. DRAM space burst access is performed in fast page mode.
Bit 6
BE
Description
0
Burst disabled (always full access)
1
For DRAM space access, access in fast page mode
(Initial value)
Bit 5—RAS Down Mode (RCDM): When areas 2 to 5 are designated as DRAM space and access to DRAM is
interrupted, RCDM selects whether the next DRAM access is waited for with the RAS signal held low (RAS down mode),
or the RAS signal is driven high again (RAS up mode).
Bit 5
RCDM
Description
0
DRAM interface: RAS up mode selected
1
DRAM interface: RAS down mode selected
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(Initial value)
Bit 4—2-CAS Method Select (CW2): Write 1 to this bit when areas 2 to 5 are designated as 8-bit DRAM space, and 0
otherwise.
Bit 4
CW2
Description
0
16-bit DRAM space selected
1
8-bit DRAM space selected
(Initial value)
Bits 3 and 2—Multiplex Shift Count 1 and 0 (MXC1, MXC0): These bits select the size of the shift to the lower half of
the row address in row address/column address multiplexing for the DRAM interface. In burst operation on the DRAM
interface, these bits also select the row address to be used for comparison.
Bit 3
MXC1
Bit 2
MXC0
0
0
8-bit shift
(Initial value)
• When 8-bit access space is designated: Row address A23 to A 8 used
for comparison
• When 16-bit access space is designated: Row address A23 to A 9 used
for comparison
1
9-bit shift
• When 8-bit access space is designated: Row address A23 to A 9 used
for comparison
• When 16-bit access space is designated: Row address A23 to A 10 used
for comparison
0
10-bit shift
• When 8-bit access space is designated: Row address A23 to A 10 used
for comparison
• When 16-bit access space is designated: Row address A23 to A 11 used
for comparison
1
—
1
Description
Bits 1 and 0—Refresh Cycle Wait Control 1 and 0 (RLW1, RLW0): These bits select the number of wait states to be
inserted in a DRAM interface CAS-before-RAS refresh cycle. This setting is used for all areas designated as DRAM
space. Wait input by the WAIT pin is disabled.
Bit 1
RLW1
Bit 0
RLW0
Description
0
0
No wait state inserted
1
1 wait state inserted
1
0
2 wait states inserted
1
3 wait states inserted
(Initial value)
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6.2.7
DRAM Control Register (DRAMCR)
Bit
:
7
6
5
4
3
2
1
0
RFSHE
RCW
RMODE
CMF
CMIE
CKS2
CKS1
CKS0
0
0
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Initial value :
R/W
:
DRAMCR is an 8-bit readable/writable register that selects the DRAM refresh mode and refresh counter clock, and
controls the refresh timer.
DRAMCR is initialized to H'00 by a power-on reset and in hardware standby mode. It is not initialized by a manual reset*
or in software standby mode.
Note: * Manual reset is only supported in the H8S/2357 ZTAT.
Bit 7—Refresh Control (RFSHE): Selects whether or not refresh control is performed. When refresh control is not
performed, the refresh timer can be used as an interval timer.
Bit 7
RFSHE
Description
0
Refresh control is not performed
1
Refresh control is performed
(Initial value)
Bit 6—RAS-CAS Wait (RCW): Controls wait state insertion in DRAM interface CAS-before-RAS refreshing.
Bit 6
RCW
Description
0
Wait state insertion in CAS-before-RAS refreshing disabled
RAS falls in TRr cycle
1
One wait state inserted in CAS-before-RAS refreshing
RAS falls in TRc1 cycle
(Initial value)
Bit 5—Refresh Mode (RMODE): When refresh control is performed (RFSHE = 1), this bit selects whether normal
refreshing (CAS-before-RAS refreshing for the DRAM interface) or self-refreshing is performed.
Bit 5
RMODE
0
1
Description
DRAM interface
CAS-before-RAS refreshing used
(Initial value)
Self-refreshing used
Bit 4—Compare Match Flag (CMF): Status flag that indicates a match between the values of RTCNT and RTCOR.
When refresh control is performed (RFSHE = 1), 1 should be written to the CMF bit when writing to DRAMCR.
Bit 4
CMF
Description
0
[Clearing condition]
Cleared by reading the CMF flag when CMF = 1, then writing 0 to the CMF flag
(Initial value)
1
[Setting condition]
Set when RTCNT = RTCOR
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Bit 3—Compare Match Interrupt Enable (CMIE): Enables or disables interrupt requests (CMI) by the CMF flag when
the CMF flag in DRAMCR is set to 1.
When refresh control is performed (RFSHE = 1), the CMIE bit is always cleared to 0.
Bit 3
CMIE
Description
0
Interrupt request (CMI) by CMF flag disabled
1
Interrupt request (CMI) by CMF flag enabled
(Initial value)
Bits 2 to 0—Refresh Counter Clock Select (CKS2 to CKS0): These bits select the clock to be input to RTCNT from
among 7 internal clocks obtained by dividing the system clock (ø). When the input clock is selected with bits CKS2 to
CKS0, RTCNT begins counting up.
Bit 2
CKS2
Bit 1
CKS1
Bit 0
CKS0
Description
0
0
0
Count operation disabled
1
Count uses ø/2
0
Count uses ø/8
1
Count uses ø/32
0
Count uses ø/128
1
Count uses ø/512
0
Count uses ø/2048
1
Count uses ø/4096
1
1
0
1
6.2.8
Bit
(Initial value)
Refresh Timer/Counter (RTCNT)
:
7
6
5
4
3
2
1
0
Initial value :
0
0
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
:
RTCNT is an 8-bit readable/writable up-counter.
RTCNT counts up using the internal clock selected by bits CKS2 to CKS0 in DRAMCR.
When RTCNT matches RTCOR (compare match), the CMF flag in DRAMCR is set to 1 and RTCNT is cleared to H'00.
If the RFSHE bit in DRAMCR is set to 1 at this time, a refresh cycle is started. Also, if the CMIE bit in DRAMCR is set
to 1, a compare match interrupt (CMI) is generated.
RTCNT is initialized to H'00 by a power-on reset and in hardware standby mode. It is not initialized by a manual reset* or
in software standby mode.
Note: * Manual reset is only supported in the H8S/2357 ZTAT.
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6.2.9
Bit
Refresh Time Constant Register (RTCOR)
:
7
6
5
4
3
2
1
0
Initial value :
1
1
1
1
1
1
1
1
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
:
RTCOR is an 8-bit readable/writable register that sets the period for compare match operations with RTCNT.
The values of RTCOR and RTCNT are constantly compared, and if they match, the CMF flag in DRAMCR is set to 1 and
RTCNT is cleared to H'00.
RTCOR is initialized to H'FF by a power-on reset and in hardware standby mode. It is not initialized by a manual reset* or
in software standby mode.
Note: * Manual reset is only supported in the H8S/2357 ZTAT.
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6.3
Overview of Bus Control
6.3.1
Area Partitioning
In advanced mode, the bus controller partitions the 16 Mbytes address space into eight areas, 0 to 7, in 2-Mbyte units, and
performs bus control for external space in area units. Figure 6-2 shows an outline of the memory map.
Chip select signals (CS0 to CS7) can be output for each area.
H'000000
Area 0
(2 Mbytes)
H'1FFFFF
H'200000
Area 1
(2 Mbytes)
H'3FFFFF
H'400000
Area 2
(2 Mbytes)
H'5FFFFF
H'600000
Area 3
(2 Mbytes)
H'7FFFFF
H'800000
Area 4
(2 Mbytes)
H'9FFFFF
H'A00000
Area 5
(2 Mbytes)
H'BFFFFF
H'C00000
Area 6
(2 Mbytes)
H'DFFFFF
H'E00000
Area 7
(2 Mbytes)
H'FFFFFF
Advanced mode
Figure 6-2 Overview of Area Partitioning
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6.3.2
Bus Specifications
The external space bus specifications consist of three elements: bus width, number of access states, and number of
program wait states.
The bus width and number of access states for on-chip memory and internal I/O registers are fixed, and are not affected by
the bus controller.
Bus Width: A bus width of 8 or 16 bits can be selected with ABWCR. An area for which an 8-bit bus is selected
functions as an 8-bit access space, and an area for which a 16-bit bus is selected functions as a16-bit access space.
If all areas are designated for 8-bit access, 8-bit bus mode is set; if any area is designated for 16-bit access, 16-bit bus
mode is set. When the burst ROM interface is designated, 16-bit bus mode is always set.
Number of Access States: Two or three access states can be selected with ASTCR. An area for which 2-state access is
selected functions as a 2-state access space, and an area for which 3-state access is selected functions as a 3-state access
space.
With the DRAM interface and burst ROM interface, the number of access states may be determined without regard to
ASTCR.
When 2-state access space is designated, wait insertion is disabled.
Number of Program Wait States: When 3-state access space is designated by ASTCR, the number of program wait
states to be inserted automatically is selected with WCRH and WCRL. From 0 to 3 program wait states can be selected.
Table 6-3 shows the bus specifications for each basic bus interface area.
Table 6-3
Bus Specifications for Each Area (Basic Bus Interface)
WCRH, WCRL
Bus Specifications (Basic Bus Interface)
ABWCR
ABWn
ASTCR
ASTn
Wn1
Wn0
Bus Width
Program Wait
Access States States
0
0
—
—
16
2
0
1
0
0
3
0
1
1
1
1
0
2
1
3
0
—
—
1
0
0
1
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8
2
0
3
0
1
1
0
2
1
3
6.3.3
Memory Interfaces
The H8S/2357 Group memory interfaces comprise a basic bus interface that allows direct connection of ROM, SRAM,
and so on; a DRAM interface that allows direct connection of DRAM; and a burst ROM interface that allows direct
connection of burst ROM. The interface can be selected independently for each area.
An area for which the basic bus interface is designated functions as normal space, an area for which the DRAM interface
is designated functions as DRAM space, and an area for which the burst ROM interface is designated functions as burst
ROM space.
6.3.4
Advanced Mode
The initial state of each area is basic bus interface, 3-state access space. The initial bus width is selected according to the
operating mode. The bus specifications described here cover basic items only, and the sections on each memory interface
(section 6.4, Basic Bus Interface, section 6.5, DRAM Interface, and section 6.7, Burst ROM Interface) should be referred
to for further details.
Area 0: Area 0 includes on-chip ROM*, and in ROM-disabled expansion mode, all of area 0 is external space. In ROMenabled expansion mode, the space excluding on-chip ROM* is external space.
When area 0 external space is accessed, the CS0 signal can be output.
Either basic bus interface or burst ROM interface can be selected for area 0.
Note: * Applies to the on-chip ROM version only.
Areas 1 and 6: In external expansion mode, all of areas 1 and 6 is external space.
When area 1 and 6 external space is accessed, the CS1 and CS6 pin signals respectively can be output.
Only the basic bus interface can be used for areas 1 and 6.
Areas 2 to 5: In external expansion mode, all of areas 2 to 5 is external space.
When area 2 to 5 external space is accessed, signals CS2 to CS5 can be output.
Basic bus interface or DRAM interface can be selected for areas 2 to 5. With the DRAM interface, signals CS2 to CS5 are
used as RAS signals.
Area 7: Area 7 includes the on-chip RAM and internal I/O registers. In external expansion mode, the space excluding the
on-chip RAM and internal I/O registers is external space. The on-chip RAM is enabled when the RAME bit in the system
control register (SYSCR) is set to 1; when the RAME bit is cleared to 0, the on-chip RAM is disabled and the
corresponding space becomes external space .
When area 7 external space is accessed, the CS7 signal can be output.
Only the basic bus interface can be used for the area 7 memory interface.
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6.3.5
Chip Select Signals
The H8S/2357 Group can output chip select signals (CS0 to CS7) to areas 0 to 7, the signal being driven low when the
corresponding external space area is accessed.
Figure 6-3 shows an example of CSn (n = 0 to 7) output timing.
Enabling or disabling of the CSn signal is performed by setting the data direction register (DDR) for the port
corresponding to the particular CSn pin.
In ROM-disabled expansion mode, the CS0 pin is placed in the output state after a power-on reset. Pins CS1 to CS7 are
placed in the input state after a power-on reset, and so the corresponding DDR should be set to 1 when outputting signals
CS1 to CS7.
In the ROM-enabled expansion mode, pins CS0 to CS7 are all placed in the input state after a power-on reset, and so the
corresponding DDR bits should be set to 1 when outputting signals CS0 to CS7.
For details, see section 9, I/O Ports.
When areas 2 to 5 are designated as DRAM space, outputs CS2 to CS5 are used as RAS signals.
Bus cycle
T1
T2
T3
ø
Address bus
Area n external address
CSn
Figure 6-3 CSn Signal Output Timing (n = 0 to 7)
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6.4
Basic Bus Interface
6.4.1
Overview
The basic bus interface enables direct connection of ROM, SRAM, and so on.
The bus specifications can be selected with ABWCR, ASTCR, WCRH, and WCRL (see table 6-3).
6.4.2
Data Size and Data Alignment
Data sizes for the CPU and other internal bus masters are byte, word, and longword. The bus controller has a data
alignment function, and when accessing external space, controls whether the upper data bus (D15 to D8) or lower data bus
(D 7 to D0) is used according to the bus specifications for the area being accessed (8-bit access space or 16-bit access space)
and the data size.
8-Bit Access Space: Figure 6-4 illustrates data alignment control for the 8-bit access space. With the 8-bit access space,
the upper data bus (D15 to D8) is always used for accesses. The amount of data that can be accessed at one time is one byte:
a word transfer instruction is performed as two byte accesses, and a longword transfer instruction, as four byte accesses.
Upper data bus
Lower data bus
D15
D8 D7
D0
Byte size
Word size
1st bus cycle
2nd bus cycle
1st bus cycle
Longword size
2nd bus cycle
3rd bus cycle
4th bus cycle
Figure 6-4 Access Sizes and Data Alignment Control (8-Bit Access Space)
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16-Bit Access Space: Figure 6-5 illustrates data alignment control for the 16-bit access space. With the 16-bit access
space, the upper data bus (D15 to D8) and lower data bus (D7 to D0) are used for accesses. The amount of data that can be
accessed at one time is one byte or one word, and a longword transfer instruction is executed as two word transfer
instructions.
In byte access, whether the upper or lower data bus is used is determined by whether the address is even or odd. The
upper data bus is used for an even address, and the lower data bus for an odd address.
Upper data bus
Lower data bus
D15
D8 D7
D0
Byte size
• Even address
Byte size
• Odd address
Word size
Longword
size
1st bus cycle
2nd bus cycle
Figure 6-5 Access Sizes and Data Alignment Control (16-Bit Access Space)
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6.4.3
Valid Strobes
Table 6-4 shows the data buses used and valid strobes for the access spaces.
In a read, the RD signal is valid without discrimination between the upper and lower halves of the data bus.
In a write, the HWR signal is valid for the upper half of the data bus, and the LWR signal for the lower half.
Table 6-4
Data Buses Used and Valid Strobes
Area
8-bit access
space
Access Read/
Size
Write
Byte
16-bit access Byte
space
Address
Valid
Strobe
Upper Data Bus
(D15 to D8)
Lower data bus
(D7 to D0)
Read
—
RD
Valid
Invalid
Write
—
HWR
Even
RD
Read
Odd
Valid
Invalid
Invalid
Valid
Even
HWR
Valid
Hi-Z
Odd
LWR
Hi-Z
Valid
Read
—
RD
Valid
Valid
Write
—
HWR, LWR Valid
Valid
Write
Word
Hi-Z
Legend:
Hi-Z: High impedance
Invalid: Input state; input value is ignored.
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6.4.4
Basic Timing
8-Bit 2-State Access Space: Figure 6-6 shows the bus timing for an 8-bit 2-state access space. When an 8-bit access
space is accessed, the upper half (D15 to D8) of the data bus is used.
The LWR pin is fixed high. Wait states cannot be inserted.
Bus cycle
T1
T2
ø
Address bus
CSn
AS
RD
Read
D15 to D8
Valid
D7 to D0
Invalid
HWR
LWR
High
Write
D15 to D8
D7 to D0
Valid
High impedance
Note: n = 0 to 7
Figure 6-6 Bus Timing for 8-Bit 2-State Access Space
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8-Bit 3-State Access Space: Figure 6-7 shows the bus timing for an 8-bit 3-state access space. When an 8-bit access
space is accessed, the upper half (D15 to D8) of the data bus is used.
The LWR pin is fixed high. Wait states can be inserted.
Bus cycle
T1
T2
T3
ø
Address bus
CSn
AS
RD
Read
D15 to D8
Valid
D7 to D0
Invalid
HWR
LWR
High
Write
D15 to D8
D7 to D0
Valid
High impedance
Note: n = 0 to 7
Figure 6-7 Bus Timing for 8-Bit 3-State Access Space
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16-Bit 2-State Access Space: Figures 6-8 to 6-10 show bus timings for a 16-bit 2-state access space. When a 16-bit
access space is accessed, the upper half (D15 to D8) of the data bus is used for the even address, and the lower half (D7 to
D0) for the odd address.
Wait states cannot be inserted.
Bus cycle
T1
T2
ø
Address bus
CSn
AS
RD
Read
D15 to D8
Valid
D7 to D0
Invalid
HWR
LWR
High
Write
D15 to D8
D7 to D0
Valid
High impedance
Note: n = 0 to 7
Figure 6-8 Bus Timing for 16-Bit 2-State Access Space (1) (Even Address Byte Access)
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Bus cycle
T1
T2
ø
Address bus
CSn
AS
RD
Read
D15 to D8
Invalid
D7 to D0
Valid
HWR
High
LWR
Write
D15 to D8
D7 to D0
High impedance
Valid
Note: n = 0 to 7
Figure 6-9 Bus Timing for 16-Bit 2-State Access Space (2) (Odd Address Byte Access)
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Bus cycle
T1
T2
ø
Address bus
CSn
AS
RD
Read
D15 to D8
Valid
D7 to D0
Valid
HWR
LWR
Write
D15 to D8
Valid
D7 to D0
Valid
Note: n = 0 to 7
Figure 6-10 Bus Timing for 16-Bit 2-State Access Space (3) (Word Access)
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16-Bit 3-State Access Space: Figures 6-11 to 6-13 show bus timings for a 16-bit 3-state access space. When a 16-bit
access space is accessed , the upper half (D15 to D8) of the data bus is used for the even address, and the lower half (D7 to
D0) for the odd address.
Wait states can be inserted.
Bus cycle
T1
T2
T3
ø
Address bus
CSn
AS
RD
Read
D15 to D8
Valid
D7 to D0
Invalid
HWR
LWR
High
Write
D15 to D8
D7 to D0
Valid
High impedance
Note: n = 0 to 7
Figure 6-11 Bus Timing for 16-Bit 3-State Access Space (1) (Even Address Byte Access)
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Bus cycle
T1
T2
T3
ø
Address bus
CSn
AS
RD
Read
D15 to D8
Invalid
D7 to D0
Valid
HWR
High
LWR
Write
D15 to D8
D7 to D0
High impedance
Valid
Note: n = 0 to 7
Figure 6-12 Bus Timing for 16-Bit 3-State Access Space (2) (Odd Address Byte Access)
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Bus cycle
T1
T2
T3
ø
Address bus
CSn
AS
RD
Read
D15 to D8
Valid
D7 to D0
Valid
HWR
LWR
Write
D15 to D8
Valid
D7 to D0
Valid
Note: n = 0 to 7
Figure 6-13 Bus Timing for 16-Bit 3-State Access Space (3) (Word Access)
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6.4.5
Wait Control
When accessing external space, the H8S/2357 Group can extend the bus cycle by inserting one or more wait states (Tw).
There are two ways of inserting wait states: program wait insertion and pin wait insertion using the WAIT pin.
Program Wait Insertion: From 0 to 3 wait states can be inserted automatically between the T2 state and T3 state on an
individual area basis in 3-state access space, according to the settings of WCRH and WCRL.
Pin Wait Insertion: Setting the WAITE bit in BCRL to 1 enables wait insertion by means of the WAIT pin. Program wait
insertion is first carried out according to the settings in WCRH and WCRL. Then , if the WAIT pin is low at the falling
edge of ø in the last T2 or Tw state, a Tw state is inserted. If the WAIT pin is held low, Tw states are inserted until it goes
high.
This is useful when inserting four or more Tw states, or when changing the number of Tw states for different external
devices.
The WAITE bit setting applies to all areas.
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Figure 6-14 shows an example of wait state insertion timing.
By program wait
T1
T2
Tw
By WAIT pin
Tw
Tw
T3
ø
WAIT
Address bus
AS
RD
Read
Data bus
Read data
HWR, LWR
Write
Data bus
Note:
Write data
indicates the timing of WAIT pin sampling.
Figure 6-14 Example of Wait State Insertion Timing
The settings after a power-on reset are: 3-state access, 3 program wait state insertion, and WAIT input disabled. When a
manual reset* is performed, the contents of bus controller registers are retained, and the wait control settings remain the
same as before the reset.
Note: * Manual reset is only supported in the H8S/2357 ZTAT.
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6.5
DRAM Interface
6.5.1
Overview
When the H8S/2357 Group is in advanced mode, external space areas 2 to 5 can be designated as DRAM space, and
DRAM interfacing performed. With the DRAM interface, DRAM can be directly connected to the H8S/2357 Group. A
DRAM space of 2, 4, or 8 Mbytes can be set by means of bits RMTS2 to RMTS0 in BCRH. Burst operation is also
possible, using fast page mode.
6.5.2
Setting DRAM Space
Areas 2 to 5 are designated as DRAM space by setting bits RMTS2 to RMTS0 in BCRH. The relation between the
settings of bits RMTS2 to RMTS0 and DRAM space is shown in table 6-5. Possible DRAM space settings are: one area
(area 2), two areas (areas 2 and 3), and four areas (areas 2 to 5).
Table 6-5
6.5.3
Settings of Bits RMTS2 to RMTS0 and Corresponding DRAM Spaces
RMTS2
RMTS1
RMTS0
Area 5
Area 4
0
0
1
Normal space
1
0
Normal space
1
DRAM space
Area 3
Area 2
DRAM space
DRAM space
Address Multiplexing
With DRAM space, the row address and column address are multiplexed. In address multiplexing, the size of the shift of
the row address is selected with bits MXC1 and MXC0 in MCR. Table 6-6 shows the relation between the settings of
MXC1 and MXC0 and the shift size.
Table 6-6
Address Multiplexing Settings by Bits MXC1 and MXC0
MCR
Shift
MXC1 MXC0 Size
A23 to A 13 A12 A11 A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0
Row
0
address
0
8 bits
A23 to A 13 A20 A19 A18 A17 A16 A15 A14 A13 A12 A11 A10 A9 A8
1
9 bits
A23 to A 13 A12 A20 A19 A18 A17 A16 A15 A14 A13 A12 A11 A10 A9
1
0
10 bits
A23 to A 13 A12 A11 A20 A19 A18 A17 A16 A15 A14 A13 A12 A11 A10
1
Setting
—
prohibited
—
—
Column —
address
6.5.4
Address Pins
— — — — — — — — — — — — —
A23 to A 13 A12 A11 A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0
Data Bus
If the bit in ABWCR corresponding to an area designated as DRAM space is set to 1, that area is designated as 8-bit
DRAM space; if the bit is cleared to 0, the area is designated as 16-bit DRAM space. In 16-bit DRAM space, × 16-bit
configuration DRAM can be connected directly.
In 8-bit DRAM space the upper half of the data bus, D15 to D8, is enabled, while in 16-bit DRAM space both the upper and
lower halves of the data bus, D15 to D0, are enabled.
Access sizes and data alignment are the same as for the basic bus interface: see section 6.4.2, Data Size and Data
Alignment.
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6.5.5
Pins Used for DRAM Interface
Table 6-7 shows the pins used for DRAM interfacing and their functions.
Table 6-7
DRAM Interface Pins
Pin
With DRAM
Setting
Name
I/O
HWR
WE
Write enable
Output When 2-CAS system is set,
write enable for DRAM space
access.
LCAS
LCAS
Lower column address strobe Output Lower column address strobe
for 16-bit DRAM space access
CS2
RAS2
Row address strobe 2
Output Row address strobe when
area 2 is designated as DRAM
space.
CS3
RAS3
Row address strobe 3
Output Row address strobe when
area 3 is designated as DRAM
space.
CS4
RAS4
Row address strobe 4
Output Row address strobe when
area 4 is designated as DRAM
space.
CS5
RAS5
Row address strobe 5
Output Row address strobe when
area 5 is designated as DRAM
space.
CAS
UCAS
Upper column address strobe Output Upper column address strobe
for DRAM space access
WAIT
WAIT
Wait
Input
A12 to A 0
A12 to A 0
Address pins
Output Row address/column address
multiplexed output
D15 to D0
D15 to D0
Data pins
I/O
Function
Wait request signal
Data input/output pins
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6.5.6
Basic Timing
Figure 6-15 shows the basic access timing for DRAM space. The basic DRAM access timing is 4 states. Unlike the basic
bus interface, the corresponding bits in ASTCR control only enabling or disabling of wait insertion, and do not affect the
number of access states. When the corresponding bit in ASTCR is cleared to 0, wait states cannot be inserted in the
DRAM access cycle.
The 4 states of the basic timing consist of one T p (precharge cycle) state, one Tr (row address output cycle), and two Tc
(column address output cycle) states, T c1 and T c2 .
Tp
Tr
Tc1
Tc2
ø
A23 to A0
Row
CSn, (RAS)
CAS, LCAS
HWR, (WE)
Read
D15 to D0
HWR, (WE)
Write
D15 to D0
Note: n = 2 to 5
Figure 6-15 Basic Access Timing
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Column
6.5.7
Precharge State Control
When DRAM is accessed, RAS precharging time must be secured. With the H8S/2357 Series, one Tp state is always
inserted when DRAM space is accessed. This can be changed to two Tp states by setting the TPC bit in MCR to 1. Set the
appropriate number of T p cycles according to the DRAM connected and the operating frequency of the H8S/2357 Group.
Figure 6-16 shows the timing when two Tp states are inserted.
When the TPC bit is set to 1, two T p states are also used for refresh cycles.
Tp1
Tp2
Tr
Tc1
Tc2
ø
A23 to A0
Row
Column
CSn, (RAS)
CAS, LCAS
HWR, (WE)
Read
D15 to D0
HWR, (WE)
Write
D15 to D0
Note: n = 2 to 5
Figure 6-16 Timing with Two Precharge States
6.5.8
Wait Control
There are two ways of inserting wait states in a DRAM access cycle: program wait insertion and pin wait insertion using
the WAIT pin.
Program Wait Insertion: When the bit in ASTCR corresponding to an area designated as DRAM space is set to 1, from
0 to 3 wait states can be inserted automatically between the Tc1 state and Tc2 state, according to the settings of WCRH and
WCRL.
Pin Wait Insertion: When the WAITE bit in BCRH is set to 1, wait input by means of the WAIT pin is enabled
regardless of the setting of the AST bit in ASTCR. When DRAM space is accessed in this state, a program wait is first
inserted. If the WAIT pin is low at the falling edge of ø in the last Tc1 or Tw state, another Tw state is inserted. If the WAIT
pin is held low, Tw states are inserted until it goes high.
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Figure 6-17 shows an example of wait state insertion timing.
By program wait
Tp
Tr
Tc1
Tw
By WAIT pin
Tw
Tc2
ø
WAIT
Address bus
CSn, (RAS)
CAS
Read
Data bus
Read data
CAS
Write
Data bus
Notes:
Write data
indicates the timing of WAIT pin sampling.
n = 2 to 5
Figure 6-17 Example of Wait State Insertion Timing (CW2 = 1, 8-Bit Area Setting for Entire Space)
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6.5.9
Byte Access Control
When DRAM with a ×16 configuration is connected, the 2-CAS system can be used for the control signals required for
byte access.
When the CW2 bit is cleared to 0 in MCR, the 2-CAS system is selected. Figure 6-18 shows the control timing in the 2CAS system, and figure 6-19 shows an example 2-CAS system DRAM connection.
When only DRAM with a ×8 configuration is connected, set the CW2 bit to 1 in MCR.
Tp
Tr
Tc1
Tc2
ø
A23 to A0
Row
Column
CSn, (RAS)
CAS
Byte control
LCAS
HWR, (WE)
Note: n = 2 to 5
Figure 6-18 2-CAS System Control Timing (Upper Byte Write Access)
H8S/2357 Group
(Address shift size set to 9 bits)
CS, (RAS)
2-CAS type 4-Mbit DRAM
256-kbyte x 16-bit configuration
9-bit column address
RAS
CAS
UCAS
LCAS
LCAS
HWR, (WE)
WE
A9
A8
A8
A7
A7
A6
A6
A5
A5
A4
A4
A3
A3
A2
A2
A1
A1
A0
D15 to D0
Low address
input: A8 to A0
Column address
input: A8 to A0
D15 to D0
OE
Figure 6-19 Example of 2-CAS System Connection
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6.5.10
Burst Operation
With DRAM, in addition to full access (normal access) in which data is accessed by outputting a row address for each
access, a fast page mode is also provided which can be used when making a number of consecutive accesses to the same
row address. This mode enables fast (burst) access of data by simply changing the column address after the row address
has been output. Burst access can be selected by setting the BE bit in MCR to 1.
Burst Access (Fast Page Mode) Operation Timing: Figure 6-20 shows the operation timing for burst access. When
there are consecutive access cycles for DRAM space, the CAS signal and column address output cycles (two states)
continue as long as the row address is the same for consecutive access cycles. The row address used for the comparison is
set with bits MXC1 and MXC0 in MCR.
Tp
Tr
Tc1
Tc2
Tc1
Tc2
ø
A23 to A0
Row
Column1
Column2
CSn, (RAS)
CAS, LCAS
HWR, (WE)
Read
D15 to D0
HWR, (WE)
Write
D15 to D0
Note: n = 2 to 5
Figure 6-20 Operation Timing in Fast Page Mode
The bus cycle can also be extended in burst access by inserting wait states. The wait state insertion method and timing are
the same as for full access. For details, see section 6.5.8, Wait Control.
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RAS Down Mode and RAS Up Mode: Even when burst operation is selected, it may happen that access to DRAM space
is not continuous, but is interrupted by access to another space. In this case, if the RAS signal is held low during the
access to the other space, burst operation can be resumed when the same row address in DRAM space is accessed again.
• RAS down mode
To select RAS down mode, set the RCDM bit in MCR to 1. If access to DRAM space is interrupted and another space
is accessed, the RAS signal is held low during the access to the other space, and burst access is performed if the row
address of the next DRAM space access is the same as the row address of the previous DRAM space access. Figure 621 shows an example of the timing in RAS down mode.
Note, however, that the RAS signal will go high if a refresh operation interrupts RAS down mode.
DRAM access
Tp
Tr
Tc1
Tc2
External space
access
T1
T2
DRAM access
Tc1
Tc2
ø
A23 to A0
CSn, (RAS)
CAS, LCAS
D15 to D0
Note: n = 2 to 5
Figure 6-21 Example of Operation Timing in RAS Down Mode
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• RAS up mode
To select RAS up mode, clear the RCDM bit in MCR to 0. Each time access to DRAM space is interrupted and
another space is accessed, the RAS signal goes high again. Burst operation is only performed if DRAM space is
continuous. Figure 6-22 shows an example of the timing in RAS up mode.
In the case of burst ROM space access, the RAS signal is not restored to the high level.
DRAM access
Tp
Tr
Tc1
DRAM access
Tc2
Tc1
Tc2
External space
access
T1
T2
ø
A23 to A0
CSn, (RAS)
CAS, LCAS
D15 to D0
Note: n = 2 to 5
Figure 6-22 Example of Operation Timing in RAS Up Mode
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6.5.11
Refresh Control
The H8S/2357 Group is provided with a DRAM refresh control function. Either of two refreshing methods can be
selected: CAS-before-RAS (CBR) refreshing, or self-refreshing.
CAS-before-RAS (CBR) Refreshing: To select CBR refreshing, set the RFSHE bit in DRAMCR to 1, and clear the
RMODE bit to 0.
With CBR refreshing, RTCNT counts up using the input clock selected by bits CKS2 to CKS0 in DRAMCR, and when
the count matches the value set in RTCOR (compare match), refresh control is performed. At the same time, RTCNT is
reset and starts counting again from H'00. Refreshing is thus repeated at fixed intervals determined by RTCOR and bits
CKS2 to CKS0. Set a value in RTCOR and bits CKS2 to CKS0 that will meet the refreshing interval specification for the
DRAM used.
When bits CKS2 to CKS0 are set, RTCNT starts counting up. RTCNT and RTCOR settings should therefore be
completed before setting bits CKS2 to CKS0.
Do not clear the CMF flag when refresh control is being performed (RFSHE = 1).
RTCNT operation is shown in figure 6-23, compare match timing in figure 6-24, and CBR refresh timings in figure 6-25.
RTCNT
RTCOR
H'00
Refresh request
Figure 6-23 RTCNT Operation
ø
RTCNT
H'00
N
RTCOR
N
Refresh request signal
and CMF bit setting signal
Figure 6-24 Compare Match Timing
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TRp
TRr
TRc1
TRc2
ø
CS, (RAS)
CAS, LCAS
Note: n = 2 to 5
Figure 6-25 CBR Refresh Timing
When the RCW bit is set to 1, RAS signal output is delayed by one cycle. The width of the RAS signal should be adjusted
with bits RLW1 and RLW0. These bits are only enabled in refresh operations.
Figure 6-26 shows the timing when the RCW bit is set to 1.
TRp
TRr
TRc1
TRw
TRc2
ø
CSn, (RAS)
CAS, LCAS
Note: n = 2 to 5
Figure 6-26 CBR Refresh Timing (When RCW = 1, RLW1 = 0, RLW0 = 1)
Self-Refreshing: A self-refresh mode (battery backup mode) is provided for DRAM as a kind of standby mode. In this
mode, refresh timing and refresh addresses are generated within the DRAM.
To select self-refreshing, set the RFSHE bit and RMODE bit in DRAMCR to 1. Then, when a SLEEP instruction is
executed to enter software standby mode, the CAS and RAS signals are output and DRAM enters self-refresh mode, as
shown in figure 6-27.
When software standby mode is exited, the RMODE bit is cleared to 0 and self-refresh mode is cleared.
When switching to software standby mode, if there is a CBR refresh request, CBR refreshing is executed before selfrefresh mode is entered.
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TRp
Software
standby
TRcr
TRc3
ø
CSn, (RAS)
CAS, LCAS
HWR, (WE)
High
Note: n = 2 to 5
Figure 6-27 Self-Refresh Timing (When CW2 = 1, or CW2 = 0 and LCASS = 0)
6.6
DMAC Single Address Mode and DRAM Interface
When burst mode is selected with the DRAM interface, the DACK output timing can be selected with the DDS bit. When
DRAM space is accessed in DMAC single address mode at the same time, whether or not burst access is to be performed
is selected.
6.6.1
When DDS = 1
Burst access is performed by determining the address only, irrespective of the bus master. The DACK output goes low
from the TC1 state in the case of the DRAM interface.
Figure 6-28 shows the DACK output timing for the DRAM interface when DDS = 1.
Tp
Tr
Tc1
Tc2
ø
A23 to A0
Row
Column
CSn, (RAS)
CAS, (UCAS),
LCAS, (LCAS)
HWR, (WE)
Read
D15 to D0
HWR, (WE)
Write
D15 to D0
DACK
Note: n = 2 to 5
Figure 6-28 DACK Output Timing when DDS = 1 (Example of DRAM Access)
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6.6.2
When DDS = 0
When DRAM space is accessed in DMAC single address mode, full access (normal access) is always performed. The
DACK output goes low from the Tr state in the case of the DRAM interface.
In modes other than DMAC single address mode, burst access can be used when accessing DRAM space.
Figure 6-29 shows the DACK output timing for the DRAM interface when DDS = 0.
Tp
Tr
Tc1
Tc2
ø
A23 to A0
Row
Column
CSn, (RAS)
CAS, (UCAS),
LCAS, (LCAS)
HWR, (WE)
Read
D15 to D0
HWR, (WE)
Write
D15 to D0
DACK
Note: n = 2 to 5
Figure 6-29 DACK Output Timing when DDS = 0 (Example of DRAM Access)
6.7
Burst ROM Interface
6.7.1
Overview
With the H8S/2357 Group, external space area 0 can be designated as burst ROM space, and burst ROM interfacing can
be performed. The burst ROM space interface enables 16-bit configuration ROM with burst access capability to be
accessed at high speed.
Area 0 can be designated as burst ROM space by means of the BRSTRM bit in BCRH. Consecutive burst accesses of a
maximum of 4 words or 8 words can be performed for CPU instruction fetches only. One or two states can be selected for
burst access.
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6.7.2
Basic Timing
The number of states in the initial cycle (full access) of the burst ROM interface is in accordance with the setting of the
AST0 bit in ASTCR. Also, when the AST0 bit is set to 1, wait state insertion is possible. One or two states can be selected
for the burst cycle, according to the setting of the BRSTS1 bit in BCRH. Wait states cannot be inserted. When area 0 is
designated as burst ROM space, it becomes 16-bit access space regardless of the setting of the ABW0 bit in ABWCR.
When the BRSTS0 bit in BCRH is cleared to 0, burst access of up to 4 words is performed; when the BRSTS0 bit is set to
1, burst access of up to 8 words is performed.
The basic access timing for burst ROM space is shown in figures 6-30 (a) and (b). The timing shown in figure 6-30 (a) is
for the case where the AST0 and BRSTS1 bits are both set to 1, and that in figure 6-30 (b) is for the case where both these
bits are cleared to 0.
Full access
T1
T2
Burst access
T3
T1
T2
T1
T2
ø
Only lower address changed
Address bus
CS0
AS
RD
Data bus
Read data
Read data
Read data
Figure 6-30 (a) Example of Burst ROM Access Timing (When AST0 = BRSTS1 = 1)
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Full access
T1
T2
Burst access
T1
T1
ø
Only lower address changed
Address bus
CS0
AS
RD
Data bus
Read data
Read data Read data
Figure 6-30 (b) Example of Burst ROM Access Timing (When AST0 = BRSTS1 = 0)
6.7.3
Wait Control
As with the basic bus interface, either program wait insertion or pin wait insertion using the WAIT pin can be used in the
initial cycle (full access) of the burst ROM interface. See section 6.4.5, Wait Control.
Wait states cannot be inserted in a burst cycle.
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6.8
Idle Cycle
6.8.1
Operation
When the H8S/2357 Group accesses external space, it can insert a 1-state idle cycle (TI) between bus cycles in the
following two cases: (1) when read accesses between different areas occur consecutively, and (2) when a write cycle
occurs immediately after a read cycle. By inserting an idle cycle it is possible, for example, to avoid data collisions
between ROM, with a long output floating time, and high-speed memory, I/O interfaces, and so on.
(1) Consecutive Reads between Different Areas
If consecutive reads between different areas occur while the ICIS1 bit in BCRH is set to 1, an idle cycle is inserted at the
start of the second read cycle. This is enabled in advanced mode.
Figure 6-31 shows an example of the operation in this case. In this example, bus cycle A is a read cycle from ROM with a
long output floating time, and bus cycle B is a read cycle from SRAM, each being located in a different area. In (a), an
idle cycle is not inserted, and a collision occurs in cycle B between the read data from ROM and that from SRAM. In (b),
an idle cycle is inserted, and a data collision is prevented.
Bus cycle A
T1
T2
Bus cycle B
T3
T1
Bus cycle A
T2
T1
ø
ø
Address bus
Address bus
CS (area A)
CS (area A)
CS (area B)
RD
Data bus
,
Long output
floating time
(a) Idle cycle not inserted
(ICIS1 = 0)
T2
T3
Bus cycle B
TI
T1
T2
CS (area B)
RD
Data bus
Data
collision
(b) Idle cycle inserted
(Initial value ICIS1 = 1)
Figure 6-31 Example of Idle Cycle Operation (1)
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(2) Write after Read
If an external write occurs after an external read while the ICIS0 bit in BCRH is set to 1, an idle cycle is inserted at the
start of the write cycle.
Figure 6-32 shows an example of the operation in this case. In this example, bus cycle A is a read cycle from ROM with a
long output floating time, and bus cycle B is a CPU write cycle. In (a), an idle cycle is not inserted, and a collision occurs
in cycle B between the read data from ROM and the CPU write data. In (b), an idle cycle is inserted, and a data collision is
prevented.
Bus cycle A
T1
T2
Bus cycle B
T3
T1
Bus cycle A
T2
T1
ø
ø
Address bus
Address bus
CS (area A)
CS (area A)
CS (area B)
CS (area B)
,
RD
HWR
Data bus
Long output
floating time
(a) Idle cycle not inserted
(ICIS0 = 0)
T2
TI
T1
RD
HWR
Data bus
Data
collision
(b) Idle cycle inserted
(Initial value ICIS0 = 1)
Figure 6-32 Example of Idle Cycle Operation (2)
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T3
Bus cycle B
T2
(3) Relationship between Chip Select (CS) Signal and Read (RD) Signal
Depending on the system’s load conditions, the RD signal may lag behind the CS signal. An example is shown in figure 633.
In this case, with the setting for no idle cycle insertion (a), there may be a period of overlap between the bus cycle A RD
signal and the bus cycle B CS signal.
Setting idle cycle insertion, as in (b), however, will prevent any overlap between the RD and CS signals.
In the initial state after reset release, idle cycle insertion (b) is set.
Bus cycle A
T1
T2
T3
Bus cycle B
T1
Bus cycle A
T2
T1
ø
ø
Address bus
Address bus
CS (area A)
CS (area A)
CS (area B)
CS (area B)
RD
RD
T2
T3
Bus cycle B
TI
T1
T2
Possibility of overlap between
CS (area B) and RD
(a) Idle cycle not inserted
(ICIS1 = 0)
(b) Idle cycle inserted
(Initial value ICIS1 = 1)
Figure 6-33 Relationship between Chip Select (CS) and Read (RD)
6.8.2
Usage Notes
When DRAM space is accessed, the ICIS0 and ICIS1 bit settings are disabled. In the case of consecutive reads between
different areas, for example, if the second access is a DRAM access, only a T p cycle is inserted, and a TI cycle is not. The
timing in this case is shown in figure 6-34.
However, in burst access in RAS down mode these settings are enabled, and an idle cycle is inserted. The timing in this
case is shown in figures 6-35 (a) and (b).
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External read
T1
T2
T3
DRAM space read
Tp
Tr
Tc1
Tc2
ø
Address bus
RD
Data bus
Figure 6-34 Example of DRAM Access after External Read
DRAM space read
Tp
Tr
Tc1
External read
Tc2
TI
T1
T2
DRAM space read
T3
TcI
Tc1
Tc2
EXTAL
Address
RD
RAS
CAS, LCAS
Data bus
Idle cycle
Figure 6-35 (a) Example of Idle Cycle Operation in RAS Down Mode (ICIS1 = 1)
DRAM space read
Tp
Tr
Tc1
External read
Tc2
TI
T1
T2
DRAM space write
T3
TcI
Tc1
Tc2
EXTAL
Address
RD
HWR
RAS
CAS, LCAS
Data bus
Idle cycle
Figure 6-35 (b) Example of Idle Cycle Operation in RAS Down Mode (ICIS0 = 1)
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6.8.3
Pin States in Idle Cycle
Table 6-8 shows pin states in an idle cycle.
Table 6-8
Pin States in Idle Cycle
Pins
Pin State
A23 to A 0
Contents of next bus cycle
D15 to D0
High impedance
CSn*
2
High* 1
CAS
High
AS
High
RD
High
HWR
High
LWR
DACKm*
High
3
High
Notes: 1. Remains low in DRAM space RAS down mode or a refresh cycle.
2. n = 0 to 7
3. m = 0, 1
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6.9
Write Data Buffer Function
The H8S/2357 Group has a write data buffer function in the external data bus. Using the write data buffer function enables
external writes and DMA single address mode transfers to be executed in parallel with internal accesses. The write data
buffer function is made available by setting the WDBE bit in BCRL to 1.
Figure 6-36 shows an example of the timing when the write data buffer function is used. When this function is used, if an
external write or DMA single address mode transfer continues for 2 states or longer, and there is an internal access next,
only an external write is executed in the first state, but from the next state onward an internal access (on-chip memory or
internal I/O register read/write) is executed in parallel with the external write rather than waiting until it ends.
On-chip memory read Internal I/O register read
External write cycle
T1
T2
TW
TW
T3
Internal address bus
Internal memory
Internal I/O register address
Internal read signal
A23 to A0
External address
CSn
External
space
write
HWR, LWR
D15 to D0
Note : n = 0 to 7
Figure 6-36 Example of Timing when Write Data Buffer Function is Used
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6.10
Bus Release
6.10.1
Overview
The H8S/2357 Group can release the external bus in response to a bus request from an external device. In the external bus
released state, the internal bus master continues to operate as long as there is no external access.
If an internal bus master wants to make an external access in the external bus released state, or if a refresh request is
generated, it can issue a bus request off-chip.
6.10.2
Operation
In external expansion mode, the bus can be released to an external device by setting the BRLE bit in BCRL to 1. Driving
the BREQ pin low issues an external bus request to the H8S/2357 Group. When the BREQ pin is sampled, at the
prescribed timing the BACK pin is driven low, and the address bus, data bus, and bus control signals are placed in the
high-impedance state, establishing the external bus-released state.
In the external bus released state, an internal bus master can perform accesses using the internal bus. When an internal bus
master wants to make an external access, it temporarily defers activation of the bus cycle, and waits for the bus request
from the external bus master to be dropped. Even if a refresh request is generated in the external bus released state,
refresh control is deferred until the external bus master drops the bus request.
If the BREQOE bit in BCRL is set to 1, when an internal bus master wants to make an external access in the external bus
released state, or when a refresh request is generated, the BREQO pin is driven low and a request can be made off-chip to
drop the bus request.
When the BREQ pin is driven high, the BACK pin is driven high at the prescribed timing and the external bus released
state is terminated.
If an external bus release request and external access occur simultaneously, the order of priority is as follows:
(High) External bus release > Internal bus master external access (Low)
If a refresh request and external bus release request occur simultaneously, the order of priority is as follows:
(High) Refresh > External bus release (Low)
As a refresh and an external access by an internal bus master can be executed simultaneously, there is no relative order of
priority for these two operations.
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6.10.3
Pin States in External Bus Released State
Table 6-9 shows pin states in the external bus released state.
Table 6-9
Pin States in Bus Released State
Pins
Pin State
A23 to A 0
High impedance
D15 to D0
High impedance
CSn*
1
High impedance
CAS
High impedance
AS
High impedance
RD
High impedance
HWR
High impedance
LWR
DACKm*
Notes : 1. n = 0 to 7
2. m = 0, 1
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High impedance
2
High
6.10.4
Transition Timing
Figure 6-37 shows the timing for transition to the bus-released state.
CPU cycle
T0
CPU
cycle
External bus released state
T1
T2
ø
High impedance
Address bus
Address
High impedance
Data bus
High impedance
AS
High impedance
RD
High impedance
HWR, LWR
BREQ
BACK
BREQO *
Minimum
1 state
[1]
[2]
[3]
[4]
[1]
Low level of BREQ pin is sampled at rise of T2 state.
[2]
BACK pin is driven low at end of CPU read cycle, releasing bus to external
[5]
[6]
bus master.
[3]
BREQ pin state is still sampled in external bus released state.
[4]
High level of BREQ pin is sampled.
[5]
BACK pin is driven high, ending bus release cycle.
[6]
BREQO signal goes high 1.5 clocks after BACK signal goes high.
Note: * Output only when BREQOE is set to 1.
Figure 6-37 Bus-Released State Transition Timing
6.10.5
Usage Note
When MSTPCR is set to H'FFFF or H'EFFF and a transition is made to sleep mode, the external bus release function halts.
Therefore, MSTPCR should not be set to H'FFFF or H'EFFF if the external bus release function is to be used in sleep
mode.
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6.11
Bus Arbitration
6.11.1
Overview
The H8S/2357 Group has a bus arbiter that arbitrates bus master operations.
There are three bus masters, the CPU, DTC, and DMAC, which perform read/write operations when they have possession
of the bus. Each bus master requests the bus by means of a bus request signal. The bus arbiter determines priorities at the
prescribed timing, and permits use of the bus by means of a bus request acknowledge signal. The selected bus master then
takes possession of the bus and begins its operation.
6.11.2
Operation
The bus arbiter detects the bus masters' bus request signals, and if the bus is requested, sends a bus request acknowledge
signal to the bus master making the request. If there are bus requests from more than one bus master, the bus request
acknowledge signal is sent to the one with the highest priority. When a bus master receives the bus request acknowledge
signal, it takes possession of the bus until that signal is canceled.
The order of priority of the bus masters is as follows:
(High) DMAC > DTC > CPU (Low)
An internal bus access by an internal bus master, external bus release, and refreshing, can be executed in parallel.
In the event of simultaneous external bus release request, refresh request, and internal bus master external access request
generation, the order of priority is as follows:
(High) Refresh > External bus release (Low)
(High) External bus release > Internal bus master external access (Low)
As a refresh and an external access by an internal bus master can be executed simultaneously, there is no relative order of
priority for these two operations.
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6.11.3
Bus Transfer Timing
Even if a bus request is received from a bus master with a higher priority than that of the bus master that has acquired the
bus and is currently operating, the bus is not necessarily transferred immediately. There are specific times at which each
bus master can relinquish the bus.
CPU: The CPU is the lowest-priority bus master, and if a bus request is received from the DTC or DMAC, the bus arbiter
transfers the bus to the bus master that issued the request. The timing for transfer of the bus is as follows:
• The bus is transferred at a break between bus cycles. However, if a bus cycle is executed in discrete operations, as in
the case of a longword-size access, the bus is not transferred between the operations. See Appendix A.5, Bus States
during Instruction Execution, for timings at which the bus is not transferred.
• If the CPU is in sleep mode, it transfers the bus immediately.
DTC: The DTC sends the bus arbiter a request for the bus when an activation request is generated.
The DTC can release the bus after a vector read, a register information read (3 states), a single data transfer, or a register
information write (3 states). It does not release the bus during a register information read (3 states), a single data transfer,
or a register information write (3 states).
DMAC: The DMAC sends the bus arbiter a request for the bus when an activation request is generated.
In the case of an external request in short address mode or normal mode, and in cycle steal mode, the DMAC releases the
bus after a single transfer.
In block transfer mode, it releases the bus after transfer of one block, and in burst mode, after completion of a transfer.
6.11.4
External Bus Release Usage Note
External bus release can be performed on completion of an external bus cycle. The RD signal, DRAM interface RAS and
CAS signals remain low until the end of the external bus cycle. Therefore, when external bus release is performed, the
RD, RAS, and CAS signals may change from the low level to the high-impedance state.
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6.12
Resets and the Bus Controller
In a power-on reset, the H8S/2357 Group, including the bus controller, enters the reset state at that point, and an executing
bus cycle is discontinued.
In a manual reset*, the bus controller’s registers and internal state are maintained, and an executing external bus cycle is
completed. In this case, WAIT input is ignored. Also, since the DMAC is initialized by a manual reset*, DACK and
TEND output is disabled and these pins become I/O ports controlled by DDR and DR.
Note: * Manual reset is only supported in the H8S/2357 ZTAT.
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Section 7 DMA Controller
7.1
Overview
The H8S/2357 Group has a on-chip DMA controller (DMAC) which can carry out data transfer on up to 4 channels.
7.1.1
Features
The features of the DMAC are listed below.
• Choice of short address mode or full address mode
Short address mode
 Maximum of 4 channels can be used
 Choice of dual address mode or single address mode
 In dual address mode, one of the two addresses, transfer source and transfer destination, is specified as 24 bits and
the other as 16 bits
 In single address mode, transfer source or transfer destination address only is specified as 24 bits
 In single address mode, transfer can be performed in one bus cycle
 Choice of sequential mode, idle mode, or repeat mode for dual address mode and single address mode
Full address mode
 Maximum of 2 channels can be used
 Transfer source and transfer destination address specified as 24 bits
 Choice of normal mode or block transfer mode
• 16-Mbyte address space can be specified directly
• Byte or word can be set as the transfer unit
• Activation sources: internal interrupt, external request, auto-request (depending on transfer mode)
 Six 16-bit timer-pulse unit (TPU) compare match/input capture interrupts
 Serial communication interface (SCI0, SCI1) transmission data empty interrupt, reception data full interrupt
 A/D converter conversion end interrupt
 External request
 Auto-request
• Module stop mode can be set
 The initial setting enables DMAC registers to be accessed. DMAC operation is halted by setting module stop mode
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7.1.2
Block Diagram
A block diagram of the DMAC is shown in figure 7-1.
Internal address bus
Address buffer
Control logic
DMAWER
Channel 1
DMATCR
DMACR0A
DMACR0B
DMACR1A
DMACR1B
DMABCR
Data buffer
Internal data bus
Legend:
DMAWER:
DMATCR:
DMABCR:
DMACR:
MAR:
IOAR:
ETCR:
DMA write enable register
DMA terminal control register
DMA band control register (for all channels)
DMA control register
Memory address register
I/O address register
Executive transfer counter register
Figure 7-1 Block Diagram of DMAC
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MAR0A
IOAR0A
ETCR0A
MAR0B
IOAR0B
ETCR0B
MAR1A
IOAR1A
ETCR1A
MAR1B
IOAR1B
ETCR1B
Module data bus
Channel 0
Processor
Channel 1B Channel 1A Channel 0B Channel 0A
Internal interrupts
TGI0A
TGI1A
TGI2A
TGI3A
TGI4A
TGI5A
TXI0
RXI0
TXI1
RXI1
ADI
External pins
DREQ0
DREQ1
TEND0
TEND1
DACK0
DACK1
Interrupt signals
DEND0A
DEND0B
DEND1A
DEND1B
7.1.3
Overview of Functions
Tables 7-1 (1) and (2) summarize DMAC functions in short address mode and full address mode, respectively.
Table 7-1 (1)
Overview of DMAC Functions (Short Address Mode)
Address Register Bit Length
Transfer Mode
Transfer Source
Source
Destination
Dual address mode
•
TPU channel 0 to
5 compare
match/input
capture A
interrupts
24/16
16/24
•
SCI transmission
data empty
interrupt
•
SCI reception data
full interrupt
24/DACK
DACK/24
•
Sequential mode
 1-byte or 1-word transfer
executed for one transfer request
 Memory address
incremented/decremented by 1
or 2
 1 to 65,536 transfers
•
Idle mode
 1-byte or 1-word transfer
•
executed for one transfer request
 Memory address fixed
 1 to 65,536 transfers
•
A/D converter
conversion end
interrupt
•
External request
•
External request
Repeat mode
 1-byte or 1-word transfer
executed for one transfer request
 Memory address incremented/
decremented by 1 or 2
 After specified number of
transfers (1 to 256), initial state is
restored and operation continues
Single address mode
•
1-byte or 1-word transfer executed
for one transfer request
•
Transfer in 1 bus cycle using DACK
pin in place of address specifying I/O
•
Specifiable for sequential, idle, and
repeat modes
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Table 7-1 (2)
Overview of DMAC Functions (Full Address Mode)
Address Register Bit Length
Transfer Mode
Transfer Source
Source
Destination
•
•
Auto-request
24
24
•
External request
•
TPU channel 0 to
5 compare
match/input
capture A
interrupts
24
24
•
SCI transmission
data empty
interrupt
•
SCI reception data
full interrupt
•
External request
•
A/D converter
conversion end
interrupt
Normal mode
Auto-request
 Transfer request retained
internally
 Transfers continue for the
specified number of times (1 to
65,536)
 Choice of burst or cycle steal
transfer
External request
 1-byte or 1-word transfer
executed for one transfer request
 1 to 65,536 transfers
•
Block transfer mode
 Specified block size transfer
executed for one transfer request
 1 to 65,536 transfers
 Either source or destination
specifiable as block area
 Block size: 1 to 256 bytes or
words
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7.1.4
Pin Configuration
Table 7-2 summarizes the DMAC pins.
In short address mode, external request transfer, single address transfer, and transfer end output are not performed for
channel A.
The DMA transfer acknowledge function is used in channel B single address mode in short address mode.
When the DREQ pin is used, do not designate the corresponding port for output.
With regard to the DACK pins, setting single address transfer automatically sets the corresponding port to output,
functioning as a DACK pin.
With regard to the TEND pins, whether or not the corresponding port is used as a TEND pin can be specified by means of
a register setting.
Table 7-2
DMAC Pins
Channel
Pin Name
Symbol
I/O
Function
0
DMA request 0
DREQ0
Input
DMAC channel 0 external
request
DMA transfer acknowledge 0
DACK0
Output
DMAC channel 0 single address
transfer acknowledge
DMA transfer end 0
TEND0
Output
DMAC channel 0 transfer end
DMA request 1
DREQ1
Input
DMAC channel 1 external
request
DMA transfer acknowledge 1
DACK1
Output
DMAC channel 1 single address
transfer acknowledge
DMA transfer end 1
TEND1
Output
DMAC channel 1 transfer end
1
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7.1.5
Register Configuration
Table 7-3 summarizes the DMAC registers.
Table 7-3
DMAC Registers
Channel Name
Abbreviation R/W
Initial
Value
0
Memory address register 0A
MAR0A
R/W
Undefined H'FEE0
16 bits
I/O address register 0A
IOAR0A
R/W
Undefined H'FEE4
16 bits
Transfer count register 0A
ETCR0A
R/W
Undefined H'FEE6
16 bits
Memory address register 0B
MAR0B
R/W
Undefined H'FEE8
16 bits
I/O address register 0B
IOAR0B
R/W
Undefined H'FEEC
16 bits
Transfer count register 0B
ETCR0B
R/W
Undefined H'FEEE
16 bits
Memory address register 1A
MAR1A
R/W
Undefined H'FEF0
16 bits
I/O address register 1A
IOAR1A
R/W
Undefined H'FEF4
16 bits
Transfer count register 1A
ETCR1A
R/W
Undefined H'FEF6
16 bits
Memory address register 1B
MAR1B
R/W
Undefined H'FEF8
16 bits
I/O address register 1B
IOAR1B
R/W
Undefined H'FEFC
16 bits
Transfer count register 1B
ETCR1B
R/W
Undefined H'FEFE
16 bits
DMA write enable register
DMAWER
R/W
H'00
H'FF00
8 bits
DMA terminal control register DMATCR
R/W
H'00
H'FF01
8 bits
DMA control register 0A
DMACR0A
R/W
H'00
H'FF02
16 bits
DMA control register 0B
DMACR0B
R/W
H'00
H'FF03
16 bits
DMA control register 1A
DMACR1A
R/W
H'00
H'FF04
16 bits
DMA control register 1B
DMACR1B
R/W
H'00
H'FF05
16 bits
DMA band control register
DMABCR
R/W
H'0000
H'FF06
16 bits
Module stop control register
MSTPCR
R/W
H'3FFF
H'FF3C
8 bits
1
0, 1
Note: * Lower 16 bits of the address.
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Address* Bus Width
7.2
Register Descriptions (1) (Short Address Mode)
Short address mode transfer can be performed for channels A and B independently.
Short address mode transfer is specified for each channel by clearing the FAE bit in DMABCR to 0, as shown in table 7-4.
Short address mode or full address mode can be selected for channels 1 and 0 independently by means of bits FAE1 and
FAE0.
Short Address Mode and Full Address Mode (For 1 Channel: Example of Channel 0)
0
Short address mode specified (channels A and B operate independently)
1
Channel 0A
Description
MAR0A
Channel 0B
FAE0
MAR0B
Specifies transfer source/transfer destination address
IOAR0A
Specifies transfer destination/transfer source address
ETCR0A
Specifies number of transfers
DMACR0A
Specifies transfer size, mode, activation source, etc.
Specifies transfer source/transfer destination address
IOAR0B
Specifies transfer destination/transfer source address
ETCR0B
Specifies number of transfers
DMACR0B
Specifies transfer size, mode, activation source, etc.
Full address mode specified (channels A and B operate in combination)
Channel 0
Table 7-4
MAR0A
Specifies transfer source address
MAR0B
Specifies transfer destination address
IOAR0A
IOAR0B
ETCR0A
ETCR0B
DMACR0A DMACR0B
Not used
Not used
Specifies number of transfers
Specifies number of transfers (used in block transfer
mode only)
Specifies transfer size, mode, activation source, etc.
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7.2.1
Memory Address Registers (MAR)
Bit
:
31
30
29
28
27
26
25
24
MAR
:
—
—
—
—
—
—
—
—
Initial value :
0
0
0
0
0
0
0
0
R/W
:
—
—
—
—
—
—
—
— R/W R/W R/W R/W R/W R/W R/W R/W
Bit
:
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
MAR
:
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
Initial value :
R/W
23
22
21
20
19
18
17
16
*
*
*
*
*
*
*
*
: R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
*: Undefined
MAR is a 32-bit readable/writable register that specifies the transfer source address or destination address.
The upper 8 bits of MAR are reserved: they are always read as 0, and cannot be modified.
Whether MAR functions as the source address register or as the destination address register can be selected by means of
the DTDIR bit in DMACR.
MAR is incremented or decremented each time a byte or word transfer is executed, so that the address specified by MAR
is constantly updated. For details, see section 7.2.4, DMA Control Register (DMACR).
MAR is not initialized by a reset or in standby mode.
7.2.2
I/O Address Register (IOAR)
Bit
:
IOAR
:
Initial value :
R/W
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
: R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
*: Undefined
IOAR is a 16-bit readable/writable register that specifies the lower 16 bits of the transfer source address or destination
address. The upper 8 bits of the transfer address are automatically set to H'FF.
Whether IOAR functions as the source address register or as the destination address register can be selected by means of
the DTDIR bit in DMACR.
IOAR is invalid in single address mode.
IOAR is not incremented or decremented each time a transfer is executed, so that the address specified by IOAR is fixed.
IOAR is not initialized by a reset or in standby mode.
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7.2.3
Execute Transfer Count Register (ETCR)
ETCR is a 16-bit readable/writable register that specifies the number of transfers. The setting of this register is different
for sequential mode and idle mode on the one hand, and for repeat mode on the other.
(1) Sequential Mode and Idle Mode
Transfer Counter
Bit
:
ETCR
:
Initial value :
R/W
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
: R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
*: Undefined
In sequential mode and idle mode, ETCR functions as a 16-bit transfer counter (with a count range of 1 to 65,536). ETCR
is decremented by 1 each time a transfer is performed, and when the count reaches H'0000, the DTE bit in DMABCR is
cleared, and transfer ends.
(2) Repeat Mode
Transfer Number Storage
Bit
:
ETCRH
:
Initial value :
R/W
:
15
14
13
12
11
10
9
8
*
*
*
*
*
*
*
*
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
7
6
5
4
3
2
1
0
*
*
*
*
*
*
*
*
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Transfer Counter
Bit
:
ETCRL
:
Initial value :
R/W
:
*: Undefined
In repeat mode, ETCR functions as transfer counter ETCRL (with a count range of 1 to 256) and transfer number storage
register ETCRH. ETCRL is decremented by 1 each time a transfer is performed, and when the count reaches H'00,
ETCRL is loaded with the value in ETCRH. At this point, MAR is automatically restored to the value it had when the
count was started. The DTE bit in DMABCR is not cleared, and so transfers can be performed repeatedly until the DTE bit
is cleared by the user.
ETCR is not initialized by a reset or in standby mode.
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7.2.4
DMA Control Register (DMACR)
Bit
:
7
6
5
4
3
2
1
0
DMACR
:
DTSZ
DTID5
RPE
DTDIR
DTF3
DTF2
DTF1
DTF0
0
0
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Initial value :
R/W
:
DMACR is an 8-bit readable/writable register that controls the operation of each DMAC channel.
DMACR is initialized to H'00 by a reset, and in hardware standby mode.
Bit 7—Data Transfer Size (DTSZ): Selects the size of data to be transferred at one time.
Bit 7
DTSZ
Description
0
Byte-size transfer
1
Word-size transfer
(Initial value)
Bit 6—Data Transfer Increment/Decrement (DTID): Selects incrementing or decrementing of MAR every data transfer
in sequential mode or repeat mode.
In idle mode, MAR is neither incremented nor decremented.
Bit 6
DTID
Description
0
MAR is incremented after a data transfer
1
•
When DTSZ = 0, MAR is incremented by 1 after a transfer
•
When DTSZ = 1, MAR is incremented by 2 after a transfer
(Initial value)
MAR is decremented after a data transfer
•
When DTSZ = 0, MAR is decremented by 1 after a transfer
•
When DTSZ = 1, MAR is decremented by 2 after a transfer
Bit 5—Repeat Enable (RPE): Used in combination with the DTIE bit in DMABCR to select the mode (sequential, idle,
or repeat) in which transfer is to be performed.
Bit 5
RPE
DMABCR
DTIE
Description
0
0
Transfer in sequential mode (no transfer end interrupt)
1
Transfer in sequential mode (with transfer end interrupt)
0
Transfer in repeat mode (no transfer end interrupt)
1
Transfer in idle mode (with transfer end interrupt)
1
(Initial value)
For details of operation in sequential, idle, and repeat mode, see section 7.5.2, Sequential Mode, section 7.5.3, Idle Mode,
and section 7.5.4, Repeat Mode.
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Bit 4—Data Transfer Direction (DTDIR): Used in combination with the SAE bit in DMABCR to specify the data
transfer direction (source or destination). The function of this bit is therefore different in dual address mode and single
address mode.
DMABCR
SAE
Bit 4
DTDIR
0
0
Transfer with MAR as source address and IOAR as destination
address
(Initial value)
1
Transfer with IOAR as source address and MAR as destination address
0
Transfer with MAR as source address and DACK pin as write strobe
1
Transfer with DACK pin as read strobe and MAR as destination address
1
Description
Bits 3 to 0—Data Transfer Factor (DTF3 to DTF0): These bits select the data transfer factor (activation source). There
are some differences in activation sources for channel A and for channel B.
Channel A
Bit 3
DTF3
Bit 2
DTF2
Bit 1
DTF1
Bit 0
DTF0
Description
0
0
0
0
—
1
Activated by A/D converter conversion end interrupt
0
—
1
—
0
Activated by SCI channel 0 transmission data empty
interrupt
1
Activated by SCI channel 0 reception data full interrupt
0
Activated by SCI channel 1 transmission data empty
interrupt
1
Activated by SCI channel 1 reception data full interrupt
0
Activated by TPU channel 0 compare match/input capture
A interrupt
1
Activated by TPU channel 1 compare match/input capture
A interrupt
0
Activated by TPU channel 2 compare match/input capture
A interrupt
1
Activated by TPU channel 3 compare match/input capture
A interrupt
0
Activated by TPU channel 4 compare match/input capture
A interrupt
1
Activated by TPU channel 5 compare match/input capture
A interrupt
0
—
1
—
1
1
0
1
1
0
0
1
1
0
1
(Initial value)
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Channel B
Bit 3
DTF3
Bit 2
DTF2
Bit 1
DTF1
Bit 0
DTF0
Description
0
0
0
0
—
1
Activated by A/D converter conversion end interrupt
0
Activated by DREQ pin falling edge input*
1
Activated by DREQ pin low-level input
0
Activated by SCI channel 0 transmission data empty
interrupt
1
Activated by SCI channel 0 reception data full interrupt
0
Activated by SCI channel 1 transmission data empty
interrupt
1
Activated by SCI channel 1 reception data full interrupt
0
Activated by TPU channel 0 compare match/input capture
A interrupt
1
Activated by TPU channel 1 compare match/input capture
A interrupt
0
Activated by TPU channel 2 compare match/input capture
A interrupt
1
Activated by TPU channel 3 compare match/input capture
A interrupt
0
Activated by TPU channel 4 compare match/input capture
A interrupt
1
Activated by TPU channel 5 compare match/input capture
A interrupt
0
—
1
—
1
1
0
1
1
0
0
1
1
0
1
(Initial value)
Note: * Detected as a low level in the first transfer after transfer is enabled.
The same factor can be selected for more than one channel. In this case, activation starts with the highest-priority channel
according to the relative channel priorities. For relative channel priorities, see section 7.5.13, DMAC Multi-Channel
Operation.
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7.2.5
DMA Band Control Register (DMABCR)
Bit
:
15
14
13
12
11
10
9
8
DMABCRH :
FAE1
FAE0
SAE1
SAE0
DTA1B
DTA1A
DTA0B
DTA0A
Initial value :
0
0
0
0
0
0
0
0
R/W
:
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Bit
:
7
6
5
4
3
2
1
0
DMABCRL :
DTE1B
DTE1A
DTE0B
DTE0A
DTIE1B
DTIE1A
DTIE0B
DTIE0A
Initial value :
0
0
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
:
DMABCR is a 16-bit readable/writable register that controls the operation of each DMAC channel.
DMABCR is initialized to H'0000 by a reset, and in hardware standby mode.
Bit 15—Full Address Enable 1 (FAE1): Specifies whether channel 1 is to be used in short address mode or full address
mode.
Bit 15
FAE1
Description
0
Short address mode
1
Full address mode
(Initial value)
In short address mode, channels 1A and 1B are used as independent channels.
Bit 14—Full Address Enable 0 (FAE0): Specifies whether channel 0 is to be used in short address mode or full address
mode.
Bit 14
FAE0
Description
0
Short address mode
1
Full address mode
(Initial value)
In short address mode, channels 0A and 0B are used as independent channels.
Bit 13—Single Address Enable 1 (SAE1): Specifies whether channel 1B is to be used for transfer in dual address mode
or single address mode.
Bit 13
SAE1
Description
0
Transfer in dual address mode
1
Transfer in single address mode
(Initial value)
This bit is invalid in full address mode.
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Bit 12—Single Address Enable 0 (SAE0): Specifies whether channel 0B is to be used for transfer in dual address mode
or single address mode.
Bit 12
SAE0
Description
0
Transfer in dual address mode
1
Transfer in single address mode
(Initial value)
This bit is invalid in full address mode.
Bits 11 to 8—Data Transfer Acknowledge (DTA): These bits enable or disable clearing, when DMA transfer is
performed, of the internal interrupt source selected by the data transfer factor setting.
When DTE = 1 and DTA = 1, the internal interrupt source selected by the data transfer factor setting is cleared
automatically by DMA transfer. When DTE = 1 and DTA = 1, the internal interrupt source selected by the data transfer
factor setting does not issue an interrupt request to the CPU or DTC.
When DTE = 1 and DTA = 0, the internal interrupt source selected by the data transfer factor setting is not cleared when a
transfer is performed, and can issue an interrupt request to the CPU or DTC in parallel. In this case, the interrupt source
should be cleared by the CPU or DTC transfer.
When DTE = 0, the internal interrupt source selected by the data transfer factor setting issues an interrupt request to the
CPU or DTC regardless of the DTA bit setting.
Bit 11—Data Transfer Acknowledge 1B (DTA1B): Enables or disables clearing, when DMA transfer is performed, of
the internal interrupt source selected by the channel 1B data transfer factor setting.
Bit 11
DTA1B
Description
0
Clearing of selected internal interrupt source at time of DMA transfer is disabled
(Initial value)
1
Clearing of selected internal interrupt source at time of DMA transfer is enabled
Bit 10—Data Transfer Acknowledge 1A (DTA1A): Enables or disables clearing, when DMA transfer is performed, of
the internal interrupt source selected by the channel 1A data transfer factor setting.
Bit 10
DTA1A
Description
0
Clearing of selected internal interrupt source at time of DMA transfer is disabled
(Initial value)
1
Clearing of selected internal interrupt source at time of DMA transfer is enabled
Bit 9—Data Transfer Acknowledge 0B (DTA0B): Enables or disables clearing, when DMA transfer is performed, of the
internal interrupt source selected by the channel 0B data transfer factor setting.
Bit 9
DTA0B
Description
0
Clearing of selected internal interrupt source at time of DMA transfer is disabled
(Initial value)
1
Clearing of selected internal interrupt source at time of DMA transfer is enabled
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Bit 8—Data Transfer Acknowledge 0A (DTA0A): Enables or disables clearing, when DMA transfer is performed, of
the internal interrupt source selected by the channel 0A data transfer factor setting.
Bit 8
DTA0A
Description
0
Clearing of selected internal interrupt source at time of DMA transfer is disabled
(Initial value)
1
Clearing of selected internal interrupt source at time of DMA transfer is enabled
Bits 7 to 4—Data Transfer Enable (DTE): When DTE = 0, data transfer is disabled and the activation source selected by
the data transfer factor setting is ignored. If the activation source is an internal interrupt, an interrupt request is issued to
the CPU or DTC. If the DTIE bit is set to 1 when DTE = 0, the DMAC regards this as indicating the end of a transfer, and
issues a transfer end interrupt request to the CPU or DTC.
The conditions for the DTE bit being cleared to 0 are as follows:
• When initialization is performed
• When the specified number of transfers have been completed in a transfer mode other than repeat mode
• When 0 is written to the DTE bit to forcibly abort the transfer, or for a similar reason
When DTE = 1, data transfer is enabled and the DMAC waits for a request by the activation source selected by the data
transfer factor setting. When a request is issued by the activation source, DMA transfer is executed.
The condition for the DTE bit being set to 1 is as follows:
• When 1 is written to the DTE bit after the DTE bit is read as 0
Bit 7—Data Transfer Enable 1B (DTE1B): Enables or disables data transfer on channel 1B.
Bit 7
DTE1B
Description
0
Data transfer disabled
1
Data transfer enabled
(Initial value)
Bit 6—Data Transfer Enable 1A (DTE1A): Enables or disables data transfer on channel 1A.
Bit 6
DTE1A
Description
0
Data transfer disabled
1
Data transfer enabled
(Initial value)
Bit 5—Data Transfer Enable 0B (DTE0B): Enables or disables data transfer on channel 0B.
Bit 5
DTE0B
Description
0
Data transfer disabled
1
Data transfer enabled
(Initial value)
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Bit 4—Data Transfer Enable 0A (DTE0A): Enables or disables data transfer on channel 0A.
Bit 4
DTE0A
Description
0
Data transfer disabled
1
Data transfer enabled
(Initial value)
Bits 3 to 0—Data Transfer End Interrupt Enable (DTIE): These bits enable or disable an interrupt to the CPU or DTC
when transfer ends. If the DTIE bit is set to 1 when DTE = 0, the DMAC regards this as indicating the end of a transfer,
and issues a transfer end interrupt request to the CPU or DTC.
A transfer end interrupt can be canceled either by clearing the DTIE bit to 0 in the interrupt handling routine, or by
performing processing to continue transfer by setting the transfer counter and address register again, and then setting the
DTE bit to 1.
Bit 3—Data Transfer Interrupt Enable 1B (DTIE1B): Enables or disables the channel 1B transfer end interrupt.
Bit 3
DTIE1B
Description
0
Transfer end interrupt disabled
1
Transfer end interrupt enabled
(Initial value)
Bit 2—Data Transfer Interrupt Enable 1A (DTIE1A): Enables or disables the channel 1A transfer end interrupt.
Bit 2
DTIE1A
Description
0
Transfer end interrupt disabled
1
Transfer end interrupt enabled
(Initial value)
Bit 1—Data Transfer Interrupt Enable 0B (DTIE0B): Enables or disables the channel 0B transfer end interrupt.
Bit 1
DTIE0B
Description
0
Transfer end interrupt disabled
1
Transfer end interrupt enabled
(Initial value)
Bit 0—Data Transfer Interrupt Enable 0A (DTIE0A): Enables or disables the channel 0A transfer end interrupt.
Bit 0
DTIE0A
Description
0
Transfer end interrupt disabled
1
Transfer end interrupt enabled
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(Initial value)
7.3
Register Descriptions (2) (Full Address Mode)
Full address mode transfer is performed with channels A and B together. For details of full address mode setting, see table
7-4.
7.3.1
Memory Address Register (MAR)
Bit
:
31
30
29
28
27
26
25
24
MAR
:
—
—
—
—
—
—
—
—
Initial value :
0
0
0
0
0
0
0
0
R/W
:
—
—
—
—
—
—
—
— R/W R/W R/W R/W R/W R/W R/W R/W
Bit
:
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
MAR
:
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
Initial value :
R/W
23
22
21
20
19
18
17
16
*
*
*
*
*
*
*
*
: R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
*: Undefined
MAR is a 32-bit readable/writable register; MARA functions as the transfer source address register, and MARB as the
destination address register.
MAR is composed of two 16-bit registers, MARH and MARL. The upper 8 bits of MARH are reserved; they are always
read as 0, and cannot be modified.
MAR is incremented or decremented each time a byte or word transfer is executed, so that the source or destination
memory address can be updated automatically. For details, see section 7.3.4, DMA Control Register (DMACR).
MAR is not initialized by a reset or in standby mode.
7.3.2
I/O Address Register (IOAR)
IOAR is not used in full address transfer.
7.3.3
Execute Transfer Count Register (ETCR)
ETCR is a 16-bit readable/writable register that specifies the number of transfers. The function of this register is different
in normal mode and in block transfer mode.
ETCR is not initialized by a reset or in standby mode.
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(1) Normal Mode
ETCRA
Transfer Counter
Bit
:
ETCR
:
Initial value :
R/W
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
: R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
*: Undefined
In normal mode, ETCRA functions as a 16-bit transfer counter. ETCRA is decremented by 1 each time a transfer is
performed, and transfer ends when the count reaches H'0000. ETCRB is not used at this time.
ETCRB
ETCRB is not used in normal mode.
(2) Block Transfer Mode
ETCRA
Holds block size
Bit
:
ETCRAH
:
15
14
13
12
11
10
9
8
*
*
*
*
*
*
*
*
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
7
6
5
4
3
2
1
0
*
*
*
*
*
*
*
*
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Initial value :
R/W
:
Block size counter
Bit
:
ETCRAL
:
Initial value :
R/W
:
*: Undefined
ETCRB
Block Transfer Counter
Bit
:
ETCRB
:
Initial value :
R/W
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
: R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
In block transfer mode, ETCRAL functions as an 8-bit block size counter and ETCRAH holds the block size. ETCRAL is
decremented each time a 1-byte or 1-word transfer is performed, and when the count reaches H'00, ETCRAL is loaded
with the value in ETCRAH. So by setting the block size in ETCRAH and ETCRAL, it is possible to repeatedly transfer
blocks consisting of any desired number of bytes or words.
ETCRB functions in block transfer mode, as a 16-bit block transfer counter. ETCRB is decremented by 1 each time a
block is transferred, and transfer ends when the count reaches H'0000.
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7.3.4
DMA Control Register (DMACR)
DMACR is a 16-bit readable/writable register that controls the operation of each DMAC channel. In full address mode,
DMACRA and DMACRB have different functions.
DMACR is initialized to H'0000 by a reset, and in hardware standby mode.
DMACRA
Bit
:
15
14
13
12
11
10
9
8
DMACRA :
DTSZ
SAID
SAIDE
BLKDIR
BLKE
—
—
—
Initial value :
0
0
0
0
0
0
0
0
:
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
:
7
6
5
4
3
2
1
0
DMACRB :
—
DAID
DAIDE
—
DTF3
DTF2
DTF1
DTF0
Initial value :
0
0
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
DMACRB
Bit
R/W
:
Bit 15—Data Transfer Size (DTSZ): Selects the size of data to be transferred at one time.
Bit 15
DTSZ
Description
0
Byte-size transfer
1
Word-size transfer
(Initial value)
Bit 14—Source Address Increment/Decrement (SAID)
Bit 13—Source Address Increment/Decrement Enable (SAIDE): These bits specify whether source address register
MARA is to be incremented, decremented, or left unchanged, when data transfer is performed.
Bit 14
SAID
Bit 13
SAIDE
Description
0
0
MARA is fixed
1
MARA is incremented after a data transfer
1
(Initial value)
•
When DTSZ = 0, MARA is incremented by 1 after a transfer
•
When DTSZ = 1, MARA is incremented by 2 after a transfer
0
MARA is fixed
1
MARA is decremented after a data transfer
•
When DTSZ = 0, MARA is decremented by 1 after a transfer
•
When DTSZ = 1, MARA is decremented by 2 after a transfer
Bit 12—Block Direction (BLKDIR)
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REJ09B0138-0600H
Bit 11—Block Enable (BLKE): These bits specify whether normal mode or block transfer mode is to be used. If block
transfer mode is specified, the BLKDIR bit specifies whether the source side or the destination side is to be the block area.
Bit 12
BLKDIR
Bit 11
BLKE
Description
0
0
Transfer in normal mode
1
Transfer in block transfer mode, destination side is block area
0
Transfer in normal mode
1
Transfer in block transfer mode, source side is block area
1
(Initial value)
For operation in normal mode and block transfer mode, see section 7.5, Operation.
Bits 10 to 7—Reserved: Can be read or written to. Write 0 to these bits.
Bit 6—Destination Address Increment/Decrement (DAID)
Bit 5—Destination Address Increment/Decrement Enable (DAIDE): These bits specify whether destination address
register MARB is to be incremented, decremented, or left unchanged, when data transfer is performed.
Bit 6
DAID
Bit 5
DAIDE
Description
0
0
MARB is fixed
1
MARB is incremented after a data transfer
1
(Initial value)
•
When DTSZ = 0, MARB is incremented by 1 after a transfer
•
When DTSZ = 1, MARB is incremented by 2 after a transfer
0
MARB is fixed
1
MARB is decremented after a data transfer
•
When DTSZ = 0, MARB is decremented by 1 after a transfer
•
When DTSZ = 1, MARB is decremented by 2 after a transfer
Bit 4—Reserved: Can be read or written to. Write 0 to this bit.
Bits 3 to 0—Data Transfer Factor (DTF3 to DTF0): These bits select the data transfer factor (activation source). The
factors that can be specified differ between normal mode and block transfer mode.
• Normal Mode
Bit 3
DTF3
Bit 2
DTF2
Bit 1
DTF1
Bit 0
DTF0
Description
0
0
0
0
—
1
—
0
Activated by DREQ pin falling edge input
1
Activated by DREQ pin low-level input
0
×
—
1
0
Auto-request (cycle steal)
1
Auto-request (burst)
×
—
1
1
1
×
×
(Initial value)
×: Don't care
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• Block Transfer Mode
Bit 3
DTF3
Bit 2
DTF2
Bit 1
DTF1
Bit 0
DTF0
Description
0
0
0
0
—
1
Activated by A/D converter conversion end interrupt
0
Activated by DREQ pin falling edge input*
1
Activated by DREQ pin low-level input
0
Activated by SCI channel 0 transmission data empty
interrupt
1
Activated by SCI channel 0 reception data full interrupt
0
Activated by SCI channel 1 transmission data empty
interrupt
1
Activated by SCI channel 1 reception data full interrupt
0
Activated by TPU channel 0 compare match/input capture
A interrupt
1
Activated by TPU channel 1 compare match/input capture
A interrupt
0
Activated by TPU channel 2 compare match/input capture
A interrupt
1
Activated by TPU channel 3 compare match/input capture
A interrupt
0
Activated by TPU channel 4 compare match/input capture
A interrupt
1
Activated by TPU channel 5 compare match/input capture
A interrupt
0
—
1
—
1
1
0
1
1
0
0
1
1
0
1
(Initial value)
Note: * Detected as a low level in the first transfer after transfer is enabled.
The same factor can be selected for more than one channel. In this case, activation starts with the highest-priority channel
according to the relative channel priorities. For relative channel priorities, see section 7.5.13, DMAC Multi-Channel
Operation.
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REJ09B0138-0600H
7.3.5
DMA Band Control Register (DMABCR)
Bit
:
15
14
13
12
11
10
9
8
DMABCRH :
FAE1
FAE0
—
—
DTA1
—
DTA0
—
Initial value :
0
0
0
0
0
0
0
0
R/W
:
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Bit
:
7
6
5
4
3
2
1
0
DMABCRL :
DTME1
DTE1
DTME0
DTE0
DTIE1B
DTIE1A
DTIE0B
DTIE0A
Initial value :
0
0
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
:
DMABCR is a 16-bit readable/writable register that controls the operation of each DMAC channel.
DMABCR is initialized to H'0000 by a reset, and in standby mode.
Bit 15—Full Address Enable 1 (FAE1): Specifies whether channel 1 is to be used in short address mode or full address
mode.
In full address mode, channels 1A and 1B are used together as a single channel.
Bit 15
FAE1
Description
0
Short address mode
1
Full address mode
(Initial value)
Bit 14—Full Address Enable 0 (FAE0): Specifies whether channel 0 is to be used in short address mode or full address
mode.
In full address mode, channels 0A and 0B are used together as a single channel.
Bit 14
FAE0
Description
0
Short address mode
1
Full address mode
Bits 13 and 12—Reserved: Can be read or written to. Write 0 to these bits.
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(Initial value)
Bits 11 and 9—Data Transfer Acknowledge (DTA): These bits enable or disable clearing, when DMA transfer is
performed, of the internal interrupt source selected by the data transfer factor setting.
When DTE = 1 and DTA = 1, the internal interrupt source selected by the data transfer factor setting is cleared
automatically by DMA transfer. When DTE = 1 and DTA = 1, the internal interrupt source selected by the data transfer
factor setting does not issue an interrupt request to the CPU or DTC.
When the DTE = 1 and the DTA = 0, the internal interrupt source selected by the data transfer factor setting is not cleared
when a transfer is performed, and can issue an interrupt request to the CPU or DTC in parallel. In this case, the interrupt
source should be cleared by the CPU or DTC transfer.
When the DTE = 0, the internal interrupt source selected by the data transfer factor setting issues an interrupt request to
the CPU or DTC regardless of the DTA bit setting.
The state of the DTME bit does not affect the above operations.
Bit 11—Data Transfer Acknowledge 1 (DTA1): Enables or disables clearing, when DMA transfer is performed, of the
internal interrupt source selected by the channel 1 data transfer factor setting.
Bit 11
DTA1
Description
0
Clearing of selected internal interrupt source at time of DMA transfer is disabled
(Initial value)
1
Clearing of selected internal interrupt source at time of DMA transfer is enabled
Bit 9—Data Transfer Acknowledge 0 (DTA0): Enables or disables clearing, when DMA transfer is performed, of the
internal interrupt source selected by the channel 0 data transfer factor setting.
Bit 9
DTA0
Description
0
Clearing of selected internal interrupt source at time of DMA transfer is disabled
(Initial value)
1
Clearing of selected internal interrupt source at time of DMA transfer is enabled
Bits 10 and 8—Reserved: Can be read or written to. Write 0 to these bits.
Bits 7 and 5—Data Transfer Master Enable (DTME): Together with the DTE bit, these bits control enabling or
disabling of data transfer on the relevant channel. When both the DTME bit and the DTE bit are set to 1, transfer is
enabled for the channel.
If the relevant channel is in the middle of a burst mode transfer when an NMI interrupt is generated, the DTME bit is
cleared, the transfer is interrupted, and bus mastership passes to the CPU. When the DTME bit is subsequently set to 1
again, the interrupted transfer is resumed. In block transfer mode, however, the DTME bit is not cleared by an NMI
interrupt, and transfer is not interrupted.
The conditions for the DTME bit being cleared to 0 are as follows:
• When initialization is performed
• When NMI is input in burst mode
• When 0 is written to the DTME bit
The condition for DTME being set to 1 is as follows:
• When 1 is written to DTME after DTME is read as 0
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Bit 7—Data Transfer Master Enable 1 (DTME1): Enables or disables data transfer on channel 1.
Bit 7
DTME1
Description
0
Data transfer disabled. In burst mode, cleared to 0 by an NMI interrupt
1
Data transfer enabled
(Initial value)
Bit 5—Data Transfer Master Enable 0 (DTME0): Enables or disables data transfer on channel 0.
Bit 5
DTME0
Description
0
Data transfer disabled. In normal mode, cleared to 0 by an NMI interrupt (Initial value)
1
Data transfer enabled
Bits 6 and 4—Data Transfer Enable (DTE): When DTE = 0, data transfer is disabled and the activation source selected
by the data transfer factor setting is ignored. If the activation source is an internal interrupt, an interrupt request is issued to
the CPU or DTC. If the DTIE bit is set to 1 when DTE = 0, the DMAC regards this as indicating the end of a transfer, and
issues a transfer end interrupt request to the CPU.
The conditions for the DTE bit being cleared to 0 are as follows:
• When initialization is performed
• When the specified number of transfers have been completed
• When 0 is written to the DTE bit to forcibly abort the transfer, or for a similar reason
When DTE = 1 and DTME = 1, data transfer is enabled and the DMAC waits for a request by the activation source
selected by the data transfer factor setting. When a request is issued by the activation source, DMA transfer is executed.
The condition for the DTE bit being set to 1 is as follows:
• When 1 is written to the DTE bit after the DTE bit is read as 0
Bit 6—Data Transfer Enable 1 (DTE1): Enables or disables data transfer on channel 1.
Bit 6
DTE1
Description
0
Data transfer disabled
1
Data transfer enabled
(Initial value)
Bit 4—Data Transfer Enable 0 (DTE0): Enables or disables data transfer on channel 0.
Bit 4
DTE0
Description
0
Data transfer disabled
1
Data transfer enabled
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(Initial value)
Bits 3 and 1—Data Transfer Interrupt Enable B (DTIEB): These bits enable or disable an interrupt to the CPU or
DTC when transfer is interrupted. If the DTIEB bit is set to 1 when DTME = 0, the DMAC regards this as indicating a
break in the transfer, and issues a transfer break interrupt request to the CPU or DTC.
A transfer break interrupt can be canceled either by clearing the DTIEB bit to 0 in the interrupt handling routine, or by
performing processing to continue transfer by setting the DTME bit to 1.
Bit 3—Data Transfer Interrupt Enable 1B (DTIE1B): Enables or disables the channel 1 transfer break interrupt.
Bit 3
DTIE1B
Description
0
Transfer break interrupt disabled
1
Transfer break interrupt enabled
(Initial value)
Bit 1—Data Transfer Interrupt Enable 0B (DTIE0B): Enables or disables the channel 0 transfer break interrupt.
Bit 1
DTIE0B
Description
0
Transfer break interrupt disabled
1
Transfer break interrupt enabled
(Initial value)
Bits 2 and 0—Data Transfer End Interrupt Enable A (DTIEA): These bits enable or disable an interrupt to the CPU or
DTC when transfer ends. If DTIEA bit is set to 1 when DTE = 0, the DMAC regards this as indicating the end of a
transfer, and issues a transfer end interrupt request to the CPU or DTC.
A transfer end interrupt can be canceled either by clearing the DTIEA bit to 0 in the interrupt handling routine, or by
performing processing to continue transfer by setting the transfer counter and address register again, and then setting the
DTE bit to 1.
Bit 2—Data Transfer Interrupt Enable 1A (DTIE1A): Enables or disables the channel 1 transfer end interrupt.
Bit 2
DTIE1A
Description
0
Transfer end interrupt disabled
1
Transfer end interrupt enabled
(Initial value)
Bit 0—Data Transfer Interrupt Enable 0A (DTIE0A): Enables or disables the channel 0 transfer end interrupt.
Bit 0
DTIE0A
Description
0
Transfer end interrupt disabled
1
Transfer end interrupt enabled
(Initial value)
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7.4
Register Descriptions (3)
7.4.1
DMA Write Enable Register (DMAWER)
The DMAC can activate the DTC with a transfer end interrupt, rewrite the channel on which the transfer ended using a
DTC chain transfer, and reactivate the DTC. DMAWER applies restrictions so that specific bits of DMACR for the
specific channel, and also DMATCR and DMABCR, can be changed to prevent inadvertent rewriting of registers other
than those for the channel concerned. The restrictions applied by DMAWER are valid for the DTC.
Figure 7-2 shows the transfer areas for activating the DTC with a channel 0A transfer end interrupt, and reactivating
channel 0A. The address register and count register area is re-set by the first DTC transfer, then the control register area is
re-set by the second DTC chain transfer.
When re-setting the control register area, perform masking by setting bits in DMAWER to prevent modification of the
contents of the other channels.
MAR0A
First transfer area
IOAR0A
ETCR0A
MAR0B
IOAR0B
ETCR0B
MAR1A
DTC
IOAR1A
ETCR1A
MAR1B
IOAR1B
ETCR1B
DMAWER
DMATCR
DMACR0A
DMACR0B
DMACR1A
DMACR1B
Second transfer area
using chain transfer
DMABCR
Figure 7-2 Areas for Register Re-Setting by DTC (Example: Channel 0A)
Bit
:
7
6
5
4
3
2
1
0
DMAWER :
—
—
—
—
WE1B
WE1A
WE0B
WE0A
Initial value :
0
0
0
0
0
0
0
0
R/W
—
—
—
—
R/W
R/W
R/W
R/W
:
DMAWER is an 8-bit readable/writable register that controls enabling or disabling of writes to the DMACR, DMABCR,
and DMATCR by the DTC.
DMAWER is initialized to H'00 by a reset, and in standby mode.
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Bits 7 to 4—Reserved: These bits cannot be modified and are always read as 0.
Bit 3—Write Enable 1B (WE1B): Enables or disables writes to all bits in DMACR1B, bits 11, 7, and 3 in DMABCR,
and bit 5 in DMATCR by the DTC.
Bit 3
WE1B
Description
0
Writes to all bits in DMACR1B, bits 11, 7, and 3 in DMABCR, and bit 5 in DMATCR
are disabled
(Initial value)
1
Writes to all bits in DMACR1B, bits 11, 7, and 3 in DMABCR, and bit 5 in DMATCR
are enabled
Bit 2—Write Enable 1A (WE1A): Enables or disables writes to all bits in DMACR1A, and bits 10, 6, and 2 in
DMABCR by the DTC.
Bit 2
WE1A
Description
0
Writes to all bits in DMACR1A, and bits 10, 6, and 2 in DMABCR are disabled
(Initial value)
1
Writes to all bits in DMACR1A, and bits 10, 6, and 2 in DMABCR are enabled
Bit 1—Write Enable 0B (WE0B): Enables or disables writes to all bits in DMACR0B, bits 9, 5, and 1 in DMABCR, and
bit 4 in DMATCR.
Bit 1
WE0B
Description
0
Writes to all bits in DMACR0B, bits 9, 5, and 1 in DMABCR, and bit 4 in DMATCR
are disabled
(Initial value)
1
Writes to all bits in DMACR0B, bits 9, 5, and 1 in DMABCR, and bit 4 in DMATCR
are enabled
Bit 0—Write Enable 0A (WE0A): Enables or disables writes to all bits in DMACR0A, and bits 8, 4, and 0 in DMABCR.
Bit 0
WE0A
Description
0
Writes to all bits in DMACR0A, and bits 8, 4, and 0 in DMABCR are disabled
(Initial value)
1
Writes to all bits in DMACR0A, and bits 8, 4, and 0 in DMABCR are enabled
Writes by the DTC to bits 15 to 12 (FAE and SAE) in DMABCR are invalid regardless of the DMAWER settings. These
bits should be changed, if necessary, by CPU processing.
In writes by the DTC to bits 7 to 4 (DTE) in DMABCR, 1 can be written without first reading 0. To reactivate a channel
set to full address mode, write 1 to both Write Enable A and Write Enable B for the channel to be reactivated.
MAR, IOAR, and ETCR are always write-enabled regardless of the DMAWER settings. When modifying these registers,
the channel for which the modification is to be made should be halted.
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7.4.2
DMA Terminal Control Register (DMATCR)
Bit
:
7
6
5
4
3
2
1
0
DMATCR :
—
—
TEE1
TEE0
—
—
—
—
Initial value :
0
0
0
0
0
0
0
0
R/W
—
—
R/W
R/W
—
—
—
—
:
DMATCR is an 8-bit readable/writable register that controls enabling or disabling of DMAC transfer end pin output. A
port can be set for output automatically, and a transfer end signal output, by setting the appropriate bit.
DMATCR is initialized to H'00 by a reset, and in standby mode.
Bits 7 and 6—Reserved: These bits cannot be modified and are always read as 0.
Bit 5—Transfer End Enable 1 (TEE1): Enables or disables transfer end pin 1 (TEND1) output.
Bit 5
TEE1
Description
0
TEND1 pin output disabled
1
TEND1 pin output enabled
(Initial value)
Bit 4—Transfer End Enable 0 (TEE0): Enables or disables transfer end pin 0 (TEND0) output.
Bit 4
TEE0
Description
0
TEND0 pin output disabled
1
TEND0 pin output enabled
(Initial value)
The TEND pins are assigned only to channel B in short address mode.
The transfer end signal indicates the transfer cycle in which the transfer counter reached 0, regardless of the transfer
source. An exception is block transfer mode, in which the transfer end signal indicates the transfer cycle in which the
block counter reached 0.
Bits 3 to 0—Reserved: These bits cannot be modified and are always read as 0.
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7.4.3
Module Stop Control Register (MSTPCR)
MSTPCRH
Bit
MSTPCRL
:
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Initial value :
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
R/W
: R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
MSTPCR is a 16-bit readable/writable register that performs module stop mode control.
When the MSTP15 bit in MSTPCR is set to 1, the DMAC operation stops at the end of the bus cycle and a transition is
made to module stop mode. For details, see section 21.5, Module Stop Mode.
MSTPCR is initialized to H'3FFF by a reset and in hardware standby mode. It is not initialized in software standby mode.
Bit 15—Module Stop (MSTP15): Specifies the DMAC module stop mode.
Bits 15
MSTP15
Description
0
DMAC module stop mode cleared
1
DMAC module stop mode set
(Initial value)
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7.5
Operation
7.5.1
Transfer Modes
Table 7-5 lists the DMAC modes.
Table 7-5
DMAC Transfer Modes
Transfer Mode
Short
address
mode
Transfer Source
Dual
(1) Sequential mode •
address
(2) Idle mode
mode
(3) Repeat mode
•
TPU channel 0 to 5
compare match/input
capture A interrupts
Remarks
•
Up to 4 channels can
operate independently
•
External request
applies to channel B
only
SCI transmission data
empty interrupt
•
SCI reception data full •
interrupt
•
A/D converter
conversion end
interrupt
•
External request
•
External request
•
Auto-request
Single address mode
applies to channel B
only
•
Modes (1), (2), and (3)
can also be specified
for single address
mode
•
Max. 2-channel
operation, combining
channels A and B
•
With auto-request,
burst mode transfer or
cycle steal transfer can
be selected
(4) Single address mode
Full address (5) Normal mode
mode
(6) Block transfer
mode
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•
TPU channel 0 to 5
compare match/input
capture A interrupt
•
SCI transmission data
empty interrupt
•
SCI reception data full
interrupt
•
A/D converter
conversion end
interrupt
•
External request
Operation in each mode is summarized below.
(1) Sequential mode
In response to a single transfer request, the specified number of transfers are carried out, one byte or one word at a
time. An interrupt request can be sent to the CPU or DTC when the specified number of transfers have been
completed. One address is specified as 24 bits, and the other as 16 bits. The transfer direction is programmable.
(2) Idle mode
In response to a single transfer request, the specified number of transfers are carried out, one byte or one word at a
time. An interrupt request can be sent to the CPU or DTC when the specified number of transfers have been
completed. One address is specified as 24 bits, and the other as 16 bits. The transfer source address and transfer
destination address are fixed. The transfer direction is programmable.
(3) Repeat mode
In response to a single transfer request, the specified number of transfers are carried out, one byte or one word at a
time. When the specified number of transfers have been completed, the addresses and transfer counter are restored to
their original settings, and operation is continued. No interrupt request is sent to the CPU or DTC. One address is
specified as 24 bits, and the other as 16 bits. The transfer direction is programmable.
(4) Single address mode
In response to a single transfer request, the specified number of transfers are carried out between external memory and
an external device, one byte or one word at a time. Unlike dual address mode, source and destination accesses are
performed in parallel. Therefore, either the source or the destination is an external device which can be accessed with a
strobe alone, using the DACK pin. One address is specified as 24 bits, and for the other, the pin is set automatically.
The transfer direction is programmable.
Modes (1), (2) and (3) can also be specified for single address mode.
(5) Normal mode
• Auto-request
By means of register settings only, the DMAC is activated, and transfer continues until the specified number of
transfers have been completed. An interrupt request can be sent to the CPU or DTC when transfer is completed. Both
addresses are specified as 24 bits.
 Cycle steal mode: The bus is released to another bus master every byte or word transfer.
 Burst mode: The bus is held and transfer continued until the specified number of transfers have been completed.
• External request
In response to a single transfer request, the specified number of transfers are carried out, one byte or one word at a
time. An interrupt request can be sent to the CPU or DTC when the specified number of transfers have been
completed. Both addresses are specified as 24 bits.
(6) Block transfer mode
In response to a single transfer request, a block transfer of the specified block size is carried out. This is repeated the
specified number of times, once each time there is a transfer request. At the end of each single block transfer, one
address is restored to its original setting. An interrupt request can be sent to the CPU or DTC when the specified
number of block transfers have been completed. Both addresses are specified as 24 bits.
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7.5.2
Sequential Mode
Sequential mode can be specified by clearing the RPE bit in DMACR to 0. In sequential mode, MAR is updated after each
byte or word transfer in response to a single transfer request, and this is executed the number of times specified in ETCR.
One address is specified by MAR, and the other by IOAR. The transfer direction can be specified by the DTDIR bit in
DMACR.
Table 7-6 summarizes register functions in sequential mode.
Table 7-6
Register Functions in Sequential Mode
Function
Register
DTDIR = 0 DTDIR = 1 Initial Setting
23
0 Source
address
register
MAR
23
15
H'FF
Destination Start address of
Incremented/
address
transfer destination decremented every
register
or transfer source
transfer
0 Destination Source
IOAR
15
address
register
address
register
0 Transfer counter
ETCR
Operation
Start address of
Fixed
transfer source or
transfer destination
Number of transfers Decremented every
transfer; transfer
ends when count
reaches H'0000
Legend:
MAR: Memory address register
IOAR: I/O address register
ETCR: Transfer count register
DTDIR:Data transfer direction bit
MAR specifies the start address of the transfer source or transfer destination as 24 bits. MAR is incremented or
decremented by 1 or 2 each time a byte or word is transferred.
IOAR specifies the lower 16 bits of the other address. The 8 bits above IOAR have a value of H'FF.
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Figure 7-3 illustrates operation in sequential mode.
Address T
Transfer
IOAR
1 byte or word transfer performed in
response to 1 transfer request
Address B
Legend:
Address T = L
Address B = L + (–1)DTID • (2DTSZ • (N–1))
Where : L = Value set in MAR
N = Value set in ETCR
Figure 7-3 Operation in Sequential Mode
The number of transfers is specified as 16 bits in ETCR. ETCR is decremented by 1 each time a transfer is executed, and
when its value reaches H'0000, the DTE bit is cleared and transfer ends. If the DTIE bit is set to 1 at this time, an interrupt
request is sent to the CPU or DTC.
The maximum number of transfers, when H'0000 is set in ETCR, is 65,536.
Transfer requests (activation sources) consist of A/D converter conversion end interrupts, external requests, SCI
transmission data empty and reception data full interrupts, and TPU channel 0 to 5 compare match/input capture A
interrupts. External requests can be set for channel B only.
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Figure 7-4 shows an example of the setting procedure for sequential mode.
[1] Set each bit in DMABCRH.
• Clear the FAE bit to 0 to select short address
mode.
• Specify enabling or disabling of internal
interrupt clearing with the DTA bit.
Sequential mode setting
Set DMABCRH
[1]
[2] Set the transfer source address and transfer
destination address in MAR and IOAR.
[3] Set the number of transfers in ETCR.
Set transfer source
and transfer destination
addresses
[2]
Set number of transfers
[3]
Set DMACR
[4]
[4] Set each bit in DMACR.
• Set the transfer data size with the DTSZ bit.
• Specify whether MAR is to be incremented or
decremented with the DTID bit.
• Clear the RPE bit to 0 to select sequential
mode.
• Specify the transfer direction with the DTDIR
bit.
• Select the activation source with bits DTF3 to
DTF0.
[5] Read the DTE bit in DMABCRL as 0.
Read DMABCRL
[5]
Set DMABCRL
[6]
[6] Set each bit in DMABCRL.
• Specify enabling or disabling of transfer end
interrupts with the DTIE bit.
• Set the DTE bit to 1 to enable transfer.
Sequential mode
Figure 7-4 Example of Sequential Mode Setting Procedure
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7.5.3
Idle Mode
Idle mode can be specified by setting the RPE bit and DTIE bit in DMACR to 1. In idle mode, one byte or word is
transferred in response to a single transfer request, and this is executed the number of times specified in ETCR.
One address is specified by MAR, and the other by IOAR. The transfer direction can be specified by the DTDIR bit in
DMACR.
Table 7-7 summarizes register functions in idle mode.
Table 7-7
Register Functions in Idle Mode
Function
Register
DTDIR = 0 DTDIR = 1 Initial Setting
23
0 Source
address
register
MAR
23
15
H'FF
Destination Start address of
Fixed
address
transfer destination
register
or transfer source
0 Destination Source
IOAR
15
address
register
Operation
address
register
0 Transfer counter
ETCR
Start address of
Fixed
transfer source or
transfer destination
Number of transfers Decremented every
transfer; transfer
ends when count
reaches H'0000
Legend:
MAR: Memory address register
IOAR: I/O address register
ETCR: Transfer count register
DTDIR:Data transfer direction bit
MAR specifies the start address of the transfer source or transfer destination as 24 bits. MAR is neither incremented nor
decremented each time a byte or word is transferred.
IOAR specifies the lower 16 bits of the other address. The 8 bits above IOAR have a value of H'FF.
Figure 7-5 illustrates operation in idle mode.
MAR
Transfer
IOAR
1 byte or word transfer performed in
response to 1 transfer request
Figure 7-5 Operation in Idle Mode
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The number of transfers is specified as 16 bits in ETCR. ETCR is decremented by 1 each time a transfer is executed, and
when its value reaches H'0000, the DTE bit is cleared and transfer ends. If the DTIE bit is set to 1 at this time, an interrupt
request is sent to the CPU or DTC.
The maximum number of transfers, when H'0000 is set in ETCR, is 65,536.
Transfer requests (activation sources) consist of A/D converter conversion end interrupts, external requests, SCI
transmission data empty and reception data full interrupts, and TPU channel 0 to 5 compare match/input capture A
interrupts. External requests can be set for channel B only.
When the DMAC is used in single address mode, only channel B can be set.
Figure 7-6 shows an example of the setting procedure for idle mode.
[1] Set each bit in DMABCRH.
• Clear the FAE bit to 0 to select short address
mode.
• Specify enabling or disabling of internal
interrupt clearing with the DTA bit.
Idle mode setting
Set DMABCRH
[1]
[2] Set the transfer source address and transfer
destination address in MAR and IOAR.
[3] Set the number of transfers in ETCR.
Set transfer source
and transfer destination
addresses
[2]
Set number of transfers
[3]
Set DMACR
[4]
[4] Set each bit in DMACR.
• Set the transfer data size with the DTSZ bit.
• Specify whether MAR is to be incremented or
decremented with the DTID bit.
• Set the RPE bit to 1.
• Specify the transfer direction with the DTDIR
bit.
• Select the activation source with bits DTF3 to
DTF0.
[5] Read the DTE bit in DMABCRL as 0.
[6] Set each bit in DMABCRL.
• Set the DTIE bit to 1.
• Set the DTE bit to 1 to enable transfer.
Read DMABCRL
[5]
Set DMABCRL
[6]
Idle mode
Figure 7-6 Example of Idle Mode Setting Procedure
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7.5.4
Repeat Mode
Repeat mode can be specified by setting the RPE bit in DMACR to 1, and clearing the DTIE bit to 0. In repeat mode,
MAR is updated after each byte or word transfer in response to a single transfer request, and this is executed the number
of times specified in ETCR. On completion of the specified number of transfers, MAR and ETCRL are automatically
restored to their original settings and operation continues.
One address is specified by MAR, and the other by IOAR. The transfer direction can be specified by the DTDIR bit in
DMACR.
Table 7-8 summarizes register functions in repeat mode.
Table 7-8
Register Functions in Repeat Mode
Function
Register
DTDIR = 0 DTDIR = 1 Initial Setting
23
0 Source
address
register
MAR
23
15
H'FF
Destination Start address of
Incremented/
address
transfer destination decremented every
register
or transfer source
transfer. Initial
setting is restored
when value reaches
H'0000
0 Destination Source
address
register
IOAR
7
address
register
0 Holds number of
Start address of
Fixed
transfer source or
transfer destination
Number of transfers Fixed
transfers
ETCRH
7
Operation
0
Transfer counter
ETCRL
Number of transfers Decremented every
transfer. Loaded with
ETCRH value when
count reaches H'00
Legend:
MAR: Memory address register
IOAR: I/O address register
ETCR: Transfer count register
DTDIR:Data transfer direction bit
MAR specifies the start address of the transfer source or transfer destination as 24 bits. MAR is incremented or
decremented by 1 or 2 each time a byte or word is transferred.
IOAR specifies the lower 16 bits of the other address. The 8 bits above IOAR have a value of H'FF.
The number of transfers is specified as 8 bits by ETCRH and ETCRL. The maximum number of transfers, when H'00 is
set in both ETCRH and ETCRL, is 256.
In repeat mode, ETCRL functions as the transfer counter, and ETCRH is used to hold the number of transfers. ETCRL is
decremented by 1 each time a transfer is executed, and when its value reaches H'00, it is loaded with the value in ETCRH.
At the same time, the value set in MAR is restored in accordance with the values of the DTSZ and DTID bits in DMACR.
The MAR restoration operation is as shown below.
MAR = MAR – (–1)DTID · 2DTSZ · ETCRH
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The same value should be set in ETCRH and ETCRL.
In repeat mode, operation continues until the DTE bit is cleared. To end the transfer operation, therefore, you should clear
the DTE bit to 0. A transfer end interrupt request is not sent to the CPU or DTC.
By setting the DTE bit to 1 again after it has been cleared, the operation can be restarted from the transfer after that
terminated when the DTE bit was cleared.
Figure 7-7 illustrates operation in repeat mode.
Address T
Transfer
IOAR
1 byte or word transfer performed in
response to 1 transfer request
Address B
Legend:
Address T = L
Address B = L + (–1)DTID • (2DTSZ • (N–1))
Where : L = Value set in MAR
N = Value set in ETCR
Figure 7-7 Operation in Repeat mode
Transfer requests (activation sources) consist of A/D converter conversion end interrupts, external requests, SCI
transmission data empty and reception data full interrupts, and TPU channel 0 to 5 compare match/input capture A
interrupts. External requests can be set for channel B only.
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Figure 7-8 shows an example of the setting procedure for repeat mode.
[1] Set each bit in DMABCRH.
• Clear the FAE bit to 0 to select short address
mode.
• Specify enabling or disabling of internal
interrupt clearing with the DTA bit.
Repeat mode setting
Set DMABCRH
[1]
[2] Set the transfer source address and transfer
destination address in MAR and IOAR.
[3] Set the number of transfers in both ETCRH and
ETCRL.
Set transfer source
and transfer destination
addresses
[2]
Set number of transfers
[3]
Set DMACR
[4]
[4] Set each bit in DMACR.
• Set the transfer data size with the DTSZ bit.
• Specify whether MAR is to be incremented or
decremented with the DTID bit.
• Set the RPE bit to 1.
• Specify the transfer direction with the DTDIR
bit.
• Select the activation source with bits DTF3 to
DTF0.
[5] Read the DTE bit in DMABCRL as 0.
Read DMABCRL
[5]
Set DMABCRL
[6]
[6] Set each bit in DMABCRL.
• Clear the DTIE bit to 0.
• Set the DTE bit to 1 to enable transfer.
Repeat mode
Figure 7-8 Example of Repeat Mode Setting Procedure
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7.5.5
Single Address Mode
Single address mode can only be specified for channel B. This mode can be specified by setting the SAE bit in DMABCR
to 1 in short address mode.
One address is specified by MAR, and the other is set automatically to the data transfer acknowledge pin (DACK). The
transfer direction can be specified by the DTDIR in DMACR.
Table 7-9 summarizes register functions in single address mode.
Table 7-9
Register Functions in Single Address Mode
Function
Register
DTDIR = 0 DTDIR = 1 Initial Setting
23
0 Source
MAR
DACK pin
15
Operation
address
register
Destination Start address of
*
address
transfer destination
register
or transfer source
Write
strobe
Read
strobe
0 Transfer counter
(Set automatically Strobe for external
by SAE bit; IOAR is device
invalid)
Number of transfers *
ETCR
Legend:
MAR: Memory address register
IOAR: I/O address register
ETCR: Transfer count register
DTDIR:Data transfer direction bit
DACK: Data transfer acknowledge
Note: * See the operation descriptions in sections 7.5.2, Sequential Mode, 7.5.3, Idle Mode, and 7.5.4, Repeat Mode.
MAR specifies the start address of the transfer source or transfer destination as 24 bits.
IOAR is invalid; in its place the strobe for external devices (DACK) is output.
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Figure 7-9 illustrates operation in single address mode (when sequential mode is specified).
Address T
DACK
Transfer
1 byte or word transfer performed in
response to 1 transfer request
Address B
Legend:
Address T = L
Address B = L + (–1)DTID • (2DTSZ • (N–1))
Where : L = Value set in MAR
N = Value set in ETCR
Figure 7-9 Operation in Single Address Mode (When Sequential Mode Is Specified)
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Figure 7-10 shows an example of the setting procedure for single address mode (when sequential mode is specified).
Single address
mode setting
Set DMABCRH
Set transfer source and
transfer destination
addresses
[1]
[1] Set each bit in DMABCRH.
• Clear the FAE bit to 0 to select short address
mode.
• Set the SAE bit to 1 to select single address
mode.
• Specify enabling or disabling of internal
interrupt clearing with the DTA bit.
[2] Set the transfer source address/transfer
destination address in MAR.
[2]
Set number of transfers
[3]
Set DMACR
[4]
[3] Set the number of transfers in ETCR.
[4] Set each bit in DMACR.
• Set the transfer data size with the DTSZ bit.
• Specify whether MAR is to be incremented or
decremented with the DTID bit.
• Clear the RPE bit to 0 to select sequential
mode.
• Specify the transfer direction with the DTDIR
bit.
• Select the activation source with bits DTF3 to
DTF0.
[5] Read the DTE bit in DMABCRL as 0.
Read DMABCRL
[5]
Set DMABCRL
[6]
[6] Set each bit in DMABCRL.
• Specify enabling or disabling of transfer end
interrupts with the DTIE bit.
• Set the DTE bit to 1 to enable transfer.
Single address mode
Figure 7-10 Example of Single Address Mode Setting Procedure (When Sequential Mode Is Specified)
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7.5.6
Normal Mode
In normal mode, transfer is performed with channels A and B used in combination. Normal mode can be specified by
setting the FAE bit in DMABCR to 1 and clearing the BLKE bit in DMACRA to 0.
In normal mode, MAR is updated after each byte or word transfer in response to a single transfer request, and this is
executed the number of times specified in ETCRA. The transfer source is specified by MARA, and the transfer destination
by MARB.
Table 7-10 summarizes register functions in normal mode.
Table 7-10 Register Functions in Normal Mode
Register
Function
23
0 Source address
MARA
23
register
0 Destination
MARB
15
address register
0 Transfer counter
ETCRA
Initial Setting
Operation
Start address of
transfer source
Incremented/decremented
every transfer, or fixed
Start address of
Incremented/decremented
transfer destination every transfer, or fixed
Number of transfers Decremented every
transfer; transfer ends
when count reaches
H'0000
Legend:
MARA: Memory address register A
MARB: Memory address register B
ETCRA: Transfer count register A
MARA and MARB specify the start addresses of the transfer source and transfer destination, respectively, as 24 bits.
MAR can be incremented or decremented by 1 or 2 each time a byte or word is transferred, or can be fixed.
Incrementing, decrementing, or holding a fixed value can be set separately for MARA and MARB.
The number of transfers is specified by ETCRA as 16 bits. ETCRA is decremented each time a transfer is performed, and
when its value reaches H'0000 the DTE bit is cleared and transfer ends. If the DTIE bit is set to 1 at this time, an interrupt
request is sent to the CPU or DTC.
The maximum number of transfers, when H'0000 is set in ETCRA, is 65,536.
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Figure 7-11 illustrates operation in normal mode.
Transfer
Address TA
Address BB
Address BA
Legend:
Address TA
Address TB
Address BA
Address BB
Where : LA
LB
N
Address TB
= LA
= LB
= LA + SAIDE • (–1)SAID • (2DTSZ • (N–1))
= LB + DAIDE • (–1)DAID • (2DTSZ • (N–1))
= Value set in MARA
= Value set in MARB
= Value set in ETCRA
Figure 7-11 Operation in Normal Mode
Transfer requests (activation sources) are external requests and auto-requests.
With auto-request, the DMAC is only activated by register setting, and the specified number of transfers are performed
automatically. With auto-request, cycle steal mode or burst mode can be selected. In cycle steal mode, the bus is released
to another bus master each time a transfer is performed. In burst mode, the bus is held continuously until transfer ends.
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For setting details, see section 7.3.4, DMA Controller Register (DMACR).
Figure 7-12 shows an example of the setting procedure for normal mode.
[1] Set each bit in DMABCRH.
• Set the FAE bit to 1 to select full address
mode.
• Specify enabling or disabling of internal
interrupt clearing with the DTA bit.
Normal mode setting
Set DMABCRH
[1]
[2] Set the transfer source address in MARA, and
the transfer destination address in MARB.
[3] Set the number of transfers in ETCRA.
Set transfer source and
transfer destination
addresses
[2]
Set number of transfers
[3]
Set DMACR
[4]
[4] Set each bit in DMACRA and DMACRB.
• Set the transfer data size with the DTSZ bit.
• Specify whether MARA is to be incremented,
decremented, or fixed, with the SAID and
SAIDE bits.
• Clear the BLKE bit to 0 to select normal
mode.
• Specify whether MARB is to be incremented,
decremented, or fixed, with the DAID and
DAIDE bits.
• Select the activation source with bits DTF3 to
DTF0.
[5] Read DTE = 0 and DTME = 0 in DMABCRL.
Read DMABCRL
[5]
Set DMABCRL
[6]
[6] Set each bit in DMABCRL.
• Specify enabling or disabling of transfer end
interrupts with the DTIE bit.
• Set both the DTME bit and the DTE bit to 1 to
enable transfer.
Normal mode
Figure 7-12 Example of Normal Mode Setting Procedure
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7.5.7
Block Transfer Mode
In block transfer mode, transfer is performed with channels A and B used in combination. Block transfer mode can be
specified by setting the FAE bit in DMABCR and the BLKE bit in DMACRA to 1.
In block transfer mode, a transfer of the specified block size is carried out in response to a single transfer request, and this
is executed the specified number of times. The transfer source is specified by MARA, and the transfer destination by
MARB. Either the transfer source or the transfer destination can be selected as a block area (an area composed of a
number of bytes or words).
Table 7-11 summarizes register functions in block transfer mode.
Table 7-11 Register Functions in Block Transfer Mode
Register
Function
23
0 Source address
register
MARA
23
0 Destination
address register
MARB
7
0 Holds block
ETCRAH
Initial Setting
Operation
Start address of
transfer source
Incremented/decremented
every transfer, or fixed
Start address of
Incremented/decremented
transfer destination every transfer, or fixed
Block size
Fixed
Block size
Decremented every
transfer; ETCRH value
copied when count reaches
H'00
Number of block
transfers
Decremented every block
transfer; transfer ends
when count reaches
H'0000
size
Block size
0 counter
7
ETCRAL
15
0 Block transfer
ETCRB
counter
Legend:
MARA: Memory address register A
MARB: Memory address register B
ETCRA: Transfer count register A
ETCRB: Transfer count register B
MARA and MARB specify the start addresses of the transfer source and transfer destination, respectively, as 24 bits.
MAR can be incremented or decremented by 1 or 2 each time a byte or word is transferred, or can be fixed.
Incrementing, decrementing, or holding a fixed value can be set separately for MARA and MARB.
Whether a block is to be designated for MARA or for MARB is specified by the BLKDIR bit in DMACRA.
To specify the number of transfers, if M is the size of one block (where M = 1 to 256) and N transfers are to be performed
(where N = 1 to 65,536), M is set in both ETCRAH and ETCRAL, and N in ETCRB.
Figure 7-13 illustrates operation in block transfer mode when MARB is designated as a block area.
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Address TB
Address TA
1st block
2nd block
Transfer
Block area
Address BB
Consecutive transfer
of M bytes or words
is performed in
response to one
request
Nth block
Address BA
Legend:
Address TA
Address TB
Address BA
Address BB
Where : LA
LB
N
M
= LA
= LB
= LA + SAIDE • (–1)SAID • (2DTSZ • (M•N–1))
= LB + DAIDE • (–1)DAID • (2DTSZ • (N–1))
= Value set in MARA
= Value set in MARB
= Value set in ETCRB
= Value set in ETCRAH and ETCRAL
Figure 7-13 Operation in Block Transfer Mode (BLKDIR = 0)
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Figure 7-14 illustrates operation in block transfer mode when MARA is designated as a block area.
Address TA
Address TB
Block area
Transfer
1st block
Consecutive transfer
of M bytes or words
is performed in
response to one
request
Address BA
2nd block
Nth block
Address BB
Legend:
Address TA
Address TB
Address BA
Address BB
Where : LA
LB
N
M
= LA
= LB
= LA + SAIDE · (–1)SAID · (2DTSZ · (N–1))
= LB + DAIDE · (–1)DAID · (2DTSZ · (M·N–1))
= Value set in MARA
= Value set in MARB
= Value set in ETCRB
= Value set in ETCRAH and ETCRAL
Figure 7-14 Operation in Block Transfer Mode (BLKDIR = 1)
ETCRAL is decremented by 1 each time a byte or word transfer is performed. In response to a single transfer request,
burst transfer is performed until the value in ETCRAL reaches H'00. ETCRAL is then loaded with the value in ETCRAH.
At this time, the value in the MAR register for which a block designation has been given by the BLKDIR bit in DMACRA
is restored in accordance with the DTSZ, SAID/DAID, and SAIDE/DAIDE bits in DMACR.
ETCRB is decremented by 1 every block transfer, and when the count reaches H'0000 the DTE bit is cleared and transfer
ends. If the DTIE bit is set to 1 at this point, an interrupt request is sent to the CPU or DTC.
Figure 7-15 shows the operation flow in block transfer mode.
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Start
(DTE = DTME = 1)
Transfer request?
No
Yes
Acquire bus
Read address specified by MARA
MARA = MARA + SAIDE·(–1)SAID·2DTSZ
Write to address specified by MARB
MARB = MARB + DAIDE·(–1)DAID ·2DTSZ
ETCRAL = ETCRAL–1
ETCRAL = H'00
No
Yes
Release bus
ETCRAL = ETCRAH
BLKDIR = 0
No
Yes
MARB = MARB – DAIDE·(–1)DAID·2DTSZ·ETCRAH
MARA = MARA – SAIDE·(–1)SAID·2DTSZ·ETCRAH
ETCRB = ETCRB – 1
No
ETCRB = H'0000
Yes
Clear DTE bit to 0
to end transfer
Figure 7-15 Operation Flow in Block Transfer Mode
Transfer requests (activation sources) consist of A/D converter conversion end interrupts, external requests, SCI
transmission data empty and reception data full interrupts, and TPU channel 0 to 5 compare match/input capture A
interrupts.
For details, see section 7.3.4, DMA Control Register (DMACR).
Figure 7-16 shows an example of the setting procedure for block transfer mode.
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[1] Set each bit in DMABCRH.
• Set the FAE bit to 1 to select full address
mode.
• Specify enabling or disabling of internal
interrupt clearing with the DTA bit.
Block transfer
mode setting
Set DMABCRH
Set transfer source
and transfer destination
addresses
[1]
[2]
Set number of transfers
[3]
Set DMACR
[4]
Read DMABCRL
[5]
[2] Set the transfer source address in MARA, and
the transfer destination address in MARB.
[3] Set the block size in both ETCRAH and
ETCRAL. Set the number of transfers in
ETCRB.
[4] Set each bit in DMACRA and DMACRB.
• Set the transfer data size with the DTSZ bit.
• Specify whether MARA is to be incremented,
decremented, or fixed, with the SAID and
SAIDE bits.
• Set the BLKE bit to 1 to select block transfer
mode.
• Specify whether the transfer source or the
transfer destination is a block area with the
BLKDIR bit.
• Specify whether MARB is to be incremented,
decremented, or fixed, with the DAID and
DAIDE bits.
• Select the activation source with bits DTF3 to
DTF0.
[5] Read DTE = 0 and DTME = 0 in DMABCRL.
Set DMABCRL
Block transfer mode
[6]
[6] Set each bit in DMABCRL.
• Specify enabling or disabling of transfer end
interrupts to the CPU with the DTIE bit.
• Set both the DTME bit and the DTE bit to 1 to
enable transfer.
Figure 7-16 Example of Block Transfer Mode Setting Procedure
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7.5.8
DMAC Activation Sources
DMAC activation sources consist of internal interrupts, external requests, and auto-requests. The activation sources that
can be specified depend on the transfer mode and the channel, as shown in table 7-12.
Table 7-12 DMAC Activation Sources
Short Address Mode
Activation Source
Internal
Interrupts
External
Requests
Channels
0A and 1A
Channels
0B and 1B
Full Address Mode
Normal
Mode
ADI
×
TXI0
×
RXI0
×
TXI1
×
RXI1
×
TGI0A
×
TGI1A
×
TGI2A
×
TGI3A
×
TGI4A
×
TGI5A
×
DREQ pin falling edge input
×
DREQ pin low-level input
×
Auto-request
×
×
Block
Transfer
Mode
×
Legend:
: Can be specified
× : Cannot be specified
Activation by Internal Interrupt: An interrupt request selected as a DMAC activation source can be sent simultaneously
to the CPU and DTC. For details, see section 5, Interrupt Controller.
With activation by an internal interrupt, the DMAC accepts the request independently of the interrupt controller.
Consequently, interrupt controller priority settings are not accepted.
If the DMAC is activated by a CPU interrupt source or an interrupt source that is not used as a DTC activation source
(DTA = 1), the interrupt source flag is cleared automatically by the DMA transfer. With ADI, TXI, and RXI interrupts,
however, the interrupt source flag is not cleared unless the prescribed register is accessed in a DMA transfer. If the same
interrupt is used as an activation source for more than one channel, the interrupt request flag is cleared when the highestpriority channel is activated first. Transfer requests for other channels are held pending in the DMAC, and activation is
carried out in order of priority.
When DTE = 0, such as after completion of a transfer, a request from the selected activation source is not sent to the
DMAC, regardless of the DTA bit. In this case, the relevant interrupt request is sent to the CPU or DTC.
In case of overlap with a CPU interrupt source or DTC activation source (DTA = 0), the interrupt request flag is not
cleared by the DMAC.
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Activation by External Request: If an external request (DREQ pin) is specified as an activation source, the relevant port
should be set to input mode in advance.
Level sensing or edge sensing can be used for external requests.
External request operation in normal mode (short address mode or full address mode) is described below.
When edge sensing is selected, a 1-byte or 1-word transfer is executed each time a high-to-low transition is detected on the
DREQ pin. The next transfer may not be performed if the next edge is input before transfer is completed.
When level sensing is selected, the DMAC stands by for a transfer request while the DREQ pin is held high. While the
DREQ pin is held low, transfers continue in succession, with the bus being released each time a byte or word is
transferred. If the DREQ pin goes high in the middle of a transfer, the transfer is interrupted and the DMAC stands by for
a transfer request.
Activation by Auto-Request: Auto-request activation is performed by register setting only, and transfer continues to the
end.
With auto-request activation, cycle steal mode or burst mode can be selected.
In cycle steal mode, the DMAC releases the bus to another bus master each time a byte or word is transferred. DMA and
CPU cycles usually alternate.
In burst mode, the DMAC keeps possession of the bus until the end of the transfer, and transfer is performed continuously.
Single Address Mode: The DMAC can operate in dual address mode in which read cycles and write cycles are separate
cycles, or single address mode in which read and write cycles are executed in parallel.
In dual address mode, transfer is performed with the source address and destination address specified separately.
In single address mode, on the other hand, transfer is performed between external space in which either the transfer source
or the transfer destination is specified by an address, and an external device for which selection is performed by means of
the DACK strobe, without regard to the address. Figure 7-17 shows the data bus in single address mode.
RD
HWR, LWR
A23 to A0
Address bus
External
memory
H8S/2357
Group
D15 to D0
(high impedance)
Data bus
(Read)
(Write)
External
device
DACK
Figure 7-17 Data Bus in Single Address Mode
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When using the DMAC for single address mode reading, transfer is performed from external memory to the external
device, and the DACK pin functions as a write strobe for the external device. When using the DMAC for single address
mode writing, transfer is performed from the external device to external memory, and the DACK pin functions as a read
strobe for the external device. Since there is no directional control for the external device, one or other of the above single
directions should be used.
Bus cycles in single address mode are in accordance with the settings of the bus controller for the external memory area.
On the external device side, DACK is output in synchronization with the address strobe. For details of bus cycles, see
section 7.5.11, DMAC Bus Cycles (Single Address Mode).
Do not specify internal space for transfer addresses in single address mode.
7.5.9
Basic DMAC Bus Cycles
An example of the basic DMAC bus cycle timing is shown in figure 7-18. In this example, word-size transfer is
performed from 16-bit, 2-state access space to 8-bit, 3-state access space. When the bus is transferred from the CPU to the
DMAC, a source address read and destination address write are performed. The bus is not released in response to another
bus request, etc., between these read and write operations. As with CPU cycles, DMA cycles conform to the bus
controller settings.
CPU cycle
DMAC cycle (1-word transfer)
T1
T2
T1
T2
T3
T1
T2
CPU cycle
T3
ø
Source
address
Destination address
Address bus
RD
HWR
LWR
Figure 7-18 Example of DMA Transfer Bus Timing
The address is not output to the external address bus in an access to on-chip memory or an internal I/O register.
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7.5.10
DMAC Bus Cycles (Dual Address Mode)
Short Address Mode: Figure 7-19 shows a transfer example in which TEND output is enabled and byte-size short
address mode transfer (sequential/idle/repeat mode) is performed from external 8-bit, 2-state access space to internal I/O
space.
DMA
read
DMA
write
DMA
read
DMA
write
DMA
read
DMA
write
DMA
dead
ø
Address bus
RD
HWR
LWR
TEND
Bus release
Bus release
Bus release Last transfer cycle
Bus
release
Figure 7-19 Example of Short Address Mode Transfer
A one-byte or one-word transfer is performed for one transfer request, and after the transfer the bus is released. While the
bus is released one or more bus cycles are inserted by the CPU or DTC.
In the transfer end cycle (the cycle in which the transfer counter reaches 0), a one-state DMA dead cycle is inserted after
the DMA write cycle.
In repeat mode, when TEND output is enabled, TEND output goes low in the transfer cycle in which the transfer counter
reaches 0.
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Full Address Mode (Cycle Steal Mode): Figure 7-20 shows a transfer example in which TEND output is enabled and
word-size full address mode transfer (cycle steal mode) is performed from external 16-bit, 2-state access space to external
16-bit, 2-state access space.
DMA
read
DMA
write
DMA
read
DMA
write
DMA
read
DMA
write
DMA
dead
ø
Address bus
RD
HWR
LWR
TEND
Bus release
Bus release
Bus release
Last transfer
cycle
Bus
release
Figure 7-20 Example of Full Address Mode (Cycle Steal) Transfer
A one-byte or one-word transfer is performed, and after the transfer the bus is released. While the bus is released one bus
cycle is inserted by the CPU or DTC.
In the transfer end cycle (the cycle in which the transfer counter reaches 0), a one-state DMA dead cycle is inserted after
the DMA write cycle.
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Full Address Mode (Burst Mode): Figure 7-21 shows a transfer example in which TEND output is enabled and wordsize full address mode transfer (burst mode) is performed from external 16-bit, 2-state access space to external 16-bit, 2state access space.
DMA
read
DMA
write
DMA
read
DMA
write
DMA
read
DMA
write
DMA
dead
ø
Address bus
RD
HWR
LWR
TEND
Last transfer cycle
Bus release
Bus release
Burst transfer
Figure 7-21 Example of Full Address Mode (Burst Mode) Transfer
In burst mode, one-byte or one-word transfers are executed consecutively until transfer ends.
In the transfer end cycle (the cycle in which the transfer counter reaches 0), a one-state DMA dead cycle is inserted after
the DMA write cycle.
If a request from another higher-priority channel is generated after burst transfer starts, that channel has to wait until the
burst transfer ends.
If an NMI is generated while a channel designated for burst transfer is in the transfer enabled state, the DTME bit is
cleared and the channel is placed in the transfer disabled state. If burst transfer has already been activated inside the
DMAC, the bus is released on completion of a one-byte or one-word transfer within the burst transfer, and burst transfer is
suspended. If the last transfer cycle of the burst transfer has already been activated inside the DMAC, execution continues
to the end of the transfer even if the DTME bit is cleared.
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Full Address Mode (Block Transfer Mode): Figure 7-22 shows a transfer example in which TEND output is enabled
and word-size full address mode transfer (block transfer mode) is performed from internal 16-bit, 1-state access space to
external 16-bit, 2-state access space.
DMA
read
DMA
write
DMA
read
DMA
write
DMA
dead
DMA
read
DMA
write
DMA
read
DMA
write
DMA
dead
ø
Address bus
RD
HWR
LWR
TEND
Bus release
Block transfer
Bus release
Last block transfer
Bus
release
Figure 7-22 Example of Full Address Mode (Block Transfer Mode) Transfer
A one-block transfer is performed for one transfer request, and after the transfer the bus is released. While the bus is
released, one or more bus cycles are inserted by the CPU or DTC.
In the transfer end cycle of each block (the cycle in which the transfer counter reaches 0), a one-state DMA dead cycle is
inserted after the DMA write cycle.
One block is transmitted without interruption. NMI generation does not affect block transfer operation.
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DREQ Pin Falling Edge Activation Timing: Set the DTA bit for the channel for which the DREQ pin is selected to 1.
Figure 7-23 shows an example of DREQ pin falling edge activated normal mode transfer.
DMA
read
DMA
write
Transfer
source
Transfer
destination
Bus release
Bus
release
DMA
read
DMA
write
Transfer
source
Transfer
destination
Bus
release
ø
DREQ
Address bus
DMA control
Channel
Read
Idle
[2]
[3]
Read
Idle
Request clear period
Request
Minimum of 2 cycles
[1]
Write
Write
Idle
Request clear period
Request
Minimum of 2 cycles
[4]
[5]
Acceptance resumes
[6]
[7]
Acceptance resumes
Acceptance after transfer enabling; the DREQ pin low level is sampled on the rising
edge of ø, and the request is held.
[2] [5] The request is cleared at the next bus break, and activation is started in the DMAC.
[3] [6] Start of DMA cycle; DREQ pin high level sampling on the rising edge of ø starts.
[4] [7] When the DREQ pin high level has been sampled, acceptance is resumed after the
write cycle is completed.
(As in [1], the DREQ pin low level is sampled on the rising edge of ø, and the request
is held.)
[1]
Note: In write data buffer mode, bus breaks from [2] to [7] may be hidden, and not visible.
Figure 7-23 Example of DREQ Pin Falling Edge Activated Normal Mode Transfer
DREQ pin sampling is performed every cycle, with the rising edge of the next ø cycle after the end of the DMABCR write
cycle for setting the transfer enabled state as the starting point.
When the DREQ pin low level is sampled while acceptance by means of the DREQ pin is possible, the request is held in
the DMAC. Then, when activation is initiated in the DMAC, the request is cleared, and DREQ pin high level sampling
for edge detection is started. If DREQ pin high level sampling has been completed by the time the DMA write cycle ends,
acceptance resumes after the end of the write cycle, DREQ pin low level sampling is performed again, and this operation
is repeated until the transfer ends.
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Figure 7-24 shows an example of DREQ pin falling edge activated block transfer mode transfer.
1 block transfer
1 block transfer
DMA
read
Bus release
DMA
write
DMA Bus
dead release
DMA
read
DMA
write
Transfer
source
Transfer
destination
DMA
dead
Bus
release
ø
DREQ
Transfer
source
Address bus
DMA control
Channel
Read
Idle
Request
[2]
Dead
Write
Request clear period
Minimun of 2 cycles
[1]
Transfer
destination
[3]
Idle Read
Write
Dead
Idle
Request clear period
Request
Minimun of 2 cycles
[4]
[5]
Acceptance resumes
[6]
[7]
Acceptance resumes
Acceptance after transfer enabling; the DREQ pin low level is sampled on the rising edge of ø,
and the request is held.
[2] [5] The request is cleared at the next bus break, and activation is started in the DMAC.
[3] [6] Start of DMA cycle; DREQ pin high level sampling on the rising edge of ø starts.
[4] [7] When the DREQ pin high level has been sampled, acceptance is resumed after the dead cycle
is completed.
(As in [1], the DREQ pin low level is sampled on the rising edge of ø, and the request is held.)
[1]
Note: In write data buffer mode, bus breaks from [2] to [7] may be hidden, and not visible.
Figure 7-24 Example of DREQ Pin Falling Edge Activated Block Transfer Mode Transfer
DREQ pin sampling is performed every cycle, with the rising edge of the next ø cycle after the end of the DMABCR write
cycle for setting the transfer enabled state as the starting point.
When the DREQ pin low level is sampled while acceptance by means of the DREQ pin is possible, the request is held in
the DMAC. Then, when activation is initiated in the DMAC, the request is cleared, and DREQ pin high level sampling
for edge detection is started. If DREQ pin high level sampling has been completed by the time the DMA dead cycle ends,
acceptance resumes after the end of the dead cycle, DREQ pin low level sampling is performed again, and this operation is
repeated until the transfer ends.
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DREQ Level Activation Timing (Normal Mode): Set the DTA bit for the channel for which the DREQ pin is selected to
1.
Figure 7-25 shows an example of DREQ level activated normal mode transfer.
DMA
read
DMA
write
Transfer
source
Transfer
destination
Bus
release
Bus
release
DMA
read
DMA
write
Transfer
source
Transfer
destination
Bus
release
ø
DREQ
Address bus
DMA control
Channel
Read
Idle
Request
[2]
[3]
Read
Idle
Request clear period
Minimum of 2 cycles
[1]
Write
Request
Write
Idle
Request clear period
Minimum of 2 cycles
[4]
[5]
[6]
Acceptance resumes
[7]
Acceptance resumes
Acceptance after transfer enabling; the DREQ pin low level is sampled on the rising
edge of ø, and the request is held.
[2] [5] The request is cleared at the next bus break, and activation is started in the DMAC.
[3] [6] The DMA cycle is started.
[4] [7] Acceptance is resumed after the write cycle is completed.
(As in [1], the DREQ pin low level is sampled on the rising edge of ø, and the request is held.)
[1]
Note: In write data buffer mode, bus breaks from [2] to [7] may be hidden, and not visible.
Figure 7-25 Example of DREQ Level Activated Normal Mode Transfer
DREQ pin sampling is performed every cycle, with the rising edge of the next ø cycle after the end of the DMABCR write
cycle for setting the transfer enabled state as the starting point.
When the DREQ pin low level is sampled while acceptance by means of the DREQ pin is possible, the request is held in
the DMAC. Then, when activation is initiated in the DMAC, the request is cleared. After the end of the write cycle,
acceptance resumes, DREQ pin low level sampling is performed again, and this operation is repeated until the transfer
ends.
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Figure 7-26 shows an example of DREQ level activated block transfer mode transfer.
1 block transfer
DMA
read
Bus release
1 block transfer
DMA
right
DMA Bus
dead release
DMA
read
DMA
right
DMA
dead
Bus
release
ø
DREQ
Transfer
source
Address bus
DMA control
Channel
Read
Idle
[2]
[3]
Transfer
source
Dead
Request clear period
Request
Minimum of 2 cycles
[1]
Write
Transfer
destination
Idle Read
Write
Transfer
destination
Dead
Idle
Request clear period
Request
Minimum of 2 cycles
[4]
[5]
Acceptance resumes
[6]
[7]
Acceptance resumes
Acceptance after transfer enabling; the DREQ pin low level is sampled on the rising
edge of ø, and the request is held.
[2] [5] The request is cleared at the next bus break, and activation is started in the DMAC.
[3] [6] The DMA cycle is started.
[4] [7] Acceptance is resumed after the dead cycle is completed.
(As in [1], the DREQ pin low level is sampled on the rising edge of ø, and the request is held.)
[1]
Note: In write data buffer mode, bus breaks from [2] to [7] may be hidden, and not visible.
Figure 7-26 Example of DREQ Level Activated Block Transfer Mode Transfer
DREQ pin sampling is performed every cycle, with the rising edge of the next ø cycle after the end of the DMABCR write
cycle for setting the transfer enabled state as the starting point.
When the DREQ pin low level is sampled while acceptance by means of the DREQ pin is possible, the request is held in
the DMAC. Then, when activation is initiated in the DMAC, the request is cleared. After the end of the dead cycle,
acceptance resumes, DREQ pin low level sampling is performed again, and this operation is repeated until the transfer
ends.
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7.5.11
DMAC Bus Cycles (Single Address Mode)
Single Address Mode (Read): Figure 7-27 shows a transfer example in which TEND output is enabled and byte-size
single address mode transfer (read) is performed from external 8-bit, 2-state access space to an external device.
DMA read
DMA read
DMA
DMA read dead
DMA read
ø
Address bus
RD
DACK
TEND
Bus
release
Bus
release
Bus
release
Bus Last transfer
release
cycle
Bus
release
Figure 7-27 Example of Single Address Mode (Byte Read) Transfer
Figure 7-28 shows a transfer example in which TEND output is enabled and word-size single address mode transfer (read)
is performed from external 8-bit, 2-state access space to an external device.
DMA read
DMA read
DMA read
DMA
dead
ø
Address bus
RD
DACK
TEND
Bus
release
Bus
release
Bus
release
Last transfer
cycle
Bus
release
Figure 7-28 Example of Single Address Mode (Word Read) Transfer
A one-byte or one-word transfer is performed for one transfer request, and after the transfer the bus is released. While the
bus is released, one or more bus cycles are inserted by the CPU or DTC.
In the transfer end cycle (the cycle in which the transfer counter reaches 0), a one-state DMA dead cycle is inserted after
the DMA write cycle.
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Single Address Mode (Write): Figure 7-29 shows a transfer example in which TEND output is enabled and byte-size
single address mode transfer (write) is performed from an external device to external 8-bit, 2-state access space.
DMA write
DMA write
DMA write
DMA
DMA write dead
ø
Address bus
HWR
LWR
DACK
TEND
Bus
release
Bus
release
Bus
release
Bus Last transfer
release
cycle
Bus
release
Figure 7-29 Example of Single Address Mode (Byte Write) Transfer
Figure 7-30 shows a transfer example in which TEND output is enabled and word-size single address mode transfer
(write) is performed from an external device to external 8-bit, 2-state access space.
DMA write
DMA write
DMA write
DMA
dead
ø
Address bus
HWR
LWR
DACK
TEND
Bus
release
Bus
release
Bus
release
Last transfer
cycle
Bus
release
Figure 7-30 Example of Single Address Mode (Word Write) Transfer
A one-byte or one-word transfer is performed for one transfer request, and after the transfer the bus is released. While the
bus is released one or more bus cycles are inserted by the CPU or DTC.
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In the transfer end cycle (the cycle in which the transfer counter reaches 0), a one-state DMA dead cycle is inserted after
the DMA write cycle.
DREQ Pin Falling Edge Activation Timing: Set the DTA bit for the channel for which the DREQ pin is selected to 1.
Figure 7-31 shows an example of DREQ pin falling edge activated single address mode transfer.
Bus release
DMA single
Bus release
DMA single
Bus release
ø
DREQ
Transfer source/
destination
Address bus
Transfer source/
destination
DACK
DMA control
Idle
Single
Channel
Request
Idle
Request clear
period
Single
[1]
[2]
Request clear
period
Request
Minimum of
2 cycles
Idle
Minimum of
2 cycles
[3]
[4]
[5]
Acceptance resumes
[6]
[7]
Acceptance resumes
Acceptance after transfer enabling; the DREQ pin low level is sampled on the rising
edge of ø, and the request is held.
[2] [5] The request is cleared at the next bus break, and activation is started in the DMAC.
[3] [6] Start of DMA cycle; DREQ pin high level sampling on the rising edge of ø starts.
[4] [7] When the DREQ pin high level has been sampled, acceptance is resumed after the single
cycle is completed.
(As in [1], the DREQ pin low level is sampled on the rising edge of ø, and the request is held.)
[1]
Note: In write data buffer mode, bus breaks from [2] to [7] may be hidden, and not visible.
Figure 7-31 Example of DREQ Pin Falling Edge Activated Single Address Mode Transfer
DREQ pin sampling is performed every cycle, with the rising edge of the next ø cycle after the end of the DMABCR write
cycle for setting the transfer enabled state as the starting point.
When the DREQ pin low level is sampled while acceptance by means of the DREQ pin is possible, the request is held in
the DMAC. Then, when activation is initiated in the DMAC, the request is cleared, and DREQ pin high level sampling
for edge detection is started. If DREQ pin high level sampling has been completed by the time the DMA single cycle
ends, acceptance resumes after the end of the single cycle, DREQ pin low level sampling is performed again, and this
operation is repeated until the transfer ends.
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DREQ Pin Low Level Activation Timing: Set the DTA bit for the channel for which the DREQ pin is selected to 1.
Figure 7-32 shows an example of DREQ pin low level activated single address mode transfer.
Bus release
DMA single
Bus release
Bus
release
DMA single
ø
DREQ
Transfer source/
destination
Address bus
Transfer source/
destination
DACK
DMA control
Channel
Idle
Single
Idle
Request clear
period
Request
Single
[1]
[2]
Request clear
period
Request
Minimum of
2 cycles
Idle
Minimum of
2 cycles
[3]
[4]
[5]
Acceptance resumes
[6]
[7]
Acceptance resumes
Acceptance after transfer enabling; the DREQ pin low level is sampled on the rising
edge of ø, and the request is held.
[2] [5] The request is cleared at the next bus break, and activation is started in the DMAC.
[3] [6] The DMAC cycle is started.
[4] [7] Acceptance is resumed after the single cycle is completed.
(As in [1], the DREQ pin low level is sampled on the rising edge of ø, and the request is held.)
[1]
Note: In write data buffer mode, bus breaks from [2] to [7] may be hidden, and not visible.
Figure 7-32 Example of DREQ Pin Low Level Activated Single Address Mode Transfer
DREQ pin sampling is performed every cycle, with the rising edge of the next ø cycle after the end of the DMABCR write
cycle for setting the transfer enabled state as the starting point.
When the DREQ pin low level is sampled while acceptance by means of the DREQ pin is possible, the request is held in
the DMAC. Then, when activation is initiated in the DMAC, the request is cleared. After the end of the single cycle,
acceptance resumes, DREQ pin low level sampling is performed again, and this operation is repeated until the transfer
ends.
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7.5.12
Write Data Buffer Function
DMAC internal-to-external dual address transfers and single address transfers can be executed at high speed using the
write data buffer function, enabling system throughput to be improved.
When the WDBE bit of BCRL in the bus controller is set to 1, enabling the write data buffer function, dual address
transfer external write cycles or single address transfers and internal accesses (on-chip memory or internal I/O registers)
are executed in parallel. Internal accesses are independent of the bus master, and DMAC dead cycles are regarded as
internal accesses.
A low level can always be output from the TEND pin if the bus cycle in which a low level is to be output is an external
bus cycle. However, a low level is not output from the TEND pin if the bus cycle in which a low level is to be output
from the TEND pin is an internal bus cycle, and an external write cycle is executed in parallel with this cycle.
Figure 7-33 shows an example of burst mode transfer from on-chip RAM to external memory using the write data buffer
function.
DMA
read
DMA
write
DMA
read
DMA
write
DMA
read
DMA
write
DMA
read
DMA
write
DMA
dead
ø
Internal address
Internal read signal
External address
HWR, LWR
TEND
Figure 7-33 Example of Dual Address Transfer Using Write Data Buffer Function
Figure 7-34 shows an example of single address transfer using the write data buffer function. In this example, the CPU
program area is in on-chip memory.
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DMA
read
DMA
single
CPU
read
DMA
single
CPU
read
ø
Internal address
Internal read signal
External address
RD
DACK
Figure 7-34 Example of Single Address Transfer Using Write Data Buffer Function
When the write data buffer function is activated, the DMAC recognizes that the bus cycle concerned has ended, and starts
the next operation. Therefore, DREQ pin sampling is started one state after the start of the DMA write cycle or single
address transfer.
7.5.13
DMAC Multi-Channel Operation
The DMAC channel priority order is: channel 0 > channel 1, and channel A > channel B. Table 7-13 summarizes the
priority order for DMAC channels.
Table 7-13 DMAC Channel Priority Order
Short Address Mode
Full Address Mode
Priority
Channel 0A
Channel 0
High
Channel 0B
Channel 1A
Channel 1B
Channel 1
Low
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If transfer requests are issued simultaneously for more than one channel, or if a transfer request for another channel is
issued during a transfer, when the bus is released the DMAC selects the highest-priority channel from among those issuing
a request according to the priority order shown in table 7-13.
During burst transfer, or when one block is being transferred in block transfer, the channel will not be changed until the
end of the transfer.
Figure 7-35 shows a transfer example in which transfer requests are issued simultaneously for channels 0A, 0B, and 1.
DMA read
DMA write
DMA read
DMA write
DMA read
DMA
DMA write read
ø
Address bus
RD
HWR
LWR
DMA control Idle Read
Channel 0A
Idle
Write
Read
Write
Idle
Read
Write
Read
Request clear
Channel 0B
Request
hold
Selection
Channel 1
Request
hold
Nonselection
Bus
release
Channel 0A
transfer
Request clear
Request
hold
Bus
release
Selection
Channel 0B
transfer
Request clear
Bus
release
Channel 1 transfer
Figure 7-35 Example of Multi-Channel Transfer
7.5.14
Relation between External Bus Requests, Refresh Cycles, the DTC, and the DMAC
There can be no break between a DMA cycle read and a DMA cycle write. This means that a refresh cycle, external bus
release cycle, or DTC cycle is not generated between the external read and external write in a DMA cycle.
In the case of successive read and write cycles, such as in burst transfer or block transfer, a refresh or external bus released
state may be inserted after a write cycle. Since the DTC has a lower priority than the DMAC, the DTC does not operate
until the DMAC releases the bus.
When DMA cycle reads or writes are accesses to on-chip memory or internal I/O registers, these DMA cycles can be
executed at the same time as refresh cycles or external bus release. However, simultaneous operation may not be possible
when a write buffer is used.
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7.5.15
NMI Interrupts and DMAC
When an NMI interrupt is requested, burst mode transfer in full address mode is interrupted. An NMI interrupt does not
affect the operation of the DMAC in other modes.
In full address mode, transfer is enabled for a channel when both the DTE bit and the DTME bit are set to 1. With burst
mode setting, the DTME bit is cleared when an NMI interrupt is requested.
If the DTME bit is cleared during burst mode transfer, the DMAC discontinues transfer on completion of the 1-byte or 1word transfer in progress, then releases the bus, which passes to the CPU.
The channel on which transfer was interrupted can be restarted by setting the DTME bit to 1 again. Figure 7-36 shows the
procedure for continuing transfer when it has been interrupted by an NMI interrupt on a channel designated for burst mode
transfer.
Resumption of
transfer on interrupted
channel
DTE = 1
DTME = 0
[1]
Check that DTE = 1 and
DTME = 0 in DMABCRL
[2]
Write 1 to the DTME bit.
[1]
No
Yes
Set DTME bit to 1
Transfer continues
[2]
Transfer ends
Figure 7-36 Example of Procedure for Continuing Transfer on Channel Interrupted by NMI Interrupt
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7.5.16
Forced Termination of DMAC Operation
If the DTE bit for the channel currently operating is cleared to 0, the DMAC stops on completion of the 1-byte or 1-word
transfer in progress. DMAC operation resumes when the DTE bit is set to 1 again.
In full address mode, the same applies to the DTME bit.
Figure 7-37 shows the procedure for forcibly terminating DMAC operation by software.
[1]
Forced termination
of DMAC
Clear DTE bit to 0
Clear the DTE bit in DMABCRL to 0.
If you want to prevent interrupt generation after
forced termination of DMAC operation, clear the
DTIE bit to 0 at the same time.
[1]
Forced termination
Figure 7-37 Example of Procedure for Forcibly Terminating DMAC Operation
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7.5.17
Clearing Full Address Mode
Figure 7-38 shows the procedure for releasing and initializing a channel designated for full address mode. After full
address mode has been cleared, the channel can be set to another transfer mode using the appropriate setting procedure.
Clearing full
address mode
Stop the channel
[1]
[1] Clear both the DTE bit and the DTME bit in
DMABCRL to 0; or wait until the transfer ends
and the DTE bit is cleared to 0, then clear the
DTME bit to 0.
Also clear the corresponding DTIE bit to 0 at the
same time.
[2] Clear all bits in DMACRA and DMACRB to 0.
[3] Clear the FAE bit in DMABCRH to 0.
Initialize DMACR
[2]
Clear FAE bit to 0
[3]
Initialization;
operation halted
Figure 7-38 Example of Procedure for Clearing Full Address Mode
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7.6
Interrupts
The sources of interrupts generated by the DMAC are transfer end and transfer break. Table 7-14 shows the interrupt
sources and their priority order.
Table 7-14 Interrupt Source Priority Order
Interrupt
Name
Interrupt Source
Interrupt
Priority Order
Short Address Mode
Full Address Mode
DEND0A
Interrupt due to end of
transfer on channel 0A
Interrupt due to end of
transfer on channel 0
DEND0B
Interrupt due to end of
transfer on channel 0B
Interrupt due to break in
transfer on channel 0
DEND1A
Interrupt due to end of
transfer on channel 1A
Interrupt due to end of
transfer on channel 1
DEND1B
Interrupt due to end of
transfer on channel 1B
Interrupt due to break in
transfer on channel 1
High
Low
Enabling or disabling of each interrupt source is set by means of the DTIE bit for the corresponding channel in DMABCR,
and interrupts from each source are sent to the interrupt controller independently.
The relative priority of transfer end interrupts on each channel is decided by the interrupt controller, as shown in table 714.
Figure 7-39 shows a block diagram of a transfer end/transfer break interrupt. An interrupt is always generated when the
DTIE bit is set to 1 while DTE bit is cleared to 0.
DTE/
DTME
Transfer end/transfer
break interrupt
DTIE
Figure 7-39 Block Diagram of Transfer End/Transfer Break Interrupt
In full address mode, a transfer break interrupt is generated when the DTME bit is cleared to o while DTIEB bit is set to 1.
In both short address mode and full address mode, DMABCR should be set so as to prevent the occurrence of a
combination that constitutes a condition for interrupt generation during setting.
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7.7
Usage Notes
DMAC Register Access during Operation: Except for forced termination, the operating (including transfer waiting
state) channel setting should not be changed. The operating channel setting should only be changed when transfer is
disabled.
Also, the DMAC register should not be written to in a DMA transfer.
DMAC register reads during operation (including the transfer waiting state) are described below.
(a) DMAC control starts one cycle before the bus cycle, with output of the internal address. Consequently, MAR is
updated in the bus cycle before DMAC transfer.
Figure 7-40 shows an example of the update timing for DMAC registers in dual address transfer mode.
DMA last transfer cycle
DMA transfer cycle
DMA read
DMA read
DMA write
DMA write
DMA
dead
ø
DMA Internal
address
DMA control
DMA register
operation
Idle
[1]
Transfer
source
Transfer
destination
Read
Write
[2]
Transfer
destination
Transfer
source
Read
Idle
[1]
Write
[2']
Dead
Idle
[3]
[1] Transfer source address register MAR operation (incremented/decremented/fixed)
Transfer counter ETCR operation (decremented)
Block size counter ETCR operation (decremented in block transfer mode)
[2] Transfer destination address register MAR operation (incremented/decremented/fixed)
[2'] Transfer destination address register MAR operation (incremented/decremented/fixed)
Block transfer counter ETCR operation (decremented, in last transfer cycle of a block
in block transfer mode)
[3] Transfer address register MAR restore operation (in block or repeat transfer mode)
Transfer counter ETCR restore (in repeat transfer mode)
Block size counter ETCR restore (in block transfer mode)
Notes: 1. In single address transfer mode, the update timing is the same as [1].
2. The MAR operation is post-incrementing/decrementing of the DMA internal address value.
Figure 7-40 Example of DMAC Register Update Timing
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(b) DMAC registers are read as shown in figure 7-41, when the DMAC transfer cycle occurs immediately after the DMAC
register has been read.
DMA transfer cycle
CPU longword read
MAR upper
word read
MAR lower
word read
DMA read
DMA write
ø
DMA internal
address
DMA control
DMA register
operation
Idle
Transfer
source
Transfer
destination
Read
Write
[1]
Idle
[2]
Note: The lower word of MAR is the updated value after the operation in [1].
Figure 7-41 Competition between Updating of DMAC Register and CPU Read Operations
Module Stop: When the MSTP15 bit in MSTPCR is set to 1, the DMAC clock stops, and the module stop state is entered.
However, 1 cannot be written to the MSTP15 bit if any of the DMAC channels is enabled. This setting should therefore
be made when DMAC operation is stopped.
When the DMAC clock stops, DMAC register accesses can no longer be made. Since the following DMAC register
settings are valid even in the module stop state, they should be invalidated, if necessary, before a module stop.
• Transfer end/suspend interrupt (DTE = 0 and DTIE = 1)
• TEND pin enable (TEE = 1)
• DACK pin enable (FAE = 0 and SAE = 1)
Medium-Speed Mode: When the DTA bit is 0, internal interrupt signals specified as DMAC transfer sources are edgedetected.
In medium-speed mode, the DMAC operates on a medium-speed clock, while on-chip supporting modules operate on a
high-speed clock. Consequently, if the period in which the relevant interrupt source is cleared by the CPU, DTC, or
another DMAC channel, and the next interrupt is generated, is less than one state with respect to the DMAC clock (bus
master clock), edge detection may not be possible and the interrupt may be ignored.
Also, in medium-speed mode, DREQ pin sampling is performed on the rising edge of the medium-speed clock.
Write Data Buffer Function: When the WDBE bit of BCRL in the bus controller is set to 1, enabling the write data
buffer function, dual address transfer external write cycles or single address transfers and internal accesses (on-chip
memory or internal I/O registers) are executed in parallel.
(a) Write Data Buffer Function and DMAC Register Setting
If the setting of is changed during execution of an external access by means of the write data buffer function, the external
access may not be performed normally. The register that controls external accesses should only be manipulated when
external reads, etc., are used with DMAC operation disabled, and the operation is not performed in parallel with external
access.
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(b) Write Data Buffer Function and DMAC Operation Timing
The DMAC can start its next operation during external access using the write data buffer function. Consequently, the
DREQ pin sampling timing, TEND output timing, etc., are different from the case in which the write data buffer function
is disabled. Also, internal bus cycles maybe hidden, and not visible.
(c) Write Data Buffer Function and TEND Output
A low level is not output from the TEND pin if the bus cycle in which a low level is to be output from the TEND pin is an
internal bus cycle, and an external write cycle is executed in parallel with this cycle. Note, for example, that a low level
may not be output from the TEND pin if the write data buffer function is used when data transfer is performed between an
internal I/O register and on-chip memory.
If at least one of the DMAC transfer addresses is an external address, a low level is output from the TEND pin.
Figure 7-42 shows an example in which a low level is not output at the TEND pin.
DMA
read
DMA
write
ø
Internal address
Internal read signal
Internal write signal
External address
HWR, LWR
TEND
Not output
External write by CPU, etc.
Figure 7-42 Example in Which Low Level is Not Output at TEND Pin
Activation by Falling Edge on DREQ Pin: DREQ pin falling edge detection is performed in synchronization with
DMAC internal operations. The operation is as follows:
[1] Activation request wait state: Waits for detection of a low level on the DREQ pin, and switches to [2].
[2] Transfer wait state: Waits for DMAC data transfer to become possible, and switches to [3].
[3] Activation request disabled state: Waits for detection of a high level on the DREQ pin, and switches to [1].
After DMAC transfer is enabled, a transition is made to [1]. Thus, initial activation after transfer is enabled is performed
by detection of a low level.
Activation Source Acceptance: At the start of activation source acceptance, a low level is detected in both DREQ pin
falling edge sensing and low level sensing. Similarly, in the case of an internal interrupt, the interrupt request is detected.
Therefore, a request is accepted from an internal interrupt or DREQ pin low level that occurs before execution of the
DMABCRL write to enable transfer.
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When the DMAC is activated, take any necessary steps to prevent an internal interrupt or DREQ pin low level remaining
from the end of the previous transfer, etc.
Internal Interrupt after End of Transfer: When the DTE bit is cleared to 0 by the end of transfer or an abort, the
selected internal interrupt request will be sent to the CPU or DTC even if DTA is set to 1.
Also, if internal DMAC activation has already been initiated when operation is aborted, the transfer is executed but flag
clearing is not performed for the selected internal interrupt even if DTA is set to 1.
An internal interrupt request following the end of transfer or an abort should be handled by the CPU as necessary.
Channel Re-Setting: To reactivate a number of channels when multiple channels are enabled, use exclusive handling of
transfer end interrupts, and perform DMABCR control bit operations exclusively.
Note, in particular, that in cases where multiple interrupts are generated between reading and writing of DMABCR, and a
DMABCR operation is performed during new interrupt handling, the DMABCR write data in the original interrupt
handling routine will be incorrect, and the write may invalidate the results of the operations by the multiple interrupts.
Ensure that overlapping DMABCR operations are not performed by multiple interrupts, and that there is no separation
between read and write operations by the use of a bit-manipulation instruction.
Also, when the DTE and DTME bits are cleared by the DMAC or are written with 0, they must first be read while cleared
to 0 before the CPU can write 1 to them.
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Section 8 Data Transfer Controller
8.1
Overview
The H8S/2357 Group includes a data transfer controller (DTC). The DTC can be activated by an interrupt or software, to
transfer data.
8.1.1
Features
The features of the DTC are:
• Transfer possible over any number of channels
 Transfer information is stored in memory
 One activation source can trigger a number of data transfers (chain transfer)
• Wide range of transfer modes
 Normal, repeat, and block transfer modes available
 Incrementing, decrementing, and fixing of source and destination addresses can be selected
• Direct specification of 16-Mbyte address space possible
 24-bit transfer source and destination addresses can be specified
• Transfer can be set in byte or word units
• A CPU interrupt can be requested for the interrupt that activated the DTC
 An interrupt request can be issued to the CPU after one data transfer ends
 An interrupt request can be issued to the CPU after the specified data transfers have completely ended
• Activation by software is possible
• Module stop mode can be set
 The initial setting enables DTC registers to be accessed. DTC operation is halted by setting module stop mode.
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8.1.2
Block Diagram
Figure 8-1 shows a block diagram of the DTC.
The DTC’s register information is stored in the on-chip RAM*. A 32-bit bus connects the DTC to the on-chip RAM (1
kbyte), enabling 32-bit/1-state reading and writing of the DTC register information and hence helping to increase
processing speed.
Note: * When the DTC is used, the RAME bit in SYSCR must be set to 1.
Internal address bus
On-chip
RAM
Internal data bus
CPU interrupt
request
Legend:
MRA, MRB:
CRA, CRB:
SAR:
DAR:
DTCERA to DTCERF:
DTVECR:
DTC mode registers A and B
DTC transfer count registers A and B
DTC source address register
DTC destination address register
DTC enable registers A to F
DTC vector register
Figure 8-1 Block Diagram of DTC
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Register information
MRA MRB
CRA
CRB
DAR
SAR
DTC
Control logic
DTC service
request
DTVECR
Interrupt
request
DTCERA
to
DTCERF
Interrupt controller
8.1.3
Register Configuration
Table 8-1 summarizes the DTC registers.
Table 8-1
DTC Registers
Name
Abbreviation
R/W
Initial Value
Address* 1
DTC mode register A
MRA
—* 2
Undefined
—* 3
DTC mode register B
MRB
—* 2
Undefined
—* 3
DTC source address register
SAR
—* 2
Undefined
—* 3
DTC destination address register
DAR
—* 2
Undefined
—* 3
DTC transfer count register A
CRA
—* 2
Undefined
—* 3
DTC transfer count register B
CRB
—* 2
Undefined
—* 3
DTC enable registers
DTCER
R/W
H'00
H'FF30 to H'FF35
DTC vector register
DTVECR
R/W
H'00
H'FF37
Module stop control register
MSTPCR
R/W
H'3FFF
H'FF3C
Notes: 1. Lower 16 bits of the address.
2. Registers within the DTC cannot be read or written to directly.
3. Register information is located in on-chip RAM addresses H'F800 to H'FBFF. It cannot be located in external
space. When the DTC is used, do not clear the RAME bit in SYSCR to 0.
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8.2
Register Descriptions
8.2.1
DTC Mode Register A (MRA)
Bit
:
Initial value :
R/W
:
7
6
5
4
3
2
1
0
SM1
SM0
DM1
DM0
MD1
MD0
DTS
Sz
Undefined
Undefined
Undefined
Undefined
Undefined
Undefined
Undefined
Undefined
—
—
—
—
—
—
—
—
MRA is an 8-bit register that controls the DTC operating mode.
Bits 7 and 6—Source Address Mode 1 and 0 (SM1, SM0): These bits specify whether SAR is to be incremented,
decremented, or left fixed after a data transfer.
Bit 7
SM1
Bit 6
SM0
Description
0
—
SAR is fixed
1
0
SAR is incremented after a transfer
(by +1 when Sz = 0; by +2 when Sz = 1)
1
SAR is decremented after a transfer
(by –1 when Sz = 0; by –2 when Sz = 1)
Bits 5 and 4—Destination Address Mode 1 and 0 (DM1, DM0): These bits specify whether DAR is to be incremented,
decremented, or left fixed after a data transfer.
Bit 5
DM1
Bit 4
DM0
Description
0
—
DAR is fixed
1
0
DAR is incremented after a transfer
(by +1 when Sz = 0; by +2 when Sz = 1)
1
DAR is decremented after a transfer
(by –1 when Sz = 0; by –2 when Sz = 1)
Bits 3 and 2—DTC Mode (MD1, MD0): These bits specify the DTC transfer mode.
Bit 3
MD1
Bit 2
MD0
Description
0
0
Normal mode
1
Repeat mode
0
Block transfer mode
1
—
1
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Bit 1—DTC Transfer Mode Select (DTS): Specifies whether the source side or the destination side is set to be a repeat
area or block area, in repeat mode or block transfer mode.
Bit 1
DTS
Description
0
Destination side is repeat area or block area
1
Source side is repeat area or block area
Bit 0—DTC Data Transfer Size (Sz): Specifies the size of data to be transferred.
8.2.2
Bit 0
Sz
Description
0
Byte-size transfer
1
Word-size transfer
DTC Mode Register B (MRB)
Bit
:
7
6
5
4
3
2
1
0
CHNE
DISEL
—
—
—
—
—
—
Undefined
Undefined
Undefined
Undefined
Undefined
Undefined
Undefined
Undefined
—
—
—
—
—
—
—
—
Initial value :
R/W
:
MRB is an 8-bit register that controls the DTC operating mode.
Bit 7—DTC Chain Transfer Enable (CHNE): Specifies chain transfer. With chain transfer, a number of data transfers
can be performed consecutively in response to a single transfer request.
In data transfer with CHNE set to 1, determination of the end of the specified number of transfers, clearing of the interrupt
source flag, and clearing of DTCER is not performed.
Bit 7
CHNE
Description
0
End of DTC data transfer (activation waiting state is entered)
1
DTC chain transfer (new register information is read, then data is transferred)
Bit 6—DTC Interrupt Select (DISEL): Specifies whether interrupt requests to the CPU are disabled or enabled after a
data transfer.
Bit 6
DISEL
Description
0
After a data transfer ends, the CPU interrupt is disabled unless the transfer counter is
0 (the DTC clears the interrupt source flag of the activating interrupt to 0)
1
After a data transfer ends, the CPU interrupt is enabled (the DTC does not clear the
interrupt source flag of the activating interrupt to 0)
Bits 5 to 0—Reserved: These bits have no effect on DTC operation in the H8S/2357 Group, and should always be written
with 0.
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8.2.3
Bit
DTC Source Address Register (SAR)
:
23
22
21
20
19
–––
4
3
2
1
0
–––
Initial value :
R/W
:
–––
Unde- Unde- Unde- Unde- Undefined fined fined fined fined
—
—
—
—
—
Unde- Unde- Unde- Unde- Undefined fined fined fined fined
–––
—
—
—
—
—
SAR is a 24-bit register that designates the source address of data to be transferred by the DTC. For word-size transfer,
specify an even source address.
8.2.4
Bit
DTC Destination Address Register (DAR)
:
23
22
21
20
19
–––
4
3
2
1
0
–––
Initial value :
R/W
:
–––
Unde- Unde- Unde- Unde- Undefined fined fined fined fined
—
—
—
—
—
Unde- Unde- Unde- Unde- Undefined fined fined fined fined
–––
—
—
—
—
—
DAR is a 24-bit register that designates the destination address of data to be transferred by the DTC. For word-size
transfer, specify an even destination address.
8.2.5
Bit
DTC Transfer Count Register A (CRA)
:
Initial value :
R/W
:
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Undefined fined fined fined fined fined fined fined fined fined fined fined fined fined fined fined
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
← CRAH → ← CRAL →
CRA is a 16-bit register that designates the number of times data is to be transferred by the DTC.
In normal mode, the entire CRA functions as a 16-bit transfer counter (1 to 65,536). It is decremented by 1 every time
data is transferred, and transfer ends when the count reaches H'0000.
In repeat mode or block transfer mode, the CRA is divided into two parts: the upper 8 bits (CRAH) and the lower 8 bits
(CRAL). CRAH holds the number of transfers while CRAL functions as an 8-bit transfer counter (1 to 256). CRAL is
decremented by 1 every time data is transferred, and the contents of CRAH are sent when the count reaches H'00. This
operation is repeated.
8.2.6
Bit
DTC Transfer Count Register B (CRB)
:
Initial value :
R/W
:
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Undefined fined fined fined fined fined fined fined fined fined fined fined fined fined fined fined
—
—
—
—
—
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—
—
—
—
—
—
—
—
—
—
—
CRB is a 16-bit register that designates the number of times data is to be transferred by the DTC in block transfer mode. It
functions as a 16-bit transfer counter (1 to 65,536) that is decremented by 1 every time data is transferred, and transfer
ends when the count reaches H'0000.
8.2.7
DTC Enable Registers (DTCER)
Bit
:
7
6
5
4
3
2
1
0
DTCE7
DTCE6
DTCE5
DTCE4
DTCE3
DTCE2
DTCE1
DTCE0
0
0
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Initial value :
R/W
:
The DTC enable registers comprise six 8-bit readable/writable registers, DTCERA to DTCERF, with bits corresponding to
the interrupt sources that can activate the DTC. These bits enable or disable DTC service for the corresponding interrupt
sources.
The DTC enable registers are initialized to H'00 by a reset and in hardware standby mode.
Bit n—DTC Activation Enable (DTCEn)
Bit n
DTCEn
Description
0
DTC activation by this interrupt is disabled
(Initial value)
[Clearing conditions]
1
•
When the DISEL bit is 1 and the data transfer has ended
•
When the specified number of transfers have ended
DTC activation by this interrupt is enabled
[Holding condition]
When the DISEL bit is 0 and the specified number of transfers have not ended
(n = 7 to 0)
A DTCE bit can be set for each interrupt source that can activate the DTC. The correspondence between interrupt sources
and DTCE bits is shown in table 8-4, together with the vector number generated for each interrupt controller.
For DTCE bit setting, read/write operations must be performed using bit-manipulation instructions such as BSET and
BCLR. For the initial setting only, however, when multiple activation sources are set at one time, it is possible to disable
interrupts and write after executing a dummy read on the relevant register.
8.2.8
Bit
DTC Vector Register (DTVECR)
:
7
6
5
4
3
2
1
0
SWDTE DTVEC6 DTVEC5 DTVEC4 DTVEC3 DTVEC2 DTVEC1 DTVEC0
Initial value :
R/W
:
0
0
0
0
0
0
0
0
R/(W)*
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Note: * A value of 1 can always be written to the SWDTE bit, but 0 can only be written after 1 is read.
DTVECR is an 8-bit readable/writable register that enables or disables DTC activation by software, and sets a vector
number for the software activation interrupt.
DTVECR is initialized to H'00 by a reset and in hardware standby mode.
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Bit 7—DTC Software Activation Enable (SWDTE): Enables or disables DTC activation by software.
When clearing the SWDTE bit to 0 by software, write 0 to SWDTE after reading SWDTE set to 1.
Bit 7
SWDTE
Description
0
DTC software activation is disabled
(Initial value)
[Clearing condition]
When the DISEL bit is 0 and the specified number of transfers have not ended
1
DTC software activation is enabled
[Holding conditions]
•
When the DISEL bit is 1 and data transfer has ended
•
When the specified number of transfers have ended
•
During data transfer due to software activation
Bits 6 to 0—DTC Software Activation Vectors 6 to 0 (DTVEC6 to DTVEC0): These bits specify a vector number for
DTC software activation.
The vector address is expressed as H'0400 + ((vector number) << 1). <<1 indicates a one-bit left-shift. For example,
when DTVEC6 to DTVEC0 = H'10, the vector address is H'0420.
8.2.9
Module Stop Control Register (MSTPCR)
MSTPCRH
Bit
MSTPCRL
:
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Initial value :
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
R/W
: R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
MSTPCR is a 16-bit readable/writable register that performs module stop mode control.
When the MSTP14 bit in MSTPCR is set to 1, the DTC operation stops at the end of the bus cycle and a transition is made
to module stop mode. However, 1 cannot be written in the MSTP14 bit while the DTC is operating. For details, see section
21.5, Module Stop Mode.
MSTPCR is initialized to H'3FFF by a reset and in hardware standby mode. It is not initialized in software standby mode.
Bit 14—Module Stop (MSTP14): Specifies the DTC module stop mode.
Bit 14
MSTP14
Description
0
DTC module stop mode cleared
1
DTC module stop mode set
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(Initial value)
8.3
Operation
8.3.1
Overview
When activated, the DTC reads register information that is already stored in memory and transfers data on the basis of that
register information. After the data transfer, it writes updated register information back to memory. Pre-storage of
register information in memory makes it possible to transfer data over any required number of channels. Setting the
CHNE bit to 1 makes it possible to perform a number of transfers with a single activation.
Figure 8-2 shows a flowchart of DTC operation.
Start
Read DTC vector
Next transfer
Read register information
Data transfer
Write register information
CHNE=1
Yes
No
Transfer Counter= 0
or DISEL= 1
Yes
No
Clear an activation flag
Clear DTCER
End
Interrupt exception
handling
Figure 8-2 Flowchart of DTC Operation
The DTC transfer mode can be normal mode, repeat mode, or block transfer mode.
The 24-bit SAR designates the DTC transfer source address and the 24-bit DAR designates the transfer destination
address. After each transfer, SAR and DAR are independently incremented, decremented, or left fixed.
Table 8-2 outlines the functions of the DTC.
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Table 8-2
DTC Functions
Address Registers
Transfer Mode
Transfer Transfer
Activation Source Source Destination
•
Normal mode
•
IRQ
 One transfer request transfers one byte or one
word
•
TPU TGI
•
8-bit timer CMI
 Memory addresses are incremented or
decremented by 1 or 2
•
SCI TXI or RXI
•
A/D converter
ADI
Repeat mode
•
DMAC DEND
 One transfer request transfers one byte or one
word
•
Software
 Up to 65,536 transfers possible
•
 Memory addresses are incremented or
decremented by 1 or 2
 After the specified number of transfers (1 to 256),
the initial state resumes and operation continues
•
Block transfer mode
 One transfer request transfers a block of the
specified size
 Block size is from 1 to 256 bytes or words
 Up to 65,536 transfers possible
 A block area can be designated at either the
source or destination
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24 bits
24 bits
8.3.2
Activation Sources
The DTC operates when activated by an interrupt or by a write to DTVECR by software. An interrupt request can be
directed to the CPU or DTC, as designated by the corresponding DTCER bit. An interrupt becomes a DTC activation
source when the corresponding bit is set to 1, and a CPU interrupt source when the bit is cleared to 0.
At the end of a data transfer (or the last consecutive transfer in the case of chain transfer), the activation source or
corresponding DTCER bit is cleared. Table 8-3 shows activation source and DTCER clearance. The activation source flag,
in the case of RXI0, for example, is the RDRF flag of SCI0.
Table 8-3
Activation Source and DTCER Clearance
When the DISEL Bit Is 0 and
the Specified Number of
Activation Source Transfers Have Not Ended
When the DISEL Bit Is 1, or when
the Specified Number of Transfers
Have Ended
Software activation The SWDTE bit is cleared to 0
The SWDTE bit remains set to 1
An interrupt is issued to the CPU
Interrupt activation
The corresponding DTCER bit
remains set to 1
The activation source flag is
cleared to 0
The corresponding DTCER bit is cleared
to 0
The activation source flag remains set to 1
A request is issued to the CPU for the
activation source interrupt
Figure 8-3 shows a block diagram of activation source control. For details see section 5, Interrupt Controller.
Source flag cleared
Clear
controller
Clear
DTCER
Clear request
On-chip
supporting
module
IRQ interrupt
DTVECR
Interrupt
request
Selection circuit
Select
DTC
Interrupt controller
CPU
Interrupt mask
Figure 8-3 Block Diagram of DTC Activation Source Control
When an interrupt has been designated a DTC activation source, existing CPU mask level and interrupt controller
priorities have no effect. If there is more than one activation source at the same time, the DTC operates in accordance with
the default priorities.
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8.3.3
DTC Vector Table
Figure 8-4 shows the correspondence between DTC vector addresses and register information.
Table 8-4 shows the correspondence between activation, vector addresses, and DTCER bits. When the DTC is activated
by software, the vector address is obtained from: H'0400 + (DTVECR[6:0] << 1) (where << 1 indicates a 1-bit left shift).
For example, if DTVECR is H'10, the vector address is H'0420.
The DTC reads the start address of the register information from the vector address set for each activation source, and then
reads the register information from that start address. The register information can be placed at predetermined addresses
in the on-chip RAM. The start address of the register information should be an integral multiple of four.
The configuration of the vector address is the same in both normal and advanced modes, a 2-byte unit being used in both
cases. These two bytes specify the lower bits of the address in the on-chip RAM.
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Table 8-4
Interrupt Sources, DTC Vector Addresses, and Corresponding DTCEs
Interrupt Source
Origin of
Interrupt
Source
Vector
Number
Vector
Address
Write to DTVECR
Software
DTVECR
IRQ0
External pin
DTCE*
Priority
H'0400+
(DTVECR
[6:0]<<1)
—
High
16
H'0420
DTCEA7
IRQ1
17
H'0422
DTCEA6
IRQ2
18
H'0424
DTCEA5
IRQ3
19
H'0426
DTCEA4
IRQ4
20
H'0428
DTCEA3
IRQ5
21
H'042A
DTCEA2
IRQ6
22
H'042C
DTCEA1
IRQ7
23
H'042E
DTCEA0
ADI (A/D conversion end)
A/D
28
H'0438
DTCEB6
TGI0A (GR0A compare match/
input capture)
TPU
channel 0
32
H'0440
DTCEB5
TGI0B (GR0B compare match/
input capture)
33
H'0442
DTCEB4
TGI0C (GR0C compare match/
input capture)
34
H'0444
DTCEB3
TGI0D (GR0D compare match/
input capture)
35
H'0446
DTCEB2
40
H'0450
DTCEB1
41
H'0452
DTCEB0
44
H'0458
DTCEC7
45
H'045A
DTCEC6
48
H'0460
DTCEC5
TGI3B (GR3B compare match/
input capture)
49
H'0462
DTCEC4
TGI3C (GR3C compare match/
input capture)
50
H'0464
DTCEC3
TGI3D (GR3D compare match/
input capture)
51
H'0466
DTCEC2
56
H'0470
DTCEC1
57
H'0472
DTCEC0
60
H'0478
DTCED5
TGI1A (GR1A compare match/
input capture)
TPU
channel 1
TGI1B (GR1B compare match/
input capture)
TGI2A (GR2A compare match/
input capture)
TPU
channel 2
TGI2B (GR2B compare match/
input capture)
TGI3A (GR3A compare match/
input capture)
TGI4A (GR4A compare match/
input capture)
TPU
channel 3
TPU
channel 4
TGI4B (GR4B compare match/
input capture)
TGI5A (GR5A compare match/
input capture)
TPU
channel 5
Low
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Interrupt Source
Origin of
Interrupt
Source
TGI5B (GR5B compare match/
input capture)
CMIA0
Vector
Number
Vector
Address
DTCE*
Priority
TPU
channel 5
61
H'047A
DTCED4
High
8-bit timer
channel 0
64
H'0480
DTCED3
65
H'0482
DTCED2
68
H'0488
DTCED1
69
H'048A
DTCED0
DMTEND0A (DMAC transfer end 0) DMAC
72
H'0490
DTCEE7
DMTEND0B (DMAC transfer end 1)
73
H'0492
DTCEE6
DMTEND1A (DMAC transfer end 2)
74
H'0494
DTCEE5
DMTEND1B (DMAC transfer end 3)
75
H'0496
DTCEE4
81
H'04A2
DTCEE3
82
H'04A4
DTCEE2
85
H'04AA
DTCEE1
86
H'04AC
DTCEE0
89
H'04B2
DTCEF7
90
H'04B4
DTCEF6
CMIB0
CMIA1
CMIB1
RXI0 (reception data full 0)
TXI0 (transmit data empty 0)
RXI1 (reception data full 1)
TXI1 (transmit data empty 1)
RXI2 (reception data full 2)
TXI2 (transmit data empty 2)
8-bit timer
channel 1
SCI
channel 0
SCI
channel 1
SCI
channel 2
Note: * DTCE bits with no corresponding interrupt are reserved, and should be written with 0.
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Low
DTC vector
address
Register information
start address
Register information
Chain transfer
Figure 8-4 Correspondence between DTC Vector Address and Register Information
8.3.4
Location of Register Information in Address Space
Figure 8-5 shows how the register information should be located in the address space.
Locate the MRA, SAR, MRB, DAR, CRA, and CRB registers, in that order, from the start address of the register
information (contents of the vector address). In the case of chain transfer, register information should be located in
consecutive areas.
Locate the register information in the on-chip RAM (addresses: H'FFF800 to H'FFFBFF).
Lower address
Register
information
start address
Chain
transfer
0
1
2
3
MRA
SAR
MRB
DAR
CRA
Register information
CRB
MRA
SAR
MRB
DAR
CRA
Register information
for 2nd transfer in
chain transfer
CRB
4 bytes
Figure 8-5 Location of Register Information in Address Space
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8.3.5
Normal Mode
In normal mode, one operation transfers one byte or one word of data.
From 1 to 65,536 transfers can be specified. Once the specified number of transfers have ended, a CPU interrupt can be
requested.
Table 8-5 lists the register information in normal mode and figure 8-6 shows memory mapping in normal mode.
Table 8-5
Register Information in Normal Mode
Name
Abbreviation
Function
DTC source address register
SAR
Designates source address
DTC destination address register
DAR
Designates destination address
DTC transfer count register A
CRA
Designates transfer count
DTC transfer count register B
CRB
Not used
SAR
DAR
Transfer
Figure 8-6 Memory Mapping in Normal Mode
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8.3.6
Repeat Mode
In repeat mode, one operation transfers one byte or one word of data.
From 1 to 256 transfers can be specified. Once the specified number of transfers have ended, the initial state of the
transfer counter and the address register specified as the repeat area is restored, and transfer is repeated. In repeat mode the
transfer counter value does not reach H'00, and therefore CPU interrupts cannot be requested when DISEL = 0.
Table 8-6 lists the register information in repeat mode and figure 8-7 shows memory mapping in repeat mode.
Table 8-6
Register Information in Repeat Mode
Name
Abbreviation
Function
DTC source address register
SAR
Designates source address
DTC destination address register
DAR
Designates destination address
DTC transfer count register AH
CRAH
Holds number of transfers
DTC transfer count register AL
CRAL
Designates transfer count
DTC transfer count register B
CRB
Not used
SAR or
DAR
DAR or
SAR
Repeat area
Transfer
Figure 8-7 Memory Mapping in Repeat Mode
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8.3.7
Block Transfer Mode
In block transfer mode, one operation transfers one block of data.
The block size is 1 to 256. When the transfer of one block ends, the initial state of the block size counter and the address
register specified as the block area is restored. The other address register is then incremented, decremented, or left fixed.
From 1 to 65,536 transfers can be specified. Once the specified number of transfers have ended, a CPU interrupt is
requested.
Table 8-7 lists the register information in block transfer mode and figure 8-8 shows memory mapping in block transfer
mode.
Table 8-7
Register Information in Block Transfer Mode
Name
Abbreviation
Function
DTC source address register
SAR
Designates transfer source address
DTC destination address register
DAR
Designates destination address
DTC transfer count register AH
CRAH
Holds block size
DTC transfer count register AL
CRAL
Designates block size count
DTC transfer count register B
CRB
Transfer count
First block
·
·
·
SAR or
DAR
Block area
Transfer
Nth block
Figure 8-8 Memory Mapping in Block Transfer Mode
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DAR or
SAR
8.3.8
Chain Transfer
Setting the CHNE bit to 1 enables a number of data transfers to be performed consectutively in response to a single
transfer request. SAR, DAR, CRA, CRB, MRA, and MRB, which define data transfers, can be set independently.
Figure 8-9 shows the memory map for chain transfer.
Source
Destination
Register information
CHNE = 1
DTC vector
address
Register information
start address
Register information
CHNE = 0
Source
Destination
Figure 8-9 Chain Transfer Memory Map
In the case of transfer with CHNE set to 1, an interrupt request to the CPU is not generated at the end of the specified
number of transfers or by setting of the DISEL bit to 1, and the interrupt source flag for the activation source is not
affected.
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8.3.9
Operation Timing
Figures 8-10 to 8-12 show an example of DTC operation timing.
ø
DTC activation
request
DTC
request
Data transfer
Vector read
Address
Read Write
Transfer
information read
Transfer
information write
Figure 8-10 DTC Operation Timing (Example in Normal Mode or Repeat Mode)
ø
DTC activation
request
DTC request
Data transfer
Vector read
Address
Read Write Read Write
Transfer
information read
Transfer
information write
Figure 8-11 DTC Operation Timing (Example of Block Transfer Mode,
with Block Size of 2)
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ø
DTC activation
request
DTC
request
Data transfer
Data transfer
Read Write
Read Write
Vector read
Address
Transfer
information
read
Transfer
Transfer
information information
write
read
Transfer
information
write
Figure 8-12 DTC Operation Timing (Example of Chain Transfer)
8.3.10
Number of DTC Execution States
Table 8-8 lists execution statuses for a single DTC data transfer, and table 8-9 shows the number of states required for
each execution status.
Table 8-8
DTC Execution Statuses
Mode
Vector Read
I
Register Information
Read/Write
Data Read
J
K
Data Write
L
Internal
Operations
M
Normal
1
6
1
1
3
Repeat
1
6
1
1
3
Block transfer
1
6
N
N
3
N: Block size (initial setting of CRAH and CRAL)
Table 8-9
Number of States Required for Each Execution Status
Object to be Accessed
OnChip
RAM
OnChip
ROM
On-Chip I/O
Registers
External Devices
Bus width
32
16
8
16
8
Access states
1
1
2
2
2
3
Execution
status
16
2
3
Vector read
SI
—
1
—
—
4
6+2m 2
3+m
Register
information
read/write
SJ
1
—
—
—
—
—
—
—
Byte data read
SK
1
1
2
2
2
3+m
2
3+m
Word data read
SK
1
1
4
2
4
6+2m 2
3+m
Byte data write
SL
1
1
2
2
2
3+m
2
3+m
Word data write
SL
1
1
4
2
4
6+2m 2
3+m
Internal operation SM
1
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The number of execution states is calculated from the formula below. Note that Σ means the sum of all transfers activated
by one activation event (the number in which the CHNE bit is set to 1, plus 1).
Number of execution states = I · SI + Σ (J · SJ + K · SK + L · SL ) + M · SM
For example, when the DTC vector address table is located in on-chip ROM, normal mode is set, and data is transferred
from the on-chip ROM to an internal I/O register, the time required for the DTC operation is 13 states. The time from
activation to the end of the data write is 10 states.
8.3.11
Procedures for Using DTC
Activation by Interrupt: The procedure for using the DTC with interrupt activation is as follows:
[1] Set the MRA, MRB, SAR, DAR, CRA, and CRB register information in the on-chip RAM.
[2] Set the start address of the register information in the DTC vector address.
[3] Set the corresponding bit in DTCER to 1.
[4] Set the enable bits for the interrupt sources to be used as the activation sources to 1. The DTC is activated when an
interrupt used as an activation source is generated.
[5] After the end of one data transfer, or after the specified number of data transfers have ended, the DTCE bit is cleared
to 0 and a CPU interrupt is requested. If the DTC is to continue transferring data, set the DTCE bit to 1.
Activation by Software: The procedure for using the DTC with software activation is as follows:
[1] Set the MRA, MRB, SAR, DAR, CRA, and CRB register information in the on-chip RAM.
[2] Set the start address of the register information in the DTC vector address.
[3] Check that the SWDTE bit is 0.
[4] Write 1 to SWDTE bit and the vector number to DTVECR.
[5] Check the vector number written to DTVECR.
[6] After the end of one data transfer, if the DISEL bit is 0 and a CPU interrupt is not requested, the SWDTE bit is
cleared to 0. If the DTC is to continue transferring data, set the SWDTE bit to 1. When the DISEL bit is 1, or after the
specified number of data transfers have ended, the SWDTE bit is held at 1 and a CPU interrupt is requested.
8.3.12
Examples of Use of the D7TC
(1) Normal Mode
An example is shown in which the DTC is used to receive 128 bytes of data via the SCI.
[1] Set MRA to fixed source address (SM1 = SM0 = 0), incrementing destination address (DM1 = 1, DM0 = 0), normal
mode (MD1 = MD0 = 0), and byte size (Sz = 0). The DTS bit can have any value. Set MRB for one data transfer by
one interrupt (CHNE = 0, DISEL = 0). Set the SCI RDR address in SAR, the start address of the RAM area where the
data will be received in DAR, and 128 (H'0080) in CRA. CRB can be set to any value.
[2] Set the start address of the register information at the DTC vector address.
[3] Set the corresponding bit in DTCER to 1.
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[4] Set the SCI to the appropriate receive mode. Set the RIE bit in SCR to 1 to enable the reception data full (RXI)
interrupt. Since the generation of a receive error during the SCI reception operation will disable subsequent reception,
the CPU should be enabled to accept receive error interrupts.
[5] Each time reception of one byte of data ends on the SCI, the RDRF flag in SSR is set to 1, an RXI interrupt is
generated, and the DTC is activated. The receive data is transferred from RDR to RAM by the DTC. DAR is
incremented and CRA is decremented. The RDRF flag is automatically cleared to 0.
[6] When CRA becomes 0 after the 128 data transfers have ended, the RDRF flag is held at 1, the DTCE bit is cleared to
0, and an RXI interrupt request is sent to the CPU. The interrupt handling routine should perform wrap-up
processing.
(2) Chain Transfer
An example of DTC chain transfer is shown in which pulse output is performed using the PPG. Chain transfer can be used
to perform pulse output data transfer and PPG output trigger cycle updating. Repeat mode transfer to the PPG’s NDR is
performed in the first half of the chain transfer, and normal mode transfer to the TPU’s TGR in the second half. This is
because clearing of the activation source and interrupt generation at the end of the specified number of transfers are
restricted to the second half of the chain transfer (transfer when CHNE = 0).
[1] Perform settings for transfer to the PPG’s NDR. Set MRA to source address incrementing (SM1 = 1, SM0 = 0), fixed
destination address (DM1 = DM0 = 0), repeat mode (MD1 = 0, MD0 = 1), and word size (Sz = 1). Set the source side
as a repeat area (DTS = 1). Set MRB to chain mode (CHNE = 1, DISEL = 0). Set the data table start address in SAR,
the NDRH address in DAR, and the data table size in CRAH and CRAL. CRB can be set to any value.
[2] Perform settings for transfer to the TPU’s TGR. Set MRA to source address incrementing (SM1 = 1, SM0 = 0), fixed
destination address (DM1 = DM0 = 0), normal mode (MD1 = MD0 = 0), and word size (Sz = 1). Set the data table
start address in SAR, the TGRA address in DAR, and the data table size in CRA. CRB can be set to any value.
[3] Locate the TPU transfer register information consecutively after the NDR transfer register information.
[4] Set the start address of the NDR transfer register information to the DTC vector address.
[5] Set the bit corresponding to TGIA in DTCER to 1.
[6] Set TGRA as an output compare register (output disabled) with TIOR, and enable the TGIA interrupt with TIER.
[7] Set the initial output value in PODR, and the next output value in NDR. Set bits in DDR and NDER for which output
is to be performed to 1. Using PCR, select the TPU compare match to be used as the output trigger.
[8] Set the CST bit in TSTR to 1, and start the TCNT count operation.
[9] Each time a TGRA compare match occurs, the next output value is transferred to NDR and the set value of the next
output trigger period is transferred to TGRA. The activation source TGFA flag is cleared.
[10] When the specified number of transfers are completed (the TPU transfer CRA value is 0), the TGFA flag is held at 1,
the DTCE bit is cleared to 0, and a TGIA interrupt request is sent to the CPU. Termination processing should be
performed in the interrupt handling routine.
(3) Software Activation
An example is shown in which the DTC is used to transfer a block of 128 bytes of data by means of software activation.
The transfer source address is H'1000 and the destination address is H'2000. The vector number is H'60, so the vector
address is H'04C0.
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[1] Set MRA to incrementing source address (SM1 = 1, SM0 = 0), incrementing destination address (DM1 = 1, DM0 =
0), block transfer mode (MD1 = 1, MD0 = 0), and byte size (Sz = 0). The DTS bit can have any value. Set MRB for
one block transfer by one interrupt (CHNE = 0). Set the transfer source address (H'1000) in SAR, the destination
address (H'2000) in DAR, and 128 (H'8080) in CRA. Set 1 (H'0001) in CRB.
[2] Set the start address of the register information at the DTC vector address (H'04C0).
[3] Check that the SWDTE bit in DTVECR is 0. Check that there is currently no transfer activated by software.
[4] Write 1 to the SWDTE bit and the vector number (H'60) to DTVECR. The write data is H'E0.
[5] Read DTVECR again and check that it is set to the vector number (H'60). If it is not, this indicates that the write
failed. This is presumably because an interrupt occurred between steps 3 and 4 and led to a different software
activation. To activate this transfer, go back to step 3.
[6] If the write was successful, the DTC is activated and a block of 128 bytes of data is transferred.
[7] After the transfer, an SWDTEND interrupt occurs. The interrupt handling routine should clear the SWDTE bit to 0
and perform other wrap-up processing.
8.4
Interrupts
An interrupt request is issued to the CPU when the DTC finishes the specified number of data transfers, or a data transfer
for which the DISEL bit was set to 1. In the case of interrupt activation, the interrupt set as the activation source is
generated. These interrupts to the CPU are subject to CPU mask level and interrupt controller priority level control.
In the case of activation by software, a software activated data transfer end interrupt (SWDTEND) is generated.
When the DISEL bit is 1 and one data transfer has ended, or the specified number of transfers have ended, after data
transfer ends, the SWDTE bit is held at 1 and an SWDTEND interrupt is generated. The interrupt handling routine should
clear the SWDTE bit to 0.
When the DTC is activated by software, an SWDTEND interrupt is not generated during a data transfer wait or during
data transfer even if the SWDTE bit is set to 1.
8.5
Usage Notes
Module Stop: When the MSTP14 bit in MSTPCR is set to 1, the DTC clock stops, and the DTC enters the module stop
state. However, 1 cannot be written in the MSTP14 bit while the DTC is operating.
On-Chip RAM: The MRA, MRB, SAR, DAR, CRA, and CRB registers are all located in on-chip RAM. When the DTC
is used, the RAME bit in SYSCR must not be cleared to 0.
DMAC Transfer End Interrupt: When DTC transfer is activated by a DMAC transfer end interrupt, regardless of the
transfer counter and DISEL bit, the DMAC’s DTE bit is not subject to DTC control, and the write data has priority.
Consequently, an interrupt request may not be sent to the CPU when the DTC transfer counter reaches 0.
DTCE Bit Setting: For DTCE bit setting, read/write operations must be performed using bit-manipulation instructions
such as BSET and BCLR. For the initial setting only, however, when multiple activation sources are set at one time, it is
possible to disable interrupts and write after executing a dummy read on the relevant register.
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Section 9 I/O Ports
9.1
Overview
The H8S/2357 Group has 12 I/O ports (ports 1, 2, 3, 5, 6, and A to G), and one input-only port (port 4).
Table 9-1 summarizes the port functions. The pins of each port also have other functions.
Each port includes a data direction register (DDR) that controls input/output (not provided for the input-only port), a data
register (DR) that stores output data, and a port register (PORT) used to read the pin states.
Ports A to E have a on-chip pull-up MOS function, and in addition to DR and DDR, have a MOS input pull-up control
register (PCR) to control the on/off state of MOS input pull-up.
Port 3 and port A include an open-drain control register (ODR) that controls the on/off state of the output buffer PMOS.
Ports 1, and A to F can drive a single TTL load and 90 pF capacitive load, and ports 2, 3, 5, 6, and G can drive a single
TTL load and 30 pF capacitive load. All the I/O ports can drive a Darlington transistor when in output mode. Ports 1, A,
B, and C can drive an LED (10 mA sink current).
Port 2, and pins 64 to 67 and A 4 to A7, are Schmitt-triggered inputs.
For block diagrams of the ports see Appendix C, I/O Port Block Diagrams.
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Table 9-1
Port Functions
Port Description
Port 1 • 8-bit I/O
port
Pins
Mode 4*3
Mode 5*3
Mode 6
Mode 7
P17/PO15/TIOCB2/TCLKD 8-bit I/O port also functioning as DMA controller output pins
(DACK0 and DACK1), TPU I/O pins (TCLKA, TCLKB,
P16/PO14/TIOCA2
TCLKC, TCLKD, TIOCA0, TIOCB0, TIOCC0, TIOCD0,
P15/PO13/TIOCB1/TCLKC TIOCA1, TIOCB1, TIOCA2, TIOCB2) and PPG output pins
P14/PO12/TIOCA1
(PO15 to PO8)
P13/PO11/TIOCD0/TCLKB
P12/PO10/TIOCC0/TCLKA
P11/PO9/TIOCB0/DACK1
P10/PO8/TIOCA0/DACK0
Port 2 • 8-bit I/O
port
• Schmitttriggered
input
P27/PO7/TIOCB5/TMO1
P26/PO6/TIOCA5/TMO0
P25/PO5/TIOCB4/TMCI1
P24/PO4/TIOCA4/TMRI1
8-bit I/O port also functioning as TPU I/O pins (TIOCA3,
TIOCB3, TIOCC3, TIOCD3, TIOCA4, TIOCB4, TIOCA5,
TIOCB5), 8-bit timer (channels 0 and 1) I/O pins (TMRI0,
TMCI0, TMO0, TMRI1, TMCI1, TMO1) and PPG output
pins (PO7 to PO0)
P23/PO3/TIOCD3/TMCI0
P22/PO2/TIOCC3/TMRI0
P21/PO1/TIOCB3
P20/PO0/TIOCA3
Port 3 • 6-bit I/O
port
• Open-drain
output
capability
P35/SCK1
P34/SCK0
6-bit I/O port also functioning as SCI (channels 0 and 1) I/O
pins (TxD0, RxD0, SCK0, TxD1, RxD1, SCK1)
P33/RxD1
P32/RxD0
P31/TxD1
P30/TxD0
Port 4 • 8-bit input
port
P47/AN7/DA1
P46/AN6/DA0
P45/AN5
8-bit input port also functioning as A/D converter analog
inputs (AN7 to AN0) and D/A converter analog outputs
(DA1 and DA0)
P44/AN4
P43/AN3
P42/AN2
P41/AN1
P40/AN0
Port 5 • 4-bit I/O
port
P53/ADTRG
P52/SCK2
4-bit I/O port also functioning as SCI (channel 2) I/O pins
(TxD2, RxD2, SCK2) and A/D converter input pin (ADTRG)
P51/RxD2
P50/TxD2
Port 6 • 8-bit I/O
port
• Schmitttriggered
input
(P64 to P67)
P67/IRQ3/CS7
P66/IRQ2/CS6
P65/IRQ1
P64/IRQ0
P63/TEND1
P62/DREQ1
P61/TEND0/CS5
P60/DREQ0/CS4
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8-bit I/O port also functioning as DMA
controller I/O pins (DREQ0, TEND0,
DREQ1, TEND1), bus control output pins
(CS4 to CS7), and interrupt input pins (IRQ0
to IRQ3)
8-bit I/O port
also functioning as interrupt input pins
(IRQ0 to
IRQ3)
Port Description
Pins
Port A • 8-bit I/O
PA 7/A 23 /IRQ7
port
PA 6/A 22 /IRQ6
• On-chip
PA 5/A 21 /IRQ5
MOS input
4
pull-up*
• Open-drain
output
capability*4
• SchmittPA 4/A 20 /IRQ4
triggered
input
(PA4 to PA7)
PA 3/A 19 to PA0/A 16
Mode 4*3
Mode 5*3
When DDR = 0 (after reset):
dual function as input ports
and interrupt input pins
(IRQ7 to IRQ5)
When DDR = 1: address
output
Mode 6
Mode 7
When DDR =
0 (after reset):
dual function
as input ports
and interrupt
input pins
(IRQ7 to
IRQ4)
Dual function
as I/O ports
and interrupt
input pins
(IRQ7 to
IRQ4)
Address output
When DDR =
1: address
output
Address output
When DDR = I/O port
0 (after reset):
input ports
When DDR =
1: address
output
Port B • 8-bit I/O
port
• On-chip
MOS input
pull-up*4
PB 7/A 15 to PB0/A 8
Port C • 8-bit I/O
port
• On-chip
MOS input
pull-up*4
PC7/A 7 to PC0/A 0
Port D • 8-bit I/O
port
• On-chip
MOS input
pull-up*4
PD7/D15 to PD0/D8
Data bus input/output
I/O port
Port E • 8-bit I/O
port
• On-chip
MOS input
pull-up*4
PE 7/D7 to PE0/D0
In 8-bit bus mode: I/O port
I/O port
Address output
When DDR = I/O port
0 (after reset):
input port
When DDR =
1: address
output
Address output
When DDR = I/O port
0 (after reset):
input port
When DDR =
1: address
output
In 16-bit bus mode: data bus input/output
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Port Description
Port F • 8-bit I/O
port
Pins
PF7/ø
Mode 4*3
Mode 5*3
Mode 6
When DDR = 0: input port
When DDR = 1 (after reset): ø output
Mode 7
When DDR =
0 (after reset):
input port
When DDR =
1: ø output
PF6/AS
AS, RD, HWR, LWR output
I/O port
PF5/RD
PF4/HWR
PF3/LWR
PF2/LCAS/WAIT/BREQO
When WAITE = 0 and BREQOE = 0 (after
reset): I/O port
When WAITE = 1 and BREQOE = 0: WAIT
input
When WAITE = 0 and BREQOE = 1:
BREQO output
When RMTS2 to RMTS0= B'001 to B'011,
CW2= 0, and LCASS= 0: LCAS output
Port G • 5-bit I/O
port
PF1/BACK
When BRLE = 0 (after reset): I/O port
PF0/BREQ
When BRLE = 1: BREQ input, BACK output
PG 4/CS0
When DDR = 0*1: input port
When DDR = 1*2: CS0 output
PG 3/CS1
When DDR = 0 (after reset): input port
PG 2/CS2
When DDR = 1: CS1, CS2, CS3 output
PG 1/CS3
PG 0/CAS
DRAM space set: CAS output
Otherwise (after reset): I/O port
Notes: 1.
2.
3.
4.
After a reset in mode 6
After a reset in mode 4 or 5
In ROMless version, only modes 4 and 5 are available.
Applies to the on-chip ROM version only.
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I/O port
9.2
Port 1
9.2.1
Overview
Port 1 is an 8-bit I/O port. Port 1 pins also function as PPG output pins (PO15 to PO8), TPU I/O pins (TCLKA, TCLKB,
TCLKC, TCLKD, TIOCA0, TIOCB0, TIOCC0, TIOCD0, TIOCA1, TIOCB1, TIOCA2, and TIOCB2), and DMAC
output pins (DACK0 and DACK1). Port 1 pin functions are the same in all operating modes.
Figure 9-1 shows the port 1 pin configuration.
Port 1 pins
P17 (I/O)/PO15 (output)/TIOCB2 (I/O)/TCLKD (input)
P16 (I/O)/PO14 (output)/TIOCA2 (I/O)
P15 (I/O)/PO13 (output)/TIOCB1 (I/O)/TCLKC (input)
P14 (I/O)/PO12 (output)/TIOCA1 (I/O)
Port 1
P13 (I/O)/PO11 (output)/TIOCD0 (I/O)/TCLKB (input)
P12 (I/O)/PO10 (output)/TIOCC0 (I/O)/TCLKA (input)
P11 (I/O)/PO9 (output)/TIOCB0 (I/O)/DACK1 (output)
P10 (I/O)/PO8 (output)/TIOCA0 (I/O)/DACK0 (output)
Figure 9-1 Port 1 Pin Functions
9.2.2
Register Configuration
Table 9-2 shows the port 1 register configuration.
Table 9-2
Port 1 Registers
Name
Abbreviation
R/W
Initial Value
Address*
Port 1 data direction register
P1DDR
W
H'00
H'FEB0
Port 1 data register
P1DR
R/W
H'00
H'FF60
Port 1 register
PORT1
R
Undefined
H'FF50
Note: * Lower 16 bits of the address.
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Port 1 Data Direction Register (P1DDR)
Bit
:
7
6
5
4
3
2
1
0
P17DDR P16DDR P15DDR P14DDR P13DDR P12DDR P11DDR P10DDR
Initial value :
0
0
0
0
0
0
0
0
R/W
W
W
W
W
W
W
W
W
:
P1DDR is an 8-bit write-only register, the individual bits of which specify input or output for the pins of port 1. P1DDR
cannot be read; if it is, an undefined value will be read.
Setting a P1DDR bit to 1 makes the corresponding port 1 pin an output pin, while clearing the bit to 0 makes the pin an
input pin.
P1DDR is initialized to H'00 by a power-on reset, and in hardware standby mode. It retains its prior state after a manual
reset*, and in software standby mode. As the PPG, TPU, and DMAC are initialized by a manual reset*, the pin states are
determined by the P1DDR and P1DR specifications.
Note: * Manual reset is only supported in the H8S/2357 ZTAT.
Port 1 Data Register (P1DR)
Bit
:
Initial value :
R/W
:
7
6
5
4
3
2
1
0
P17DR
P16DR
P15DR
P14DR
P13DR
P12DR
P11DR
P10DR
0
0
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
P1DR is an 8-bit readable/writable register that stores output data for the port 1 pins (P17 to P10).
P1DR is initialized to H'00 by a power-on reset, and in hardware standby mode. It retains its prior state after a manual
reset*, and in software standby mode.
Note: * Manual reset is only supported in the H8S/2357 ZTAT.
Port 1 Register (PORT1)
Bit
:
Initial value :
R/W
:
7
6
5
4
3
2
1
0
P17
P16
P15
P14
P13
P12
P11
P10
—*
—*
—*
—*
—*
—*
—*
—*
R
R
R
R
R
R
R
R
Note: * Determined by state of pins P17 to P1 0.
PORT1 is an 8-bit read-only register that shows the pin states. It cannot be written to. Writing of output data for the port 1
pins (P17 to P10) must always be performed on P1DR.
If a port 1 read is performed while P1DDR bits are set to 1, the P1DR values are read. If a port 1 read is performed while
P1DDR bits are cleared to 0, the pin states are read.
After a power-on reset and in hardware standby mode, PORT1 contents are determined by the pin states, as P1DDR and
P1DR are initialized. PORT1 retains its prior state after a manual reset*, and in software standby mode.
Note: * Manual reset is only supported in the H8S/2357 ZTAT.
Rev.6.00 Oct.28.2004 page 270 of 1016
REJ09B0138-0600H
9.2.3
Pin Functions
Port 1 pins also function as PPG output pins (PO15 to PO8), TPU I/O pins (TCLKA, TCLKB, TCLKC, TCLKD,
TIOCA0, TIOCB0, TIOCC0, TIOCD0, TIOCA1, TIOCB1, TIOCA2, and TIOCB2), and DMAC output pins (DACK0
and DACK1). Port 1 pin functions are shown in table 9-3.
Table 9-3
Port 1 Pin Functions
Pin
Selection Method and Pin Functions
P17/PO15/TIOCB2/ The pin function is switched as shown below according to the combination of
TCLKD
the TPU channel 2 setting by bits MD3 to MD0 in TMDR2, bits IOB3 to IOB0 in
TIOR2, bits CCLR1 and CCLR0 in TCR2, bits TPSC2 to TPSC0 in TCR0 and
TCR5, bit NDER15 in NDERH, and bit P17DDR.
TPU Channel
2 Setting
Table Below (1)
P17DDR
Table Below (2)
—
NDER15
Pin function
0
1
1
—
—
0
1
TIOCB2 output
P17
input
P17
output
PO15
output
TIOCB2 input * 1
TCLKD input *
2
Notes: 1. TIOCB2 input when MD3 to MD0 = B'0000, B'01××, and IOB3 = 1.
2. TCLKD input when the setting for either TCR0 or TCR5 is: TPSC2
to TPSC0 = B'111.
TCLKD input when channels 2 and 4 are set to phase counting
mode.
TPU Channel
2 Setting
MD3 to MD0
(2)
(1)
B'0000, B'01××
(2)
(2)
B'0010
(1)
(2)
B'0011
B'0000
B'0100
B'1×××
B'0001 to
B'0011
B'0101 to
B'0111
—
B'××00
CCLR1,
CCLR0
—
—
—
—
Other
than B'10
B'10
Output
function
—
Output
compare
output
—
—
PWM
mode 2
output
—
IOB3 to IOB0
Other than B'××00
×: Don’t care
Rev.6.00 Oct.28.2004 page 271 of 1016
REJ09B0138-0600H
Pin
Selection Method and Pin Functions
P16/PO14/TIOCA2 The pin function is switched as shown below according to the combination of
the TPU channel 2 setting by bits MD3 to MD0 in TMDR2, bits IOA3 to IOA0 in
TIOR2, bits CCLR1 and CCLR0 in TCR2, bit NDER14 in NDERH, and bit
P16DDR.
TPU Channel
2 Setting
Table Below (1)
Table Below (2)
P16DDR
—
0
1
1
NDER14
—
—
0
1
TIOCA2 output
P16
input
P16
output
PO14
output
Pin function
TIOCA2 input * 1
Note: 1. TIOCA2 input when MD3 to MD0 = B'0000, B'01××, and IOA3 = 1.
TPU Channel
2 Setting
MD3 to MD0
(2)
(1)
B'0000, B'01××
(2)
(1)
B'001×
B'0011
B'0000
B'0100
B'1×××
B'0001 to
B'0011
B'0101 to
B'0111
B'××00
CCLR1,
CCLR0
—
—
—
Output
function
—
Output
compare
output
—
IOA3 to IOA0
(1)
(2)
B'0011
Other than B'××00
—
Other
than B'01
PWM
PWM
mode 1 mode 2
output * 2 output
B'01
—
×: Don’t care
Note: 2. TIOCB2 output is disabled.
Rev.6.00 Oct.28.2004 page 272 of 1016
REJ09B0138-0600H
Pin
Selection Method and Pin Functions
P15/PO13/TIOCB1/ The pin function is switched as shown below according to the combination of
TCLKC
the TPU channel 1 setting by bits MD3 to MD0 in TMDR1, bits IOB3 to IOB0 in
TIOR1, bits CCLR1 and CCLR0 in TCR1, bits TPSC2 to TPSC0 in TCR0,
TCR2, TCR4, and TCR5, bit NDER13 in NDERH, and bit P15DDR.
TPU Channel
1 Setting
Table Below (1)
Table Below (2)
P15DDR
—
0
1
1
NDER13
—
—
0
1
TIOCB1 output
P15
input
P15
output
PO13
output
Pin function
TIOCB1 input * 1
TCLKC input * 2
Notes: 1. TIOCB1 input when MD3 to MD0 = B'0000, B'01×× and IOB3
to IOB0 = B'10××.
2. TCLKC input when the setting for either TCR0 or TCR2 is: TPSC2
to TPSC0 = B'110; or when the setting for either TCR4 or TCR5 is
TPSC2 to TPSC0 = B'101.
TCLKC input when channels 2 and 4 are set to phase counting
mode.
TPU Channel
1 Setting
MD3 to MD0
(2)
(1)
B'0000, B'01××
(2)
(2)
B'0010
(1)
(2)
B'0011
B'0000
B'0100
B'1×××
B'0001 to
B'0011
B'0101 to
B'0111
—
B'××00
CCLR1,
CCLR0
—
—
—
—
Other
than
B'10
B'10
Output
function
—
Output
compare
output
—
—
PWM
mode 2
output
—
IOB3 to IOB0
Other than B'××00
×: Don’t care
Rev.6.00 Oct.28.2004 page 273 of 1016
REJ09B0138-0600H
Pin
Selection Method and Pin Functions
P14/PO12/TIOCA1 The pin function is switched as shown below according to the combination of
the TPU channel 1 setting by bits MD3 to MD0 in TMDR1, bits IOA3 to IOA0 in
TIOR1, bits CCLR1 and CCLR0 in TCR1, bit NDER12 in NDERH, and bit
P14DDR.
TPU Channel
1 Setting
Table Below (1)
Table Below (2)
P14DDR
—
0
1
1
NDER12
—
—
0
1
TIOCA1 output
P14
input
P14
output
PO12
output
Pin function
TIOCA1 input * 1
Note: 1. TIOCA1 input when MD3 to MD0 = B'0000, B'01××, IOA3 to IOA0 =
B'10××.
TPU Channel
1 Setting
MD3 to MD0
(2)
(1)
(1)
(1)
(2)
B'001×
B'0010
B'0011
B'0000
B'0100
B'1×××
B'0001 to
B'0011
B'0101 to
B'0111
B'××00
Other
than
B'××00
Other than B'××00
CCLR1,
CCLR0
—
—
—
—
Other
than B'01
B'01
Output
function
—
Output
compare
output
—
PWM
mode 1
output* 2
PWM
mode 2
output
—
IOA3 to IOA0
B'0000, B'01××
(2)
×: Don't care
Note: 2. TIOCB1 output is disabled.
Rev.6.00 Oct.28.2004 page 274 of 1016
REJ09B0138-0600H
Pin
Selection Method and Pin Functions
P13/PO11/TIOCD0/ The pin function is switched as shown below according to the combination of
TCLKB
the TPU channel 0 setting by bits MD3 to MD0 in TMDR0, bits IOD3 to IOD0 in
TIOR0L, bits CCLR2 to CCLR0 in TCR0, bits TPSC2 to TPSC0 in TCR0 to
TCR2, bit NDER11 in NDERH, and bit P13DDR.
TPU Channel
0 Setting
Table Below (1)
Table Below (2)
P13DDR
—
0
1
1
NDER11
—
—
0
1
TIOCD0 output
P13
input
P13
output
PO11
output
Pin function
TIOCD0 input * 1
TCLKB input * 2
Notes: 1. TIOCD0 input when MD3 to MD0 = B'0000, IOD3 to IOD0 =B'10××.
2. TCLKB input when the setting for TCR0 to TCR2 is: TPSC2 to
TPSC0 = B'101;
TCLKB input when channels 1 and 5 are set to phase counting
mode.
TPU Channel
0 Setting
(2)
MD3 to MD0
(1)
B'0000
(2)
(2)
B'0010
(1)
(2)
B'0011
B'0000
B'0100
B'1×××
B'0001 to
B'0011
B'0101 to
B'0111
—
B'××00
CCLR2 to
CCLR0
—
—
—
—
Other
than
B'110
B'110
Output
function
—
Output
compare
output
—
—
PWM
mode 2
output
—
IOD3 to IOD0
Other than B'××00
×: Don’t care
Rev.6.00 Oct.28.2004 page 275 of 1016
REJ09B0138-0600H
Pin
Selection Method and Pin Functions
P12/PO10/TIOCC0/ The pin function is switched as shown below according to the combination of
TCLKA
the TPU channel 0 setting by bits MD3 to MD0 in TMDR0, bits IOC3 to IOC0 in
TIOR0L, bits CCLR2 to CCLR0 in TCR0, bits TPSC2 to TPSC0 in TCR0 to
TCR5, bit NDER10 in NDERH, and bit P12DDR.
TPU Channel
0 Setting
Table Below (1)
Table Below (2)
P12DDR
—
0
1
1
NDER10
—
—
0
1
TIOCC0 output
P12
input
P12
output
PO10
output
Pin function
TIOCC0 input * 1
TCLKA input * 2
Notes: 1. TIOCC0 input when MD3 to MD0 = B'0000, and IOC3 to IOC0 =
B'10××.
2. TCLKA input when the setting for TCR0 to TCR5 is: TPSC2 to
TPSC0 = B'100;
TCLKA input when channels 1 and 5 are set to phase counting
mode.
TPU Channel
0 Setting
(2)
(1)
(2)
(1)
B'001×
B'0010
B'0000
B'0100
B'1×××
B'0001 to
B'0011
B'0101 to
B'0111
B'××00
CCLR2 to
CCLR0
—
—
—
—
Other
than
B'101
B'101
Output
function
—
Output
compare
output
—
PWM
mode 1
output* 3
PWM
mode 2
output
—
MD3 to MD0
IOC3 to IOC0
B'0000
(1)
(2)
B'0011
Other than B'××00
×: Don’t care
Note: 3. TIOCD0 output is disabled.
When BFA = 1 or BFB = 1 in TMDR0, output is disabled and setting
(2) applies.
Rev.6.00 Oct.28.2004 page 276 of 1016
REJ09B0138-0600H
Pin
Selection Method and Pin Functions
P11/PO9/TIOCB0/ The pin function is switched as shown below according to the combination of
DACK1
the TPU channel 0 setting by bits MD3 to MD0 in TMDR0, bits IOB3 to IOB0 in
TIOR0H, bits CCLR2 to CCLR0 in TCR0, bit NDER9 in NDERH, bit SAE1 in
DMABCRH, and bit P11DDR.
SAE1
0
TPU Channel
0 Setting
1
Table
Below (1)
Table Below (2)
P11DDR
—
0
1
1
—
NDER9
—
—
0
1
—
TIOCB0
output
P11
input
P11
output
PO9
output
DACK1
output
Pin function
TIOCB0 input *
Note: *
TIOCB0 input when MD3 to MD0 = B'0000, and IOB3 to IOB0 =
B'10××.
TPU Channel
0 Setting
(2)
MD3 to MD0
(1)
B'0000
(2)
(2)
B'0010
(1)
(2)
B'0011
B'0000
B'0100
B'1×××
B'0001 to
B'0011
B'0101 to
B'0111
—
B'××00
CCLR2 to
CCLR0
—
—
—
—
Other
than
B'010
B'010
Output
function
—
Output
compare
output
—
—
PWM
mode 2
output
—
IOB3 to IOB0
Other than B'××00
×: Don’t care
Rev.6.00 Oct.28.2004 page 277 of 1016
REJ09B0138-0600H
Pin
Selection Method and Pin Functions
P10/PO8/TIOCA0/ The pin function is switched as shown below according to the combination of
DACK0
the TPU channel 0 setting by bits MD3 to MD0 in TMDR0, bits IOA3 to IOA0 in
TIOR0H, bits CCLR2 to CCLR0 in TCR0, bit NDER8 in NDERH, bit SAE0 in
DMABCRH, and bit P10DDR.
SAE0
TPU Channel
0 Setting
0
Table
Below (1)
1
Table Below (2)
—
P10DDR
—
0
1
1
—
NDER8
—
—
0
1
—
TIOCA0
output
P10
input
P10
output
PO8
output
DACK0
output
Pin function
TIOCA0 input * 1
Note: 1. TIOCA0 input when MD3 to MD0 = B'0000, and IOA3 to IOA0 =
B'10××.
TPU Channel
0 Setting
(2)
(1)
(2)
(1)
B'001×
B'0010
B'0000
B'0100
B'1×××
B'0001 to
B'0011
B'0101 to
B'0111
B'××00
CCLR2 to
CCLR0
—
—
—
—
Other
than
B'001
B'001
Output
function
—
Output
compare
output
—
PWM
mode 1
output* 2
PWM
mode 2
output
—
MD3 to MD0
IOA3 to IOA0
B'0000
(1)
(2)
B'0011
Other than B'××00
×: Don’t care
Note: 2. TIOCB0 output is disabled.
Rev.6.00 Oct.28.2004 page 278 of 1016
REJ09B0138-0600H
9.3
Port 2
9.3.1
Overview
Port 2 is an 8-bit I/O port. Port 2 pins also function as PPG output pins (PO7 to PO0), TPU I/O pins (TIOCA3, TIOCB3,
TIOCC3, TIOCD3, TIOCA4, TIOCB4, TIOCA5, and TIOCB5) and 8-bit timer I/O pins (TMRI0, TMCI0, TMO0,
TMRI1, TMCI1, and TMO1). Port 2 pin functions are the same in all operating modes. Port 2 uses Schmitt-triggered
input.
Figure 9-2 shows the port 2 pin configuration.
Port 2 pins
P27 (I/O)/PO7 (output)/TIOCB5 (I/O)/TMO1 (output)
P26 (I/O)/PO6 (output)/TIOCA5 (I/O)/TMO0 (output)
P25 (I/O)/PO5 (output)/TIOCB4 (I/O)/TMCI1 (input)
P24 (I/O)/PO4 (output)/TIOCA4 (I/O)/TMRI1 (input)
Port 2
P23 (I/O)/PO3 (output)/TIOCD3 (I/O)/TMCI0 (input)
P22 (I/O)/PO2 (output)/TIOCC3 (I/O)/TMRI0 (input)
P21 (I/O)/PO1 (output)/TIOCB3 (I/O)
P20 (I/O)/PO0 (output)/TIOCA3 (I/O)
Figure 9-2 Port 2 Pin Functions
9.3.2
Register Configuration
Table 9-4 shows the port 2 register configuration.
Table 9-4
Port 2 Registers
Name
Abbreviation
R/W
Initial Value
Address*
Port 2 data direction register
P2DDR
W
H'00
H'FEB1
Port 2 data register
P2DR
R/W
H'00
H'FF61
Port 2 register
PORT2
R
Undefined
H'FF51
Note: * Lower 16 bits of the address.
Port 2 Data Direction Register (P2DDR)
Bit
:
7
6
5
4
3
2
1
0
P27DDR P26DDR P25DDR P24DDR P23DDR P22DDR P21DDR P20DDR
Initial value :
0
0
0
0
0
0
0
0
R/W
W
W
W
W
W
W
W
W
:
P2DDR is an 8-bit write-only register, the individual bits of which specify input or output for the pins of port 2. P2DDR
cannot be read; if it is, an undefined value will be read.
Setting a P2DDR bit to 1 makes the corresponding port 2 pin an output pin, while clearing the bit to 0 makes the pin an
input pin.
Rev.6.00 Oct.28.2004 page 279 of 1016
REJ09B0138-0600H
P2DDR is initialized to H'00 by a power-on reset, and in hardware standby mode. It retains its prior state after a manual
reset*, and in software standby mode. As the PPG, TPU, and 8-bit timer are initialized by a manual reset*, the pin states
are determined by the P2DDR and P2DR specifications.
Note: * Manual reset is only supported in the H8S/2357 ZTAT.
Port 2 Data Register (P2DR)
Bit
:
Initial value :
R/W
:
7
6
5
4
3
2
1
0
P27DR
P26DR
P25DR
P24DR
P23DR
P22DR
P21DR
P20DR
0
0
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
P2DR is an 8-bit readable/writable register that stores output data for the port 2 pins (P27 to P20).
P2DR is initialized to H'00 by a power-on reset, and in hardware standby mode. It retains its prior state after a manual
reset*, and in software standby mode.
Note: * Manual reset is only supported in the H8S/2357 ZTAT.
Port 2 Register (PORT2)
Bit
:
Initial value :
R/W
:
7
6
5
4
3
2
1
0
P27
P26
P25
P24
P23
P22
P21
P20
—*
—*
—*
—*
—*
—*
—*
—*
R
R
R
R
R
R
R
R
Note: * Determined by state of pins P27 to P2 0.
PORT2 is an 8-bit read-only register that shows the pin states. It cannot be written to. Writing of output data for the port 2
pins (P27 to P20) must always be performed on P2DR.
If a port 2 read is performed while P2DDR bits are set to 1, the P2DR values are read. If a port 2 read is performed while
P2DDR bits are cleared to 0, the pin states are read.
After a power-on reset and in hardware standby mode, PORT2 contents are determined by the pin states, as P2DDR and
P2DR are initialized. PORT2 retains its prior state after a manual reset*, and in software standby mode.
Note: * Manual reset is only supported in the H8S/2357 ZTAT.
Rev.6.00 Oct.28.2004 page 280 of 1016
REJ09B0138-0600H
9.3.3
Pin Functions
Port 2 pins also function as PPG output pins (PO7 to PO0) and TPU I/O pins (TIOCA3, TIOCB3, TIOCC3, TIOCD3,
TIOCA4, TIOCB4, TIOCA5, and TIOCB5), and 8-bit timer I/O pins (TMRI0, TMCI0, TMO0, TMRI1, TMCI1, and
TMO1). Port 2 pin functions are shown in table 9-5.
Table 9-5
Port 2 Pin Functions
Pin
Selection Method and Pin Functions
P27/PO7/TIOCB5/ The pin function is switched as shown below according to the combination of
TMO1
the TPU channel 5 setting by bits MD3 to MD0 in TMDR5, bits IOB3 to IOB0 in
TIOR5, bits CCLR1 and CCLR0 in TCR5, bit NDER7 in NDERL, bits OS3 to
OS0 in TCSR1, and bit P27DDR.
OS3 to OS0
TPU Channel
5 Setting
All 0
Table
Below (1)
Any 1
Table Below (2)
—
P27DDR
—
0
1
1
—
NDER7
—
—
0
1
—
TIOCB5
output
P27
input
P27
output
PO7
output
TMO1
output
Pin function
TIOCB5 input *
Note: * TIOCB5 input when MD3 to MD0 = B'0000, B'01××, and IOB3 = 1.
TPU Channel
5 Setting
MD3 to MD0
(2)
(1)
B'0000, B'01××
(2)
(2)
B'0010
(1)
(2)
B'0011
B'0000
B'0100
B'1×××
B'0001 to
B'0011
B'0101 to
B'0111
—
B'××00
CCLR1,
CCLR0
—
—
—
—
Other
than B'10
B'10
Output
function
—
Output
compare
output
—
—
PWM
mode 2
output
—
IOB3 to IOB0
Other than B'××00
×: Don’t care
Rev.6.00 Oct.28.2004 page 281 of 1016
REJ09B0138-0600H
Pin
Selection Method and Pin Functions
P26/PO6/TIOCA5/ The pin function is switched as shown below according to the combination of
TMO0
the TPU channel 5 setting by bits MD3 to MD0 in TMDR5, bits IOA3 to IOA0 in
TIOR5, bits CCLR1 and CCLR0 in TCR5, bit NDER6 in NDERL, bits OS3 to
OS0 in TCSR0, and bit P26DDR.
OS3 to OS0
TPU Channel
5 Setting
All 0
Table
Below (1)
Any 1
Table Below (2)
—
P26DDR
—
0
1
1
—
NDER6
—
—
0
1
—
TIOCA5
output
P26
input
P26
output
PO6
output
TMO0
output
Pin function
TIOCA5 input * 1
Note: 1. TIOCA5 input when MD3 to MD0 = B'0000, B'01××, and IOA3 = 1.
TPU Channel
5 Setting
MD3 to MD0
(2)
(1)
B'0000, B'01××
(2)
(1)
B'001×
B'0010
(1)
(2)
B'0011
B'0000
B'0100
B'1×××
B'0001 to
B'0011
B'0101 to
B'0111
B'××00
CCLR1,
CCLR0
—
—
—
—
Other
than B'01
B'01
Output
function
—
Output
compare
output
—
PWM
mode 1
output* 2
PWM
mode 2
output
—
IOA3 to IOA0
Other than B'××00
×: Don’t care
Note: 2. TIOCB5 output is disabled.
Rev.6.00 Oct.28.2004 page 282 of 1016
REJ09B0138-0600H
Pin
Selection Method and Pin Functions
P25/PO5/TIOCB4/ This pin is used as the 8-bit timer external clock input pin when external clock
TMCI1
is selected with bits CKS2 to CKS0 in TCR1.
The pin function is switched as shown below according to the combination of
the TPU channel 4 setting by bits MD3 to MD0 in TMDR4 and bits IOB3 to
IOB0 in TIOR4, bits CCLR1 and CCLR0 in TCR4, bit NDER5 in NDERL, and
bit P25DDR.
TPU Channel
4 Setting
Table Below (1)
Table Below (2)
P25DDR
—
0
1
1
NDER5
—
—
0
1
TIOCB4 output
P25
input
P25
output
PO5
output
Pin function
TIOCB4 input *
TMCI1 input
Note: *
TIOCB4 input when MD3 to MD0 = B'0000, B'01××, and IOB3 to
IOB0 = B'10××.
TPU Channel
4 Setting
MD3 to MD0
(2)
(1)
B'0000, B'01××
(2)
(2)
B'0010
(1)
(2)
B'0011
B'0000
B'0100
B'1×××
B'0001 to
B'0011
B'0101 to
B'0111
—
B'××00
CCLR1,
CCLR0
—
—
—
—
Other
than B'10
B'10
Output
function
—
Output
compare
output
—
—
PWM
mode 2
output
—
IOB3 to IOB0
Other than B'××00
×: Don’t care
Rev.6.00 Oct.28.2004 page 283 of 1016
REJ09B0138-0600H
Pin
Selection Method and Pin Functions
P24/PO4/TIOCA4/ This pin is used as the 8-bit timer counter reset pin when bits CCLR1 and
TMRI1
CCLR0 in TCR1 are both set to 1.
The pin function is switched as shown below according to the combination of
the TPU channel 4 setting by bits MD3 to MD0 in TMDR4, bits IOA3 to IOA0 in
TIOR4, bits CCLR1 and CCLR0 in TCR4, bit NDER4 in NDERL, and bit
P24DDR.
TPU Channel
4 Setting
Table Below (1)
Table Below (2)
P24DDR
—
0
1
1
NDER4
—
—
0
1
TIOCA4 output
P24
input
P24
output
PO4
output
Pin function
TIOCA4 input * 1
TMRI1 input
Note: 1. TIOCA4 input when MD3 to MD0 = B'0000, B'01××, and IOA3 to
IOA0 = B'10××.
TPU Channel
4 Setting
MD3 to MD0
(2)
(1)
B'0000, B'01××
(2)
(1)
B'001×
B'0010
(1)
(2)
B'0011
B'0000
B'0100
B'1×××
B'0001 to
B'0011
B'0101 to
B'0111
B'××00
CCLR1,
CCLR0
—
—
—
—
Other
than B'01
B'01
Output
function
—
Output
compare
output
—
PWM
mode 1
output* 2
PWM
mode 2
output
—
IOA3 to IOA0
Other than B'××00
×: Don’t care
Note: 2. TIOCB4 output is disabled.
Rev.6.00 Oct.28.2004 page 284 of 1016
REJ09B0138-0600H
Pin
Selection Method and Pin Functions
P23/PO3/TIOCD3/ This pin is used as the 8-bit timer external clock input pin when external clock
TMCI0
is selected with bits CKS2 to CKS0 in TCR0.
The pin function is switched as shown below according to the combination of
the TPU channel 3 setting by bits MD3 to MD0 in TMDR3, bits IOD3 to IOD0 in
TIOR3L, bits CCLR2 to CCLR0 in TCR3, bit NDER3 in NDERL, and bit
P23DDR.
TPU Channel
3 Setting
Table Below (1)
Table Below (2)
P23DDR
—
0
1
1
NDER3
—
—
0
1
TIOCD3 output
P23
input
P23
output
PO3
output
Pin function
TIOCD3 input *
TMCI0 input
Note: *
TIOCD3 input when MD3 to MD0 = B'0000, and IOD3 to IOD0 =
B'10××.
TPU Channel
3 Setting
(2)
MD3 to MD0
(1)
B'0000
(2)
(2)
B'0010
(1)
(2)
B'0011
B'0000
B'0100
B'1×××
B'0001 to
B'0011
B'0101 to
B'0111
—
B'××00
CCLR2 to
CCLR0
—
—
—
—
Other
than
B'110
B'110
Output
function
—
Output
compare
output
—
—
PWM
mode 2
output
—
IOD3 to IOD0
Other than B'××00
×: Don’t care
Rev.6.00 Oct.28.2004 page 285 of 1016
REJ09B0138-0600H
Pin
Selection Method and Pin Functions
P22/PO2/TIOCC3/ This pin is used as the 8-bit timer counter reset pin when bits CCLR1 and
TMRI0
CCLR0 in TCR0 are both set to 1.
The pin function is switched as shown below according to the combination of
the TPU channel 3 setting by bits MD3 to MD0 in TMDR3, bits IOC3 to IOC0 in
TIOR3L, bits CCLR2 to CCLR0 in TCR3, bit NDER2 in NDERL, and bit
P22DDR.
TPU Channel
3 Setting
Table Below (1)
Table Below (2)
P22DDR
—
0
1
1
NDER2
—
—
0
1
TIOCC3 output
P22
input
P22
output
PO2
output
Pin function
TIOCC3 input * 1
TMRI0 input
Note: 1. TIOCC3 input when MD3 to MD0 = B'0000, and IOC3 to IOC0 =
B'10××.
TPU Channel
3 Setting
(2)
(1)
(2)
(1)
B'001×
B'0010
B'0000
B'0100
B'1×××
B'0001 to
B'0011
B'0101 to
B'0111
B'××00
CCLR2 to
CCLR0
—
—
—
—
Other
than
B'101
B'101
Output
function
—
Output
compare
output
—
PWM
mode 1
output* 2
PWM
mode 2
output
—
MD3 to MD0
IOC3 to IOC0
B'0000
(1)
(2)
B'0011
Other than B'××00
×: Don’t care
Note: 2. TIOCD3 output is disabled.
When BFA = 1 or BFB = 1 in TMDR3, output is disabled and setting
(2) applies.
Rev.6.00 Oct.28.2004 page 286 of 1016
REJ09B0138-0600H
Pin
Selection Method and Pin Functions
P21/PO1/TIOCB3
The pin function is switched as shown below according to the combination of
the TPU channel 3 setting by bits MD3 to MD0 in TMDR3, bits IOB3 to IOB0 in
TIOR3H, bits CCLR2 to CCLR0 in TCR3, bit NDER1 in NDERL, and bit
P21DDR.
TPU Channel
3 Setting
Table Below (1)
Table Below (2)
P21DDR
—
0
1
1
NDER1
—
—
0
1
TIOCB3 output
P21
input
P21
output
PO1
output
Pin function
TIOCB3 input *
Note: *
TIOCB3 input when MD3 to MD0 = B'0000, and IOB3 to IOB0 =
B'10××.
TPU Channel
3 Setting
(2)
MD3 to MD0
(1)
B'0000
(2)
(2)
B'0010
(1)
(2)
B'0011
B'0000
B'0100
B'1×××
B'0001 to
B'0011
B'0101 to
B'0111
—
B'××00
CCLR2 to
CCLR0
—
—
—
—
Other
than
B'010
B'010
Output
function
—
Output
compare
output
—
—
PWM
mode 2
output
—
IOB3 to IOB0
Other than B'××00
×: Don’t care
Rev.6.00 Oct.28.2004 page 287 of 1016
REJ09B0138-0600H
Pin
Selection Method and Pin Functions
P20/PO0/TIOCA3
The pin function is switched as shown below according to the combination of
the TPU channel 3 setting by bits MD3 to MD0 in TMDR3, bits IOA3 to IOA0 in
TIOR3H, bits CCLR2 to CCLR0 in TCR3, bit NDER0 in NDERL, and bit
P20DDR.
TPU Channel
3 Setting
Table Below (1)
Table Below (2)
P20DDR
—
0
1
1
NDER0
—
—
0
1
TIOCA3 output
P20
input
P20
output
PO0
output
Pin function
TIOCA3 input * 1
Note: 1. TIOCA3 input when MD3 to MD0 = B'0000, and IOA3 to IOA0 =
B'10××.
TPU Channel
3 Setting
(2)
(1)
(2)
(1)
B'001×
B'0010
B'0000
B'0100
B'1×××
B'0001 to
B'0011
B'0101 to
B'0111
B'××00
CCLR2 to
CCLR0
—
—
—
—
Other
than
B'001
B'001
Output
function
—
Output
compare
output
—
PWM
mode 1
output* 2
PWM
mode 2
output
—
MD3 to MD0
IOA3 to IOA0
B'0000
(1)
(2)
B'0011
Other than B'××00
×: Don’t care
Note: 2. TIOCB3 output is disabled.
Rev.6.00 Oct.28.2004 page 288 of 1016
REJ09B0138-0600H
9.4
Port 3
9.4.1
Overview
Port 3 is a 6-bit I/O port. Port 3 pins also function as SCI I/O pins (TxD0, RxD0, SCK0, TxD1, RxD1, and SCK1). Port 3
pin functions are the same in all operating modes.
Figure 9-3 shows the port 3 pin configuration.
Port 3 pins
P35 (I/O)/ SCK1 (I/O)
P34 (I/O)/ SCK0 (I/O)
P33 (I/O)/ RxD1 (input)
Port 3
P32 (I/O)/ RxD0 (input)
P31 (I/O)/ TxD1 (output)
P30 (I/O)/ TxD0 (output)
Figure 9-3 Port 3 Pin Functions
9.4.2
Register Configuration
Table 9-6 shows the port 3 register configuration.
Table 9-6
Port 3 Registers
Name
Abbreviation
R/W
Initial Value* 2
Address* 1
Port 3 data direction register
P3DDR
W
H'00
H'FEB2
Port 3 data register
P3DR
R/W
H'00
H'FF62
Port 3 register
PORT3
R
Undefined
H'FF52
Port 3 open drain control register
P3ODR
R/W
H'00
H'FF76
Notes: 1. Lower 16 bits of the address.
2. Value of bits 5 to 0.
Port 3 Data Direction Register (P3DDR)
Bit
:
7
6
—
—
5
4
3
2
1
0
P35DDR P34DDR P33DDR P32DDR P31DDR P30DDR
Initial value : Undefined Undefined
0
0
0
0
0
0
R/W
W
W
W
W
W
W
:
—
—
P3DDR is an 8-bit write-only register, the individual bits of which specify input or output for the pins of port 3. Bits 7 and
6 are reserved. P3DDR cannot be read; if it is, an undefined value will be read.
Setting a P3DDR bit to 1 makes the corresponding port 3 pin an output pin, while clearing the bit to 0 makes the pin an
input pin.
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REJ09B0138-0600H
P3DDR is initialized to H'00 (bits 5 to 0) by a power-on reset, and in hardware standby mode. It retains its prior state after
a manual reset*, and in software standby mode. As the SCI is initialized, the pin states are determined by the P3DDR and
P3DR specifications.
Note: * Manual reset is only supported in the H8S/2357 ZTAT.
Port 3 Data Register (P3DR)
Bit
:
7
6
5
4
3
2
1
0
—
—
P35DR
P34DR
P33DR
P32DR
P31DR
P30DR
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
Initial value : Undefined Undefined
R/W
:
—
—
P3DR is an 8-bit readable/writable register that stores output data for the port 3 pins (P35 to P30).
Bits 7 and 6 are reserved; they return an undetermined value if read, and cannot be modified.
P3DR is initialized to H'00 (bits 5 to 0) by a power-on reset, and in hardware standby mode. It retains its prior state after a
manual reset*, and in software standby mode.
Note: * Manual reset is only supported in the H8S/2357 ZTAT.
Port 3 Register (PORT3)
Bit
:
7
6
5
4
3
2
1
0
—
—
P35
P34
P33
P32
P31
P30
—*
—*
—*
—*
—*
—*
R
R
R
R
R
R
Initial value : Undefined Undefined
R/W
:
—
—
Note: * Determined by state of pins P35 to P3 0.
PORT3 is an 8-bit read-only register that shows the pin states. Writing of output data for the port 3 pins (P35 to P30) must
always be performed on P3DR.
Bits 7 and 6 are reserved; they return an undetermined value if read, and cannot be modified.
If a port 3 read is performed while P3DDR bits are set to 1, the P3DR values are read. If a port 3 read is performed while
P3DDR bits are cleared to 0, the pin states are read.
After a power-on reset and in hardware standby mode, PORT3 contents are determined by the pin states, as P3DDR and
P3DR are initialized. PORT3 retains its prior state after a manual reset*, and in software standby mode.
Note: * Manual reset is only supported in the H8S/2357 ZTAT.
Port 3 Open Drain Control Register (P3ODR)
Bit
:
7
6
—
—
5
:
—
—
3
2
1
0
P35ODR P34ODR P33ODR P32ODR P31ODR P30ODR
Initial value : Undefined Undefined
R/W
4
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
P3ODR is an 8-bit readable/writable register that controls the PMOS on/off status for each port 3 pin (P35 to P30).
Rev.6.00 Oct.28.2004 page 290 of 1016
REJ09B0138-0600H
Bits 7 and 6 are reserved; they return an undetermined value if read, and cannot be modified.
Setting a P3ODR bit to 1 makes the corresponding port 3 pin an NMOS open-drain output pin, while clearing the bit to 0
makes the pin a CMOS output pin.
P3ODR is initialized to H'00 (bits 5 to 0) by a power-on reset, and in hardware standby mode. It retains its prior state after
a manual reset*, and in software standby mode.
Note: * Manual reset is only supported in the H8S/2357 ZTAT.
9.4.3
Pin Functions
Port 3 pins also function as SCI I/O pins (TxD0, RxD0, SCK0, TxD1, RxD1, and SCK1). Port 3 pin functions are shown
in table 9-7.
Table 9-7
Port 3 Pin Functions
Pin
Selection Method and Pin Functions
P35/SCK1
The pin function is switched as shown below according to the combination of
bit C/A in the SCI1 SMR, bits CKE0 and CKE1 in SCR, and bit P35DDR.
CKE1
0
C/A
0
CKE0
P35DDR
Pin function
1
0
0
P35
input pin
1
1
—
1
—
—
—
—
—
P35
SCK1
SCK1
output pin* output pin* output pin*
SCK1
input pin
Note: * When P35ODR = 1, the pin becomes an NMOS open-drain output.
P34/SCK0
The pin function is switched as shown below according to the combination of
bit C/A in the SCI0 SMR, bits CKE0 and CKE1 in SCR, and bit P34DDR.
CKE1
0
C/A
0
CKE0
P34DDR
Pin function
1
0
0
P34
input pin
1
1
—
1
—
—
—
—
—
P34
SCK0
SCK0
output pin* output pin* output pin*
SCK0
input pin
Note: * When P34ODR = 1, the pin becomes an NMOS open-drain output.
Rev.6.00 Oct.28.2004 page 291 of 1016
REJ09B0138-0600H
Pin
Selection Method and Pin Functions
P33/RxD1
The pin function is switched as shown below according to the combination of
bit RE in the SCI1 SCR, and bit P33DDR.
RE
P33DDR
Pin function
0
1
0
1
—
P33 input pin
P33 output pin*
RxD1 input pin
Note: * When P33ODR = 1, the pin becomes an NMOS open-drain output.
P32/RxD0
The pin function is switched as shown below according to the combination of
bit RE in the SCI0 SCR, and bit P32DDR.
RE
P32DDR
Pin function
0
1
0
1
—
P32 input pin
P32 output pin*
RxD0 input pin
Note: * When P32ODR = 1, the pin becomes an NMOS open-drain output.
P31/TxD1
The pin function is switched as shown below according to the combination of
bit TE in the SCI1 SCR, and bit P31DDR.
TE
P31DDR
Pin function
0
1
0
1
—
P31 input pin
P31 output pin*
TxD1 output pin*
Note: * When P31ODR = 1, the pin becomes an NMOS open-drain output.
P30/TxD0
The pin function is switched as shown below according to the combination of
bit TE in the SCI0 SCR, and bit P30DDR.
TE
P30DDR
Pin function
0
1
0
1
—
P30 input pin
P30 output pin*
TxD0 output pin*
Note: * When P30ODR = 1, the pin becomes an NMOS open-drain output.
Rev.6.00 Oct.28.2004 page 292 of 1016
REJ09B0138-0600H
9.5
Port 4
9.5.1
Overview
Port 4 is an 8-bit input-only port. Port 4 pins also function as A/D converter analog input pins (AN0 to AN7) and D/A
converter analog output pins (DA0 and DA1). Port 4 pin functions are the same in all operating modes. Figure 9-4 shows
the port 4 pin configuration.
Port 4 pins
P47 (input)/ AN7 (input)/DA1 (output)
P46 (input)/ AN6 (input)/DA0 (output)
P45 (input)/ AN5 (input)
P44 (input)/ AN4 (input)
Port 4
P43 (input)/ AN3 (input)
P42 (input)/ AN2 (input)
P41 (input)/ AN1 (input)
P40 (input)/ AN0 (input)
Figure 9-4 Port 4 Pin Functions
9.5.2
Register Configuration
Table 9-8 shows the port 4 register configuration. Port 4 is an input-only port, and does not have a data direction register
or data register.
Table 9-8
Port 4 Registers
Name
Abbreviation
R/W
Initial Value
Address*
Port 4 register
PORT4
R
Undefined
H'FF53
Note: * Lower 16 bits of the address.
Port 4 Register (PORT4): The pin states are always read when a port 4 read is performed.
Bit
:
Initial value :
R/W
:
7
6
5
4
3
2
1
0
P47
P46
P45
P44
P43
P42
P41
P40
—*
—*
—*
—*
—*
—*
—*
—*
R
R
R
R
R
R
R
R
Note: * Determined by state of pins P47 to P4 0.
9.5.3
Pin Functions
Port 4 pins also function as A/D converter analog input pins (AN0 to AN7) and D/A converter analog output pins (DA0
and DA1).
Rev.6.00 Oct.28.2004 page 293 of 1016
REJ09B0138-0600H
9.6
Port 5
9.6.1
Overview
Port 5 is a 4-bit I/O port. Port 5 pins also function as SCI I/O pins (TxD2, RxD2, and SCK2) and the A/D converter input
pin (ADTRG). Port 5 pin functions are the same in all operating modes. Figure 9-5 shows the port 5 pin configuration.
Port 5 pins
P53 (I/O)/ADTRG (input)
P52 (I/O)/SCK2 (I/O)
Port 5
P51 (I/O)/RxD2 (input)
P50 (I/O)/TxD2 (output)
Figure 9-5 Port 5 Pin Functions
9.6.2
Register Configuration
Table 9-9 shows the port 5 register configuration.
Table 9-9
Port 5 Registers
Name
Abbreviation
R/W
Initial Value* 2
Address* 1
Port 5 data direction register
P5DDR
W
H'0
H'FEB4
Port 5 data register
P5DR
R/W
H'0
H'FF64
Port 5 register
PORT5
R
Undefined
H'FF54
Notes: 1. Lower 16 bits of the address.
2. Value of bits 3 to 0.
Port 5 Data Direction Register (P5DDR)
Bit
:
7
6
5
4
—
—
—
—
3
2
1
0
P53DDR P52DDR P51DDR P50DDR
Initial value : Undefined Undefined Undefined Undefined
0
0
0
0
R/W
W
W
W
W
:
—
—
—
—
P5DDR is an 8-bit write-only register, the individual bits of which specify input or output for the pins of port 5. Bits 7 to 4
are reserved. P5DDR cannot be read; if it is, an undefined value will be read.
Setting a P5DDR bit to 1 makes the corresponding port 5 pin an output pin, while clearing the bit to 0 makes the pin an
input pin.
P5DDR is initialized to H'0 (bits 3 to 0) by a power-on reset, and in hardware standby mode. It retains its prior state after a
manual reset*, and in software standby mode. As the SCI is initialized, the pin states are determined by the P5DDR and
P5DR specifications.
Rev.6.00 Oct.28.2004 page 294 of 1016
REJ09B0138-0600H
Note: * Manual reset is only supported in the H8S/2357 ZTAT.
Port 5 Data Register (P5DR)
Bit
:
7
6
5
4
3
2
1
0
—
—
—
—
P53DR
P52DR
P51DR
P50DR
Initial value : Undefined Undefined Undefined Undefined
R/W
:
—
—
—
—
0
0
0
0
R/W
R/W
R/W
R/W
P5DR is an 8-bit readable/writable register that stores output data for the port 5 pins (P53 to P50).
Bits 7 to 4 are reserved; they return an undetermined value if read, and cannot be modified.
P5DR is initialized to H'0 (bits 3 to 0) by a power-on reset, and in hardware standby mode. It retains its prior state after a
manual reset*, and in software standby mode.
Note: * Manual reset is only supported in the H8S/2357 ZTAT.
Port 5 Register (PORT5)
Bit
:
7
6
5
4
3
2
1
0
—
—
—
—
P53
P52
P51
P50
—*
—*
—*
—*
R
R
R
R
Initial value : Undefined Undefined Undefined Undefined
R/W
:
—
—
—
—
Note: * Determined by state of pins P53 to P5 0.
PORT5 is an 8-bit read-only register that shows the pin states. It cannot be written to. Writing of output data for the port 5
pins (P53 to P50) must always be performed on P5DR.
Bits 7 to 4 are reserved; they return an undetermined value if read, and cannot be modified.
If a port 5 read is performed while P5DDR bits are set to 1, the P5DR values are read. If a port 5 read is performed while
P5DDR bits are cleared to 0, the pin states are read.
After a power-on reset and in hardware standby mode, PORT5 contents are determined by the pin states, as P5DDR and
P5DR are initialized. PORT5 retains its prior state after a manual reset*, and in software standby mode.
Note: * Manual reset is only supported in the H8S/2357 ZTAT.
Rev.6.00 Oct.28.2004 page 295 of 1016
REJ09B0138-0600H
9.6.3
Pin Functions
Port 5 pins also function as SCI I/O pins (TxD2, RxD2, and SCK2), and the A/D converter input pin (ADTRG). Port 5 pin
functions are shown in table 9-10.
Table 9-10 Port 5 Pin Functions
Pin
Selection Method and Pin Functions
P53/ADTRG
The pin function is switched as shown below according to the combination of
bits TRGS1 and TRGS0 in the A/D converter ADCR, and bit P53DDR.
P53DDR
Pin function
0
1
P53 input pin
P53 output pin
ADTRG input pin*
Note: * ADTRG input when TRGS0 = TRGS1 = 1.
P52/SCK2
The pin function is switched as shown below according to the combination of
bit C/A in the SCI2 SMR, bits CKE0 and CKE1 in SCR, and bit P52DDR.
CKE1
0
C/A
0
CKE0
P52DDR
Pin function
P51/RxD2
0
1
—
1
—
—
0
1
—
—
—
P52
input pin
P52
output pin
SCK2
output pin
SCK2
output pin
SCK2
input pin
The pin function is switched as shown below according to the combination of
bit RE in the SCI2 SCR, and bit P51DDR.
RE
P51DDR
Pin function
P50/TxD2
1
0
1
0
1
—
P51 input pin
P51 output pin
RxD2 input pin
The pin function is switched as shown below according to the combination of
bit TE in the SCI2 SCR, and bit P50DDR.
TE
P50DDR
Pin function
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REJ09B0138-0600H
0
1
0
1
—
P50 input pin
P50 output pin
TxD2 output pin
9.7
Port 6
9.7.1
Overview
Port 6 is an 8-bit I/O port. Port 6 pins also function as interrupt input pins (IRQ0 to IRQ3), DMAC I/O pins (DREQ0,
TEND0, DREQ1, and TEND1), and bus control output pins (CS4 to CS7). The functions of pins P65 to P62 are the same in
all operating modes, while the functions of pins P6 7, P6 6, P6 1, and P60 change according to the operating mode. Pins P67 to
P6 4 are schmitt-triggered inputs. Figure 9-6 shows the port 6 pin configuration.
Port 6
Port 6 pins
Pin functions in mode 7*
P67 / IRQ3 / CS7
P67 (I/O)/IRQ3 (input)
P66 / IRQ2 / CS6
P66 (I/O)/IRQ2 (input)
P65 / IRQ1
P65 (I/O)/IRQ1 (input)
P64 / IRQ0
P64 (I/O)/IRQ0 (input)
P63 / TEND1
P63 (I/O)/TEND1 (output)
P62 / DREQ1
P62 (I/O)/DREQ1 (input)
P61 / TEND0 / CS5
P61 (I/O)/TEND0 (output)
P60 / DREQ0 / CS4
P60 (I/O)/DREQ0 (input)
Pin functions in modes 4 to 6*
P67 (input)/IRQ3 (input)/CS7 (output)
P66 (input)/IRQ2 (input)/CS6 (output)
P65 (I/O)/IRQ1 (input)
P64 (I/O)/IRQ0 (input)
P63 (I/O)/TEND1 (output)
P62 (I/O)/DREQ1 (input)
P61 (input)/TEND0 (output)/CS5 (output)
P60 (input)/DREQ0 (input)/CS4 (output)
Note: * Modes 6 and 7 are provided in the on-chip ROM version only.
Figure 9-6 Port 6 Pin Functions
9.7.2
Register Configuration
Table 9-11 shows the port 6 register configuration.
Table 9-11 Port 6 Registers
Name
Abbreviation
R/W
Initial Value
Address*
Port 6 data direction register
P6DDR
W
H'00
H'FEB5
Port 6 data register
P6DR
R/W
H'00
H'FF65
Port 6 register
PORT6
R
Undefined
H'FF55
Note: * Lower 16 bits of the address.
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Port 6 Data Direction Register (P6DDR)
Bit
:
7
6
5
4
3
2
1
0
P67DDR P66DDR P65DDR P64DDR P63DDR P62DDR P61DDR P60DDR
Initial value :
0
0
0
0
0
0
0
0
R/W
W
W
W
W
W
W
W
W
:
P6DDR is an 8-bit write-only register, the individual bits of which specify input or output for the pins of port 6. P6DDR
cannot be read; if it is, an undefined value will be read.
Setting a P6DDR bit to 1 makes the corresponding port 6 pin an output pin, while clearing the bit to 0 makes the pin an
input pin.
P6DDR is initialized to H'00 by a power-on reset, and in hardware standby mode. It retains its prior state after a manual
reset*, and in software standby mode. As the DMAC is initialized by a manual reset*, the pin states are determined by the
P6DDR and P6DR specifications.
Note: * Manual reset is only supported in the H8S/2357 ZTAT.
Port 6 Data Register (P6DR)
Bit
:
Initial value :
R/W
:
7
6
5
4
3
2
1
0
P67DR
P66DR
P65DR
P64DR
P63DR
P62DR
P61DR
P60DR
0
0
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
P6DR is an 8-bit readable/writable register that stores output data for the port 6 pins (P67 to P60).
P6DR is initialized to H'00 by a power-on reset, and in hardware standby mode. It retains its prior state after a manual
reset*, and in software standby mode.
Note: * Manual reset is only supported in the H8S/2357 ZTAT.
Port 6 Register (PORT6)
Bit
:
Initial value :
R/W
:
7
6
5
4
3
2
1
0
P67
P66
P65
P64
P63
P62
P61
P60
—*
—*
—*
—*
—*
—*
—*
—*
R
R
R
R
R
R
R
R
Note: * Determined by state of pins P67 to P6 0.
PORT6 is an 8-bit read-only register that shows the pin states. It cannot be written to. Writing of output data for the port 6
pins (P67 to P60) must always be performed on P6DR.
If a port 6 read is performed while P6DDR bits are set to 1, the P6DR values are read. If a port 6 read is performed while
P6DDR bits are cleared to 0, the pin states are read.
After a power-on reset and in hardware standby mode, PORT6 contents are determined by the pin states, as P6DDR and
P6DR are initialized. PORT6 retains its prior state after a manual reset*, and in software standby mode.
Note: * Manual reset is only supported in the H8S/2357 ZTAT.
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9.7.3
Pin Functions
Port 6 pins also function as interrupt input pins (IRQ0 to IRQ3), DMAC I/O pins (DREQ0, TEND0, DREQ1, and
TEND1), and bus control output pins (CS4 to CS7). Port 6 pin functions are shown in table 9-12.
Table 9-12 Port 6 Pin Functions
Pin
Selection Method and Pin Functions
P67/IRQ3/CS7
The pin function is switched as shown below according to bit P67DDR.
Mode
P67DDR
Pin function
Mode 7*
0
Modes 4 to 6*
1
P67 input pin P67 output pin
0
1
P67 input pin CS7 output pin
IRQ3 interrupt input pin
Note: * Modes 6 and 7 are provided in the on-chip ROM version only.
P66/IRQ2/CS6
The pin function is switched as shown below according to bit P66DDR.
Mode
P66DDR
Pin function
Mode 7*
0
Modes 4 to 6*
1
P66 input pin P66 output pin
0
1
P66 input pin CS6 output pin
IRQ2 interrupt input pin
Note: * Modes 6 and 7 are provided in the on-chip ROM version only.
P65/IRQ1
The pin function is switched as shown below according to bit P65DDR.
P65DDR
Pin function
0
1
P65 input pin
P65 output pin
IRQ1 interrupt input pin
P64/IRQ0
The pin function is switched as shown below according to bit P64DDR.
P64DDR
Pin function
0
1
P64 input pin
P64 output pin
IRQ0 interrupt input pin
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Pin
Selection Method and Pin Functions
P63/TEND1
The pin function is switched as shown below according to the combination of
bit TEE1 in the DMAC DMATCR, and bit P63DDR.
TEE1
0
P63DDR
Pin function
P62/DREQ1
1
0
1
—
P63 input pin
P63 output pin
TEND1 output
The pin function is switched as shown below according to bit P62DDR.
P62DDR
Pin function
0
1
P62 input pin
P62 output pin
DERQ1 input
P61/TEND0/CS5
The pin function is switched as shown below according to the combination of
bit TEE0 in the DMAC DMATCR, and bit P61DDR.
Mode
Mode 7*
TEE0
P61DDR
Pin function
Modes 4 to 6*
0
0
1
1
—
P61
P61
TEND0
input pin output pin output
0
0
1
1
—
P61
CS5
TEND0
input pin output pin output
Note: * Modes 6 and 7 are provided in the on-chip ROM version only.
P60/DREQ0/CS4
The pin function is switched as shown below according to bit P60DDR.
Mode
P60DDR
Pin function
Mode 7*
0
Modes 4 to 6*
1
0
P60 input pin P60 output pin
P60 input pin CS4 output pin
DREQ0 input
Note: * Modes 6 and 7 are provided in the on-chip ROM version only.
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1
9.8
Port A
9.8.1
Overview
Port A is an 8-bit I/O port. Port A pins also function as address bus outputs and interrupt input pins (IRQ4 to IRQ7). The
pin functions change according to the operating mode.
Port A has a on-chip MOS input pull-up function that can be controlled by software. Pins PA7 to PA4 are schmitt-triggered
inputs.
Figure 9-7 shows the port A pin configuration.
Port A
Port A pins
Pin functions in mode 7*
PA7/A23/IRQ7
PA7 (I/O)/IRQ7 (input)
PA6/A22/IRQ6
PA6 (I/O)/IRQ6 (input)
PA5/A21/IRQ5
PA5 (I/O)/IRQ5 (input)
PA4/A20/IRQ4
PA4 (I/O)/IRQ4 (input)
PA3/A19
PA3 (I/O)
PA2/A18
PA2 (I/O)
PA1/A17
PA1 (I/O)
PA0/A16
PA0 (I/O)
Pin functions in mode 6*
Pin functions in modes 4 and 5
PA7 (input)/A23 (output)/IRQ7 (input)
PA7 (input)/A23 (output)/IRQ7 (input)
PA6 (input)/A22 (output)/IRQ6 (input)
PA6 (input)/A22 (output)/IRQ6 (input)
PA5 (input)/A21 (output)/IRQ5 (input)
PA5 (input)/A21 (output)/IRQ5 (input)
PA4 (input)/A20 (output)/IRQ4 (input)
A20 (output)
PA3 (input)/A19 (output)
A19 (output)
PA2 (input)/A18 (output)
A18 (output)
PA1 (input)/A17 (output)
A17 (output)
PA0 (input)/A16 (output)
A16 (output)
Note: * Modes 6 and 7 are provided in the on-chip ROM version only.
Figure 9-7 Port A Pin Functions
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9.8.2
Register Configuration
Table 9-13 shows the port A register configuration.
Table 9-13 Port A Registers
Name
Abbreviation
R/W
Initial Value
Address* 1
Port A data direction register
PADDR
W
H'00
H'FEB9
Port A data register
PADR
R/W
H'00
H'FF69
PORTA
R
Undefined
H'FF59
R/W
H'00
H'FF70
R/W
H'00
H'FF77
Port A register
2
Port A MOS pull-up control register* PAPCR
Port A open-drain control register*
2
PAODR
Notes: 1. Lower 16 bits of the address.
2. PAPCR and PAODR settings are prohibited in the ROMless version.
Port A Data Direction Register (PADDR)
Bit
:
7
6
5
4
3
2
1
0
PA7DDR PA6DDR PA5DDR PA4DDR PA3DDR PA2DDR PA1DDR PA0DDR
Initial value :
0
0
0
0
0
0
0
0
R/W
W
W
W
W
W
W
W
W
:
PADDR is an 8-bit write-only register, the individual bits of which specify input or output for the pins of port A. PADDR
cannot be read; if it is, an undefined value will be read.
PADDR is initialized to H'00 by a power-on reset and in hardware standby mode. It retains its prior state after a manual
reset*, and in software standby mode. The OPE bit in SBYCR is used to select whether the address output pins retain their
output state or become high-impedance when a transition is made to software standby mode.
Note: * Manual reset is only supported in the H8S/2357 ZTAT.
• Mode 7
Setting a PADDR bit to 1 makes the corresponding port A pin an output port, while clearing the bit to 0 makes the pin
an input port.
• Mode 6
Setting a PADDR bit to 1 makes the corresponding port A pin an address output while clearing the bit to 0 makes the
pin an input port.
• Modes 4 and 5
The corresponding port A pins are address outputs irrespective of the value of bits PA4DDR to PA0DDR.
Setting one of bits PA7DDR to PA5DDR to 1 makes the corresponding port A pin an address output, while clearing
the bit to 0 makes the pin an input port.
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Port A Data Register (PADR)
Bit
:
Initial value :
R/W
:
7
6
5
4
3
2
1
0
PA7DR
PA6DR
PA5DR
PA4DR
PA3DR
PA2DR
PA1DR
PA0DR
0
0
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
PADR is an 8-bit readable/writable register that stores output data for the port A pins (PA7 to PA 0).
PADR is initialized to H'00 by a power-on reset, and in hardware standby mode. It retains its prior state after a manual
reset*, and in software standby mode.
Note: * Manual reset is only supported in the H8S/2357 ZTAT.
Port A Register (PORTA)
Bit
:
Initial value :
R/W
:
7
6
5
4
3
2
1
0
PA7
PA6
PA5
PA4
PA3
PA2
PA1
PA0
—*
—*
—*
—*
—*
—*
—*
—*
R
R
R
R
R
R
R
R
Note: * Determined by state of pins PA7 to PA 0.
PORTA is an 8-bit read-only register that shows the pin states. It cannot be written to. Writing of output data for the port
A pins (PA7 to PA 0) must always be performed on PADR.
If a port A read is performed while PADDR bits are set to 1, the PADR values are read. If a port A read is performed
while PADDR bits are cleared to 0, the pin states are read.
After a power-on reset and in hardware standby mode, PORTA contents are determined by the pin states, as PADDR and
PADR are initialized. PORTA retains its prior state after a manual reset*, and in software standby mode.
Note: * Manual reset is only supported in the H8S/2357 ZTAT.
Port A MOS Pull-Up Control Register (PAPCR) (On-Chip ROM Version Only)
Bit
:
7
6
5
4
3
2
1
0
PA7PCR PA6PCR PA5PCR PA4PCR PA3PCR PA2PCR PA1PCR PA0PCR
Initial value :
R/W
:
0
0
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Note: Setting is prohibited in the H8S/2352, H8S/2394, H8S/2392, and H8S/2390.
PAPCR is an 8-bit readable/writable register that controls the MOS input pull-up function incorporated into port A on an
individual bit basis.
All the bits are valid in modes 6 and 7, and bits 7 to 5 are valid in modes 4 and 5. When a PADDR bit is cleared to 0
(input port setting), setting the corresponding PAPCR bit to 1 turns on the MOS input pull-up for the corresponding pin.
PAPCR is initialized to H'00 by a power-on reset, and in hardware standby mode. It retains its prior state after a manual
reset*, and in software standby mode.
Note: * Manual reset is only supported in the H8S/2357 ZTAT.
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Port A Open Drain Control Register (PAODR) (On-Chip ROM Version Only)
Bit
:
7
6
5
4
3
2
1
0
PA7ODR PA6ODR PA5ODR PA4ODR PA3ODR PA2ODR PA1ODR PA0ODR
Initial value :
R/W
:
0
0
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Note: Setting is prohibited in the H8S/2352, H8S/2394, H8S/2392, and H8S/2390.
PAODR is an 8-bit readable/writable register that controls whether PMOS is on or off for each port A pin (PA7 to PA0).
All bits are valid in mode 7.
Setting a PAODR bit to 1 makes the corresponding port A pin an NMOS open-drain output, while clearing the bit to 0
makes the pin a CMOS output.
PAODR is initialized to H'00 by a power-on reset, and in hardware standby mode. It retains its prior state after a manual
reset*, and in software standby mode.
Note: * Manual reset is only supported in the H8S/2357 ZTAT.
9.8.3
Pin Functions
Mode 7 (On-Chip ROM Version Only): In mode 7, port A pins function as I/O ports and interrupt input pins. Input or
output can be specified for each pin on an individual bit basis. Setting a PADDR bit to 1 makes the corresponding port A
pin an output port, while clearing the bit to 0 makes the pin an input port.
Port A pin functions in mode 7 are shown in figure 9-8.
PA7 (I/O)/IRQ7 (input)
PA6 (I/O)/IRQ6 (input)
PA5 (I/O)/IRQ5 (input)
Port A
PA4 (I/O)/IRQ4 (input)
PA3 (I/O)
PA2 (I/O)
PA1 (I/O)
PA0 (I/O)
Figure 9-8 Port A Pin Functions (Mode 7)
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REJ09B0138-0600H
Mode 6 (On-Chip ROM Version Only): In mode 6, port A pins function as address outputs or input ports and interrupt
input pins. Input or output can be specified on an individual bit basis. Setting a PADDR bit to 1 makes the corresponding
port A pin an address output, while clearing the bit to 0 makes the pin an input port.
Port A pin functions in mode 6 are shown in figure 9-9.
Port A
When PADDR = 1
When PADDR = 0
A23 (output)
PA7 (input)/IRQ7 (input)
A22 (output)
PA6 (input)/IRQ6 (input)
A21 (output)
PA5 (input)/IRQ5 (input)
A20 (output)
A20 (output)
A19 (output)
A19 (output)
A18 (output)
A18 (output)
A17 (output)
A17 (output)
A16 (output)
A16 (output)
Figure 9-9 Port A Pin Functions (Mode 6)
Modes 4 and 5: In modes 4 and 5, the lower 5 bits of port A are designated as address outputs automatically, while the
upper 3 bits function as address outputs or input ports and interrupt input pins. Input or output can be specified
individually for the upper 3 bits. Setting one of bits PA7DDR to PA5DDR to 1 makes the corresponding port A pin an
address output, while clearing the bit to 0 makes the pin an input port.
Port A pin functions in modes 4 and 5 are shown in figure 9-10.
Port A
When PADDR = 1
When PADDR = 0
A23 (output)
PA7 (input)/IRQ7 (input)
A22 (output)
PA6 (input)/IRQ6 (input)
A21 (output)
PA5 (input)/IRQ5 (input)
A20 (output)
PA4 (input)/IRQ4 (input)
A19 (output)
PA3 (input)
A18 (output)
PA2 (input)
A17 (output)
PA1 (input)
A16 (output)
PA0 (input)
Figure 9-10 Port A Pin Functions (Modes 4 and 5)
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REJ09B0138-0600H
9.8.4
MOS Input Pull-Up Function (On-Chip ROM Version Only)
Port A has a on-chip MOS input pull-up function that can be controlled by software. This MOS input pull-up function can
be used by pins PA7 to PA5 in modes 4 and 5, and by all pins in modes 6 and 7. MOS input pull-up can be specified as on
or off on an individual bit basis.
When a PADDR bit is cleared to 0, setting the corresponding PAPCR bit to 1 turns on the MOS input pull-up for that pin.
The MOS input pull-up function is in the off state after a power-on reset, and in hardware standby mode. The prior state is
retained after a manual reset*, and in software standby mode.
Table 9-14 summarizes the MOS input pull-up states.
Note: * Manual reset is only supported in the H8S/2357 ZTAT.
Table 9-14 MOS Input Pull-Up States (Port A)
Modes
Power-On Hardware
Reset
Standby Mode
Manual Software
Reset* Standby Mode
OFF
ON/OFF
6, 7
PA7 to PA 0
4, 5
PA7 to PA 5
ON/OFF
PA4 to PA 0
OFF
Legend:
OFF:
MOS input pull-up is always off.
ON/OFF: On when PADDR = 0 and PAPCR = 1; otherwise off.
Note: * Manual reset is only supported in the H8S/2357 ZTAT.
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In Other
Operations
9.9
Port B
9.9.1
Overview
Port B is an 8-bit I/O port. Port B has an address bus output function, and the pin functions change according to the
operating mode.
Port B has a on-chip MOS input pull-up function that can be controlled by software (on-chip ROM version only).
Figure 9-11 shows the port B pin configuration.
Port B pins
Port B
Pin functions in mode 7*
PB7 / A15
PB7 (I/O)
PB6 / A14
PB6 (I/O)
PB5 / A13
PB5 (I/O)
PB4 / A12
PB4 (I/O)
PB3 / A11
PB3 (I/O)
PB2 / A10
PB2 (I/O)
PB1 / A9
PB1 (I/O)
PB0 / A8
PB0 (I/O)
Pin functions in mode 6*
Pin functions in modes 4 and 5
PB7 (input)/A15 (output)
A15 (output)
PB6 (input)/A14 (output)
A14 (output)
PB5 (input)/A13 (output)
A13 (output)
PB4 (input)/A12 (output)
A12 (output)
PB3 (input)/A11 (output)
A11 (output)
PB2 (input)/A10 (output)
A10 (output)
PB1 (input)/A9 (output)
A9 (output)
PB0 (input)/A8 (output)
A8 (output)
Note: * Modes 6 and 7 are provided in the on-chip ROM version only.
Figure 9-11 Port B Pin Functions
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REJ09B0138-0600H
9.9.2
Register Configuration (On-Chip ROM Version Only)
Table 9-15 shows the port B register configuration.
Table 9-15 Port B Registers
Name
Abbreviation
R/W
Initial Value
Address *
Port B data direction register
PBDDR
W
H'00
H'FEBA
Port B data register
PBDR
R/W
H'00
H'FF6A
Port B register
PORTB
R
Undefined
H'FF5A
Port B MOS pull-up control register
PBPCR
R/W
H'00
H'FF71
Note: * Lower 16 bits of the address.
Port B Data Direction Register (PBDDR) (On-Chip ROM Version Only)
Bit
:
7
6
5
4
3
2
1
0
PB7DDR PB6DDR PB5DDR PB4DDR PB3DDR PB2DDR PB1DDR PB0DDR
Initial value :
0
0
0
0
0
0
0
0
R/W
W
W
W
W
W
W
W
W
:
PBDDR is an 8-bit write-only register, the individual bits of which specify input or output for the pins of port B. PBDDR
cannot be read; if it is, an undefined value will be read.
PBDDR is initialized to H'00 by a power-on reset and in hardware standby mode. It retains its prior state after a manual
reset*, and in software standby mode. The OPE bit in SBYCR is used to select whether the address output pins retain their
output state or become high-impedance when a transition is made to software standby mode.
Note: * Manual reset is only supported in the H8S/2357 ZTAT.
• Mode 7
Setting a PBDDR bit to 1 makes the corresponding port B pin an output port, while clearing the bit to 0 makes the pin
an input port.
• Mode 6
Setting a PBDDR bit to 1 makes the corresponding port B pin an address output, while clearing the bit to 0 makes the
pin an input port.
• Modes 4 and 5
The corresponding port B pins are address outputs irrespective of the value of the PBDDR bits.
Port B Data Register (PBDR) (On-Chip ROM Version Only)
Bit
:
Initial value :
R/W
:
7
6
5
4
3
2
1
0
PB7DR
PB6DR
PB5DR
PB4DR
PB3DR
PB2DR
PB1DR
PB0DR
0
0
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
PBDR is an 8-bit readable/writable register that stores output data for the port B pins (PB7 to PB0). PBDR is initialized to
H'00 by a power-on reset, and in hardware standby mode. It retains its prior state after a manual reset*, and in software
standby mode.
Rev.6.00 Oct.28.2004 page 308 of 1016
REJ09B0138-0600H
Note: * Manual reset is only supported in the H8S/2357 ZTAT.
Port B Register (PORTB) (On-Chip ROM Version Only)
Bit
:
Initial value :
R/W
:
7
6
5
4
3
2
1
0
PB7
PB6
PB5
PB4
PB3
PB2
PB1
PB0
—*
—*
—*
—*
—*
—*
—*
—*
R
R
R
R
R
R
R
R
Note: * Determined by state of pins PB7 to PB 0.
PORTB is an 8-bit read-only register that shows the pin states. It cannot be written to. Writing of output data for the port B
pins (PB7 to PB0) must always be performed on PBDR.
If a port B read is performed while PBDDR bits are set to 1, the PBDR values are read. If a port B read is performed while
PBDDR bits are cleared to 0, the pin states are read.
After a power-on reset and in hardware standby mode, PORTB contents are determined by the pin states, as PBDDR and
PBDR are initialized. PORTB retains its prior state after a manual reset*, and in software standby mode.
Note: * Manual reset is only supported in the H8S/2357 ZTAT.
Port B MOS Pull-Up Control Register (PBPCR) (On-Chip ROM Version Only)
Bit
:
7
6
5
4
3
2
1
0
PB7PCR PB6PCR PB5PCR PB4PCR PB3PCR PB2PCR PB1PCR PB0PCR
Initial value :
R/W
:
0
0
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Note: Setting is prohibited in the H8S/2352, H8S/2394, H8S/2392, and H8S/2390.
PBPCR is an 8-bit readable/writable register that controls the MOS input pull-up function incorporated into port B on an
individual bit basis.
When a PBDDR bit is cleared to 0 (input port setting) in mode 6 or 7, setting the corresponding PBPCR bit to 1 turns on
the MOS input pull-up for the corresponding pin.
PBPCR is initialized to H'00 by a power-on reset, and in hardware standby mode. It retains its prior state after a manual
reset*, and in software standby mode.
Note: * Manual reset is only supported in the H8S/2357 ZTAT.
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REJ09B0138-0600H
9.9.3
Pin Functions
Mode 7 (On-Chip ROM Version Only): In mode 7, port B pins function as I/O ports. Input or output can be specified
for each pin on an individual bit basis. Setting a PBDDR bit to 1 makes the corresponding port B pin an output port, while
clearing the bit to 0 makes the pin an input port.
Port B pin functions in mode 7 are shown in figure 9-12.
PB7 (I/O)
PB6 (I/O)
PB5 (I/O)
Port B
PB4 (I/O)
PB3 (I/O)
PB2 (I/O)
PB1 (I/O)
PB0 (I/O)
Figure 9-12 Port B Pin Functions (Mode 7)
Mode 6 (On-Chip ROM Version Only): In mode 6, port B pins function as address outputs or input ports. Input or
output can be specified on an individual bit basis. Setting a PBDDR bit to 1 makes the corresponding port B pin an
address output, while clearing the bit to 0 makes the pin an input port.
Port B pin functions in mode 6 are shown in figure 9-13.
Port B
When PBDDR = 1
When PBDDR = 0
A15 (output)
PB7 (input)
A14 (output)
PB6 (input)
A13 (output)
PB5 (input)
A12 (output)
PB4 (input)
A11 (output)
PB3 (input)
A10 (output)
PB2 (input)
A9 (output)
PB1 (input)
A8 (output)
PB0 (input)
Figure 9-13 Port B Pin Functions (Mode 6)
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REJ09B0138-0600H
Modes 4 and 5: In modes 4 and 5, port B pins are automatically designated as address outputs.
Port B pin functions in modes 4 and 5 are shown in figure 9-14.
A15 (output)
A14 (output)
A13 (output)
Port B
A12 (output)
A11 (output)
A10 (output)
A9 (output)
A8 (output)
Figure 9-14 Port B Pin Functions (Modes 4 and 5)
9.9.4
MOS Input Pull-Up Function (On-Chip ROM Version Only)
Port B has a on-chip MOS input pull-up function that can be controlled by software. This MOS input pull-up function can
be used in modes 6 and 7, and can be specified as on or off on an individual bit basis.
When a PBDDR bit is cleared to 0 in mode 6 or 7, setting the corresponding PBPCR bit to 1 turns on the MOS input pullup for that pin.
The MOS input pull-up function is in the off state after a power-on reset, and in hardware standby mode. The prior state is
retained after a manual reset*, and in software standby mode.
Table 9-16 summarizes the MOS input pull-up states.
Note: * Manual reset is only supported in the H8S/2357 ZTAT.
Table 9-16 MOS Input Pull-Up States (Port B)
Modes
Power-On Hardware
Reset
Standby Mode
Manual Software
Reset* Standby Mode
6, 7
OFF
ON/OFF
4, 5
In Other
Operations
OFF
Legend:
OFF:
MOS input pull-up is always off.
ON/OFF: On when PBDDR = 0 and PBPCR = 1; otherwise off.
Note: * Manual reset is only supported in the H8S/2357 ZTAT.
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REJ09B0138-0600H
9.10
Port C
9.10.1
Overview
Port C is an 8-bit I/O port. Port C has an address bus output function, and the pin functions change according to the
operating mode.
Port C has a on-chip MOS input pull-up function that can be controlled by software (on-chip ROM version only).
Figure 9-15 shows the port C pin configuration.
Port C pins
Port C
Pin functions in mode 7*
PC7 / A7
PC7 (I/O)
PC6 / A6
PC6 (I/O)
PC5 / A5
PC5 (I/O)
PC4 / A4
PC4 (I/O)
PC3 / A3
PC3 (I/O)
PC2 / A2
PC2 (I/O)
PC1 / A1
PC1 (I/O)
PC0 / A0
PC0 (I/O)
Pin functions in mode 6*
Pin functions in modes 4 and 5
PC7 (input)/ A7 (output)
A7 (output)
PC6 (input)/ A6 (output)
A6 (output)
PC5 (input)/ A5 (output)
A5 (output)
PC4 (input)/ A4 (output)
A4 (output)
PC3 (input)/ A3 (output)
A3 (output)
PC2 (input)/ A2 (output)
A2 (output)
PC1 (input)/ A1 (output)
A1 (output)
PC0 (input)/ A0 (output)
A0 (output)
Note: * Modes 6 and 7 are provided in the on-chip ROM version only.
Figure 9-15 Port C Pin Functions
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REJ09B0138-0600H
9.10.2
Register Configuration (On-Chip ROM Version Only)
Table 9-17 shows the port C register configuration.
Table 9-17 Port C Registers
Name
Abbreviation
R/W
Initial Value
Address *
Port C data direction register
PCDDR
W
H'00
H'FEBB
Port C data register
PCDR
R/W
H'00
H'FF6B
Port C register
PORTC
R
Undefined
H'FF5B
Port C MOS pull-up control register
PCPCR
R/W
H'00
H'FF72
Note: * Lower 16 bits of the address.
Port C Data Direction Register (PCDDR) (On-Chip ROM Version Only)
Bit
:
7
6
5
4
3
2
1
0
PC7DDR PC6DDR PC5DDR PC4DDR PC3DDR PC2DDR PC1DDR PC0DDR
Initial value :
0
0
0
0
0
0
0
0
R/W
W
W
W
W
W
W
W
W
:
PCDDR is an 8-bit write-only register, the individual bits of which specify input or output for the pins of port C. PCDDR
cannot be read; if it is, an undefined value will be read.
PCDDR is initialized to H'00 by a power-on reset and in hardware standby mode. It retains its prior state after a manual
reset*, and in software standby mode. The OPE bit in SBYCR is used to select whether the address output pins retain their
output state or become high-impedance when a transition is made to software standby mode.
Note: * Manual reset is only supported in the H8S/2357 ZTAT.
• Mode 7
Setting a PCDDR bit to 1 makes the corresponding port C pin an output port, while clearing the bit to 0 makes the pin
an input port.
• Mode 6
Setting a PCDDR bit to 1 makes the corresponding port C pin an address output, while clearing the bit to 0 makes the
pin an input port.
• Modes 4 and 5
The corresponding port C pins are address outputs irrespective of the value of the PCDDR bits.
Port C Data Register (PCDR) (On-Chip ROM Version Only)
Bit
:
Initial value :
R/W
:
7
6
5
4
3
2
1
0
PC7DR
PC6DR
PC5DR
PC4DR
PC3DR
PC2DR
PC1DR
PC0DR
0
0
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
PCDR is an 8-bit readable/writable register that stores output data for the port C pins (PC7 to PC0).
PCDR is initialized to H'00 by a power-on reset, and in hardware standby mode. It retains its prior state after a manual
reset*, and in software standby mode.
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REJ09B0138-0600H
Note: * Manual reset is only supported in the H8S/2357 ZTAT.
Port C Register (PORTC) (On-Chip ROM Version Only)
Bit
:
Initial value :
R/W
:
7
6
5
4
3
2
1
0
PC7
PC6
PC5
PC4
PC3
PC2
PC1
PC0
—*
—*
—*
—*
—*
—*
—*
—*
R
R
R
R
R
R
R
R
Note: * Determined by state of pins PC 7 to PC0.
PORTC is an 8-bit read-only register that shows the pin states. It cannot be written to. Writing of output data for the port C
pins (PC7 to PC0) must always be performed on PCDR.
If a port C read is performed while PCDDR bits are set to 1, the PCDR values are read. If a port C read is performed while
PCDDR bits are cleared to 0, the pin states are read.
After a power-on reset and in hardware standby mode, PORTC contents are determined by the pin states, as PCDDR and
PCDR are initialized. PORTC retains its prior state after a manual reset*, and in software standby mode.
Note: * Manual reset is only supported in the H8S/2357 ZTAT.
Port C MOS Pull-Up Control Register (PCPCR) (On-Chip ROM Version Only)
Bit
:
7
6
5
4
3
2
1
0
PC7PCR PC6PCR PC5PCR PC4PCR PC3PCR PC2PCR PC1PCR PC0PCR
Initial value :
R/W
:
0
0
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Note: Setting is prohibited in the H8S/2352, H8S/2394, H8S/2392, and H8S/2390.
PCPCR is an 8-bit readable/writable register that controls the MOS input pull-up function incorporated into port C on an
individual bit basis.
When a PCDDR bit is cleared to 0 (input port setting) in mode 6 or 7, setting the corresponding PCPCR bit to 1 turns on
the MOS input pull-up for the corresponding pin.
PCPCR is initialized to H'00 by a power-on reset, and in hardware standby mode. It retains its prior state after a manual
reset*, and in software standby mode.
Note: * Manual reset is only supported in the H8S/2357 ZTAT.
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REJ09B0138-0600H
9.10.3
Pin Functions
Mode 7 (On-Chip ROM Version Only): In mode 7, port C pins function as I/O ports. Input or output can be specified
for each pin on an individual bit basis. Setting a PCDDR bit to 1 makes the corresponding port C pin an output port, while
clearing the bit to 0 makes the pin an input port.
Port C pin functions in mode 7 are shown in figure 9-16.
PC7 (I/O)
PC6 (I/O)
PC5 (I/O)
Port C
PC4 (I/O)
PC3 (I/O)
PC2 (I/O)
PC1 (I/O)
PC0 (I/O)
Figure 9-16 Port C Pin Functions (Mode 7)
Mode 6 (On-Chip ROM Version Only): In mode 6, port C pins function as address outputs or input ports. Input or
output can be specified on an individual bit basis. Setting a PCDDR bit to 1 makes the corresponding port C pin an
address output, while clearing the bit to 0 makes the pin an input port.
Port C pin functions in mode 6 are shown in figure 9-17.
Port C
When PCDDR = 1
When PCDDR = 0
A7 (output)
PC7 (input)
A6 (output)
PC6 (input)
A5 (output)
PC5 (input)
A4 (output)
PC4 (input)
A3 (output)
PC3 (input)
A2 (output)
PC2 (input)
A1 (output)
PC1 (input)
A0 (output)
PC0 (input)
Figure 9-17 Port C Pin Functions (Mode 6)
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REJ09B0138-0600H
Modes 4 and 5: In modes 4 and 5, port C pins are automatically designated as address outputs.
Port C pin functions in modes 4 and 5 are shown in figure 9-18.
A7 (output)
A6 (output)
A5 (output)
Port C
A4 (output)
A3 (output)
A2 (output)
A1 (output)
A0 (output)
Figure 9-18 Port C Pin Functions (Modes 4 and 5)
9.10.4
MOS Input Pull-Up Function (On-Chip ROM Version Only)
Port C has a on-chip MOS input pull-up function that can be controlled by software. This MOS input pull-up function can
be used in modes 6 and 7, and can be specified as on or off on an individual bit basis.
When a PCDDR bit is cleared to 0 in mode 6 or 7, setting the corresponding PCPCR bit to 1 turns on the MOS input pullup for that pin.
The MOS input pull-up function is in the off state after a power-on reset, and in hardware standby mode. The prior state is
retained after a manual reset*, and in software standby mode.
Table 9-18 summarizes the MOS input pull-up states.
Note: * Manual reset is only supported in the H8S/2357 ZTAT.
Table 9-18 MOS Input Pull-Up States (Port C)
Modes
Power-On Hardware
Reset
Standby Mode
Manual Software
Reset* Standby Mode
6, 7
OFF
ON/OFF
4, 5
Legend:
OFF:
MOS input pull-up is always off.
ON/OFF: On when PCDDR = 0 and PCPCR = 1; otherwise off.
Note: * Manual reset is only supported in the H8S/2357 ZTAT.
Rev.6.00 Oct.28.2004 page 316 of 1016
REJ09B0138-0600H
OFF
In Other
Operations
9.11
Port D
9.11.1
Overview
Port D is an 8-bit I/O port. Port D has a data bus I/O function, and the pin functions change according to the operating
mode. In the H8S/2352, port D pins are dedicated data bus pins.
Port D has a on-chip MOS input pull-up function that can be controlled by software (on-chip ROM version only).
Figure 9-19 shows the port D pin configuration.
Port D
Port D pins
Pin functions in mode 7*
PD7 / D15
PD7 (I/O)
PD6 / D14
PD6 (I/O)
PD5 / D13
PD5 (I/O)
PD4 / D12
PD4 (I/O)
PD3 / D11
PD3 (I/O)
PD2 / D10
PD2 (I/O)
PD1 / D9
PD1 (I/O)
PD0 / D8
PD0 (I/O)
Pin functions in modes 4 to 6*
D15 (I/O)
D14 (I/O)
D13 (I/O)
D12 (I/O)
D11 (I/O)
D10 (I/O)
D9 (I/O)
D8 (I/O)
Note: * Modes 6 and 7 are provided in the on-chip ROM version only.
Figure 9-19 Port D Pin Functions
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REJ09B0138-0600H
9.11.2
Register Configuration (On-Chip ROM Version Only)
Table 9-19 shows the port D register configuration.
Table 9-19 Port D Registers
Name
Abbreviation
R/W
Initial Value
Address *
Port D data direction register
PDDDR
W
H'00
H'FEBC
Port D data register
PDDR
R/W
H'00
H'FF6C
Port D register
PORTD
R
Undefined
H'FF5C
Port D MOS pull-up control register
PDPCR
R/W
H'00
H'FF73
Note: * Lower 16 bits of the address.
Port D Data Direction Register (PDDDR) (On-Chip ROM Version Only)
Bit
:
7
6
5
4
3
2
1
0
PD7DDR PD6DDR PD5DDR PD4DDR PD3DDR PD2DDR PD1DDR PD0DDR
Initial value :
0
0
0
0
0
0
0
0
R/W
W
W
W
W
W
W
W
W
:
PDDDR is an 8-bit write-only register, the individual bits of which specify input or output for the pins of port D. PDDDR
cannot be read; if it is, an undefined value will be read.
PDDDR is initialized to H'00 by a power-on reset, and in hardware standby mode. It retains its prior state after a manual
reset*, and in software standby mode.
Note: * Manual reset is only supported in the H8S/2357 ZTAT.
• Mode 7
Setting a PDDDR bit to 1 makes the corresponding port D pin an output port, while clearing the bit to 0 makes the pin
an input port.
• Modes 4 to 6
The input/output direction specification by PDDDR is ignored, and port D is automatically designated for data I/O.
Port D Data Register (PDDR) (On-Chip ROM Version Only)
Bit
:
Initial value :
R/W
:
7
6
5
4
3
2
1
0
PD7DR
PD6DR
PD5DR
PD4DR
PD3DR
PD2DR
PD1DR
PD0DR
0
0
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
PDDR is an 8-bit readable/writable register that stores output data for the port D pins (PD7 to PD 0).
PDDR is initialized to H'00 by a power-on reset, and in hardware standby mode. It retains its prior state after a manual
reset*, and in software standby mode.
Note: * Manual reset is only supported in the H8S/2357 ZTAT.
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REJ09B0138-0600H
Port D Register (PORTD) (On-Chip ROM Version Only)
Bit
:
Initial value :
R/W
:
7
6
5
4
3
2
1
0
PD7
PD6
PD5
PD4
PD3
PD2
PD1
PD0
—*
—*
—*
—*
—*
—*
—*
—*
R
R
R
R
R
R
R
R
Note: * Determined by state of pins PD 7 to PD0.
PORTD is an 8-bit read-only register that shows the pin states. It cannot be written to. Writing of output data for the port
D pins (PD7 to PD 0) must always be performed on PDDR.
If a port D read is performed while PDDDR bits are set to 1, the PDDR values are read. If a port D read is performed
while PDDDR bits are cleared to 0, the pin states are read.
After a power-on reset and in hardware standby mode, PORTD contents are determined by the pin states, as PDDDR and
PDDR are initialized. PORTD retains its prior state after a manual reset*, and in software standby mode.
Note: * Manual reset is only supported in the H8S/2357 ZTAT.
Port D MOS Pull-Up Control Register (PDPCR) (On-Chip ROM Version Only)
Bit
:
7
6
5
4
3
2
1
0
PD7PCR PD6PCR PD5PCR PD4PCR PD3PCR PD2PCR PD1PCR PD0PCR
Initial value :
R/W
:
0
0
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Note: Setting is prohibited in the H8S/2352, H8S/2394, H8S/2392, and H8S/2390.
PDPCR is an 8-bit readable/writable register that controls the MOS input pull-up function incorporated into port D on an
individual bit basis.
When a PDDDR bit is cleared to 0 (input port setting) in mode 7, setting the corresponding PDPCR bit to 1 turns on the
MOS input pull-up for the corresponding pin.
PDPCR is initialized to H'00 by a power-on reset, and in hardware standby mode. It retains its prior state after a manual
reset*, and in software standby mode.
Note: * Manual reset is only supported in the H8S/2357 ZTAT.
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REJ09B0138-0600H
9.11.3
Pin Functions
Modes 7 (On-Chip ROM Version Only): In mode 7, port D pins function as I/O ports. Input or output can be specified
for each pin on an individual bit basis. Setting a PDDDR bit to 1 makes the corresponding port D pin an output port, while
clearing the bit to 0 makes the pin an input port.
Port D pin functions in mode 7 are shown in figure 9-20.
PD7 (I/O)
PD6 (I/O)
PD5 (I/O)
Port D
PD4 (I/O)
PD3 (I/O)
PD2 (I/O)
PD1 (I/O)
PD0 (I/O)
Figure 9-20 Port D Pin Functions (Mode 7)
Modes 4 to 6*: In modes 4 to 6, port D pins are automatically designated as data I/O pins.
Port D pin functions in modes 4 to 6 are shown in figure 9-21.
Note: * Mode 6 is provided in the on-chip ROM version only.
D15 (I/O)
D14 (I/O)
D13 (I/O)
Port D
D12 (I/O)
D11 (I/O)
D10 (I/O)
D9 (I/O)
D8 (I/O)
Figure 9-21 Port D Pin Functions (Modes 4 to 6)
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REJ09B0138-0600H
9.11.4
MOS Input Pull-Up Function (On-Chip ROM Version Only)
Port D has a on-chip MOS input pull-up function that can be controlled by software. This MOS input pull-up function can
be used in mode 7, and can be specified as on or off on an individual bit basis.
When a PDDDR bit is cleared to 0 in mode 7, setting the corresponding PDPCR bit to 1 turns on the MOS input pull-up
for that pin.
The MOS input pull-up function is in the off state after a power-on reset, and in hardware standby mode. The prior state is
retained after a manual reset*, and in software standby mode.
Table 9-20 summarizes the MOS input pull-up states.
Note: * Manual reset is only supported in the H8S/2357 ZTAT.
Table 9-20 MOS Input Pull-Up States (Port D)
Modes
Power-On Hardware
Reset
Standby Mode
Manual Software
Reset* Standby Mode
7
OFF
ON/OFF
4 to 6
In Other
Operations
OFF
Legend:
OFF:
MOS input pull-up is always off.
ON/OFF: On when PDDDR = 0 and PDPCR = 1; otherwise off.
Note: * Manual reset is only supported in the H8S/2357 ZTAT.
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REJ09B0138-0600H
9.12
Port E
9.12.1
Overview
Port E is an 8-bit I/O port. Port E has a data bus I/O function, and the pin functions change according to the operating
mode and whether 8-bit or 16-bit bus mode is selected.
Port E has a on-chip MOS input pull-up function that can be controlled by software (on-chip ROM version only).
Figure 9-22 shows the port E pin configuration.
Port E
Port E pins
Pin functions in mode 7*
PE7 / D7
PE7 (I/O)
PE6 / D6
PE6 (I/O)
PE5 / D5
PE5 (I/O)
PE4 / D4
PE4 (I/O)
PE3 / D3
PE3 (I/O)
PE2 / D2
PE2 (I/O)
PE1 / D1
PE1 (I/O)
PE0 / D0
PE0 (I/O)
Pin functions in modes 4 to 6*
PE7 (I/O)/ D7 (I/O)
PE6 (I/O)/ D6 (I/O)
PE5 (I/O)/ D5 (I/O)
PE4 (I/O)/ D4 (I/O)
PE3 (I/O)/ D3 (I/O)
PE2 (I/O)/ D2 (I/O)
PE1 (I/O)/ D1 (I/O)
PE0 (I/O)/ D0 (I/O)
Note: * Modes 6 and 7 are provided in the on-chip ROM version only.
Figure 9-22 Port E Pin Functions
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REJ09B0138-0600H
9.12.2
Register Configuration
Table 9-21 shows the port E register configuration.
Table 9-21 Port E Registers
Name
Abbreviation
R/W
Initial Value
Address* 1
Port E data direction register
PEDDR
W
H'00
H'FEBD
Port E data register
PEDR
R/W
H'00
H'FF6D
Port E register
PORTE
R
Undefined
H'FF5D
Port E MOS pull-up control register* 2
PEPCR
R/W
H'00
H'FF74
2
1
Notes: 1. Lower 16 bits of the address.
2. PEPCR settings are prohibited in the ROMless version.
Port E Data Direction Register (PEDDR)
Bit
:
7
6
5
4
3
0
PE7DDR PE6DDR PE5DDR PE4DDR PE3DDR PE2DDR PE1DDR PE0DDR
Initial value :
0
0
0
0
0
0
0
0
R/W
W
W
W
W
W
W
W
W
:
PEDDR is an 8-bit write-only register, the individual bits of which specify input or output for the pins of port E. PEDDR
cannot be read; if it is, an undefined value will be read.
PEDDR is initialized to H'00 by a power-on reset, and in hardware standby mode. It retains its prior state after a manual
reset*, and in software standby mode.
Note: * Manual reset is only supported in the H8S/2357 ZTAT.
• Mode 7*
Setting a PEDDR bit to 1 makes the corresponding port E pin an output port, while clearing the bit to 0 makes the pin
an input port.
Note: * Modes 6 and 7 are provided in the on-chip ROM version only.
• Modes 4 to 6*
When 8-bit bus mode has been selected, port E pins function as I/O ports. Setting a PEDDR bit to 1 makes the
corresponding port E pin an output port, while clearing the bit to 0 makes the pin an input port.
When 16-bit bus mode has been selected, the input/output direction specification by PEDDR is ignored, and port E is
designated for data I/O.
For details of 8-bit and 16-bit bus modes, see section 6, Bus Controller.
Port E Data Register (PEDR)
Bit
:
Initial value :
R/W
:
7
6
5
4
3
2
1
0
PE7DR
PE6DR
PE5DR
PE4DR
PE3DR
PE2DR
PE1DR
PE0DR
0
0
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
PEDR is an 8-bit readable/writable register that stores output data for the port E pins (PE7 to PE0).
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REJ09B0138-0600H
PEDR is initialized to H'00 by a power-on reset, and in hardware standby mode. It retains its prior state after a manual
reset*, and in software standby mode.
Note: * Manual reset is only supported in the H8S/2357 ZTAT.
Port E Register (PORTE)
Bit
:
Initial value :
R/W
:
7
6
5
4
3
2
1
0
PE7
PE6
PE5
PE4
PE3
PE2
PE1
PE0
—*
—*
—*
—*
—*
—*
—*
—*
R
R
R
R
R
R
R
R
Note: * Determined by state of pins PE 7 to PE 0.
PORTE is an 8-bit read-only register that shows the pin states. It cannot be written to. Writing of output data for the port E
pins (PE7 to PE0) must always be performed on PEDR.
If a port E read is performed while PEDDR bits are set to 1, the PEDR values are read. If a port E read is performed while
PEDDR bits are cleared to 0, the pin states are read.
After a power-on reset and in hardware standby mode, PORTE contents are determined by the pin states, as PEDDR and
PEDR are initialized. PORTE retains its prior state after a manual reset*, and in software standby mode.
Note: * Manual reset is only supported in the H8S/2357 ZTAT.
Port E MOS Pull-Up Control Register (PEPCR) (On-Chip ROM Version Only)
Bit
:
7
6
5
4
3
2
1
0
PE7PCR PE6PCR PE5PCR PE4PCR PE3PCR PE2PCR PE1PCR PE0PCR
Initial value :
R/W
:
0
0
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Note: Setting is prohibited in the H8S/2352, H8S/2394, H8S/2392, and H8S/2390.
PEPCR is an 8-bit readable/writable register that controls the MOS input pull-up function incorporated into port E on an
individual bit basis.
When a PEDDR bit is cleared to 0 (input port setting) when 8-bit bus mode is selected in mode 4, 5, or 6, or in mode 7,
setting the corresponding PEPCR bit to 1 turns on the MOS input pull-up for the corresponding pin.
PEPCR is initialized to H'00 by a power-on reset, and in hardware standby mode. It retains its prior state after a manual
reset*, and in software standby mode.
Note: * Manual reset is only supported in the H8S/2357 ZTAT.
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9.12.3
Pin Functions
Mode 7*: In mode 7, port E pins function as I/O ports. Input or output can be specified for each pin on a bit-by-bit basis.
Setting a PEDDR bit to 1 makes the corresponding port E pin an output port, while clearing the bit to 0 makes the pin an
input port.
Note: * Modes 6 and 7 are provided in the on-chip ROM version only.
Port E pin functions in mode 7 are shown in figure 9-23.
PE7 (I/O)
PE6 (I/O)
PE5 (I/O)
Port E
PE4 (I/O)
PE3 (I/O)
PE2 (I/O)
PE1 (I/O)
PE0 (I/O)
Figure 9-23 Port E Pin Functions (Mode 7)
Modes 4 to 6*: In modes 4 to 6, when 8-bit access is designated and 8-bit bus mode is selected, port E pins are
automatically designated as I/O ports. Setting a PEDDR bit to 1 makes the corresponding port E pin an output port, while
clearing the bit to 0 makes the pin an input port.
When 16-bit bus mode is selected, the input/output direction specification by PEDDR is ignored, and port E is designated
for data I/O.
Port E pin functions in modes 4 to 6 are shown in figure 9-24.
Note: * Modes 6 and 7 are provided in the on-chip ROM version only.
Port E
8-bit bus mode
16-bit bus mode
PE7 (I/O)
D7 (I/O)
PE6 (I/O)
D6 (I/O)
PE5 (I/O)
D5 (I/O)
PE4 (I/O)
D4 (I/O)
PE3 (I/O)
D3 (I/O)
PE2 (I/O)
D2 (I/O)
PE1 (I/O)
D1 (I/O)
PE0 (I/O)
D0 (I/O)
Figure 9-24 Port E Pin Functions (Modes 4 to 6)
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9.12.4
MOS Input Pull-Up Function (On-Chip ROM Version Only)
Port E has a on-chip MOS input pull-up function that can be controlled by software. This MOS input pull-up function can
be used in modes 4 to 6 when 8-bit bus mode is selected, or in mode 7, and can be specified as on or off on an individual
bit basis.
When a PEDDR bit is cleared to 0 in mode 4, 5, or 6 when 8-bit bus mode is selected, or in mode 7, setting the
corresponding PEPCR bit to 1 turns on the MOS input pull-up for that pin.
The MOS input pull-up function is in the off state after a power-on reset, and in hardware standby mode. The prior state is
retained after a manual reset*, and in software standby mode.
Table 9-22 summarizes the MOS input pull-up states.
Note: * Manual reset is only supported in the H8S/2357 ZTAT.
Table 9-22 MOS Input Pull-Up States (Port E)
Modes
Power-On Hardware
Reset
Standby Mode
Manual Software
Reset* Standby Mode
7
OFF
ON/OFF
4 to 6
8-bit bus
16-bit bus
Legend:
OFF:
MOS input pull-up is always off.
ON/OFF: On when PEDDR = 0 and PEPCR = 1; otherwise off.
Note: * Manual reset is only supported in the H8S/2357 ZTAT.
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OFF
In Other
Operations
9.13
Port F
9.13.1
Overview
Port F is an 8-bit I/O port. Port F pins also function as bus control signal input/output pins (AS, RD, HWR, LWR, LCAS,
WAIT, BREQO, BREQ, and BACK) and the system clock (ø) output pin.
Figure 9-25 shows the port F pin configuration.
Port F
Port F pins
Pin functions in mode 7*
PF7 / ø
PF7 (input)/ ø (output)
PF6 / AS
PF6 (I/O)
PF5 / RD
PF5 (I/O)
PF4 / HWR
PF4 (I/O)
PF3 / LWR
PF3 (I/O)
PF2 / LCAS/ WAIT / BREQO
PF2 (I/O)
PF1 / BACK
PF1 (I/O)
PF0 / BREQ
PF0 (I/O)
Pin functions in modes 4 to 6*
PF7 (input) / ø (output)
AS (output)
RD (output)
HWR (output)
LWR (output)
PF2 (I/O)/ LCAS (output) / WAIT (input) / BREQO (output)
PF1 (I/O)/ BACK (output)
PF0 (I/O)/ BREQ (input)
Note: * Modes 6 and 7 are provided in the on-chip ROM version only.
Figure 9-25 Port F Pin Functions
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REJ09B0138-0600H
9.13.2
Register Configuration
Table 9-23 shows the port F register configuration.
Table 9-23 Port F Registers
Name
Abbreviation
R/W
Initial Value
Address * 1
Port F data direction register
PFDDR
W
H'80/H'00* 2
H'FEBE
Port F data register
PFDR
R/W
H'00
H'FF6E
Port F register
PORTF
R
Undefined
H'FF5E
Notes: 1. Lower 16 bits of the address.
2. Initial value depends on the mode.
Port F Data Direction Register (PFDDR)
Bit
:
7
6
5
4
3
2
1
0
PF7DDR PF6DDR PF5DDR PF4DDR PF3DDR PF2DDR PF1DDR PF0DDR
Mode 7
Initial value :
0
0
0
0
0
0
0
0
R/W
:
W
W
W
W
W
W
W
W
Initial value :
1
0
0
0
0
0
0
0
R/W
W
W
W
W
W
W
W
W
Modes 4 to 6
:
PFDDR is an 8-bit write-only register, the individual bits of which specify input or output for the pins of port F. PFDDR
cannot be read; if it is, an undefined value will be read.
PFDDR is initialized by a power-on reset, and in hardware standby mode, to H'80 in modes 4 to 6, and to H'00 in mode 7.
It retains its prior state after a manual reset*, and in software standby mode. The OPE bit in SBYCR is used to select
whether the bus control output pins retain their output state or become high-impedance when a transition is made to
software standby mode.
Note: * Manual reset is only supported in the H8S/2357 ZTAT.
• Mode 7*
Setting a PFDDR bit to 1 makes the corresponding port F pin PF6 to PF0 an output port, or in the case of pin PF7, the ø
output pin. Clearing the bit to 0 makes the pin an input port.
Note: * Modes 6 and 7 are provided in the on-chip ROM version only.
• Modes 4 to 6*
Pin PF7 functions as the ø output pin when the corresponding PFDDR bit is set to 1, and as an input port when the bit is
cleared to 0.
The input/output direction specified by PFDDR is ignored for pins PF6 to PF3, which are automatically designated as
bus control outputs (AS, RD, HWR, and LWR).
Pins PF2 to PF0 are designated as bus control input/output pins (LCAS, WAIT, BREQO, BACK, and BREQ) by means
of bus controller settings. At other times, setting a PFDDR bit to 1 makes the corresponding port F pin an output port,
while clearing the bit to 0 makes the pin an input port.
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Port F Data Register (PFDR)
Bit
:
Initial value :
R/W
:
7
6
5
4
3
2
1
0
PF7DR
PF6DR
PF5DR
PF4DR
PF3DR
PF2DR
PF1DR
PF0DR
0
0
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
PFDR is an 8-bit readable/writable register that stores output data for the port F pins (PF7 to PF0).
PFDR is initialized to H'00 by a power-on reset, and in hardware standby mode. It retains its prior state after a manual
reset*, and in software standby mode.
Note: * Manual reset is only supported in the H8S/2357 ZTAT.
Port F Register (PORTF)
Bit
:
Initial value :
R/W
:
7
6
5
4
3
2
1
0
PF7
PF6
PF5
PF4
PF3
PF2
PF1
PF0
—*
—*
—*
—*
—*
—*
—*
—*
R
R
R
R
R
R
R
R
Note: * Determined by state of pins PF 7 to PF0.
PORTF is an 8-bit read-only register that shows the pin states. Writing of output data for the port F pins (PF7 to PF0) must
always be performed on PFDR.
If a port F read is performed while PFDDR bits are set to 1, the PFDR values are read. If a port F read is performed while
PFDDR bits are cleared to 0, the pin states are read.
After a power-on reset and in hardware standby mode, PORTF contents are determined by the pin states, as PFDDR and
PFDR are initialized. PORTF retains its prior state after a manual reset*, and in software standby mode.
Note: * Manual reset is only supported in the H8S/2357 ZTAT.
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REJ09B0138-0600H
9.13.3
Pin Functions
Port F pins also function as bus control signal input/output pins (AS, RD, HWR, LWR, LCAS, WAIT, BREQO, BREQ,
and BACK) and the system clock (ø) output pin. The pin functions differ between modes 4 to 6, and mode 7. Port F pin
functions are shown in table 9-24.
Table 9-24 Port F Pin Functions
Pin
Selection Method and Pin Functions
PF 7/ø
The pin function is switched as shown below according to bit PF7DDR.
PF7DDR
Pin function
PF 6/AS
0
1
PF 7 input pin
ø output pin
The pin function is switched as shown below according to the operating mode
and bit PF6DDR.
Operating
Mode
Modes 4 to 6*
PF6DDR
—
0
1
AS output pin
PF 6 input pin
PF 6 output pin
Pin function
Mode 7*
Note: * Modes 6 and 7 are provided in the on-chip ROM version only.
PF 5/RD
The pin function is switched as shown below according to the operating mode
and bit PF5DDR.
Operating
Mode
Modes 4 to 6*
PF5DDR
—
0
1
RD output pin
PF 5 input pin
PF 5 output pin
Pin function
Mode 7*
Note: * Modes 6 and 7 are provided in the on-chip ROM version only.
PF 4/HWR
The pin function is switched as shown below according to the operating mode
and bit PF4DDR.
Operating
Mode
Modes 4 to 6*
PF4DDR
—
0
1
HWR output pin
PF 4 input pin
PF 4 output pin
Pin function
Mode 7*
Note: * Modes 6 and 7 are provided in the on-chip ROM version only.
PF 3/LWR
The pin function is switched as shown below according to the operating mode
and bit PF3DDR.
Operating
Mode
PF3DDR
Pin function
Modes 4 to 6*
Mode 7*
—
0
1
LWR output pin
PF 3 input pin
PF 3 output pin
Note: * Modes 6 and 7 are provided in the on-chip ROM version only.
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REJ09B0138-0600H
Pin
Selection Method and Pin Functions
PF 2/LCAS/WAIT/
BREQO
The pin function is switched as shown below according to the combination of
the operating mode, and bits RMTS2 to RMTS0, LCASS, BREQOE, WAITE,
ABW5 to ABW2, and PF2DDR.
Operating
Mode
Modes 4 to 6* 2
LCASS
0* 1
BREQOE
—
1
—
0
WAITE
—
PF2DDR
—
0
1
LCAS
output
pin
PF 2
input
pin
PF 2
output
pin
Pin function
Mode 7* 2
0
1
1
—
—
—
—
—
WAIT BREQO
input output
pin
pin
0
1
PF 2
input
pin
PF 2
output
pin
Note: 1. Only in DRAM space 16-bit access in modes 4 to 6 when RMTS2 to
RMTS0 = B'001 to B'011.
2. Modes 6 and 7 are provided in the on-chip ROM version only.
PF 1/BACK
The pin function is switched as shown below according to the combination of
the operating mode, and bits BRLE and PF1DDR.
Operating
Mode
Modes 4 to 6*
BRLE
0
PF1DDR
Pin function
Mode 7*
1
—
0
1
—
0
1
PF 1
input pin
PF 1
output pin
BACK
output pin
PF 1
input pin
PF 1
output pin
Note: * Modes 6 and 7 are provided in the on-chip ROM version only.
PF 0/BREQ
The pin function is switched as shown below according to the combination of
the operating mode, and bits BRLE and PF0DDR.
Operating
Mode
Modes 4 to 6*
BRLE
0
PF0DDR
Pin function
Mode 7*
1
—
0
1
—
0
1
PF 0
input pin
PF 0
output pin
BREQ
input pin
PF 0
input pin
PF 0
output pin
Note: * Modes 6 and 7 are provided in the on-chip ROM version only.
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REJ09B0138-0600H
9.14
Port G
9.14.1
Overview
Port G is a 5-bit I/O port. Port G pins also function as bus control signal output pins (CS0 to CS3, and CAS).
Figure 9-26 shows the port G pin configuration.
Port G
Port G pins
Pin functions in mode 7*
Pin functions in modes 4 to 6*
PG4 / CS0
PG4 (I/O)
PG4 (input)/CS0 (output)
PG3 / CS1
PG3 (I/O)
PG3 (input)/CS1 (output)
PG2 / CS2
PG2 (I/O)
PG2 (input)/CS2 (output)
PG1 / CS3
PG1 (I/O)
PG1 (input)/CS3 (output)
PG0 / CAS
PG0 (I/O)
PG0 (I/O)/CAS (output)
Note: * Modes 6 and 7 are provided in the on-chip ROM version only.
Figure 9-26 Port G Pin Functions
9.14.2
Register Configuration
Table 9-25 shows the port G register configuration.
Table 9-25 Port G Registers
Name
Abbreviation
R/W
Initial Value* 2
Address* 1
Port G data direction register
PGDDR
W
H'10/H'00* 3
H'FEBF
Port G data register
PGDR
R/W
H'00
H'FF6F
Port G register
PORTG
R
Undefined
H'FF5F
Notes: 1. Lower 16 bits of the address.
2. Value of bits 4 to 0.
3. Initial value depends on the mode.
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Port G Data Direction Register (PGDDR)
Bit
:
7
6
5
—
—
—
4
3
2
1
0
PG4DDR PG3DDR PG2DDR PG1DDR PG0DDR
Modes 6, 7
Initial value : Undefined Undefined Undefined
0
0
0
0
0
R/W
W
W
W
W
W
Initial value : Undefined Undefined Undefined
1
0
0
0
0
R/W
W
W
W
W
W
:
—
—
—
Modes 4, 5
:
—
—
—
PGDDR is an 8-bit write-only register, the individual bits of which specify input or output for the pins of port G. PGDDR
cannot be read, and bits 7 to 5 are reserved. If PGDDR is read, an undefined value will be read.
The PG4DDR bit is initialized by a power-on reset and in hardware standby mode, to 1 in modes 4 and 5, and to 0 in
modes 6 and 7. It retains its prior state after a manual reset* and in software standby mode. The OPE bit in SBYCR is
used to select whether the bus control output pins retain their output state or become high-impedance when a transition is
made to software standby mode.
Note: * Manual reset is only supported in the H8S/2357 ZTAT.
• Mode 7*
Setting a PGDDR bit to 1 makes the corresponding port G pin an output port, while clearing the bit to 0 makes the pin
an input port.
• Modes 4 to 6*
Pins PG 4 to PG 1 function as bus control output pins (CS0 to CS3) when the corresponding PGDDR bits are set to 1,
and as input ports when the bits are cleared to 0.
Pin PG 0 functions as the CAS output pin when DRAM interface is designated. Otherwise, setting the corresponding
PGDDR bit to 1 makes the pin an output port, while clearing the bit to 0 makes the pin an input port. For details of the
DRAM interfaces, see section 6, Bus Controller.
Note: * Modes 6 and 7 are provided in the on-chip ROM version only.
Port G Data Register (PGDR)
Bit
:
7
6
5
4
3
2
1
0
—
—
—
PG4DR
PG3DR
PG2DR
PG1DR
PG0DR
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
Initial value : Undefined Undefined Undefined
R/W
:
—
—
—
PGDR is an 8-bit readable/writable register that stores output data for the port G pins (PG4 to PG 0).
Bits 7 to 5 are reserved; they return an undetermined value if read, and cannot be modified.
PGDR is initialized to H'00 (bits 4 to 0) by a power-on reset, and in hardware standby mode. It retains its prior state after a
manual reset*, and in software standby mode.
Note: * Manual reset is only supported in the H8S/2357 ZTAT.
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REJ09B0138-0600H
Port G Register (PORTG)
Bit
:
7
6
5
4
3
2
1
0
—
—
—
PG4
PG3
PG2
PG1
PG0
—*
—*
—*
—*
—*
R
R
R
R
R
Initial value : Undefined Undefined Undefined
R/W
:
—
—
—
Note: * Determined by state of pins PG4 to PG 0.
PORTG is an 8-bit read-only register that shows the pin states. It cannot be written to. Writing of output data for the port
G pins (PG4 to PG 0) must always be performed on PGDR.
Bits 7 to 5 are reserved; they return an undetermined value if read, and cannot be modified.
If a port G read is performed while PGDDR bits are set to 1, the PGDR values are read. If a port G read is performed
while PGDDR bits are cleared to 0, the pin states are read.
After a power-on reset and in hardware standby mode, PORTG contents are determined by the pin states, as PGDDR and
PGDR are initialized. PORTG retains its prior state after a manual reset*, and in software standby mode.
Note: * Manual reset is only supported in the H8S/2357 ZTAT.
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REJ09B0138-0600H
9.14.3
Pin Functions
Port G pins also function as bus control signal output pins (CS0 to CS3, and CAS). The pin functions are different in mode
7, and modes 4 to 6. Port G pin functions are shown in table 9-26.
Table 9-26 Port G Pin Functions
Pin
Selection Method and Pin Functions
PG4/CS0
The pin function is switched as shown below according to the operating mode
and bit PG4DDR.
Operating
Mode
Mode 7*
PG4DDR
Pin function
0
Modes 4 to 6*
1
0
1
PG4 input pin PG4 output pin PG4 input pin CS0 output pin
Note: * Modes 6 and 7 are provided in the on-chip ROM version only.
PG3/CS1
The pin function is switched as shown below according to the operating mode
and bit PG3DDR.
Operating
Mode
Mode 7*
PG3DDR
Pin function
0
Modes 4 to 6*
1
0
1
PG3 input pin PG3 output pin PG3 input pin CS1 output pin
Note: * Modes 6 and 7 are provided in the on-chip ROM version only.
PG2/CS2
The pin function is switched as shown below according to the operating mode
and bit PG2DDR.
Operating
Mode
Mode 7*
PG2DDR
Pin function
0
Modes 4 to 6*
1
0
1
PG2 input pin PG2 output pin PG2 input pin CS2 output pin
Note: * Modes 6 and 7 are provided in the on-chip ROM version only.
PG1/CS3
The pin function is switched as shown below according to the operating mode
and bit PG1DDR.
Operating
Mode
Mode 7*
PG1DDR
Pin function
0
Modes 4 to 6*
1
0
1
PG1 input pin PG1 output pin PG1 input pin CS3 output pin
Note: * Modes 6 and 7 are provided in the on-chip ROM version only.
PG0/CAS
The pin function is switched as shown below according to the combination of
the operating mode and bits RMTS2 to RMTS0 and PG0DDR.
Operating
Mode
Mode 7*
RMTS2 to
RMTS0
PG0DDR
Pin function
Modes 4 to 6*
—
B'000,
B'100 to B'111
B'001 to
B'011
0
1
0
1
—
PG0
input
pin
PG0
output
pin
PG0
input
pin
PG0
output
pin
CAS
output
Note: * Modes 6 and 7 are provided in the on-chip ROM version only.
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REJ09B0138-0600H
Section 10 16-Bit Timer Pulse Unit (TPU)
10.1
Overview
The H8S/2357 Group has an on-chip 16-bit timer pulse unit (TPU) that comprises six 16-bit timer channels.
10.1.1
Features
• Maximum 16-pulse input/output
 A total of 16 timer general registers (TGRs) are provided (four each for channels 0 and 3, and two each for
channels 1, 2, 4, and 5), each of which can be set independently as an output compare/input capture register
 TGRC and TGRD for channels 0 and 3 can also be used as buffer registers
• Selection of 8 counter input clocks for each channel
• The following operations can be set for each channel:
 Waveform output at compare match: Selection of 0, 1, or toggle output
 Input capture function: Selection of rising edge, falling edge, or both edge detection
 Counter clear operation: Counter clearing possible by compare match or input capture
 Synchronous operation: Multiple timer counters (TCNT) can be written to simultaneously. Simultaneous clearing
by compare match and input capture possible. Register simultaneous input/output possible by counter synchronous
operation
 PWM mode: Any PWM output duty can be set. Maximum of 15-phase PWM output possible by combination with
synchronous operation
• Buffer operation settable for channels 0 and 3
 Input capture register double-buffering possible
 Automatic rewriting of output compare register possible
• Phase counting mode settable independently for each of channels 1, 2, 4, and 5
 Two-phase encoder pulse up/down-count possible
• Cascaded operation
 Channel 2 (channel 5) input clock operates as 32-bit counter by setting channel 1 (channel 4) overflow/underflow
• Fast access via internal 16-bit bus
 Fast access is possible via a 16-bit bus interface
• 26 interrupt sources
 For channels 0 and 3, four compare match/input capture dual-function interrupts and one overflow interrupt can be
requested independently
 For channels 1, 2, 4, and 5, two compare match/input capture dual-function interrupts, one overflow interrupt, and
one underflow interrupt can be requested independently
• Automatic transfer of register data
 Block transfer, 1-word data transfer, and 1-byte data transfer possible by data transfer controller (DTC) or DMA
controller (DMAC) activation
• Programmable pulse generator (PPG) output trigger can be generated
 Channel 0 to 3 compare match/input capture signals can be used as PPG output trigger
Rev.6.00 Oct.28.2004 page 337 of 1016
REJ09B0138-0600H
• A/D converter conversion start trigger can be generated
 Channel 0 to 5 compare match A/input capture A signals can be used as A/D converter conversion start trigger
• Module stop mode can be set
 As the initial setting, TPU operation is halted. Register access is enabled by exiting module stop mode.
Table 10-1 lists the functions of the TPU.
Rev.6.00 Oct.28.2004 page 338 of 1016
REJ09B0138-0600H
Table 10-1 TPU Functions
Item
Channel 0 Channel 1 Channel 2 Channel 3 Channel 4 Channel 5
Count clock
ø/1
ø/4
ø/16
ø/64
TCLKA
TCLKB
TCLKC
TCLKD
ø/1
ø/4
ø/16
ø/64
ø/256
TCLKA
TCLKB
ø/1
ø/4
ø/16
ø/64
ø/1024
TCLKA
TCLKB
TCLKC
ø/1
ø/4
ø/16
ø/64
ø/256
ø/1024
ø/4096
TCLKA
ø/1
ø/4
ø/16
ø/64
ø/1024
TCLKA
TCLKC
ø/1
ø/4
ø/16
ø/64
ø/256
TCLKA
TCLKC
TCLKD
General registers
TGR0A
TGR0B
TGR1A
TGR1B
TGR2A
TGR2B
TGR3A
TGR3B
TGR4A
TGR4B
TGR5A
TGR5B
General registers/
buffer registers
TGR0C
TGR0D
—
—
TGR3C
TGR3D
—
—
I/O pins
TIOCA0
TIOCB0
TIOCC0
TIOCD0
TIOCA1
TIOCB1
TIOCA2
TIOCB2
TIOCA3
TIOCB3
TIOCC3
TIOCD3
TIOCA4
TIOCB4
TIOCA5
TIOCB5
Counter clear
function
TGR
compare
match or
input
capture
TGR
compare
match or
input
capture
TGR
compare
match or
input
capture
TGR
compare
match or
input
capture
TGR
compare
match or
input
capture
TGR
compare
match or
input
capture
—
—
Compare 0 output
match
1 output
output
Toggle
output
Input capture
function
Synchronous
operation
PWM mode
Phase counting
mode
Buffer operation
—
—
—
—
Rev.6.00 Oct.28.2004 page 339 of 1016
REJ09B0138-0600H
Item
Channel 0
Channel 1
Channel 2
Channel 3
Channel 4
Channel 5
DMAC
TGR0A
activation compare
match or
input capture
TGR1A
compare
match or
input capture
TGR2A
compare
match or
input capture
TGR3A
compare
match or
input capture
TGR4A
compare
match or
input capture
TGR5A
compare
match or
input capture
DTC
TGR
activation compare
match or
input capture
TGR
compare
match or
input capture
TGR
compare
match or
input capture
TGR
compare
match or
input capture
TGR
compare
match or
input capture
TGR
compare
match or
input capture
A/D
TGR0A
converter compare
trigger
match or
input capture
TGR1A
compare
match or
input capture
TGR2A
compare
match or
input capture
TGR3A
compare
match or
input capture
TGR4A
compare
match or
input capture
TGR5A
compare
match or
input capture
PPG
trigger
TGR0A/
TGR0B
compare
match or
input capture
TGR1A/
TGR1B
compare
match or
input capture
TGR2A/
TGR2B
compare
match or
input capture
—
TGR3A/
TGR3B
compare
match or
input capture
Interrupt
sources
5 sources
4 sources
4 sources
5 sources
—
4 sources
4 sources
•
Compare •
match or
input
capture 0A
Compare •
match or
input
capture 1A
Compare •
match or
input
capture 2A
Compare •
match or
input
capture 3A
Compare •
match or
input
capture 4A
Compare
match or
input
capture 5A
•
Compare •
match or
input
capture 0B
Compare •
match or
input
capture 1B
Compare •
match or
input
capture 2B
Compare •
match or
input
capture 3B
Compare •
match or
input
capture 4B
Compare
match or
input
capture 5B
•
Compare •
match or •
input
capture 0C
Overflow •
Overflow
•
Underflow
Compare •
match or •
input
capture 3C
Overflow
Underflow •
•
Compare
match or
input
capture 0D
•
Compare
match or
input
capture 3D
•
Overflow
•
Overflow
Legend:
: Possible
— : Not possible
Rev.6.00 Oct.28.2004 page 340 of 1016
REJ09B0138-0600H
•
Underflow •
Overflow
Underflow
10.1.2
Block Diagram
TGRD
TGRB
TGRC
TGRB
Interrupt request signals
Channel 3: TGI3A
TGI3B
TGI3C
TGI3D
TCI3V
Channel 4: TGI4A
TGI4B
TCI4V
TCI4U
Channel 5: TGI5A
TGI5B
TCI5V
TCI5U
Internal data bus
A/D conversion start request signal
TGRD
PPG output trigger signal
TGRC
TGRB
TGRB
TGRB
TCNT
TCNT
TGRA
TCNT
TGRA
TGRA
Bus interface
TGRB
TCNT
TCNT
TGRA
TCNT
Module data bus
TGRA
TGRA
TSR
TIER
TSR
TSR
TIER
TSR
TIER
TSR
TSTR TSYR
TIER
TSR
TIER
TIOR
TIOR
TIORH TIORL
TIOR
TIOR
TIER
TMDR
TIORH TIORL
TCR
TMDR
Channel 4
TCR
TMDR
Channel 5
TCR
Common
Control logic
TMDR
Channel 0
TCR
TMDR
Channel 1
TCR
TMDR
Channel 2
TCR
Input/output pins
TIOCA0
Channel 0:
TIOCB0
TIOCC0
TIOCD0
TIOCA1
Channel 1:
TIOCB1
TIOCA2
Channel 2:
TIOCB2
Control logic for channels 3 to 5
Clock input
Internal clock: ø/1
ø/4
ø/16
ø/64
ø/256
ø/1024
ø/4096
External clock: TCLKA
TCLKB
TCLKC
TCLKD
Control logic for channels 0 to 2
Input/output pins
Channel 3:
TIOCA3
TIOCB3
TIOCC3
TIOCD3
TIOCA4
Channel 4:
TIOCB4
TIOCA5
Channel 5:
TIOCB5
Channel 3
Figure 10-1 shows a block diagram of the TPU.
Interrupt request signals
Channel 0: TGI0A
TGI0B
TGI0C
TGI0D
TCI0V
Channel 1: TGI1A
TGI1B
TCI1V
TCI1U
Channel 2: TGI2A
TGI2B
TCI2V
TCI2U
Figure 10-1 Block Diagram of TPU
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REJ09B0138-0600H
10.1.3
Pin Configuration
Table 10-2 summarizes the TPU pins.
Table 10-2 TPU Pins
Channel
Name
Symbol
I/O
Function
All
Clock input A
TCLKA
Input
External clock A input pin
(Channel 1 and 5 phase counting mode A
phase inputs)
Clock input B
TCLKB
Input
External clock B input pin
(Channel 1 and 5 phase counting mode B
phase inputs)
Clock input C
TCLKC
Input
External clock C input pin
(Channel 2 and 4 phase counting mode A
phase inputs)
Clock input D
TCLKD
Input
External clock D input pin
(Channel 2 and 4 phase counting mode B
phase inputs)
Input capture/out TIOCA0
compare match A0
I/O
TGR0A input capture input/output compare
output/PWM output pin
Input capture/out TIOCB0
compare match B0
I/O
TGR0B input capture input/output compare
output/PWM output pin
Input capture/out TIOCC0
compare match C0
I/O
TGR0C input capture input/output compare
output/PWM output pin
Input capture/out TIOCD0
compare match D0
I/O
TGR0D input capture input/output compare
output/PWM output pin
Input capture/out TIOCA1
compare match A1
I/O
TGR1A input capture input/output compare
output/PWM output pin
Input capture/out TIOCB1
compare match B1
I/O
TGR1B input capture input/output compare
output/PWM output pin
Input capture/out TIOCA2
compare match A2
I/O
TGR2A input capture input/output compare
output/PWM output pin
Input capture/out TIOCB2
compare match B2
I/O
TGR2B input capture input/output compare
output/PWM output pin
Input capture/out TIOCA3
compare match A3
I/O
TGR3A input capture input/output compare
output/PWM output pin
Input capture/out TIOCB3
compare match B3
I/O
TGR3B input capture input/output compare
output/PWM output pin
Input capture/out TIOCC3
compare match C3
I/O
TGR3C input capture input/output compare
output/PWM output pin
Input capture/out TIOCD3
compare match D3
I/O
TGR3D input capture input/output compare
output/PWM output pin
Input capture/out TIOCA4
compare match A4
I/O
TGR4A input capture input/output compare
output/PWM output pin
Input capture/out TIOCB4
compare match B4
I/O
TGR4B input capture input/output compare
output/PWM output pin
Input capture/out TIOCA5
compare match A5
I/O
TGR5A input capture input/output compare
output/PWM output pin
Input capture/out TIOCB5
compare match B5
I/O
TGR5B input capture input/output compare
output/PWM output pin
0
1
2
3
4
5
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10.1.4
Register Configuration
Table 10-3 summarizes the TPU registers.
Table 10-3 TPU Registers
Channel Name
Abbreviation
R/W
Initial Value
Address * 1
0
Timer control register 0
TCR0
R/W
H'00
H'FFD0
Timer mode register 0
TMDR0
R/W
H'C0
H'FFD1
Timer I/O control register 0H
TIOR0H
R/W
H'00
H'FFD2
Timer I/O control register 0L
TIOR0L
R/W
H'00
H'FFD3
H'40
H'FFD4
H'C0
H'FFD5
Timer interrupt enable register 0 TIER0
1
2
R/W
2
Timer status register 0
TSR0
R/(W)*
Timer counter 0
TCNT0
R/W
H'0000
H'FFD6
Timer general register 0A
TGR0A
R/W
H'FFFF
H'FFD8
Timer general register 0B
TGR0B
R/W
H'FFFF
H'FFDA
Timer general register 0C
TGR0C
R/W
H'FFFF
H'FFDC
Timer general register 0D
TGR0D
R/W
H'FFFF
H'FFDE
Timer control register 1
TCR1
R/W
H'00
H'FFE0
Timer mode register 1
TMDR1
R/W
H'C0
H'FFE1
Timer I/O control register 1
TIOR1
R/W
H'00
H'FFE2
Timer interrupt enable register 1 TIER1
R/W
H'40
H'FFE4
2
Timer status register 1
TSR1
R/(W) * H'C0
H'FFE5
Timer counter 1
TCNT1
R/W
H'0000
H'FFE6
Timer general register 1A
TGR1A
R/W
H'FFFF
H'FFE8
Timer general register 1B
TGR1B
R/W
H'FFFF
H'FFEA
Timer control register 2
TCR2
R/W
H'00
H'FFF0
Timer mode register 2
TMDR2
R/W
H'C0
H'FFF1
Timer I/O control register 2
TIOR2
R/W
H'00
H'FFF2
Timer interrupt enable register 2 TIER2
R/W
H'40
H'FFF4
2
Timer status register 2
TSR2
R/(W) * H'C0
H'FFF5
Timer counter 2
TCNT2
R/W
H'0000
H'FFF6
Timer general register 2A
TGR2A
R/W
H'FFFF
H'FFF8
Timer general register 2B
TGR2B
R/W
H'FFFF
H'FFFA
Rev.6.00 Oct.28.2004 page 343 of 1016
REJ09B0138-0600H
Channel Name
Abbreviation
R/W
Initial Value
Address* 1
3
Timer control register 3
TCR3
R/W
H'00
H'FE80
Timer mode register 3
TMDR3
R/W
H'C0
H'FE81
Timer I/O control register 3H
TIOR3H
R/W
H'00
H'FE82
Timer I/O control register 3L
TIOR3L
R/W
H'00
H'FE83
H'40
H'FE84
H'C0
H'FE85
Timer interrupt enable register 3 TIER3
4
5
All
R/W
2
Timer status register 3
TSR3
R/(W)*
Timer counter 3
TCNT3
R/W
H'0000
H'FE86
Timer general register 3A
TGR3A
R/W
H'FFFF
H'FE88
Timer general register 3B
TGR3B
R/W
H'FFFF
H'FE8A
Timer general register 3C
TGR3C
R/W
H'FFFF
H'FE8C
Timer general register 3D
TGR3D
R/W
H'FFFF
H'FE8E
Timer control register 4
TCR4
R/W
H'00
H'FE90
Timer mode register 4
TMDR4
R/W
H'C0
H'FE91
Timer I/O control register 4
TIOR4
R/W
H'00
H'FE92
Timer interrupt enable register 4 TIER4
R/W
H'40
H'FE94
2
Timer status register 4
TSR4
R/(W) * H'C0
H'FE95
Timer counter 4
TCNT4
R/W
H'0000
H'FE96
Timer general register 4A
TGR4A
R/W
H'FFFF
H'FE98
Timer general register 4B
TGR4B
R/W
H'FFFF
H'FE9A
Timer control register 5
TCR5
R/W
H'00
H'FEA0
Timer mode register 5
TMDR5
R/W
H'C0
H'FEA1
Timer I/O control register 5
TIOR5
R/W
H'00
H'FEA2
Timer interrupt enable register 5 TIER5
R/W
H'40
H'FEA4
2
Timer status register 5
TSR5
R/(W) * H'C0
H'FEA5
Timer counter 5
TCNT5
R/W
H'0000
H'FEA6
Timer general register 5A
TGR5A
R/W
H'FFFF
H'FEA8
Timer general register 5B
TGR5B
R/W
H'FFFF
H'FEAA
Timer start register
TSTR
R/W
H'00
H'FFC0
Timer synchro register
TSYR
R/W
H'00
H'FFC1
Module stop control register
MSTPCR
R/W
H'3FFF
H'FF3C
Notes: 1. Lower 16 bits of the address.
2. Can only be written with 0 for flag clearing.
Rev.6.00 Oct.28.2004 page 344 of 1016
REJ09B0138-0600H
10.2
Register Descriptions
10.2.1
Timer Control Register (TCR)
Channel 0: TCR0
Channel 3: TCR3
Bit
:
7
6
5
4
3
2
1
0
CCLR2
CCLR1
CCLR0
CKEG1
CKEG0
TPSC2
TPSC1
TPSC0
0
0
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
7
6
5
4
3
2
1
0
—
CCLR1
CCLR0
CKEG1
CKEG0
TPSC2
TPSC1
TPSC0
Initial value :
0
0
0
0
0
0
0
0
R/W
—
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Initial value :
R/W
:
Channel 1: TCR1
Channel 2: TCR2
Channel 4: TCR4
Channel 5: TCR5
Bit
:
:
The TCR registers are 8-bit registers that control the TCNT channels. The TPU has six TCR registers, one for each of
channels 0 to 5. The TCR registers are initialized to H'00 by a reset, and in hardware standby mode.
TCR register settings should be made only when TCNT operation is stopped.
Rev.6.00 Oct.28.2004 page 345 of 1016
REJ09B0138-0600H
Bits 7 to 5—Counter Clear 2, 1, and 0 (CCLR2, CCLR1, CCLR0): These bits select the TCNT counter clearing
source.
Channel
Bit 7
CCLR2
Bit 6
CCLR1
Bit 5
CCLR0
Description
0, 3
0
0
0
TCNT clearing disabled
1
TCNT cleared by TGRA compare match/input
capture
0
TCNT cleared by TGRB compare match/input
capture
1
TCNT cleared by counter clearing for another
channel performing synchronous clearing/
synchronous operation * 1
0
TCNT clearing disabled
1
TCNT cleared by TGRC compare match/input
capture * 2
0
TCNT cleared by TGRD compare match/input
capture * 2
1
TCNT cleared by counter clearing for another
channel performing synchronous clearing/
synchronous operation * 1
1
1
0
1
(Initial value)
Channel
Bit 6
Bit 7
Reserved* 3 CCLR1
Bit 5
CCLR0
Description
1, 2, 4, 5
0
0
TCNT clearing disabled
1
TCNT cleared by TGRA compare match/input
capture
0
TCNT cleared by TGRB compare match/input
capture
1
TCNT cleared by counter clearing for another
channel performing synchronous clearing/
synchronous operation * 1
0
1
(Initial value)
Notes: 1. Synchronous operation setting is performed by setting the SYNC bit in TSYR to 1.
2. When TGRC or TGRD is used as a buffer register, TCNT is not cleared because the buffer register setting has
priority, and compare match/input capture does not occur.
3. Bit 7 is reserved in channels 1, 2, 4, and 5. It is always read as 0 and cannot be modified.
Rev.6.00 Oct.28.2004 page 346 of 1016
REJ09B0138-0600H
Bits 4 and 3—Clock Edge 1 and 0 (CKEG1, CKEG0): These bits select the input clock edge. When the input clock is
counted using both edges, the input clock period is halved (e.g. ø/4 both edges = ø/2 rising edge). If phase counting mode
is used on channels 1, 2, 4, and 5, this setting is ignored and the phase counting mode setting has priority.
Bit 4
CKEG1
Bit 3
CKEG0
Description
0
0
Count at rising edge
1
Count at falling edge
—
Count at both edges
1
(Initial value)
Note: Internal clock edge selection is valid when the input clock is ø/4 or slower. This setting is ignored if the input clock is
ø/1, or when overflow/underflow of another channel is selected.
Bits 2 to 0—Time Prescaler 2 to 0 (TPSC2 to TPSC0): These bits select the TCNT counter clock. The clock source can
be selected independently for each channel. Table 10-4 shows the clock sources that can be set for each channel.
Table 10-4 TPU Clock Sources
Internal Clock
Channel
ø/1
ø/4
External Clock
ø/16 ø/64 ø/256 ø/1024 ø/4096
Overflow/
Underflow
on Another
TCLKA TCLKB TCLKC TCLKD Channel
0
1
2
3
4
5
Legend:
:
Setting
Blank: No setting
Channel
Bit 2
TPSC2
Bit 1
TPSC1
Bit 0
TPSC0
Description
0
0
0
0
Internal clock: counts on ø/1
1
Internal clock: counts on ø/4
0
Internal clock: counts on ø/16
1
Internal clock: counts on ø/64
0
External clock: counts on TCLKA pin input
1
External clock: counts on TCLKB pin input
0
External clock: counts on TCLKC pin input
1
External clock: counts on TCLKD pin input
1
1
0
1
(Initial value)
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REJ09B0138-0600H
Channel
Bit 2
TPSC2
Bit 1
TPSC1
Bit 0
TPSC0
Description
1
0
0
0
Internal clock: counts on ø/1
1
Internal clock: counts on ø/4
0
Internal clock: counts on ø/16
1
Internal clock: counts on ø/64
0
External clock: counts on TCLKA pin input
1
External clock: counts on TCLKB pin input
0
Internal clock: counts on ø/256
1
Counts on TCNT2 overflow/underflow
1
1
0
1
(Initial value)
Note: This setting is ignored when channel 1 is in phase counting mode.
Channel
Bit 2
TPSC2
Bit 1
TPSC1
Bit 0
TPSC0
Description
2
0
0
0
Internal clock: counts on ø/1
1
Internal clock: counts on ø/4
0
Internal clock: counts on ø/16
1
Internal clock: counts on ø/64
0
External clock: counts on TCLKA pin input
1
External clock: counts on TCLKB pin input
0
External clock: counts on TCLKC pin input
1
Internal clock: counts on ø/1024
1
1
0
1
(Initial value)
Note: This setting is ignored when channel 2 is in phase counting mode.
Channel
Bit 2
TPSC2
Bit 1
TPSC1
Bit 0
TPSC0
Description
3
0
0
0
Internal clock: counts on ø/1
1
Internal clock: counts on ø/4
0
Internal clock: counts on ø/16
1
Internal clock: counts on ø/64
0
External clock: counts on TCLKA pin input
1
Internal clock: counts on ø/1024
0
Internal clock: counts on ø/256
1
Internal clock: counts on ø/4096
1
1
0
1
Rev.6.00 Oct.28.2004 page 348 of 1016
REJ09B0138-0600H
(Initial value)
Channel
Bit 2
TPSC2
Bit 1
TPSC1
Bit 0
TPSC0
Description
4
0
0
0
Internal clock: counts on ø/1
1
Internal clock: counts on ø/4
0
Internal clock: counts on ø/16
1
Internal clock: counts on ø/64
0
External clock: counts on TCLKA pin input
1
External clock: counts on TCLKC pin input
0
Internal clock: counts on ø/1024
1
Counts on TCNT5 overflow/underflow
1
1
0
1
(Initial value)
Note: This setting is ignored when channel 4 is in phase counting mode.
Channel
Bit 2
TPSC2
Bit 1
TPSC1
Bit 0
TPSC0
Description
5
0
0
0
Internal clock: counts on ø/1
1
Internal clock: counts on ø/4
0
Internal clock: counts on ø/16
1
Internal clock: counts on ø/64
0
External clock: counts on TCLKA pin input
1
External clock: counts on TCLKC pin input
0
Internal clock: counts on ø/256
1
External clock: counts on TCLKD pin input
1
1
0
1
(Initial value)
Note: This setting is ignored when channel 5 is in phase counting mode.
10.2.2
Timer Mode Register (TMDR)
Channel 0: TMDR0
Channel 3: TMDR3
Bit
:
7
6
5
4
3
2
1
0
—
—
BFB
BFA
MD3
MD2
MD1
MD0
Initial value :
1
1
0
0
0
0
0
0
R/W
—
—
R/W
R/W
R/W
R/W
R/W
R/W
7
6
5
4
3
2
1
0
—
—
—
—
MD3
MD2
MD1
MD0
:
Channel 1: TMDR1
Channel 2: TMDR2
Channel 4: TMDR4
Channel 5: TMDR5
Bit
:
Initial value :
1
1
0
0
0
0
0
0
R/W
—
—
—
—
R/W
R/W
R/W
R/W
:
Rev.6.00 Oct.28.2004 page 349 of 1016
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The TMDR registers are 8-bit readable/writable registers that are used to set the operating mode for each channel. The
TPU has six TMDR registers, one for each channel. The TMDR registers are initialized to H'C0 by a reset, and in
hardware standby mode.
TMDR register settings should be made only when TCNT operation is stopped.
Bits 7 and 6—Reserved: These bits cannot be modified and are always read as 1.
Bit 5—Buffer Operation B (BFB): Specifies whether TGRB is to operate in the normal way, or TGRB and TGRD are to
be used together for buffer operation. When TGRD is used as a buffer register, TGRD input capture/output compare is not
generated.
In channels 1, 2, 4, and 5, which have no TGRD, bit 5 is reserved. It is always read as 0 and cannot be modified.
Bit 5
BFB
Description
0
TGRB operates normally
1
TGRB and TGRD used together for buffer operation
(Initial value)
Bit 4—Buffer Operation A (BFA): Specifies whether TGRA is to operate in the normal way, or TGRA and TGRC are to
be used together for buffer operation. When TGRC is used as a buffer register, TGRC input capture/output compare is not
generated.
In channels 1, 2, 4, and 5, which have no TGRC, bit 4 is reserved. It is always read as 0 and cannot be modified.
Bit 4
BFA
Description
0
TGRA operates normally
1
TGRA and TGRC used together for buffer operation
(Initial value)
Bits 3 to 0—Modes 3 to 0 (MD3 to MD0): These bits are used to set the timer operating mode.
Bit 3
MD3* 1
Bit 2
MD2* 2
Bit 1
MD1
Bit 0
MD0
Description
0
0
0
0
Normal operation
1
Reserved
0
PWM mode 1
1
PWM mode 2
0
Phase counting mode 1
1
Phase counting mode 2
0
Phase counting mode 3
1
Phase counting mode 4
×
—
1
1
0
1
1
×
×
(Initial value)
×: Don’t care
Notes: 1. MD3 is a reserved bit. In a write, it should always be written with 0.
2. Phase counting mode cannot be set for channels 0 and 3. In this case, 0 should always be written to MD2.
Rev.6.00 Oct.28.2004 page 350 of 1016
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10.2.3
Timer I/O Control Register (TIOR)
Channel 0: TIOR0H
Channel 1: TIOR1
Channel 2: TIOR2
Channel 3: TIOR3H
Channel 4: TIOR4
Channel 5: TIOR5
Bit
:
Initial value :
R/W
:
7
6
5
4
3
2
1
0
IOB3
IOB2
IOB1
IOB0
IOA3
IOA2
IOA1
IOA0
0
0
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
7
6
5
4
3
2
1
0
IOD3
IOD2
IOD1
IOD0
IOC3
IOC2
IOC1
IOC0
Channel 0: TIOR0L
Channel 3: TIOR3L
Bit
:
Initial value :
R/W
:
0
0
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Note: When TGRC or TGRD is designated for buffer operation, this setting is invalid and the register operates as a buffer
register.
The TIOR registers are 8-bit registers that control the TGR registers. The TPU has eight TIOR registers, two each for
channels 0 and 3, and one each for channels 1, 2, 4, and 5. The TIOR registers are initialized to H'00 by a reset, and in
hardware standby mode.
Care is required since TIOR is affected by the TMDR setting. The initial output specified by TIOR is valid when the
counter is stopped (the CST bit in TSTR is cleared to 0). Note also that, in PWM mode 2, the output at the point at which
the counter is cleared to 0 is specified.
Rev.6.00 Oct.28.2004 page 351 of 1016
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Bits 7 to 4— I/O Control B3 to B0 (IOB3 to IOB0)
I/O Control D3 to D0 (IOD3 to IOD0):
Bits IOB3 to IOB0 specify the function of TGRB.
Bits IOD3 to IOD0 specify the function of TGRD.
Channel
Bit 7 Bit 6 Bit 5 Bit 4
IOB3 IOB2 IOB1 IOB0 Description
0
0
0
0
0
1
1
0
TGR0B is Output disabled
output
Initial output is 0
compare output
register
0
1
0
Output disabled
1
Initial output is 1
output
0
1
1
0
0
0
1
1
Note:
*
1
×
×
×
0 output at compare match
1 output at compare match
Toggle output at compare
match
1
1
(Initial value)
0 output at compare match
1 output at compare match
Toggle output at compare
match
TGR0B is Capture input
source is
input
TIOCB0 pin
capture
register
Input capture at rising edge
Input capture at falling edge
Input capture at both edges
Capture input
Input capture at TCNT1
source is channel count- up/count-down*
1/count clock
×: Don’t care
When bits TPSC2 to TPSC0 in TCR1 are set to B'000 and ø/1 is used as the TCNT1 count clock, this setting is
invalid and input capture is not generated.
Rev.6.00 Oct.28.2004 page 352 of 1016
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Channel
Bit 7 Bit 6 Bit 5 Bit 4
IOD3 IOD2 IOD1 IOD0 Description
0
0
0
0
0
1
1
0
TGR0D is Output disabled
output
Initial output is 0
compare output
2
register*
0
0
Output disabled
1
1
0
Initial output is 1
output
1
1
0
0
0
1
1
1
×
×
×
0 output at compare match
1 output at compare match
Toggle output at compare
match
1
1
(Initial value)
0 output at compare match
1 output at compare match
Toggle output at compare
match
TGR0D is Capture input
source is
input
TIOCD0 pin
capture
register* 2
Input capture at rising edge
Input capture at falling edge
Input capture at both edges
Capture input
Input capture at TCNT1
source is channel count-up/count-down* 1
1/count clock
×: Don’t care
Notes: 1. When bits TPSC2 to TPSC0 in TCR1 are set to B'000 and ø/1 is used as the TCNT1 count clock, this setting is
invalid and input capture is not generated.
2. When the BFB bit in TMDR0 is set to 1 and TGR0D is used as a buffer register, this setting is invalid and input
capture/output compare is not generated.
Channel
Bit 7 Bit 6 Bit 5 Bit 4
IOB3 IOB2 IOB1 IOB0 Description
1
0
0
0
0
1
1
0
TGR1B is Output disabled
output
Initial output is 0
compare output
register
0
1
0
Output disabled
1
Initial output is 1
output
0
1
1
0
0
0
1
1
1
×
×
×
0 output at compare match
1 output at compare match
Toggle output at compare
match
1
1
(Initial value)
0 output at compare match
1 output at compare match
Toggle output at compare
match
TGR1B is Capture input
source is
input
TIOCB1 pin
capture
register
Input capture at rising edge
Input capture at falling edge
Input capture at both edges
Input capture at generation of
Capture input
source is TGR0C TGR0C compare match/input
compare match/ capture
input capture
×: Don’t care
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Channel
Bit 7 Bit 6 Bit 5 Bit 4
IOB3 IOB2 IOB1 IOB0 Description
2
0
0
0
0
1
1
0
TGR2B is Output disabled
output
Initial output is 0
compare output
register
0
1
0
Output disabled
1
Initial output is 1
output
0
1
1
×
0
0
1
1
×
0 output at compare match
1 output at compare match
Toggle output at compare
match
1
1
(Initial value)
0 output at compare match
1 output at compare match
Toggle output at compare
match
TGR2B is Capture input
source is
input
TIOCB2 pin
capture
register
Input capture at rising edge
Input capture at falling edge
Input capture at both edges
×: Don’t care
Channel
Bit 7 Bit 6 Bit 5 Bit 4
IOB3 IOB2 IOB1 IOB0 Description
3
0
0
0
0
1
1
0
TGR3B is Output disabled
output
Initial output is 0
compare output
register
0
1
0
Output disabled
1
Initial output is 1
output
0
1
1
0
0
0
1
1
Note:
*
1
×
×
×
0 output at compare match
1 output at compare match
Toggle output at compare
match
1
1
(Initial value)
0 output at compare match
1 output at compare match
Toggle output at compare
match
TGR3B is Capture input
source is
input
TIOCB3 pin
capture
register
Input capture at rising edge
Input capture at falling edge
Input capture at both edges
Capture input
Input capture at TCNT4
source is channel count-up/count-down*
4/count clock
×: Don’t care
When bits TPSC2 to TPSC0 in TCR4 are set to B'000 and ø/1 is used as the TCNT4 count clock, this setting is
invalid and input capture is not generated.
Rev.6.00 Oct.28.2004 page 354 of 1016
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Channel
Bit 7 Bit 6 Bit 5 Bit 4
IOD3 IOD2 IOD1 IOD0 Description
3
0
0
0
0
1
1
0
TGR3D is Output disabled
output
Initial output is 0
compare output
2
register*
0
0
Output disabled
1
1
0
Initial output is 1
output
1
1
0
0
0
1
1
1
×
×
×
0 output at compare match
1 output at compare match
Toggle output at compare
match
1
1
(Initial value)
0 output at compare match
1 output at compare match
Toggle output at compare
match
TGR3D is Capture input
source is
input
TIOCD3 pin
capture
register* 2
Input capture at rising edge
Input capture at falling edge
Input capture at both edges
Capture input
Input capture at TCNT4
source is channel count-up/count-down* 1
4/count clock
×: Don’t care
Notes: 1. When bits TPSC2 to TPSC0 in TCR4 are set to B'000 and ø/1 is used as the TCNT4 count clock, this setting is
invalid and input capture is not generated.
2. When the BFB bit in TMDR3 is set to 1 and TGR3D is used as a buffer register, this setting is invalid and input
capture/output compare is not generated.
Rev.6.00 Oct.28.2004 page 355 of 1016
REJ09B0138-0600H
Channel
Bit 7 Bit 6 Bit 5 Bit 4
IOB3 IOB2 IOB1 IOB0 Description
4
0
0
0
0
1
1
0
TGR4B is Output disabled
output
Initial output is 0
compare output
register
0
1
0
Output disabled
1
Initial output is 1
output
0
1
1
0
0
0
1
1
1
×
×
×
1 output at compare match
Toggle output at compare
match
1
1
(Initial value)
0 output at compare match
0 output at compare match
1 output at compare match
Toggle output at compare
match
TGR4B is Capture input
source is
input
TIOCB4 pin
capture
register
Input capture at rising edge
Input capture at falling edge
Input capture at both edges
Input capture at generation of
Capture input
source is TGR3C TGR3C compare match/
compare match/ input capture
input capture
×: Don’t care
Channel
Bit 7 Bit 6 Bit 5 Bit 4
IOB3 IOB2 IOB1 IOB0 Description
5
0
0
0
0
1
1
0
TGR5B is Output disabled
output
Initial output is 0
compare output
register
0
1
0
Output disabled
1
Initial output is 1
output
0
1
1
×
0
0
1
1
×
0 output at compare match
1 output at compare match
Toggle output at compare
match
1
1
(Initial value)
0 output at compare match
1 output at compare match
Toggle output at compare
match
TGR5B is Capture input
source is
input
TIOCB5 pin
capture
register
Input capture at rising edge
Input capture at falling edge
Input capture at both edges
×: Don’t care
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Bits 3 to 0— I/O Control A3 to A0 (IOA3 to IOA0)
I/O Control C3 to C0 (IOC3 to IOC0):
IOA3 to IOA0 specify the function of TGRA.
IOC3 to IOC0 specify the function of TGRC.
Channel
Bit 3 Bit 2 Bit 1 Bit 0
IOA3 IOA2 IOA1 IOA0 Description
0
0
0
0
0
1
1
0
TGR0A is Output disabled
output
Initial output is 0
compare output
register
0
1
0
Output disabled
1
Initial output is 1
output
0
1
1
0
0
0
1
1
1
×
×
×
0 output at compare match
1 output at compare match
Toggle output at compare
match
1
1
(Initial value)
0 output at compare match
1 output at compare match
Toggle output at compare
match
TGR0A is Capture input
source is
input
TIOCA0 pin
capture
register
Input capture at rising edge
Input capture at falling edge
Input capture at both edges
Capture input
Input capture at TCNT1
source is channel count-up/count-down
1/ count clock
×: Don’t care
Channel
Bit 3 Bit 2 Bit 1 Bit 0
IOC3 IOC2 IOC1 IOC0 Description
0
0
0
0
0
1
1
0
TGR0C is Output disabled
output
Initial output is 0
compare output
1
register*
0
1
0
Output disabled
1
Initial output is 1
output
0
1
1
0
0
0
1
1
Note:
*
1
×
×
×
0 output at compare match
1 output at compare match
Toggle output at compare
match
1
1
(Initial value)
0 output at compare match
1 output at compare match
Toggle output at compare
match
TGR0C is Capture input
source is
input
TIOCC0 pin
capture
register*
Input capture at rising edge
Input capture at falling edge
Input capture at both edges
Capture input
Input capture at TCNT1
source is channel count-up/count-down
1/count clock
×: Don’t care
When the BFA bit in TMDR0 is set to 1 and TGR0C is used as a buffer register, this setting is invalid and input
capture/output compare is not generated.
Rev.6.00 Oct.28.2004 page 357 of 1016
REJ09B0138-0600H
Channel
Bit 3 Bit 2 Bit 1 Bit 0
IOA3 IOA2 IOA1 IOA0 Description
1
0
0
0
0
1
1
0
TGR1A is Output disabled
output
Initial output is 0
compare output
register
0
1
0
Output disabled
1
Initial output is 1
output
0
1
1
0
0
0
1
1
1
×
×
×
0 output at compare match
1 output at compare match
Toggle output at compare
match
1
1
(Initial value)
0 output at compare match
1 output at compare match
Toggle output at compare
match
TGR1A is Capture input
source is
input
TIOCA1 pin
capture
register
Input capture at rising edge
Input capture at falling edge
Input capture at both edges
Input capture at generation of
Capture input
source is TGR0A channel 0/TGR0A compare
compare match/ match/input capture
input capture
×: Don’t care
Channel
Bit 3 Bit 2 Bit 1 Bit 0
IOA3 IOA2 IOA1 IOA0 Description
2
0
0
0
0
1
1
0
TGR2A is Output disabled
output
Initial output is 0
compare output
register
0
1
0
Output disabled
1
Initial output is 1
output
0
1
1
×
0
0
1
1
×
0 output at compare match
1 output at compare match
Toggle output at compare
match
1
1
(Initial value)
0 output at compare match
1 output at compare match
Toggle output at compare
match
TGR2A is Capture input
source is
input
TIOCA2 pin
capture
register
Input capture at rising edge
Input capture at falling edge
Input capture at both edges
×: Don’t care
Rev.6.00 Oct.28.2004 page 358 of 1016
REJ09B0138-0600H
Channel
Bit 3 Bit 2 Bit 1 Bit 0
IOA3 IOA2 IOA1 IOA0 Description
3
0
0
0
0
1
1
0
TGR3A is Output disabled
output
Initial output is 0
compare output
register
0
1
0
Output disabled
1
Initial output is 1
output
0
1
1
0
0
0
1
1
1
×
×
×
0 output at compare match
1 output at compare match
Toggle output at compare
match
1
1
(Initial value)
0 output at compare match
1 output at compare match
Toggle output at compare
match
TGR3A is Capture input
source is
input
TIOCA3 pin
capture
register
Input capture at rising edge
Input capture at falling edge
Input capture at both edges
Capture input
Input capture at TCNT4
source is channel count-up/count-down
4/count clock
×: Don’t care
Channel
Bit 3 Bit 2 Bit 1 Bit 0
IOC3 IOC2 IOC1 IOC0 Description
3
0
0
0
0
1
1
0
TGR3C is Output disabled
output
Initial output is 0
compare output
register* 1
0
1
0
Output disabled
1
Initial output is 1
output
0
1
1
0
0
0
1
1
Note:
*
1
×
×
×
0 output at compare match
1 output at compare match
Toggle output at compare
match
1
1
(Initial value)
0 output at compare match
1 output at compare match
Toggle output at compare
match
TGR3C is Capture input
source is
input
TIOCC3 pin
capture
register*
Input capture at rising edge
Input capture at falling edge
Input capture at both edges
Capture input
Input capture at TCNT4
source is channel count-up/count-down
4/count clock
×: Don’t care
When the BFA bit in TMDR3 is set to 1 and TGR3C is used as a buffer register, this setting is invalid and input
capture/output compare is not generated.
Rev.6.00 Oct.28.2004 page 359 of 1016
REJ09B0138-0600H
Channel
Bit 3 Bit 2 Bit 1 Bit 0
IOA3 IOA2 IOA1 IOA0 Description
4
0
0
0
0
1
1
0
TGR4A is Output disabled
output
Initial output is 0
compare output
register
0
0
Output disabled
1
1
0
Initial output is 1
output
1
1
0
0
0
1
1
1
×
×
×
1 output at compare match
Toggle output at compare
match
1
1
(Initial value)
0 output at compare match
0 output at compare match
1 output at compare match
Toggle output at compare
match
TGR4A is Capture input
source is
input
TIOCA4 pin
capture
register
Input capture at rising edge
Input capture at falling edge
Input capture at both edges
Input capture at generation of
Capture input
source is TGR3A TGR3A compare match/input
compare match/ capture
input capture
×: Don’t care
Channel
Bit 3 Bit 2 Bit 1 Bit 0
IOA3 IOA2 IOA1 IOA0 Description
5
0
0
0
0
1
1
0
TGR5A is Output disabled
output
Initial output is 0
compare output
register
0
1
0
Output disabled
1
Initial output is 1
output
0
1
1
×
0
0
1
1
×
0 output at compare match
1 output at compare match
Toggle output at compare
match
1
1
(Initial value)
0 output at compare match
1 output at compare match
Toggle output at compare
match
TGR5A is Capture input
source is
input
TIOCA5 pin
capture
register
Input capture at rising edge
Input capture at falling edge
Input capture at both edges
×: Don’t care
Rev.6.00 Oct.28.2004 page 360 of 1016
REJ09B0138-0600H
10.2.4
Timer Interrupt Enable Register (TIER)
Channel 0: TIER0
Channel 3: TIER3
Bit
:
7
6
5
4
3
2
1
0
TTGE
—
—
TCIEV
TGIED
TGIEC
TGIEB
TGIEA
0
1
0
0
0
0
0
0
R/W
—
—
R/W
R/W
R/W
R/W
R/W
7
6
5
4
3
2
1
0
TTGE
—
TCIEU
TCIEV
—
—
TGIEB
TGIEA
0
1
0
0
0
0
0
0
R/W
—
R/W
R/W
—
—
R/W
R/W
Initial value :
R/W
:
Channel 1: TIER1
Channel 2: TIER2
Channel 4: TIER4
Channel 5: TIER5
Bit
:
Initial value :
R/W
:
The TIER registers are 8-bit registers that control enabling or disabling of interrupt requests for each channel. The TPU
has six TIER registers, one for each channel. The TIER registers are initialized to H'40 by a reset, and in hardware standby
mode.
Bit 7—A/D Conversion Start Request Enable (TTGE): Enables or disables generation of A/D conversion start requests
by TGRA input capture/compare match.
Bit 7
TTGE
Description
0
A/D conversion start request generation disabled
1
A/D conversion start request generation enabled
(Initial value)
Bit 6—Reserved: This bit cannot be modified and is always read as 1.
Bit 5—Underflow Interrupt Enable (TCIEU): Enables or disables interrupt requests (TCIU) by the TCFU flag when
the TCFU flag in TSR is set to 1 in channels 1 and 2.
In channels 0 and 3, bit 5 is reserved. It is always read as 0 and cannot be modified.
Bit 5
TCIEU
Description
0
Interrupt requests (TCIU) by TCFU disabled
1
Interrupt requests (TCIU) by TCFU enabled
(Initial value)
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Bit 4—Overflow Interrupt Enable (TCIEV): Enables or disables interrupt requests (TCIV) by the TCFV flag when the
TCFV flag in TSR is set to 1.
Bit 4
TCIEV
Description
0
Interrupt requests (TCIV) by TCFV disabled
1
Interrupt requests (TCIV) by TCFV enabled
(Initial value)
Bit 3—TGR Interrupt Enable D (TGIED): Enables or disables interrupt requests (TGID) by the TGFD bit when the
TGFD bit in TSR is set to 1 in channels 0 and 3.
In channels 1, 2, 4, and 5, bit 3 is reserved. It is always read as 0 and cannot be modified.
Bit 3
TGIED
Description
0
Interrupt requests (TGID) by TGFD bit disabled
1
Interrupt requests (TGID) by TGFD bit enabled
(Initial value)
Bit 2—TGR Interrupt Enable C (TGIEC): Enables or disables interrupt requests (TGIC) by the TGFC bit when the
TGFC bit in TSR is set to 1 in channels 0 and 3.
In channels 1, 2, 4, and 5, bit 2 is reserved. It is always read as 0 and cannot be modified.
Bit 2
TGIEC
Description
0
Interrupt requests (TGIC) by TGFC bit disabled
1
Interrupt requests (TGIC) by TGFC bit enabled
(Initial value)
Bit 1—TGR Interrupt Enable B (TGIEB): Enables or disables interrupt requests (TGIB) by the TGFB bit when the
TGFB bit in TSR is set to 1.
Bit 1
TGIEB
Description
0
Interrupt requests (TGIB) by TGFB bit disabled
1
Interrupt requests (TGIB) by TGFB bit enabled
(Initial value)
Bit 0—TGR Interrupt Enable A (TGIEA): Enables or disables interrupt requests (TGIA) by the TGFA bit when the
TGFA bit in TSR is set to 1.
Bit 0
TGIEA
Description
0
Interrupt requests (TGIA) by TGFA bit disabled
1
Interrupt requests (TGIA) by TGFA bit enabled
Rev.6.00 Oct.28.2004 page 362 of 1016
REJ09B0138-0600H
(Initial value)
10.2.5
Timer Status Register (TSR)
Channel 0: TSR0
Channel 3: TSR3
Bit
:
7
6
5
4
3
2
1
0
—
—
—
TCFV
TGFD
TGFC
TGFB
TGFA
Initial value :
1
1
0
0
0
0
0
0
R/W
—
—
—
R/(W)*
R/(W)*
R/(W)*
R/(W)*
R/(W)*
:
Note: * Can only be written with 0 for flag clearing.
Channel 1: TSR1
Channel 2: TSR2
Channel 4: TSR4
Channel 5: TSR5
Bit
:
7
6
5
4
3
2
1
0
TCFD
—
TCFU
TCFV
—
—
TGFB
TGFA
Initial value :
1
1
0
0
0
0
0
0
R/W
R
—
R/(W)*
R/(W)*
—
—
R/(W)*
R/(W)*
:
Note: * Can only be written with 0 for flag clearing.
The TSR registers are 8-bit registers that indicate the status of each channel. The TPU has six TSR registers, one for each
channel. The TSR registers are initialized to H'C0 by a reset, and in hardware standby mode.
Bit 7—Count Direction Flag (TCFD): Status flag that shows the direction in which TCNT counts in channels 1, 2, 4,
and 5.
In channels 0 and 3, bit 7 is reserved. It is always read as 1 and cannot be modified.
Bit 7
TCFD
Description
0
TCNT counts down
1
TCNT counts up
(Initial value)
Bit 6—Reserved: This bit cannot be modified and is always read as 1.
Bit 5—Underflow Flag (TCFU): Status flag that indicates that TCNT underflow has occurred when channels 1, 2, 4, and
5 are set to phase counting mode.
In channels 0 and 3, bit 5 is reserved. It is always read as 0 and cannot be modified.
Bit 5
TCFU
Description
0
[Clearing condition]
When 0 is written to TCFU after reading TCFU = 1
(Initial value)
1
[Setting condition]
When the TCNT value underflows (changes from H'0000 to H'FFFF)
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Bit 4—Overflow Flag (TCFV): Status flag that indicates that TCNT overflow has occurred.
Bit 4
TCFV
0
Description
[Clearing condition]
(Initial value)
When 0 is written to TCFV after reading TCFV = 1
1
[Setting condition]
When the TCNT value overflows (changes from H'FFFF to H'0000 )
Bit 3—Input Capture/Output Compare Flag D (TGFD): Status flag that indicates the occurrence of TGRD input
capture or compare match in channels 0 and 3.
In channels 1, 2, 4, and 5, bit 3 is reserved. It is always read as 0 and cannot be modified.
Bit 3
TGFD
Description
0
[Clearing conditions]
1
(Initial value)
•
When DTC is activated by TGID interrupt while DISEL bit of MRB in DTC is 0
•
When 0 is written to TGFD after reading TGFD = 1
[Setting conditions]
•
When TCNT = TGRD while TGRD is functioning as output compare register
•
When TCNT value is transferred to TGRD by input capture signal while TGRD is
functioning as input capture register
Bit 2—Input Capture/Output Compare Flag C (TGFC): Status flag that indicates the occurrence of TGRC input
capture or compare match in channels 0 and 3.
In channels 1, 2, 4, and 5, bit 2 is reserved. It is always read as 0 and cannot be modified.
Bit 2
TGFC
Description
0
[Clearing conditions]
1
(Initial value)
•
When DTC is activated by TGIC interrupt while DISEL bit of MRB in DTC is 0
•
When 0 is written to TGFC after reading TGFC = 1
[Setting conditions]
•
When TCNT = TGRC while TGRC is functioning as output compare register
•
When TCNT value is transferred to TGRC by input capture signal while TGRC is
functioning as input capture register
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Bit 1—Input Capture/Output Compare Flag B (TGFB): Status flag that indicates the occurrence of TGRB input
capture or compare match.
Bit 1
TGFB
Description
0
[Clearing conditions]
1
(Initial value)
•
When DTC is activated by TGIB interrupt while DISEL bit of MRB in DTC is 0
•
When 0 is written to TGFB after reading TGFB = 1
[Setting conditions]
•
When TCNT = TGRB while TGRB is functioning as output compare register
•
When TCNT value is transferred to TGRB by input capture signal while TGRB is
functioning as input capture register
Bit 0—Input Capture/Output Compare Flag A (TGFA): Status flag that indicates the occurrence of TGRA input
capture or compare match.
Bit 0
TGFA
Description
0
[Clearing conditions]
1
(Initial value)
•
When DTC is activated by TGIA interrupt while DISEL bit of MRB in DTC is 0
•
When DMAC is activated by TGIA interrupt while DTA bit of DMABCR in DMAC is
1
•
When 0 is written to TGFA after reading TGFA = 1
[Setting conditions]
•
When TCNT = TGRA while TGRA is functioning as output compare register
•
When TCNT value is transferred to TGRA by input capture signal while TGRA is
functioning as input capture register
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10.2.6
Timer Counter (TCNT)
Channel 0: TCNT0 (up-counter)
Channel 1: TCNT1 (up/down-counter*)
Channel 2: TCNT2 (up/down-counter*)
Channel 3: TCNT3 (up-counter)
Channel 4: TCNT4 (up/down-counter*)
Channel 5: TCNT5 (up/down-counter*)
Bit
:
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Initial value :
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
R/W
: R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
Note: * These counters can be used as up/down-counters only in phase counting mode or when counting
overflow/underflow on another channel. In other cases they function as up-counters.
The TCNT registers are 16-bit counters. The TPU has six TCNT counters, one for each channel.
The TCNT counters are initialized to H'0000 by a reset, and in hardware standby mode.
The TCNT counters cannot be accessed in 8-bit units; they must always be accessed as a 16-bit unit.
10.2.7
Bit
Timer General Register (TGR)
:
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Initial value :
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
R/W
: R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
The TGR registers are 16-bit registers with a dual function as output compare and input capture registers. The TPU has 16
TGR registers, four each for channels 0 and 3 and two each for channels 1, 2, 4, and 5. TGRC and TGRD for channels 0
and 3 can also be designated for operation as buffer registers*. The TGR registers are initialized to H'FFFF by a reset, and
in hardware standby mode.
The TGR registers cannot be accessed in 8-bit units; they must always be accessed as a 16-bit unit.
Note: * TGR buffer register combinations are TGRA—TGRC and TGRB—TGRD.
10.2.8
Bit
Timer Start Register (TSTR)
:
7
6
5
4
3
2
1
0
—
—
CST5
CST4
CST3
CST2
CST1
CST0
Initial value :
0
0
0
0
0
0
0
0
R/W
—
—
R/W
R/W
R/W
R/W
R/W
R/W
:
TSTR is an 8-bit readable/writable register that selects operation/stoppage for channels 0 to 5. TSTR is initialized to H'00
by a reset, and in hardware standby mode. When setting the operating mode in TMDR or setting the count clock in TCR,
first stop the TCNT counter.
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Bits 7 and 6—Reserved: Should always be written with 0.
Bits 5 to 0—Counter Start 5 to 0 (CST5 to CST0): These bits select operation or stoppage for TCNT.
Bit n
CSTn
Description
0
TCNTn count operation is stopped
1
TCNTn performs count operation
(Initial value)
n = 5 to 0
Note: If 0 is written to the CST bit during operation with the TIOC pin designated for output, the counter stops but the
TIOC pin output compare output level is retained. If TIOR is written to when the CST bit is cleared to 0, the pin
output level will be changed to the set initial output value.
10.2.9
Timer Synchro Register (TSYR)
Bit
:
7
6
5
4
3
2
1
0
—
—
SYNC5
SYNC4
SYNC3
SYNC2
SYNC1
SYNC0
Initial value :
0
0
0
0
0
0
0
0
R/W
—
—
R/W
R/W
R/W
R/W
R/W
R/W
:
TSYR is an 8-bit readable/writable register that selects independent operation or synchronous operation for the channel 0
to 4 TCNT counters. A channel performs synchronous operation when the corresponding bit in TSYR is set to 1.
TSYR is initialized to H'00 by a reset, and in hardware standby mode.
Bits 7 and 6—Reserved: Should always be written with 0.
Bits 5 to 0—Timer Synchro 5 to 0 (SYNC5 to SYNC0): These bits select whether operation is independent of or
synchronized with other channels.
When synchronous operation is selected, synchronous presetting of multiple channels*1, and synchronous clearing through
counter clearing on another channel*2 are possible.
Notes: 1. To set synchronous operation, the SYNC bits for at least two channels must be set to 1.
2. To set synchronous clearing, in addition to the SYNC bit, the TCNT clearing source must also be set by means
of bits CCLR2 to CCLR0 in TCR.
Bit n
SYNCn
0
1
Description
TCNTn operates independently (TCNT presetting/clearing is unrelated to
other channels)
(Initial value)
TCNTn performs synchronous operation
TCNT synchronous presetting/synchronous clearing is possible
n = 5 to 0
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10.2.10
Module Stop Control Register (MSTPCR)
MSTPCRH
Bit
MSTPCRL
:
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Initial value :
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
R/W
: R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
MSTPCR is a 16-bit readable/writable register that performs module stop mode control.
When the MSTP13 bit in MSTPCR is set to 1, TPU operation stops at the end of the bus cycle and a transition is made to
module stop mode. Registers cannot be read or written to in module stop mode. For details, see section 21.5, Module Stop
Mode.
MSTPCR is initialized to H'3FFF by a reset and in hardware standby mode. It is not initialized in software standby mode.
Bit 13—Module Stop (MSTP13): Specifies the TPU module stop mode.
Bit 13
MSTP13
Description
0
TPU module stop mode cleared
1
TPU module stop mode set
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(Initial value)
10.3
Interface to Bus Master
10.3.1
16-Bit Registers
TCNT and TGR are 16-bit registers. As the data bus to the bus master is 16 bits wide, these registers can be read and
written to in 16-bit units.
These registers cannot be read or written to in 8-bit units; 16-bit access must always be used.
An example of 16-bit register access operation is shown in figure 10-2.
Internal data bus
H
Bus
master
L
Module
data bus
Bus interface
TCNTH
TCNTL
Figure 10-2 16-Bit Register Access Operation [Bus Master ↔ TCNT (16 Bits)]
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10.3.2
8-Bit Registers
Registers other than TCNT and TGR are 8-bit. As the data bus to the CPU is 16 bits wide, these registers can be read and
written to in 16-bit units. They can also be read and written to in 8-bit units.
Examples of 8-bit register access operation are shown in figures 10-3 to 10-5.
Internal data bus
H
Bus
master
L
Module
data bus
Bus interface
TCR
Figure 10-3 8-Bit Register Access Operation [Bus Master ↔ TCR (Upper 8 Bits)]
Internal data bus
H
Bus
master
L
Module
data bus
Bus interface
TMDR
Figure 10-4 8-Bit Register Access Operation [Bus Master ↔ TMDR (Lower 8 Bits)]
Internal data bus
H
Bus
master
L
Module
data bus
Bus interface
TCR
TMDR
Figure 10-5 8-Bit Register Access Operation [Bus Master ↔ TCR and TMDR (16 Bits)]
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10.4
Operation
10.4.1
Overview
Operation in each mode is outlined below.
Normal Operation: Each channel has a TCNT and TGR register. TCNT performs up-counting, and is also capable of
free-running operation, synchronous counting, and external event counting.
Each TGR can be used as an input capture register or output compare register.
Synchronous Operation: When synchronous operation is designated for a channel, TCNT for that channel performs
synchronous presetting. That is, when TCNT for a channel designated for synchronous operation is rewritten, the TCNT
counters for the other channels are also rewritten at the same time. Synchronous clearing of the TCNT counters is also
possible by setting the timer synchronization bits in TSYR for channels designated for synchronous operation.
Buffer Operation
• When TGR is an output compare register
When a compare match occurs, the value in the buffer register for the relevant channel is transferred to TGR.
• When TGR is an input capture register
When input capture occurs, the value in TCNT is transfer to TGR and the value previously held in TGR is transferred
to the buffer register.
Cascaded Operation: The channel 1 counter (TCNT1), channel 2 counter (TCNT2), channel 4 counter (TCNT4), and
channel 5 counter (TCNT5) can be connected together to operate as a 32-bit counter.
PWM Mode: In this mode, a PWM waveform is output. The output level can be set by means of TIOR. A PWM
waveform with a duty of between 0% and 100% can be output, according to the setting of each TGR register.
Phase Counting Mode: In this mode, TCNT is incremented or decremented by detecting the phases of two clocks input
from the external clock input pins in channels 1, 2, 4, and 5. When phase counting mode is set, the corresponding TCLK
pin functions as the clock pin, and TCNT performs up- or down-counting.
This can be used for two-phase encoder pulse input.
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10.4.2
Basic Functions
Counter Operation: When one of bits CST0 to CST5 is set to 1 in TSTR, the TCNT counter for the corresponding
channel starts counting. TCNT can operate as a free-running counter, periodic counter, and so on.
• Example of count operation setting procedure
Figure 10-6 shows an example of the count operation setting procedure.
[1] Select the counter
clock with bits
TPSC2 to TPSC0 in
TCR. At the same
time, select the
input clock edge
with bits CKEG1
and CKEG0 in TCR.
Operation selection
Select counter clock
[1]
Periodic counter
Select counter clearing source
[2]
Select output compare register
[3]
Set period
[4]
Start count operation
[5]
<Periodic counter>
[2] For periodic counter
operation, select the
TGR to be used as
the TCNT clearing
source with bits
CCLR2 to CCLR0 in
TCR.
Free-running counter
[3] Designate the TGR
selected in [2] as an
output compare
register by means of
TIOR.
[4] Set the periodic
counter cycle in the
TGR selected in [2].
Start count operation
<Free-running counter>
[5]
[5] Set the CST bit in
TSTR to 1 to start
the counter
operation.
Figure 10-6 Example of Counter Operation Setting Procedure
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• Free-running count operation and periodic count operation
Immediately after a reset, the TPU’s TCNT counters are all designated as free-running counters. When the relevant bit
in TSTR is set to 1 the corresponding TCNT counter starts up-count operation as a free-running counter. When TCNT
overflows (from H'FFFF to H'0000), the TCFV bit in TSR is set to 1. If the value of the corresponding TCIEV bit in
TIER is 1 at this point, the TPU requests an interrupt. After overflow, TCNT starts counting up again from H'0000.
Figure 10-7 illustrates free-running counter operation.
TCNT value
H'FFFF
H'0000
Time
CST bit
TCFV
Figure 10-7 Free-Running Counter Operation
When compare match is selected as the TCNT clearing source, the TCNT counter for the relevant channel performs
periodic count operation. The TGR register for setting the period is designated as an output compare register, and
counter clearing by compare match is selected by means of bits CCLR2 to CCLR0 in TCR. After the settings have
been made, TCNT starts up-count operation as periodic counter when the corresponding bit in TSTR is set to 1. When
the count value matches the value in TGR, the TGF bit in TSR is set to 1 and TCNT is cleared to H'0000.
If the value of the corresponding TGIE bit in TIER is 1 at this point, the TPU requests an interrupt. After a compare
match, TCNT starts counting up again from H'0000.
Figure 10-8 illustrates periodic counter operation.
TCNT value
TGR
Counter cleared by TGR
compare match
H'0000
Time
CST bit
Flag cleared by software or
DTC/DMAC activation
TGF
Figure 10-8 Periodic Counter Operation
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Waveform Output by Compare Match: The TPU can perform 0, 1, or toggle output from the corresponding output pin
using compare match.
• Example of setting procedure for waveform output by compare match
Figure 10-9 shows an example of the setting procedure for waveform output by compare match
Output selection
Select waveform output mode
[1]
[1] Select initial value 0 output or 1 output, and
compare match output value 0 output, 1 output,
or toggle output, by means of TIOR. The set
initial value is output at the TIOC pin until the
first compare match occurs.
[2] Set the timing for compare match generation in
TGR.
Set output timing
[2]
Start count operation
[3]
[3] Set the CST bit in TSTR to 1 to start the count
operation.
<Waveform output>
Figure 10-9 Example of Setting Procedure for Waveform Output by Compare Match
• Examples of waveform output operation
Figure 10-10 shows an example of 0 output/1 output.
In this example TCNT has been designated as a free-running counter, and settings have been made so that 1 is output
by compare match A, and 0 is output by compare match B. When the set level and the pin level coincide, the pin level
does not change.
TCNT value
H'FFFF
TGRA
TGRB
Time
H'0000
No change
No change
1 output
TIOCA
No change
TIOCB
No change
Figure 10-10 Example of 0 Output/1 Output Operation
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0 output
Figure 10-11 shows an example of toggle output.
In this example TCNT has been designated as a periodic counter (with counter clearing performed by compare match
B), and settings have been made so that output is toggled by both compare match A and compare match B.
TCNT value
Counter cleared by TGRB compare match
H'FFFF
TGRB
TGRA
Time
H'0000
Toggle output
TIOCB
Toggle output
TIOCA
Figure 10-11 Example of Toggle Output Operation
Input Capture Function: The TCNT value can be transferred to TGR on detection of the TIOC pin input edge.
Rising edge, falling edge, or both edges can be selected as the detected edge. For channels 0, 1, 3, and 4, it is also possible
to specify another channel’s counter input clock or compare match signal as the input capture source.
Note: When another channel’s counter input clock is used as the input capture input for channels 0 and 3, ø/1 should not
be selected as the counter input clock used for input capture input. Input capture will not be generated if ø/1 is
selected.
• Example of input capture operation setting procedure
Figure 10-12 shows an example of the input capture operation setting procedure.
[1] Designate TGR as an input capture register by
means of TIOR, and select rising edge, falling
edge, or both edges as the input capture source
and input signal edge.
Input selection
Select input capture input
[1]
Start count
[2]
[2] Set the CST bit in TSTR to 1 to start the count
operation.
<Input capture operation>
Figure 10-12 Example of Input Capture Operation Setting Procedure
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• Example of input capture operation
Figure 10-13 shows an example of input capture operation.
In this example both rising and falling edges have been selected as the TIOCA pin input capture input edge, falling
edge has been selected as the TIOCB pin input capture input edge, and counter clearing by TGRB input capture has
been designated for TCNT.
Counter cleared by TIOCB
input (falling edge)
TCNT value
H'0180
H'0160
H'0010
H'0005
Time
H'0000
TIOCA
TGRA
H'0005
H'0160
H'0010
TIOCB
TGRB
H'0180
Figure 10-13 Example of Input Capture Operation
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10.4.3
Synchronous Operation
In synchronous operation, the values in a number of TCNT counters can be rewritten simultaneously (synchronous
presetting). Also, a number of TCNT counters can be cleared simultaneously by making the appropriate setting in TCR
(synchronous clearing).
Synchronous operation enables TGR to be incremented with respect to a single time base.
Channels 0 to 5 can all be designated for synchronous operation.
Example of Synchronous Operation Setting Procedure: Figure 10-14 shows an example of the synchronous operation
setting procedure.
Synchronous operation
selection
Set synchronous
operation
[1]
Synchronous presetting
Set TCNT
Synchronous clearing
[2]
Clearing
source generation
channel?
No
Yes
<Synchronous presetting>
Select counter
clearing source
[3]
Set synchronous
counter clearing
[4]
Start count
[5]
Start count
[5]
<Counter clearing>
<Synchronous clearing>
[1]
Set to 1 the SYNC bits in TSYR corresponding to the channels to be designated for synchronous
operation.
[2]
When the TCNT counter of any of the channels designated for synchronous operation is
written to, the same value is simultaneously written to the other TCNT counters.
[3]
Use bits CCLR2 to CCLR0 in TCR to specify TCNT clearing by input capture/output compare,
etc.
[4]
Use bits CCLR2 to CCLR0 in TCR to designate synchronous clearing for the counter clearing
source.
[5]
Set to 1 the CST bits in TSTR for the relevant channels, to start the count operation.
Figure 10-14 Example of Synchronous Operation Setting Procedure
Example of Synchronous Operation: Figure 10-15 shows an example of synchronous operation.
In this example, synchronous operation and PWM mode 1 have been designated for channels 0 to 2, TGR0B compare
match has been set as the channel 0 counter clearing source, and synchronous clearing has been set for the channel 1 and 2
counter clearing sources.
Three-phase PWM waveforms are output from pins TIOC0A, TIOC1A, and TIOC2A. At this time, synchronous
presetting, and synchronous clearing by TGR0B compare match, is performed for channel 0 to 2 TCNT counters, and the
data set in TGR0B is used as the PWM cycle.
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For details of PWM modes, see section 10.4.6, PWM Modes.
Synchronous clearing by TGR0B compare match
TCNT0 to TCNT2 values
TGR0B
TGR1B
TGR0A
TGR2B
TGR1A
TGR2A
Time
H'0000
TIOC0A
TIOC1A
TIOC2A
Figure 10-15 Example of Synchronous Operation
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10.4.4
Buffer Operation
Buffer operation, provided for channels 0 and 3, enables TGRC and TGRD to be used as buffer registers.
Buffer operation differs depending on whether TGR has been designated as an input capture register or as a compare
match register.
Table 10-5 shows the register combinations used in buffer operation.
Table 10-5 Register Combinations in Buffer Operation
Channel
Timer General Register
Buffer Register
0
TGR0A
TGR0C
TGR0B
TGR0D
TGR3A
TGR3C
TGR3B
TGR3D
3
• When TGR is an output compare register
When a compare match occurs, the value in the buffer register for the corresponding channel is transferred to the timer
general register.
This operation is illustrated in figure 10-16.
Compare match signal
Timer general
register
Buffer register
Comparator
TCNT
Figure 10-16 Compare Match Buffer Operation
• When TGR is an input capture register
When input capture occurs, the value in TCNT is transferred to TGR and the value previously held in the timer general
register is transferred to the buffer register.
This operation is illustrated in figure 10-17.
Input capture
signal
Buffer register
Timer general
register
TCNT
Figure 10-17 Input Capture Buffer Operation
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Example of Buffer Operation Setting Procedure: Figure 10-18 shows an example of the buffer operation setting
procedure.
[1] Designate TGR as an input capture register or
output compare register by means of TIOR.
Buffer operation
[1]
[2] Designate TGR for buffer operation with bits
BFA and BFB in TMDR.
Set buffer operation
[2]
[3] Set the CST bit in TSTR to 1 to start the count
operation.
Start count
[3]
Select TGR function
<Buffer operation>
Figure 10-18 Example of Buffer Operation Setting Procedure
Examples of Buffer Operation
• When TGR is an output compare register
Figure 10-19 shows an operation example in which PWM mode 1 has been designated for channel 0, and buffer
operation has been designated for TGRA and TGRC. The settings used in this example are TCNT clearing by compare
match B, 1 output at compare match A, and 0 output at compare match B.
As buffer operation has been set, when compare match A occurs the output changes and the value in buffer register
TGRC is simultaneously transferred to timer general register TGRA. This operation is repeated each time compare
match A occurs.
For details of PWM modes, see section 10.4.6, PWM Modes.
TCNT value
TGR0B
H'0520
H'0450
H'0200
TGR0A
Time
H'0000
TGR0C H'0200
H'0450
H'0520
Transfer
TGR0A
H'0200
H'0450
TIOCA
Figure 10-19 Example of Buffer Operation (1)
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• When TGR is an input capture register
Figure 10-20 shows an operation example in which TGRA has been designated as an input capture register, and buffer
operation has been designated for TGRA and TGRC.
Counter clearing by TGRA input capture has been set for TCNT, and both rising and falling edges have been selected
as the TIOCA pin input capture input edge.
As buffer operation has been set, when the TCNT value is stored in TGRA upon occurrence of input capture A, the
value previously stored in TGRA is simultaneously transferred to TGRC.
TCNT value
H'0F07
H'09FB
H'0532
H'0000
Time
TIOCA
TGRA
TGRC
H'0532
H'0F07
H'09FB
H'0532
H'0F07
Figure 10-20 Example of Buffer Operation (2)
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10.4.5
Cascaded Operation
In cascaded operation, two 16-bit counters for different channels are used together as a 32-bit counter.
This function works by counting the channel 1 (channel 4) counter clock upon overflow/underflow of TCNT2 (TCNT5) as
set in bits TPSC2 to TPSC0 in TCR.
Underflow occurs only when the lower 16-bit TCNT is in phase-counting mode.
Table 10-6 shows the register combinations used in cascaded operation.
Note: When phase counting mode is set for channel 1 or 4, the counter clock setting is invalid and the counter operates
independently in phase counting mode.
Table 10-6 Cascaded Combinations
Combination
Upper 16 Bits
Lower 16 Bits
Channels 1 and 2
TCNT1
TCNT2
Channels 4 and 5
TCNT4
TCNT5
Example of Cascaded Operation Setting Procedure: Figure 10-21 shows an example of the setting procedure for
cascaded operation.
[1] Set bits TPSC2 to TPSC0 in the channel 1
(channel 4) TCR to B’111 to select TCNT2
(TCNT5) overflow/underflow counting.
Cascaded operation
Set cascading
[1]
Start count
[2]
[2] Set the CST bit in TSTR for the upper and lower
channel to 1 to start the count operation.
<Cascaded operation>
Figure 10-21 Cascaded Operation Setting Procedure
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Examples of Cascaded Operation: Figure 10-22 illustrates the operation when counting upon TCNT2
overflow/underflow has been set for TCNT1, TGR1A and TGR2A have been designated as input capture registers, and
TIOC pin rising edge has been selected.
When a rising edge is input to the TIOCA1 and TIOCA2 pins simultaneously, the upper 16 bits of the 32-bit data are
transferred to TGR1A, and the lower 16 bits to TGR2A.
TCNT1
clock
TCNT1
H'03A1
H'03A2
TCNT2
clock
TCNT2
H'FFFF
H'0000
H'0001
TIOCA1,
TIOCA2
TGR1A
H'03A2
TGR2A
H'0000
Figure 10-22 Example of Cascaded Operation (1)
Figure 10-23 illustrates the operation when counting upon TCNT2 overflow/underflow has been set for TCNT1, and phase
counting mode has been designated for channel 2.
TCNT1 is incremented by TCNT2 overflow and decremented by TCNT2 underflow.
TCLKC
TCLKD
TCNT2
TCNT1
FFFD
FFFE
FFFF
0000
0000
0001
0002
0001
0001
0000
FFFF
0000
Figure 10-23 Example of Cascaded Operation (2)
10.4.6
PWM Modes
In PWM mode, PWM waveforms are output from the output pins. 0, 1, or toggle output can be selected as the output level
in response to compare match of each TGR.
Designating TGR compare match as the counter clearing source enables the period to be set in that register. All channels
can be designated for PWM mode independently. Synchronous operation is also possible.
There are two PWM modes, as described below.
• PWM mode 1
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PWM output is generated from the TIOCA and TIOCC pins by pairing TGRA with TGRB and TGRC with TGRD.
The output specified by bits IOA3 to IOA0 and IOC3 to IOC0 in TIOR is output from the TIOCA and TIOCC pins at
compare matches A and C, and the output specified by bits IOB3 to IOB0 and IOD3 to IOD0 in TIOR is output at
compare matches B and D. The initial output value is the value set in TGRA or TGRC. If the set values of paired
TGRs are identical, the output value does not change when a compare match occurs.
In PWM mode 1, a maximum 8-phase PWM output is possible.
• PWM mode 2
PWM output is generated using one TGR as the cycle register and the others as duty registers. The output specified in
TIOR is performed by means of compare matches. Upon counter clearing by a synchronization register compare
match, the output value of each pin is the initial value set in TIOR. If the set values of the cycle and duty registers are
identical, the output value does not change when a compare match occurs.
In PWM mode 2, a maximum 15-phase PWM output is possible by combined use with synchronous operation.
The correspondence between PWM output pins and registers is shown in table 10-7.
Table 10-7 PWM Output Registers and Output Pins
Output Pins
Channel
Registers
PWM Mode 1
PWM Mode 2
0
TGR0A
TIOCA0
TIOCA0
TGR0B
TGR0C
TIOCB0
TIOCC0
TGR0D
1
TGR1A
TIOCD0
TIOCA1
TGR1B
2
TGR2A
TGR3A
TIOCA2
TIOCA3
TGR4A
TIOCC3
TGR5A
TGR5B
TIOCC3
TIOCD3
TIOCA4
TGR4B
5
TIOCA3
TIOCB3
TGR3D
4
TIOCA2
TIOCB2
TGR3B
TGR3C
TIOCA1
TIOCB1
TGR2B
3
TIOCC0
TIOCA4
TIOCB4
TIOCA5
TIOCA5
TIOCB5
Note: In PWM mode 2, PWM output is not possible for the TGR register in which the period is set.
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Example of PWM Mode Setting Procedure: Figure 10-24 shows an example of the PWM mode setting procedure.
PWM mode
Select counter clock
[1]
[1] Select the counter clock with bits TPSC2 to
TPSC0 in TCR. At the same time, select the
input clock edge with bits CKEG1 and CKEG0 in
TCR.
[2] Use bits CCLR2 to CCLR0 in TCR to select the
TGR to be used as the TCNT clearing source.
Select counter clearing source
Select waveform output level
Set TGR
[2]
[3]
[4]
[3] Use TIOR to designate the TGR as an output
compare register, and select the initial value and
output value.
[4] Set the cycle in the TGR selected in [2], and set
the duty in the other the TGR.
[5] Select the PWM mode with bits MD3 to MD0 in
TMDR.
Set PWM mode
[5]
Start count
[6]
[6] Set the CST bit in TSTR to 1 to start the count
operation.
<PWM mode>
Figure 10-24 Example of PWM Mode Setting Procedure
Examples of PWM Mode Operation: Figure 10-25 shows an example of PWM mode 1 operation.
In this example, TGRA compare match is set as the TCNT clearing source, 0 is set for the TGRA initial output value and
output value, and 1 is set as the TGRB output value.
In this case, the value set in TGRA is used as the period, and the values set in TGRB registers as the duty.
TCNT value
TGRA
Counter cleared by
TGRA compare match
TGRB
H'0000
Time
TIOCA
Figure 10-25 Example of PWM Mode Operation (1)
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Figure 10-26 shows an example of PWM mode 2 operation.
In this example, synchronous operation is designated for channels 0 and 1, TGR1B compare match is set as the TCNT
clearing source, and 0 is set for the initial output value and 1 for the output value of the other TGR registers (TGR0A to
TGR0D, TGR1A), to output a 5-phase PWM waveform.
In this case, the value set in TGR1B is used as the cycle, and the values set in the other TGRs as the duty.
Counter cleared by TGR1B
compare match
TCNT value
TGR1B
TGR1A
TGR0D
TGR0C
TGR0B
TGR0A
H'0000
Time
TIOCA0
TIOCB0
TIOCC0
TIOCD0
TIOCA1
Figure 10-26 Example of PWM Mode Operation (2)
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Figure 10-27 shows examples of PWM waveform output with 0% duty and 100% duty in PWM mode.
TCNT value
TGRB rewritten
TGRA
TGRB
TGRB
rewritten
TGRB rewritten
H'0000
Time
0% duty
TIOCA
Output does not change when cycle register and duty register
compare matches occur simultaneously
TCNT value
TGRB rewritten
TGRA
TGRB rewritten
TGRB rewritten
TGRB
H'0000
Time
100% duty
TIOCA
Output does not change when cycle register and duty
register compare matches occur simultaneously
TCNT value
TGRB rewritten
TGRA
TGRB rewritten
TGRB
TGRB rewritten
Time
H'0000
TIOCA
100% duty
0% duty
Figure 10-27 Example of PWM Mode Operation (3)
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10.4.7
Phase Counting Mode
In phase counting mode, the phase difference between two external clock inputs is detected and TCNT is
incremented/decremented accordingly. This mode can be set for channels 1, 2, 4, and 5.
When phase counting mode is set, an external clock is selected as the counter input clock and TCNT operates as an
up/down-counter regardless of the setting of bits TPSC2 to TPSC0 and bits CKEG1 and CKEG0 in TCR. However, the
functions of bits CCLR1 and CCLR0 in TCR, and of TIOR, TIER, and TGR are valid, and input capture/compare match
and interrupt functions can be used.
When overflow occurs while TCNT is counting up, the TCFV flag in TSR is set; when underflow occurs while TCNT is
counting down, the TCFU flag is set.
The TCFD bit in TSR is the count direction flag. Reading the TCFD flag provides an indication of whether TCNT is
counting up or down.
Table 10-8 shows the correspondence between external clock pins and channels.
Table 10-8 Phase Counting Mode Clock Input Pins
External Clock Pins
Channels
A-Phase
B-Phase
When channel 1 or 5 is set to phase counting mode
TCLKA
TCLKB
When channel 2 or 4 is set to phase counting mode
TCLKC
TCLKD
Example of Phase Counting Mode Setting Procedure: Figure 10-28 shows an example of the phase counting mode
setting procedure.
[1] Select phase counting mode with bits MD3 to
MD0 in TMDR.
Phase counting mode
Select phase counting mode
[1]
Start count
[2]
[2] Set the CST bit in TSTR to 1 to start the count
operation.
<Phase counting mode>
Figure 10-28 Example of Phase Counting Mode Setting Procedure
Examples of Phase Counting Mode Operation: In phase counting mode, TCNT counts up or down according to the
phase difference between two external clocks. There are four modes, according to the count conditions.
• Phase counting mode 1
Figure 10-29 shows an example of phase counting mode 1 operation, and table 10-9 summarizes the TCNT up/downcount conditions.
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TCLKA (channels 1 and 5)
TCLKC (channels 2 and 4)
TCLKB (channels 1 and 5)
TCLKD (channels 2 and 4)
TCNT value
Up-count
Down-count
Time
Figure 10-29 Example of Phase Counting Mode 1 Operation
Table 10-9 Up/Down-Count Conditions in Phase Counting Mode 1
TCLKA (Channels 1 and 5)
TCLKC (Channels 2 and 4)
TCLKB (Channels 1 and 5)
TCLKD (Channels 2 and 4)
High level
Operation
Up-count
Low level
Low level
High level
High level
Down-count
Low level
High level
Low level
Legend:
: Rising edge
: Falling edge
• Phase counting mode 2
Figure 10-30 shows an example of phase counting mode 2 operation, and table 10-10 summarizes the TCNT up/downcount conditions.
TCLKA (Channels 1 and 5)
TCLKC (Channels 2 and 4)
TCLKB (Channels 1 and 5)
TCLKD (Channels 2 and 4)
TCNT value
Up-count
Down-count
Time
Figure 10-30 Example of Phase Counting Mode 2 Operation
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Table 10-10 Up/Down-Count Conditions in Phase Counting Mode 2
TCLKA (Channels 1 and 5)
TCLKC (Channels 2 and 4)
TCLKB (Channels 1 and 5)
TCLKD (Channels 2 and 4)
Operation
High level
Don’t care
Low level
Don’t care
Low level
Don’t care
High level
Up-count
High level
Don’t care
Low level
Don’t care
High level
Don’t care
Low level
Down-count
Legend:
: Rising edge
: Falling edge
• Phase counting mode 3
Figure 10-31 shows an example of phase counting mode 3 operation, and table 10-11 summarizes the TCNT up/downcount conditions.
TCLKA (channels 1 and 5)
TCLKC (channels 2 and 4)
TCLKB (channels 1 and 5)
TCLKD (channels 2 and 4)
TCNT value
Up-count
Down-count
Time
Figure 10-31 Example of Phase Counting Mode 3 Operation
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Table 10-11 Up/Down-Count Conditions in Phase Counting Mode 3
TCLKA (Channels 1 and 5)
TCLKC (Channels 2 and 4)
TCLKB (Channels 1 and 5)
TCLKD (Channels 2 and 4)
Operation
High level
Don’t care
Low level
Don’t care
Low level
Don’t care
High level
Up-count
High level
Down-count
Low level
Don’t care
High level
Don’t care
Low level
Don’t care
Legend:
: Rising edge
: Falling edge
• Phase counting mode 4
Figure 10-32 shows an example of phase counting mode 4 operation, and table 10-12 summarizes the TCNT up/downcount conditions.
TCLKA (channels 1 and 5)
TCLKC (channels 2 and 4)
TCLKB (channels 1 and 5)
TCLKD (channels 2 and 4)
TCNT value
Up-count
Down-count
Time
Figure 10-32 Example of Phase Counting Mode 4 Operation
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Table 10-12 Up/Down-Count Conditions in Phase Counting Mode 4
TCLKA (Channels 1 and 5)
TCLKC (Channels 2 and 4)
TCLKB (Channels 1 and 5)
TCLKD (Channels 2 and 4)
High level
Operation
Up-count
Low level
Low level
Don’t care
High level
High level
Down-count
Low level
High level
Don’t care
Low level
Legend:
: Rising edge
: Falling edge
Phase Counting Mode Application Example: Figure 10-33 shows an example in which phase counting mode is
designated for channel 1, and channel 1 is coupled with channel 0 to input servo motor 2-phase encoder pulses in order to
detect the position or speed.
Channel 1 is set to phase counting mode 1, and the encoder pulse A-phase and B-phase are input to TCLKA and TCLKB.
Channel 0 operates with TCNT counter clearing by TGR0C compare match; TGR0A and TGR0C are used for the
compare match function, and are set with the speed control period and position control period. TGR0B is used for input
capture, with TGR0B and TGR0D operating in buffer mode. The channel 1 counter input clock is designated as the
TGR0B input capture source, and detection of the pulse width of 2-phase encoder 4-multiplication pulses is performed.
TGR1A and TGR1B for channel 1 are designated for input capture, channel 0 TGR0A and TGR0C compare matches are
selected as the input capture source, and store the up/down-counter values for the control periods.
This procedure enables accurate position/speed detection to be achieved.
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Channel 1
TCLKA
TCLKB
Edge
detection
circuit
TCNT1
TGR1A
(speed period capture)
TGR1B
(position period capture)
TCNT0
+
TGR0A (speed control period)
–
+
TGR0C
(position control period)
–
TGR0B (pulse width capture)
TGR0D (buffer operation)
Channel 0
Figure 10-33 Phase Counting Mode Application Example
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10.5
Interrupts
10.5.1
Interrupt Sources and Priorities
There are three kinds of TPU interrupt source: TGR input capture/compare match, TCNT overflow, and TCNT underflow.
Each interrupt source has its own status flag and enable/disabled bit, allowing generation of interrupt request signals to be
enabled or disabled individually.
When an interrupt request is generated, the corresponding status flag in TSR is set to 1. If the corresponding
enable/disable bit in TIER is set to 1 at this time, an interrupt is requested. The interrupt request is cleared by clearing the
status flag to 0.
Relative channel priorities can be changed by the interrupt controller, but the priority order within a channel is fixed. For
details, see section 5, Interrupt Controller.
Table 10-13 lists the TPU interrupt sources.
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Table 10-13 TPU Interrupts
Channel
Interrupt
Source
Description
0
TGI0A
TGR0A input capture/compare match Possible
TGI0B
TGR0B input capture/compare match Not possible Possible
TGI0C
TGR0C input capture/compare match Not possible Possible
TGI0D
TGR0D input capture/compare match Not possible Possible
TCI0V
TCNT0 overflow
TGI1A
TGR1A input capture/compare match Possible
TGI1B
TGR1B input capture/compare match Not possible Possible
TCI1V
TCNT1 overflow
Not possible Not possible
TCI1U
TCNT1 underflow
Not possible Not possible
TGI2A
TGR2A input capture/compare match Possible
TGI2B
TGR2B input capture/compare match Not possible Possible
TCI2V
TCNT2 overflow
Not possible Not possible
TCI2U
TCNT2 underflow
Not possible Not possible
TGI3A
TGR3A input capture/compare match Possible
TGI3B
TGR3B input capture/compare match Not possible Possible
TGI3C
TGR3C input capture/compare match Not possible Possible
TGI3D
TGR3D input capture/compare match Not possible Possible
TCI3V
TCNT3 overflow
TGI4A
TGR4A input capture/compare match Possible
TGI4B
TGR4B input capture/compare match Not possible Possible
TCI4V
TCNT4 overflow
Not possible Not possible
TCI4U
TCNT4 underflow
Not possible Not possible
TGI5A
TGR5A input capture/compare match Possible
TGI5B
TGR5B input capture/compare match Not possible Possible
TCI5V
TCNT5 overflow
Not possible Not possible
TCI5U
TCNT5 underflow
Not possible Not possible
1
2
3
4
5
DMAC
Activation
DTC
Activation
Possible
Priority
High
Not possible Not possible
Possible
Possible
Possible
Not possible Not possible
Possible
Possible
Low
Note: This table shows the initial state immediately after a reset. The relative channel priorities can be changed by the
interrupt controller.
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Input Capture/Compare Match Interrupt: An interrupt is requested if the TGIE bit in TIER is set to 1 when the TGF
flag in TSR is set to 1 by the occurrence of a TGR input capture/compare match on a particular channel. The interrupt
request is cleared by clearing the TGF flag to 0. The TPU has 16 input capture/compare match interrupts, four each for
channels 0 and 3, and two each for channels 1, 2, 4, and 5.
Overflow Interrupt: An interrupt is requested if the TCIEV bit in TIER is set to 1 when the TCFV flag in TSR is set to 1
by the occurrence of TCNT overflow on a channel. The interrupt request is cleared by clearing the TCFV flag to 0. The
TPU has six overflow interrupts, one for each channel.
Underflow Interrupt: An interrupt is requested if the TCIEU bit in TIER is set to 1 when the TCFU flag in TSR is set to
1 by the occurrence of TCNT underflow on a channel. The interrupt request is cleared by clearing the TCFU flag to 0.
The TPU has four underflow interrupts, one each for channels 1, 2, 4, and 5.
10.5.2
DTC/DMAC Activation
DTC Activation: The DTC can be activated by the TGR input capture/compare match interrupt for a channel. For details,
see section 8, Data Transfer Controller.
A total of 16 TPU input capture/compare match interrupts can be used as DTC activation sources, four each for channels 0
and 3, and two each for channels 1, 2, 4, and 5.
DMAC Activation: The DMAC can be activated by the TGRA input capture/compare match interrupt for a channel. For
details, see section 7, DMA Controller.
In the TPU, a total of six TGRA input capture/compare match interrupts can be used as DMAC activation sources, one for
each channel.
10.5.3
A/D Converter Activation
The A/D converter can be activated by the TGRA input capture/compare match for a channel.
If the TTGE bit in TIER is set to 1 when the TGFA flag in TSR is set to 1 by the occurrence of a TGRA input
capture/compare match on a particular channel, a request to start A/D conversion is sent to the A/D converter. If the TPU
conversion start trigger has been selected on the A/D converter side at this time, A/D conversion is started.
In the TPU, a total of six TGRA input capture/compare match interrupts can be used as A/D converter conversion start
sources, one for each channel.
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10.6
Operation Timing
10.6.1
Input/Output Timing
TCNT Count Timing: Figure 10-34 shows TCNT count timing in internal clock operation, and figure 10-35 shows
TCNT count timing in external clock operation.
ø
Internal clock
Falling edge
Rising edge
TCNT
input clock
TCNT
N–1
N
N+1
N+2
Figure 10-34 Count Timing in Internal Clock Operation
ø
External clock
Falling edge
Rising edge
Falling edge
TCNT
input clock
TCNT
N–1
N
N+1
N+2
Figure 10-35 Count Timing in External Clock Operation
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Output Compare Output Timing: A compare match signal is generated in the final state in which TCNT and TGR
match (the point at which the count value matched by TCNT is updated). When a compare match signal is generated, the
output value set in TIOR is output at the output compare output pin. After a match between TCNT and TGR, the compare
match signal is not generated until the TCNT input clock is generated.
Figure 10-36 shows output compare output timing.
ø
TCNT
input clock
N
TCNT
N+1
N
TGR
Compare
match signal
TIOC pin
Figure 10-36 Output Compare Output Timing
Input Capture Signal Timing: Figure 10-37 shows input capture signal timing.
ø
Input capture
input
Input capture
signal
N
TCNT
N+1
N+2
N
TGR
N+2
Figure 10-37 Input Capture Input Signal Timing
Timing for Counter Clearing by Compare Match/Input Capture: Figure 10-38 shows the timing when counter
clearing by compare match occurrence is specified, and figure 10-39 shows the timing when counter clearing by input
capture occurrence is specified.
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ø
Compare
match signal
Counter
clear signal
TCNT
N
TGR
N
H'0000
Figure 10-38 Counter Clear Timing (Compare Match)
ø
Input capture
signal
Counter clear
signal
TCNT
TGR
N
H'0000
N
Figure 10-39 Counter Clear Timing (Input Capture)
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Buffer Operation Timing: Figures 10-40 and 10-41 show the timing in buffer operation.
ø
n
TCNT
n+1
Compare
match signal
TGRA,
TGRB
n
TGRC,
TGRD
N
N
Figure 10-40 Buffer Operation Timing (Compare Match)
ø
Input capture
signal
TCNT
N
TGRA,
TGRB
n
TGRC,
TGRD
N+1
N
N+1
n
N
Figure 10-41 Buffer Operation Timing (Input Capture)
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10.6.2
Interrupt Signal Timing
TGF Flag Setting Timing in Case of Compare Match: Figure 10-42 shows the timing for setting of the TGF flag in
TSR by compare match occurrence, and TGI interrupt request signal timing.
ø
TCNT input
clock
TCNT
N
TGR
N
N+1
Compare
match signal
TGF flag
TGI interrupt
Figure 10-42 TGI Interrupt Timing (Compare Match)
TGF Flag Setting Timing in Case of Input Capture: Figure 10-43 shows the timing for setting of the TGF flag in TSR
by input capture occurrence, and TGI interrupt request signal timing.
ø
Input capture
signal
TCNT
TGR
N
N
TGF flag
TGI interrupt
Figure 10-43 TGI Interrupt Timing (Input Capture)
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TCFV Flag/TCFU Flag Setting Timing: Figure 10-44 shows the timing for setting of the TCFV flag in TSR by overflow
occurrence, and TCIV interrupt request signal timing.
Figure 10-45 shows the timing for setting of the TCFU flag in TSR by underflow occurrence, and TCIU interrupt request
signal timing.
ø
TCNT input
clock
TCNT
(overflow)
H'FFFF
H'0000
Overflow
signal
TCFV flag
TCIV interrupt
Figure 10-44 TCIV Interrupt Setting Timing
ø
TCNT
input clock
TCNT
(underflow)
H'0000
H'FFFF
Underflow signal
TCFU flag
TCIU interrupt
Figure 10-45 TCIU Interrupt Setting Timing
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Status Flag Clearing Timing: After a status flag is read as 1 by the CPU, it is cleared by writing 0 to it. When the DTC
or DMAC is activated, the flag is cleared automatically. Figure 10-46 shows the timing for status flag clearing by the
CPU, and figure 10-47 shows the timing for status flag clearing by the DTC or DMAC.
TSR write cycle
T2
T1
ø
Address
TSR address
Write signal
Status flag
Interrupt
request
signal
Figure 10-46 Timing for Status Flag Clearing by CPU
DTC/DMAC
read cycle
T1
T2
DTC/DMAC
write cycle
T1
T2
ø
Address
Source address
Destination
address
Status flag
Interrupt
request
signal
Figure 10-47 Timing for Status Flag Clearing by DTC/DMAC Activation
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10.7
Usage Notes
Note that the kinds of operation and contention described below occur during TPU operation.
Input Clock Restrictions: The input clock pulse width must be at least 1.5 states in the case of single-edge detection, and
at least 2.5 states in the case of both-edge detection. The TPU will not operate properly with a narrower pulse width.
In phase counting mode, the phase difference and overlap between the two input clocks must be at least 1.5 states, and the
pulse width must be at least 2.5 states. Figure 10-48 shows the input clock conditions in phase counting mode.
Overlap
Phase
Phase
differdifference Overlap ence
Pulse width
Pulse width
TCLKA
(TCLKC)
TCLKB
(TCLKD)
Pulse width
Pulse width
Notes: Phase difference and overlap : 1.5 states or more
: 2.5 states or more
Pulse width
Figure 10-48 Phase Difference, Overlap, and Pulse Width in Phase Counting Mode
Caution on Period Setting: When counter clearing by compare match is set, TCNT is cleared in the final state in which it
matches the TGR value (the point at which the count value matched by TCNT is updated). Consequently, the actual
counter frequency is given by the following formula:
f=
ø
(N + 1)
Where
f : Counter frequency
ø : Operating frequency
N : TGR set value
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Contention between TCNT Write and Clear Operations: If the counter clear signal is generated in the T2 state of a
TCNT write cycle, TCNT clearing takes precedence and the TCNT write is not performed.
Figure 10-49 shows the timing in this case.
TCNT write cycle
T2
T1
ø
TCNT address
Address
Write signal
Counter clear
signal
N
TCNT
H'0000
Figure 10-49 Contention between TCNT Write and Clear Operations
Contention between TCNT Write and Increment Operations: If incrementing occurs in the T2 state of a TCNT write
cycle, the TCNT write takes precedence and TCNT is not incremented.
Figure 10-50 shows the timing in this case.
TCNT write cycle
T2
T1
ø
TCNT address
Address
Write signal
TCNT input
clock
TCNT
N
M
TCNT write data
Figure 10-50 Contention between TCNT Write and Increment Operations
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Contention between TGR Write and Compare Match: If a compare match occurs in the T2 state of a TGR write cycle,
the TGR write takes precedence and the compare match signal is inhibited. A compare match does not occur even if the
same value as before is written.
Figure 10-51 shows the timing in this case.
TGR write cycle
T2
T1
ø
TGR address
Address
Write signal
Compare
match signal
Prohibited
TCNT
N
N+1
TGR
N
M
TGR write data
Figure 10-51 Contention between TGR Write and Compare Match
Contention between Buffer Register Write and Compare Match: If a compare match occurs in the T2 state of a TGR
write cycle, the data transferred to TGR by the buffer operation will be the data prior to the write.
Figure 10-52 shows the timing in this case.
TGR write cycle
T2
T1
ø
Buffer register
address
Address
Write signal
Compare
match signal
Buffer register write data
Buffer
register
TGR
N
M
N
Figure 10-52 Contention between Buffer Register Write and Compare Match
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Contention between TGR Read and Input Capture: If the input capture signal is generated in the T1 state of a TGR
read cycle, the data that is read will be the data after input capture transfer.
Figure 10-53 shows the timing in this case.
TGR read cycle
T2
T1
ø
TGR address
Address
Read signal
Input capture
signal
TGR
X
M
M
Internal
data bus
Figure 10-53 Contention between TGR Read and Input Capture
Contention between TGR Write and Input Capture: If the input capture signal is generated in the T2 state of a TGR
write cycle, the input capture operation takes precedence and the write to TGR is not performed.
Figure 10-54 shows the timing in this case.
TGR write cycle
T2
T1
ø
TGR address
Address
Write signal
Input capture
signal
TCNT
TGR
M
M
Figure 10-54 Contention between TGR Write and Input Capture
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Contention between Buffer Register Write and Input Capture: If the input capture signal is generated in the T2 state of
a buffer write cycle, the buffer operation takes precedence and the write to the buffer register is not performed.
Figure 10-55 shows the timing in this case.
Buffer register write cycle
T2
T1
ø
Buffer register
address
Address
Write signal
Input capture
signal
TCNT
N
M
TGR
Buffer
register
N
M
Figure 10-55 Contention between Buffer Register Write and Input Capture
Contention between Overflow/Underflow and Counter Clearing: If overflow/underflow and counter clearing occur
simultaneously, the TCFV/TCFU flag in TSR is not set and TCNT clearing takes precedence.
Figure 10-56 shows the operation timing when a TGR compare match is specified as the clearing source, and H'FFFF is
set in TGR.
ø
TCNT input
clock
TCNT
H'FFFF
H'0000
Counter
clear signal
TGF
Prohibited
TCFV
Figure 10-56 Contention between Overflow and Counter Clearing
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Contention between TCNT Write and Overflow/Underflow: If there is an up-count or down-count in the T2 state of a
TCNT write cycle, and overflow/underflow occurs, the TCNT write takes precedence and the TCFV/TCFU flag in TSR is
not set.
Figure 10-57 shows the operation timing when there is contention between TCNT write and overflow.
TCNT write cycle
T2
T1
ø
TCNT address
Address
Write signal
TCNT
TCFV flag
TCNT write data
H'FFFF
M
Prohibited
Figure 10-57 Contention between TCNT Write and Overflow
Multiplexing of I/O Pins: In the H8S/2357 Group, the TCLKA input pin is multiplexed with the TIOCC0 I/O pin, the
TCLKB input pin with the TIOCD0 I/O pin, the TCLKC input pin with the TIOCB1 I/O pin, and the TCLKD input pin
with the TIOCB2 I/O pin. When an external clock is input, compare match output should not be performed from a
multiplexed pin.
Interrupts and Module Stop Mode: If module stop mode is entered when an interrupt has been requested, it will not be
possible to clear the CPU interrupt source or the DMAC or DTC activation source. Interrupts should therefore be disabled
before entering module stop mode.
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Section 11 Programmable Pulse Generator (PPG)
11.1
Overview
The H8S/2357 Group has a on-chip programmable pulse generator (PPG) that provides pulse outputs by using the 16-bit
timer-pulse unit (TPU) as a time base. The PPG pulse outputs are divided into 4-bit groups (group 3 to group 0) that can
operate both simultaneously and independently.
11.1.1
Features
PPG features are listed below.
• 16-bit output data
 Maximum 16-bit data can be output, and output can be enabled on a bit-by-bit basis
• Four output groups
 Output trigger signals can be selected in 4-bit groups to provide up to four different 4-bit outputs
• Selectable output trigger signals
 Output trigger signals can be selected for each group from the compare match signals of four TPU channels
• Non-overlap mode
 A non-overlap margin can be provided between pulse outputs
• Can operate together with the data transfer controller (DTC) and DMA controller (DMAC)
 The compare match signals selected as output trigger signals can activate the DTC or DMAC for sequential output
of data without CPU intervention
• Settable inverted output
 Inverted data can be output for each group
• Module stop mode can be set
 As the initial setting, PPG operation is halted. Register access is enabled by exiting module stop mode
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11.1.2
Block Diagram
Figure 11-1 shows a block diagram of the PPG.
Compare match signals
Control logic
PO15
PO14
PO13
PO12
PO11
PO10
PO9
PO8
PO7
PO6
PO5
PO4
PO3
PO2
PO1
PO0
NDERH
NDERL
PMR
PCR
Pulse output
pins, group 3
PODRH
NDRH
PODRL
NDRL
Pulse output
pins, group 2
Pulse output
pins, group 1
Pulse output
pins, group 0
Legend:
PPG output mode register
PMR:
PPG output control register
PCR:
NDERH: Next data enable register H
NDERL: Next data enable register L
NDRH: Next data register H
NDRL: Next data register L
PODRH: Output data register H
PODRL: Output data register L
Figure 11-1 Block Diagram of PPG
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Internal
data bus
11.1.3
Pin Configuration
Table 11-1 summarizes the PPG pins.
Table 11-1 PPG Pins
Name
Symbol
I/O
Function
Pulse output 0
PO0
Output
Group 0 pulse output
Pulse output 1
PO1
Output
Pulse output 2
PO2
Output
Pulse output 3
PO3
Output
Pulse output 4
PO4
Output
Pulse output 5
PO5
Output
Pulse output 6
PO6
Output
Pulse output 7
PO7
Output
Pulse output 8
PO8
Output
Pulse output 9
PO9
Output
Pulse output 10
PO10
Output
Pulse output 11
PO11
Output
Pulse output 12
PO12
Output
Pulse output 13
PO13
Output
Pulse output 14
PO14
Output
Pulse output 15
PO15
Output
Group 1 pulse output
Group 2 pulse output
Group 3 pulse output
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11.1.4
Registers
Table 11-2 summarizes the PPG registers.
Table 11-2 PPG Registers
Name
Abbreviation
R/W
Initial Value
Address* 1
PPG output control register
PCR
R/W
H'FF
H'FF46
PPG output mode register
PMR
R/W
H'F0
H'FF47
Next data enable register H
NDERH
R/W
H'00
H'FF48
Next data enable register L
NDERL
R/W
Output data register H
PODRH
H'00
H'FF49
R/(W)*
2
H'00
H'FF4A
2
H'00
H'FF4B
Output data register L
PODRL
R/(W)*
Next data register H
NDRH
R/W
H'00
H'FF4C* 3
H'FF4E
Next data register L
NDRL
R/W
H'00
H'FF4D* 3
H'FF4F
Port 1 data direction register
P1DDR
W
H'00
H'FEB0
Port 2 data direction register
P2DDR
W
H'00
H'FEB1
Module stop control register
MSTPCR
R/W
H'3FFF
H'FF3C
Notes: 1. Lower 16 bits of the address.
2. Bits used for pulse output cannot be written to.
3. When the same output trigger is selected for pulse output groups 2 and 3 by the PCR setting, the NDRH
address is H'FF4C. When the output triggers are different, the NDRH address is H'FF4E for group 2 and
H'FF4C for group 3.
Similarly, when the same output trigger is selected for pulse output groups 0 and 1 by the PCR setting, the
NDRL address is H'FF4D. When the output triggers are different, the NDRL address is H'FF4F for group 0 and
H'FF4D for group 1.
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11.2
Register Descriptions
11.2.1
Next Data Enable Registers H and L (NDERH, NDERL)
NDERH
Bit
:
7
6
5
4
3
2
1
NDER15 NDER14 NDER13 NDER12 NDER11 NDER10 NDER9
Initial value :
R/W
0
NDER8
0
0
0
0
0
0
0
0
:
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
:
7
6
5
4
3
2
1
0
NDER7
NDER6
NDER5
NDER4
NDER3
NDER2
NDER1
NDER0
0
0
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
NDERL
Bit
Initial value :
R/W
:
NDERH and NDERL are 8-bit readable/writable registers that enable or disable pulse output on a bit-by-bit basis.
If a bit is enabled for pulse output by NDERH or NDERL, the NDR value is automatically transferred to the
corresponding PODR bit when the TPU compare match event specified by PCR occurs, updating the output value. If
pulse output is disabled, the bit value is not transferred from NDR to PODR and the output value does not change.
NDERH and NDERL are each initialized to H'00 by a reset and in hardware standby mode. They are not initialized in
software standby mode.
NDERH Bits 7 to 0—Next Data Enable 15 to 8 (NDER15 to NDER8): These bits enable or disable pulse output on a
bit-by-bit basis.
Bits 7 to 0
NDER15 to NDER8
Description
0
Pulse outputs PO15 to PO8 are disabled (NDR15 to NDR8 are not
transferred to POD15 to POD8)
(Initial value)
1
Pulse outputs PO15 to PO8 are enabled (NDR15 to NDR8 are transferred
to POD15 to POD8)
NDERL Bits 7 to 0—Next Data Enable 7 to 0 (NDER7 to NDER0): These bits enable or disable pulse output on a bitby-bit basis.
Bits 7 to 0
NDER7 to NDER0
Description
0
Pulse outputs PO7 to PO0 are disabled (NDR7 to NDR0 are not
transferred to POD7 to POD0)
(Initial value)
1
Pulse outputs PO7 to PO0 are enabled (NDR7 to NDR0 are transferred to
POD7 to POD0)
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11.2.2
Output Data Registers H and L (PODRH, PODRL)
PODRH
Bit
:
7
6
5
4
3
2
1
0
POD15
POD14
POD13
POD12
POD11
POD10
POD9
POD8
0
0
0
0
0
0
0
0
:
R/(W)*
R/(W)*
R/(W)*
R/(W)*
R/(W)*
R/(W)*
R/(W)*
R/(W)*
:
7
6
5
4
3
2
1
0
POD7
POD6
POD5
POD4
POD3
POD2
POD1
POD0
Initial value :
R/W
PODRL
Bit
Initial value :
R/W
:
0
0
0
0
0
0
0
0
R/(W)*
R/(W)*
R/(W)*
R/(W)*
R/(W)*
R/(W)*
R/(W)*
R/(W)*
Note: * A bit that has been set for pulse output by NDER is read-only.
PODRH and PODRL are 8-bit readable/writable registers that store output data for use in pulse output.
11.2.3
Next Data Registers H and L (NDRH, NDRL)
NDRH and NDRL are 8-bit readable/writable registers that store the next data for pulse output. During pulse output, the
contents of NDRH and NDRL are transferred to the corresponding bits in PODRH and PODRL when the TPU compare
match event specified by PCR occurs. The NDRH and NDRL addresses differ depending on whether pulse output groups
have the same output trigger or different output triggers. For details see section 11.2.4, Notes on NDR Access.
NDRH and NDRL are each initialized to H'00 by a reset and in hardware standby mode. They are not initialized in
software standby mode.
11.2.4
Notes on NDR Access
The NDRH and NDRL addresses differ depending on whether pulse output groups have the same output trigger or
different output triggers.
Same Trigger for Pulse Output Groups: If pulse output groups 2 and 3 are triggered by the same compare match event,
the NDRH address is H'FF4C. The upper 4 bits belong to group 3 and the lower 4 bits to group 2. Address H'FF4E
consists entirely of reserved bits that cannot be modified and are always read as 1.
Address H'FF4C
Bit
:
Initial value :
R/W
:
7
6
5
4
3
2
1
0
NDR15
NDR14
NDR13
NDR12
NDR11
NDR10
NDR9
NDR8
0
0
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
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Address H'FF4E
Bit
:
7
6
5
4
3
2
1
0
—
—
—
—
—
—
—
—
Initial value :
1
1
1
1
1
1
1
1
R/W
—
—
—
—
—
—
—
—
:
If pulse output groups 0 and 1 are triggered by the same compare match event, the NDRL address is H'FF4D. The upper 4
bits belong to group 1 and the lower 4 bits to group 0. Address H'FF4F consists entirely of reserved bits that cannot be
modified and are always read as 1.
Address H'FF4D
Bit
:
Initial value :
R/W
:
7
6
5
4
3
2
1
0
NDR7
NDR6
NDR5
NDR4
NDR3
NDR2
NDR1
NDR0
0
0
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
7
6
5
4
3
2
1
0
—
—
—
—
—
—
—
—
Address H'FF4F
Bit
:
Initial value :
1
1
1
1
1
1
1
1
R/W
—
—
—
—
—
—
—
—
:
Different Triggers for Pulse Output Groups: If pulse output groups 2 and 3 are triggered by different compare match
events, the address of the upper 4 bits in NDRH (group 3) is H'FF4C and the address of the lower 4 bits (group 2) is
H'FF4E. Bits 3 to 0 of address H'FF4C and bits 7 to 4 of address H'FF4E are reserved bits that cannot be modified and are
always read as 1.
Address H'FF4C
Bit
:
7
6
5
4
3
2
1
0
NDR15
NDR14
NDR13
NDR12
—
—
—
—
0
0
0
0
1
1
1
1
R/W
R/W
R/W
R/W
—
—
—
—
7
6
5
4
3
2
1
0
—
—
—
—
NDR11
NDR10
NDR9
NDR8
Initial value :
1
1
1
1
0
0
0
0
R/W
—
—
—
—
R/W
R/W
R/W
R/W
Initial value :
R/W
:
Address H'FF4E
Bit
:
:
If pulse output groups 0 and 1 are triggered by different compare match event, the address of the upper 4 bits in NDRL
(group 1) is H'FF4D and the address of the lower 4 bits (group 0) is H'FF4F. Bits 3 to 0 of address H'FF4D and bits 7 to 4
of address H'FF4F are reserved bits that cannot be modified and are always read as 1.
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Address H'FF4D
Bit
:
7
6
5
4
3
2
1
0
NDR7
NDR6
NDR5
NDR4
—
—
—
—
0
0
0
0
1
1
1
1
R/W
R/W
R/W
R/W
—
—
—
—
7
6
5
4
3
2
1
0
—
—
—
—
NDR3
NDR2
NDR1
NDR0
Initial value :
1
1
1
1
0
0
0
0
R/W
—
—
—
—
R/W
R/W
R/W
R/W
4
3
2
1
0
Initial value :
R/W
:
Address H'FF4F
Bit
11.2.5
:
:
PPG Output Control Register (PCR)
Bit
:
7
6
5
G3CMS1 G3CMS0 G2CMS1 G2CMS0 G1CMS1 G1CMS0 G0CMS1 G0CMS0
Initial value :
R/W
:
1
1
1
1
1
1
1
1
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
PCR is an 8-bit readable/writable register that selects output trigger signals for PPG outputs on a group-by-group basis.
PCR is initialized to H'FF by a reset and in hardware standby mode. It is not initialized in software standby mode.
Bits 7 and 6—Group 3 Compare Match Select 1 and 0 (G3CMS1, G3CMS0): These bits select the compare match
that triggers pulse output group 3 (pins PO15 to PO12).
Description
Bit 7
G3CMS1
Bit 6
G3CMS0
Output Trigger for Pulse Output Group 3
0
0
Compare match in TPU channel 0
1
Compare match in TPU channel 1
0
Compare match in TPU channel 2
1
Compare match in TPU channel 3
1
(Initial value)
Bits 5 and 4—Group 2 Compare Match Select 1 and 0 (G2CMS1, G2CMS0): These bits select the compare match
that triggers pulse output group 2 (pins PO11 to PO8).
Description
Bit 5
G2CMS1
Bit 4
G2CMS0
Output Trigger for Pulse Output Group 2
0
0
Compare match in TPU channel 0
1
Compare match in TPU channel 1
0
Compare match in TPU channel 2
1
Compare match in TPU channel 3
1
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(Initial value)
Bits 3 and 2—Group 1 Compare Match Select 1 and 0 (G1CMS1, G1CMS0): These bits select the compare match
that triggers pulse output group 1 (pins PO7 to PO4).
Description
Bit 3
G1CMS1
Bit 2
G1CMS0
Output Trigger for Pulse Output Group 1
0
0
Compare match in TPU channel 0
1
Compare match in TPU channel 1
0
Compare match in TPU channel 2
1
Compare match in TPU channel 3
1
(Initial value)
Bits 1 and 0—Group 0 Compare Match Select 1 and 0 (G0CMS1, G0CMS0): These bits select the compare match
that triggers pulse output group 0 (pins PO3 to PO0).
Description
Bit 1
G0CMS1
Bit 0
G0CMS0
Output Trigger for Pulse Output Group 0
0
0
Compare match in TPU channel 0
1
Compare match in TPU channel 1
0
Compare match in TPU channel 2
1
Compare match in TPU channel 3
1
11.2.6
(Initial value)
PPG Output Mode Register (PMR)
Bit
:
7
6
5
4
3
2
1
0
G3INV
G2INV
G1INV
G0INV
G3NOV
G2NOV
G1NOV
G0NOV
1
1
1
1
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Initial value :
R/W
:
PMR is an 8-bit readable/writable register that selects pulse output inversion and non-overlapping operation for each
group.
The output trigger period of a non-overlapping operation PPG output waveform is set in TGRB and the non-overlap
margin is set in TGRA. The output values change at compare match A and B.
For details, see section 11.3.4, Non-Overlapping Pulse Output.
PMR is initialized to H'F0 by a reset and in hardware standby mode. It is not initialized in software standby mode.
Bit 7—Group 3 Inversion (G3INV): Selects direct output or inverted output for pulse output group 3 (pins PO15 to
PO12).
Bit 7
G3INV
Description
0
Inverted output for pulse output group 3 (low-level output at pin for a 1 in PODRH)
1
Direct output for pulse output group 3 (high-level output at pin for a 1 in PODRH)
(Initial value)
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Bit 6—Group 2 Inversion (G2INV): Selects direct output or inverted output for pulse output group 2 (pins PO11 to
PO8).
Bit 6
G2INV
Description
0
Inverted output for pulse output group 2 (low-level output at pin for a 1 in PODRH)
1
Direct output for pulse output group 2 (high-level output at pin for a 1 in PODRH)
(Initial value)
Bit 5—Group 1 Inversion (G1INV): Selects direct output or inverted output for pulse output group 1 (pins PO7 to PO4).
Bit 5
G1INV
Description
0
Inverted output for pulse output group 1 (low-level output at pin for a 1 in PODRL)
1
Direct output for pulse output group 1 (high-level output at pin for a 1 in PODRL)
(Initial value)
Bit 4—Group 0 Inversion (G0INV): Selects direct output or inverted output for pulse output group 0 (pins PO3 to PO0).
Bit 4
G0INV
Description
0
Inverted output for pulse output group 0 (low-level output at pin for a 1 in PODRL)
1
Direct output for pulse output group 0 (high-level output at pin for a 1 in PODRL)
(Initial value)
Bit 3—Group 3 Non-Overlap (G3NOV): Selects normal or non-overlapping operation for pulse output group 3 (pins
PO15 to PO12).
Bit 3
G3NOV
Description
0
Normal operation in pulse output group 3 (output values updated at compare match A
in the selected TPU channel)
(Initial value)
1
Non-overlapping operation in pulse output group 3 (independent 1 and 0 output at
compare match A or B in the selected TPU channel)
Bit 2—Group 2 Non-Overlap (G2NOV): Selects normal or non-overlapping operation for pulse output group 2 (pins
PO11 to PO8).
Bit 2
G2NOV
Description
0
Normal operation in pulse output group 2 (output values updated at compare match A
in the selected TPU channel)
(Initial value)
1
Non-overlapping operation in pulse output group 2 (independent 1 and 0 output at
compare match A or B in the selected TPU channel)
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Bit 1—Group 1 Non-Overlap (G1NOV): Selects normal or non-overlapping operation for pulse output group 1 (pins
PO7 to PO4).
Bit 1
G1NOV
Description
0
Normal operation in pulse output group 1 (output values updated at compare match A
in the selected TPU channel)
(Initial value)
1
Non-overlapping operation in pulse output group 1 (independent 1 and 0 output at
compare match A or B in the selected TPU channel)
Bit 0—Group 0 Non-Overlap (G0NOV): Selects normal or non-overlapping operation for pulse output group 0 (pins
PO3 to PO0).
Bit 0
G0NOV
11.2.7
Bit
Description
0
Normal operation in pulse output group 0 (output values updated at compare match A
in the selected TPU channel)
(Initial value)
1
Non-overlapping operation in pulse output group 0 (independent 1 and 0 output at
compare match A or B in the selected TPU channel)
Port 1 Data Direction Register (P1DDR)
:
7
6
5
4
3
2
1
0
P17DDR P16DDR P15DDR P14DDR P13DDR P12DDR P11DDR P10DDR
Initial value :
0
0
0
0
0
0
0
0
R/W
W
W
W
W
W
W
W
W
:
P1DDR is an 8-bit write-only register, the individual bits of which specify input or output for the pins of port 1.
Port 1 is multiplexed with pins PO15 to PO8. Bits corresponding to pins used for PPG output must be set to 1. For further
information about P1DDR, see section 9.2, Port 1.
11.2.8
Bit
Port 2 Data Direction Register (P2DDR)
:
7
6
5
4
3
2
1
0
P27DDR P26DDR P25DDR P24DDR P23DDR P22DDR P21DDR P20DDR
Initial value :
0
0
0
0
0
0
0
0
R/W
W
W
W
W
W
W
W
W
:
P2DDR is an 8-bit write-only register, the individual bits of which specify input or output for the pins of port 2.
Port 2 is multiplexed with pins PO7 to PO0. Bits corresponding to pins used for PPG output must be set to 1. For further
information about P2DDR, see section 9.3, Port 2.
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11.2.9
Module Stop Control Register (MSTPCR)
MSTPCRH
Bit
MSTPCRL
:
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Initial value :
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
R/W
: R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
MSTPCR is a 16-bit readable/writable register that performs module stop mode control.
When the MSTP11 bit in MSTPCR is set to 1, PPG operation stops at the end of the bus cycle and a transition is made to
module stop mode. Registers cannot be read or written to in module stop mode. For details, see section 21.5, Module Stop
Mode.
MSTPCR is initialized to H'3FFF by a reset and in hardware standby mode. It is not initialized in software standby mode.
Bit 11—Module Stop (MSTP11): Specifies the PPG module stop mode.
Bit 11
MSTP11
Description
0
PPG module stop mode cleared
1
PPG module stop mode set
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(Initial value)
11.3
Operation
11.3.1
Overview
PPG pulse output is enabled when the corresponding bits in P1DDR, P2DDR, and NDER are set to 1. In this state the
corresponding PODR contents are output.
When the compare match event specified by PCR occurs, the corresponding NDR bit contents are transferred to PODR to
update the output values.
Figure 11-2 illustrates the PPG output operation and table 11-3 summarizes the PPG operating conditions.
DDR
NDER
Q
Output trigger signal
C
Q PODR D
Q NDR D
Internal data bus
Pulse output pin
Normal output/inverted output
Figure 11-2 PPG Output Operation
Table 11-3 PPG Operating Conditions
NDER
DDR
Pin Function
0
0
Generic input port
1
Generic output port
0
Generic input port (but the PODR bit is a read-only bit, and when
compare match occurs, the NDR bit value is transferred to the PODR bit)
1
PPG pulse output
1
Sequential output of data of up to 16 bits is possible by writing new output data to NDR before the next compare match.
For details of non-overlapping operation, see section 11.3.4, Non-Overlapping Pulse Output.
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11.3.2
Output Timing
If pulse output is enabled, NDR contents are transferred to PODR and output when the specified compare match event
occurs. Figure 11-3 shows the timing of these operations for the case of normal output in groups 2 and 3, triggered by
compare match A.
ø
N
TCNT
TGRA
N+1
N
Compare match
A signal
n
NDRH
PODRH
PO8 to PO15
m
n
m
n
Figure 11-3 Timing of Transfer and Output of NDR Contents (Example)
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11.3.3
Normal Pulse Output
Sample Setup Procedure for Normal Pulse Output: Figure 11-4 shows a sample procedure for setting up normal pulse
output.
Normal PPG output
Select TGR functions
[1]
Set TGRA value
[2]
Set counting operation
[3]
Select interrupt request
[4]
[1] Set TIOR to make TGRA an output
compare register (with output
disabled)
[2] Set the PPG output trigger period
TPU setup
Port and
PPG setup
TPU setup
Set initial output data
[5]
Enable pulse output
[6]
Select output trigger
[7]
Set next pulse
output data
[8]
Start counter
[9]
Compare match?
No
[3] Select the counter clock source
with bits TPSC2 to TPSC0 in TCR.
Select the counter clear source
with bits CCLR1 and CCLR0.
[4] Enable the TGIA interrupt in TIER.
The DTC or DMAC can also be set
up to transfer data to NDR.
[5] Set the initial output values in
PODR.
[6] Set the DDR and NDER bits for the
pins to be used for pulse output to 1.
[7] Select the TPU compare match
event to be used as the output
trigger in PCR.
[8] Set the next pulse output values in
NDR.
Yes
Set next pulse
output data
[10]
[9] Set the CST bit in TSTR to 1 to
start the TCNT counter.
[10] At each TGIA interrupt, set the next
output values in NDR.
Figure 11-4 Setup Procedure for Normal Pulse Output (Example)
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Example of Normal Pulse Output (Example of Five-Phase Pulse Output): Figure 11-5 shows an example in which
pulse output is used for cyclic five-phase pulse output.
TCNT value
Compare match
TCNT
TGRA
H'0000
Time
80
NDRH
PODRH
00
C0
80
40
C0
60
40
20
60
30
20
10
30
18
10
08
18
88
08
80
88
C0
80
40
C0
PO15
PO14
PO13
PO12
PO11
Figure 11-5 Normal Pulse Output Example (Five-Phase Pulse Output)
[1] Set up the TPU channel to be used as the output trigger channel so that TGRA is an output compare register and the
counter will be cleared by compare match A. Set the trigger period in TGRA and set the TGIEA bit in TIER to 1 to
enable the compare match A (TGIA) interrupt.
[2] Write H'F8 in P1DDR and NDERH, and set the G3CMS1, G3CMS0, G2CMS1, and G2CMS0 bits in PCR to select
compare match in the TPU channel set up in the previous step to be the output trigger. Write output data H'80 in
NDRH.
[3] The timer counter in the TPU channel starts. When compare match A occurs, the NDRH contents are transferred to
PODRH and output. The TGIA interrupt handling routine writes the next output data (H'C0) in NDRH.
[4] Five-phase overlapping pulse output (one or two phases active at a time) can be obtained subsequently by writing
H'40, H'60, H'20, H'30. H'10, H'18, H'08, H'88... at successive TGIA interrupts. If the DTC or DMAC is set for
activation by this interrupt, pulse output can be obtained without imposing a load on the CPU.
11.3.4
Non-Overlapping Pulse Output
Sample Setup Procedure for Non-Overlapping Pulse Output: Figure 11-6 shows a sample procedure for setting up
non-overlapping pulse output.
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[1] Set TIOR to make TGRA and
TGRB an output compare registers
(with output disabled)
Non-overlapping
PPG output
Select TGR functions
[1]
Set TGR values
[2]
Set counting operation
[3]
Select interrupt request
[4]
Set initial output data
[5]
TPU setup
PPG setup
TPU setup
Enable pulse output
[6]
Select output trigger
[7]
Set non-overlapping groups
[8]
Set next pulse
output data
[9]
Start counter
[10]
Compare match A?
No
[3] Select the counter clock source
with bits TPSC2 to TPSC0 in TCR.
Select the counter clear source
with bits CCLR1 and CCLR0.
[4] Enable the TGIA interrupt in TIER.
The DTC or DMAC can also be set
up to transfer data to NDR.
[5] Set the initial output values in
PODR.
[6] Set the DDR and NDER bits for the
pins to be used for pulse output to
1.
[7] Select the TPU compare match
event to be used as the pulse
output trigger in PCR.
[8] In PMR, select the groups that will
operate in non-overlap mode.
Yes
Set next pulse
output data
[2] Set the pulse output trigger period
in TGRB and the non-overlap
margin in TGRA.
[11]
[9] Set the next pulse output values in
NDR.
[10] Set the CST bit in TSTR to 1 to
start the TCNT counter.
[11] At each TGIA interrupt, set the next
output values in NDR.
Figure 11-6 Setup Procedure for Non-Overlapping Pulse Output (Example)
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Example of Non-Overlapping Pulse Output (Example of Four-Phase Complementary Non-Overlapping Output):
Figure 11-7 shows an example in which pulse output is used for four-phase complementary non-overlapping pulse output.
TCNT value
TGRB
TCNT
TGRA
H'0000
NDRH
PODRH
Time
95
00
65
95
59
05
65
56
41
59
95
50
56
65
14
95
05
65
Non-overlap margin
PO15
PO14
PO13
PO12
PO11
PO10
PO9
PO8
Figure 11-7 Non-Overlapping Pulse Output Example (Four-Phase Complementary)
[1] Set up the TPU channel to be used as the output trigger channel so that TGRA and TGRB are output compare registers.
Set the trigger period in TGRB and the non-overlap margin in TGRA, and set the counter to be cleared by compare
match B. Set the TGIEA bit in TIER to 1 to enable the TGIA interrupt.
[2] Write H'FF in P1DDR and NDERH, and set the G3CMS1, G3CMS0, G2CMS1, and G2CMS0 bits in PCR to select
compare match in the TPU channel set up in the previous step to be the output trigger. Set the G3NOV and G2NOV
bits in PMR to 1 to select non-overlapping output. Write output data H'95 in NDRH.
[3] The timer counter in the TPU channel starts. When a compare match with TGRB occurs, outputs change from 1 to 0.
When a compare match with TGRA occurs, outputs change from 0 to 1 (the change from 0 to 1 is delayed by the value
set in TGRA). The TGIA interrupt handling routine writes the next output data (H'65) in NDRH.
[4] Four-phase complementary non-overlapping pulse output can be obtained subsequently by writing H'59, H'56, H'95...
at successive TGIA interrupts. If the DTC or DMAC is set for activation by this interrupt, pulse output can be
obtained without imposing a load on the CPU.
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11.3.5
Inverted Pulse Output
If the G3INV, G2INV, G1INV, and G0INV bits in PMR are cleared to 0, values that are the inverse of the PODR contents
can be output.
Figure 11-8 shows the outputs when G3INV and G2INV are cleared to 0, in addition to the settings of figure 11-7.
TCNT value
TGRB
TCNT
TGRA
H'0000
NDRH
PODRL
Time
95
00
65
95
59
05
65
56
41
59
95
50
56
65
14
95
05
65
PO15
PO14
PO13
PO12
PO11
PO10
PO9
PO8
Figure 11-8 Inverted Pulse Output (Example)
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11.3.6
Pulse Output Triggered by Input Capture
Pulse output can be triggered by TPU input capture as well as by compare match. If TGRA functions as an input capture
register in the TPU channel selected by PCR, pulse output will be triggered by the input capture signal.
Figure 11-9 shows the timing of this output.
ø
TIOC pin
Input capture
signal
NDR
N
PODR
M
PO
M
N
N
Figure 11-9 Pulse Output Triggered by Input Capture (Example)
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11.4
Usage Notes
Operation of Pulse Output Pins: Pins PO0 to PO15 are also used for other peripheral functions such as the TPU. When
output by another peripheral function is enabled, the corresponding pins cannot be used for pulse output. Note, however,
that data transfer from NDR bits to PODR bits takes place, regardless of the usage of the pins.
Pin functions should be changed only under conditions in which the output trigger event will not occur.
Note on Non-Overlapping Output: During non-overlapping operation, the transfer of NDR bit values to PODR bits
takes place as follows.
• NDR bits are always transferred to PODR bits at compare match A.
• At compare match B, NDR bits are transferred only if their value is 0. Bits are not transferred if their value is 1.
Figure 11-10 illustrates the non-overlapping pulse output operation.
DDR
NDER
Q
Compare match A
Compare match B
Pulse
output
pin
C
Q PODR D
Q NDR D
Internal data bus
Normal output/inverted output
Figure 11-10 Non-Overlapping Pulse Output
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Therefore, 0 data can be transferred ahead of 1 data by making compare match B occur before compare match A. The
NDR contents should not be altered during the interval from compare match B to compare match A (the non-overlap
margin).
This can be accomplished by having the TGIA interrupt handling routine write the next data in NDR, or by having the
TGIA interrupt activate the DTC or DMAC. Note, however, that the next data must be written before the next compare
match B occurs.
Figure 11-11 shows the timing of this operation.
Compare match A
Compare match B
Write to NDR
Write to NDR
NDR
PODR
0 output
0/1 output
Write to NDR
Do not write here
to NDR here
0 output 0/1 output
Do not write
to NDR here
Write to NDR
here
Figure 11-11 Non-Overlapping Operation and NDR Write Timing
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Section 12 8-Bit Timers
12.1
Overview
The H8S/2357 Group includes an 8-bit timer module with two channels (TMR0 and TMR1). Each channel has an 8-bit
counter (TCNT) and two time constant registers (TCORA and TCORB) that are constantly compared with the TCNT
value to detect compare match events. The 8-bit timer module can thus be used for a variety of functions, including pulse
output with an arbitrary duty cycle.
12.1.1
Features
The features of the 8-bit timer module are listed below.
• Selection of four clock sources
The counters can be driven by one of three internal clock signals (ø/8, ø/64, or ø/8192) or an external clock input
(enabling use as an external event counter).
• Selection of three ways to clear the counters
The counters can be cleared on compare match A or B, or by an external reset signal.
• Timer output control by a combination of two compare match signals
The timer output signal in each channel is controlled by a combination of two independent compare match signals,
enabling the timer to generate output waveforms with an arbitrary duty cycle or PWM output.
• Provision for cascading of two channels
 Operation as a 16-bit timer is possible, using channel 0 for the upper 8 bits and channel 1 for the lower 8 bits (16bit count mode).
 Channel 1 can be used to count channel 0 compare matches (compare match count mode).
• Three independent interrupts
Compare match A and B and overflow interrupts can be requested independently.
• A/D converter conversion start trigger can be generated
Channel 0 compare match A signal can be used as an A/D converter conversion start trigger.
• Module stop mode can be set
 As the initial setting, 8-bit timer operation is halted. Register access is enabled by exiting module stop mode.
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12.1.2
Block Diagram
Figure 12-1 shows a block diagram of the 8-bit timer module.
External clock source
TMCI0
TMCI1
Internal clock sources
ø/8
ø/64
ø/8192
Clock select
Clock 1
Clock 0
TCORA0
Compare match A1
Compare match A0 Comparator A0
Overflow 1
Overflow 0
TMO0
TMRI0
TCNT0
TCORA1
Comparator A1
TCNT1
Clear 1
TMO1
TMRI1
Control logic
Compare match B1
Compare match B0 Comparator B0
A/D
conversion
start request
signal
Comparator B1
TCORB0
TCORB1
TCSR0
TCSR1
TCR0
TCR1
CMIA0
CMIB0
OVI0
CMIA1
CMIB1
OVI1
Interrupt signals
Figure 12-1 Block Diagram of 8-Bit Timer
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Internal bus
Clear 0
12.1.3
Pin Configuration
Table 12-1 summarizes the input and output pins of the 8-bit timer.
Table 12-1 Input and Output Pins of 8-Bit Timer
Channel
Name
Symbol
I/O
Function
0
Timer output pin 0
TMO0
Output
Outputs at compare match
Timer clock input pin 0
TMCI0
Input
Inputs external clock for counter
Timer reset input pin 0
TMRI0
Input
Inputs external reset to counter
Timer output pin 1
TMO1
Output
Outputs at compare match
Timer clock input pin 1
TMCI1
Input
Inputs external clock for counter
Timer reset input pin 1
TMRI1
Input
Inputs external reset to counter
1
12.1.4
Register Configuration
Table 12-2 summarizes the registers of the 8-bit timer module.
Table 12-2 8-Bit Timer Registers
Channel
Name
Abbreviation
R/W
0
Timer control register 0
TCR0
R/W
1
All
2
Initial value
Address* 1
H'00
H'FFB0
H'00
H'FFB2
Timer control/status register 0 TCSR0
R/(W)*
Time constant register A0
TCORA0
R/W
H'FF
H'FFB4
Time constant register B0
TCORB0
R/W
H'FF
H'FFB6
Timer counter 0
TCNT0
R/W
H'00
H'FFB8
Timer control register 1
TCR1
R/W
H'00
H'FFB1
H'10
H'FFB3
2
Timer control/status register 1 TCSR1
R/(W)*
Time constant register A1
TCORA1
R/W
H'FF
H'FFB5
Time constant register B1
TCORB1
R/W
H'FF
H'FFB7
Timer counter 1
TCNT1
R/W
H'00
H'FFB9
Module stop control register
MSTPCR
R/W
H'3FFF
H'FF3C
Notes: 1. Lower 16 bits of the address
2. Only 0 can be written to bits 7 to 5, to clear these flags.
Each pair of registers for channel 0 and channel 1 is a 16-bit register with the upper 8 bits for channel 0 and the lower 8
bits for channel 1, so they can be accessed together by word transfer instruction.
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12.2
Register Descriptions
12.2.1
Timer Counters 0 and 1 (TCNT0, TCNT1)
TCNT0
Bit
TCNT1
:
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Initial value :
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
R/W
: R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
TCNT0 and TCNT1 are 8-bit readable/writable up-counters that increment on pulses generated from an internal or
external clock source. This clock source is selected by clock select bits CKS2 to CKS0 of TCR. The CPU can read or
write to TCNT0 and TCNT1 at all times.
TCNT0 and TCNT1 comprise a single 16-bit register, so they can be accessed together by word transfer instruction.
TCNT0 and TCNT1 can be cleared by an external reset input or by a compare match signal. Which signal is to be used for
clearing is selected by clock clear bits CCLR1 and CCLR0 of TCR.
When a timer counter overflows from H'FF to H'00, OVF in TCSR is set to 1.
TCNT0 and TCNT1 are each initialized to H'00 by a reset and in hardware standby mode.
12.2.2
Time Constant Registers A0 and A1 (TCORA0, TCORA1)
TCORA0
Bit
TCORA1
:
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Initial value :
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
R/W
: R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
TCORA0 and TCORA1 are 8-bit readable/writable registers. TCORA0 and TCORA1 comprise a single 16-bit register so
they can be accessed together by word transfer instruction.
TCORA is continually compared with the value in TCNT. When a match is detected, the corresponding CMFA flag of
TCSR is set. Note, however, that comparison is disabled during the T2 state of a TCOR write cycle.
The timer output can be freely controlled by these compare match signals and the settings of bits OS1 and OS0 of TCSR.
TCORA0 and TCORA1 are each initialized to H'FF by a reset and in hardware standby mode.
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12.2.3
Time Constant Registers B0 and B1 (TCORB0, TCORB1)
TCORB0
Bit
TCORB1
:
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Initial value :
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
R/W
: R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
TCORB0 and TCORB1 are 8-bit readable/writable registers. TCORB0 and TCORB1 comprise a single 16-bit register so
they can be accessed together by word transfer instruction.
TCORB is continually compared with the value in TCNT. When a match is detected, the corresponding CMFB flag of
TCSR is set. Note, however, that comparison is disabled during the T2 state of a TCOR write cycle.
The timer output can be freely controlled by these compare match signals and the settings of output select bits OS3 and
OS2 of TCSR.
TCORB0 and TCORB1 are each initialized to H'FF by a reset and in hardware standby mode.
12.2.4
Time Control Registers 0 and 1 (TCR0, TCR1)
Bit
:
7
6
5
4
3
2
1
0
CMIEB
CMIEA
OVIE
CCLR1
CCLR0
CKS2
CKS1
CKS0
0
0
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Initial value :
R/W
:
TCR0 and TCR1 are 8-bit readable/writable registers that select the clock source and the time at which TCNT is cleared,
and enable interrupts.
TCR0 and TCR1 are each initialized to H'00 by a reset and in hardware standby mode.
For details of this timing, see section 12.3, Operation.
Bit 7—Compare Match Interrupt Enable B (CMIEB): Selects whether CMFB interrupt requests (CMIB) are enabled
or disabled when the CMFB flag of TCSR is set to 1.
Bit 7
CMIEB
Description
0
CMFB interrupt requests (CMIB) are disabled
1
CMFB interrupt requests (CMIB) are enabled
(Initial value)
Bit 6—Compare Match Interrupt Enable A (CMIEA): Selects whether CMFA interrupt requests (CMIA) are enabled
or disabled when the CMFA flag of TCSR is set to 1.
Bit 6
CMIEA
Description
0
CMFA interrupt requests (CMIA) are disabled
1
CMFA interrupt requests (CMIA) are enabled
(Initial value)
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Bit 5—Timer Overflow Interrupt Enable (OVIE): Selects whether OVF interrupt requests (OVI) are enabled or
disabled when the OVF flag of TCSR is set to 1.
Bit 5
OVIE
Description
0
OVF interrupt requests (OVI) are disabled
1
OVF interrupt requests (OVI) are enabled
(Initial value)
Bits 4 and 3—Counter Clear 1 and 0 (CCLR1 and CCLR0): These bits select the method by which TCNT is cleared:
by compare match A or B, or by an external reset input.
Bit 4
CCLR1
Bit 3
CCLR0
Description
0
0
Clear is disabled
1
Clear by compare match A
0
Clear by compare match B
1
Clear by rising edge of external reset input
1
(Initial value)
Bits 2 to 0—Clock Select 2 to 0 (CKS2 to CKS0): These bits select whether the clock input to TCNT is an internal or
external clock.
Three internal clocks can be selected, all divided from the system clock (ø): ø/8, ø/64, and ø/8192. The falling edge of the
selected internal clock triggers the count.
When use of an external clock is selected, three types of count can be selected: at the rising edge, the falling edge, and
both rising and falling edges.
Some functions differ between channel 0 and channel 1.
Bit 2
CKS2
Bit 1
CKS1
Bit 0
CKS0
Description
0
0
0
Clock input disabled
1
Internal clock, counted at falling edge of ø/8
0
Internal clock, counted at falling edge of ø/64
1
Internal clock, counted at falling edge of ø/8192
0
For channel 0: count at TCNT1 overflow signal*
1
1
0
(Initial value)
For channel 1: count at TCNT0 compare match A*
1
1
External clock, counted at rising edge
0
External clock, counted at falling edge
1
External clock, counted at both rising and falling edges
Note: * If the count input of channel 0 is the TCNT1 overflow signal and that of channel 1 is the TCNT0 compare match
signal, no incrementing clock is generated. Do not use this setting.
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12.2.5
Timer Control/Status Registers 0 and 1 (TCSR0, TCSR1)
TCSR0
Bit
:
7
6
5
4
3
2
1
0
CMFB
CMFA
OVF
ADTE
OS3
OS2
OS1
OS0
0
0
0
0
0
0
0
0
:
R/(W)*
R/(W)*
R/(W)*
R/W
R/W
R/W
R/W
R/W
:
7
6
5
4
3
2
1
0
CMFB
CMFA
OVF
—
OS3
OS2
OS1
OS0
Initial value :
R/W
TCSR1
Bit
Initial value :
R/W
:
0
0
0
1
0
0
0
0
R/(W)*
R/(W)*
R/(W)*
—
R/W
R/W
R/W
R/W
Note: * Only 0 can be written to bits 7 to 5, to clear these flags.
TCSR0 and TCSR1 are 8-bit registers that display compare match and overflow statuses, and control compare match
output.
TCSR0 is initialized to H'00, and TCSR1 to H'10, by a reset and in hardware standby mode.
Bit 7—Compare Match Flag B (CMFB): Status flag indicating whether the values of TCNT and TCORB match.
Bit 7
CMFB
Description
0
[Clearing conditions]
1
(Initial value)
•
Cleared by reading CMFB when CMFB = 1, then writing 0 to CMFB
•
When DTC is activated by CMIB interrupt while DISEL bit of MRB in DTC is 0
[Setting condition]
Set when TCNT matches TCORB
Bit 6—Compare Match Flag A (CMFA): Status flag indicating whether the values of TCNT and TCORA match.
Bit 6
CMFA
Description
0
[Clearing conditions]
1
(Initial value)
•
Cleared by reading CMFA when CMFA = 1, then writing 0 to CMFA
•
When DTC is activated by CMIA interrupt while DISEL bit of MRB in DTC is 0
[Setting condition]
Set when TCNT matches TCORA
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Bit 5—Timer Overflow Flag (OVF): Status flag indicating that TCNT has overflowed (changed from H'FF to H'00).
Bit 5
OVF
Description
0
[Clearing condition]
(Initial value)
Cleared by reading OVF when OVF = 1, then writing 0 to OVF
1
[Setting condition]
Set when TCNT overflows from H'FF to H'00
Bit 4—A/D Trigger Enable (ADTE) (TCSR0 Only): Selects enabling or disabling of A/D converter start requests by
compare-match A.
In TCSR1, this bit is reserved: it is always read as 1 and cannot be modified.
Bit 4
ADTE
Description
0
A/D converter start requests by compare match A are disabled
1
A/D converter start requests by compare match A are enabled
(Initial value)
Bits 3 to 0—Output Select 3 to 0 (OS3 to OS0): These bits specify how the timer output level is to be changed by a
compare match of TCOR and TCNT.
Bits OS3 and OS2 select the effect of compare match B on the output level, bits OS1 and OS0 select the effect of compare
match A on the output level, and both of them can be controlled independently.
Note, however, that priorities are set such that: toggle output > 1 output > 0 output. If compare matches occur
simultaneously, the output changes according to the compare match with the higher priority.
Timer output is disabled when bits OS3 to OS0 are all 0.
After a reset, the timer output is 0 until the first compare match event occurs.
Bit 3
OS3
Bit 2
OS2
Description
0
0
No change when compare match B occurs
1
0 is output when compare match B occurs
0
1 is output when compare match B occurs
1
Output is inverted when compare match B occurs (toggle output)
Bit 1
OS1
Bit 0
OS0
Description
0
0
No change when compare match A occurs
1
0 is output when compare match A occurs
0
1 is output when compare match A occurs
1
Output is inverted when compare match A occurs (toggle output)
1
1
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(Initial value)
(Initial value)
12.2.6
Module Stop Control Register (MSTPCR)
MSTPCRH
Bit
MSTPCRL
:
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Initial value :
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
R/W
: R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
MSTPCR is a 16-bit readable/writable register that performs module stop mode control.
When the MSTP12 bit in MSTPCR is set to 1, the 8-bit timer operation stops at the end of the bus cycle and a transition is
made to module stop mode. Registers cannot be read or written to in module stop mode. For details, see section 21.5,
Module Stop Mode.
MSTPCR is initialized to H'3FFF by a reset and in hardware standby mode. It is not initialized in software standby mode.
Bit 12—Module Stop (MSTP12): Specifies the 8-bit timer module stop mode.
Bit 12
MSTP12
Description
0
8-bit timer module stop mode cleared
1
8-bit timer module stop mode set
(Initial value)
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12.3
Operation
12.3.1
TCNT Incrementation Timing
TCNT is incremented by input clock pulses (either internal or external).
Internal Clock: Three different internal clock signals (ø/8, ø/64, or ø/8192) divided from the system clock (ø) can be
selected, by setting bits CKS2 to CKS0 in TCR. Figure 12-2 shows the count timing.
ø
Internal clock
Clock input
to TCNT
TCNT
N–1
N
N+1
Figure 12-2 Count Timing for Internal Clock Input
External Clock: Three incrementation methods can be selected by setting bits CKS2 to CKS0 in TCR: at the rising edge,
the falling edge, and both rising and falling edges.
Note that the external clock pulse width must be at least 1.5 states for incrementation at a single edge, and at least 2.5
states for incrementation at both edges. The counter will not increment correctly if the pulse width is less than these
values.
Figure 12-3 shows the timing of incrementation at both edges of an external clock signal.
ø
External clock
input
Clock input
to TCNT
TCNT
N–1
N
Figure 12-3 Count Timing for External Clock Input
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N+1
12.3.2
Compare Match Timing
Setting of Compare Match Flags A and B (CMFA, CMFB): The CMFA and CMFB flags in TCSR are set to 1 by a
compare match signal generated when the TCOR and TCNT values match. The compare match signal is generated at the
last state in which the match is true, just before the timer counter is updated.
Therefore, when TCOR and TCNT match, the compare match signal is not generated until the next incrementation clock
input. Figure 12-4 shows this timing.
ø
TCNT
N
TCOR
N
N+1
Compare match
signal
CMF
Figure 12-4 Timing of CMF Setting
Timer Output Timing: When compare match A or B occurs, the timer output changes a specified by bits OS3 to OS0 in
TCSR. Depending on these bits, the output can remain the same, change to 0, change to 1, or toggle.
Figure 12-5 shows the timing when the output is set to toggle at compare match A.
ø
Compare match A
signal
Timer output pin
Figure 12-5 Timing of Timer Output
Timing of Compare Match Clear: The timer counter is cleared when compare match A or B occurs, depending on the
setting of the CCLR1 and CCLR0 bits in TCR. Figure 12-6 shows the timing of this operation.
ø
Compare match
signal
TCNT
N
H'00
Figure 12-6 Timing of Compare Match Clear
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12.3.3
Timing of External RESET on TCNT
TCNT is cleared at the rising edge of an external reset input, depending on the settings of the CCLR1 and CCLR0 bits in
TCR. The clear pulse width must be at least 1.5 states. Figure 12-7 shows the timing of this operation.
ø
External reset
input pin
Clear signal
TCNT
N–1
N
H'00
Figure 12-7 Timing of External Reset
12.3.4
Timing of Overflow Flag (OVF) Setting
The OVF in TCSR is set to 1 when the timer count overflows (changes from H'FF to H'00). Figure 12-8 shows the timing
of this operation.
ø
TCNT
H'FF
H'00
Overflow signal
OVF
Figure 12-8 Timing of OVF Setting
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12.3.5
Operation with Cascaded Connection
If bits CKS2 to CKS0 in either TCR0 or TCR1 are set to B’100, the 8-bit timers of the two channels are cascaded. With
this configuration, a single 16-bit timer could be used (16-bit timer mode) or compare matches of the 8-bit channel 0 could
be counted by the timer of channel 1 (compare match counter mode). In this case, the timer operates as below.
16-Bit Counter Mode: When bits CKS2 to CKS0 in TCR0 are set to B'100, the timer functions as a single 16-bit timer
with channel 0 occupying the upper 8 bits and channel 1 occupying the lower 8 bits.
• Setting of compare match flags
 The CMF flag in TCSR0 is set to 1 when a 16-bit compare match event occurs.
 The CMF flag in TCSR1 is set to 1 when a lower 8-bit compare match event occurs.
• Counter clear specification
 If the CCLR1 and CCLR0 bits in TCR0 have been set for counter clear at compare match, the 16-bit counter
(TCNT0 and TCNT1 together) is cleared when a 16-bit compare match event occurs. The 16-bit counter (TCNT0
and TCNT1 together) is cleared even if counter clear by the TMRI0 pin has also been set.
 The settings of the CCLR1 and CCLR0 bits in TCR1 are ignored. The lower 8 bits cannot be cleared
independently.
• Pin output
 Control of output from the TMO0 pin by bits OS3 to OS0 in TCSR0 is in accordance with the 16-bit compare
match conditions.
 Control of output from the TMO1 pin by bits OS3 to OS0 in TCSR1 is in accordance with the lower 8-bit compare
match conditions.
Compare Match Counter Mode: When bits CKS2 to CKS0 in TCR1 are B'100, TCNT1 counts compare match A’s for
channel 0.
Channels 0 and 1 are controlled independently. Conditions such as setting of the CMF flag, generation of interrupts,
output from the TMO pin, and counter clear are in accordance with the settings for each channel.
Note on Usage: If the 16-bit counter mode and compare match counter mode are set simultaneously, the input clock
pulses for TCNT0 and TCNT1 are not generated and thus the counters will stop operating. Software should therefore
avoid using both these modes.
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12.4
Interrupts
12.4.1
Interrupt Sources and DTC Activation
There are three 8-bit timer interrupt sources: CMIA, CMIB, and OVI. Their relative priorities are shown in table 12-3.
Each interrupt source is set as enabled or disabled by the corresponding interrupt enable bit in TCR, and independent
interrupt requests are sent for each to the interrupt controller. It is also possible to activate the DTC by means of CMIA
and CMIB interrupts.
Table 12-3 8-Bit Timer Interrupt Sources
Channel
Interrupt Source
Description
DTC Activation
0
CMIA0
Interrupt by CMFA
Possible
CMIB0
Interrupt by CMFB
Possible
OVI0
Interrupt by OVF
Not possible
CMIA1
Interrupt by CMFA
Possible
CMIB1
Interrupt by CMFB
Possible
OVI1
Interrupt by OVF
Not possible
1
Priority
High
Low
Note: This table shows the initial state immediately after a reset. The relative channel priorities can be changed by the
interrupt controller.
12.4.2
A/D Converter Activation
The A/D converter can be activated only by channel 0 compare match A.
If the ADTE bit in TCSR0 is set to 1 when the CMFA flag is set to 1 by the occurrence of channel 0 compare match A, a
request to start A/D conversion is sent to the A/D converter. If the 8-bit timer conversion start trigger has been selected on
the A/D converter side at this time, A/D conversion is started.
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12.5
Sample Application
In the example below, the 8-bit timer is used to generate a pulse output with a selected duty cycle, as shown in figure 12-9.
The control bits are set as follows:
[1] In TCR, bit CCLR1 is cleared to 0 and bit CCLR0 is set to 1 so that the timer counter is cleared when its value matches
the constant in TCORA.
[2] In TCSR, bits OS3 to OS0 are set to B'0110, causing the output to change to 1 at a TCORA compare match and to 0 at
a TCORB compare match.
With these settings, the 8-bit timer provides output of pulses at a rate determined by TCORA with a pulse width
determined by TCORB. No software intervention is required.
TCNT
H'FF
Counter clear
TCORA
TCORB
H'00
TMO
Figure 12-9 Example of Pulse Output
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12.6
Usage Notes
Application programmers should note that the following kinds of contention can occur in the 8-bit timer.
12.6.1
Contention between TCNT Write and Clear
If a timer counter clock pulse is generated during the T2 state of a TCNT write cycle, the clear takes priority, so that the
counter is cleared and the write is not performed.
Figure 12-10 shows this operation.
TCNT write cycle by CPU
T1
T2
ø
Address
TCNT address
Internal write signal
Counter clear signal
TCNT
N
H'00
Figure 12-10 Contention between TCNT Write and Clear
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12.6.2
Contention between TCNT Write and Increment
If a timer counter clock pulse is generated during the T2 state of a TCNT write cycle, the write takes priority and the
counter is not incremented.
Figure 12-11 shows this operation.
TCNT write cycle by CPU
T1
T2
ø
Address
TCNT address
Internal write signal
TCNT input clock
TCNT
N
M
Counter write data
Figure 12-11 Contention between TCNT Write and Increment
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12.6.3
Contention between TCOR Write and Compare Match
During the T 2 state of a TCOR write cycle, the TCOR write has priority and the compare match signal is disabled even if a
compare match event occurs.
Figure 12-12 shows this operation.
TCOR write cycle by CPU
T1
T2
ø
Address
TCOR address
Internal write signal
TCNT
N
N+1
TCOR
N
M
TCOR write data
Compare match signal
Prohibited
Figure 12-12 Contention between TCOR Write and Compare Match
12.6.4
Contention between Compare Matches A and B
If compare match events A and B occur at the same time, the 8-bit timer operates in accordance with the priorities for the
output statuses set for compare match A and compare match B, as shown in table 12-4.
Table 12-4 Timer Output Priorities
Output Setting
Toggle output
Priority
High
1 output
0 output
No change
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Low
12.6.5
Switching of Internal Clocks and TCNT Operation
TCNT may increment erroneously when the internal clock is switched over. Table 12-5 shows the relationship between
the timing at which the internal clock is switched (by writing to the CKS1 and CKS0 bits) and the TCNT operation.
When the TCNT clock is generated from an internal clock, the falling edge of the internal clock pulse is detected. If clock
switching causes a change from high to low level, as shown in case 3 in table 12-5, a TCNT clock pulse is generated on
the assumption that the switchover is a falling edge. This increments TCNT.
The erroneous incrementation can also happen when switching between internal and external clocks.
Table 12-5 Switching of Internal Clock and TCNT Operation
No.
1
Timing of Switchover
by Means of CKS1
and CKS0 Bits
TCNT Clock Operation
Switching from
low to low* 1
Clock before
switchover
Clock after
switchover
TCNT clock
TCNT
N
N+1
CKS bit write
2
Switching from
low to high* 2
Clock before
switchover
Clock after
switchover
TCNT clock
TCNT
N
N+1
N+2
CKS bit write
3
Switching from
high to low* 3
Clock before
switchover
Clock after
switchover
*4
TCNT clock
TCNT
N
N+1
N+2
CKS bit write
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No.
4
Timing of Switchover
by Means of CKS1
and CKS0 Bits
TCNT Clock Operation
Switching from high
to high
Clock before
switchover
Clock after
switchover
TCNT clock
TCNT
N
N+1
N+2
CKS bit write
Notes: 1.
2.
3.
4.
12.6.6
Includes switching from low to stop, and from stop to low.
Includes switching from stop to high.
Includes switching from high to stop.
Generated on the assumption that the switchover is a falling edge; TCNT is incremented.
Interrupts and Module Stop Mode
If module stop mode is entered when an interrupt has been requested, it will not be possible to clear the CPU interrupt
source or the DMAC or DTC activation source. Interrupts should therefore be disabled before entering module stop mode.
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Section 13 Watchdog Timer
13.1
Overview
The H8S/2357 Group has a single-channel on-chip watchdog timer (WDT) for monitoring system operation. The WDT
outputs an overflow signal (WDTOVF) if a system crash prevents the CPU from writing to the timer counter, allowing it
to overflow. At the same time, the WDT can also generate an internal reset signal for the H8S/2357 Group.
When this watchdog function is not needed, the WDT can be used as an interval timer. In interval timer operation, an
interval timer interrupt is generated each time the counter overflows.
13.1.1
Features
WDT features are listed below.
• Switchable between watchdog timer mode and interval timer mode
• WDTOVF output when in watchdog timer mode*1
If the counter overflows, the WDT outputs WDTOVF. It is possible to select whether or not the entire H8S/2357
Group is reset at the same time. This internal reset can be a power-on reset or a manual reset.* 2
• Interrupt generation when in interval timer mode
If the counter overflows, the WDT generates an interval timer interrupt.
• Choice of eight counter clock sources.
Notes: 1. The WDTOVF pin function is not available in the F-ZTAT versions, and the H8S/2398, H8S/2394, H8S/2392,
and H8S/2390.
2. Manual reset is only supported in the H8S/2357 ZTAT.
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13.1.2
Block Diagram
Figure 13-1 shows a block diagram of the WDT.
Overflow
Clock
WDTOVF*2
Internal reset
Clock
select
Reset
control
signal*1
RSTCSR
ø/2
ø/64
ø/128
ø/512
ø/2048
ø/8192
ø/32768
ø/131072
Internal clock
sources
TCNT
TSCR
Module bus
Bus
interface
Internal bus
WOVI
(interrupt request
signal)
Interrupt
control
WDT
Legend:
TCSR:
Timer control/status register
TCNT:
Timer counter
RSTCSR: Reset control/status register
Notes: 1. The type of internal reset signal depends on a register setting. Either power-on
reset or manual reset can be selected. Manual reset is only supported in the H8S/2357 ZTAT.
2. The WDTOVF pin function is not available in the F-ZTAT version, the H8S/2398, H8S/2394, H8S/2392,
or H8S/2390.
Figure 13-1 Block Diagram of WDT
13.1.3
Pin Configuration
Table 13-1 describes the WDT output pin.
Table 13-1 WDT Pin
Name
Symbol
I/O
Watchdog timer overflow
WDTOVF* Output
Function
Outputs counter overflow signal in watchdog
timer mode
Note: * The WDTOVF pin function is not available in the F-ZTAT version, the H8S/2398, H8S/2394, H8S/2392 or
H8S/2390.
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13.1.4
Register Configuration
The WDT has three registers, as summarized in table 13-2. These registers control clock selection, WDT mode switching,
and the reset signal.
Table 13-2 WDT Registers
Address* 1
Name
Abbreviation
R/W
Timer control/status register
TCSR
R/(W)*
Timer counter
TCNT
R/W
Reset control/status register
RSTCSR
R/(W)*
3
3
Initial Value
Write*2
Read
H'18
H'FFBC
H'FFBC
H'00
H'FFBC
H'FFBD
H'1F
H'FFBE
H'FFBF
Notes: 1. Lower 16 bits of the address.
2. For details of write operations, see section 13.2.4, Notes on Register Access.
3. Only a write of 0 is permitted to bit 7, to clear the flag.
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13.2
Register Descriptions
13.2.1
Timer Counter (TCNT)
Bit
:
Initial value :
R/W
:
7
6
5
4
3
2
1
0
0
0
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
TCNT is an 8-bit readable/writable*1 up-counter.
When the TME bit is set to 1 in TCSR, TCNT starts counting pulses generated from the internal clock source selected by
bits CKS2 to CKS0 in TCSR. When the count overflows (changes from H'FF to H'00), either the watchdog timer overflow
signal (WDTOVF)*2 or an interval timer interrupt (WOVI) is generated, depending on the mode selected by the WT/IT bit
in TCSR.
TCNT is initialized to H'00 by a reset, in hardware standby mode, or when the TME bit is cleared to 0. It is not initialized
in software standby mode.
Notes: 1. TCNT is write-protected by a password to prevent accidental overwriting. For details see section 13.2.4,
Notes on Register Access.
2. The WDTOVF pin function is not available in the F-ZTAT version, the H8S/2398, H8S/2394, H8S/2392 or
H8S/2390.
13.2.2
Bit
Timer Control/Status Register (TCSR)
:
Initial value :
R/W
:
7
6
5
4
3
2
1
0
OVF
WT/IT
TME
—
—
CKS2
CKS1
CKS0
0
0
0
1
1
0
0
0
R/(W)*
R/W
R/W
—
—
R/W
R/W
R/W
Note: * Can only be written with 0 for flag clearing.
TCSR is an 8-bit readable/writable* register. Its functions include selecting the clock source to be input to TCNT, and the
timer mode.
TCR is initialized to H'18 by a reset and in hardware standby mode. It is not initialized in software standby mode.
Note: * TCSR is write-protected by a password to prevent accidental overwriting. For details see section 13.2.4, Notes on
Register Access.
Bit 7—Overflow Flag (OVF): Indicates that TCNT has overflowed from H'FF to H'00, when in interval timer mode. This
flag cannot be set during watchdog timer operation.
Bit 7
OVF
Description
0
[Clearing condition]
Cleared by reading TCSR when OVF = 1, then writing 0 to OVF
1
(Initial value)
[Setting condition]
Set when TCNT overflows (changes from H'FF to H'00) in interval timer mode
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Bit 6—Timer Mode Select (WT/IT): Selects whether the WDT is used as a watchdog timer or interval timer. If used as
an interval timer, the WDT generates an interval timer interrupt request (WOVI) when TCNT overflows. If used as a
watchdog timer, the WDT generates the WDTOVF signal*1 when TCNT overflows.
Bit 6
WT/IT
Description
0
Interval timer: Sends the CPU an interval timer interrupt request (WOVI)
when TCNT overflows
(Initial value)
1
Watchdog timer: Generates the WDTOVF signal* 1 when TCNT overflows* 2
Notes: 1. The WDTOVF pin function is not available in the F-ZTAT version, the H8S/2398, H8S/2394, H8S/2392 or
H8S/2390.
2. For details of the case where TCNT overflows in watchdog timer mode, see section 13.2.3, Reset
Control/Status Register (RSTCSR).
Bit 5—Timer Enable (TME): Selects whether TCNT runs or is halted.
Bit 5
TME
Description
0
TCNT is initialized to H'00 and halted
1
TCNT counts
(Initial value)
Bits 4 and 3—Reserved: These bits cannot be modified and are always read as 1.
Bits 2 to 0—Clock Select 2 to 0 (CKS2 to CKS0): These bits select one of eight internal clock sources, obtained by
dividing the system clock (ø), for input to TCNT.
Description
Bit 2
CKS2
Bit 1
CKS1
Bit 0
CKS0
Clock
Overflow Period (when ø = 20 MHz)*
0
0
0
ø/2 (Initial value)
25.6 µs
1
ø/64
819.2 µs
0
ø/128
1.6 ms
1
ø/512
6.6 ms
0
ø/2048
26.2 ms
1
ø/8192
104.9 ms
0
ø/32768
419.4 ms
1
ø/131072
1.68 s
1
1
0
1
Note: * The overflow period is the time from when TCNT starts counting up from H'00 until overflow occurs.
13.2.3
Bit
Reset Control/Status Register (RSTCSR)
:
Initial value :
R/W
:
7
6
5
4
3
2
1
0
WOVF
RSTE
RSTS
—
—
—
—
—
0
0
0
1
1
1
1
1
R/(W)*
R/W
R/W
—
—
—
—
—
Note: * Can only be written with 0 for flag clearing.
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RSTCSR is an 8-bit readable/writable* register that controls the generation of the internal reset signal when TCNT
overflows, and selects the type of internal reset signal.
RSTCSR is initialized to H'1F by a reset signal from the RES pin, but not by the WDT internal reset signal caused by
overflows.
Note: * RSTCSR is write-protected by a password to prevent accidental overwriting. For details see section 13.2.4, Notes
on Register Access.
Bit 7—Watchdog Overflow Flag (WOVF): Indicates that TCNT has overflowed (changed from H'FF to H'00) during
watchdog timer operation. This bit is not set in interval timer mode.
Bit 7
WOVF
Description
0
[Clearing condition]
(Initial value)
Cleared by reading RSTCSR when WOVF = 1, then writing 0 to WOVF
1
[Setting condition]
Set when TCNT overflows (changed from H'FF to H'00) during watchdog timer
operation
Bit 6—Reset Enable (RSTE): Specifies whether or not a reset signal is generated in the H8S/2357 Group if TCNT
overflows during watchdog timer operation.
Bit 6
RSTE
Description
0
Reset signal is not generated if TCNT overflows*
1
Reset signal is generated if TCNT overflows
(Initial value)
Note: * The modules within the H8S/2357 Group are not reset, but TCNT and TCSR within the WDT are reset.
Bit 5—Reset Select (RSTS): Selects the type of internal reset generated if TCNT overflows during watchdog timer
operation.
For details of the types of resets, see section 4, Exception Handling.
Bit 5
RSTS
Description
0
Power-on reset
1
Manual reset*
(Initial value)
Note: * Manual reset is supported only in the H8S/2357 ZTAT. In the models except the H8S/2357 ZTAT, only 0 should be
written to this bit.
Bits 4 to 0—Reserved: These bits cannot be modified and are always read as 1.
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13.2.4
Notes on Register Access
The watchdog timer’s TCNT, TCSR, and RSTCSR registers differ from other registers in being more difficult to write to.
The procedures for writing to and reading these registers are given below.
Writing to TCNT and TCSR: These registers must be written to by a word transfer instruction. They cannot be written
to with byte instructions.
Figure 13-2 shows the format of data written to TCNT and TCSR. TCNT and TCSR both have the same write address.
For a write to TCNT, the upper byte of the written word must contain H'5A and the lower byte must contain the write data.
For a write to TCSR, the upper byte of the written word must contain H'A5 and the lower byte must contain the write data.
This transfers the write data from the lower byte to TCNT or TCSR.
TCNT write
15
8 7
H'5A
Address: H'FFBC
0
Write data
TCSR write
15
8 7
H'A5
Address: H'FFBC
0
Write data
Figure 13-2 Format of Data Written to TCNT and TCSR
Writing to RSTCSR: RSTCSR must be written to by word transfer instruction to address H'FFBE. It cannot be written to
with byte instructions.
Figure 13-3 shows the format of data written to RSTCSR. The method of writing 0 to the WOVF bit differs from that for
writing to the RSTE and RSTS bits.
To write 0 to the WOVF bit, the write data must have H'A5 in the upper byte and H'00 in the lower byte. This clears the
WOVF bit to 0, but has no effect on the RSTE and RSTS bits. To write to the RSTE and RSTS bits, the upper byte must
contain H'5A and the lower byte must contain the write data. This writes the values in bits 6 and 5 of the lower byte into
the RSTE and RSTS bits, but has no effect on the WOVF bit.
Writing 0 to WOVF bit
15
8 7
0
H'A5
Address: H'FFBE
H'00
Writing to RSTE and RSTS bits
15
Address: H'FFBE
8 7
H'5A
0
Write data
Figure 13-3 Format of Data Written to RSTCSR
Reading TCNT, TCSR, and RSTCSR: These registers are read in the same way as other registers. The read addresses
are H'FFBC for TCSR, H'FFBD for TCNT, and H'FFBF for RSTCSR.
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13.3
Operation
13.3.1
Watchdog Timer Operation
To use the WDT as a watchdog timer, set the WT/IT and TME bits to 1. Software must prevent TCNT overflows by
rewriting the TCNT value (normally be writing H'00) before overflows occurs. This ensures that TCNT does not overflow
while the system is operating normally. If TCNT overflows without being rewritten because of a system crash or other
error, the WDTOVF signal*1 is output. This is shown in figure 13-4. This WDTOVF signal*1 can be used to reset the
system. The WDTOVF signal*1 is output for 132 states when RSTE = 1, and for 130 states when RSTE = 0.
If TCNT overflows when 1 is set in the RSTE bit in RSTCSR, a signal that resets the H8S/2357 Group internally is
generated at the same time as the WDTOVF signal*1. This reset can be selected as a power-on reset or a manual reset*2,
depending on the setting of the RSTS bit in RSTCSR. The internal reset signal is output for 518 states.
If a reset caused by a signal input to the RES pin occurs at the same time as a reset caused by a WDT overflow, the RES
pin reset has priority and the WOVF bit in RSTCSR is cleared to 0.
Notes: 1. In the F-ZTAT version, the H8S/2398, H8S/2394, H8S/2392, or H8S/2390, the WDTOVF pin function is not
available.
2. Manual reset is only supported in the H8S/2357 ZTAT.
TCNT count
Overflow
H'FF
Time
H'00
WT/IT=1
TME=1
H'00 written
to TCNT
WOVF=1
WDTOVF *3 and
internal reset are
generated
WT/IT=1
TME=1
H'00 written
to TCNT
WDTOVF signal*3
132 states*2
Internal reset
signal*1
518 states
Legend:
WT/IT: Timer mode select bit
TME: Timer enable bit
Notes: 1. The internal reset signal is generated only if the RSTE bit is set to 1.
2. 130 states when the RSTE bit is cleared to 0.
3. The WDTOVF pin function is not available in the F-ZTAT version, the H8S/2398, H8S/2394,
H8S/2392, or H8S/2390.
Figure 13-4 Watchdog Timer Operation
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13.3.2
Interval Timer Operation
To use the WDT as an interval timer, clear the WT/IT bit in TCSR to 0 and set the TME bit to 1. An interval timer
interrupt (WOVI) is generated each time TCNT overflows, provided that the WDT is operating as an interval timer, as
shown in figure 13-5. This function can be used to generate interrupt requests at regular intervals.
TCNT count
Overflow
H'FF
Overflow
Overflow
Overflow
Time
H'00
WT/IT=0
TME=1
WOVI
WOVI
WOVI
WOVI
Legend:
WOVI: Interval timer interrupt request generation
Figure 13-5 Interval Timer Operation
13.3.3
Timing of Setting Overflow Flag (OVF)
The OVF flag is set to 1 if TCNT overflows during interval timer operation. At the same time, an interval timer interrupt
(WOVI) is requested. This timing is shown in figure 13-6.
ø
TCNT
H'FF
H'00
Overflow signal
(internal signal)
OVF
Figure 13-6 Timing of Setting of OVF
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13.3.4
Timing of Setting of Watchdog Timer Overflow Flag (WOVF)
The WOVF flag is set to 1 if TCNT overflows during watchdog timer operation. At the same time, the WDTOVF signal*
goes low. If TCNT overflows while the RSTE bit in RSTCSR is set to 1, an internal reset signal is generated for the entire
H8S/2357 Group chip. Figure 13-7 shows the timing in this case.
Note: * The WDTOVF pin function is not available in the F-ZTAT version, the H8S/2398, H8S/2394, H8S/2392, or
H8S/2390.
ø
TCNT
H'FF
H'00
Overflow signal
(internal signal)
WOVF
132 states
WDTOVF signal*
Internal reset
signal
518 states
Note: * The WDTOVF pin function is not available in the F-ZTAT version, the H8S/2398, H8S/2394, H8S/2392,
or H8S/2390.
Figure 13-7 Timing of Setting of WOVF
13.4
Interrupts
During interval timer mode operation, an overflow generates an interval timer interrupt (WOVI). The interval timer
interrupt is requested whenever the OVF flag is set to 1 in TCSR.
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13.5
Usage Notes
13.5.1
Contention between Timer Counter (TCNT) Write and Increment
If a timer counter clock pulse is generated during the T2 state of a TCNT write cycle, the write takes priority and the timer
counter is not incremented. Figure 13-8 shows this operation.
TCNT write cycle
T1
T2
ø
Address
Internal write signal
TCNT input clock
TCNT
N
M
Counter write data
Figure 13-8 Contention between TCNT Write and Increment
13.5.2
Changing Value of CKS2 to CKS0
If bits CKS2 to CKS0 in TCSR are written to while the WDT is operating, errors could occur in the incrementation.
Software must stop the watchdog timer (by clearing the TME bit to 0) before changing the value of bits CKS2 to CKS0.
13.5.3
Switching between Watchdog Timer Mode and Interval Timer Mode
If the mode is switched from watchdog timer to interval timer, or vice versa, while the WDT is operating, errors could
occur in the incrementation. Software must stop the watchdog timer (by clearing the TME bit to 0) before switching the
mode.
13.5.4
System Reset by WDTOVF Signal
If the WDTOVF output signal* is input to the RES pin of the H8S/2357 Group, the H8S/2357 Group will not be
initialized correctly. Make sure that the WDTOVF signal* is not input logically to the RES pin. To reset the entire system
by means of the WDTOVF signal*, use the circuit shown in figure 13-9.
Note: * The WDTOVF pin function is not available in the F-ZTAT version, the H8S/2398, H8S/2394, H8S/2392 or
H8S/2390.
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H8S/2357 Group
Reset input
Reset signal to entire system
RES
WDTOVF*
Note: * The WDTOVF pin function is not available in the F-ZTAT version,
the H8S/2398, H8S/2394, H8S/2392 or H8S/2390.
Figure 13-9 Circuit for System Reset by WDTOVF Signal (Example)
13.5.5
Internal Reset in Watchdog Timer Mode
The H8S/2357 Group is not reset internally if TCNT overflows while the RSTE bit is cleared to 0 during watchdog timer
operation, but TCNT and TSCR of the WDT are reset.
TCNT, TCSR, and RSTCR cannot be written to while the WDTOVF signal* is low. Also note that a read of the WOVF
flag is not recognized during this period. To clear the WOVF falg, therefore, read RSTCSR after the WDTOVF signal*
goes high, then write 0 to the WOVF flag.
Note: * The WDTOVF pin function is not available in the F-ZTAT version, the H8S/2398, H8S/2394, H8S/2392 or
H8S/2390.
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REJ09B0138-0600H
Section 14 Serial Communication Interface (SCI)
14.1
Overview
The H8S/2357 Group is equipped with a three-channel serial communication interface (SCI). All three channels have the
same functions. The SCI can handle both asynchronous and clocked synchronous serial communication. A function is also
provided for serial communication between processors (multiprocessor communication function).
14.1.1
Features
SCI features are listed below.
• Choice of asynchronous or clocked synchronous serial communication mode
Asynchronous mode
 Serial data communication executed using asynchronous system in which synchronization is achieved character by
character
 Serial data communication can be carried out with standard asynchronous communication chips such as a Universal
Asynchronous Receiver/Transmitter (UART) or Asynchronous Communication Interface Adapter (ACIA)
 A multiprocessor communication function is provided that enables serial data communication with a number of
processors
 Choice of 12 serial data transfer formats
Data length
: 7 or 8 bits
Stop bit length
: 1 or 2 bits
Parity
: Even, odd, or none
Multiprocessor bit
: 1 or 0
 Receive error detection : Parity, overrun, and framing errors
 Break detection
: Break can be detected by reading the RxD pin level
directly in case of a framing error
Clocked Synchronous mode
 Serial data communication synchronized with a clock
 Serial data communication can be carried out with other chips that have a synchronous communication function
 One serial data transfer format
Data length
: 8 bits
 Receive error detection : Overrun errors detected
• Full-duplex communication capability
 The transmitter and receiver are mutually independent, enabling transmission and reception to be executed
simultaneously
 Double-buffering is used in both the transmitter and the receiver, enabling continuous transmission and continuous
reception of serial data
• Choice of LSB-first or MSB-first transfer
 Can be selected regardless of the communication mode* (except in the case of 7-bit data asynchronous mode)
• On-chip baud rate generator allows any bit rate to be selected
• Choice of serial clock source
 Internal clock from baud rate generator or external clock from SCK pin
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• Four interrupt sources
 Four interrupt sources — transmit-data-empty, transmit-end, receive-data-full, and receive error — that can issue
requests independently
 The transmit-data-empty interrupt and receive-data-full interrupt can activate the DMA controller (DMAC) or data
transfer controller (DTC) to execute data transfer
• Module stop mode can be set
 As the initial setting, SCI operation is halted. Register access is enabled by exiting module stop mode.
Note: * Descriptions in this section refer to LSB-first transfer.
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14.1.2
Block Diagram
Bus interface
Figure 14-1 shows a block diagram of the SCI.
Module data bus
RDR
RxD
TDR
RSR
SCMR
SSR
SCR
SMR
TSR
Parity generation
ø
Baud rate
generator
ø/4
ø/16
ø/64
Clock
Parity check
External clock
SCK
Legend:
SCMR:
RSR:
RDR:
TSR:
TDR:
SMR:
SCR:
SSR:
BRR:
BRR
Transmission/
reception control
TxD
Internal
data bus
TEI
TXI
RXI
ERI
Smart Card mode register
Receive shift register
Receive data register
Transmit shift register
Transmit data register
Serial mode register
Serial control register
Serial status register
Bit rate register
Figure 14-1 Block Diagram of SCI
14.1.3
Pin Configuration
Table 14-1 shows the serial pins for each SCI channel.
Table 14-1 SCI Pins
Channel
Pin Name
Symbol
I/O
Function
0
Serial clock pin 0
SCK0
I/O
SCI0 clock input/output
Receive data pin 0
RxD0
Input
SCI0 receive data input
Transmit data pin 0
TxD0
Output
SCI0 transmit data output
Serial clock pin 1
SCK1
I/O
SCI1 clock input/output
Receive data pin 1
RxD1
Input
SCI1 receive data input
Transmit data pin 1
TxD1
Output
SCI1 transmit data output
Serial clock pin 2
SCK2
I/O
SCI2 clock input/output
Receive data pin 2
RxD2
Input
SCI2 receive data input
Transmit data pin 2
TxD2
Output
SCI2 transmit data output
1
2
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14.1.4
Register Configuration
The SCI has the internal registers shown in table 14-2. These registers are used to specify asynchronous mode or clocked
synchronous mode, the data format, and the bit rate, and to control transmitter/receiver.
Table 14-2 SCI Registers
Channel
Name
Abbreviation
R/W
Initial Value
Address* 1
0
Serial mode register 0
SMR0
R/W
H'00
H'FF78
Bit rate register 0
BRR0
R/W
H'FF
H'FF79
Serial control register 0
SCR0
R/W
H'00
H'FF7A
Transmit data register 0
TDR0
R/W
H'FF
H'FF7B
H'84
H'FF7C
1
2
All
2
Serial status register 0
SSR0
R/(W)*
Receive data register 0
RDR0
R
H'00
H'FF7D
Smart Card mode register 0
SCMR0
R/W
H'F2
H'FF7E
Serial mode register 1
SMR1
R/W
H'00
H'FF80
Bit rate register 1
BRR1
R/W
H'FF
H'FF81
Serial control register 1
SCR1
R/W
H'00
H'FF82
Transmit data register 1
TDR1
R/W
H'FF
H'FF83
H'84
H'FF84
2
Serial status register 1
SSR1
R/(W)*
Receive data register 1
RDR1
R
H'00
H'FF85
Smart Card mode register 1
SCMR1
R/W
H'F2
H'FF86
Serial mode register 2
SMR2
R/W
H'00
H'FF88
Bit rate register 2
BRR2
R/W
H'FF
H'FF89
Serial control register 2
SCR2
R/W
H'00
H'FF8A
Transmit data register 2
TDR2
R/W
H'FF
H'FF8B
H'84
H'FF8C
2
Serial status register 2
SSR2
R/(W)*
Receive data register 2
RDR2
R
H'00
H'FF8D
Smart Card mode register 2
SCMR2
R/W
H'F2
H'FF8E
Module stop control register
MSTPCR
R/W
H'3FFF
H'FF3C
Notes: 1. Lower 16 bits of the address.
2. Can only be written with 0 for flag clearing.
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14.2
Register Descriptions
14.2.1
Receive Shift Register (RSR)
Bit
:
7
6
5
4
3
2
1
0
R/W
:
—
—
—
—
—
—
—
—
RSR is a register used to receive serial data.
The SCI sets serial data input from the RxD pin in RSR in the order received, starting with the LSB (bit 0), and converts it
to parallel data. When one byte of data has been received, it is transferred to RDR automatically.
RSR cannot be directly read or written to by the CPU.
14.2.2
Receive Data Register (RDR)
Bit
:
7
6
5
4
3
2
1
0
Initial value :
0
0
0
0
0
0
0
0
R/W
R
R
R
R
R
R
R
R
:
RDR is a register that stores received serial data.
When the SCI has received one byte of serial data, it transfers the received serial data from RSR to RDR where it is stored,
and completes the receive operation. After this, RSR is receive-enabled.
Since RSR and RDR function as a double buffer in this way, enables continuous receive operations to be performed.
RDR is a read-only register, and cannot be written to by the CPU.
RDR is initialized to H'00 by a reset, and in standby mode or module stop mode.
14.2.3
Transmit Shift Register (TSR)
Bit
:
7
6
5
4
3
2
1
0
R/W
:
—
—
—
—
—
—
—
—
TSR is a register used to transmit serial data.
To perform serial data transmission, the SCI first transfers transmit data from TDR to TSR, then sends the data to the TxD
pin starting with the LSB (bit 0).
When transmission of one byte is completed, the next transmit data is transferred from TDR to TSR, and transmission
started, automatically. However, data transfer from TDR to TSR is not performed if the TDRE bit in SSR is set to 1.
TSR cannot be directly read or written to by the CPU.
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14.2.4
Transmit Data Register (TDR)
Bit
:
7
6
5
4
3
2
1
0
Initial value :
1
1
1
1
1
1
1
1
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
:
TDR is an 8-bit register that stores data for serial transmission.
When the SCI detects that TSR is empty, it transfers the transmit data written in TDR to TSR and starts serial
transmission. Continuous serial transmission can be carried out by writing the next transmit data to TDR during serial
transmission of the data in TSR.
TDR can be read or written to by the CPU at all times.
TDR is initialized to H'FF by a reset, and in standby mode or module stop mode.
14.2.5
Serial Mode Register (SMR)
Bit
:
Initial value :
R/W
:
7
6
5
4
3
2
1
0
C/A
CHR
PE
O/E
STOP
MP
CKS1
CKS0
0
0
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
SMR is an 8-bit register used to set the SCI’s serial transfer format and select the baud rate generator clock source.
SMR can be read or written to by the CPU at all times.
SMR is initialized to H'00 by a reset, and by putting the device in standby mode or module stop mode. In the H8S/2398,
H8S/2394, H8S/2392, and H8S/2390, however, the value in SMR is initialized to H'00 by a reset, or in hardware standby
mode, but SMR retains its current state when the device enters software standby mode or module stop mode.
Bit 7—Communication Mode (C/A): Selects asynchronous mode or clocked synchronous mode as the SCI operating
mode.
Bit 7
C/A
Description
0
Asynchronous mode
1
Clocked synchronous mode
(Initial value)
Bit 6—Character Length (CHR): Selects 7 or 8 bits as the data length in asynchronous mode. In clocked synchronous
mode, a fixed data length of 8 bits is used regardless of the CHR setting.
Bit 6
CHR
Description
0
8-bit data
1
7-bit data*
(Initial value)
Note: * When 7-bit data is selected, the MSB (bit 7) of TDR is not transmitted, and it is not possible to choose between
LSB-first or MSB-first transfer.
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Bit 5—Parity Enable (PE): In asynchronous mode, selects whether or not parity bit addition is performed in
transmission, and parity bit checking in reception. In clocked synchronous mode and with a multiprocessor format, parity
bit addition and checking is not performed, regardless of the PE bit setting.
Bit 5
PE
Description
0
Parity bit addition and checking disabled
1
Parity bit addition and checking enabled*
(Initial value)
Note:* When the PE bit is set to 1, the parity (even or odd) specified by the O/E bit is added to transmit data before
transmission. In reception, the parity bit is checked for the parity (even or odd) specified by the O/E bit.
Bit 4—Parity Mode (O/E): Selects either even or odd parity for use in parity addition and checking.
The O/E bit setting is only valid when the PE bit is set to 1, enabling parity bit addition and checking, in asynchronous
mode. The O/E bit setting is invalid in clocked synchronous mode, and when parity addition and checking is disabled in
asynchronous mode.
Bit 4
O/E
Description
0
Even parity* 1
1
Odd parity*
(Initial value)
2
Notes: 1. When even parity is set, parity bit addition is performed in transmission so that the total number of 1 bits in the
transmit character plus the parity bit is even.
In reception, a check is performed to see if the total number of 1 bits in the receive character plus the parity bit
is even.
2. When odd parity is set, parity bit addition is performed in transmission so that the total number of 1 bits in the
transmit character plus the parity bit is odd.
In reception, a check is performed to see if the total number of 1 bits in the receive character plus the parity bit
is odd.
Bit 3—Stop Bit Length (STOP): Selects 1 or 2 bits as the stop bit length in asynchronous mode. The STOP bits setting is
only valid in asynchronous mode. If clocked synchronous mode is set the STOP bit setting is invalid since stop bits are not
added.
Bit 3
STOP
Description
0
1 stop bit: In transmission, a single 1 bit (stop bit) is added to the end of a transmit
character before it is sent.
(Initial value)
1
2 stop bits: In transmission, two 1 bits (stop bits) are added to the end of a transmit
character before it is sent.
In reception, only the first stop bit is checked, regardless of the STOP bit setting. If the second stop bit is 1, it is treated as
a stop bit; if it is 0, it is treated as the start bit of the next transmit character.
Bit 2—Multiprocessor Mode (MP): Selects multiprocessor format. When multiprocessor format is selected, the PE bit
and O/E bit parity settings are invalid. The MP bit setting is only valid in asynchronous mode; it is invalid in clocked
synchronous mode.
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For details of the multiprocessor communication function, see section 14.3.3, Multiprocessor Communication Function.
Bit 2
MP
Description
0
Multiprocessor function disabled
1
Multiprocessor format selected
(Initial value)
Bits 1 and 0—Clock Select 1 and 0 (CKS1, CKS0): These bits select the clock source for the baud rate generator. The
clock source can be selected from ø, ø/4, ø/16, and ø/64, according to the setting of bits CKS1 and CKS0.
For the relation between the clock source, the bit rate register setting, and the baud rate, see section 14.2.8, Bit Rate
Register (BRR).
Bit 1
CKS1
Bit 0
CKS0
Description
0
0
ø clock
1
ø/4 clock
0
ø/16 clock
1
ø/64 clock
1
14.2.6
(Initial value)
Serial Control Register (SCR)
Bit
:
Initial value :
R/W
:
7
6
5
4
3
2
1
0
TIE
RIE
TE
RE
MPIE
TEIE
CKE1
CKE0
0
0
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
SCR is a register that performs enabling or disabling of SCI transfer operations, serial clock output in asynchronous mode,
and interrupt requests, and selection of the serial clock source.
SCR can be read or written to by the CPU at all times.
SCR is initialized to H'00 by a reset, and by putting the device in standby mode or module stop mode. In the H8S/2398,
H8S/2394, H8S/2392, and H8S/2390, however, the value in SCR is initialized to H'00 by a reset, or in hardware standby
mode, but SCR retains its current state when the device enters software standby mode or module stop mode.
Bit 7—Transmit Interrupt Enable (TIE): Enables or disables transmit data empty interrupt (TXI) request generation
when serial transmit data is transferred from TDR to TSR and the TDRE flag in SSR is set to 1.
Bit 7
TIE
Description
0
Transmit data empty interrupt (TXI) requests disabled*
1
Transmit data empty interrupt (TXI) requests enabled
(Initial value)
Note:* TXI interrupt request cancellation can be performed by reading 1 from the TDRE flag, then clearing it to 0, or
clearing the TIE bit to 0.
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REJ09B0138-0600H
Bit 6—Receive Interrupt Enable (RIE): Enables or disables receive data full interrupt (RXI) request and receive error
interrupt (ERI) request generation when serial receive data is transferred from RSR to RDR and the RDRF flag in SSR is
set to 1.
Bit 6
RIE
Description
0
Receive data full interrupt (RXI) request and receive error interrupt (ERI) request
disabled*
(Initial value)
1
Receive data full interrupt (RXI) request and receive error interrupt (ERI) request
enabled
Note:* RXI and ERI interrupt request cancellation can be performed by reading 1 from the RDRF flag, or the FER, PER, or
ORER flag, then clearing the flag to 0, or clearing the RIE bit to 0.
Bit 5—Transmit Enable (TE): Enables or disables the start of serial transmission by the SCI.
Bit 5
TE
Description
0
Transmission disabled* 1
1
Transmission enabled*
(Initial value)
2
Notes: 1. The TDRE flag in SSR is fixed at 1.
2. In this state, serial transmission is started when transmit data is written to TDR and the TDRE flag in SSR is
cleared to 0.
SMR setting must be performed to decide the transfer format before setting the TE bit to 1.
Bit 4—Receive Enable (RE): Enables or disables the start of serial reception by the SCI.
Bit 4
RE
Description
0
Reception disabled* 1
1
Reception enabled*
(Initial value)
2
Notes: 1. Clearing the RE bit to 0 does not affect the RDRF, FER, PER, and ORER flags, which retain their states.
2. Serial reception is started in this state when a start bit is detected in asynchronous mode or serial clock input is
detected in clocked synchronous mode.
SMR setting must be performed to decide the transfer format before setting the RE bit to 1.
Bit 3—Multiprocessor Interrupt Enable (MPIE): Enables or disables multiprocessor interrupts. The MPIE bit setting is
only valid in asynchronous mode when the MP bit in SMR is set to 1.
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REJ09B0138-0600H
The MPIE bit setting is invalid in clocked synchronous mode or when the MP bit is cleared to 0.
Bit 3
MPIE
0
Description
Multiprocessor interrupts disabled (normal reception performed)
(Initial value)
[Clearing conditions]
1
•
When the MPIE bit is cleared to 0
•
When MPB= 1 data is received
Multiprocessor interrupts enabled*
Receive data full interrupt (RXI) requests, receive error interrupt (ERI) requests, and
setting of the RDRF, FER, and ORER flags in SSR are disabled until data with the
multiprocessor bit set to 1 is received.
Note: * When receive data including MPB = 0 is received, receive data transfer from RSR to RDR, receive error detection,
and setting of the RDRF, FER, and ORER flags in SSR, is not performed. When receive data including MPB = 1 is
received, the MPB bit in SSR is set to 1, the MPIE bit is cleared to 0 automatically, and generation of RXI and ERI
interrupts (when the TIE and RIE bits in SCR are set to 1) and FER and ORER flag setting is enabled.
Bit 2—Transmit End Interrupt Enable (TEIE): Enables or disables transmit end interrupt (TEI) request generation
when there is no valid transmit data in TDR in MSB data transmission.
Bit 2
TEIE
Description
0
Transmit end interrupt (TEI) request disabled*
1
Transmit end interrupt (TEI) request enabled*
(Initial value)
Note: * TEI cancellation can be performed by reading 1 from the TDRE flag in SSR, then clearing it to 0 and clearing the
TEND flag to 0, or clearing the TEIE bit to 0.
Bits 1 and 0—Clock Enable 1 and 0 (CKE1, CKE0): These bits are used to select the SCI clock source and enable or
disable clock output from the SCK pin. The combination of the CKE1 and CKE0 bits determines whether the SCK pin
functions as an I/O port, the serial clock output pin, or the serial clock input pin.
The setting of the CKE0 bit, however, is only valid for internal clock operation (CKE1 = 0) in asynchronous mode. The
CKE0 bit setting is invalid in clocked synchronous mode, and in the case of external clock operation (CKE1 = 1). Note
that the SCI’s operating mode must be decided using SMR before setting the CKE1 and CKE0 bits.
Rev.6.00 Oct.28.2004 page 474 of 1016
REJ09B0138-0600H
For details of clock source selection, see table 14-9 in section 14.3, Operation.
Bit 1
CKE1
Bit 0
CKE0
Description
0
0
Asynchronous mode
Internal clock/SCK pin functions as I/O port* 1
Clocked synchronous
mode
Internal clock/SCK pin functions as serial clock
output
Asynchronous mode
Internal clock/SCK pin functions as clock output* 2
Clocked synchronous
mode
Internal clock/SCK pin functions as serial clock
output
Asynchronous mode
External clock/SCK pin functions as clock input* 3
Clocked synchronous
mode
External clock/SCK pin functions as serial clock
input
Asynchronous mode
External clock/SCK pin functions as clock input* 3
Clocked synchronous
mode
External clock/SCK pin functions as serial clock
input
1
1
0
1
Notes: 1. Initial value
2. Outputs a clock of the same frequency as the bit rate.
3. Inputs a clock with a frequency 16 times the bit rate.
14.2.7
Serial Status Register (SSR)
Bit
:
7
6
5
4
3
2
1
0
TDRE
RDRF
ORER
FER
PER
TEND
MPB
MPBT
1
0
0
0
0
1
0
0
R/(W)*
R/(W)*
R/(W)*
R/(W)*
R/(W)*
R
R
R/W
Initial value :
R/W
:
Note: * Only 0 can be written, to clear the flag.
SSR is an 8-bit register containing status flags that indicate the operating status of the SCI, and multiprocessor bits.
SSR can be read or written to by the CPU at all times. However, 1 cannot be written to flags TDRE, RDRF, ORER, PER,
and FER. Also note that in order to clear these flags they must be read as 1 beforehand. The TEND flag and MPB flag are
read-only flags and cannot be modified.
SSR is initialized to H'84 by a reset, and by putting the device in standby mode or module stop mode.
Bit 7—Transmit Data Register Empty (TDRE): Indicates that data has been transferred from TDR to TSR and the next
serial data can be written to TDR.
Bit 7
TDRE
Description
0
[Clearing conditions]
1
•
When 0 is written to TDRE after reading TDRE = 1
•
When the DMAC or DTC is activated by a TXI interrupt and write data to TDR
[Setting conditions]
(Initial value)
•
When the TE bit in SCR is 0
•
When data is transferred from TDR to TSR and data can be written to TDR
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REJ09B0138-0600H
Bit 6—Receive Data Register Full (RDRF): Indicates that the received data is stored in RDR.
Bit 6
RDRF
0
Description
[Clearing conditions]
(Initial value)
• When 0 is written to RDRF after reading RDRF = 1
• When the DMAC or DTC is activated by an RXI interrupt and read data from RDR
1
[Setting condition]
When serial reception ends normally and receive data is transferred from RSR to RDR
Note: RDR and the RDRF flag are not affected and retain their previous values when an error is detected during reception
or when the RE bit in SCR is cleared to 0.
If reception of the next data is completed while the RDRF flag is still set to 1, an overrun error will occur and the
receive data will be lost.
Bit 5—Overrun Error (ORER): Indicates that an overrun error occurred during reception, causing abnormal
termination.
Bit 5
ORER
Description
0
[Clearing condition]
(Initial value)*1
When 0 is written to ORER after reading ORER = 1
1
[Setting condition]
When the next serial reception is completed while RDRF = 1*2
Notes: 1. The ORER flag is not affected and retains its previous state when the RE bit in SCR is cleared to 0.
2. The receive data prior to the overrun error is retained in RDR, and the data received subsequently is lost. Also,
subsequent serial reception cannot be continued while the ORER flag is set to 1. In clocked synchronous mode,
serial transmission cannot be continued, either.
Bit 4—Framing Error (FER): Indicates that a framing error occurred during reception in asynchronous mode, causing
abnormal termination.
Bit 4
FER
Description
0
[Clearing condition]
(Initial value)*1
When 0 is written to FER after reading FER = 1
1
[Setting condition]
When the SCI checks whether the stop bit at the end of the receive data when
reception ends, and the stop bit is 0 * 2
Notes: 1. The FER flag is not affected and retains its previous state when the RE bit in SCR is cleared to 0.
2. In 2-stop-bit mode, only the first stop bit is checked for a value of 0; the second stop bit is not checked. If a
framing error occurs, the receive data is transferred to RDR but the RDRF flag is not set. Also, subsequent
serial reception cannot be continued while the FER flag is set to 1. In clocked synchronous mode, serial
transmission cannot be continued, either.
Rev.6.00 Oct.28.2004 page 476 of 1016
REJ09B0138-0600H
Bit 3—Parity Error (PER): Indicates that a parity error occurred during reception using parity addition in asynchronous
mode, causing abnormal termination.
Bit 3
PER
Description
0
[Clearing condition]
(Initial value)*1
When 0 is written to PER after reading PER = 1
1
[Setting condition]
When, in reception, the number of 1 bits in the receive data plus the parity bit does not
match the parity setting (even or odd) specified by the O/E bit in SMR* 2
Notes: 1. The PER flag is not affected and retains its previous state when the RE bit in SCR is cleared to 0.
2. If a parity error occurs, the receive data is transferred to RDR but the RDRF flag is not set. Also, subsequent
serial reception cannot be continued while the PER flag is set to 1. In clocked synchronous mode, serial
transmission cannot be continued, either.
Bit 2—Transmit End (TEND): Indicates that there is no valid data in TDR when the last bit of the transmit character is
sent, and transmission has been ended.
The TEND flag is read-only and cannot be modified.
Bit 2
TEND
Description
0
[Clearing conditions]
1
•
When 0 is written to TDRE after reading TDRE = 1
•
When the DMAC or DTC is activated by a TXI interrupt and write data to TDR
[Setting conditions]
(Initial value)
•
When the TE bit in SCR is 0
•
When TDRE = 1 at transmission of the last bit of a 1-byte serial transmit character
Bit 1—Multiprocessor Bit (MPB): When reception is performed using multiprocessor format in asynchronous mode,
MPB stores the multiprocessor bit in the receive data.
MPB is a read-only bit, and cannot be modified.
Bit 1
MPB
0
Description
[Clearing condition]
When data with a 0 multiprocessor bit is received
(Initial value)*
1
[Setting condition]
When data with a 1 multiprocessor bit is received
Note: * Retains its previous state when the RE bit in SCR is cleared to 0 with multiprocessor format.
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REJ09B0138-0600H
Bit 0—Multiprocessor Bit Transfer (MPBT): When transmission is performed using multiprocessor format in
asynchronous mode, MPBT stores the multiprocessor bit to be added to the transmit data.
The MPBT bit setting is invalid when multiprocessor format is not used, when not transmitting, and in clocked
synchronous mode.
14.2.8
Bit
Bit 0
MPBT
Description
0
Data with a 0 multiprocessor bit is transmitted
1
Data with a 1 multiprocessor bit is transmitted
(Initial value)
Bit Rate Register (BRR)
:
7
6
5
4
3
2
1
0
Initial value :
1
1
1
1
1
1
1
1
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
:
BRR is an 8-bit register that sets the serial transfer bit rate in accordance with the baud rate generator operating clock
selected by bits CKS1 and CKS0 in SMR.
BRR can be read or written to by the CPU at all times.
BRR is initialized to H'FF by a reset, and by putting the device in standby mode or module stop mode. In the H8S/2398,
H8S/2394, H8S/2392, and H8S/2390, however, the value in BRR is initialized to H'FF by a reset, or in hardware standby
mode, but BRR retains its current state when the device enters software standby mode or module stop mode.
As baud rate generator control is performed independently for each channel, different values can be set for each channel.
Table 14-3 shows sample BRR settings in asynchronous mode, and table 14-4 shows sample BRR settings in clocked
synchronous mode.
Table 14-3 BRR Settings for Various Bit Rates (Asynchronous Mode)
ø = 2 MHz
ø = 2.097152 MHz
Bit Rate
(bit/s)
n
N
Error
(%)
n
N
Error
(%)
110
1
141
0.03
1
148
150
1
103
0.16
1
300
0
207
0.16
600
0
103
1200
0
2400
ø = 2.4576 MHz
N
Error
(%)
–0.04 1
174
108
0.21
1
0
217
0.21
0.16
0
108
0.21
51
0.16
0
54
0
25
0.16
0
4800
0
12
0.16
9600
0
6
19200
0
31250
38400
ø = 3 MHz
N
Error
(%)
–0.26 1
212
0.03
127
0.00
1
155
0.16
0
255
0.00
1
77
0.16
0
127
0.00
0
155
0.16
–0.70 0
63
0.00
0
77
0.16
26
1.14
0
31
0.00
0
38
0.16
0
13
–2.48 0
15
0.00
0
19
–2.34
—
0
6
–2.48 0
7
0.00
0
9
–2.34
2
—
0
2
—
0
3
0.00
0
4
–2.34
0
1
0.00
0
1
—
0
1
—
0
2
0.00
0
1
—
0
1
—
0
1
0.00
—
—
—
Rev.6.00 Oct.28.2004 page 478 of 1016
REJ09B0138-0600H
n
n
ø = 3.6864 MHz
ø = 4 MHz
ø = 4.9152 MHz
ø = 5 MHz
Bit Rate
(bit/s)
n
N
Error
(%)
n
N
Error
(%)
n
N
Error
(%)
n
N
Error
(%)
110
2
64
0.70
2
70
0.03
2
86
0.31
2
88
–0.25
150
1
191
0.00
1
207
0.16
1
255
0.00
2
64
0.16
300
1
95
0.00
1
103
0.16
1
127
0.00
1
129
0.16
600
0
191
0.00
0
207
0.16
0
255
0.00
1
64
0.16
1200
0
95
0.00
0
103
0.16
0
127
0.00
0
129
0.16
2400
0
47
0.00
0
51
0.16
0
63
0.00
0
64
0.16
4800
0
23
0.00
0
25
0.16
0
31
0.00
0
32
–1.36
9600
0
11
0.00
0
12
0.16
0
15
0.00
0
15
1.73
19200
0
5
0.00
0
6
—
0
7
0.00
0
7
1.73
31250
—
—
—
0
3
0.00
0
4
–1.70 0
4
0.00
38400
0
2
0.00
0
2
—
0
3
0.00
3
1.73
ø = 6 MHz
Bit Rate
(bit/s)
n
N
Error
(%)
110
2
106
150
2
300
ø = 6.144 MHz
0
ø = 7.3728 MHz
N
Error
(%)
n
N
Error
(%)
–0.44 2
108
0.08
2
130
77
0.16
2
79
0.00
2
1
155
0.16
1
159
0.00
600
1
77
0.16
1
79
1200
0
155
0.16
0
2400
0
77
0.16
4800
0
38
0.16
9600
0
19200
ø = 8 MHz
N
Error
(%)
–0.07 2
141
0.03
95
0.00
2
103
0.16
1
191
0.00
1
207
0.16
0.00
1
95
0.00
1
103
0.16
159
0.00
0
191
0.00
0
207
0.16
0
79
0.00
0
95
0.00
0
103
0.16
0
39
0.00
0
47
0.00
0
51
0.16
19
–2.34 0
19
0.00
0
23
0.00
0
25
0.16
0
9
–2.34 0
9
0.00
0
11
0.00
0
12
0.16
31250
0
5
0.00
0
5
2.40
0
6
—
0
7
0.00
38400
0
4
–2.34 0
4
0.00
0
5
0.00
0
6
—
n
n
Rev.6.00 Oct.28.2004 page 479 of 1016
REJ09B0138-0600H
ø = 9.8304 MHz
Bit Rate
(bit/s)
n
N
Error
(%)
110
2
174
150
2
300
ø = 10 MHz
N
Error
(%)
–0.26 2
177
127
0.00
2
1
255
0.00
600
1
127
1200
0
2400
ø = 12 MHz
ø = 12.288 MHz
N
Error
(%)
n
N
Error
(%)
–0.25 2
212
0.03
2
217
0.08
129
0.16
2
155
0.16
2
159
0.00
2
64
0.16
2
77
0.16
2
79
0.00
0.00
1
129
0.16
1
155
0.16
1
159
0.00
255
0.00
1
64
0.16
1
77
0.16
1
79
0.00
0
127
0.00
0
129
0.16
0
155
0.16
0
159
0.00
4800
0
63
0.00
0
64
0.16
0
77
0.16
0
79
0.00
9600
0
31
0.00
0
32
–1.36 0
38
0.16
0
39
0.00
19200
0
15
0.00
0
15
1.73
0
19
–2.34 0
19
0.00
31250
0
9
–1.70 0
9
0.00
0
11
0.00
11
2.40
38400
0
7
0.00
7
1.73
0
9
–2.34 0
9
0.00
n
0
ø = 14 MHz
Bit Rate
(bit/s)
n
N
Error
(%)
110
2
248
150
2
300
n
ø = 14.7456 MHz
0
ø = 16 MHz
ø = 17.2032 MHz
N
Error
(%)
n
N
Error
(%)
n
N
Error
(%)
–0.17 3
64
0.70
3
70
0.03
3
75
0.48
181
0.16
2
191
0.00
2
207
0.16
2
223
0.00
2
90
0.16
2
95
0.00
2
103
0.16
2
111
0.00
600
1
181
0.16
1
191
0.00
1
207
0.16
1
223
0.00
1200
1
90
0.16
1
95
0.00
1
103
0.16
1
111
0.00
2400
0
181
0.16
0
191
0.00
0
207
0.16
0
223
0.00
4800
0
90
0.16
0
95
0.00
0
103
0.16
0
111
0.00
9600
0
45
–0.93 0
47
0.00
0
51
0.16
0
55
0.00
19200
0
22
–0.93 0
23
0.00
0
25
0.16
0
27
0.00
31250
0
13
0.00
0
14
–1.70 0
15
0.00
0
16
1.20
38400
0
10
—
0
11
0.00
12
0.16
0
13
0.00
Rev.6.00 Oct.28.2004 page 480 of 1016
REJ09B0138-0600H
n
0
ø = 18 MHz
ø = 19.6608 MHz
Bit Rate
(bit/s)
n
N
Error
(%)
110
3
79
150
2
300
ø = 20 MHz
N
Error
(%)
n
N
Error
(%)
–0.12 3
86
0.31
3
88
–0.25
233
0.16
2
255
0.00
3
64
0.16
2
116
0.16
2
127
0.00
2
129
0.16
600
1
233
0.16
1
255
0.00
2
64
0.16
1200
1
116
0.16
1
127
0.00
1
129
0.16
2400
0
233
0.16
0
255
0.00
1
64
0.16
4800
0
116
0.16
0
127
0.00
0
129
0.16
9600
0
58
–0.69 0
63
0.00
0
64
0.16
19200
0
28
1.02
0
31
0.00
0
32
–1.36
31250
0
17
0.00
0
19
–1.70 0
19
0.00
38400
0
14
–2.34 0
15
0.00
15
1.73
n
0
Table 14-4 BRR Settings for Various Bit Rates (Clocked Synchronous Mode)
ø = 2 MHz
Bit Rate
(bit/s)
n
N
110
3
70
250
2
500
ø = 4 MHz
ø = 8 MHz
ø = 10 MHz
ø = 16 MHz
n
N
n
N
n
N
n
N
124
2
249
3
124
—
—
3
249
1
249
2
124
2
249
—
—
3
1k
1
124
1
249
2
124
—
—
2.5 k
0
199
1
99
1
199
1
5k
0
99
0
199
1
99
10 k
0
49
0
99
0
25 k
0
19
0
39
50 k
0
9
0
100 k
0
4
250 k
0
500 k
0
1M
ø = 20 MHz
n
N
124
—
—
2
249
—
—
249
2
99
2
124
1
124
1
199
1
249
199
0
249
1
99
1
124
0
79
0
99
0
159
0
199
19
0
39
0
49
0
79
0
99
0
9
0
19
0
24
0
39
0
49
1
0
3
0
7
0
9
0
15
0
19
0*
0
1
0
3
0
4
0
7
0
9
0
0*
0
1
0
3
0
4
0
1
0
0*
2.5 M
5M
0
0*
Legend:
Blank: Cannot be set.
— : Can be set, but there will be a degree of error.
* : Continuous transfer is not possible.
Rev.6.00 Oct.28.2004 page 481 of 1016
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The BRR setting is found from the following formulas.
Asynchronous mode:
N=
ø
64 × 2
2n–1
×B
× 10 6 – 1
Clocked synchronous mode:
N=
Where B:
N:
ø:
n:
ø
8×2
2n–1
×B
× 10 6 – 1
Bit rate (bit/s)
BRR setting for baud rate generator (0 ≤ N ≤ 255)
Operating frequency (MHz)
Baud rate generator input clock (n = 0 to 3)
(See the table below for the relation between n and the clock.)
SMR Setting
n
Clock
CKS1
CKS0
0
ø
0
0
1
ø/4
0
1
2
ø/16
1
0
3
ø/64
1
1
The bit rate error in asynchronous mode is found from the following formula:
Error (%) = {
ø × 106
(N + 1) × B × 64 × 22n–1
Rev.6.00 Oct.28.2004 page 482 of 1016
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– 1} × 100
Table 14-5 shows the maximum bit rate for each frequency in asynchronous mode. Tables 14-6 and 14-7 show the
maximum bit rates with external clock input.
Table 14-5 Maximum Bit Rate for Each Frequency (Asynchronous Mode)
ø (MHz)
Maximum Bit Rate (bit/s)
n
N
2
62500
0
0
2.097152
65536
0
0
2.4576
76800
0
0
3
93750
0
0
3.6864
115200
0
0
4
125000
0
0
4.9152
153600
0
0
5
156250
0
0
6
187500
0
0
6.144
192000
0
0
7.3728
230400
0
0
8
250000
0
0
9.8304
307200
0
0
10
312500
0
0
12
375000
0
0
12.288
384000
0
0
14
437500
0
0
14.7456
460800
0
0
16
500000
0
0
17.2032
537600
0
0
18
562500
0
0
19.6608
614400
0
0
20
625000
0
0
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Table 14-6 Maximum Bit Rate with External Clock Input (Asynchronous Mode)
ø (MHz)
External Input Clock (MHz)
Maximum Bit Rate (bit/s)
2
0.5000
31250
2.097152
0.5243
32768
2.4576
0.6144
38400
3
0.7500
46875
3.6864
0.9216
57600
4
1.0000
62500
4.9152
1.2288
76800
5
1.2500
78125
6
1.5000
93750
6.144
1.5360
96000
7.3728
1.8432
115200
8
2.0000
125000
9.8304
2.4576
153600
10
2.5000
156250
12
3.0000
187500
12.288
3.0720
192000
14
3.5000
218750
14.7456
3.6864
230400
16
4.0000
250000
17.2032
4.3008
268800
18
4.5000
281250
19.6608
4.9152
307200
20
5.0000
312500
Table 14-7 Maximum Bit Rate with External Clock Input (Clocked Synchronous Mode)
ø (MHz)
External Input Clock (MHz)
Maximum Bit Rate (bit/s)
2
0.3333
333333.3
4
0.6667
666666.7
6
1.0000
1000000.0
8
1.3333
1333333.3
10
1.6667
1666666.7
12
2.0000
2000000.0
14
2.3333
2333333.3
16
2.6667
2666666.7
18
3.0000
3000000.0
20
3.3333
3333333.3
Rev.6.00 Oct.28.2004 page 484 of 1016
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14.2.9
Smart Card Mode Register (SCMR)
Bit
:
7
6
5
4
3
2
1
0
—
—
—
—
SDIR
SINV
—
SMIF
Initial value :
1
1
1
1
0
0
1
0
R/W
—
—
—
—
R/W
R/W
—
R/W
:
SCMR selects LSB-first or MSB-first by means of bit SDIR. Except in the case of asynchronous mode 7-bit data, LSBfirst or MSB-first can be selected regardless of the serial communication mode. The descriptions in this chapter refer to
LSB-first transfer.
For details of the other bits in SCMR, see section 15.2.1, Smart Card Mode Register (SCMR).
SCMR is initialized to H'F2 by a reset, and by putting the device in standby mode or module stop mode. In the H8S/2398,
H8S/2394, H8S/2392, and H8S/2390, however, the value in SCMR is initialized to H'F2 by a reset, or in hardware standby
mode, but SCMR retains its current state when the device enters software standby mode or module stop mode.
Bits 7 to 4—Reserved: These bits cannot be modified and are always read as 1.
Bit 3—Smart Card Data Transfer Direction (SDIR): Selects the serial/parallel conversion format.
This bit is valid when 8-bit data is used as the transmit/receive format.
Bit 3
SDIR
Description
0
TDR contents are transmitted LSB-first
(Initial value)
Receive data is stored in RDR LSB-first
1
TDR contents are transmitted MSB-first
Receive data is stored in RDR MSB-first
Bit 2—Smart Card Data Invert (SINV): When the Smart Card interface operates as a normal SCI, 0 should be written to
this bit.
Bit 1—Reserved: This bit cannot be modified always read as 1.
Bit 0—Smart Card Interface Mode Select (SMIF): When the Smart Card interface operates as a normal SCI, 0 should
be written to this bit.
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14.2.10
Module Stop Control Register (MSTPCR)
MSTPCRH
Bit
MSTPCRL
:
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Initial value :
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
R/W
: R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
MSTPCR is a 16-bit readable/writable register that performs module stop mode control.
When the corresponding bit of bits MSTP7 to MSTP5 is set to 1, SCI operation stops at the end of the bus cycle and a
transition is made to module stop mode. Registers cannot be read or written to in module stop mode. For details, see
section 21.5, Module Stop Mode.
MSTPCR is initialized to H'3FFF by a reset and in hardware standby mode. It is not initialized in software standby mode.
Bit 7—Module Stop (MSTP7): Specifies the SCI channel 2 module stop mode.
Bit 7
MSTP7
Description
0
SCI channel 2 module stop mode cleared
1
SCI channel 2 module stop mode set
(Initial value)
Bit 6—Module Stop (MSTP6): Specifies the SCI channel 1 module stop mode.
Bit 6
MSTP6
Description
0
SCI channel 1 module stop mode cleared
1
SCI channel 1 module stop mode set
(Initial value)
Bit 5—Module Stop (MSTP5): Specifies the SCI channel 0 module stop mode.
Bit 5
MSTP5
Description
0
SCI channel 0 module stop mode cleared
1
SCI channel 0 module stop mode set
Rev.6.00 Oct.28.2004 page 486 of 1016
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(Initial value)
14.3
Operation
14.3.1
Overview
The SCI can carry out serial communication in two modes: asynchronous mode in which synchronization is achieved
character by character, and clocked synchronous mode in which synchronization is achieved with clock pulses.
Selection of asynchronous or clocked synchronous mode and the transmission format is made using SMR as shown in
table 14-8. The SCI clock is determined by a combination of the C/A bit in SMR and the CKE1 and CKE0 bits in SCR, as
shown in table 14-9.
Asynchronous Mode
• Data length: Choice of 7 or 8 bits
• Choice of parity addition, multiprocessor bit addition, and addition of 1 or 2 stop bits (the combination of these
parameters determines the transfer format and character length)
• Detection of framing, parity, and overrun errors, and breaks, during reception
• Choice of internal or external clock as SCI clock source
 When internal clock is selected:
The SCI operates on the baud rate generator clock and a clock with the same frequency as the bit rate can be output
 When external clock is selected:
A clock with a frequency of 16 times the bit rate must be input (the on-chip baud rate generator is not used)
Clocked Synchronous Mode
• Transfer format: Fixed 8-bit data
• Detection of overrun errors during reception
• Choice of internal or external clock as SCI clock source
 When internal clock is selected:
The SCI operates on the baud rate generator clock and a serial clock is output off-chip
 When external clock is selected:
The on-chip baud rate generator is not used, and the SCI operates on the input serial clock
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Table 14-8 SMR Settings and Serial Transfer Format Selection
SMR Settings
SCI Transfer Format
Bit 7
Bit 6
Bit 2
Bit 5
Bit 3
C/A
CHR
MP
PE
STOP
Mode
Data
Length
Multi
Processor
Bit
0
0
0
0
0
Asynchronous
8-bit data
No
1
mode
1
Parity
Bit
Stop Bit
Length
No
1 bit
2 bits
0
Yes
1
1
0
2 bits
0
7-bit data
No
1
1
1
0
—
1
1
—
—
1 bit
2 bits
Yes
1
0
1 bit
1 bit
2 bits
0
Asynchronous
—
1
—
0
mode (multiprocessor
format)
—
1
—
—
8-bit data
Yes
No
1 bit
2 bits
7-bit data
1 bit
2 bits
Clocked
8-bit data
synchronous mode
No
None
Table 14-9 SMR and SCR Settings and SCI Clock Source Selection
SMR
SCR Setting
SCI Transmit/Receive Clock
Bit 7
Bit 1
Bit 0
C/A
CKE1
CKE0
Mode
Source
Clock
SCK Pin Function
0
0
0
Asynchronous
mode
Internal
SCI does not use SCK pin
1
1
0
Outputs clock with same frequency as bit
rate
External
Inputs clock with frequency of 16 times
the bit rate
Internal
Outputs serial clock
External
Inputs serial clock
1
1
0
1
0
Clocked
1
synchronous
mode
0
1
Rev.6.00 Oct.28.2004 page 488 of 1016
REJ09B0138-0600H
14.3.2
Operation in Asynchronous Mode
In asynchronous mode, characters are sent or received, each preceded by a start bit indicating the start of communication
and one or two stop bits indicating the end of communication. Serial communication is thus carried out with
synchronization established on a character-by-character basis.
Inside the SCI, the transmitter and receiver are independent units, enabling full-duplex communication. Both the
transmitter and the receiver also have a double-buffered structure, so that data can be read or written during transmission
or reception, enabling continuous data transfer.
Figure 14-2 shows the general format for asynchronous serial communication.
In asynchronous serial communication, the transmission line is usually held in the mark state (high level). The SCI
monitors the transmission line, and when it goes to the space state (low level), recognizes a start bit and starts serial
communication.
One serial communication character consists of a start bit (low level), followed by data (in LSB-first order), a parity bit
(high or low level), and finally one or two stop bits (high level).
In asynchronous mode, the SCI performs synchronization at the falling edge of the start bit in reception. The SCI samples
the data on the 8th pulse of a clock with a frequency of 16 times the length of one bit, so that the transfer data is latched at
the center of each bit.
Idle state
(mark state)
1
Serial
data
MSB
LSB
0
D0
D1
D2
D3
D4
D5
Start
bit
Transmit/receive data
1 bit
7 or 8 bits
D6
D7
1
0/1
1
1
Stop bit
Parity
bit
1 bit,
or none
1 or
2 bits
One unit of transfer data (character or frame)
Figure 14-2 Data Format in Asynchronous Communication
(Example with 8-Bit Data, Parity, Two Stop Bits)
Data Transfer Format: Table 14-10 shows the data transfer formats that can be used in asynchronous mode. Any of 12
transfer formats can be selected according to the SMR setting.
Rev.6.00 Oct.28.2004 page 489 of 1016
REJ09B0138-0600H
Table 14-10 Serial Transfer Formats (Asynchronous Mode)
SMR Settings
Serial Transfer Format and Frame Length
CHR
PE
MP
STOP
1
0
0
0
0
S
8-bit data
STOP
0
0
0
1
S
8-bit data
STOP STOP
0
1
0
0
S
8-bit data
P STOP
0
1
0
1
S
8-bit data
P STOP STOP
1
0
0
0
S
7-bit data
STOP
1
0
0
1
S
7-bit data
STOP STOP
1
1
0
0
S
7-bit data
P
STOP
1
1
0
1
S
7-bit data
P
STOP STOP
0
—
1
0
S
8-bit data
MPB STOP
0
—
1
1
S
8-bit data
MPB STOP STOP
1
—
1
0
S
7-bit data
MPB STOP
1
—
1
1
S
7-bit data
MPB STOP STOP
Legend:
S:
Start bit
STOP: Stop bit
P:
Parity bit
MPB: Multiprocessor bit
Rev.6.00 Oct.28.2004 page 490 of 1016
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2
3
4
5
6
7
8
9
10
11
12
Clock: Either an internal clock generated by the on-chip baud rate generator or an external clock input at the SCK pin can
be selected as the SCI’s serial clock, according to the setting of the C/A bit in SMR and the CKE1 and CKE0 bits in SCR.
For details of SCI clock source selection, see table 14-9.
When an external clock is input at the SCK pin, the clock frequency should be 16 times the bit rate used.
When the SCI is operated on an internal clock, the clock can be output from the SCK pin. The frequency of the clock
output in this case is equal to the bit rate, and the phase is such that the rising edge of the clock is in the middle of the
transmit data, as shown in figure 14-3.
0
D0
D1
D2
D3
D4
D5
D6
D7
0/1
1
1
1 frame
Figure 14-3 Relation between Output Clock and Transfer Data Phase
(Asynchronous Mode)
Data Transfer Operations:
• SCI initialization (asynchronous mode)
Before transmitting and receiving data, you should first clear the TE and RE bits in SCR to 0, then initialize the SCI as
described below.
When the operating mode, transfer format, etc., is changed, the TE and RE bits must be cleared to 0 before making the
change using the following procedure. When the TE bit is cleared to 0, the TDRE flag is set to 1 and TSR is initialized.
Note that clearing the RE bit to 0 does not change the contents of the RDRF, PER, FER, and ORER flags, or the
contents of RDR.
When an external clock is used the clock should not be stopped during operation, including initialization, since
operation is uncertain.
Rev.6.00 Oct.28.2004 page 491 of 1016
REJ09B0138-0600H
Figure 14-4 shows a sample SCI initialization flowchart.
[1] Set the clock selection in SCR.
Be sure to clear bits RIE, TIE,
TEIE, and MPIE, and bits TE and
RE, to 0.
Start initialization
Clear TE and RE bits in SCR to 0
Set CKE1 and CKE0 bits in SCR
(TE, RE bits 0)
[1]
Set data transfer format in
SMR and SCMR
[2]
Set value in BRR
[3]
When the clock is selected in
asynchronous mode, it is output
immediately after SCR settings are
made.
[2] Set the data transfer format in SMR
and SCMR.
[3] Write a value corresponding to the
bit rate to BRR. Not necessary if an
external clock is used.
Wait
No
1-bit interval elapsed?
Yes
Set TE and RE bits in
SCR to 1, and set RIE, TIE, TEIE,
and MPIE bits
[4] Wait at least one bit interval, then
set the TE bit or RE bit in SCR to 1.
Also set the RIE, TIE, TEIE, and
MPIE bits.
Setting the TE and RE bits enables
the TxD and RxD pins to be used.
[4]
<Transfer completion>
Figure 14-4 Sample SCI Initialization Flowchart
Rev.6.00 Oct.28.2004 page 492 of 1016
REJ09B0138-0600H
• Serial data transmission (asynchronous mode)
Figure 14-5 shows a sample flowchart for serial transmission.
The following procedure should be used for serial data transmission.
Initialization
[1]
Start transmission
Read TDRE flag in SSR
[2]
[2] SCI status check and transmit data
write:
Read SSR and check that the
TDRE flag is set to 1, then write
transmit data to TDR and clear the
TDRE flag to 0.
No
TDRE=1
Yes
Write transmit data to TDR
and clear TDRE flag in SSR to 0
No
All data transmitted?
Yes
[3]
Read TEND flag in SSR
No
TEND= 1
Yes
No
Break output?
Yes
[1] SCI initialization:
The TxD pin is automatically
designated as the transmit data
output pin.
After the TE bit is set to 1, a frame
of 1s is output, and transmission is
enabled.
[4]
[3] Serial transmission continuation
procedure:
To continue serial transmission,
read 1 from the TDRE flag to
confirm that writing is possible,
then write data to TDR, and then
clear the TDRE flag to 0. Checking
and clearing of the TDRE flag is
automatic when the DMAC or DTC
is activated by a transmit data
empty interrupt (TXI) request, and
data is written to TDR.
[4] Break output at the end of serial
transmission:
To output a break in serial
transmission, set DDR for the port
corresponding to the TxD pin to 1,
clear DR to 0, then clear the TE bit
in SCR to 0.
Clear DR to 0 and
set DDR to 1
Clear TE bit in SCR to 0
<End>
Figure 14-5 Sample Serial Transmission Flowchart
In serial transmission, the SCI operates as described below.
[1] The SCI monitors the TDRE flag in SSR, and if is 0, recognizes that data has been written to TDR, and transfers the
data from TDR to TSR.
[2] After transferring data from TDR to TSR, the SCI sets the TDRE flag to 1 and starts transmission.
If the TIE bit is set to 1 at this time, a transmit data empty interrupt (TXI) is generated.
The serial transmit data is sent from the TxD pin in the following order.
[a] Start bit:
One 0-bit is output.
Rev.6.00 Oct.28.2004 page 493 of 1016
REJ09B0138-0600H
[b] Transmit data:
8-bit or 7-bit data is output in LSB-first order.
[c] Parity bit or multiprocessor bit:
One parity bit (even or odd parity), or one multiprocessor bit is output.
A format in which neither a parity bit nor a multiprocessor bit is output can also be selected.
[d] Stop bit(s):
One or two 1-bits (stop bits) are output.
[e] Mark state:
1 is output continuously until the start bit that starts the next transmission is sent.
[3] The SCI checks the TDRE flag at the timing for sending the stop bit.
If the TDRE flag is cleared to 0, the data is transferred from TDR to TSR, the stop bit is sent, and then serial
transmission of the next frame is started.
If the TDRE flag is set to 1, the TEND flag in SSR is set to 1, the stop bit is sent, and then the “mark state” is entered
in which 1 is output continuously. If the TEIE bit in SCR is set to 1 at this time, a TEI interrupt request is generated.
Figure 14-6 shows an example of the operation for transmission in asynchronous mode.
1
Start
bit
0
Data
D0
D1
Parity Stop Start
bit
bit
bit
D7
0/1
1
0
Data
D0
D1
Parity Stop
bit
bit
D7
0/1
1
1
Idle state
(mark state)
TDRE
TEND
TXI interrupt
Data written to TDR and
request generated TDRE flag cleared to 0 in
TXI interrupt service routine
TXI interrupt
request generated
TEI interrupt
request generated
1 frame
Figure 14-6 Example of Operation in Transmission in Asynchronous Mode
(Example with 8-Bit Data, Parity, One Stop Bit)
Rev.6.00 Oct.28.2004 page 494 of 1016
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• Serial data reception (asynchronous mode)
Figure 14-7 shows a sample flowchart for serial reception.
The following procedure should be used for serial data reception.
Initialization
[1]
Start reception
[1] SCI initialization:
The RxD pin is automatically
designated as the receive data
input pin.
[2] [3] Receive error processing and
break detection:
Read ORER, PER, and
If a receive error occurs, read the
[2]
FER flags in SSR
ORER, PER, and FER flags in
SSR to identify the error. After
performing the appropriate error
Yes
processing, ensure that the
PER∨FER∨ORER= 1
ORER, PER, and FER flags are
[3]
all cleared to 0. Reception cannot
No
Error processing
be resumed if any of these flags
(Continued on next page) are set to 1. In the case of a
framing error, a break can be
detected by reading the value of
[4]
Read RDRF flag in SSR
the input port corresponding to
the RxD pin.
No
RDRF= 1
[4] SCI status check and receive
data read :
Read SSR and check that RDRF
= 1, then read the receive data in
RDR and clear the RDRF flag to
0. Transition of the RDRF flag
from 0 to 1 can also be identified
by an RXI interrupt.
Yes
Read receive data in RDR, and
clear RDRF flag in SSR to 0
No
All data received?
Yes
Clear RE bit in SCR to 0
<End>
[5]
[5] Serial reception continuation
procedure:
To continue serial reception,
before the stop bit for the current
frame is received, read the
RDRF flag, read RDR, and clear
the RDRF flag to 0. The RDRF
flag is cleared automatically
when the DMAC or DTC is
activated by an RXI interrupt and
the RDR value is read.
Figure 14-7 Sample Serial Reception Data Flowchart
Rev.6.00 Oct.28.2004 page 495 of 1016
REJ09B0138-0600H
[3]
Error processing
No
ORER= 1
Yes
Overrun error processing
No
FER= 1
Yes
Yes
Break?
No
Framing error processing
Clear RE bit in SCR to 0
No
PER= 1
Yes
Parity error processing
Clear ORER, PER, and
FER flags in SSR to 0
<End>
Figure 14-7 Sample Serial Reception Data Flowchart (cont)
Rev.6.00 Oct.28.2004 page 496 of 1016
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In serial reception, the SCI operates as described below.
[1] The SCI monitors the transmission line, and if a 0 stop bit is detected, performs internal synchronization and starts
reception.
[2] The received data is stored in RSR in LSB-to-MSB order.
[3] The parity bit and stop bit are received.
After receiving these bits, the SCI carries out the following checks.
[a] Parity check:
The SCI checks whether the number of 1 bits in the receive data agrees with the parity (even or odd) set in the O/E
bit in SMR.
[b] Stop bit check:
The SCI checks whether the stop bit is 1.
If there are two stop bits, only the first is checked.
[c] Status check:
The SCI checks whether the RDRF flag is 0, indicating that the receive data can be transferred from RSR to RDR.
If all the above checks are passed, the RDRF flag is set to 1, and the receive data is stored in RDR.
If a receive error* is detected in the error check, the operation is as shown in table 14-11.
Note: * Subsequent receive operations cannot be performed when a receive error has occurred.
Also note that the RDRF flag is not set to 1 in reception, and so the error flags must be cleared to 0.
[4] If the RIE bit in SCR is set to 1 when the RDRF flag changes to 1, a receive data full interrupt (RXI) request is
generated.
Also, if the RIE bit in SCR is set to 1 when the ORER, PER, or FER flag changes to 1, a receive error interrupt (ERI)
request is generated.
Rev.6.00 Oct.28.2004 page 497 of 1016
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Table 14-11 Receive Errors and Conditions for Occurrence
Receive Error
Abbreviation
Occurrence Condition
Data Transfer
Overrun error
ORER
When the next data reception is Receive data is not
completed while the RDRF flag transferred from RSR to
in SSR is set to 1
RDR.
Framing error
FER
When the stop bit is 0
Parity error
PER
When the received data differs Receive data is transferred
from the parity (even or odd) set from RSR to RDR.
in SMR
Receive data is transferred
from RSR to RDR.
Figure 14-8 shows an example of the operation for reception in asynchronous mode.
1
Start
bit
0
Data
D0
D1
Parity Stop Start
bit
bit
bit
D7
0/1
1
0
Data
D0
D1
Parity Stop
bit
bit
D7
0/1
0
1
Idle state
(mark state)
RDRF
FER
RXI interrupt
request
generated
RDR data read and RDRF
flag cleared to 0 in RXI
interrupt service routine
ERI interrupt request
generated by framing
error
1 frame
Figure 14-8 Example of SCI Operation in Reception
(Example with 8-Bit Data, Parity, One Stop Bit)
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14.3.3
Multiprocessor Communication Function
The multiprocessor communication function performs serial communication using the multiprocessor format, in which a
multiprocessor bit is added to the transfer data, in asynchronous mode. Use of this function enables data transfer to be
performed among a number of processors sharing transmission lines.
When multiprocessor communication is carried out, each receiving station is addressed by a unique ID code.
The serial communication cycle consists of two component cycles: an ID transmission cycle which specifies the receiving
station , and a data transmission cycle. The multiprocessor bit is used to differentiate between the ID transmission cycle
and the data transmission cycle.
The transmitting station first sends the ID of the receiving station with which it wants to perform serial communication as
data with a 1 multiprocessor bit added. It then sends transmit data as data with a 0 multiprocessor bit added.
The receiving station skips the data until data with a 1 multiprocessor bit is sent.
When data with a 1 multiprocessor bit is received, the receiving station compares that data with its own ID. The station
whose ID matches then receives the data sent next. Stations whose ID does not match continue to skip the data until data
with a 1 multiprocessor bit is again received. In this way, data communication is carried out among a number of
processors.
Figure 14-9 shows an example of inter-processor communication using the multiprocessor format.
Data Transfer Format: There are four data transfer formats.
When the multiprocessor format is specified, the parity bit specification is invalid.
For details, see table 14-10.
Clock: See the section on asynchronous mode.
Transmitting
station
Serial transmission line
Receiving
station A
Receiving
station B
Receiving
station C
Receiving
station D
(ID= 01)
(ID= 02)
(ID= 03)
(ID= 04)
Serial
data
H'01
H'AA
(MPB= 1)
ID transmission cycle=
receiving station
specification
(MPB= 0)
Data transmission cycle=
Data transmission to
receiving station specified by ID
Legend:
MPB: Multiprocessor bit
Figure 14-9 Example of Inter-Processor Communication Using Multiprocessor Format
(Transmission of Data H'AA to Receiving Station A)
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Data Transfer Operations:
• Multiprocessor serial data transmission
Figure 14-10 shows a sample flowchart for multiprocessor serial data transmission.
The following procedure should be used for multiprocessor serial data transmission.
[1] [1] SCI initialization:
Initialization
Start transmission
Read TDRE flag in SSR
[2]
No
TDRE= 1
Yes
Write transmit data to TDR and
set MPBT bit in SSR
Clear TDRE flag to 0
No
All data transmitted?
Yes
Read TEND flag in SSR
No
The TxD pin is automatically
designated as the transmit data
output pin.
After the TE bit is set to 1,
a frame of 1s is output, and
transmission is enabled.
[2] SCI status check and transmit
data write:
Read SSR and check that the
TDRE flag is set to 1, then write
transmit data to TDR. Set the
MPBT bit in SSR to 0 or 1.
Finally, clear the TDRE flag to 0.
[3] Serial transmission continuation
procedure:
To continue serial transmission,
be sure to read 1 from the TDRE
flag to confirm that writing is
[3]
possible, then write data to TDR,
and then clear the TDRE flag to
0. Checking and clearing of the
TDRE flag is automatic when the
DMAC or DTC is activated by a
transmit data empty interrupt
(TXI) request, and data is written
to TDR.
TEND= 1
Yes
No
Break output?
[4] Break output at the end of serial
transmission:
To output a break in serial
transmission, set the port DDR to
[4]
1, clear DR to 0, then clear the
TE bit in SCR to 0.
Yes
Clear DR to 0 and set DDR to 1
Clear TE bit in SCR to 0
<End>
Figure 14-10 Sample Multiprocessor Serial Transmission Flowchart
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In serial transmission, the SCI operates as described below.
[1] The SCI monitors the TDRE flag in SSR, and if is 0, recognizes that data has been written to TDR, and transfers the
data from TDR to TSR.
[2] After transferring data from TDR to TSR, the SCI sets the TDRE flag to 1 and starts transmission.
If the TIE bit is set to 1 at this time, a transmit data empty interrupt (TXI) is generated.
The serial transmit data is sent from the TxD pin in the following order.
[a] Start bit:
One 0-bit is output.
[b] Transmit data:
8-bit or 7-bit data is output in LSB-first order.
[c] Multiprocessor bit
One multiprocessor bit (MPBT value) is output.
[d] Stop bit(s):
One or two 1-bits (stop bits) are output.
[e] Mark state:
1 is output continuously until the start bit that starts the next transmission is sent.
[3] The SCI checks the TDRE flag at the timing for sending the stop bit.
If the TDRE flag is cleared to 0, data is transferred from TDR to TSR, the stop bit is sent, and then serial transmission
of the next frame is started.
If the TDRE flag is set to 1, the TEND flag in SSR is set to 1, the stop bit is sent, and then the mark state is entered in
which 1 is output continuously. If the TEIE bit in SCR is set to 1 at this time, a transmission end interrupt (TEI)
request is generated.
Figure 14-11 shows an example of SCI operation for transmission using the multiprocessor format.
1
Start
bit
0
Multiprocessor Stop
bit
bit
Data
D0
D1
D7
0/1
1
Start
bit
0
Multiproces- Stop
1
sor bit bit
Data
D0
D1
D7
0/1
1
Idle state
(mark state)
TDRE
TEND
TXI interrupt
request generated
Data written to TDR
and TDRE flag cleared to
0 in TXI interrupt service
routine
TXI interrupt
request generated
TEI interrupt
request generated
1 frame
Figure 14-11 Example of SCI Operation in Transmission
(Example with 8-Bit Data, Multiprocessor Bit, One Stop Bit)
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• Multiprocessor serial data reception
Figure 14-12 shows a sample flowchart for multiprocessor serial reception.
The following procedure should be used for multiprocessor serial data reception.
Initialization
[1]
[1] SCI initialization:
The RxD pin is automatically
designated as the receive data
input pin.
[2]
[2] ID reception cycle:
Set the MPIE bit in SCR to 1.
Start reception
Read MPIE bit in SCR
Read ORER and FER flags in SSR
[3] SCI status check, ID reception
and comparison:
Read SSR and check that the
RDRF flag is set to 1, then read
the receive data in RDR and
compare it with this station’s ID.
If the data is not this station’s ID,
set the MPIE bit to 1 again, and
clear the RDRF flag to 0.
If the data is this station’s ID,
clear the RDRF flag to 0.
Yes
FER∨ORER= 1
No
Read RDRF flag in SSR
[3]
No
RDRF= 1
Yes
[4] SCI status check and data
reception:
Read SSR and check that the
RDRF flag is set to 1, then read
the data in RDR.
Read receive data in RDR
No
This station's ID?
Yes
[5] Receive error processing and
break detection:
If a receive error occurs, read the
ORER and FER flags in SSR to
identify the error. After
performing the appropriate error
processing, ensure that the
ORER and FER flags are all
cleared to 0.
Reception cannot be resumed if
either of these flags is set to 1.
In the case of a framing error, a
break can be detected by reading
the RxD pin value.
Read ORER and FER flags in SSR
Yes
FER∨ORER= 1
No
Read RDRF flag in SSR
[4]
No
RDRF= 1
Yes
Read receive data in RDR
No
All data received?
[5]
Error processing
Yes
Clear RE bit in SCR to 0
(Continued on
next page)
<End>
Figure 14-12 Sample Multiprocessor Serial Reception Flowchart
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[5]
Error processing
No
ORER= 1
Yes
Overrun error processing
No
FER= 1
Yes
Yes
Break?
No
Framing error processing
Clear RE bit in SCR to 0
Clear ORER, PER, and
FER flags in SSR to 0
<End>
Figure 14-12 Sample Multiprocessor Serial Reception Flowchart (cont)
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Figure 14-13 shows an example of SCI operation for multiprocessor format reception.
1
Start
bit
0
Data (ID1)
MPB
D0
D1
D7
1
Stop
bit
Start
bit
1
0
Data (Data1)
MPB
D0
D1
D7
0
Stop
bit
1
1 Idle state
(mark state)
MPIE
RDRF
RDR
value
ID1
MPIE = 0
RXI interrupt
request
(multiprocessor
interrupt)
generated
RDR data read
and RDRF flag
cleared to 0 in
RXI interrupt
service routine
If not this station’s ID, RXI interrupt request is
MPIE bit is set to 1
not generated, and RDR
again
retains its state
(a) Data does not match station’s ID
1
Start
bit
0
Data (ID2)
MPB
D0
D1
D7
1
Stop
bit
Start
bit
1
0
Data (Data2)
MPB
D0
D1
D7
0
Stop
bit
1
1 Idle state
(mark state)
MPIE
RDRF
RDR
value
ID1
MPIE = 0
ID2
RXI interrupt
request
(multiprocessor
interrupt)
generated
RDR data read and
RDRF flag cleared
to 0 in RXI interrupt
service routine
Matches this station’s ID,
so reception continues, and
data is received in RXI
interrupt service routine
(b) Data matches station’s ID
Figure 14-13 Example of SCI Operation in Reception
(Example with 8-Bit Data, Multiprocessor Bit, One Stop Bit)
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Data2
MPIE bit set to 1
again
14.3.4
Operation in Clocked Synchronous Mode
In clocked synchronous mode, data is transmitted or received in synchronization with clock pulses, making it suitable for
high-speed serial communication.
Inside the SCI, the transmitter and receiver are independent units, enabling full-duplex communication by use of a
common clock. Both the transmitter and the receiver also have a double-buffered structure, so that data can be read or
written during transmission or reception, enabling continuous data transfer.
Figure 14-14 shows the general format for clocked synchronous serial communication.
One unit of transfer data (character or frame)
*
*
Serial
clock
LSB
Serial
data
Bit 0
MSB
Bit 1
Bit 2
Bit 3
Bit 4
Bit 5
Bit 6
Bit 7
Don’t care
Don’t care
Note: * High except in continuous transfer
Figure 14-14 Data Format in Synchronous Communication
In clocked synchronous serial communication, data on the transmission line is output from one falling edge of the serial
clock to the next. Data confirmation is guaranteed at the rising edge of the serial clock.
In clocked serial communication, one character consists of data output starting with the LSB and ending with the MSB.
After the MSB is output, the transmission line holds the MSB state.
In clocked synchronous mode, the SCI receives data in synchronization with the rising edge of the serial clock.
Data Transfer Format: A fixed 8-bit data format is used.
No parity or multiprocessor bits are added.
Clock: Either an internal clock generated by the on-chip baud rate generator or an external serial clock input at the SCK
pin can be selected, according to the setting of the C/A bit in SMR and the CKE1 and CKE0 bits in SCR. For details of
SCI clock source selection, see table 14-9.
When the SCI is operated on an internal clock, the serial clock is output from the SCK pin.
Eight serial clock pulses are output in the transfer of one character, and when no transfer is performed the clock is fixed
high. When only receive operations are performed, however, the serial clock is output until an overrun error occurs or the
RE bit is cleared to 0. If you want to perform receive operations in units of one character, you should select an external
clock as the clock source.
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Data Transfer Operations:
• SCI initialization (clocked synchronous mode)
Before transmitting and receiving data, you should first clear the TE and RE bits in SCR to 0, then initialize the SCI as
described below.
When the operating mode, transfer format, etc., is changed, the TE and RE bits must be cleared to 0 before making the
change using the following procedure. When the TE bit is cleared to 0, the TDRE flag is set to 1 and TSR is initialized.
Note that clearing the RE bit to 0 does not change the contents of the RDRF, PER, FER, and ORER flags, or the
contents of RDR.
Figure 14-15 shows a sample SCI initialization flowchart.
[1] Set the clock selection in SCR. Be sure
to clear bits RIE, TIE, TEIE, and MPIE,
TE and RE, to 0.
Start initialization
Clear TE and RE bits in SCR to 0
[2] Set the data transfer format in SMR
and SCMR.
Set CKE1 and CKE0 bits in SCR
(TE, RE bits 0)
[1]
[3] Write a value corresponding to the bit
rate to BRR. Not necessary if an
external clock is used.
Set data transfer format in
SMR and SCMR
[2]
Set value in BRR
[3]
[4] Wait at least one bit interval, then set
the TE bit or RE bit in SCR to 1.
Also set the RIE, TIE, TEIE, and MPIE
bits.
Setting the TE and RE bits enables the
TxD and RxD pins to be used.
Wait
No
1-bit interval elapsed?
Yes
Set TE and RE bits in SCR to 1, and
set RIE, TIE, TEIE, and MPIE bits
[4]
<Transfer start>
Note: In simultaneous transmit and receive operations, the TE and RE bits should
both be cleared to 0 or set to 1 simultaneously.
Figure 14-15 Sample SCI Initialization Flowchart
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• Serial data transmission (clocked synchronous mode)
Figure 14-16 shows a sample flowchart for serial transmission.
The following procedure should be used for serial data transmission.
[1]
Initialization
Start transmission
Read TDRE flag in SSR
[2]
No
TDRE= 1
Yes
Write transmit data to TDR and
clear TDRE flag in SSR to 0
No
All data transmitted?
[3]
Yes
Read TEND flag in SSR
[1] SCI initialization:
The TxD pin is automatically
designated as the transmit data output
pin.
[2] SCI status check and transmit data
write:
Read SSR and check that the TDRE
flag is set to 1, then write transmit data
to TDR and clear the TDRE flag to 0.
[3] Serial transmission continuation
procedure:
To continue serial transmission, be
sure to read 1 from the TDRE flag to
confirm that writing is possible, then
write data to TDR, and then clear the
TDRE flag to 0.
Checking and clearing of the TDRE
flag is automatic when the DMAC or
DTC is activated by a transmit data
empty interrupt (TXI) request and data
is written to TDR.
No
TEND= 1
Yes
Clear TE bit in SCR to 0
<End>
Figure 14-16 Sample Serial Transmission Flowchart
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In serial transmission, the SCI operates as described below.
[1] The SCI monitors the TDRE flag in SSR, and if is 0, recognizes that data has been written to TDR, and transfers the
data from TDR to TSR.
[2] After transferring data from TDR to TSR, the SCI sets the TDRE flag to 1 and starts transmission. If the TIE bit is set
to 1 at this time, a transmit data empty interrupt (TXI) is generated.
When clock output mode has been set, the SCI outputs 8 serial clock pulses. When use of an external clock has been
specified, data is output synchronized with the input clock.
The serial transmit data is sent from the TxD pin starting with the LSB (bit 0) and ending with the MSB (bit 7).
[3] The SCI checks the TDRE flag at the timing for sending the MSB (bit 7).
If the TDRE flag is cleared to 0, data is transferred from TDR to TSR, and serial transmission of the next frame is
started.
If the TDRE flag is set to 1, the TEND flag in SSR is set to 1, the MSB (bit 7) is sent, and the TxD pin maintains its
state.
If the TEIE bit in SCR is set to 1 at this time, a TEI interrupt request is generated.
[4] After completion of serial transmission, the SCK pin is fixed.
Figure 14-17 shows an example of SCI operation in transmission.
Transfer direction
Serial clock
Serial data
Bit 7
Bit 0
Bit 7
Bit 0
Bit 1
Bit 6
Bit 7
TDRE
TEND
TXI interrupt
Data written to TDR
request generated
and TDRE flag
cleared to 0 in TXI
interrupt service routine
TXI interrupt
request generated
1 frame
Figure 14-17 Example of SCI Operation in Transmission
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TEI interrupt
request generated
• Serial data reception (clocked synchronous mode)
Figure 14-18 shows a sample flowchart for serial reception.
The following procedure should be used for serial data reception.
When changing the operating mode from asynchronous to clocked synchronous, be sure to check that the ORER, PER,
and FER flags are all cleared to 0.
The RDRF flag will not be set if the FER or PER flag is set to 1, and neither transmit nor receive operations will be
possible.
Initialization
[1]
Start reception
[2]
Read ORER flag in SSR
Yes
[3]
ORER= 1
No
Error processing
(Continued below)
Read RDRF flag in SSR
[4]
No
RDRF= 1
Yes
Read receive data in RDR, and
clear RDRF flag in SSR to 0
No
All data received?
Yes
Clear RE bit in SCR to 0
[5]
[1]
SCI initialization:
The RxD pin is automatically
designated as the receive data
input pin.
[2] [3] Receive error processing:
If a receive error occurs, read the
ORER flag in SSR, and after
performing the appropriate error
processing, clear the ORER flag
to 0. Transfer cannot be resumed
if the ORER flag is set to 1.
[4] SCI status check and receive
data read:
Read SSR and check that the
RDRF flag is set to 1, then read
the receive data in RDR and
clear the RDRF flag to 0.
Transition of the RDRF flag from
0 to 1 can also be identified by
an RXI interrupt.
[5] Serial reception continuation
procedure:
To continue serial reception,
before the MSB (bit 7) of the
current frame is received, finish
reading the RDRF flag, reading
RDR, and clearing the RDRF flag
to 0. The RDRF flag is cleared
automatically when the DMAC or
DTC is activated by a receive
data full interrupt (RXI) request
and the RDR value is read.
<End>
[3]
Error processing
Overrun error processing
Clear ORER flag in SSR to 0
<End>
Figure 14-18 Sample Serial Reception Flowchart
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In serial reception, the SCI operates as described below.
[1] The SCI performs internal initialization in synchronization with serial clock input or output.
[2] The received data is stored in RSR in LSB-to-MSB order.
After reception, the SCI checks whether the RDRF flag is 0 and the receive data can be transferred from RSR to RDR.
If this check is passed, the RDRF flag is set to 1, and the receive data is stored in RDR. If a receive error is detected in
the error check, the operation is as shown in table 14-11.
Neither transmit nor receive operations can be performed subsequently when a receive error has been found in the
error check.
[3] If the RIE bit in SCR is set to 1 when the RDRF flag changes to 1, a receive data full interrupt (RXI) request is
generated.
Also, if the RIE bit in SCR is set to 1 when the ORER flag changes to 1, a receive error interrupt (ERI) request is
generated.
Figure 14-19 shows an example of SCI operation in reception.
Serial
clock
Serial
data
Bit 7
Bit 0
Bit 7
Bit 0
Bit 1
Bit 6
Bit 7
RDRF
ORER
RXI interrupt request
generated
RDR data read and
RDRF flag cleared to 0
in RXI interrupt service
routine
RXI interrupt request
generated
ERI interrupt request
generated by overrun
error
1 frame
Figure 14-19 Example of SCI Operation in Reception
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• Simultaneous serial data transmission and reception (clocked synchronous mode)
Figure 14-20 shows a sample flowchart for simultaneous serial transmit and receive operations.
The following procedure should be used for simultaneous serial data transmit and receive operations.
Initialization
[1] SCI initialization:
[1]
The TxD pin is designated as the
transmit data output pin, and the
RxD pin is designated as the
receive data input pin, enabling
simultaneous transmit and receive
operations.
Start transmission/reception
Read TDRE flag in SSR
[2]
[2] SCI status check and transmit data
write:
Read SSR and check that the
TDRE flag is set to 1, then write
transmit data to TDR and clear the
TDRE flag to 0.
Transition of the TDRE flag from 0
to 1 can also be identified by a TXI
interrupt.
No
TDRE= 1
Yes
Write transmit data to TDR and
clear TDRE flag in SSR to 0
[3] Receive error processing:
If a receive error occurs, read the
ORER flag in SSR, and after
performing the appropriate error
processing, clear the ORER flag to
0. Transmission/reception cannot be
resumed if the ORER flag is set to
1.
Read ORER flag in SSR
ORER= 1
No
Read RDRF flag in SSR
Yes
[3]
Error processing
[4] SCI status check and receive data
read:
Read SSR and check that the
RDRF flag is set to 1, then read the
receive data in RDR and clear the
RDRF flag to 0. Transition of the
RDRF flag from 0 to 1 can also be
identified by an RXI interrupt.
[4]
No
RDRF= 1
Yes
[5] Serial transmission/reception
Read receive data in RDR, and
clear RDRF flag in SSR to 0
No
All data received?
[5]
Yes
Clear TE and RE bits in SCR to 0
<End>
Note: When switching from transmit or receive operation to simultaneous
transmit and receive operations, first clear the TE and RE bits to 0,
then set both these bits to 1 simultaneously.
continuation procedure:
To continue serial transmission/
reception, before the MSB (bit 7) of
the current frame is received, finish
reading the RDRF flag, reading
RDR, and clearing the RDRF flag to
0. Also, before the MSB (bit 7) of
the current frame is transmitted,
read 1 from the TDRE flag to
confirm that writing is possible.
Then write data to TDR and clear
the TDRE flag to 0.
Checking and clearing of the TDRE
flag is automatic when the DMAC or
DTC is activated by a transmit data
empty interrupt (TXI) request and
data is written to TDR. Also, the
RDRF flag is cleared automatically
when the DMAC or DTC is activated
by a receive data full interrupt (RXI)
request and the RDR value is read.
Figure 14-20 Sample Flowchart of Simultaneous Serial Transmit and Receive Operations
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14.4
SCI Interrupts
The SCI has four interrupt sources: the transmit-end interrupt (TEI) request, receive-error interrupt (ERI) request, receivedata-full interrupt (RXI) request, and transmit-data-empty interrupt (TXI) request. Table 14-12 shows the interrupt sources
and their relative priorities. Individual interrupt sources can be enabled or disabled with the TIE, RIE, and TEIE bits in the
SCR. Each kind of interrupt request is sent to the interrupt controller independently.
When the TDRE flag in SSR is set to 1, a TXI interrupt request is generated. When the TEND flag in SSR is set to 1, a
TEI interrupt request is generated. A TXI interrupt can activate the DMAC or DTC to perform data transfer. The TDRE
flag is cleared to 0 automatically when data transfer is performed by the DMAC or DTC. The DMAC and DTC cannot be
activated by a TEI interrupt request.
When the RDRF flag in SSR is set to 1, an RXI interrupt request is generated. When the ORER, PER, or FER flag in SSR
is set to 1, an ERI interrupt request is generated. An RXI interrupt can activate the DMAC or DTC to perform data
transfer. The RDRF flag is cleared to 0 automatically when data transfer is performed by the DMAC or DTC. The DMAC
and DTC cannot be activated by an ERI interrupt request.
Also note that the DMAC cannot be activated by an SCI channel 2 interrupt.
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Table 14-12 SCI Interrupt Sources
Channel
Interrupt
Source
Description
DTC
Activation
DMAC
Activation
0
ERI
Interrupt due to receive error
(ORER, FER, or PER)
Not
possible
Not
possible
RXI
Interrupt due to receive data full
state (RDRF)
Possible
Possible
TXI
Interrupt due to transmit data empty
state (TDRE)
Possible
Possible
TEI
Interrupt due to transmission end
(TEND)
Not
possible
Not
possible
ERI
Interrupt due to receive error
(ORER, FER, or PER)
Not
possible
Not
possible
RXI
Interrupt due to receive data full
state (RDRF)
Possible
Possible
TXI
Interrupt due to transmit data empty
state (TDRE)
Possible
Possible
TEI
Interrupt due to transmission end
(TEND)
Not
possible
Not
possible
ERI
Interrupt due to receive error
(ORER, FER, or PER)
Not
possible
Not
possible
RXI
Interrupt due to receive data full
state (RDRF)
Possible
Not
possible
TXI
Interrupt due to transmit data empty
state (TDRE)
Possible
Not
possible
TEI
Interrupt due to transmission end
(TEND)
Not
possible
Not
possible
1
2
Priority*
High
Low
Note: * This table shows the initial state immediately after a reset. Relative priorities among channels can be changed by
means of ICR and IPR.
A TEI interrupt is requested when the TEND flag is set to 1 while the TEIE bit is set to 1. The TEND flag is cleared at the
same time as the TDRE flag. Consequently, if a TEI interrupt and a TXI interrupt are requested simultaneously, the TXI
interrupt may be accepted first, with the result that the TDRE and TEND flags are cleared. Note that the TEI interrupt
will not be accepted in this case.
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14.5
Usage Notes
The following points should be noted when using the SCI.
Relation between Writes to TDR and the TDRE Flag
The TDRE flag in SSR is a status flag that indicates that transmit data has been transferred from TDR to TSR. When the
SCI transfers data from TDR to TSR, the TDRE flag is set to 1.
Data can be written to TDR regardless of the state of the TDRE flag. However, if new data is written to TDR when the
TDRE flag is cleared to 0, the data stored in TDR will be lost since it has not yet been transferred to TSR. It is therefore
essential to check that the TDRE flag is set to 1 before writing transmit data to TDR.
Operation when Multiple Receive Errors Occur Simultaneously
If a number of receive errors occur at the same time, the state of the status flags in SSR is as shown in table 14-13. If there
is an overrun error, data is not transferred from RSR to RDR, and the receive data is lost.
Table 14-13 State of SSR Status Flags and Transfer of Receive Data
SSR Status Flags
Notes:
Receive Data Transfer
Receive Error Status
RDRF
ORER
FER
PER
RSR to RDR
1
1
0
0
×
0
0
1
0
Framing error
0
0
0
1
Parity error
1
1
1
0
×
Overrun error + framing error
1
1
0
1
×
Overrun error + parity error
0
0
1
1
1
1
1
1
Framing error + parity error
×
: Receive data is transferred from RSR to RDR.
×: Receive data is not transferred from RSR to RDR.
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Overrun error
Overrun error + framing error +
parity error
Break Detection and Processing (Asynchronous Mode Only): When framing error (FER) detection is performed, a
break can be detected by reading the RxD pin value directly. In a break, the input from the RxD pin becomes all 0s, and so
the FER flag is set, and the parity error flag (PER) may also be set.
Note that, since the SCI continues the receive operation after receiving a break, even if the FER flag is cleared to 0, it will
be set to 1 again.
Sending a Break (Asynchronous Mode Only): The TxD pin has a dual function as an I/O port whose direction (input or
output) is determined by DR and DDR. This can be used to send a break.
Between serial transmission initialization and setting of the TE bit to 1, the mark state is replaced by the value of DR (the
pin does not function as the TxD pin until the TE bit is set to 1). Consequently, DDR and DR for the port corresponding to
the TxD pin are first set to 1.
To send a break during serial transmission, first clear DR to 0, then clear the TE bit to 0.
When the TE bit is cleared to 0, the transmitter is initialized regardless of the current transmission state, the TxD pin
becomes an I/O port, and 0 is output from the TxD pin.
Receive Error Flags and Transmit Operations (Clocked Synchronous Mode Only):
Transmission cannot be started when a receive error flag (ORER, PER, or FER) is set to 1, even if the TDRE flag is
cleared to 0. Be sure to clear the receive error flags to 0 before starting transmission.
Note also that receive error flags cannot be cleared to 0 even if the RE bit is cleared to 0.
Receive Data Sampling Timing and Reception Margin in Asynchronous Mode:
In asynchronous mode, the SCI operates on a basic clock with a frequency of 16 times the transfer rate.
In reception, the SCI samples the falling edge of the start bit using the basic clock, and performs internal synchronization.
Receive data is latched internally at the rising edge of the 8th pulse of the basic clock. This is illustrated in figure 14-21.
16 clocks
8 clocks
0
7
15 0
7
15 0
Internal basic
clock
Receive data
(RxD)
Start bit
D0
D1
Synchronization
sampling timing
Data sampling
timing
Figure 14-21 Receive Data Sampling Timing in Asynchronous Mode
Thus the reception margin in asynchronous mode is given by formula (1) below.
M = | (0.5 –
1
2N
) – (L – 0.5) F –
| D – 0.5 |
(1 + F) | × 100%
N
... Formula (1)
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REJ09B0138-0600H
Where M
N
D
L
F
: Reception margin (%)
: Ratio of bit rate to clock (N = 16)
: Clock duty (D = 0 to 1.0)
: Frame length (L = 9 to 12)
: Absolute value of clock rate deviation
Assuming values of F = 0 and D = 0.5 in formula (1), a reception margin of 46.875% is given by formula (2) below.
When D = 0.5 and F = 0,
M = (0.5 –
1
2 × 16
) × 100%
= 46.875%
... Formula (2)
However, this is only the computed value, and a margin of 20% to 30% should be allowed in system design.
Restrictions on Use of DMAC or DTC
• When an external clock source is used as the serial clock, the transmit clock should not be input until at least 5 ø clock
cycles after TDR is updated by the DMAC or DTC. Misoperation may occur if the transmit clock is input within 4 ø
clocks after TDR is updated. (Figure 14-22)
• When RDR is read by the DMAC or DTC, be sure to set the activation source to the relevant SCI reception data full
interrupt (RXI).
SCK
t
TDRE
LSB
Serial data
D0
D1
D2
D3
D4
D5
D6
D7
Note: When operating on an external clock, set t >4 clocks.
Figure 14-22 Example of Clocked Synchronous Transmission by DTC
Operation before mode transition (for the H8S/2398, H8S/2394, H8S/2392, and H8S/2390)
Before a mode transition to module stop mode or software standby mode, SCR should be initialized first, then SMR, BRR,
and SCMR should be initialized.
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Section 15 Smart Card Interface
15.1
Overview
SCI supports an IC card (Smart Card) interface conforming to ISO/IEC 7816-3 (Identification Card) as a serial
communication interface extension function.
Switching between the normal serial communication interface and the Smart Card interface is carried out by means of a
register setting.
15.1.1
Features
Features of the Smart Card interface supported by the H8S/2357 Group are as follows.
• Asynchronous mode
 Data length: 8 bits
 Parity bit generation and checking
 Transmission of error signal (parity error) in receive mode
 Error signal detection and automatic data retransmission in transmit mode
 Direct convention and inverse convention both supported
• On-chip baud rate generator allows any bit rate to be selected
• Three interrupt sources
 Three interrupt sources (transmit data empty, receive data full, and transmit/receive error) that can issue requests
independently
 The transmit data empty interrupt and receive data full interrupt can activate the DMA controller (DMAC) or data
transfer controller (DTC) to execute data transfer
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15.1.2
Block Diagram
Bus interface
Figure 15-1 shows a block diagram of the Smart Card interface.
Module data bus
RDR
RxD
TDR
RSR
BRR
SCMR
SSR
SCR
SMR
TSR
ø
Baud rate
generator
Transmission/
reception control
TxD
Parity generation
ø/4
ø/16
ø/64
Clock
Parity check
SCK
Legend:
SCMR:
RSR:
RDR:
TSR:
TDR:
SMR:
SCR:
SSR:
BRR:
TXI
RXI
ERI
Smart Card mode register
Receive shift register
Receive data register
Transmit shift register
Transmit data register
Serial mode register
Serial control register
Serial status register
Bit rate register
Figure 15-1 Block Diagram of Smart Card Interface
15.1.3
Pin Configuration
Table 15-1 shows the Smart Card interface pin configuration.
Table 15-1 Smart Card Interface Pins
Channel
Pin Name
Symbol
I/O
Function
0
Serial clock pin 0
SCK0
I/O
SCI0 clock input/output
Receive data pin 0
RxD0
Input
SCI0 receive data input
Transmit data pin 0
TxD0
Output
SCI0 transmit data output
Serial clock pin 1
SCK1
I/O
SCI1 clock input/output
Receive data pin 1
RxD1
Input
SCI1 receive data input
Transmit data pin 1
TxD1
Output
SCI1 transmit data output
Serial clock pin 2
SCK2
I/O
SCI2 clock input/output
Receive data pin 2
RxD2
Input
SCI2 receive data input
Transmit data pin 2
TxD2
Output
SCI2 transmit data output
1
2
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Internal
data bus
15.1.4
Register Configuration
Table 15-2 shows the registers used by the Smart Card interface. Details of SMR, BRR, SCR, TDR, RDR, and MSTPCR
are the same as for the normal SCI function: see the register descriptions in section 14, Serial Communication Interface
(SCI).
Table 15-2 Smart Card Interface Registers
Channel
Name
Abbreviation
R/W
Initial Value
Address* 1
0
Serial mode register 0
SMR0
R/W
H'00
H'FF78
Bit rate register 0
BRR0
R/W
H'FF
H'FF79
Serial control register 0
SCR0
R/W
H'00
H'FF7A
Transmit data register 0
TDR0
R/W
H'FF
H'FF7B
H'84
H'FF7C
1
2
All
2
Serial status register 0
SSR0
R/(W)*
Receive data register 0
RDR0
R
H'00
H'FF7D
Smart Card mode
register 0
SCMR0
R/W
H'F2
H'FF7E
Serial mode register 1
SMR1
R/W
H'00
H'FF80
Bit rate register 1
BRR1
R/W
H'FF
H'FF81
Serial control register 1
SCR1
R/W
H'00
H'FF82
Transmit data register 1
TDR1
R/W
H'FF
H'FF83
H'84
H'FF84
2
Serial status register 1
SSR1
R/(W)*
Receive data register 1
RDR1
R
H'00
H'FF85
Smart Card mode
register 1
SCMR1
R/W
H'F2
H'FF86
Serial mode register 2
SMR2
R/W
H'00
H'FF88
Bit rate register 2
BRR2
R/W
H'FF
H'FF89
Serial control register 2
SCR2
R/W
H'00
H'FF8A
Transmit data register 2
TDR2
R/W
H'FF
H'FF8B
H'84
H'FF8C
2
Serial status register 2
SSR2
R/(W)*
Receive data register 2
RDR2
R
H'00
H'FF8D
Smart Card mode
register 2
SCMR2
R/W
H'F2
H'FF8E
Module stop control
register
MSTPCR
R/W
H'3FFF
H'FF3C
Notes: 1. Lower 16 bits of the address.
2. Can only be written with 0 for flag clearing.
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15.2
Register Descriptions
Registers added with the Smart Card interface and bits for which the function changes are described here.
15.2.1
Smart Card Mode Register (SCMR)
Bit
:
7
6
5
4
3
2
1
0
—
—
—
—
SDIR
SINV
—
SMIF
Initial value :
1
1
1
1
0
0
1
0
R/W
—
—
—
—
R/W
R/W
—
R/W
:
SCMR is an 8-bit readable/writable register that selects the Smart Card interface function.
SCMR is initialized to H'F2 by a reset, and in standby mode or module stop mode.
Bits 7 to 4—Reserved: These bits cannot be modified and are always read as 1.
Bit 3—Smart Card Data Transfer Direction (SDIR): Selects the serial/parallel conversion format.
Bit 3
SDIR
Description
0
TDR contents are transmitted LSB-first
(Initial value)
Receive data is stored in RDR LSB-first
1
TDR contents are transmitted MSB-first
Receive data is stored in RDR MSB-first
Bit 2—Smart Card Data Invert (SINV): Specifies inversion of the data logic level. This function is used together with
the SDIR bit for communication with an inverse convention card. The SINV bit does not affect the logic level of the parity
bit. For parity-related setting procedures, see section 15.3.4, Register Settings.
Bit 2
SINV
0
Description
TDR contents are transmitted as they are
(Initial value)
Receive data is stored as it is in RDR
1
TDR contents are inverted before being transmitted
Receive data is stored in inverted form in RDR
Bit 1—Reserved: This bit cannot be modified and is always read as 1.
Bit 0—Smart Card Interface Mode Select (SMIF): Enables or disables the Smart Card interface function.
Bit 0
SMIF
Description
0
Smart Card interface function is disabled
1
Smart Card interface function is enabled
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(Initial value)
15.2.2
Serial Status Register (SSR)
Bit
:
7
6
5
4
3
2
1
0
TDRE
RDRF
ORER
ERS
PER
TEND
MPB
MPBT
1
0
0
0
0
1
0
0
R/(W)*
R/(W)*
R/(W)*
R/(W)*
R/(W)*
R
R
R/W
Initial value :
R/W
:
Note: * Only 0 can be written to bits 7 to 3, to clear these flags.
Bit 4 of SSR has a different function in Smart Card interface mode. Coupled with this, the setting conditions for bit 2,
TEND, are also different.
Bits 7 to 5—Operate in the same way as for the normal SCI. For details, see section 14.2.7, Serial Status Register (SSR).
Bit 4—Error Signal Status (ERS): In Smart Card interface mode, bit 4 indicates the status of the error signal sent back
from the receiving end in transmission. Framing errors are not detected in Smart Card interface mode.
Bit 4
ERS
Description
0
[Clearing conditions]
1
(Initial value)
•
Upon reset, and in standby mode or module stop mode
•
When 0 is written to ERS after reading ERS = 1
[Setting condition]
When the low level of the error signal is sampled
Note: Clearing the TE bit in SCR to 0 does not affect the ERS flag, which retains its previous state.
Bits 3 to 0—Operate in the same way as for the normal SCI. For details, see section 14.2.7, Serial Status Register (SSR).
However, the setting conditions for the TEND bit, are as shown below.
Bit 2
TEND
Description
0
[Clearing conditions]
1
(Initial value)
•
When 0 is written to TDRE after reading TDRE = 1
•
When the DMAC or DTC is activated by a TXI interrupt and write data to TDR
[Setting conditions]
•
Upon reset, and in standby mode or module stop mode
•
When the TE bit in SCR is 0 and the ERS bit is also 0
•
When TDRE = 1 and ERS = 0 (normal transmission) 2.5 etu after transmission of a
1-byte serial character when GM = 0
•
When TDRE = 1 and ERS = 0 (normal transmission) 1.0 etu after transmission of a
1-byte serial character when GM = 1
Note: etu: Elementary Time Unit (time for transfer of 1 bit)
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REJ09B0138-0600H
15.2.3
Serial Mode Register (SMR)
Bit
:
7
6
5
4
3
2
1
0
GM
CHR
PE
O/E
STOP
MP
CKS1
CKS0
Initial value :
0
0
0
0
0
0
0
0
Set value* :
GM
0
1
O/E
1
0
CKS1
CKS0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
:
Note: * When the Smart Card interface is used, be sure to make the 0 or 1 setting shown for bits 6, 5, 3, and 2.
The function of bit 7 of SMR changes in Smart Card interface mode.
Bit 7—GSM Mode (GM): Sets the Smart Card interface function to GSM mode.
This bit is cleared to 0 when the normal Smart Card interface is used. In GSM mode, this bit is set to 1, the timing of
setting of the TEND flag that indicates transmission completion is advanced and clock output control mode addition is
performed. The contents of the clock output control mode addition are specified by bits 1 and 0 of the serial control
register (SCR).
Bit 7
GM
Description
0
Normal Smart Card interface mode operation
1
•
TEND flag generation 12.5 etu after beginning of start bit
•
Clock output ON/OFF control only
(Initial value)
GSM mode Smart Card interface mode operation
•
TEND flag generation 11.0 etu after beginning of start bit
•
High/low fixing control possible in addition to clock output ON/OFF control (set by
SCR)
Note: etu: Elementary time unit (time for transfer of 1 bit)
Bits 6 to 0—Operate in the same way as for the normal SCI.
For details, see section 14.2.5, Serial Mode Register (SMR).
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15.2.4
Serial Control Register (SCR)
Bit
:
Initial value :
R/W
:
7
6
5
4
3
2
1
0
TIE
RIE
TE
RE
MPIE
TEIE
CKE1
CKE0
0
0
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
In Smart Card interface mode, the function of bits 1 and 0 of SCR changes when bit 7 of the serial mode register (SMR) is
set to 1.
Bits 7 to 2—Operate in the same way as for the normal SCI.
For details, see section 14.2.6, Serial Control Register (SCR).
Bits 1 and 0—Clock Enable 1 and 0 (CKE1, CKE0): These bits are used to select the SCI clock source and enable or
disable clock output from the SCK pin.
In Smart Card interface mode, in addition to the normal switching between clock output enabling and disabling, the clock
output can be specified as to be fixed high or low.
SCMR
SMR
SMIF
C/A, GM
0
See the SCI
1
SCR Setting
CKE1
CKE0
SCK Pin Function
0
0
0
Operates as port I/O pin
1
0
0
1
Outputs clock as SCK output pin
1
1
0
0
Operates as SCK output pin, with output fixed
low
1
1
0
1
Outputs clock as SCK output pin
1
1
1
0
Operates as SCK output pin, with output fixed
high
1
1
1
1
Outputs clock as SCK output pin
Rev.6.00 Oct.28.2004 page 523 of 1016
REJ09B0138-0600H
15.3
Operation
15.3.1
Overview
The main functions of the Smart Card interface are as follows.
•
•
•
•
•
One frame consists of 8-bit data plus a parity bit.
In transmission, a guard time of at least 2 etu (Elementary Time Unit: the time for transfer of 1 bit) is left between the
end of the parity bit and the start of the next frame.
If a parity error is detected during reception, a low error signal level is output for one etu period, 10.5 etu after the start
bit.
If the error signal is sampled during transmission, the same data is transmitted automatically after the elapse of 2 etu or
longer.
Only asynchronous communication is supported; there is no clocked synchronous communication function.
15.3.2
Pin Connections
Figure 15-2 shows a schematic diagram of Smart Card interface related pin connections.
In communication with an IC card, since both transmission and reception are carried out on a single data transmission line,
the TxD pin and RxD pin should be connected with the LSI pin. The data transmission line should be pulled up to the VCC
power supply with a resistor.
When the clock generated on the Smart Card interface is used by an IC card, the SCK pin output is input to the CLK pin
of the IC card. No connection is needed if the IC card uses an internal clock.
LSI port output is used as the reset signal.
Other pins must normally be connected to the power supply or ground.
VCC
TxD
I/O
RxD
SCK
Rx (port)
H8S/2357 Group
Data line
Clock line
Reset line
CLK
RST
IC card
Connected equipment
Figure 15-2 Schematic Diagram of Smart Card Interface Pin Connections
Note: If an IC card is not connected, and the TE and RE bits are both set to 1, closed transmission/reception is possible,
enabling self-diagnosis to be carried out.
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REJ09B0138-0600H
15.3.3
Data Format
Figure 15-3 shows the Smart Card interface data format. In reception in this mode, a parity check is carried out on each
frame, and if an error is detected an error signal is sent back to the transmitting end, and retransmission of the data is
requested. If an error signal is sampled during transmission, the same data is retransmitted.
When there is no parity error
Ds
D0
D1
D2
D3
D4
D5
D6
D7
Dp
D7
Dp
Transmitting station output
When a parity error occurs
Ds
D0
D1
D2
D3
D4
D5
D6
DE
Transmitting station output
Receiving station
output
Legend:
Ds:
Start bit
D0 to D7: Data bits
Dp:
Parity bit
DE:
Error signal
Figure 15-3 Smart Card Interface Data Format
The operation sequence is as follows.
[1] When the data line is not in use it is in the high-impedance state, and is fixed high with a pull-up resistor.
[2] The transmitting station starts transfer of one frame of data. The data frame starts with a start bit (Ds, low-level),
followed by 8 data bits (D0 to D7) and a parity bit (Dp).
[3] With the Smart Card interface, the data line then returns to the high-impedance state. The data line is pulled high with
a pull-up resistor.
[4] The receiving station carries out a parity check.
If there is no parity error and the data is received normally, the receiving station waits for reception of the next data.
If a parity error occurs, however, the receiving station outputs an error signal (DE, low-level) to request retransmission
of the data. After outputting the error signal for the prescribed length of time, the receiving station places the signal
line in the high-impedance state again. The signal line is pulled high again by a pull-up resistor.
[5] If the transmitting station does not receive an error signal, it proceeds to transmit the next data frame.
If it does receive an error signal, however, it returns to step [2] and retransmits the erroneous data.
Rev.6.00 Oct.28.2004 page 525 of 1016
REJ09B0138-0600H
15.3.4
Register Settings
Table 15-3 shows a bit map of the registers used by the Smart Card interface.
Bits indicated as 0 or 1 must be set to the value shown. The setting of other bits is described below.
Table 15-3 Smart Card Interface Register Settings
Bit
Register
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
SMR
GM
0
1
O/E
1
0
CKS1
CKS0
BRR
BRR7
BRR6
BRR5
BRR4
BRR3
BRR2
BRR1
BRR0
SCR
TIE
RIE
TE
RE
0
0
CKE1*
CKE0
TDR
TDR7
TDR6
TDR5
TDR4
TDR3
TDR2
TDR1
TDR0
SSR
TDRE
RDRF
ORER
ERS
PER
TEND
0
0
RDR
RDR7
RDR6
RDR5
RDR4
RDR3
RDR2
RDR1
RDR0
SCMR
—
—
—
—
SDIR
SINV
—
SMIF
Notes: — : Not used.
* The CKE1 bit must be cleared to 0 when the GM bit in SMR is cleared to 0.
SMR Setting: The GM bit is cleared to 0 in normal Smart Card interface mode, and set to 1 in GSM mode. The O/E bit is
cleared to 0 if the IC card is of the direct convention type, and set to 1 if of the inverse convention type.
Bits CKS1 and CKS0 select the clock source of the on-chip baud rate generator. See section 15.3.5, Clock.
BRR Setting: BRR is used to set the bit rate. See section 15.3.5, Clock, for the method of calculating the value to be set.
SCR Setting: The function of the TIE, RIE, TE, and RE bits is the same as for the normal SCI. For details, see section 14,
Serial Communication Interface (SCI).
Bits CKE1 and CKE0 specify the clock output. When the GM bit in SMR is cleared to 0, set these bits to B'00 if a clock
is not to be output, or to B'01 if a clock is to be output. When the GM bit in SMR is set to 1, clock output is performed.
The clock output can also be fixed high or low.
Smart Card Mode Register (SCMR) Setting:
The SDIR bit is cleared to 0 if the IC card is of the direct convention type, and set to 1 if of the inverse convention type.
The SINV bit is cleared to 0 if the IC card is of the direct convention type, and set to 1 if of the inverse convention type.
The SMIF bit is set to 1 in the case of the Smart Card interface.
Examples of register settings and the waveform of the start character are shown below for the two types of IC card (direct
convention and inverse convention).
Rev.6.00 Oct.28.2004 page 526 of 1016
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• Direct convention (SDIR = SINV = O/E = 0)
(Z)
A
Z
Z
A
Z
Z
Z
A
A
Z
Ds
D0
D1
D2
D3
D4
D5
D6
D7
Dp
(Z)
State
With the direct convention type, the logic 1 level corresponds to state Z and the logic 0 level to state A, and transfer is
performed in LSB-first order. The start character data above is H'3B.
The parity bit is 1 since even parity is stipulated for the Smart Card.
• Inverse convention (SDIR = SINV = O/E = 1)
(Z)
A
Z
Z
A
A
A
A
A
A
Z
Ds
D7
D6
D5
D4
D3
D2
D1
D0
Dp
(Z)
State
With the inverse convention type, the logic 1 level corresponds to state A and the logic 0 level to state Z, and transfer
is performed in MSB-first order. The start character data above is H'3F.
The parity bit is 0, corresponding to state Z, since even parity is stipulated for the Smart Card.
With the H8S/2357 Group, inversion specified by the SINV bit applies only to the data bits, D7 to D0. For parity bit
inversion, the O/E bit in SMR is set to odd parity mode (the same applies to both transmission and reception).
15.3.5
Clock
Only an internal clock generated by the on-chip baud rate generator can be used as the transmit/receive clock for the Smart
Card interface. The bit rate is set with BRR and the CKS1 and CKS0 bits in SMR. The formula for calculating the bit rate
is as shown below. Table 15-5 shows some sample bit rates.
If clock output is selected by setting CKE0 to 1, a clock with a frequency of 372 times the bit rate is output from the SCK
pin.
B=
ø
1488 × 2
2n–1
× (N + 1)
× 10 6
Where: N = Value set in BRR (0 ≤ N ≤ 255)
B = Bit rate (bit/s)
ø = Operating frequency (MHz)
n = See table 15-4
Table 15-4 Correspondence between n and CKS1, CKS0
n
CKS1
CKS0
0
0
0
1
2
3
1
1
0
1
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Table 15-5 Examples of Bit Rate B (bit/s) for Various BRR Settings (When n = 0)
ø (MHz)
N
10.00
10.714
13.00
14.285
16.00
18.00
20.00
0
13441
14400
17473
19200
21505
24194
26882
1
6720
7200
8737
9600
10753
12097
13441
2
4480
4800
5824
6400
7168
8065
8961
Note: Bit rates are rounded to the nearest whole number.
The method of calculating the value to be set in the bit rate register (BRR) from the operating frequency and bit rate, on
the other hand, is shown below. N is an integer, 0 ≤ N ≤ 255, and the smaller error is specified.
N=
ø
1488 × 2
2n–1
×B
× 10 6 – 1
Table 15-6 Examples of BRR Settings for Bit Rate B (bit/s) (When n = 0)
ø (MHz)
7.1424
10.00
10.7136
13.00
14.2848
16.00
18.00
20.00
bit/s
N Error
N Error
N Error
N Error
N Error
N Error
N Error
N Error
9600
0
1
1
1
1
1
0.00
30
25
8.99
0.00
12.01 2
15.99 2
Table 15-7 Maximum Bit Rate at Various Frequencies (Smart Card Interface Mode)
ø (MHz)
Maximum Bit Rate (bit/s)
N
n
7.1424
9600
0
0
10.00
13441
0
0
10.7136
14400
0
0
13.00
17473
0
0
14.2848
19200
0
0
16.00
21505
0
0
18.00
24194
0
0
20.00
26882
0
0
The bit rate error is given by the following formula:
Error (%) = (
ø
1488 × 2
2n–1
× B × (N + 1)
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× 106 – 1) × 100
6.60
15.3.6
Data Transfer Operations
Initialization: Before transmitting and receiving data, initialize the SCI as described below. Initialization is also necessary
when switching from transmit mode to receive mode, or vice versa.
[1] Clear the TE and RE bits in SCR to 0.
[2] Clear the error flags ERS, PER, and ORER in SSR to 0.
[3] Set the O/E bit and CKS1 and CKS0 bits in SMR. Clear the C/A, CHR, and MP bits to 0, and set the STOP and PE bits
to 1.
[4] Set the SMIF, SDIR, and SINV bits in SCMR.
When the SMIF bit is set to 1, the TxD and RxD pins are both switched from ports to SCI pins, and are placed in the
high-impedance state.
[5] Set the value corresponding to the bit rate in BRR.
[6] Set the CKE0 bit in SCR. Clear the TIE, RIE, TE, RE, MPIE, TEIE and CKE1 bits to 0.
If the CKE0 bit is set to 1, the clock is output from the SCK pin.
[7] Wait at least one bit interval, then set the TIE, RIE, TE, and RE bits in SCR. Do not set the TE bit and RE bit at the
same time, except for self-diagnosis.
Serial Data Transmission: As data transmission in Smart Card mode involves error signal sampling and retransmission
processing, the processing procedure is different from that for the normal SCI. Figure 15-4 shows a flowchart for
transmitting, and figure 15-5 shows the relation between a transmit operation and the internal registers.
[1] Perform Smart Card interface mode initialization as described above in Initialization.
[2] Check that the ERS error flag in SSR is cleared to 0.
[3] Repeat steps [2] and [3] until it can be confirmed that the TEND flag in SSR is set to 1.
[4] Write the transmit data to TDR, clear the TDRE flag to 0, and perform the transmit operation. The TEND flag is
cleared to 0.
[5] When transmitting data continuously, go back to step [2].
[6] To end transmission, clear the TE bit to 0.
With the above processing, interrupt servicing or data transfer by the DMAC or DTC is possible.
If transmission ends and the TEND flag is set to 1 while the TIE bit is set to 1 and interrupt requests are enabled, a
transmit data empty interrupt (TXI) request will be generated. If an error occurs in transmission and the ERS flag is set to
1 while the RIE bit is set to 1 and interrupt requests are enabled, a transfer error interrupt (ERI) request will be generated.
The timing for setting the TEND flag depends on the value of the GM bit in SMR. The TEND flag set timing is shown in
figure 15-6.
If the DMAC or DTC is activated by a TXI request, the number of bytes set in the DMAC or DTC can be transmitted
automatically, including automatic retransmission.
For details, see Interrupt Operations and Data Transfer Operation by DMAC or DTC below.
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Start
Initialization
Start transmission
ERS=0?
No
Yes
Error processing
No
TEND=1?
Yes
Write data to TDR,
and clear TDRE flag
in SSR to 0
No
All data transmitted?
Yes
No
ERS=0?
Yes
Error processing
No
TEND=1?
Yes
Clear TE bit to 0
End
Figure 15-4 Example of Transmission Processing Flow
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TDR
(1) Data write
Data 1
(2) Transfer from
TDR to TSR
Data 1
(3) Serial data output
Data 1
TSR
(shift register)
Data 1
; Data remains in TDR
Data 1
I/O signal line output
In case of normal transmission: TEND flag is set
In case of transmit error:
ERS flag is set
Steps (2) and (3) above are repeated until the TEND flag is set
Note: When the ERS flag is set, it should be cleared until transfer of the last bit (D7 in LSB-first
transmission, D0 in MSB-first transmission) of the next transfer data to be transmitted has
been completed.
Figure 15-5 Relation Between Transmit Operation and Internal Registers
I/O data
Ds
D0
TXI
(TEND interrupt)
When GM = 0
When GM = 1
D1
D2
D3
D4
D5
D6
D7
Dp
DE
Guard
time
12.5 etu
11.0 etu
Legend:
Ds:
Start bit
D0 to D7: Data bits
Dp:
Parity bit
DE:
Error signal
Note: etu: Elementary time unit (time for transfer of 1 bit)
Figure 15-6 TEND Flag Generation Timing in Transmission Operation
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Serial Data Reception: Data reception in Smart Card mode uses the same processing procedure as for the normal SCI.
Figure 15-7 shows an example of the transmission processing flow.
[1] Perform Smart Card interface mode initialization as described above in Initialization.
[2] Check that the ORER flag and PER flag in SSR are cleared to 0. If either is set, perform the appropriate receive error
processing, then clear both the ORER and the PER flag to 0.
[3] Repeat steps [2] and [3] until it can be confirmed that the RDRF flag is set to 1.
[4] Read the receive data from RDR.
[5] When receiving data continuously, clear the RDRF flag to 0 and go back to step [2].
[6] To end reception, clear the RE bit to 0.
Start
Initialization
Start reception
ORER = 0 and
PER = 0
No
Yes
Error processing
No
RDRF=1?
Yes
Read RDR and clear
RDRF flag in SSR to 0
No
All data received?
Yes
Clear RE bit to 0
Figure 15-7 Example of Reception Processing Flow
With the above processing, interrupt servicing or data transfer by the DMAC or DTC is possible.
If reception ends and the RDRF flag is set to 1 while the RIE bit is set to 1 and interrupt requests are enabled, a receive
data full interrupt (RXI) request will be generated. If an error occurs in reception and either the ORER flag or the PER flag
is set to 1, a transfer error interrupt (ERI) request will be generated.
If the DMAC or DTC is activated by an RXI request, the receive data in which the error occurred is skipped, and only the
number of bytes of receive data set in the DMAC or DTC are transferred.
For details, see Interrupt Operation and Data Transfer Operation by DMAC or DTC below.
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If a parity error occurs during reception and the PER is set to 1, the received data is still transferred to RDR, and therefore
this data can be read.
Mode Switching Operation: When switching from receive mode to transmit mode, first confirm that the receive
operation has been completed, then start from initialization, clearing RE bit to 0 and setting TE bit to 1. The RDRF flag or
the PER and ORER flags can be used to check that the receive operation has been completed.
When switching from transmit mode to receive mode, first confirm that the transmit operation has been completed, then
start from initialization, clearing TE bit to 0 and setting RE bit to 1. The TEND flag can be used to check that the transmit
operation has been completed.
Fixing Clock Output Level: When the GSM bit in SMR is set to 1, the clock output level can be fixed with bits CKE1
and CKE0 in SCR. At this time, the minimum clock pulse width can be made the specified width.
Figure 15-8 shows the timing for fixing the clock output level. In this example, GSM is set to 1, CKE1 is cleared to 0, and
the CKE0 bit is controlled.
Specified pulse width
Specified pulse width
SCK
SCR write
(CKE0 = 0)
SCR write
(CKE0 = 1)
Figure 15-8 Timing for Fixing Clock Output Level
Interrupt Operation: There are three interrupt sources in Smart Card interface mode: transmit data empty interrupt (TXI)
requests, transfer error interrupt (ERI) requests, and receive data full interrupt (RXI) requests. The transmit end interrupt
(TEI) request is not used in this mode.
When the TEND flag in SSR is set to 1, a TXI interrupt request is generated.
When the RDRF flag in SSR is set to 1, an RXI interrupt request is generated.
When any of flags ORER, PER, and ERS in SSR is set to 1, an ERI interrupt request is generated. The relationship
between the operating states and interrupt sources is shown in table 15-8.
Table 15-8 Smart Card Mode Operating States and Interrupt Sources
Operating State
Flag
Enable Bit
Interrupt DMAC
Source
Activation
DTC
Activation
Transmit
Mode
Normal
operation
TEND
TIE
TXI
Possible
Possible
Error
ERS
RIE
ERI
Not possible Not possible
Normal
operation
RDRF
RIE
RXI
Possible
Error
PER, ORER
RIE
ERI
Not possible Not possible
Receive
Mode
Possible
Data Transfer Operation by DMAC or DTC: In Smart Card mode, as with the normal SCI, transfer can be carried out
using the DMAC or DTC. In a transmit operation, the TDRE flag is also set to 1 at the same time as the TEND flag in
SSR, and a TXI interrupt is generated. If the TXI request is designated beforehand as a DMAC or DTC activation source,
the DMAC or DTC will be activated by the TXI request, and transfer of the transmit data will be carried out. The TDRE
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and TEND flags are automatically cleared to 0 when data transfer is performed by the DMAC or DTC. In the event of an
error, the SCI retransmits the same data automatically. The TEND flag remains cleared to 0 during this time, and the
DMAC is not activated. Thus, the number of bytes specified by the SCI and DMAC are transmitted automatically even in
retransmission following an error. However, the ERS flag is not cleared automatically when an error occurs, and so the
RIE bit should be set to 1 beforehand so that an ERI request will be generated in the event of an error, and the ERS flag
will be cleared.
When performing transfer using the DMAC or DTC, it is essential to set and enable the DMAC or DTC before carrying
out SCI setting. For details of the DMAC and DTC setting procedures, see section 7, DMA Controller, and section 8, Data
Transfer Controller.
In a receive operation, an RXI interrupt request is generated when the RDRF flag in SSR is set to 1. If the RXI request is
designated beforehand as a DMAC or DTC activation source, the DMAC or DTC will be activated by the RXI request,
and transfer of the receive data will be carried out. The RDRF flag is cleared to 0 automatically when data transfer is
performed by the DMAC or DTC. If an error occurs, an error flag is set but the RDRF flag is not. Consequently, the
DMAC or DTC is not activated, but instead, an ERI interrupt request is sent to the CPU. Therefore, the error flag should
be cleared.
15.3.7
Operation in GSM Mode
Switching the Mode: When switching between Smart Card interface mode and software standby mode, the following
switching procedure should be followed in order to maintain the clock duty.
•
When changing from Smart Card interface mode to software standby mode
[1] Set the data register (DR) and data direction register (DDR) corresponding to the SCK pin to the value for the fixed
output state in software standby mode.
[2] Write 0 to the TE bit and RE bit in the serial control register (SCR) to halt transmit/receive operation. At the same
time, set the CKE1 bit to the value for the fixed output state in software standby mode.
[3] Write 0 to the CKE0 bit in SCR to halt the clock.
[4] Wait for one serial clock period.
During this interval, clock output is fixed at the specified level, with the duty preserved.
[5] Write H'00 to SMR and SCMR.
[6] Make the transition to the software standby state.
•
When returning to Smart Card interface mode from software standby mode
[7] Exit the software standby state.
[8] Set the CKE1 bit in SCR to the value for the fixed output state (current SCK pin state) when software standby mode is
initiated.
[9] Set Smart Card interface mode and output the clock. Signal generation is started with the normal duty.
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Software
standby
Normal operation
[1] [2] [3]
[4] [5] [6]
Normal operation
[7] [8] [9]
Figure 15-9 Clock Halt and Restart Procedure
Powering On: To secure the clock duty from power-on, the following switching procedure should be followed.
[1] The initial state is port input and high impedance. Use a pull-up resistor or pull-down resistor to fix the potential.
[2] Fix the SCK pin to the specified output level with the CKE1 bit in SCR.
[3] Set SMR and SCMR, and switch to Smart Card mode operation.
[4] Set the CKE0 bit in SCR to 1 to start clock output.
15.4
Usage Notes
The following points should be noted when using the SCI as a Smart Card interface.
Receive Data Sampling Timing and Reception Margin in Smart Card Interface Mode: In Smart Card Interface mode,
the SCI operates on a basic clock with a frequency of 372 times the transfer rate.
In reception, the SCI samples the falling edge of the start bit using the basic clock, and performs internal synchronization.
Receive data is latched internally at the rising edge of the 186th pulse of the basic clock. This is illustrated in figure 15-10.
372 clocks
186 clocks
0
185
371 0
185
371 0
Internal
basic
clock
Receive
data (RxD)
Start bit
D0
D1
Synchronization
sampling
timing
Data
sampling
timing
Figure 15-10 Receive Data Sampling Timing in Smart Card Mode
Thus the reception margin in asynchronous mode is given by the following formula.
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M = (0.5 –
1
) – (L – 0.5) F –
 D – 0.5
2N
(1 + F) × 100%
N
Where M: Reception margin (%)
N: Ratio of bit rate to clock (N = 372)
D: Clock duty (D = 0 to 1.0)
L: Frame length (L = 10)
F: Absolute value of clock frequency deviation
Assuming values of F = 0 and D = 0.5 in the above formula, the reception margin formula is as follows.
When D = 0.5 and F = 0,
M = (0.5 – 1/2 × 372) × 100%
= 49.866%
Retransfer Operations: Retransfer operations are performed by the SCI in receive mode and transmit mode as described
below.
• Retransfer operation when SCI is in receive mode
Figure 15-11 illustrates the retransfer operation when the SCI is in receive mode.
[1] If an error is found when the received parity bit is checked, the PER bit in SSR is automatically set to 1. If the RIE bit
in SCR is enabled at this time, an ERI interrupt request is generated. The PER bit in SSR should be kept cleared to 0
until the next parity bit is sampled.
[2] The RDRF bit in SSR is not set for a frame in which an error has occurred.
[3] If no error is found when the received parity bit is checked, the PER bit in SSR is not set to 1.
[4] If no error is found when the received parity bit is checked, the receive operation is judged to have been completed
normally, and the RDRF flag in SSR is automatically set to 1. If the RIE bit in SCR is enabled at this time, an RXI
interrupt request is generated.
If DMAC or DTC data transfer by an RXI source is enabled, the contents of RDR can be read automatically. When the
RDR data is read by the DMAC or DTC, the RDRF flag is automatically cleared to 0.
[5] When a normal frame is received, the pin retains the high-impedance state at the timing for error signal transmission.
nth transfer frame
Transfer
frame n+1
Retransferred frame
Ds D0 D1 D2 D3 D4 D5 D6 D7 Dp DE
(DE)
Ds D0 D1 D2 D3 D4 D5 D6 D7 Dp
Ds D0 D1 D2 D3 D4
RDRF
[2]
[4]
[1]
[3]
PER
Figure 15-11 Retransfer Operation in SCI Receive Mode
• Retransfer operation when SCI is in transmit mode
Figure 15-12 illustrates the retransfer operation when the SCI is in transmit mode.
[6] If an error signal is sent back from the receiving end after transmission of one frame is completed, the ERS bit in SSR
is set to 1. If the RIE bit in SCR is enabled at this time, an ERI interrupt request is generated. The ERS bit in SSR
should be kept cleared to 0 until the next parity bit is sampled.
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[7] The TEND bit in SSR is not set for a frame for which an error signal indicating an abnormality is received.
[8] If an error signal is not sent back from the receiving end, the ERS bit in SSR is not set.
[9] If an error signal is not sent back from the receiving end, transmission of one frame, including a retransfer, is judged to
have been completed, and the TEND bit in SSR is set to 1. If the TIE bit in SCR is enabled at this time, a TXI interrupt
request is generated.
If data transfer by the DMAC or DTC by means of the TXI source is enabled, the next data can be written to TDR
automatically. When data is written to TDR by the DMAC or DTC, the TDRE bit is automatically cleared to 0.
nth transfer frame
Transfer
frame n+1
Retransferred frame
Ds D0 D1 D2 D3 D4 D5 D6 D7 Dp DE
Ds D0 D1 D2 D3 D4 D5 D6 D7 Dp
(DE)
Ds D0 D1 D2 D3 D4
TDRE
Transfer to TSR
from TDR
Transfer to TSR from TDR
Transfer to TSR from TDR
TEND
[7]
[9]
FER/ERS
[6]
[8]
Figure 15-12 Retransfer Operation in SCI Transmit Mode
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Section 16 A/D Converter
16.1
Overview
The H8S/2357 Group incorporates a successive approximation type 10-bit A/D converter that allows up to eight analog
input channels to be selected.
16.1.1
Features
A/D converter features are listed below
• 10-bit resolution
• Eight input channels
• Settable analog conversion voltage range
 Conversion of analog voltages with the reference voltage pin (Vref ) as the analog reference voltage
• High-speed conversion
 Minimum conversion time: 6.7 µs per channel (at 20 MHz operation)
• Choice of single mode or scan mode
 Single mode: Single-channel A/D conversion
 Scan mode:
Continuous A/D conversion on 1 to 4 channels
• Four data registers
 Conversion results are held in a 16-bit data register for each channel
• Sample and hold function
• Three kinds of conversion start
 Choice of software or timer conversion start trigger (TPU or 8-bit timer), or ADTRG pin
• A/D conversion end interrupt generation
 A/D conversion end interrupt (ADI) request can be generated at the end of A/D conversion
• Module stop mode can be set
 As the initial setting, A/D converter operation is halted. Register access is enabled by exiting module stop mode.
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16.1.2
Block Diagram
Figure 16-1 shows a block diagram of the A/D converter.
Module data bus
Vref
10-bit D/A
AVSS
A
D
D
R
A
A
D
D
R
B
A
D
D
R
C
A
D
D
R
D
A
D
C
S
R
A
D
C
R
+
–
Multiplexer
AN0
AN1
AN2
AN3
AN4
AN5
AN6
AN7
Bus interface
Successive approximations
register
AVCC
Internal data bus
Comparator
Control circuit
Sample-andhold circuit
ADI
interrupt
ADTRG
8-bit timer or
conversion start
trigger from TPU
Legend:
ADCR: A/D control register
ADCSR : A/D control/status register
ADDRA : A/D data register A
ADDRB : A/D data register B
ADDRC : A/D data register C
ADDRD : A/D data register D
Figure 16-1 Block Diagram of A/D Converter
16.1.3
Pin Configuration
Table 16-1 summarizes the input pins used by the A/D converter.
The AVCC and AVSS pins are the power supply pins for the analog block in the A/D converter. The Vref pin is the A/D
conversion reference voltage pin.
The eight analog input pins are divided into two groups: group 0 (AN0 to AN3), and group 1 (AN4 to AN7).
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Table 16-1 A/D Converter Pins
Pin Name
Symbol
I/O
Function
Analog power supply pin
AVCC
Input
Analog block power supply
Analog ground pin
AVSS
Input
Analog block ground and A/D conversion
reference voltage
Reference voltage pin
Vref
Input
A/D conversion reference voltage
Analog input pin 0
AN0
Input
Group 0 analog inputs
Analog input pin 1
AN1
Input
Analog input pin 2
AN2
Input
Analog input pin 3
AN3
Input
Analog input pin 4
AN4
Input
Analog input pin 5
AN5
Input
Analog input pin 6
AN6
Input
Analog input pin 7
AN7
Input
A/D external trigger input pin ADTRG
16.1.4
Input
Group 1 analog inputs
External trigger input for starting A/D
conversion
Register Configuration
Table 16-2 summarizes the registers of the A/D converter.
Table 16-2 A/D Converter Registers
Name
Abbreviation
R/W
Initial Value
Address* 1
A/D data register AH
ADDRAH
R
H'00
H'FF90
A/D data register AL
ADDRAL
R
H'00
H'FF91
A/D data register BH
ADDRBH
R
H'00
H'FF92
A/D data register BL
ADDRBL
R
H'00
H'FF93
A/D data register CH
ADDRCH
R
H'00
H'FF94
A/D data register CL
ADDRCL
R
H'00
H'FF95
A/D data register DH
ADDRDH
R
H'00
H'FF96
A/D data register DL
ADDRDL
R
H'00
H'FF97
H'00
H'FF98
2
A/D control/status register
ADCSR
R/(W)*
A/D control register
ADCR
R/W
H'3F
H'FF99
Module stop control register
MSTPCR
R/W
H'3FFF
H'FF3C
Notes: 1. Lower 16 bits of the address.
2. Bit 7 can only be written with 0 for flag clearing.
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16.2
Register Descriptions
16.2.1
A/D Data Registers A to D (ADDRA to ADDRD)
Bit
:
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
AD9 AD8 AD7 AD6 AD5 AD4 AD3 AD2 AD1 AD0 —
—
—
—
—
—
Initial value :
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
R/W
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
:
There are four 16-bit read-only ADDR registers, ADDRA to ADDRD, used to store the results of A/D conversion.
The 10-bit data resulting from A/D conversion is transferred to the ADDR register for the selected channel and stored
there. The upper 8 bits of the converted data are transferred to the upper byte (bits 15 to 8) of ADDR, and the lower 2 bits
are transferred to the lower byte (bits 7 and 6) and stored. Bits 5 to 0 are always read as 0.
The correspondence between the analog input channels and ADDR registers is shown in table 16-3.
ADDR can always be read by the CPU. The upper byte can be read directly, but for the lower byte, data transfer is
performed via a temporary register (TEMP). For details, see section 16.3, Interface to Bus Master.
The ADDR registers are initialized to H'0000 by a reset, and in standby mode or module stop mode.
Table 16-3 Analog Input Channels and Corresponding ADDR Registers
Analog Input Channel
16.2.2
Bit
Group 0
Group 1
A/D Data Register
AN0
AN4
ADDRA
AN1
AN5
ADDRB
AN2
AN6
ADDRC
AN3
AN7
ADDRD
A/D Control/Status Register (ADCSR)
:
Initial value :
R/W
:
7
6
5
4
3
2
1
0
ADF
ADIE
ADST
SCAN
CKS
CH2
CH1
CH0
0
0
0
0
0
0
0
0
R/(W)*
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Note: * Only 0 can be written to bit 7, to clear this flag.
ADCSR is an 8-bit readable/writable register that controls A/D conversion operations and shows the status of the
operation.
ADCSR is initialized to H'00 by a reset, and in hardware standby mode or module stop mode.
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Bit 7—A/D End Flag (ADF): Status flag that indicates the end of A/D conversion.
Bit 7
ADF
Description
0
[Clearing conditions]
1
(Initial value)
•
When 0 is written to the ADF flag after reading ADF = 1
•
When the DTC is activated by an ADI interrupt and ADDR is read
[Setting conditions]
•
Single mode: When A/D conversion ends
•
Scan mode: When A/D conversion ends on all specified channels
Bit 6—A/D Interrupt Enable (ADIE): Selects enabling or disabling of interrupt (ADI) requests at the end of A/D
conversion.
Bit 6
ADIE
Description
0
A/D conversion end interrupt (ADI) request disabled
1
A/D conversion end interrupt (ADI) request enabled
(Initial value)
Bit 5—A/D Start (ADST): Selects starting or stopping on A/D conversion. Holds a value of 1 during A/D conversion.
The ADST bit can be set to 1 by software, a timer conversion start trigger, or the A/D external trigger input pin (ADTRG).
Bit 5
ADST
Description
0
•
A/D conversion stopped
1
•
Single mode: A/D conversion is started. Cleared to 0 automatically when
conversion on the specified channel ends.
•
Scan mode: A/D conversion is started. Conversion continues sequentially on the
selected channels until ADST is cleared to 0 by software, a reset, or
a transition to standby mode or module stop mode.
(Initial value)
Bit 4—Scan Mode (SCAN): Selects single mode or scan mode as the A/D conversion operating mode. See section 16.4,
Operation, for single mode and scan mode operation. Only set the SCAN bit while conversion is stopped (ADST = 0).
Bit 4
SCAN
Description
0
Single mode
1
Scan mode
(Initial value)
Bit 3—Clock Select (CKS): Sets the A/D conversion time. Only change the conversion time while conversion is stopped
(ADST = 0).
Bit 3
CKS
Description
0
Conversion time = 266 states (max.)
1
Conversion time = 134 states (max.)
(Initial value)
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Bits 2 to 0—Channel Select 2 to 0 (CH2 to CH0): Together with the SCAN bit, these bits select the analog input
channels.
Only set the input channel while conversion is stopped (ADST = 0).
Group
Selection
Channel Selection
CH2
CH1
CH0
Single Mode (SCAN=0)
Scan Mode (SCAN=1)
0
0
0
AN0 (Initial value)
AN0
1
AN1
AN0, AN1
0
AN2
AN0 to AN2
1
AN3
AN0 to AN3
0
AN4
AN4
1
AN5
AN4, AN5
0
AN6
AN4 to AN6
1
AN7
AN4 to AN7
1
1
0
1
16.2.3
Description
A/D Control Register (ADCR)
Bit
:
7
6
5
4
3
2
1
0
TRGS1
TRGS0
—
—
—
—
—
—
0
0
1
1
1
1
1
1
R/W
R/W
—
—
—
—
Initial value :
R/W
:
—/(R/W)* —/(R/W)*
Note: * Applies to the H8S/2398, H8S/2394, H8S/2392, and H8S/2390.
ADCR is an 8-bit readable/writable register that enables or disables external triggering of A/D conversion operations.
ADCR is initialized to H'3F by a reset, and in standby mode or module stop mode.
Bits 7 and 6—Timer Trigger Select 1 and 0 (TRGS1, TRGS0): Select enabling or disabling of the start of A/D
conversion by a trigger signal. Only set bits TRGS1 and TRGS0 while conversion is stopped (ADST = 0).
Bit 7
TRGS1
Bit 6
TRGS0
Description
0
0
A/D conversion start by external trigger is disabled
1
A/D conversion start by external trigger (TPU) is enabled
0
A/D conversion start by external trigger (8-bit timer) is enabled
1
A/D conversion start by external trigger pin (ADTRG) is enabled
1
(1) For H8S/2357 and H8S/2352
Bits 5 to 0—Reserved: They are always read as 1 and cannot be modified.
(2) For H8S/2398, H8S/2394, H8S/2392, and H8S/2390
Bits 5, 4, 1, and 0—Reserved: They are always read as 1 and cannot be modified.
Bits 3 and 2—Reserved: Should always be written with 1.
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(Initial value)
16.2.4
Module Stop Control Register (MSTPCR)
MSTPCRH
Bit
MSTPCRL
:
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Initial value :
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
R/W
: R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
MSTPCR is a 16-bit readable/writable register that performs module stop mode control.
When the MSTP9 bit in MSTPCR is set to 1, A/D converter operation stops at the end of the bus cycle and a transition is
made to module stop mode. Registers cannot be read or written to in module stop mode. For details, see section 21.5,
Module Stop Mode.
MSTPCR is initialized to H'3FFF by a reset and in hardware standby mode. It is not initialized in software standby mode.
Bit 9—Module Stop (MSTP9): Specifies the A/D converter module stop mode.
Bit 9
MSTP9
Description
0
A/D converter module stop mode cleared
1
A/D converter module stop mode set
(Initial value)
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16.3
Interface to Bus Master
ADDRA to ADDRD are 16-bit registers, and the data bus to the bus master is 8 bits wide. Therefore, in accesses by the
bus master, the upper byte is accessed directly, but the lower byte is accessed via a temporary register (TEMP).
A data read from ADDR is performed as follows. When the upper byte is read, the upper byte value is transferred to the
CPU and the lower byte value is transferred to TEMP. Next, when the lower byte is read, the TEMP contents are
transferred to the CPU.
When reading ADDR. always read the upper byte before the lower byte. It is possible to read only the upper byte, but if
only the lower byte is read, incorrect data may be obtained.
Figure 16-2 shows the data flow for ADDR access.
Upper byte read
Bus master
(H'AA)
Module data bus
Bus interface
TEMP
(H'40)
ADDRnH
(H'AA)
ADDRnL
(H'40)
(n = A to D)
Lower byte read
Bus master
(H'40)
Module data bus
Bus interface
TEMP
(H'40)
ADDRnH
(H'AA)
ADDRnL
(H'40)
(n = A to D)
Figure 16-2 ADDR Access Operation (Reading H'AA40)
16.4
Operation
The A/D converter operates by successive approximation with 10-bit resolution. It has two operating modes: single mode
and scan mode.
16.4.1
Single Mode (SCAN = 0)
Single mode is selected when A/D conversion is to be performed on a single channel only. A/D conversion is started when
the ADST bit is set to 1, according to the software or external trigger input. The ADST bit remains set to 1 during A/D
conversion, and is automatically cleared to 0 when conversion ends.
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On completion of conversion, the ADF flag is set to 1. If the ADIE bit is set to 1 at this time, an ADI interrupt request is
generated. The ADF flag is cleared by writing 0 after reading ADCSR.
When the operating mode or analog input channel must be changed during analog conversion, to prevent incorrect
operation, first clear the ADST bit to 0 in ADCSR to halt A/D conversion. After making the necessary changes, set the
ADST bit to 1 to start A/D conversion again. The ADST bit can be set at the same time as the operating mode or input
channel is changed.
Typical operations when channel 1 (AN1) is selected in single mode are described next. Figure 16-3 shows a timing
diagram for this example.
[1] Single mode is selected (SCAN = 0), input channel AN1 is selected (CH2 = 0, CH1 = 0, CH0 = 1), the A/D interrupt is
enabled (ADIE = 1), and A/D conversion is started (ADST = 1).
[2] When A/D conversion is completed, the result is transferred to ADDRB. At the same time the ADF flag is set to 1, the
ADST bit is cleared to 0, and the A/D converter becomes idle.
[3] Since ADF = 1 and ADIE = 1, an ADI interrupt is requested.
[4] The A/D interrupt handling routine starts.
[5] The routine reads ADCSR, then writes 0 to the ADF flag.
[6] The routine reads and processes the connection result (ADDRB).
[7] Execution of the A/D interrupt handling routine ends. After that, if the ADST bit is set to 1, A/D conversion starts
again and steps [2] to [7] are repeated.
Set*
ADIE
ADST
A/D
conversion
starts
Set*
Set*
Clear*
Clear*
ADF
State of channel 0 (AN0)
Idle
State of channel 1 (AN1)
Idle
State of channel 2 (AN2)
Idle
State of channel 3 (AN3)
Idle
A/D conversion 1
Idle
A/D conversion 2
Idle
ADDRA
ADDRB
Read conversion result
A/D conversion result 1
Read conversion result
A/D conversion result 2
ADDRC
ADDRD
Note: * Vertical arrows ( ) indicate instructions executed by software.
Figure 16-3 Example of A/D Converter Operation (Single Mode, Channel 1 Selected)
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16.4.2
Scan Mode (SCAN = 1)
Scan mode is useful for monitoring analog inputs in a group of one or more channels. When the ADST bit is set to 1 by a
software, timer or external trigger input, A/D conversion starts on the first channel in the group (AN0). When two or
more channels are selected, after conversion of the first channel ends, conversion of the second channel (AN1) starts
immediately. A/D conversion continues cyclically on the selected channels until the ADST bit is cleared to 0. The
conversion results are transferred for storage into the ADDR registers corresponding to the channels.
When the operating mode or analog input channel must be changed during analog conversion, to prevent incorrect
operation, first clear the ADST bit to 0 in ADCSR to halt A/D conversion. After making the necessary changes, set the
ADST bit to 1 to start A/D conversion again. The ADST bit can be set at the same time as the operating mode or input
channel is changed.
Typical operations when three channels (AN0 to AN2) are selected in scan mode are described next. Figure 16-4 shows a
timing diagram for this example.
[1] Scan mode is selected (SCAN = 1), scan group 0 is selected (CH2 = 0), analog input channels AN0 to AN2 are
selected (CH1 = 1, CH0 = 0), and A/D conversion is started (ADST = 1)
[2] When A/D conversion of the first channel (AN0) is completed, the result is transferred to ADDRA. Next, conversion
of the second channel (AN1) starts automatically.
[3] Conversion proceeds in the same way through the third channel (AN2).
[4] When conversion of all the selected channels (AN0 to AN2) is completed, the ADF flag is set to 1 and conversion of
the first channel (AN0) starts again. If the ADIE bit is set to 1 at this time, an ADI interrupt is requested after A/D
conversion ends.
[5] Steps [2] to [4] are repeated as long as the ADST bit remains set to 1. When the ADST bit is cleared to 0, A/D
conversion stops. After that, if the ADST bit is set to 1, A/D conversion starts again from the first channel (AN0).
Continuous A/D conversion execution
Clear*1
Set*1
ADST
Clear*1
ADF
A/D conversion time
State of channel 0 (AN0)
State of channel 1 (AN1)
Idle
Idle
A/D conversion 1
Idle
State of channel 2 (AN2)
Idle
A/D conversion 2
Idle
Idle
A/D conversion 4
A/D conversion 5 *2
Idle
A/D conversion 3
State of channel 3 (AN3)
Idle
Idle
Transfer
ADDRA
A/D conversion result 1
ADDRB
A/D conversion result 4
A/D conversion result 2
ADDRC
A/D conversion result 3
ADDRD
Notes: 1. Vertical arrows ( ) indicate instructions executed by software.
2. Data currently being converted is ignored.
Figure 16-4 Example of A/D Converter Operation
(Scan Mode, Channels AN0 to AN2 Selected)
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16.4.3
Input Sampling and A/D Conversion Time
The A/D converter has a on-chip sample-and-hold circuit. The A/D converter samples the analog input at a time tD after
the ADST bit is set to 1, then starts conversion. Figure 16-5 shows the A/D conversion timing. Table 16-4 indicates the
A/D conversion time.
As indicated in figure 16-5, the A/D conversion time includes tD and the input sampling time. The length of tD varies
depending on the timing of the write access to ADCSR. The total conversion time therefore varies within the ranges
indicated in table 16-4.
In scan mode, the values given in table 16-4 apply to the first conversion time. In the second and subsequent conversions
the conversion time is fixed at 256 states when CKS = 0 or 128 states when CKS = 1.
(1)
ø
Address bus
(2)
Write signal
Input sampling
timing
ADF
tD
t SPL
t CONV
Legend:
(1):
(2):
tD:
tSPL:
tCONV:
ADCSR write cycle
ADCSR address
A/D conversion start delay
Input sampling time
A/D conversion time
Figure 16-5 A/D Conversion Timing
Table 16-4 A/D Conversion Time (Single Mode)
CKS = 0
CKS = 1
Item
Symbol
Min
Typ
Max
Min
Typ
Max
A/D conversion start delay
tD
10
—
17
6
—
9
Input sampling time
t SPL
—
63
—
—
31
—
A/D conversion time
t CONV
259
—
266
131
—
134
Note: Values in the table are the number of states.
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16.4.4
External Trigger Input Timing
A/D conversion can be externally triggered. When the TRGS1 and TRGS0 bits are set to 11 in ADCR, external trigger
input is enabled at the ADTRG pin. A falling edge at the ADTRG pin sets the ADST bit to 1 in ADCSR, starting A/D
conversion. Other operations, in both single and scan modes, are the same as if the ADST bit has been set to 1 by
software. Figure 16-6 shows the timing.
ø
ADTRG
Internal trigger signal
ADST
A/D conversion
Figure 16-6 External Trigger Input Timing
16.5
Interrupts
The A/D converter generates an A/D conversion end interrupt (ADI) at the end of A/D conversion. ADI interrupt requests
can be enabled or disabled by means of the ADIE bit in ADCSR.
The DTC or DMAC can be activated by an ADI interrupt. Having the converted data read by the DTC or DMAC in
response to an ADI interrupt enables continuous conversion to be achieved without imposing a load on software.
The A/D converter interrupt source is shown in table 16-5.
Table 16-5 A/D Converter Interrupt Source
Interrupt Source
Description
DTC or DMAC Activation
ADI
Interrupt due to end of conversion
Possible
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16.6
Usage Notes
The following points should be noted when using the A/D converter.
Setting Range of Analog Power Supply and Other Pins:
(1) Analog input voltage range
The voltage applied to analog input pins AN0 to AN7 during A/D conversion should be in the range AVSS ≤ ANn ≤
Vref.
(2) Relation between AV CC, AVSS and V CC, VSS
As the relationship between AVCC, AVSS and V CC, VSS, set AVSS = VSS . If the A/D converter is not used, the AVCC and
AVSS pins must on no account be left open.
(3) Vref input range
The analog reference voltage input at the V ref pin set in the range Vref ≤ AVCC.
Note:If conditions (1), (2), and (3) above are not met, the reliability of the device may be adversely affected.
Notes on Board Design: In board design, digital circuitry and analog circuitry should be as mutually isolated as possible,
and layout in which digital circuit signal lines and analog circuit signal lines cross or are in close proximity should be
avoided as far as possible. Failure to do so may result in incorrect operation of the analog circuitry due to inductance,
adversely affecting A/D conversion values.
Also, digital circuitry must be isolated from the analog input signals (AN0 to AN7), analog reference power supply (Vref),
and analog power supply (AV CC) by the analog ground (AVSS ). Also, the analog ground (AVSS) should be connected at
one point to a stable digital ground (VSS) on the board.
Notes on Noise Countermeasures: A protection circuit connected to prevent damage due to an abnormal voltage such as
an excessive surge at the analog input pins (AN0 to AN7) and analog reference power supply (Vref) should be connected
between AVCC and AVSS as shown in figure 16-7.
Also, the bypass capacitors connected to AVCC and Vref and the filter capacitor connected to AN0 to AN7 must be
connected to AVSS .
If a filter capacitor is connected as shown in figure 16-7, the input currents at the analog input pins (AN0 to AN7) are
averaged, and so an error may arise. Also, when A/D conversion is performed frequently, as in scan mode, if the current
charged and discharged by the capacitance of the sample-and-hold circuit in the A/D converter exceeds the current input
via the input impedance (Rin), an error will arise in the analog input pin voltage. Careful consideration is therefore
required when deciding the circuit constants.
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AVCC
Vref
100 Ω
Rin* 2
*1
AN0 to AN7
*1
0.1 µF
Notes:
AVSS
Values are reference values.
1.
10 µF
0.01 µF
2. Rin: Input impedance
Figure 16-7 Example of Analog Input Protection Circuit
A/D Conversion Precision Definitions: H8S/2357 Group A/D conversion precision definitions are given below.
• Resolution
The number of A/D converter digital output codes
• Offset error
The deviation of the analog input voltage value from the ideal A/D conversion characteristic when the digital output
changes from the minimum voltage value B'0000000000 (H'000) to B'0000000001 (H'001) (see figure 16-9).
• Full-scale error
The deviation of the analog input voltage value from the ideal A/D conversion characteristic when the digital output
changes from B'1111111110 (H'3FE) to B'1111111111 (H'3FF) (see figure 16-9).
• Quantization error
The deviation inherent in the A/D converter, given by 1/2 LSB (see figure 16-8).
• Nonlinearity error
The error with respect to the ideal A/D conversion characteristic between the zero voltage and the full-scale voltage.
Does not include the offset error, full-scale error, or quantization error.
• Absolute precision
The deviation between the digital value and the analog input value. Includes the offset error, full-scale error,
quantization error, and nonlinearity error.
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Digital output
Ideal A/D conversion
characteristic
111
110
101
100
011
Quantization error
010
001
000
1
2
1024 1024
1022 1023
1024 1024
FS
Analog
input voltage
Figure 16-8 A/D Conversion Precision Definitions (1)
Full-scale error
Digital output
Ideal A/D conversion
characteristic
Nonlinearity
error
Actual A/D conversion
characteristic
FS
Offset error
Analog
input voltage
Figure 16-9 A/D Conversion Precision Definitions (2)
Permissible Signal Source Impedance: H8S/2357 Group analog input is designed so that conversion precision is
guaranteed for an input signal for which the signal source impedance is 10 kohm or less. This specification is provided to
enable the A/D converter's sample-and-hold circuit input capacitance to be charged within the sampling time; if the sensor
output impedance exceeds 10 kohm, charging may be insufficient and it may not be possible to guarantee the A/D
conversion precision.
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However, if a large capacitance is provided externally, the input load will essentially comprise only the internal input
resistance of 10 kohm, and the signal source impedance is ignored.
However, since a low-pass filter effect is obtained in this case, it may not be possible to follow an analog signal with a
large differential coefficient (e.g., 5 mV/µs or greater).
When converting a high-speed analog signal, a low-impedance buffer should be inserted.
Influences on Absolute Precision: Adding capacitance results in coupling with GND, and therefore noise in GND may
adversely affect absolute precision. Be sure to make the connection to an electrically stable GND such as AV SS .
Care is also required to insure that filter circuits do not communicate with digital signals on the mounting board, so acting
as antennas.
H8/2357
Group
Sensor output
impedance
to 10 k Ω
A/D converter
equivalent circuit
10 kΩ
Sensor input
Low-pass
filter C
to 0.1 µF
Cin =
15 pF
Note: Values are reference values.
Figure 16-10 Example of Analog Input Circuit
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20 pF
Section 17 D/A Converter
17.1
Overview
The H8S/2357 Group includes a two-channel D/A converter.
17.1.1
Features
D/A converter features are listed below
•
•
•
•
•
•
8-bit resolution
Two output channels
Maximum conversion time of 10 µs (with 20 pF load)
Output voltage of 0 V to Vref
D/A output hold function in software standby mode
Module stop mode can be set
 As the initial setting, D/A converter operation is halted. Register access is enabled by exiting module stop mode.
17.1.2
Block Diagram
Bus interface
Figure 17-1 shows a block diagram of the D/A converter.
Module data bus
Internal data bus
Vref
DACR
D/A
DADR1
8-bit
DA1
DADR0
AVCC
DA0
AVSS
Control circuit
Legend:
DACR:
D/A control register
DADR0,1: D/A data register 0, 1
Figure 17-1 Block Diagram of D/A Converter
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17.1.3
Pin Configuration
Table 17-1 summarizes the input and output pins of the D/A converter.
Table 17-1 Pin Configuration
17.1.4
Pin Name
Symbol
I/O
Function
Analog power pin
AVCC
Input
Analog power source
Analog ground pin
AVSS
Input
Analog ground and reference voltage
Analog output pin 0
DA0
Output
Channel 0 analog output
Analog output pin 1
DA1
Output
Channel 1 analog output
Reference voltage pin
Vref
Input
Analog reference voltage
Register Configuration
Table 17-2 summarizes the registers of the D/A converter.
Table 17-2 D/A Converter Registers
Name
Abbreviation
R/W
Initial Value
Address*
D/A data register 0
DADR0
R/W
H'00
H'FFA4
D/A data register 1
DADR1
R/W
H'00
H'FFA5
D/A control register
DACR
R/W
H'1F
H'FFA6
Module stop control register
MSTPCR
R/W
H'3FFF
H'FF3C
Note:* Lower 16 bits of the address.
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17.2
Register Descriptions
17.2.1
D/A Data Registers 0 and 1 (DADR0, DADR1)
Bit
:
7
Initial value :
R/W
:
6
5
4
3
2
1
0
0
0
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
DADR0 and DADR1 are 8-bit readable/writable registers that store data for conversion.
Whenever output is enabled, the values in DADR0 and DADR1 are converted and output from the analog output pins.
DADR0 and DADR1 are each initialized to H'00 by a reset and in hardware standby mode.
17.2.2
D/A Control Register (DACR)
Bit
:
7
6
5
4
3
2
1
0
DAOE1
DAOE0
DAE
—
—
—
—
—
0
0
0
1
1
1
1
1
R/W
R/W
R/W
—
—
—
—
—
Initial value :
R/W
:
DACR is an 8-bit readable/writable register that controls the operation of the D/A converter.
DACR is initialized to H'1F by a reset and in hardware standby mode.
Bit 7—D/A Output Enable 1 (DAOE1): Controls D/A conversion and analog output for channel 1.
Bit 7
DAOE1
Description
0
Analog output DA1 is disabled
1
Channel 1 D/A conversion is enabled; analog output DA1 is enabled
(Initial value)
Bit 6—D/A Output Enable 0 (DAOE0): Controls D/A conversion and analog output for channel 0.
Bit 6
DAOE0
Description
0
Analog output DA0 is disabled
1
Channel 0 D/A conversion is enabled; analog output DA0 is enabled
(Initial value)
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Bit 5—D/A Enable (DAE): The DAOE0 and DAOE1 bits both control D/A conversion. When the DAE bit is cleared to
0, the channel 0 and 1 D/A conversions are controlled independently. When the DAE bit is set to 1, the channel 0 and 1
D/A conversions are controlled together.
Output of resultant conversions is always controlled independently by the DAOE0 and DAOE1 bits.
Bit 7
DAOE1
Bit 6
DAOE0
Bit 5
DAE
Description
0
0
×
Channel 0 and 1 D/A conversions disabled
1
0
Channel 0 D/A conversion enabled
Channel 1 D/A conversion disabled
1
Channel 0 and 1 D/A conversions enabled
0
Channel 0 D/A conversion disabled
Channel 1 D/A conversion enabled
1
Channel 0 and 1 D/A conversions enabled
×
Channel 0 and 1 D/A conversions enabled
1
0
1
×: Don’t care
If the H8S/2357 Group enters software standby mode when D/A conversion is enabled, the D/A output is held and the
analog power current is the same as during D/A conversion. When it is necessary to reduce the analog power current in
software standby mode, clear both the DAOE0 and DAOE1 bits to 0 to disable D/A output.
Bits 4 to 0—Reserved: These bits cannot be modified and are always read as 1.
17.2.3
Module Stop Control Register (MSTPCR)
MSTPCRH
Bit
MSTPCRL
:
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Initial value :
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
R/W
: R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
MSTPCR is a 16-bit readable/writable register that performs module stop mode control.
When the MSTP10 bit in MSTPCR is set to 1, D/A converter operation stops at the end of the bus cycle and a transition is
made to module stop mode. Registers cannot be read or written to in module stop mode. For details, see section 21.5,
Module Stop Mode.
MSTPCR is initialized to H'3FFF by a reset and in hardware standby mode. It is not initialized in software standby mode.
Bit 10—Module Stop (MSTP10): Specifies the D/A converter module stop mode.
Bit 10
MSTP10
Description
0
D/A converter module stop mode cleared
1
D/A converter module stop mode set
Rev.6.00 Oct.28.2004 page 558 of 1016
REJ09B0138-0600H
(Initial value)
17.3
Operation
The D/A converter includes D/A conversion circuits for two channels, each of which can operate independently.
D/A conversion is performed continuously while enabled by DACR. If either DADR0 or DADR1 is written to, the new
data is immediately converted. The conversion result is output by setting the corresponding DAOE0 or DAOE1 bit to 1.
The operation example described in this section concerns D/A conversion on channel 0. Figure 17-2 shows the timing of
this operation.
[1] Write the conversion data to DADR0.
[2] Set the DAOE0 bit in DACR to 1. D/A conversion is started and the DA0 pin becomes an output pin. The conversion
result is output after the conversion time has elapsed. The output value is expressed by the following formula:
DADR contents
× Vref
256
The conversion results are output continuously until DADR0 is written to again or the DAOE0 bit is cleared to 0.
[3] If DADR0 is written to again, the new data is immediately converted. The new conversion result is output after the
conversion time has elapsed.
[4] If the DAOE0 bit is cleared to 0, the DA0 pin becomes an input pin.
DADR0
write cycle
DADR0
write cycle
DACR
write cycle
DACR
write cycle
ø
Address
DADR0
Conversion data 1
Conversion data 2
DAOE0
DA0
Conversion
result 2
Conversion
result 1
High-impedance state
tDCONV
tDCONV
Legend:
tDCONV: D/A conversion time
Figure 17-2 Example of D/A Converter Operation
Rev.6.00 Oct.28.2004 page 559 of 1016
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Rev.6.00 Oct.28.2004 page 560 of 1016
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Section 18 RAM
18.1
Overview
The H8S/2357, H8S/2352, H8S/2398, and H8S/2392 have 8 kbytes of on-chip high-speed static RAM. The H8S/2394 has
32 kbytes of on-chip high-speed static RAM. The H8S/2390 has 4 kbytes of on-chip high-speed static RAM. The on-chip
RAM is connected to the CPU by a 16-bit bus, and accessing both byte data and word data can be performed in a single
state. Thus, high-speed transfer of word data is possible.
The on-chip RAM can be enabled or disabled by means of the RAM enable bit (RAME) in the system control register
(SYSCR).
18.1.1
Block Diagram
Figure 18-1 shows a block diagram of the 8-kbytes of on-chip RAM.
Internal data bus (upper 8 bits)
Internal data bus (lower 8 bits)
H'FFDC00
H'FFDC01
H'FFDC02
H'FFDC03
H'FFDC04
H'FFDC05
H'FFFBFE
H'FFFBFF
Figure 18-1 Block Diagram of RAM (8 kbyte)
18.1.2
Register Configuration
The on-chip RAM is controlled by SYSCR. Table 18-1 shows the address and initial value of SYSCR.
Table 18-1 RAM Register
Name
Abbreviation
R/W
Initial Value
Address*
System control register
SYSCR
R/W
H'01
H'FF39
Note: * Lower 16 bits of the address.
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18.2
Register Descriptions
18.2.1
System Control Register (SYSCR)
Bit
:
Initial value :
R/W
:
7
6
5
4
3
2
1
0
—
—
INTM1
INTM0
NMIEG
—
—
RAME
0
0
0
0
0
0
0
1
R/W
—
R/W
R/W
R/W
—
R/W
R/W
The on-chip RAM is enabled or disabled by the RAME bit in SYSCR. For details of other bits in SYSCR, see section
3.2.2, System Control Register (SYSCR).
Bit 0—RAM Enable (RAME): Enables or disables the on-chip RAM. The RAME bit is initialized when the reset state is
released. It is not initialized in software standby mode.
18.3
Bit 0
RAME
Description
0
On-chip RAM is disabled
1
On-chip RAM is enabled
(Initial value)
Operation
When the RAME bit is set to 1, accesses to addresses H'FFDC00 to H'FFFBFF* are directed to the on-chip RAM. When
the RAME bit is cleared to 0, the off-chip address space is accessed.
Since the on-chip RAM is connected to the CPU by an internal 16-bit data bus, it can be written to and read in byte or
word units. Each type of access can be performed in one state.
Even addresses use the upper 8 bits, and odd addresses use the lower 8 bits. Word data must start at an even address.
Note: * Since the on-chip RAM capacitance differs according to each product, see section 3.5, Memory Map in Each
Operating Mode.
18.4
Usage Note
DTC register information can be located in addresses H'FFF800 to H'FFFBFF. When the DTC is used, the RAME bit
must not be cleared to 0.
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Section 19 ROM
19.1
Overview
This series has 256, or 128 kbytes of flash memory, 256 or 128 kbytes of masked ROM, or 128 kbytes of PROM. The
ROM is connected to the H8S/2000 CPU by a 16-bit data bus. The CPU accesses both byte data and word data in one
state, making possible rapid instruction fetches and high-speed processing.
The on-chip ROM is enabled or disabled by setting the mode pins (MD2, MD1, and MD0) and bit EAE in BCRL.
The flash memory versions of the H8S/2357 Group can be erased and programmed on-board as well as with a PROM
programmer.
The PROM version of the H8S/2357 Group can be programmed with a PROM programmer, by setting PROM mode.
19.1.1
Block Diagram
Figure 19-1 shows a block diagram of the on-chip ROM.
Internal data bus (upper 8 bits)
Internal data bus (lower 8 bits)
H'000000
H'000001
H'000002
H'000003
H'01FFFE
H'01FFFF
Figure 19-1 Block Diagram of ROM (128 kbytes)
19.1.2
Register Configuration
The H8S/2357’s on-chip ROM is controlled by the mode pins and register BCRL. The register configuration is shown in
table 19-1.
Table 19-1 ROM Register
Name
Abbreviation
R/W
Initial Value
Address*
Mode control register
MDCR
R/W
Undefined
H'FF3B
Bus control register L
BCRL
R/W
Undefined
H'FED5
Note: * Lower 16 bits of the address.
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19.2
Register Descriptions
19.2.1
Mode Control Register (MDCR)
Bit
:
7
6
5
4
3
2
1
0
—
—
—
—
—
MDS2
MDS1
MDS0
Initial value :
1
0
0
0
0
—*
—*
—*
R/W
—
—
—
—
—
R
R
R
:
Note: * Determined by pins MD2 to MD0.
MDCR is an 8-bit read-only register that indicates the current operating mode of the H8S/2357 Group.
Bit 7—Reserved: This bit cannot be modified and is always read as 1.
Bits 6 to 3—Reserved: These bits cannot be modified and are always read as 0.
Bits 2 to 0—Mode Select 2 to 0 (MDS2 to MDS0): These bits indicate the input levels at pins MD2 to MD0 (the current
operating mode). Bits MDS2 to MDS0 correspond to pins MD2 to MD0. MDS2 to MDS0 are read-only bits, and cannot be
written to. The mode pin (MD2 to MD0) input levels are latched into these bits when MDCR is read. These latches are
canceled by a power-on reset, but are retained after a manual reset*.
Note: * Manual reset is only supported in the H8S/2357 ZTAT.
19.2.2
Bus Control Register L (BCRL)
Bit
:
Initial value :
R/W
:
7
6
5
4
3
2
1
0
BRLE
BREQOE
EAE
LCASS
DDS
—
WDBE
WAITE
0
0
1
1
1
1
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Enabling or disabling of part of the H8S/2357’s on-chip ROM area can be selected by means of the EAE bit in BCRL.
For details of the other bits in BCRL, see section 6.2.5, Bus Control Register L (BCRL).
Bit 5—External Address Enable (EAE): Selects whether addresses H'010000 to H'01FFFF*2 are to be internal addresses
or external addresses.
Bit 5
EAE
Description
0
Addresses H'010000 to H'01FFFF* 2 are in on-chip ROM
1
Addresses H'010000 to H'01FFFF* 2 are external addresses (external expansion
mode)
or a reserved area* 1 (single-chip mode).
(Initial value)
Notes: 1. Reserved areas should not be accessed.
2. Addresses H'010000 to H'01FFFF are in the H8S/2357. Addresses H'010000 to H'03FFFF are in the H8S/2398.
Rev.6.00 Oct.28.2004 page 564 of 1016
REJ09B0138-0600H
19.3
Operation
The on-chip ROM is connected to the CPU by a 16-bit data bus, and both byte and word data can be accessed in one state.
Even addresses are connected to the upper 8 bits, and odd addresses to the lower 8 bits. Word data must start at an even
address.
The on-chip ROM is enabled and disabled by setting the mode pins (MD 2, MD1, and MD0) and bit EAE in BCRL. These
settings are shown in tables 19-2 and 19-3.
Table 19-2 Operating Modes and ROM Area (H8S/2357 F-ZTAT)
Mode Pin
BCRL
Operating Mode
FWE MD2
MD1
MD0
EAE
On-Chip ROM
Mode 0
0
0
0
—
—
—
Disabled
0
Enabled (128 kbytes)* 1
1
Enabled (64 kbytes)
0
Enabled (128 kbytes)* 1
1
Enabled (64 kbytes)
—
—
0
Enabled (128 kbytes)* 2
1
Enabled (64 kbytes)
0
Enabled (128 kbytes)* 2
1
Enabled (64 kbytes)
—
—
0
Enabled (128 kbytes)* 1
1
Enabled (64 kbytes)
0
Enabled (128 kbytes)* 1
1
Enabled (64 kbytes)
—
0
Mode 1
1
Mode 2
1
Mode 3
1
Mode 4
Advanced expanded mode
with on-chip ROM disabled
Mode 5
Advanced expanded mode
with on-chip ROM disabled
Mode 6
Advanced expanded mode
with on-chip ROM enabled
Mode 7
Mode 8
0
1
0
1
1
Advanced single-chip mode
—
1
0
0
1
Mode 11 Boot mode (advanced
single-chip mode)* 4
0
1
1
0
Mode 13
Mode 15 User program mode
(advanced single-chip
mode)*4
0
1
Mode 10 Boot mode (advanced
expanded mode with onchip ROM enabled)* 3
Mode 14 User program mode
(advanced expanded mode
with on-chip ROM
enabled)* 3
0
1
Mode 9
Mode 12 —
0
0
1
1
0
1
Notes: 1. Note that in modes 6, 7, 14, and 15, the on-chip ROM that can be used after a power-on reset is the 64-kbyte
area from H'000000 to H'00FFFF.
2. Note that in the mode 10 and mode 11 boot modes, the on-chip ROM that can be used immediately after all
flash memory is erased by the boot program is the 64-kbyte area from H'000000 to H'00FFFF.
3. Apart from the fact that flash memory can be erased and programmed, operation is the same as in advanced
expanded mode with on-chip ROM enabled.
4. Apart from the fact that flash memory can be erased and programmed, operation is the same as in advanced
single-chip mode.
Rev.6.00 Oct.28.2004 page 565 of 1016
REJ09B0138-0600H
Table 19-3 Operating Modes and ROM Area (ZTAT or Masked ROM, ROMless, Versions H8S/2398F-ZTAT)
Mode Pin
BCRL
Operating Mode
MD2
MD1
MD0
EAE
On-Chip ROM
Mode 0
0
0
0
—
—
—
Disabled
0
Enabled (128 kbytes)* 1
1
Enabled (64 kbytes)
0
Enabled (128 kbytes)* 1
1
Enabled (64 kbytes)
—
Mode 1
1
Mode 2*
2
Mode 3*
2
Mode 4*
3
1
1
Advanced expanded mode
with on-chip ROM disabled
1
0
Mode 5* 3 Advanced expanded mode
with on-chip ROM disabled
Mode 6
Mode 7
0
Advanced expanded mode
with on-chip ROM enabled
0
1
1
Advanced single-chip mode
0
1
Notes: 1. Modes 6 and 7, the on-chip ROM available after a power-on reset is the 64-kbyte area comprising addresses
H'000000 to H'00FFFF.
Since the on-chip ROM area differs according to each product, see section 3.5, Memory Map in Each Operating
Mode.
2. In the H8S/2398 F-ZTAT, modes 2 and 3 indicate boot mode. For details on boot mode of H8S/2398 F-ZTAT,
refer to table 19-35 in section 19.17, On-Board Programming Modes.
In addition, for details on user program mode, refer also to and 19-35 in section 19.17, On-Board Programming
Modes.
3. In ROMless version, only modes 4 and 5 are available.
19.4
PROM Mode (H8S/2357 ZTAT)
19.4.1
PROM Mode Setting
The PROM version of the H8S/2357 suspends its microcontroller functions when placed in PROM mode, enabling the onchip PROM to be programmed. This programming can be done with a PROM programmer set up in the same way as for
the HN27C101 EPROM (VPP = 12.5 V). Use of a 120/128-pin to 32-pin socket adapter enables programming with a
commercial PROM programmer.
Note that the PROM programmer should not be set to page mode as the H8S/2357 does not support page programming.
Table 19-4 shows how PROM mode is selected.
Table 19-4 Selecting PROM Mode
Pin Names
Setting
MD2, MD1, MD0
Low
STBY
PA2, PA1
Rev.6.00 Oct.28.2004 page 566 of 1016
REJ09B0138-0600H
High
19.4.2
Socket Adapter and Memory Map
Programs can be written and verified by attaching a socket adapter to the PROM programmer to convert from a 120/128pin arrangement to a 32-pin arrangement. Table 19-5 gives ordering information for the socket adapter, and figure 19-2
shows the wiring of the socket adapter. Figure 19-3 shows the memory map in PROM mode.
H8S/2357
EPROM socket
HN27C101
(32 Pins)
TFP-120
FP-128B
Pin
73
81
RES
VPP
1
43
49
PD0
EO0
13
44
50
PD1
EO1
14
45
51
PD2
EO2
15
46
52
PD3
EO3
17
48
54
PD4
EO4
18
49
55
PD5
EO5
19
50
56
PD6
EO6
20
51
57
PD7
EO7
21
2
6
PC0
EA0
12
3
7
PC1
EA1
11
4
8
PC2
EA2
10
5
9
PC3
EA3
9
7
11
PC4
EA4
8
8
12
PC5
EA5
7
9
13
PC6
EA6
6
10
14
PC7
EA7
5
11
15
PB0
EA8
27
74
82
NMI
EA9
26
13
17
PB2
EA10
23
14
18
PB3
EA11
25
16
20
PB4
EA12
4
17
21
PB5
EA13
28
18
22
PB6
EA14
29
19
23
PB7
EA15
3
20
24
PA0
EA16
2
86
94
PF2
CE
22
12
16
PB1
OE
24
87
95
PF1
PGM
31
1, 33, 52, 76, 81
5, 39, 58, 84, 89
VCC
VCC
32
93
103
AVCC
94
104
Vref
21
25
PA1
VSS
16
22
26
PA2
6, 15, 24, 38,
3, 10, 19, 28, 35,
VSS
47, 59, 79, 104
36, 44, 53, 65, 67,
Pin
68, 87, 99,100,114
103
113
AVSS
75
83
STBY
113
123
MD0
114
124
MD1
115
125
MD2
Note: Pins not shown in this figure should be left open.
VPP:
Programming power
supply (12.5 V)
EO7 to EO0: Data input/output
EA16 to EA0: Address input
OE:
Output enable
CE:
Chip enable
PGM:
Program
Figure 19-2 Wiring of 120/128B-Pin Socket Adapter
Rev.6.00 Oct.28.2004 page 567 of 1016
REJ09B0138-0600H
Table 19-5 Socket Adapter
Microcontroller
Package
Socket Adapter
H8S/2357
120 pin TQFP (TFP-120)
HS2655ESNS1H
128 pin QFP (FP-128B)
HS2655ESHS1H
Addresses in
MCU mode
Addresses in
PROM mode
H'000000
H'00000
On-chip PROM
H'01FFFF
H'1FFFF
Figure 19-3 Memory Map in PROM Mode
Rev.6.00 Oct.28.2004 page 568 of 1016
REJ09B0138-0600H
19.5
Programming (H8S/2357 ZTAT)
19.5.1
Overview
Table 19-6 shows how to select the program, verify, and program-inhibit modes in PROM mode.
Table 19-6 Mode Selection in PROM Mode
Pins
Mode
CE
OE
PGM
VPP
VCC
EO7 to EO0
EA 16 to EA0
Program
L
H
L
VPP
VCC
Data input
Address input
Verify
L
L
H
VPP
VCC
Data output
Address input
Program-inhibit
L
L
L
VPP
VCC
High impedance
Address input
L
H
H
H
L
L
H
H
H
Legend:
L: Low voltage level
H: High voltage level
VPP : VPP voltage level
VCC: VCC voltage level
Programming and verification should be carried out using the same specifications as for the standard HN27C101 EPROM.
However, do not set the PROM programmer to page mode, as the H8S/2357 does not support page programming. A
PROM programmer that only supports page programming cannot be used. When choosing a PROM programmer, check
that it supports high-speed programming in byte units. Always set addresses within the range H'00000 to H'1FFFF.
Rev.6.00 Oct.28.2004 page 569 of 1016
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19.5.2
Programming and Verification
An efficient, high-speed programming procedure can be used to program and verify PROM data. This procedure writes
data quickly without subjecting the chip to voltage stress or sacrificing data reliability. It leaves the data H'FF in unused
addresses. Figure 19-4 shows the basic high-speed programming flowchart. Tables 19-7 and 19-8 list the electrical
characteristics of the chip during programming. Figure 19-5 shows a timing chart.
Start
Set programming/verification mode
VCC = 6.0 V ± 0.25 V,
VPP = 12.5 V ± 0.3 V
Address = 0
n=0
n + 1→ n
Yes
No
Program with tPW = 0.2 ms ± 5%
n < 25
Address + 1 → address
No
Verification OK?
Yes
Program with tOPW = 0.2n ms
No
Last address?
Yes
Set read mode
VCC = 5.0 V ± 0.25 V
VPP = VCC
Fail
No go
All addresses read?
Go
End
Figure 19-4 High-Speed Programming Flowchart
Rev.6.00 Oct.28.2004 page 570 of 1016
REJ09B0138-0600H
Table 19-7 DC Characteristics in PROM Mode
Conditions: VCC = 6.0 V ± 0.25 V, VPP = 12.5 V ± 0.3 V, VSS = 0 V, Ta = 25°C ± 5°C
Item
Symbol Min
Typ
Max
Test
Unit Conditions
—
VCC + 0.3
V
Input high voltage
EO7 to EO 0,
EA16 to EA 0,
OE, CE, PGM
VIH
2.4
Input low voltage
EO7 to EO 0,
EA16 to EA0,
OE, CE, PGM
VIL
–0.3 —
0.8
V
Output high voltage EO7 to EO 0
VOH
2.4
—
—
V
I OH = –200 µA
Output low voltage
EO7 to EO 0
VOL
—
—
0.45
V
I OL = 1.6 mA
Input leakage
current
EO7 to EO 0,
EA16 to EA 0,
OE, CE, PGM
| ILI |
—
—
2
µA
Vin =
5.25 V/0.5 V
VCC current
I CC
—
—
40
mA
VPP current
I PP
—
—
40
mA
Table 19-8 AC Characteristics in PROM Mode
Conditions: VCC = 6.0 V ± 0.25 V, VPP = 12.5 V ± 0.3 V, T a = 25°C ± 5°C
Item
Symbol
Min
Typ
Max
Unit
Test
Conditions
Address setup time
t AS
2
—
—
µs
Figure 19-5* 1
OE setup time
t OES
2
—
—
µs
Data setup time
t DS
2
—
—
µs
Address hold time
t AH
0
—
—
µs
Data hold time
t DH
2
—
—
µs
—
—
130
ns
2
—
—
µs
0.19
0.20
0.21
ms
0.19
—
5.25
ms
Data output disable time
t DF *
VPP setup time
t VPS
Programming pulse width
t PW
2
PGM pulse width for overwrite programming t OPW*
3
VCC setup time
t VCS
2
—
—
µs
CE setup time
t CES
2
—
—
µs
Data output delay time
t OE
0
—
150
ns
Notes: 1. Input pulse level: 0.8 V to 2.2 V
Input rise time and fall time ≤ 20 ns
Timing reference levels: Input: 1.0 V, 2.0 V
Output: 0.8 V, 2.0 V
2. t DF is defined to be when output has reached the open state, and the output level can no longer be referenced.
3. t OPW is defined by the value shown in the flowchart.
Rev.6.00 Oct.28.2004 page 571 of 1016
REJ09B0138-0600H
Program
Verify
Address
tAS
tAH
Input data
Data
tDS
VPP
VCC
Output data
tDH
tDF
VPP
VCC
tVPS
VCC+1
VCC
tVCS
CE
tCES
PGM
tPW
tOES
tOE
tOPW*
OE
Note: * tOPW is defined by the value shown in the flowchart.
Figure 19-5 PROM Programming/Verification Timing
19.5.3
Programming Precautions
• Program using the specified voltages and timing.
The programming voltage (VPP) in PROM mode is 12.5 V.
If the PROM programmer is set to Renesas Technology HN27C101 specifications, VPP will be 12.5 V. Applied
voltages in excess of the specified values can permanently destroy the MCU. Be particularly careful about the PROM
programmer’s overshoot characteristics.
• Before programming, check that the MCU is correctly mounted in the PROM programmer. Overcurrent damage to the
MCU can result if the index marks on the PROM programmer, socket adapter, and MCU are not correctly aligned.
• Do not touch the socket adapter or MCU while programming. Touching either of these can cause contact faults and
programming errors.
• The MCU cannot be programmed in page programming mode. Select the programming mode carefully.
• The size of the H8S/2357 PROM is 128 kbytes. Always set addresses within the range H'00000 to H'1FFFF. During
programming, write H'FF to unused addresses to avoid verification errors.
Rev.6.00 Oct.28.2004 page 572 of 1016
REJ09B0138-0600H
19.5.4
Reliability of Programmed Data
An effective way to assure the data retention characteristics of the programmed chips is to bake them at 150°C, then
screen them for data errors. This procedure quickly eliminates chips with PROM memory cells prone to early failure.
Figure 19-6 shows the recommended screening procedure.
Program chip and verify data
Bake chip for 24 to 48 hours at
125°C to 150°C with power off
Read and check program
Mount
Figure 19-6 Recommended Screening Procedure
If a series of programming errors occurs while the same PROM programmer is being used, stop programming and check
the PROM programmer and socket adapter for defects.
Please inform Renesas Technology of any abnormal conditions noted during or after programming or in screening of
program data after high-temperature baking.
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19.6
Overview of Flash Memory (H8S/2357 F-ZTAT)
19.6.1
Features
The features of the flash memory are summarized below.
• Four flash memory operating modes
 Program mode
 Erase mode
 Program-verify mode
 Erase-verify mode
• Programming/erase methods
The flash memory is programmed 32 bytes at a time. Erasing is performed by block erase (in single-block units). When
erasing multiple blocks, the individual blocks must be erased sequentially. Block erasing can be performed as required
on 1-kbyte, 8-kbyte, 16-kbyte, 28-kbyte, and 32-kbyte blocks.
• Programming/erase times (5 V version)
The flash memory programming time is 10 ms (typ.) for simultaneous 32-byte programming, equivalent to 300 µs
(typ.) per byte, and the erase time is 100 ms (typ.) per block.
• Reprogramming capability
The flash memory can be reprogrammed up to 100 times.
• On-board programming modes
There are two modes in which flash memory can be programmed/erased/verified on-board
 Boot mode
 User program mode
• Automatic bit rate adjustment
With data transfer in boot mode, the bit rate of the H8S/2357 Group chip can be automatically adjusted to match the
transfer bit rate of the host.
• Flash memory emulation by RAM
Part of the RAM area can be overlapped onto flash memory, to emulate flash memory updates in real time.
• Protect modes
There are three protect modes, hardware, software, and error protect, which allow protected status to be designated for
flash memory program/erase/verify operations.
• Programmer mode
Flash memory can be programmed/erased in programmer mode, using a PROM programmer, as well as in on-board
programming mode.
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Block Diagram
Internal address bus
Internal data bus (16 bits)
SYSCR2
FLMCR1
Module bus
19.6.2
Bus interface/controller
FLMCR2
Operating
mode
FWE pin
Mode pins
EBR1
EBR2
RAMER
Flash memory
(128 kbytes)
Legend:
SYSCR2:
FLMCR1:
FLMCR2:
EBR1:
EBR2:
RAMER:
System control register 2
Flash memory control register 1
Flash memory control register 2
Erase block register 1
Erase block register 2
RAM emulation register
Figure 19-7 Block Diagram of Flash Memory
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19.6.3
Flash Memory Operating Modes
Mode Transitions: When the mode pins and the FWE pin are set in the reset state and a reset-start is executed, the MCU
enters one of the operating modes shown in figure 19-8. In user mode, flash memory can be read but not programmed or
erased.
Flash memory can be programmed and erased in boot mode, user program mode, and programmer mode.
Reset state
MD2 = MD1 = 1
RES = 0
User mode with
on-chip ROM
enabled
FWE = 1
RES = 0
*1
FWE = 0
RES = 0
*2
RES = 0
Programmer
mode
User
program mode
Boot mode
On-board programming mode
Notes: Only make a transition between user mode and user program mode when the CPU is
not accessing the flash memory.
1. MD2 = MD1 = MD0 = 0, P66 = 1, P65 = P64 = 0
2. NMI = 1, FWE = 1, MD2 = 0, MD1 = 1
Figure 19-8 Flash Memory Mode Transitions
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On-Board Programming Modes
• Boot mode
2. Programming control program transfer
When boot mode is entered, the boot program in
the H8S/2357 chip (originally incorporated in the
chip) is started and the programming control
program in the host is transferred to RAM via SCI
communication. The boot program required for
flash memory erasing is automatically transferred
to the RAM boot program area.
"#,!
!
1. Initial state
The old program version or data remains written
in the flash memory. The user should prepare the
programming control program and new
application program beforehand in the host.
Host
Host
Programming control
program
New application
program
New application
program
H8S/2357 Group chip
H8S/2357 Group chip
SCI
Boot program
Flash memory
SCI
Boot program
Flash memory
RAM
RAM
Boot program area
Application program
(old version)
Application program
(old version)
3. Flash memory initialization
The erase program in the boot program area (in
RAM) is executed, and the flash memory is
initialized (to H'FF). In boot mode, entire flash
memory erasure is performed, without regard to
blocks.
Programming control
program
4. Writing new application program
The programming control program transferred
from the host to RAM is executed, and the new
application program in the host is written into the
flash memory.
Host
Host
New application
program
H8S/2357 Group chip
H8S/2357 Group chip
SCI
Boot program
Flash memory
Flash memory
RAM
Boot program area
Flash memory
erase
Programming control
program
SCI
Boot program
RAM
Boot program area
New application
program
Programming control
program
Program execution state
Figure 19-9 Boot Mode
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• User program mode
2. Programming/erase control program transfer
When the FWE pin is driven high, user software
confirms this fact, executes the transfer program
in the flash memory, and transfers the
programming/erase control program to RAM.
,
,
! 1. Initial state
(1) The FWE assessment program that confirms
that the FWE pin has been driven high, and (2)
the program that will transfer the programming/
erase control program to on-chip RAM should be
written into the flash memory by the user
beforehand. (3) The programming/erase control
program should be prepared in the host or in the
flash memory.
Host
Host
Programming/
erase control program
New application
program
New application
program
H8S/2357 Group chip
H8S/2357 Group chip
SCI
Boot program
Flash memory
RAM
SCI
Boot program
Flash memory
RAM
FWE assessment
program
FWE assessment
program
Transfer program
Transfer program
Programming/
erase control program
Application program
(old version)
Application program
(old version)
3. Flash memory initialization
The programming/erase program in RAM is
executed, and the flash memory is initialized (to
H'FF). Erasing can be performed in block units,
but not in byte units.
4. Writing new application program
Next, the new application program in the host is
written into the erased flash memory blocks. Do
not write to unerased blocks.
Host
Host
New application
program
H8S/2357 Group chip
H8S/2357 Group chip
SCI
Boot program
Flash memory
RAM
FWE assessment
program
SCI
Boot program
Flash memory
RAM
FWE assessment
program
Transfer program
Transfer program
Programming/
erase control program
Flash memory
erase
Programming/
erase control program
New application
program
Program execution state
Figure 19-10 User Program Mode (Example)
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Flash Memory Emulation in RAM
• Reading Overlap Data in User Mode and User Program Mode
Emulation should be performed in user mode or user program mode. When the emulation block set in RAMER is
accessed while the emulation function is being executed, data written in the overlap RAM is read.
SCI
Flash memory
RAM
Emulation block
Overlap RAM
(emulation is performed
on data written in RAM)
Application program
Execution state
Figure 19-11 Reading Overlap Data in User Mode and User Program Mode
• Writing Overlap Data in User Program Mode
When overlap RAM data is confirmed, the RAMS bit is cleared, RAM overlap is released, and writes should actually
be performed to the flash memory.
When the programming control program is transferred to RAM, ensure that the transfer destination and the overlap
RAM do not overlap, as this will cause data in the overlap RAM to be rewritten.
SCI
Flash memory
RAM
Programming data
Overlap RAM
(programming data)
Programming control
program execution state
Application program
Figure 19-12 Writing Overlap Data in User Program Mode
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Differences between Boot Mode and User Program Mode
Table 19-9 Differences between Boot Mode and User Program Mode
Boot Mode
User Program Mode
Entire memory erase
Yes
Yes
Block erase
No
Yes
Programming control program*
Program/program-verify
Program/program-verify
Erase/erase-verify
Note: * To be provided by the user, in accordance with the recommended algorithm.
Block Configuration: The flash memory is divided into two 32-kbyte blocks, two 8-kbyte blocks, one 16-kbyte block,
one 28-kbyte block, and four 1-kbyte blocks.
Address H'00000
1 kbyte
1 kbyte
1 kbyte
1 kbyte
28 kbytes
128 kbytes
16 kbytes
8 kbytes
8 kbytes
32 kbytes
32 kbytes
Address H'1FFFF
Figure 19-13 Flash Memory Block Configuration
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19.6.4
Pin Configuration
The flash memory is controlled by means of the pins shown in table 19-10.
Table 19-10 Flash Memory Pins
19.6.5
Pin Name
Abbreviation
I/O
Function
Reset
RES
Input
Reset
Flash write enable
FWE
Input
Flash program/erase protection by hardware
Mode 2
MD2
Input
Sets MCU operating mode
Mode 1
MD1
Input
Sets MCU operating mode
Mode 0
MD0
Input
Sets MCU operating mode
Port 66
P66
Input
Sets MCU operating mode in programmer
mode
Port 65
P65
Input
Sets MCU operating mode in programmer
mode
Port 64
P64
Input
Sets MCU operating mode in programmer
mode
Transmit data
TxD1
Output
Serial transmit data output
Receive data
RxD1
Input
Serial receive data input
Register Configuration
The registers used to control the on-chip flash memory when enabled are shown in table 19-11.
In order for these registers to be accessed, the FLSHE bit must be set to 1 in SYSCR2 (except RAMER).
Table 19-11 Flash Memory Registers
Register Name
Abbreviation R/W
Initial Value
Address* 1
Flash memory control register 1
FLMCR1* 6
R/W*3
H'00* 4
H'FFC8* 2
Flash memory control register 2
FLMCR2* 6
R/W*3
H'00* 5
H'FFC9* 2
Erase block register 1
EBR1* 6
R/W*3
H'00* 5
H'FFCA* 2
Erase block register 2
EBR2* 6
R/W*3
H'00* 5
H'FFCB* 2
System control register 2
SYSCR2* 7
R/W
H'00
H'FF42
RAM emulation register
RAMER
R/W
H'00
H'FEDB
Notes: 1. Lower 16 bits of the address.
2. Flash memory registers are selected by the FLSHE bit in system control register 2 (SYSCR2).
3. In modes in which the on-chip flash memory is disabled, a read will return H'00, and writes are invalid. Writes
are also disabled when the FWE bit is cleared to 0 in FLMCR1.
4. When a high level is input to the FWE pin, the initial value is H'80.
5. When a low level is input to the FWE pin, or if a high level is input and the SWE bit in FLMCR1 is not set, these
registers are initialized to H'00.
6. FLMCR1, FLMCR2, EBR1, and EBR2 are 8-bit registers. Only byte accesses are valid for these registers, the
access requiring 2 states.
7. SYSCR2 is available only in the F-ZTAT version. In the masked ROM and ZTAT versions, this register cannot
be written to and will return an undefined value if read.
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19.7
Register Descriptions
19.7.1
Flash Memory Control Register 1 (FLMCR1)
Bit
7
6
5
4
3
2
1
0
FWE
SWE
—
—
EV
PV
E
P
Initial value
—*
0
0
0
0
0
0
0
Read/Write
R
R/W
—
—
R/W
R/W
R/W
R/W
Note: * Determined by the state of the FWE pin.
FLMCR1 is an 8-bit register used for flash memory operating mode control. Program-verify mode or erase-verify mode is
entered by setting SWE to 1 when FWE = 1. Program mode is entered by setting SWE to 1 when FWE = 1, then setting
the PSU bit in FLMCR2, and finally setting the P bit. Erase mode is entered by setting SWE to 1 when FWE = 1, then
setting the ESU bit in FLMCR2, and finally setting the E bit. FLMCR1 is initialized by a reset, and in hardware standby
mode and software standby mode. Its initial value is H'80 when a high level is input to the FWE pin, and H'00 when a low
level is input. When on-chip flash memory is disabled, a read will return H'00, and writes are invalid.
Writes to the SWE bit in FLMCR1 are enabled only when FWE = 1; writes to the EV and PV bits only when FWE=1 and
SWE=1; writes to the E bit only when FWE = 1, SWE = 1, and ESU = 1; and writes to the P bit only when FWE = 1,
SWE = 1, and PSU = 1.
Bit 7—Flash Write Enable Bit (FWE): Sets hardware protection against flash memory programming/erasing. See
section 19.14, Flash Memory Programming and Erasing Precautions, before using this bit.
Bit 7
FWE
Description
0
When a low level is input to the FWE pin (hardware-protected state)
1
When a high level is input to the FWE pin
Bit 6—Software Write Enable Bit (SWE): Enables or disables flash memory programming. SWE should be set before
setting bits ESU, PSU, EV, PV, E, P, and EB9 to EB0, and should not be cleared at the same time as these bits.
Bit 6
SWE
Description
0
Writes disabled
1
Writes enabled
[Setting condition]
When FWE = 1
Bits 5 and 4—Reserved: These bits cannot be modified and are always read as 0.
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(Initial value)
Bit 3—Erase-Verify (EV): Selects erase-verify mode transition or clearing. Do not set the SWE, ESU, PSU, PV, E, or P
bit at the same time.
Bit 3
EV
Description
0
Erase-verify mode cleared
1
Transition to erase-verify mode
(Initial value)
[Setting condition]
When FWE = 1 and SWE = 1
Bit 2—Program-Verify (PV): Selects program-verify mode transition or clearing. Do not set the SWE, ESU, PSU, EV,
E, or P bit at the same time.
Bit 2
PV
Description
0
Program-verify mode cleared
1
Transition to program-verify mode
(Initial value)
[Setting condition]
When FWE = 1 and SWE = 1
Bit 1—Erase (E): Selects erase mode transition or clearing. Do not set the SWE, ESU, PSU, EV, PV, or P bit at the same
time.
Bit 1
E
Description
0
Erase mode cleared
1
Transition to erase mode
(Initial value)
[Setting condition]
When FWE = 1, SWE = 1, and ESU = 1
Bit 0—Program (P): Selects program mode transition or clearing. Do not set the SWE, PSU, ESU, EV, PV, or E bit at
the same time.
Bit 0
P
Description
0
Program mode cleared
1
Transition to program mode
(Initial value)
[Setting condition]
When FWE = 1, SWE = 1, and PSU = 1
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19.7.2
Flash Memory Control Register 2 (FLMCR2)
Bit
7
6
5
4
3
2
1
0
FLER
—
—
—
—
—
ESU
PSU
Initial value
0
0
0
0
0
0
0
0
Read/Write
R
—
—
—
—
—
R/W
R/W
FLMCR2 is an 8-bit register that monitors the presence or absence of flash memory program/erase protection (error
protection) and performs setup for flash memory program/erase mode. FLMCR2 is initialized to H'00 by a reset, and in
hardware standby mode. The ESU and PSU bits are cleared to 0 in software standby mode, hardware protect mode, and
software protect mode.
When on-chip flash memory is disabled, a read will return H'00.
Bit 7—Flash Memory Error (FLER): Indicates that an error has occurred during an operation on flash memory
(programming or erasing). When FLER is set to 1, flash memory goes to the error-protection state.
Bit 7
FLER
0
Description
Flash memory is operating normally
(Initial value)
Flash memory program/erase protection (error protection) is disabled
[Clearing condition]
Reset or hardware standby mode
1
An error has occurred during flash memory programming/erasing
Flash memory program/erase protection (error protection) is enabled
[Setting condition]
See section 19.10.3, Error Protection
Bits 6 to 2—Reserved: These bits cannot be modified and are always read as 0.
Bit 1—Erase Setup (ESU): Prepares for a transition to erase mode. Set this bit to 1 before setting the E bit to 1 in
FLMCR1. Do not set the SWE, PSU, EV, PV, E, or P bit at the same time.
Bit 1
ESU
Description
0
Erase setup cleared
1
Erase setup
(Initial value)
[Setting condition]
When FWE = 1, and SWE = 1
Bit 0—Program Setup (PSU): Prepares for a transition to program mode. Set this bit to 1 before setting the P bit to 1 in
FLMCR1. Do not set the SWE, ESU, EV, PV, E, or P bit at the same time.
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Bit 0
PSU
Description
0
Program setup cleared
1
Program setup
(Initial value)
[Setting condition]
When FWE = 1, and SWE = 1
19.7.3
Erase Block Registers 1 and 2 (EBR1, EBR2)
Bit
7
6
5
4
3
2
1
0
EBR1
—
—
—
—
—
—
EB9
EB8
Initial value
0
0
0
0
0
0
0
0
Read/Write
—
—
—
—
—
—
R/W
R/W
Bit
7
6
5
4
3
2
1
0
EB7
EB6
EB5
EB4
EB3
EB2
EB1
EB0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
EBR2
EBR1 and EBR2 are registers that specify the flash memory erase area block by block; bits 1 and 2 in EBR1 and bits 7 to
0 in EBR2 are readable/writable bits. EBR1 and EBR2 are each initialized to H'00 by a reset, in hardware standby mode
and software standby mode, when a low level is input to the FWE pin, and when a high level is input to the FWE pin and
the SWE bit in FLMCR1 is not set. When a bit in EBR1 or EBR2 is set, the corresponding block can be erased. Other
blocks are erase-protected. Set only one bit in EBR1 or EBR2 (more than one bit cannot be set). When on-chip flash
memory is disabled, a read will return H'00, and writes are invalid.
The flash memory block configuration is shown in table 19-12.
Table 19-12 Flash Memory Erase Blocks
Block (Size)
Address
EB0 (1 kbyte)
H'000000 to H'0003FF
EB1 (1 kbyte)
H'000400 to H'0007FF
EB2 (1 kbyte)
H'000800 to H'000BFF
EB3 (1 kbyte)
H'000C00 to H'000FFF
EB4 (28 kbytes)
H'001000 to H'007FFF
EB5 (16 kbytes)
H'008000 to H'00BFFF
EB6 (8 kbytes)
H'00C000 to H'00DFFF
EB7 (8 kbytes)
H'00E000 to H'00FFFF
EB8 (32 kbytes)
H'010000 to H'017FFF
EB9 (32 kbytes)
H'018000 to H'01FFFF
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19.7.4
System Control Register 2 (SYSCR2)
Bit
7
6
5
4
3
2
1
0
—
—
—
—
FLSHE
—
—
—
Initial value
0
0
0
0
0
0
0
0
Read/Write
—
—
—
—
R/W
—
—
—
SYSCR2 is an 8-bit readable/writable register that controls on-chip flash memory (in F-ZTAT versions).
SYSCR2 is initialized to H'00 by a reset and in hardware standby mode.
SYSCR2 is available only in the F-ZTAT version. In the masked ROM and ZTAT versions, this register cannot be
written to and will return an undefined value if read.
Bits 7 to 4—Reserved: These bits cannot be modified and are always read as 0.
Bit 3—Flash Memory Control Register Enable (FLSHE): Controls CPU access to the flash memory control registers
(FLMCR1, FLMCR2, EBR1, and EBR2). Setting the FLSHE bit to 1 enables read/write access to the flash memory
control registers. If FLSHE is cleared to 0, the flash memory control registers are deselected. In this case, the flash
memory control register contents are retained.
Bit 3
FLSHE
Description
0
Flash control registers deselected in area H'FFFFC8 to H'FFFFCB
1
Flash control registers selected in area H'FFFFC8 to H'FFFFCB
(Initial value)
Bits 2 to 0—Reserved: These bits cannot be modified and are always read as 0.
19.7.5
RAM Emulation Register (RAMER)
RAMER specifies the area of flash memory to be overlapped with part of RAM when emulating real-time flash memory
programming. RAMER is initialized to H'00 by a reset and in hardware standby mode. It is not initialized in software
standby mode. RAMER settings should be made in user mode or user program mode.
Flash memory area divisions are shown in table 19-13. To ensure correct operation of the emulation function, the ROM
for which RAM emulation is performed should not be accessed immediately after this register has been modified. Normal
execution of an access immediately after register modification is not guaranteed.
Bit:
7
6
5
4
3
2
1
0
—
—
—
—
—
RAMS
RAM1
RAM0
Initial value:
0
0
0
0
0
0
0
0
R/W:
—
—
—
—
—
R/W
R/W
R/W
Bits 7 to 3—Reserved: These bits are always read as 0.
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Bit 2—RAM Select (RAMS): Specifies selection or non-selection of flash memory emulation in RAM. When RAMS =
1, all flash memory block are program/erase-protected.
Bit 2
RAMS
Description
0
Emulation not selected
(Initial value)
Program/erase-protection of all flash memory blocks is disabled
1
Emulation selected
Program/erase-protection of all flash memory blocks is enabled
Bits 1 and 0—Flash Memory Area Selection (RAM1, RAM0): These bits are used together with bit 2 to select the flash
memory area to be overlapped with RAM. (see table 19-13.)
Table 19-13 Flash Memory Area Divisions
Addresses
Block Name
RAMS
RAM1
RAM0
H'FFDC00–H'FFDFFF
RAM area 1 kbyte
0
×
×
H'000000–H'0003FF
EB0 (1 kbyte)
1
0
0
H'000400–H'0007FF
EB1 (1 kbyte)
1
0
1
H'000800–H'000BFF
EB2 (1 kbyte)
1
1
0
H'000C00–H'000FFF
EB3 (1 kbyte)
1
1
1
×: Don’t care
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19.8
On-Board Programming Modes
When pins are set to on-board programming mode, program/erase/verify operations can be performed on the on-chip flash
memory. There are two on-board programming modes: boot mode and user program mode. The pin settings for transition
to each of these modes are shown in table 19-14. For a diagram of the transitions to the various flash memory modes, see
figure 19-8.
Table 19-14 Setting On-Board Programming Modes
Mode
Mode Name
CPU Operating Mode
FWE
MD2
MD1
MD0
Boot mode
Advanced expanded mode with
on-chip ROM enabled
1
0
1
0
Advanced single-chip mode
User program mode*
Advanced expanded mode with
on-chip ROM enabled
1
1
1
1
Advanced single-chip mode
0
1
Note: * Normally, user mode should be used. Set FWE to 1 to make a transition to user program mode before performing a
program/erase/verify operation.
19.8.1
Boot Mode
When boot mode is used, the flash memory programming control program must be prepared in the host beforehand. The
channel 1 SCI to be used is set to asynchronous mode.
When a reset-start is executed after the H8S/2357 MCU’s pins have been set to boot mode, the boot program built into the
MCU is started and the programming control program prepared in the host is serially transmitted to the MCU via the SCI.
In the MCU, the programming control program received via the SCI is written into the programming control program area
in on-chip RAM. After the transfer is completed, control branches to the start address of the programming control program
area and the programming control program execution state is entered (flash memory programming is performed).
The transferred programming control program must therefore include coding that follows the programming algorithm
given later.
The system configuration in boot mode is shown in figure 19-14, and the boot program mode execution procedure in
figure 19-15.
H8S/2357 chip
Flash memory
Host
Write data reception
Verify data transmission
RxD1
SCI1
TxD1
Figure 19-14 System Configuration in Boot Mode
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REJ09B0138-0600H
On-chip RAM
Start
Set pins to boot mode
and execute reset-start
Host transfers data (H'00)
continuously at prescribed bit rate
MCU measures low period
of H'00 data transmitted by host
MCU calculates bit rate and
sets value in bit rate register
After bit rate adjustment, MCU
transmits one H'00 data byte to
host to indicate end of adjustment
Host confirms normal reception
of bit rate adjustment end
indication (H'00), and transmits
one H'55 data byte
After receiving H'55,
MCU transmits one H'AA
data byte to host
Host transmits number
of programming control program
bytes (N), upper byte followed
by lower byte
MCU transmits received
number of bytes to host as verify
data (echo-back)
n=1
Host transmits programming control
program sequentially in byte units
MCU transmits received
programming control program to
host as verify data (echo-back)
n+1→n
Transfer received programming
control program to on-chip RAM
No
n = N?
Yes
End of transmission
Check flash memory data, and
if data has already been written,
erase all blocks
After confirming that all flash
memory data has been erased,
MCU transmits one H'AA data
byte to host
Execute programming control
program transferred to on-chip RAM
Note: If a memory cell does not operate normally and cannot be erased, one H'FF byte is
transmitted as an erase error, and the erase operation and subsequent operations
are halted.
Figure 19-15 Boot Mode Execution Procedure
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Automatic SCI Bit Rate Adjustment
Start
bit
D0
D1
D2
D3
D4
D5
D6
D7
Low period (9 bits) measured (H'00 data)
Stop
bit
High period
(1 or more bits)
Figure 19-16 Automatic SCI Bit Rate Adjustment
When boot mode is initiated, the H8S/2357 MCU measures the low period of the asynchronous SCI communication data
(H'00) transmitted continuously from the host. The SCI transmit/receive format should be set as follows: 8-bit data, 1 stop
bit, no parity. The MCU calculates the bit rate of the transmission from the host from the measured low period, and
transmits one H'00 byte to the host to indicate the end of bit rate adjustment. The host should confirm that this adjustment
end indication (H'00) has been received normally, and transmit one H'55 byte to the MCU. If reception cannot be
performed normally, initiate boot mode again (reset), and repeat the above operations. Depending on the host’s
transmission bit rate and the MCU’s system clock frequency, there will be a discrepancy between the bit rates of the host
and the MCU. To ensure correct SCI operation, the host’s transfer bit rate should be set to (4,800, or 9,600) bps.
Table 19-15 shows typical host transfer bit rates and system clock frequencies for which automatic adjustment of the
MCU’s bit rate is possible. The boot program should be executed within this system clock range.
Table 19-15 System Clock Frequencies for which Automatic Adjustment of H8S/2357 Bit Rate is Possible
Host Bit Rate
System Clock Frequency for which Automatic Adjustment
of H8S/2357 Bit Rate is Possible
9600 bps
8 to 20 MHz
4800 bps
4 to 20 MHz
On-Chip RAM Area Divisions in Boot Mode: In boot mode, the 2 kbytes area from H'FFDC00 to H'FFE3FF is reserved
for use by the boot program, as shown in figure 19-17. The area to which the programming control program is transferred
is H'FFE400 to H'FFFB7F. The boot program area can be used when the programming control program transferred into
RAM enters the execution state. A stack area should be set up as required.
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H'FFDC00
H'FFE3FF
Boot program
area*1
(2 kbytes)
Programming
control program
area
(6 kbytes)
H'FFFB7F
H'FFFBFF
(128 bytes)*2
Notes: 1. The boot program area cannot be used until a transition is made to the execution state
for the programming control program transferred to RAM. Note that the boot program
remains stored in this area after a branch is made to the programming control program.
2. The area from H'FFFB80 to H'FFFBFF (128 bytes) is used by the boot program.
The area from H'FFE400 to H'FFFB7F can be used by the programming control program.
Figure 19-17 RAM Areas in Boot Mode
Notes on Use of User Mode:
• When the chip comes out of reset in boot mode, it measures the low-level period of the input at the SCI’s RxD1 pin.
The reset should end with RxD1 high. After the reset ends, it takes approximately 100 states before the chip is ready to
measure the low-level period of the RxD1 pin.
• In boot mode, if any data has been programmed into the flash memory (if all data is not 1), all flash memory blocks
are erased. Boot mode is for use when user program mode is unavailable, such as the first time on-board programming
is performed, or if the program activated in user program mode is accidentally erased.
• Interrupts cannot be used while the flash memory is being programmed or erased.
• The RxD1 and TxD1 pins should be pulled up on the board.
• Before branching to the programming control program (RAM area H'FFE400), the chip terminates transmit and
receive operations by the on-chip SCI (channel 1) (by clearing the RE and TE bits in SCR to 0), but the adjusted bit
rate value remains set in BRR. The transmit data output pin, TxD1, goes to the high-level output state (P31DDR = 1,
P31DR = 1).
The contents of the CPU’s internal general registers are undefined at this time, so these registers must be initialized
immediately after branching to the programming control program. In particular, since the stack pointer (SP) is used
implicitly in subroutine calls, etc., a stack area must be specified for use by the programming control program.
Initial settings must also be made for the other on-chip registers.
• Boot mode can be entered by making the pin settings shown in table 19-14 and executing a reset-start.
Boot mode can be cleared by driving the reset pin low, waiting at least 20 states, then setting the FWE pin and mode
pins, and executing reset release*1. Boot mode can also be cleared by a WDT overflow reset.
Do not change the mode pin input levels in boot mode, and do not drive the FWE pin low while the boot program is
being executed or while flash memory is being programmed or erased*2.
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• If the mode pin input levels are changed (for example, from low to high) during a reset, the state of ports with
multiplexed address functions and bus control output pins (AS, RD, HWR) will change according to the change in the
microcomputer’s operating mode*3.
Therefore, care must be taken to make pin settings to prevent these pins from becoming output signal pins during a
reset, or to prevent collision with signals outside the microcomputer.
Notes: 1. Mode pins and FWE pin input must satisfy the mode programming setup time (tMDS = 200 ns) with respect to
the reset release timing, as shown in figures 19-33 to 19-35.
2. For further information on FWE application and disconnection, see section 19.14, Flash Memory Programming
and Erasing Precautions.
3. See Appendix D, Pin States.
19.8.2
User Program Mode
When set to user program mode, the chip can program and erase its flash memory by executing a user program/erase
control program. Therefore, on-board reprogramming of the on-chip flash memory can be carried out by providing onboard means of FWE control and supply of programming data, and storing a program/erase control program in part of the
program area as necessary.
To select user program mode, select a mode that enables the on-chip flash memory (mode 6 or 7), and apply a high level
to the FWE pin. In this mode, on-chip supporting modules other than flash memory operate as they normally would in
modes 6 and 7.
The flash memory itself cannot be read while the SWE bit is set to 1 to perform programming or erasing, so the control
program that performs programming and erasing should be run in on-chip RAM or external memory.
Figure 19-18 shows the procedure for executing the program/erase control program when transferred to on-chip RAM.
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Write the FWE assessment program and
transfer program (and the program/erase
control program if necessary) beforehand
MD2, MD1, MD0 = 110, 111
Reset-start
Transfer program/erase control
program to RAM
Branch to program/erase control
program in RAM area
FWE = high*
Execute program/erase control
program (flash memory rewriting)
Clear FWE*
Branch to flash memory application
program
Notes: Do not apply a constant high level to the FWE pin. Apply a high level to the FWE pin
only when the flash memory is programmed or erased. Also, while a high level is
applied to the FWE pin, the watchdog timer should be activated to prevent
overprogramming or overerasing due to program runaway, etc.
* For further information on FWE application and disconnection, see section 19.14,
Flash Memory Programming and Erasing Precautions.
Figure 19-18 User Program Mode Execution Procedure
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19.9
Programming/Erasing Flash Memory
In the on-board programming modes, flash memory programming and erasing is performed by software, using the CPU.
There are four flash memory operating modes: program mode, erase mode, program-verify mode, and erase-verify mode.
Transitions to these modes can be made by setting the PSU and ESU bits in FLMCR2, and the P, E, PV, and EV bits in
FLMCR1.
The flash memory cannot be read while being programmed or erased. Therefore, the program that controls flash memory
programming/erasing (the programming control program) should be located and executed in on-chip RAM or external
memory.
Notes: 1. Operation is not guaranteed if setting/resetting of the SWE, EV, PV, E, and P bits in FLMCR1, and the ESU
and PSU bits in FLMCR2, is executed by a program in flash memory.
2. When programming or erasing, set FWE to 1 (programming/erasing will not be executed if FWE = 0).
3. Perform programming in the erased state. Do not perform additional programming on previously programmed
addresses.
19.9.1
Program Mode
Follow the procedure shown in the program/program-verify flowchart in figure 19-19 to write data or programs to flash
memory. Performing program operations according to this flowchart will enable data or programs to be written to flash
memory without subjecting the device to voltage stress or sacrificing program data reliability. Programming should be
carried out 32 bytes at a time.
The wait times (x, y, z, α, ß, γ, ε, η) after bits are set or cleared in flash memory control registers 1 and 2 (FLMCR1,
FLMCR2) and the maximum number of programming operations (N) are shown in table 22.42 in section 22.7.6, Flash
Memory Characteristics.
Following the elapse of (x) µs or more after the SWE bit is set to 1 in flash memory control register 1 (FLMCR1), 32-byte
program data is stored in the program data area and reprogram data area, and the 32-byte data in the reprogram data area
written consecutively to the write addresses. The lower 8 bits of the first address written to must be H'00, H'20, H'40,
H'60, H'80, H'A0, H'C0, or H'E0. Thirty-two consecutive byte data transfers are performed. The program address and
program data are latched in the flash memory. A 32-byte data transfer must be performed even if writing fewer than 32
bytes; in this case, H'FF data must be written to the extra addresses.
Next, the watchdog timer is set to prevent overprogramming in the event of program runaway, etc. Set a value greater than
(y + z + α + ß) µs as the WDT overflow period. After this, preparation for program mode (program setup) is carried out by
setting the PSU bit in FLMCR2, and after the elapse of (y) µs or more, the operating mode is switched to program mode
by setting the P bit in FLMCR1. The time during which the P bit is set is the flash memory programming time. Make a
program setting so that the time for one programming operation is within the range of (z) µs.
19.9.2
Program-Verify Mode
In program-verify mode, the data written in program mode is read to check whether it has been correctly written in the
flash memory.
After the elapse of a given programming time, the programming mode is exited (the P bit in FLMCR1 is cleared to 0, then
the PSU bit in FLMCR2 is cleared to 0 at least (α) µs later). Next, the watchdog timer is cleared after the elapse of (β) µs
or more, and the operating mode is switched to program-verify mode by setting the PV bit in FLMCR1. Before reading in
program-verify mode, a dummy write of H'FF data should be made to the addresses to be read. The dummy write should
be executed after the elapse of (γ) µs or more. When the flash memory is read in this state (verify data is read in 16-bit
units), the data at the latched address is read. Wait at least (ε) µs after the dummy write before performing this read
operation. Next, the originally written data is compared with the verify data, and reprogram data is computed (see figure
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REJ09B0138-0600H
19-19) and transferred to the reprogram data area. After 32 bytes of data have been verified, exit program-verify mode,
wait for at least (η) µs, then clear the SWE bit in FLMCR1 to 0. If reprogramming is necessary, set program mode again,
and repeat the program/program-verify sequence as before. However, ensure that the program/program-verify sequence is
not repeated more than (N) times on the same bits.
Start
Perform programming in the erased state.
Do not perform additional programming
on previously programmed addresses.
Set SWE bit in FLMCR1
Wait (x) µs
*5
Store 32-byte program data in program
data area and reprogram data area
*4
n=1
m=0
Write 32-byte data in RAM reprogram data
area consecutively to flash memory
*1
n←n+1
Enable WDT
Set PSU bit in FLMCR2
Wait (y) µs
*5
Set P bit in FLMCR1
Wait (z) µs
Start of programming
*5
Clear P bit in FLMCR1
Wait (α) µs
End of programming
*5
Clear PSU bit in FLMCR2
Wait (β) µs
*5
Disable WDT
Set PV bit in FLMCR1
Wait (γ) µs
*5
H'FF dummy write to verify address
Wait (ε) µs
*5
Read verify data
*2
Increment address
Notes: 1. Data transfer is performed by byte transfer. The lower
8 bits of the first address written to must be H'00, H'20, H'40,
H'60, H'80, H'A0, H'C0, or H'E0. A 32-byte data transfer
must be performed even if writing fewer than 32 bytes;
in this case, H'FF data must be written to the extra addresses.
2. Verify data is read in 16-bit (word) units.
3. Even bits for which programming has been completed in a 32-byte
programming loop will be subjected to additional programming if
the subsequent verify operation fails.
4. An area for storing program data (32 bytes) and reprogram data
(32 bytes) must be provided in RAM. The contents of the latter
are rewritten as programming progresses.
5. The values of x, y, z, α, β, γ, ε, η, and N are shown in section
22.7.6, Flash Memory Characteristics.
Program Verify
Reprogram
Comments
Data
Data
Data
0
0
1
Programmed bits are
not reprogrammed
0
1
0
Programming incomplete;
reprogram
1
0
1
—
1
1
1
Still in erased state;
no action
*3
Program data =
verify data?
OK
Reprogram data computation
Transfer reprogram data to reprogram
data area
NG
NG
m=1
*3
Note: The memory erased state is 1. Programming is
performed on 0 reprogram data.
RAM
*4
Program data storage
area (32 bytes)
End of 32-byte
data verification?
OK
Clear PV bit in FLMCR1
Wait (η) µs
m = 0?
OK
Reprogram data storage
area (32 bytes)
*5
NG
n ≥ N?
*5
NG
OK
Clear SWE bit in FLMCR1
Clear SWE bit in FLMCR1
End of programming
Programming failure
Figure 19-19 Program/Program-Verify Flowchart
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19.9.3
Erase Mode
Flash memory erasing should be performed block by block following the procedure shown in the erase/erase-verify
flowchart (single-block erase) shown in figure 19-20.
The wait times (x, y, z, α, ß, γ, ε, η) after bits are set or cleared in flash memory control registers 1 and 2 (FLMCR1,
FLMCR2) and the maximum number of programming operations (N) are shown in table 22.42 in section 22.7.6, Flash
Memory Characteristics.
To perform data or program erasure, make a 1 bit setting for the flash memory area to be erased in erase block register 1 or
2 (EBR1 or EBR2) at least (x) µs after setting the SWE bit to 1 in flash memory control register 1 (FLMCR1). Next, the
watchdog timer is set to prevent overerasing in the event of program runaway, etc. Set a value greater than (y + z + α + ß)
µs as the WDT overflow period. After this, preparation for erase mode (erase setup) is carried out by setting the ESU bit in
FLMCR2, and after the elapse of (y) µs or more, the operating mode is switched to erase mode by setting the E bit in
FLMCR1. The time during which the E bit is set is the flash memory erase time. Ensure that the erase time does not
exceed (z) ms.
Note: With flash memory erasing, preprogramming (setting all data in the memory to be erased to 0) is not necessary
before starting the erase procedure.
19.9.4
Erase-Verify Mode
In erase-verify mode, data is read after memory has been erased to check whether it has been correctly erased.
After the elapse of the erase time, erase mode is exited (the E bit in FLMCR1 is cleared to 0, then the ESU bit in FLMCR2
is cleared to 0 at least (α) µs later), the watchdog timer is cleared after the elapse of (β) µs or more, and the operating
mode is switched to erase-verify mode by setting the EV bit in FLMCR1. Before reading in erase-verify mode, a dummy
write of H'FF data should be made to the addresses to be read. The dummy write should be executed after the elapse of (γ)
µs or more. When the flash memory is read in this state (verify data is read in 16-bit units), the data at the latched address
is read. Wait at least (ε) µs after the dummy write before performing this read operation. If the read data has been erased
(all 1), a dummy write is performed to the next address, and erase-verify is performed. If the read data has not been erased,
set erase mode again, and repeat the erase/erase-verify sequence in the same way. However, ensure that the erase/eraseverify sequence is not repeated more than (N) times. When verification is completed, exit erase-verify mode, and wait for
at least (η) µs. If erasure has been completed on all the erase blocks, clear the SWE bit in FLMCR1 to 0. If there are any
unerased blocks, make a 1 bit setting in EBR1 or EBR2 for the flash memory area to be erased, and repeat the erase/eraseverify sequence in the same way.
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Start
*1
Set SWE bit in FLMCR1
Wait (x) µs
*2
n=1
Set EBR1, EBR2
*4
Enable WDT
Set ESU bit in FLMCR2
Wait (y) µs
*2
Start of erase
Set E bit in FLMCR1
Wait (z) ms
*2
Clear E bit in FLMCR1
n←n+1
Halt erase
Wait (α) µs
*2
Clear ESU bit in FLMCR2
Wait (β) µs
*2
Disable WDT
Set EV bit in FLMCR1
Wait (γ) µs
*2
Set block start address to verify address
H'FF dummy write to verify address
Increment
address
Wait (ε) µs
*2
Read verify data
*3
Verify data = all 1?
NG
OK
NG
Last address of block?
OK
Clear EV bit in FLMCR1
Clear EV bit in FLMCR1
Wait (η) µs
Wait (η) µs
*2
*2
NG
Notes: 1.
2.
3.
4.
5.
*5
End of
erasing of all erase
blocks?
OK
*2
n ≥ N?
Clear SWE bit in FLMCR1
OK
Clear SWE bit in FLMCR1
End of erasing
Erase failure
NG
Preprogramming (setting erase block data to all 0) is not necessary.
The values of x, y, z, α, β, γ, ε, η, and N are shown in section 22.7.6, Flash Memory Characteristics.
Verify data is read in 16-bit (W) units.
Set only one bit in EBR1or EBR2. More than one bit cannot be set.
Erasing is performed in block units. To erase a number of blocks, the individual blocks must be erased sequentially.
Figure 19-20 Erase/Erase-Verify Flowchart (Single-Block Erase)
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19.10
Flash Memory Protection
There are three kinds of flash memory program/erase protection: hardware protection, software protection, and error
protection.
19.10.1
Hardware Protection
Hardware protection refers to a state in which programming/erasing of flash memory is forcibly disabled or aborted.
Hardware protection is reset by settings in flash memory control registers 1 and 2 (FLMCR1, FLMCR2) and erase block
registers 1 and 2 (EBR1, EBR2). (See table 19-16.)
Table 19-16 Hardware Protection
Functions
Item
Description
Program
Erase
FWE pin protection
•
When a low level is input to the FWE pin,
FLMCR1, FLMCR2 (excluding the FLER
bit), EBR1, and EBR2 are initialized, and
the program/erase-protected state is
entered.
Yes
Yes
Reset/standby
protection
•
In a reset (including a WDT overflow reset)
and in standby mode, FLMCR1, FLMCR2,
EBR1, and EBR2 are initialized, and the
program/erase-protected state is entered.
Yes
Yes
•
In a reset via the RES pin, the reset state
is not entered unless the RES pin is held
low until oscillation stabilizes after
powering on. In the case of a reset during
operation, hold the RES pin low for the
RES pulse width specified in the AC
Characteristics section.
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19.10.2
Software Protection
Software protection can be implemented by setting the SWE bit in FLMCR1, erase block registers 1 and 2 (EBR1, EBR2),
and the RAMS bit in RAMER. When software protection is in effect, setting the P or E bit in flash memory control
register 1 (FLMCR1) does not cause a transition to program mode or erase mode. (See table 19-17.)
Table 19-17 Software Protection
Functions
Item
Description
Program
Erase
SWE bit protection
•
Yes
Yes
—
Yes
Yes
Yes
Clearing the SWE bit to 0 in FLMCR1 sets
the program/erase-protected state for all
blocks.
(Execute in on-chip RAM or external
memory.)
Block specification
protection
•
Erase protection can be set for individual
blocks by settings in erase block registers
1 and 2 (EBR1, EBR2).
•
Setting EBR1 and EBR2 to H'00 places all
blocks in the erase-protected state.
Emulation protection •
19.10.3
Setting the RAMS bit to 1 in the RAM
emulation register (RAMER) places all
blocks in the program/erase-protected
state.
Error Protection
In error protection, an error is detected when MCU runaway occurs during flash memory programming/erasing, or
operation is not performed in accordance with the program/erase algorithm, and the program/erase operation is aborted.
Aborting the program/erase operation prevents damage to the flash memory due to overprogramming or overerasing.
If the MCU malfunctions during flash memory programming/erasing, the FLER bit is set to 1 in FLMCR2 and the error
protection state is entered. The FLMCR1, FLMCR2, EBR1, and EBR2 settings are retained, but program mode or erase
mode is aborted at the point at which the error occurred. Program mode or erase mode cannot be re-entered by re-setting
the P or E bit. However, PV and EV bit setting is enabled, and a transition can be made to verify mode.
FLER bit setting conditions are as follows:
•
•
•
•
When flash memory is read during programming/erasing (including a vector read or instruction fetch)
Immediately after exception handling (excluding a reset) during programming/erasing
When a SLEEP instruction (including software standby) is executed during programming/erasing
When the CPU loses the bus during programming/erasing
Error protection is released only by a reset and in hardware standby mode.
Figure 19-21 shows the flash memory state transition diagram.
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Normal Operating mode
Program mode
Erase mode
Reset or hardware standby
(hardware protection)
RES = 0 or STBY = 0
RD VF PR ER
FLER = 0
Error occurrence
(software standby)
RD VF PR ER
FLER = 0
RES = 0 or
STBY = 0
Error
occurrence
RES = 0 or
STBY = 0
Error protection mode
RD VF PR ER
FLER = 1
Software
standby mode
Software standby
mode release
FLMCR1, FLMCR2,
EBR1, EBR2
initialization state
Error protection mode
(software standby)
RD VF PR ER
FLER = 1
FLMCR1, FLMCR2 (except FLER
bit), EBR1, EBR2 initialization state
Legend:
RD: Memory read possible
VF: Verify-read possible
PR: Programming possible
ER: Erasing possible
RD:
VF:
PR:
ER:
Memory read not possible
Verify-read not possible
Programming not possible
Erasing not possible
Figure 19-21 Flash Memory State Transitions
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19.11
Flash Memory Emulation in RAM
19.11.1
Emulation in RAM
Making a setting in the RAM emulation register (RAMER) enables part of RAM to be overlapped onto the flash memory
area so that data to be written to flash memory can be emulated in RAM in real time. After the RAMER setting has been
made, accesses can be made from the flash memory area or the RAM area overlapping flash memory. Emulation can be
performed in user mode and user program mode. Figure 19-22 shows an example of emulation of real-time flash memory
programming.
Start emulation program
Set RAMER
Write tuning data to overlap
RAM
Execute application program
No
Tuning OK?
Yes
Clear RAMER
Write to flash memory emulation
block
End of emulation program
Figure 19-22 Flowchart for Flash Memory Emulation in RAM
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19.11.2
RAM Overlap
An example in which flash memory block area EB1 is overlapped is shown below.
H'000000
EB0
H'000400
EB1
H'000800
EB2
H'000C00
This area can be accessed
from both the RAM area
and flash memory area
EB3
Flash memory
EB4 to EB9
H'FFDC00
H'FFDFFF
On-chip RAM
Figure 19.23 Example of RAM Overlap Operation
Example in Which Flash Memory Block Area (EB1) is Overlapped
1. Set bits RAMS, RAM1, and RAM0 in RAMER to 1, 0, 1, to overlap part of RAM onto the area (EB1) for which realtime programming is required.
2. Real-time programming is performed using the overlapping RAM.
3. After the program data has been confirmed, the RAMS bit is cleared, releasing RAM overlap.
4. The data written in the overlapping RAM is written into the flash memory space (EB1).
Notes: 1. When the RAMS bit is set to 1, program/erase protection is enabled for all blocks regardless of the value of
RAM1 and RAM0 (emulation protection). In this state, setting the P or E bit in flash memory control register 1
(FLMCR1) will not cause a transition to program mode or erase mode. When actually programming a flash
memory area, the RAMS bit should be cleared to 0.
2. A RAM area cannot be erased by execution of software in accordance with the erase algorithm while flash
memory emulation in RAM is being used.
3. Block area EB0 includes the vector table. When performing RAM emulation, the vector table is needed by the
overlap RAM.
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19.12
Interrupt Handling when Programming/Erasing Flash Memory
All interrupts, including NMI interrupt is disabled when flash memory is being programmed or erased (when the P or E bit
is set in FLMCR1), and while the boot program is executing in boot mode* 1, to give priority to the program or erase
operation. There are three reasons for this:
1. Interrupt during programming or erasing might cause a violation of the programming or erasing algorithm, with the
result that normal operation could not be assured.
2. In the interrupt exception handling sequence during programming or erasing, the vector would not be read correctly*2,
possibly resulting in MCU runaway.
3. If interrupt occurred during boot program execution, it would not be possible to execute the normal boot mode
sequence.
For these reasons, in on-board programming mode alone there are conditions for disabling interrupt, as an exception to the
general rule. However, this provision does not guarantee normal erasing and programming or MCU operation. All
requests, including NMI interrupt, must therefore be restricted inside and outside the MCU when programming or erasing
flash memory. NMI interrupt is also disabled in the error-protection state while the P or E bit remains set in FLMCR1.
Notes: 1. Interrupt requests must be disabled inside and outside the MCU until the programming control program has
completed programming.
2. The vector may not be read correctly in this case for the following two reasons:
• If flash memory is read while being programmed or erased (while the P or E bit is set in FLMCR1), correct
read data will not be obtained (undetermined values will be returned).
• If the interrupt entry in the vector table has not been programmed yet, interrupt exception handling will not
be executed correctly.
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19.13
Flash Memory Programmer Mode
19.13.1
Programmer Mode Setting
Programs and data can be written and erased in programmer mode as well as in the on-board programming modes. In
programmer mode, the on-chip ROM can be freely programmed using a PROM programmer that supports Renesas
Technology microcomputer device types with 128-kbyte on-chip flash memory. Flash memory read mode, auto-program
mode, auto-erase mode, and status read mode are supported with this device type. In auto-program mode, auto-erase
mode, and status read mode, a status polling procedure is used, and in status read mode, detailed internal signals are output
after execution of an auto-program or auto-erase operation.
Table 19-18 shows programmer mode pin settings.
Table 19-18 Programmer Mode Pin Settings
19.13.2
Pin Names
Settings/External Circuit Connection
Mode pins: MD 2, MD1, MD0
Low-level input
Mode setting pins: P66, P65, P64
High-level input to P66, low-level input to P65 and P64
FWE pin
High-level input (in auto-program and auto-erase
modes)
STBY pin
High-level input (do not select hardware standby mode)
RES pin
Power-on reset circuit
XTAL, EXTAL pins
Oscillator circuit
Other pins requiring setting: P51, P25
High-level input to P51 and P25
Socket Adapters and Memory Map
In programmer mode, a socket adapter is mounted on the PROM programmer to match the package concerned. Socket
adapters are available for each writer manufacturer supporting the Renesas Technology microcomputer device type with
128-kbyte on-chip flash memory.
Figure 19-24 shows the memory map in programmer mode. For pin names in programmer mode, see section 1.3.2, Pin
Functions in Each Operating Mode.
MCU mode
H8S/2357
F-ZTAT
Programmer mode
H'00000
H'000000
On-chip
ROM area
H'01FFFF
H'1FFFF
Figure 19-24 Memory Map in Programmer Mode
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19.13.3
Programmer Mode Operation
Table 19-19 shows how the different operating modes are set when using programmer mode, and table 19-20 lists the
commands used in programmer mode. Details of each mode are given below.
• Memory Read Mode
Memory read mode supports byte reads.
• Auto-Program Mode
Auto-program mode supports programming of 128 bytes at a time. Status polling is used to confirm the end of autoprogramming.
• Auto-Erase Mode
Auto-erase mode supports automatic erasing of the entire flash memory. Status polling is used to confirm the end of
auto-erasing.
• Status Read Mode
Status polling is used for auto-programming and auto-erasing, and normal termination can be confirmed by reading the
I/O6 signal. In status read mode, error information is output if an error occurs.
Table 19-19 Settings for Each Operating Mode in Programmer Mode
Pin Names
Mode
FWE
CE
OE
WE
I/O0 to I/O7
A0 to A16
Read
H or L
L
L
H
Data output
Ain
Output disable
H or L
L
H
H
Hi-Z
×
3
Command write
H or L*
L
H
L
Data input
Ain* 2
Chip disable* 1
H or L
H
×
×
Hi-Z
×
Legend:
H:
High level
L:
Low level
Hi-Z: High impedance
×:
Don’t care
Notes: *1 Chip disable is not a standby state; internally, it is an operation state.
*2 Ain indicates that there is also address input in auto-program mode.
*3 For command writes when making a transition to auto-program or auto-erase mode, input a high level to the
FWE pin.
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Table 19-20 Programmer Mode Commands
1st Cycle
2nd Cycle
Command Name
Number
of Cycles
Mode
Address Data
Mode
Address Data
Memory read mode
1+n
Write
×
H'00
Read
RA
Dout
Auto-program mode
129
Write
×
H'40
Write
PA
Din
Auto-erase mode
2
Write
×
H'20
Write
×
H'20
Status read mode
2
Write
×
H'71
Write
×
H'71
Legend:
RA: Read address
PA: Program address
×:
Don’t care
Notes: 1. In auto-program mode. 129 cycles are required for command writing by a simultaneous 128-byte write.
2. In memory read mode, the number of cycles depends on the number of address write cycles (n).
19.13.4
Memory Read Mode
• After the end of an auto-program, auto-erase, or status read operation, the command wait state is entered. To read
memory contents, a transition must be made to memory read mode by means of a command write before the read is
executed.
• Command writes can be performed in memory read mode, just as in the command wait state.
• Once memory read mode has been entered, consecutive reads can be performed.
• After power-on, memory read mode is entered.
Table 19-21 AC Characteristics in Memory Read Mode
Conditions: VCC = 5.0 V ±10%, VSS = 0 V, Ta = 25°C ±5°C
Item
Symbol
Min
Max
Unit
Command write cycle
t nxtc
20
—
µs
CE hold time
t ceh
0
—
ns
CE setup time
t ces
0
—
ns
Data hold time
t dh
50
—
ns
Data setup time
t ds
50
—
ns
Write pulse width
t wep
70
—
ns
WE rise time
tr
—
30
ns
WE fall time
tf
—
30
ns
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Command write
Memory read mode
Address
Address stable
CE
OE
WE
twep
tceh
tnxtc
tces
tf
tr
Data
Data
H'00
tdh
tds
Note: Data is latched on the rising edge of WE.
Figure 19-25 Memory Read Mode Timing Waveforms after Command Write
Table 19-22 AC Characteristics when Entering Another Mode from Memory Read Mode
Conditions: VCC = 5.0 V ±10%, VSS = 0 V, Ta = 25°C ±5°C
Item
Symbol
Min
Max
Unit
Command write cycle
t nxtc
20
—
µs
CE hold time
t ceh
0
—
ns
CE setup time
t ces
0
—
ns
Data hold time
t dh
50
—
ns
Data setup time
t ds
50
—
ns
Write pulse width
t wep
70
—
ns
WE rise time
tr
—
30
ns
WE fall time
tf
—
30
ns
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×× mode command write
Address
Address stable
twep
CE
tceh
tnxtc
OE
tces
WE
tf
Data
Data
tr
H'××
tdh
tds
Note: Do not enable WE and OE at the same time.
Figure 19-26 Timing Waveforms when Entering Another Mode from Memory Read Mode
Table 19-23 AC Characteristics in Memory Read Mode
Conditions: VCC = 5.0 V ±10%, VSS = 0 V, Ta = 25°C ±5°C
Item
Symbol
Min
Max
Unit
Access time
t acc
—
20
µs
CE output delay time
t ce
—
150
ns
OE output delay time
t oe
—
150
ns
Output disable delay time
t df
—
100
ns
Data output hold time
t oh
5
—
ns
Address
Address stable
Address stable
VIL
CE
OE
VIL
tacc
WE
VIH
tacc
toh
Data
Data
Figure 19-27 Timing Waveforms for CE/OE Enable State Read
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toh
Data
Address
Address stable
Address stable
tacc
CE
tce
tce
OE
toe
toe
WE
tdf
tdf
tacc
Data
VIH
Data
Data
toh
toh
Figure 19-28 Timing Waveforms for CE/OE Clocked Read
19.13.5
Auto-Program Mode
AC Characteristics
Table 19-24 AC Characteristics in Auto-Program Mode
Conditions: VCC = 5.0 V ±10%, VSS = 0 V, Ta = 25°C ±5°C
Item
Symbol
Min
Max
Unit
Command write cycle
t nxtc
20
—
µs
CE hold time
t ceh
0
—
ns
CE setup time
t ces
0
—
ns
Data hold time
t dh
50
—
ns
Data setup time
t ds
50
—
ns
Write pulse width
t wep
70
—
ns
Status polling start time
t wsts
1
—
ms
Status polling access time
t spa
—
150
ns
Address setup time
t as
0
—
ns
Address hold time
t ah
60
—
ns
Memory write time
t write
1
3000
ms
WE rise time
tr
—
30
ns
WE fall time
tf
—
30
ns
Write setup time
t pns
100
—
ns
Write end setup time
t pnh
100
—
ns
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FWE
tpns
tpnh
Address
stable
Address
tceh
tas
CE
tah
tnxtc
OE
tnxtc
twep
WE
Data transfer
1 byte to 128 bytes
tces
twsts
tspa
twrite (1 to 3000 ms)
Programming operation
end identification signal
tr
tf
I/O7
tds
tdh
Programming normal
end identification signal
I/O6
Programming wait
Data
H'40
Data
Data
I/O0 to
I/O5 = 0
Figure 19-29 Auto-Program Mode Timing Waveforms
Notes on Use of Auto-Program Mode
• In auto-program mode, 128 bytes are programmed simultaneously. This should be carried out by executing 128
consecutive byte transfers.
• A 128-byte data transfer is necessary even when programming fewer than 128 bytes. In this case, H'FF data must be
written to the extra addresses.
• The lower 8 bits of the transfer address must be H'00 or H'80. If a value other than an effective address is input,
processing will switch to a memory write operation but a write error will be flagged.
• Memory address transfer is performed in the second cycle (figure 19-29). Do not perform memory address transfer
after the second cycle.
• Do not perform a command write during a programming operation.
• Perform one auto-programming operation for a 128-byte block for each address. Characteristics are not guaranteed for
two or more programming operations.
• Confirm normal end of auto-programming by checking I/O6. Alternatively, status read mode can also be used for this
purpose (I/O7 status polling uses the auto-program operation end identification pin).
• The status polling I/O6 and I/O7 pin information is retained until the next command write. Until the next command
write is performed, reading is possible by enabling CE and OE.
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19.13.6
Auto-Erase Mode
AC Characteristics
Table 19-25 AC Characteristics in Auto-Erase Mode
Conditions: VCC = 5.0 V ±10%, VSS = 0 V, Ta = 25°C ±5°C
Item
Symbol
Min
Max
Unit
Command write cycle
t nxtc
20
—
µs
CE hold time
t ceh
0
—
ns
CE setup time
t ces
0
—
ns
Data hold time
t dh
50
—
ns
Data setup time
t ds
50
—
ns
Write pulse width
t wep
70
—
ns
Status polling start time
t ests
1
—
ms
Status polling access time
t spa
—
150
ns
Memory erase time
t erase
100
40000
ms
WE rise time
tr
—
30
ns
WE fall time
tf
—
30
ns
Erase setup time
t ens
100
—
ns
Erase end setup time
t enh
100
—
ns
FWE
tenh
tens
Address
tceh
tces
CE
tspa
OE
WE
tnxtc
twep
tf
tests
tr
I/O7
Erase end identification
signal
tdh
Erase normal end
confirmation signal
I/O6
Data
tnxtc
terase (100 to 40000 ms)
tds
CLin
DLin
H'20
H'20
I/O0 to I/O5 = 0
Figure 19-30 Auto-Erase Mode Timing Waveforms
Notes on Use of Auto-Erase Mode
• Auto-erase mode supports only entire memory erasing.
• Do not perform a command write during auto-erasing.
• Confirm normal end of auto-erasing by checking I/O6. Alternatively, status read mode can also be used for this purpose
(I/O 7 status polling uses the auto-erase operation end identification pin).
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• The status polling I/O6 and I/O7 pin information is retained until the next command write. Until the next command
write is performed, reading is possible by enabling CE and OE.
19.13.7
Status Read Mode
• Status read mode is used to identify what type of abnormal end has occurred. Use this mode when an abnormal end
occurs in auto-program mode or auto-erase mode.
• The return code is retained until a command write for other than status read mode is performed.
Table 19-26 AC Characteristics in Status Read Mode
Conditions: VCC = 5.0 V ±10%, VSS = 0 V, Ta = 25°C ±5°C
Item
Symbol
Min
Max
Unit
Command write cycle
t nxtc
20
—
µs
CE hold time
t ceh
0
—
ns
CE setup time
t ces
0
—
ns
Data hold time
t dh
50
—
ns
Data setup time
t ds
50
—
ns
Write pulse width
t wep
70
—
ns
OE output delay time
t oe
—
150
ns
Disable delay time
t df
—
100
ns
CE output delay time
t ce
—
150
ns
WE rise time
tr
—
30
ns
WE fall time
tf
—
30
ns
Address
CE
tnxtc
tce
OE
tnxtc
twep
WE
tceh
tces
tf
tr
tceh
tces
tf
toe
tdf
tr
tds
tds
Data
tnxtc
twep
tdh
tdh
H'71
H'71
Data
Note: I/O2 and I/O3 are undefined.
Figure 19-31 Status Read Mode Timing Waveforms
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Table 19-27 Status Read Mode Return Commands
Pin Name I/O 7
Attribute
I/O 6
Normal
Command
end
error
identification
Initial value 0
0
Indications Normal
end: 0
Command
error: 1
Abnormal
end: 1
I/O 5
I/O 4
I/O 3
I/O 2
I/O 1
Programming error
Erase
error
—
—
ProgramEffective
ming or
address error
erase count
exceeded
0
0
0
0
0
—
Count
Effective
exceeded: 1 address
Otherwise: 0 error: 1
ProgramErase
—
ming
error: 1
Otherwise: 0 error: 1
Otherwise: 0
Otherwise: 0
I/O 0
0
Otherwise: 0
Note: I/O2 and I/O3 are undefined.
19.13.8
Status Polling
• The I/O7 status polling flag indicates the operating status in auto-program or auto-erase mode.
• The I/O6 status polling flag indicates a normal or abnormal end in auto-program or auto-erase mode.
Table 19-28 Status Polling Output Truth Table
19.13.9
Pin Names
Internal Operation
in Progress
Abnormal End
—
Normal End
I/O7
0
1
0
1
I/O6
0
0
1
1
I/O0 to I/O 5
0
0
0
0
Programmer Mode Transition Time
Commands cannot be accepted during the oscillation stabilization period or the programmer mode setup period. After the
programmer mode setup time, a transition is made to memory read mode.
Table 19-29 Command Wait State Transition Time Specifications
Item
Symbol
Min
Max
Unit
Standby release (oscillation
stabilization time)
t osc1
10
—
ms
Programmer mode setup time
t bmv
10
—
ms
VCC hold time
t dwn
0
—
ms
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VCC
tosc1
tbmv
RES
tdwn
Memory read Auto-program mode
mode
Auto-erase mode
Command wait
state
FWE
Command
Don't care
wait state
Normal/
abnormal end
identification Don't care
Note: Except in auto-program mode and auto-erase mode, drive the FWE input pin low.
Figure 19-32 Oscillation Stabilization Time, Programmer Mode Setup Time, and Power Supply Fall Sequence
19.13.10
Notes on Memory Programming
• When programming addresses which have previously been programmed, carry out auto-erasing before autoprogramming.
• When performing programming using PROM mode on a chip that has been programmed/erased in an on-board
programming mode, auto-erasing is recommended before carrying out auto-programming.
Notes: 1. The flash memory is initially in the erased state when the device is shipped by Renesas Technology. For other
chips for which the erasure history is unknown, it is recommended that auto-erasing be executed to check and
supplement the initialization (erase) level.
2. Auto-programming should be performed once only on the same address block.
19.14
Flash Memory Programming and Erasing Precautions
Precautions concerning the use of on-board programming mode, the RAM emulation function, and PROM mode are
summarized below.
Use the specified voltages and timing for programming and erasing: Applied voltages in excess of the rating can
permanently damage the device. Use a PROM programmer that supports Renesas Technology microcomputer device
types with 128-kbyte on-chip flash memory.
Do not select the HN28F101 setting for the PROM programmer, and only use the specified socket adapter. Incorrect use
will result in damaging the device.
Powering on and off (see figures 19-33 to 19-35): Do not apply a high level to the FWE pin until VCC has stabilized.
Also, drive the FWE pin low before turning off VCC.
When applying or disconnecting VCC, fix the FWE pin low and place the flash memory in the hardware protection state.
The power-on and power-off timing requirements should also be satisfied in the event of a power failure and subsequent
recovery.
FWE application/disconnection (see figures 19-33 to 19-35): FWE application should be carried out when MCU
operation is in a stable condition. If MCU operation is not stable, fix the FWE pin low and set the protection state.
The following points must be observed concerning FWE application and disconnection to prevent unintentional
programming or erasing of flash memory:
• Apply FWE when the VCC voltage has stabilized within its rated voltage range. Apply FWE when oscillation has
stabilized (after the elapse of the oscillation settling time).
• In boot mode, apply and disconnect FWE during a reset.
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• In user program mode, FWE can be switched between high and low level regardless of the reset state. FWE input can
also be switched during program execution in flash memory.
• Do not apply FWE if program runaway has occurred.
• Disconnect FWE only when the SWE, ESU, PSU, EV, PV, P, and E bits in FLMCR1 and FLMCR2 are cleared.
• Make sure that the SWE, ESU, PSU, EV, PV, P, and E bits are not set by mistake when applying or disconnecting
FWE.
Do not apply a constant high level to the FWE pin: Apply a high level to the FWE pin only when programming or
erasing flash memory. A system configuration in which a high level is constantly applied to the FWE should be avoided.
Also, while a high level is applied to the FWE pin, the watchdog timer should be activated to prevent overprogramming or
overerasing due to program runaway, etc.
Use the recommended algorithm when programming and erasing flash memory: The recommended algorithm
enables programming and erasing to be carried out without subjecting the device to voltage stress or sacrificing program
data reliability. When setting the P or E bit in FLMCR1, the watchdog timer should be set beforehand as a precaution
against program runaway, etc.
Do not set or clear the SWE bit during program execution in flash memory: Clear the SWE bit before executing a
program or reading data in flash memory. When the SWE bit is set, data in flash memory can be rewritten, but flash
memory should only be accessed for verify operations (verification during programming/erasing). Similarly, when using
the RAM emulation function while a high level is being input to the FWE pin, the SWE bit must be cleared before
executing a program or reading data in flash memory. However, the RAM area overlapping flash memory space can be
read and written to regardless of whether the SWE bit is set or cleared.
Do not use interrupts while flash memory is being programmed or erased: All interrupt requests, including NMI,
should be disabled during FWE application to give priority to program/erase operations.
Do not perform additional programming. Erase the memory before reprogramming. In on-board programming,
perform only one programming operation on a 32-byte programming unit block. In PROM mode, too, perform only one
programming operation on a 128-byte programming unit block. Programming should be carried out with the entire
programming unit block erased.
Before programming, check that the chip is correctly mounted in the PROM programmer. Overcurrent damage to
the device can result if the index marks on the PROM programmer socket, socket adapter, and chip are not correctly
aligned.
Do not touch the socket adapter or chip during programming. Touching either of these can cause contact faults and
write errors.
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Wait time: x
Programming and
erase possible
φ
min 0 µs
t OSC1
VCC
t MDS* 3
FWE
min 0 µs
MD2 to MD0 * 1
t MDS* 3
RES
SWE
set
SWE
clear
SWE bit
Flash memory access disabled period
(x: Wait time after SWE setting) * 2
Flash memory reprogrammable period
(Flash memory program execution and data read, other than verify, are disabled.)
Notes:
1.
Always fix the level by pulling down or pulling up the mode pins (MD2 to MD0)
until powering off, except for mode switching.
2.
See section 22.7.6, Flash Memory Characteristics.
3.
Mode programming setup time tMDS (min) = 200 ns
Figure 19-33 Powering On/Off Timing (Boot Mode)
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Wait time: x
Programming and
erase possible
φ
min 0 µs
t OSC1
VCC
FWE
MD 2 to MD 0 * 1
t MDS* 3
RES
SWE
set
SWE
clear
SWE bit
Flash memory access disabled period
(x: Wait time after SWE setting) * 2
Flash memory reprogrammable period
(Flash memory program execution and data read, other than verify, are disabled.)
Notes:
1.
Always fix the level by pulling down or pulling up the mode pins (MD2 to MD0)
up to powering off, except for mode switching.
2.
See section 22.7.6, Flash Memory Characteristics.
3.
Mode programming setup time tMDS (min) = 200 ns
Figure 19-34 Powering On/Off Timing (User Program Mode)
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Programming
and
Wait
erase
Wait time: x possible time: x
Programming and
Wait time: x
erase possible
Programming and
erase possible
Wait
time: x
Programming
and
erase
possible
φ
t OSC1
VCC
min 0µs
FWE
*2
t MDS
t MDS
MD 2 to MD 0
t MDS
tRESW
RES
SWE set
SWE clear
SWE bit
Mode switching * 1
Boot mode Mode
User
switching * 1 mode
User program mode
User
mode
Flash memory access disabled period
(x: Wait time after SWE setting) * 3
Flash memory reprogammable period
(Flash memory program execution and data read, other than verify, are disabled.)
Notes: 1. In transition to the boot mode and transition from the boot mode to another mode,
mode switching via RES input is necessary.
During this switching period (period during which a low level is input to the RES pin),
the state of the address dual port and bus control output signals (AS,RD,WR) changes.
Therefore, do not use these pins as output signals during this switching period.
2. When making a transition from the boot mode to another mode, the mode programming
setup time tMDS (min)= 200 ns relative to the RES clear timing is necessary.
3. See section 22.7.6, Flash Memory Characteristics.
Figure 19-35 Mode Transition Timing
(Example: Boot mode → User mode ↔ User program mode)
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User
program
mode
19.15
Overview of Flash Memory (H8S/2398 F-ZTAT)
19.15.1
Features
The H8S/2398 F-ZTAT have 256 kbytes of on-chip flash memory. The features of the flash memory are summarized
below.
• Four flash memory operating modes
 Program mode
 Erase mode
 Program-verify mode
 Erase-verify mode
• Programming/erase methods
The flash memory is programmed 128 bytes at a time. Erasing is performed by block erase (in single-block units). To
erase the entire flash memory, the individual blocks must be erased sequentially. Block erasing can be performed as
required on 4-kbyte, 32-kbyte, and 64-kbyte blocks.
• Programming/erase times
The flash memory programming time is 10 ms (typ.) for simultaneous 128-byte programming, equivalent to 78 µs
(typ.) per byte, and the erase time is 50 ms (typ.).
• Reprogramming capability
Depending on the product, the maximum number of times the flash memory can be reprogrammed is either 100 or
1,000.
 Reprogrammable up to 100 times: HD64F2398TE, HD64F2398F
 Reprogrammable up to 1,000 times: HD64F2398TET, HD64F2398FT
• On-board programming modes
There are two modes in which flash memory can be programmed/erased/verified on-board:
 Boot mode
 User program mode
• Automatic bit rate adjustment
With data transfer in boot mode, the bit rate of the chip can be automatically adjusted to match the transfer bit rate of
the host.
• Flash memory emulation by RAM
Part of the RAM area can be overlapped onto flash memory, to emulate flash memory updates in real time.
• Protect modes
There are three protect modes, hardware, software, and error protect, which allow protected status to be designated for
flash memory program/erase/verify operations.
• Programmer mode
Flash memory can be programmed/erased in programmer mode, using a PROM programmer, as well as in on-board
programming mode.
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19.15.2
Overview
Block Diagram
Internal address bus
Module bus
Internal data bus (16 bits)
FLMCR1
FLMCR2
Bus interface/controller
EBR1
Operating
mode
EBR2
RAMER
SYSCR2
Flash memory
(256 kbytes)
Legend:
FLMCR1:
FLMCR2:
EBR1:
EBR2:
RAMER:
SYSCR2:
Flash memory control register 1
Flash memory control register 2
Erase block register 1
Erase block register 2
RAM emulation register
System control register 2
Figure 19-36 Block Diagram of Flash Memory
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Mode pins
19.15.3
Flash Memory Operating Modes
Mode Transitions: When the mode pins are set in the reset state and a reset-start is executed, the chip enters one of the
operating modes shown in figure 19-37. In user mode, flash memory can be read but not programmed or erased.
Flash memory can be programmed and erased in boot mode, user program mode, and PROM mode.
MD1 = 1,
MD2 = 1
RES = 0
User mode
(on-chip ROM
enabled)
SWE = 1
Reset state
RES = 0
RES = 0
SWE = 0
MD1 = 1,
MD2 = 0
*
RES = 0
Programmer mode
User
program mode
Boot mode
On-board programming mode
Notes: Only make a transition between user mode and user program mode when the CPU is
not accessing the flash memory.
* MD0 = 0, MD1 = 0, MD2 = 0, P66 = 1, P65 = 0, P64 = 0
Figure 19-37 Flash Memory Mode Transitions
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19.15.4
On-Board Programming Modes
• Boot mode
2. Programming control program transfer
When boot mode is entered, the boot program in
the chip (originally incorporated in the chip) is
started and the programming control program in
the host is transferred to RAM via SCI
communication. The boot program required for
flash memory erasing is automatically transferred
to the RAM boot program area.
"#,!
1. Initial state
The old program version or data remains written
in the flash memory. The user should prepare the
programming control program and new
application program beforehand in the host.
Host
Host
Programming control
program
New application
program
New application
program
Chip
Chip
SCI
Boot program
Flash memory
SCI
Boot program
Flash memory
RAM
RAM
Boot program area
Application program
(old version)
Application program
(old version)
3. Flash memory initialization
The erase program in the boot program area (in
RAM) is executed, and the flash memory is
initialized (to H'FF). In boot mode, entire flash
memory erasure is performed, without regard to
blocks.
Host
Programming control
program
4. Writing new application program
The programming control program transferred
from the host to RAM is executed, and the new
application program in the host is written into the
flash memory.
Host
New application
program
Chip
Chip
SCI
Boot program
Flash memory
RAM
Flash memory
Boot program area
Flash memory
prewrite-erase
Programming control
program
SCI
Boot program
RAM
Boot program area
New application
program
Programming control
program
Program execution state
Figure 19-38 Boot Mode
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REJ09B0138-0600H
• User program mode
2. Programming/erase control program transfer
Executes the transfer program in the flash
memory, and transfers the programming/erase
control program to RAM.
,
,
! 1. Initial state
(1) The program that will transfer the
programming/erase control program to on-chip
RAM should be written into the flash memory by
the user beforehand. (2) The programming/erase
control program should be prepared in the host
or in the flash memory.
Host
Host
Programming/
erase control program
New application
program
New application
program
Chip
Chip
SCI
Boot program
Flash memory
SCI
Boot program
RAM
Flash memory
Transfer program
RAM
Transfer program
Programming/
erase control program
Application program
(old version)
Application program
(old version)
3. Flash memory initialization
The programming/erase program in RAM is
executed, and the flash memory is initialized (to
H'FF). Erasing can be performed in block units,
but not in byte units.
4. Writing new application program
Next, the new application program in the host is
written into the erased flash memory blocks. Do
not write to unerased blocks.
Host
Host
New application
program
Chip
Chip
SCI
Boot program
Flash memory
RAM
Flash memory
RAM
Transfer program
Transfer program
Programming/
erase control program
Flash memory
erase
SCI
Boot program
Programming/
erase control program
New application
program
Program execution state
Figure 19-39 User Program Mode (Example)
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19.15.5
Flash Memory Emulation in RAM
Reading Overlap RAM Data in User Mode and User Program Mode: Emulation should be performed in user mode or
user program mode. When the emulation block set in RAMER is accessed while the emulation function is being executed,
data written in the overlap RAM is read.
SCI
Flash memory
RAM
Emulation block
Overlap RAM
(emulation is performed
on data written in RAM)
Application program
Execution state
Figure 19-40 Reading Overlap RAM Data in User Mode and User Program Mode
Writing Overlap RAM Data in User Program Mode: When overlap RAM data is confirmed, the RAMS bit is cleared,
RAM overlap is released, and writes should actually be performed to the flash memory.
When the programming control program is transferred to RAM, ensure that the transfer destination and the overlap RAM
do not overlap, as this will cause data in the overlap RAM to be rewritten.
SCI
Flash memory
RAM
Programming data
Overlap RAM
(programming data)
Programming control
program
Execution state
Application program
Figure 19-41 Writing Overlap RAM Data in User Program Mode
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19.15.6
Differences between Boot Mode and User Program Mode
Table 19-30 Differences between Boot Mode and User Program Mode
Boot Mode
User Program Mode
Entire memory erase
Yes
Yes
Block erase
No
Yes
Programming control program*
Program/program-verify
Erase/erase-verify/program/
program-verify/emulation
Note: * To be provided by the user, in accordance with the recommended algorithm.
19.15.7
Block Configuration
Products include 256 kbytes of flash memory are divided into three 64-kbyte blocks, one 32-kbyte block, and eight 4kbyte blocks.
Address H'00000
4 kbytes × 8
256 kbytes
32 kbytes
64 kbytes
64 kbytes
64 kbytes
Address H'3FFFF
Figure 19-42 Flash Memory Block Configuration
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19.15.8
Pin Configuration
The flash memory is controlled by means of the pins shown in table 19-31.
Table 19-31 Flash Memory Pins
19.15.9
Pin Name
Abbreviation
I/O
Function
Reset
RES
Input
Reset
Mode 2
MD2
Input
Sets MCU operating mode
Mode 1
MD1
Input
Sets MCU operating mode
Mode 0
MD0
Input
Sets MCU operating mode
Port 66
P66
Input
Sets MCU operating mode in programmer mode
Port 65
P65
Input
Sets MCU operating mode in programmer mode
Port 64
P64
Input
Sets MCU operating mode in programmer mode
Transmit data
TxD1
Output
Serial transmit data output
Receive data
RxD1
Input
Serial receive data input
Register Configuration
The registers used to control the on-chip flash memory when enabled are shown in table 19-32.
In order to access the FLMCR1, FLMCR2, EBR1, and EBR2 registers, the FLSHE bit must be set to 1 in SYSCR2
(except RAMER).
Table 19-32 Flash Memory Registers
Register Name
Abbreviation R/W
Initial Value
Address* 1
Flash memory control register 1
FLMCR1* 5
R/W*3
H'80
H'FFC8* 2
Flash memory control register 2
FLMCR2* 5
R/W*3
H'00* 4
H'FFC9* 2
Erase block register 1
EBR1* 5
R/W*3
H'00* 4
H'FFCA* 2
Erase block register 2
EBR2* 5
R/W*3
H'00* 4
H'FFCB* 2
System control register 2
SYSCR2* 6
R/W
H'00
H'FF42
RAM emulation register
RAMER
R/W
H'00
H'FEDB
Notes: 1.
2.
3.
4.
5.
Lower 16 bits of the address.
Flash memory. Registers selection is performed by the FLSHE bit in system control register 2 (SYSCR2).
In modes in which the on-chip flash memory is disabled, a read will return H'00, and writes are invalid.
If a high level is input and the SWE bit in FLMCR1 is not set, these registers are initialized to H'00.
FLMCR1, FLMCR2, EBR1, and EBR2 are 8-bit registers. Only byte accesses are valid for these registers, the
access requiring 2 states.
6. The SYSCR2 register can only be used in the F-ZTAT version. In the masked ROM version this register will
return an undefined value if read, and cannot be modified.
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19.16
Register Descriptions
19.16.1
Flash Memory Control Register 1 (FLMCR1)
Bit
:
7
6
5
4
3
2
1
0
FWE
SWE
ESU
PSU
EV
PV
E
P
Initial value :
1
0
0
0
0
0
0
0
R/W
R
R/W
R/W
R/W
R/W
R/W
R/W
R/W
:
FLMCR1 is an 8-bit register used for flash memory operating mode control. Program-verify mode or erase-verify mode is
entered by setting SWE to 1, then setting the EV or PV bit. Program mode is entered by setting SWE to 1, then setting the
PSU bit, and finally setting the P bit. Erase mode is entered by setting SWE to 1, then setting the ESU bit, and finally
setting the E bit. FLMCR1 is initialized to H'80 by a reset, and in hardware standby mode and software standby mode.
When on-chip flash memory is disabled, a read will return H'00, and writes are invalid.
Writing to bits ESU, PSU, EV, and PV in FLMCR1 is enabled only when SWE = 1; writing to the E bit is enabled only
when SWE = 1, and ESU = 1; and writing to the P bit is enabled only when SWE = 1, and PSU = 1.
Bit 7—Flash Write Enable Bit (FWE): Sets hardware protection against flash memory programming/erasing. These bits
cannot be modified and are always read as 1 in this model.
Bit 6—Software Write Enable Bit (SWE): Enables or disables flash memory programming and erasing. This bit should
be set when setting bits 5 to 0, EBR1 bits 7 to 0, and EBR2 bits 3 to 0.
When SWE = 1, the flash memory can only be read in program-verify or erase-verify mode.
Bit 6
SWE
Description
0
Writes disabled
1
Writes enabled
(Initial value)
Bit 5—Erase Setup Bit (ESU): Prepares for a transition to erase mode. Do not set the SWE, PSU, EV, PV, E, or P bit at
the same time.
Bit 5
ESU
Description
0
Erase setup cleared
1
Erase setup
(Initial value)
[Setting condition]
When SWE = 1
Bit 4—Program Setup Bit (PSU): Prepares for a transition to program mode. Do not set the SWE, ESU, EV, PV, E, or P
bit at the same time.
Bit 4
PSU
Description
0
Program setup cleared
1
Program setup
(Initial value)
[Setting condition]
When SWE = 1
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Bit 3—Erase-Verify (EV): Selects erase-verify mode transition or clearing. Do not set the SWE, ESU, PSU, PV, E, or P
bit at the same time.
Bit 3
EV
Description
0
Erase-verify mode cleared
1
Transition to erase-verify mode
(Initial value)
[Setting condition]
When SWE = 1
Bit 2—Program-Verify (PV): Selects program-verify mode transition or clearing. Do not set the SWE, ESU, PSU, EV,
E, or P bit at the same time.
Bit 2
PV
Description
0
Program-verify mode cleared
1
Transition to program-verify mode
(Initial value)
[Setting condition]
When SWE = 1
Bit 1—Erase (E): Selects erase mode transition or clearing. Do not set the SWE, ESU, PSU, EV, PV, or P bit at the same
time.
Bit 1
E
Description
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