HSMC HE8050S Npn epitaxial planar transistor Datasheet

HI-SINCERITY
Spec. No. : HE6110
Issued Date : 1992.09.30
Revised Date : 2001.07.18
Page No. : 1/4
MICROELECTRONICS CORP.
HE8050S
NPN EPITAXIAL PLANAR TRANSISTOR
Description
The HE8050S is designed for general purpose amplifier applications.
Absolute Maximum Ratings
• Maximum Temperatures
Storage Temperature ............................................................................................ -55 ~ +150 °C
Junction Temperature ................................................................................... +150 °C Maximum
• Maximum Power Dissipation
Total Power Dissipation (Ta=25°C) ............................................................................... 625 mW
• Maximum Voltages and Currents (Ta=25°C)
VCBO Collector to Base Voltage ........................................................................................ 25 V
VCEO Collector to Emitter Voltage ..................................................................................... 20 V
VEBO Emitter to Base Voltage ............................................................................................. 5 V
IC Collector Current ....................................................................................................... 700 mA
Characteristics (Ta=25°C)
Symbol
BVCBO
BVCEO
BVEBO
ICBO
IEBO
*VCE(sat)
VBE(on)
*hFE1
*hFE2
fT
Cob
Min.
25
20
5
100
150
-
Typ.
140
-
Max.
1
100
0.5
1
500
10
Unit
V
V
V
uA
nA
V
V
MHz
pF
Test Conditions
IC=10uA, IE=0
IC=1mA, IB=0
IE=10uA, IC=0
VCB=20V, IE=0
VEB=5V, IC=0
IC=0.5A, IB=50mA
VCE=1V, IC=150mA
VCE=1V, IC=150mA
VCE=1V, IC=500mA
VCE=10V, IC=20mA, f=100MHz
VCB=10V, f=1MHz, IE=0
*Pulse Test : Pulse Width ≤380us, Duty Cycle≤2%
Classifications of hFE
Rank
hFE1
hFE2
HE8050S
C
100-180
-
C1
100-180
>50
D
160-300
-
D1
160-300
>50
E
250-500
-
HSMC Product Specification
HI-SINCERITY
Spec. No. : HE6110
Issued Date : 1992.09.30
Revised Date : 2001.07.18
Page No. : 2/4
MICROELECTRONICS CORP.
Characteristics Curve
Current Gain & Collector Current
Saturation Voltage & Collector Current
1000
Saturation Voltage (mV)
hFE
1000
VCE=1V
100
100
VCE(sat) @ IC=10IB
10
10
0.1
1
10
100
0.1
1000
1
Collector Current (mA)
100
1000
Cutoff Frequency & Collector Current
On Voltage & Collector Current
1000
Cutoff Frequency (MHz)
10000
On Voltage (mV)
10
Collector Current (mA)
1000
VBE(on) @ VCE=1V
VCE=10V
100
10
100
0.1
1
10
100
1
1000
10
100
1000
Collector Current (mA)
Collector Current (mA)
Capacitance & Reverse-Biased Voltage
Safe Operating Area
100
10000
PT=1ms
Collector Current-IC (mA)
Capacitance (pF)
PT=100ms
10
Cob
1
1000
PT=1s
100
10
1
0.1
1
10
Reverse Biased Voltage (V)
HE8050S
100
1
10
100
Forward Voltage-VCE (V)
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6110
Issued Date : 1992.09.30
Revised Date : 2001.07.18
Page No. : 3/4
PD-Ta
700
Power Dissipation-PD(mW)
600
500
400
300
200
100
0
0
20
40
60
80
100
120
140
160
o
Ambient Temperature-Ta( C)
HE8050S
HSMC Product Specification
HI-SINCERITY
Spec. No. : HE6110
Issued Date : 1992.09.30
Revised Date : 2001.07.18
Page No. : 4/4
MICROELECTRONICS CORP.
TO-92 Dimension
α2
A
Marking :
HSMC Logo
B
1 2
Product Series
Part Number
3
Date Code
Rank
α3
C
Laser Mark
HSMC Logo
Product Series
D
Part Number
H
I
G
Ink Mark
α1
Style : Pin 1.Emitter 2.Collector 3.Base
E
F
3-Lead TO-92 Plastic Package
HSMC Package Code : A
*:Typical
Inches
Min.
Max.
0.1704 0.1902
0.1704 0.1902
0.5000
0.0142 0.0220
*0.0500
0.1323 0.1480
DIM
A
B
C
D
E
F
Millimeters
Min.
Max.
4.33
4.83
4.33
4.83
12.70
0.36
0.56
*1.27
3.36
3.76
DIM
G
H
I
α1
α2
α3
Inches
Min.
Max.
0.0142 0.0220
*0.1000
*0.0500
*5°
*2°
*2°
Millimeters
Min.
Max.
0.36
0.56
*2.54
*1.27
*5°
*2°
*2°
Notes : 1.Dimension and tolerance based on our Spec. dated Apr. 25,1996.
2.Controlling dimension : millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material :
• Lead : 42 Alloy ; solder plating
• Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory :
• Head Office (Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454
• Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel : 886-3-5983621~5 Fax : 886-3-5982931
HE8050S
HSMC Product Specification
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