HITACHI HD74AC539

HD74AC539
Dual 1-of-4 Decoder with 3-State Output
Description
The HD74AC539 contains two inpedendent decoders. Each accepts two Address (A 0, A1) input signals and
decodes them to select one of four mutually exclusive outputs. A polarity control input (P) determines
whether the outputs are active HIGH (P = L) or active LOW (P = H). An active LOW input Enable (E) is
available for data demultiplexing; data is routed to the selected output in non-inverted form in the active
LOW mode or in inverted form in the active HIGH mode. A HIGH signal on the active LOW Output
Enable (OE) input forces the 3-state outputs to the high impedance state.
Feature
• Outputs Source/Sink 24 mA
HD74AC539
Pin Arrangement
O2b 1
20 VCC
O1b 2
19 O3b
O0b 3
18 A1b
Pb 4
17 A0b
OEb 5
16 Eb
A0a 6
15 Ea
A1a 7
14 OEa
O3a 8
13 Pa
O2a 9
12 O0d
GND 10
11 O1a
(Top view)
Logic Symbol
P
A0
P
A1
E
A1
E
DECODER a
OE
DECODER b
OE
O0 O1 O2 O3
2
A0
O0 O1 O2 O3
HD74AC539
Pin Names
A0a to A1a
A0b to A1b
Ea – Eb
OEa , OEb
P a, P b
O0a to O3a
O0b to O3b
Side A Address Inputs
Side B Address Inputs
Enable Inputs (Active LOW)
Output Enable Inputs (Active LOW)
Polarity Control Inputs
Side A 3-State Outputs
Side B 3-State Outputs
Truth Table
Inputs
Outputs
Function
OE
E
A1
A0
O0
O1
O2
O3
High impedance
H
X
X
X
Z
Z
Z
Z
Disable
L
H
X
X
On = P
Active HIGH output
L
L
L
L
H
L
L
L
(P = L)
L
L
L
H
L
H
L
L
L
L
H
L
L
L
H
L
L
L
H
H
L
L
L
H
Active LOW output
L
L
L
L
L
H
H
H
(P = H)
L
L
L
H
H
L
H
H
L
L
H
L
H
H
L
H
L
L
H
H
H
H
H
L
H
L
X
Z
:
:
:
:
High Voltage Level
Low Voltage Level
Immaterial
High Impedance
3
HD74AC539
Logic Diagram (one half shown)
A1
A0
E
P
OE
O0
O1
O2
O3
Please note that this diagram is provided only for the understanding of logic operations and should not be
used to estimate propagation delays.
DC Characteristics (unless otherwise specified)
Item
Symbol
Max
Unit
Condition
Maximum quiescent supply current
I CC
80
µA
VIN = VCC or ground, VCC = 5.5 V,
Ta = Worst case
Maximum quiescent supply current
I CC
8.0
µA
VIN = VCC or ground, VCC = 5.5 V,
Ta = 25°C
4
HD74AC539
AC Characteristics: HD74AC539
Ta = +25°C
CL = 50 pF
Ta = –40°C to +85°C
CL = 50 pF
Item
Symbol
VCC (V)*1
Min
Typ
Max
Min
Max
Unit
Propagation delay
t PLH
3.3
1.0
—
15.0
1.0
18.0
ns
5.0
1.0
—
10.0
1.0
12.0
3.3
1.0
—
15.0
1.0
18.0
5.0
1.0
—
10.0
1.0
12.0
3.3
1.0
—
14.5
1.0
16.5
5.0
1.0
—
9.5
1.0
11.0
3.3
1.0
—
13.5
1.0
15.5
5.0
1.0
—
9.0
1.0
11.5
3.3
1.0
—
16.0
1.0
19.0
5.0
1.0
—
11.5
1.0
12.5
3.3
1.0
—
16.0
1.0
19.0
5.0
1.0
—
11.5
1.0
12.5
3.3
1.0
—
10.0
1.0
11.5
5.0
1.0
—
8.0
1.0
9.0
3.3
1.0
—
9.5
1.0
11.0
5.0
1.0
—
7.5
1.0
8.5
3.3
1.0
—
11.5
1.0
13.0
5.0
1.0
—
9.5
1.0
10.5
3.3
1.0
—
10.5
1.0
12.0
5.0
1.0
—
8.5
1.0
9.5
An to O n
Propagation delay
t PHL
An to O n
Propagation delay
t PLH
E to O n
Propagation delay
t PHL
E to O n
Propagation delay
t PLH
P to O n
Propagation delay
t PHL
P to O n
Propagation delay
t ZH
OE to O n
Propagation delay
t ZL
OE to O n
Propagation delay
t HZ
OE to O n
Propagation delay
t LZ
OE to O n
Note:
ns
ns
ns
ns
ns
ns
ns
ns
ns
1. Voltage Range 3.3 is 3.3 V ± 0.3 V
Voltage Range 5.0 is 5.0 V ± 0.5 V
Capacitance
Item
Symbol
Typ
Unit
Condition
Input capacitance
CIN
4.5
pF
VCC = 5.5 V
Power dissipation capacitance
CPD
60
pF
VCC = 5.0 V
5
Unit: mm
24.50
25.40 Max
6.30
11
1
7.00 Max
20
10
1.30
2.54 ± 0.25
0.48 ± 0.10
0.51 Min
1.27 Max
2.54 Min 5.08 Max
0.89
7.62
+ 0.11
0.25 – 0.05
0° – 15°
Hitachi Code
JEDEC
EIAJ
Weight (reference value)
DP-20N
—
Conforms
1.26 g
Unit: mm
12.6
13 Max
11
1
10
1.27
*0.42 ± 0.08
0.40 ± 0.06
0.10 ± 0.10
0.80 Max
*0.22 ± 0.05
0.20 ± 0.04
2.20 Max
5.5
20
0.20
7.80 +– 0.30
1.15
0° – 8°
0.70 ± 0.20
0.15
0.12 M
*Dimension including the plating thickness
Base material dimension
Hitachi Code
JEDEC
EIAJ
Weight (reference value)
FP-20DA
—
Conforms
0.31 g
Unit: mm
12.8
13.2 Max
11
1
10
0.20 ± 0.10
0.935 Max
1.27
*0.42 ± 0.08
0.40 ± 0.06
*0.27 ± 0.05
0.25 ± 0.04
2.65 Max
7.50
20
0.25
10.40 +– 0.40
1.45
0° – 8°
0.57
0.70 +– 0.30
0.15
0.12 M
*Dimension including the plating thickness
Base material dimension
Hitachi Code
JEDEC
EIAJ
Weight (reference value)
FP-20DB
Conforms
—
0.52 g
Unit: mm
6.50
6.80 Max
11
1
10
4.40
20
0.65
*0.22+0.08
–0.07
0.20 ± 0.06
1.0
0.13 M
6.40 ± 0.20
*Dimension including the plating thickness
Base material dimension
0.07 +0.03
–0.04
0.10
*0.17 ± 0.05
0.15 ± 0.04
1.10 Max
0.65 Max
0° – 8°
0.50 ± 0.10
Hitachi Code
JEDEC
EIAJ
Weight (reference value)
TTP-20DA
—
—
0.07 g
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,
copyright, trademark, or other intellectual property rights for information contained in this document.
Hitachi bears no responsibility for problems that may arise with third party’s rights, including
intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have
received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,
contact Hitachi’s sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable
failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without
written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor
products.
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