RENESAS HD74LV07ATELL

HD74LV07A
Hex Buffers / Drivers with Open Drain Outputs
REJ03D0231–0600
Rev.6.00
Dec 22, 2005
Description
The HD74LV07A has six buffers / drivers with open drain outputs in a 14-pin package.
Low-voltage and high-speed operation is suitable for the battery-powered products (e.g., notebook computers), and the
low-power consumption extends the battery life.
Features
•
•
•
•
•
•
•
VCC = 2.0 V to 5.5 V operation
All inputs VIH (Max.) = 5.5 V (@VCC = 0 V to 5.5 V)
All outputs VO (Max.) = 5.5 V (@VCC = 0 V)
All outputs VO (Max.) = 5.5 V (@VCC = 2.0 V to 5.5 V, Output “Z” state)
Typical VOL ground bounce < 0.8 V (@VCC = 3.3 V, Ta = 25°C)
Output current: ±8 mA (@VCC = 3.0 V to 3.6 V), ±16 mA (@VCC = 4.5 V to 5.5 V)
Ordering Information
Package Code
(Previous Code)
Package
Abbreviation
Taping Abbreviation
(Quantity)
Part Name
Package Type
HD74LV07AFPEL
SOP–14 pin(JEITA)
PRSP0014DF-B
(FP–14DAV)
FP
EL (2,000 pcs/reel)
HD74LV07ARPEL
SOP–14 pin(JEDEC)
PRSP0014DE-A
(FP–14DNV)
RP
EL (2,500 pcs/reel)
HD74LV07ATELL
TSSOP–14 pin
T
PTSP0014JA-B
(TTP–14DV)
Note: Please consult the sales office for the above package availability.
ELL (2,000 pcs/reel)
Function Table
Input A
L
H
Note: H: High level
L: Low level
Z: High impedance
Rev.6.00 Dec 22, 2005 page 1 of 7
Output Y
L
Z
HD74LV07A
Pin Arrangement
1A 1
14 VCC
1Y
2
13 6A
2A
3
12 6Y
2Y 4
11 5A
3A
5
10 5Y
3Y
6
9 4A
GND 7
8 4Y
(Top view)
Absolute Maximum Ratings
Symbol
Ratings
Unit
Supply voltage range
Input voltage range*1
Output voltage range*1, 2
Item
VCC
VI
VO
V
V
V
Input clamp current
Output clamp current
Continuous output current
IIK
IOK
IO
–0.5 to 7.0
–0.5 to 7.0
–0.5 to VCC + 0.5
–0.5 to 7.0
–20
±50
±35
mA
mA
mA
±50
mA
785
500
–65 to 150
mW
Continuous current through
VCC or GND
Maximum power dissipation at
3
Ta = 25°C (in still air)*
Storage temperature
ICC or
IGND
PT
Tstg
Conditions
Output: L
VCC: OFF or Output: Z
VI < 0
VO < 0
VO = 0 to VCC
SOP
TSSOP
°C
Notes: The absolute maximum ratings are values, which must not individually be exceeded, and furthermore, no two of
which may be realized at the same time.
1. The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are
observed.
2. This value is limited to 7.0 V maximum.
3. The maximum package power dissipation was calculated using a junction temperature of 150°C.
Rev.6.00 Dec 22, 2005 page 2 of 7
HD74LV07A
Recommended Operating Conditions
Item
Supply voltage range
Input voltage range
Output voltage range
Output current
Symbol
VCC
VI
VO
IOL
Input transition rise or fall rate
∆t / ∆v
Operating free-air temperature
Ta
Min
2.0
0
0
—
—
—
—
0
0
0
–40
Max
5.5
5.5
5.5
50
2
8
16
200
100
20
85
Unit
V
V
V
µA
mA
Conditions
VCC = 2.0 V
VCC = 2.3 to 2.7 V
VCC = 3.0 to 3.6 V
VCC = 4.5 to 5.5 V
VCC = 2.3 to 2.7 V
VCC = 3.0 to 3.6 V
VCC = 4.5 to 5.5 V
ns/V
°C
Note: Unused or floating inputs must be held high or low.
Logic Diagram
A
Y
DC Electrical Characteristics
Ta = –40 to 85°C
Item
Input voltage
Symbol
VIH
Input current
IIN
Off state output
current
IOZ
VCC (V)*
2.0
2.3 to 2.7
3.0 to 3.6
4.5 to 5.5
2.0
2.3 to 2.7
3.0 to 3.6
4.5 to 5.5
Min to Max
2.3
3.0
4.5
0 to 5.5
Min to Max
Quiescent supply
current
ICC
5.5
VIL
Output voltage
VOL
Min
1.5
VCC × 0.7
VCC × 0.7
VCC × 0.7
—
—
—
—
—
—
—
—
—
—
Typ
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Max
—
—
—
—
0.5
VCC × 0.3
VCC × 0.3
VCC × 0.3
0.1
0.4
0.44
0.55
±1
2.5
Unit
V
µA
µA
IOL = 50 µA
IOL = 2 mA
IOL = 8 mA
IOL = 16 mA
VIN = 5.5 V or GND
VO = 5.5 V
—
—
20
µA
VIN = VCC or GND, IO = 0
V
Test Conditions
0
—
—
5
µA
VI or VO = 0 to 5.5 V
IOFF
Output leakage
current
Input capacitance
CIN
3.3
—
2.3
—
pF
VI = VCC or GND
Note: For conditions shown as Min or Max, use the appropriate values under recommended operating conditions.
Rev.6.00 Dec 22, 2005 page 3 of 7
HD74LV07A
Switching Characteristics
VCC = 2.5 ± 0.2 V
Item
Symbol
tPLH
Propagation
delay time
tPHL
Ta = 25°C
Min Typ Max
—
4.7 10.4
—
9.5 15.2
—
5.4 10.4
—
7.9 15.2
Ta = –40 to 85°C
Min
Max
1.0
13.0
1.0
18.0
1.0
13.0
1.0
18.0
Ta = 25°C
Min Typ Max
—
4.0
7.1
—
7.3 10.6
—
4.3
7.1
—
5.8 10.6
Ta = –40 to 85°C
Min
Max
1.0
8.5
1.0
12.0
1.0
8.5
1.0
12.0
Ta = 25°C
Min Typ Max
Ta = –40 to 85°C
Min
Max
Unit
ns
Test
Conditions
CL = 15 pF
CL = 50 pF
CL = 15 pF
CL = 50 pF
FROM
(Input)
TO
(Output)
A
Y
VCC = 3.3 ± 0.3 V
Item
Symbol
tPLH
Propagation
delay time
tPHL
Unit
ns
Test
Conditions
CL = 15 pF
CL = 50 pF
CL = 15 pF
CL = 50 pF
FROM
(Input)
TO
(Output)
A
Y
VCC = 5.0 ± 0.5 V
Item
Symbol
tPLH
Propagation
delay time
tPHL
—
—
—
—
3.3
5.6
3.4
4.1
5.5
7.5
5.5
7.5
1.0
1.0
1.0
1.0
Unit
6.5
8.5
6.5
8.5
ns
Test
Conditions
CL = 15 pF
CL = 50 pF
CL = 15 pF
CL = 50 pF
FROM
(Input)
TO
(Output)
A
Y
Operating Characteristics
CL = 50 pF
Item
Symbol
VCC (V)
Power dissipation capacitance
CPD
3.3
5.0
Min
—
—
Ta = 25°C
Typ
9.6
11.4
Max
—
—
Unit
pF
Test Conditions
f = 10 MHz
Noise Characteristics
CL = 50 pF
Item
Symbol
VCC (V)
Quiet output, maximum
dynamic VOL
VOL (P)
Quiet output, minimum
dynamic VOL
Ta = 25°C
Unit
3.3
Min
—
Typ
0.3
Max
0.8
VOL (V)
3.3
—
–0.1
–0.8
V
High-level dynamic input
voltage
VIH (D)
3.3
2.31
—
—
V
Low-level dynamic input
voltage
VIL (D)
3.3
—
—
0.99
V
Rev.6.00 Dec 22, 2005 page 4 of 7
V
Test Conditions
HD74LV07A
Test Circuit
VCC
RL = 1 kΩ
CL
Note: CL includes the probe and jig capacitance.
• Waveform − 1
Input
tf
90%
50% VCC
tr
10%
10%
tPHL
90%
50% VCC
VCC
0V
tPLH
VOH
Output
50% VCC
VOL + 0.3 V
VOL
Notes: 1. Input waveform: PRR ≤ 1 MHz, Zo = 50 Ω, tr ≤ 3 ns, tf ≤ 3 ns
2. The output are measured one at a time with one transition per measurement.
Rev.6.00 Dec 22, 2005 page 5 of 7
HD74LV07A
Package Dimensions
JEITA Package Code
P-SOP14-3.95x8.65-1.27
RENESAS Code
PRSP0014DE-A
*1
Previous Code
FP-14DNV
MASS[Typ.]
0.13g
NOTE)
1. DIMENSIONS"*1 (Nom)"AND"*2"
DO NOT INCLUDE MOLD FLASH.
2. DIMENSION"*3"DOES NOT
INCLUDE TRIM OFFSET.
F
D
14
8
c
*2
Index mark
HE
E
bp
Terminal cross section
( Ni/Pd/Au plating )
Reference Dimension in Millimeters
Symbol
Min
1
7
*3
e
Z
bp
x
M
A
L1
A1
θ
L
y
Detail F
JEITA Package Code
P-SOP14-5.5x10.06-1.27
RENESAS Code
PRSP0014DF-B
*1
Previous Code
FP-14DAV
D
E
A2
A1
A
bp
b1
c
c1
θ
HE
e
x
y
Z
L
L1
Nom Max
8.65 9.05
3.95
0.10 0.14 0.25
1.75
0.34 0.40 0.46
0.15 0.20 0.25
0°
8°
5.80 6.10 6.20
1.27
0.25
0.15
0.635
0.40 0.60 1.27
1.08
MASS[Typ.]
0.23g
D
F
14
NOTE)
1. DIMENSIONS"*1 (Nom)"AND"*2"
DO NOT INCLUDE MOLD FLASH.
2. DIMENSION"*3"DOES NOT
INCLUDE TRIM OFFSET.
8
c
HE
*2
E
bp
Index mark
Terminal cross section
( Ni/Pd/Au plating )
1
Z
7
e
*3
bp
x
Reference Dimension in Millimeters
Symbol
M
A
L1
A1
θ
y
L
Detail F
Rev.6.00 Dec 22, 2005 page 6 of 7
D
E
A2
A1
A
bp
b1
c
c1
θ
HE
e
x
y
Z
L
L1
Min Nom Max
10.06 10.5
5.50
0.00 0.10 0.20
2.20
0.34 0.40 0.46
0.15 0.20 0.25
0°
8°
7.50 7.80 8.00
1.27
0.12
0.15
1.42
0.50 0.70 0.90
1.15
HD74LV07A
JEITA Package Code
P-TSSOP14-4.4x5-0.65
RENESAS Code
PTSP0014JA-B
*1
Previous Code
TTP-14DV
MASS[Typ.]
0.05g
D
F
14
8
NOTE)
1. DIMENSIONS"*1 (Nom)"AND"*2"
DO NOT INCLUDE MOLD FLASH.
2. DIMENSION"*3"DOES NOT
INCLUDE TRIM OFFSET.
HE
c
*2
E
bp
Index mark
Terminal cross section
( Ni/Pd/Au plating )
1
Reference Dimension in Millimeters
Symbol
7
*3
Z
bp
x
M
L1
A
e
A1
θ
L
y
Detail F
Rev.6.00 Dec 22, 2005 page 7 of 7
D
E
A2
A1
A
bp
b1
c
c1
θ
HE
e
x
y
Z
L
L1
Min Nom Max
5.00 5.30
4.40
0.03 0.07 0.10
1.10
0.15 0.20 0.25
0.10 0.15 0.20
0°
8°
6.20 6.40 6.60
0.65
0.13
0.10
0.83
0.4 0.5 0.6
1.0
Sales Strategic Planning Div.
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
Keep safety first in your circuit designs!
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble
may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage.
Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary
circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap.
Notes regarding these materials
1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's
application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party.
2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data,
diagrams, charts, programs, algorithms, or circuit application examples contained in these materials.
3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of
publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is
therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product
information before purchasing a product listed herein.
The information described here may contain technical inaccuracies or typographical errors.
Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors.
Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor
home page (http://www.renesas.com).
4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to
evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes
no responsibility for any damage, liability or other loss resulting from the information contained herein.
5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life
is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a
product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater
use.
6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials.
7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and
cannot be imported into a country other than the approved destination.
Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited.
8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein.
http://www.renesas.com
RENESAS SALES OFFICES
Refer to "http://www.renesas.com/en/network" for the latest and detailed information.
Renesas Technology America, Inc.
450 Holger Way, San Jose, CA 95134-1368, U.S.A
Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501
Renesas Technology Europe Limited
Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K.
Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900
Renesas Technology (Shanghai) Co., Ltd.
Unit 205, AZIA Center, No.133 Yincheng Rd (n), Pudong District, Shanghai 200120, China
Tel: <86> (21) 5877-1818, Fax: <86> (21) 6887-7898
Renesas Technology Hong Kong Ltd.
7th Floor, North Tower, World Finance Centre, Harbour City, 1 Canton Road, Tsimshatsui, Kowloon, Hong Kong
Tel: <852> 2265-6688, Fax: <852> 2730-6071
Renesas Technology Taiwan Co., Ltd.
10th Floor, No.99, Fushing North Road, Taipei, Taiwan
Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999
Renesas Technology Singapore Pte. Ltd.
1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632
Tel: <65> 6213-0200, Fax: <65> 6278-8001
Renesas Technology Korea Co., Ltd.
Kukje Center Bldg. 18th Fl., 191, 2-ka, Hangang-ro, Yongsan-ku, Seoul 140-702, Korea
Tel: <82> (2) 796-3115, Fax: <82> (2) 796-2145
Renesas Technology Malaysia Sdn. Bhd
Unit 906, Block B, Menara Amcorp, Amcorp Trade Centre, No.18, Jalan Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia
Tel: <603> 7955-9390, Fax: <603> 7955-9510
© 2005. Renesas Technology Corp., All rights reserved. Printed in Japan.
Colophon .5.0