Renesas HD74LS30FPEL 8-input positive nand gate Datasheet

HD74LS30
8-input Positive NAND Gate
REJ03D0404–0200
Rev.2.00
Feb.18.2005
Features
• Ordering Information
Part Name
Package Type
Package Code
(Previous Code)
Package
Abbreviation
Taping Abbreviation
(Quantity)
HD74LS30P
DILP-14 pin
PRDP0014AB-B
(DP-14AV)
P
—
HD74LS30FPEL
SOP-14 pin (JEITA)
PRSP0014DF-B
(FP-14DAV)
FP
EL (2,000 pcs/reel)
HD74LS30RPEL
SOP-14 pin (JEDEC)
PRSP0014DE-A
(FP-14DNV)
RP
EL (2,500 pcs/reel)
Note: Please consult the sales office for the above package availability.
Pin Arrangement
A
1
14
VCC
B
2
13
NC
C
3
12
H
D
4
11
G
E
5
10
NC
F
6
9
NC
GND
7
8
Y
(Top view)
Rev.2.00, Feb.18.2005, page 1 of 5
HD74LS30
Circuit Schematic
VCC
17k
75
8k
Inputs
A
B
C
4.5k
D
Output
Y
E
F
1.5k
G
3k
H
GND
Absolute Maximum Ratings
Item
Supply voltage
Input voltage
Power dissipation
Storage temperature
Symbol
VCC
VIN
PT
Tstg
Ratings
7
7
400
–65 to +150
Unit
V
V
mW
°C
Note: Voltage value, unless otherwise noted, are with respect to network ground terminal.
Recommended Operating Conditions
Item
Supply voltage
Output current
Operating temperature
Rev.2.00, Feb.18.2005, page 2 of 5
Symbol
VCC
IOH
IOL
Topr
Min
4.75
—
—
–20
Typ
5.00
—
—
25
Max
5.25
–400
8
75
Unit
V
µA
mA
°C
HD74LS30
Electrical Characteristics
(Ta = –20 to +75 °C)
Item
II
min.
2.0
—
2.7
—
—
—
—
—
Short-circuit output
current
IOS
–20
—
–100
mA
VCC = 5.25 V
Supply current
ICCH
ICCL
—
—
—
0.35
0.6
—
0.5
1.1
–1.5
mA
mA
V
VCC = 5.25 V
VCC = 5.25 V
VCC = 4.75 V, IIN = –18 mA
Input voltage
Output voltage
Input current
Symbol
VIH
VIL
VOH
VOL
IIH
IIL
Input clamp voltage
VIK
Note: * VCC = 5 V, Ta = 25°C
typ.*
—
—
—
—
—
—
—
—
max.
—
0.8
—
0.5
0.4
20
–0.4
0.1
Unit
V
V
V
µA
mA
mA
VCC = 4.75 V, VIL = 0.8 V, IOH = –400 µA
IOL = 8 mA
VCC = 4.75 V, VIH = 2 V
IOL = 4 mA
VCC = 5.25 V, VI = 2.7 V
VCC = 5.25 V, VI = 0.4 V
VCC = 5.25 V, VI = 7 V
V
Condition
Switching Characteristics
(VCC = 5 V, Ta = 25°C)
Item
Propagation delay time
Symbol
tPLH
tPHL
min.
—
—
typ.
8
13
max.
15
20
Unit
ns
ns
Condition
CL = 15 pF, RL = 2 kΩ
Note: Refer to Test Circuit and Waveform of the Common Item "TTL Common Matter (Document No.: REJ27D00050100)".
Rev.2.00, Feb.18.2005, page 3 of 5
HD74LS30
Package Dimensions
JEITA Package Code
P-DIP14-6.3x19.2-2.54
RENESAS Code
PRDP0014AB-B
MASS[Typ.]
0.97g
Previous Code
DP-14AV
D
8
E
14
1
7
b3
Z
A1
A
Reference
Symbol
Nom
e1
7.62
D
19.2
E
6.3
L
A
θ
bp
e
Dimension in Millimeters
Min
e1
A1
0.51
bp
0.40
JEITA Package Code
P-SOP14-5.5x10.06-1.27
RENESAS Code
PRSP0014DF-B
*1
Previous Code
FP-14DAV
D
0.48
0.56
c
0.19
θ
0°
e
2.29
0.25
0.31
2.54
2.79
15°
2.39
L
2.54
MASS[Typ.]
0.23g
NOTE)
1. DIMENSIONS"*1 (Nom)"AND"*2"
DO NOT INCLUDE MOLD FLASH.
2. DIMENSION"*3"DOES NOT
INCLUDE TRIM OFFSET.
F
14
7.4
1.30
Z
( Ni/Pd/Au plating )
20.32
5.06
b3
c
Max
8
c
HE
*2
E
bp
Index mark
Reference
Symbol
Terminal cross section
( Ni/Pd/Au plating )
1
Z
*3
Nom
Max
D
10.06
10.5
E
5.50
A2
7
e
A1
bp
Dimension in Millimeters
Min
x
M
0.00
0.10
0.20
0.34
0.40
0.46
0.15
0.20
0.25
7.80
8.00
A
L1
2.20
bp
b1
c
A
c
A1
θ
y
L
Detail F
1
θ
0°
HE
7.50
e
1.27
x
0.12
y
0.15
1.42
Z
L
L
Rev.2.00, Feb.18.2005, page 4 of 5
8°
0.50
1
0.70
1.15
0.90
HD74LS30
JEITA Package Code
P-SOP14-3.95x8.65-1.27
RENESAS Code
PRSP0014DE-A
*1
MASS[Typ.]
0.13g
Previous Code
FP-14DNV
NOTE)
1. DIMENSIONS"*1 (Nom)"AND"*2"
DO NOT INCLUDE MOLD FLASH.
2. DIMENSION"*3"DOES NOT
INCLUDE TRIM OFFSET.
F
D
14
8
c
*2
Index mark
HE
E
bp
Reference
Symbol
Terminal cross section
( Ni/Pd/Au plating )
Dimension in Millimeters
Min
Nom
Max
D
8.65
9.05
E
3.95
A2
A1
7
1
Z
e
*3
bp
x
M
0.14
A
c
A1
θ
L
Detail F
0.34
0.40
0.46
0.15
0.20
0.25
6.10
6.20
b1
c
y
0.25
1.75
bp
L1
1
θ
0°
HE
5.80
e
8°
1.27
0.25
x
y
0.15
Z
0.635
L
L
Rev.2.00, Feb.18.2005, page 5 of 5
0.10
A
0.40
1
0.60
1.08
1.27
Sales Strategic Planning Div.
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
Keep safety first in your circuit designs!
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble
may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage.
Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits,
(ii) use of nonflammable material or (iii) prevention against any malfunction or mishap.
Notes regarding these materials
1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's
application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party.
2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data,
diagrams, charts, programs, algorithms, or circuit application examples contained in these materials.
3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of
publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is
therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product
information before purchasing a product listed herein.
The information described here may contain technical inaccuracies or typographical errors.
Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors.
Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor
home page (http://www.renesas.com).
4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to
evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes
no responsibility for any damage, liability or other loss resulting from the information contained herein.
5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life
is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a
product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater
use.
6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials.
7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and
cannot be imported into a country other than the approved destination.
Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited.
8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein.
http://www.renesas.com
RENESAS SALES OFFICES
Refer to "http://www.renesas.com/en/network" for the latest and detailed information.
Renesas Technology America, Inc.
450 Holger Way, San Jose, CA 95134-1368, U.S.A
Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501
Renesas Technology Europe Limited
Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K.
Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900
Renesas Technology Hong Kong Ltd.
7th Floor, North Tower, World Finance Centre, Harbour City, 1 Canton Road, Tsimshatsui, Kowloon, Hong Kong
Tel: <852> 2265-6688, Fax: <852> 2730-6071
Renesas Technology Taiwan Co., Ltd.
10th Floor, No.99, Fushing North Road, Taipei, Taiwan
Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999
Renesas Technology (Shanghai) Co., Ltd.
Unit2607 Ruijing Building, No.205 Maoming Road (S), Shanghai 200020, China
Tel: <86> (21) 6472-1001, Fax: <86> (21) 6415-2952
Renesas Technology Singapore Pte. Ltd.
1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632
Tel: <65> 6213-0200, Fax: <65> 6278-8001
© 2005. Renesas Technology Corp., All rights reserved. Printed in Japan.
Colophon .2.0
Similar pages