KING BILLION ELECTRONICS CO., LTD 駿 億 電 子 股 份 有 限 公 司 HE83115 HE80000 SERIES A.HE83115 Introduction HE83115 is a member of 8-bit Micro-controller series developed by King Billion Electronics Ltd. Users can chose any one of combination among 【80 dots LCD Driver + 12 Bit I/O Port】…【48 dots LCD Driver + 20 Bit I/O Port】etc. The built-in OP comparator can be used with (light、voice、 temperature、humility) sensor and used as battery low detection. And the 7-bit current-type D/A converter and PWM device provide the complete speech output mechanism. The 64K ROM Size can be used in the storage of speech (20 seconds at 3Kbytes per second), graphic, text etc. This IC is applicable to the small systems such as sport match, sport recorder, digital watch etc.. The instruction set of HE83115 are quite easy to learn and simple to use. Only about thirty instructions with four-type addressing mode are provided. Most of instructions take only 3 oscillator clocks (machine cycles). The processing power is enough to most of battery operation system. B.HE83115 Features z Operation Voltage： z System Clock： z z z z z z z z z z z z z 2.4V – 5.5V DC ~ 8MHz @ 5.0V DC ~ 4MHz @ 2.4V Internal ROM： 64K Bytes(64K Program ROM) Internal RAM： 256 Bytes. Dual Clock System ： Normal (Fast) clock： 32.768K ~ 8MHz Slow clock： 32.768KHz Operation Mode： DUAL、FAST、SLOW、IDLE、SLEEP Mode. With WDT (WATCH DOG TIMER) to prevent deadlock condition.. 12~20 bit Bi-directional I/O port. Mask Option can select PUSH-PULL or OPEN DRAIN output mode for each I/O pin. One built-in OP comparator. 80~48 dots LCD driver (A、B TYPE selectable). One 7-bit current-type DAC output. PWM device. Two external interrupts and two internal timer interrupts. Two 16-bit timer. Instruction set： 32 instructions, 4 addressing mode. 8-bit DATA POINTER for RAM and 16-bit TABLE POINTER for ROM. C.HE83115 Application Please always take in mind that ICE is different from IC. ICE is the whole set of HE80000 series IC, but each IC is a subset of ICE. Never use any hardware resource that real IC didn't have, especially RAM and register. KBIDS and compiler cannot prevent user to use some hardware resource that didn't exist. Please check the following table and refer the abbreviation in HE80000 user's manual. I.F.C. E.S.C. I.P.R PROM DROM TP TP+1 RAM 64KB — 16-bit ◎ 256B ◎ ◎ ◎ VO DAO OP PWM LCD COM*SEG Bias Rgr — 80~48 4*20 1/3 — ◎ ◎ ◎ 1 PP DP I/O DTMF WDT Timer — 8-bit 12~20 — T1,T2 ◎ ChrgPmp LV2 LR LVG REC S.R. 1,3/2,3 — — — — ◎ V3.3E KING BILLION ELECTRONICS CO., LTD 駿 億 電 子 股 份 有 限 公 司 HE83115 HE80000 SERIES D. Pin Description Pin # 43 42 Pin name FXI, FXO I/O B, O Function 46 45 SXI, SXO I, O External slow clock pin. Connecting with 32768 Hz crystal or resistor as slow clock and providing clock source for LCD display, TIMER1, Time-Base and other internal blocks. 41 RSTP_N I System Reset. 44 TSTP_P I Test Pin 1..4 PRTC[3:0] B 4-pin bi-directional I/O port. 48.. 55 PRTD[7:0] B 8-pin bi-directional I/O port. PRTD[7..2] as wake-up pin. PRTD[7..6] as external interrupt pin. 7..14 PRT14[7:0]/ B/ SEG[19:12] O 8-pin bi-directional I/O port that is shared with LCD segment pin. 27.. 30 15.. 26 32 31 35 Description External fast clock pin. Mask option setting： Connecting to crystal or RC MO_FCK/SCKN= 00：Slow Clock only to generate 32.768 kHz ~ 01：Illegal 8MHz frequency. 10：Dual Clock COM[3:0] O LCD COMmon Output SEG[11:0] O LCD SEGment Output LC2 LC1 LV3 B B B Charge Pump Switch 2 Charge Pump Switch 1 Charge Pump V3 11：Fast Clock only MO_FOSCE = 0：Internal fast osc. = 1：External fast osc. MO_FXTAL= 0：RC osc. for fast clock = 1：X’tal osc. for fast clock MO_SXTAL= 0：RC for 32768 Hz clock = 1：X’tal for 32768 Hz clock Use OP1 and OP2 to switch among different operation mode (NORMAL, SLOW, IDEL and SLEEP). In Dual Clock mode, the main system clock is still the Fast Clock. The 32768 Hz clock is for LCD and Timer 1 only. Level trigger, active low. Except for using this pin, using mask option (MO_PORE=1) could enable IC build-in power-on reset circuit. Besides, MO_WDTE can set Watch Dog Timer： MO_WDTE=0：Disable Watch Dog Timer =1：Enable Watch Dog Timer Please bond this pin and add a test point on PCB for debugging. Leave this pin floating is OK. Mask options： MO_CPP[3..0]=1 ~ Push-pull. =0 ~ Open-drain. Output must be “1” before reading whenever use them as input (No tri-state structure). Mask options： MO_DPP[7..0]=1 ~ Push-pull. =0 ~ Open-drain. Output must be “1” before reading whenever use them as input (No tri-state structure). Mask options： MO_LIO14[7..0]=1 ~ LCD Pin. =0 ~ I/O Pin. MO_14PP[7..0]=1 ~ Push-pull. =0 ~ Open-drain. Output must be “1” before reading whenever use them as input (No tri-state structure). LCD Data filled from F0H, please refer the LCD RAM map. Add one 0.1 µF capacitor between LC1 and LC2. Please refer the application circuit. LV3< 9 Volts. 2 V3.3E KING BILLION ELECTRONICS CO., LTD 駿 億 電 子 股 份 有 限 公 司 HE83115 HE80000 SERIES Pin # Pin name I/O 34 33 LV2 LV1 B B 5 PWMP O 6 PWMN O 37 38 39 40 47 36 VO OPIN OPIP OPO VDD GND O I I O P P Function Description Please refer the application circuit. Charge Pump V2 Charge Pump V1 The PWM positive output can drive speaker or buzzer Set the bit2 of VOC register as one to turn on PWM. directly. The PWM positive output can drive speaker or buzzer Set the bit2 of VOC register as one to turn on PWM. directly. D/A output. Bit 1 of VOC = ‘1’ , Turn on DA OPAMP negative input pin. Built-in OP comparator. OPAMP positive input pin. Set Bit 0 of VOC = ‘1’ , Turn on OP OPAMP output pin. Positive Power Input Adding 0.1 µF capacitor as by-pass capacitor on power pins is necessary.(within 1 cm distance) Power Ground Input E. LCD RAM Map Page 0: F0H F1H F2H F3H F4H SEG1 COM[3:0] SEG3 COM[3:0] SEG5 COM[3:0] SEG7 COM[3:0] SEG9 COM[3:0] SEG0 COM[3:0] SEG2 COM[3:0] SEG4 COM[3:0] SEG6 COM[3:0] SEG8 COM[3:0] 3 F5H F6H F7H F8H F9H SEG11 COM[3:0] SEG13 COM[3:0] SEG15 COM[3:0] SEG17 COM[3:0] SEG19 COM[3:0] SEG10 COM[3:0] SEG12 COM[3:0] SEG14 COM[3:0] SEG16 COM[3:0] SEG18 COM[3:0] V3.3E KING BILLION ELECTRONICS CO., LTD 駿 億 電 子 股 份 有 限 公 司 HE83115 HE80000 SERIES F. Pin Diagram P P P P P P P R P P P P P R R R R R R T R R R R R T T T T T T D T T T T T V S S C C C C D D [2] D D D D D D X X [0] [1] [2] [3] [0] [1] [3] [4] [5] [6] [7] D I O Product Name PWMP PWMN PRT14[7]/SEG[19] PRT14[6]/SEG[18] PRT14[5]/SEG[17] PRT14[4]/SEG[16] PRT14[3]/SEG[15] PRT14[2]/SEG[14] PRT14[1]/SEG[13] Die Size: A1: 2500 µm * 2140 µm。 A2: 2410 µm * 2190 µm。 Substrate connect with GND。 P R T 1 4 [0] / S E G [1 2] S E G [1 1] S E G [1 0] TSTP_P FXI FXO RSTP_N OPO OPIP OPIN VO GND LV3 LV2 S S S S S S S S S S C C C C L L L E E E E E E E E E E O O O O C C V G G G G G G G G G G M M M M 1 2 1 [9] [8] [7] [6] [5] [4] [3] [2] [1] [0] [3] [2] [1] [0] 4 V3.3E KING BILLION ELECTRONICS CO., LTD 駿 億 電 子 股 份 有 限 公 司 HE83115 HE80000 SERIES G. Bonding Pad Location Which version of IC decided by KB when customer gives order to KB. Please make sure which version will be used before you make a PCB! Version A1: PIN PIN Number Name X Coordinate 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 PRTC[3] PRTC[2] PRTC[1] PRTC[0] PWMP PWMN PRT14[7] PRT14[6] PRT14[5] PRT14[4] PRT14[3] PRT14[2] PRT14[1] PRT14[0] SEG[11] SEG[10] SEG[9] SEG[8] SEG[7] SEG[6] SEG[5] SEG[4] SEG[3] SEG[2] SEG[1] SEG[0] COM[3] X= -532.10 X= -647.60 X= -763.10 X= -878.60 X= -1173.80 X= -1173.80 X= -1173.80 X= -1173.80 X= -1173.80 X= -1173.80 X= -1173.80 X= -1173.80 X= -1173.80 X= -1115.20 X= -999.80 X= -884.20 X= -768.80 X= -653.20 X= -537.80 X= -422.20 X= -306.80 X= -191.20 X= -75.80 X= 39.80 X= 155.20 X= 270.80 X= 386.20 28 COM[2] X= Y Coordinate Y= Y= Y= Y= Y= Y= Y= Y= Y= Y= Y= Y= Y= Y= Y= Y= Y= Y= Y= Y= Y= Y= Y= Y= Y= Y= Y= 991.60 991.60 991.60 991.60 288.20 124.80 -14.30 -129.80 -245.30 -360.80 -476.20 -591.80 -707.20 -991.50 -991.50 -991.50 -991.50 -991.50 -991.50 -991.50 -991.50 -991.50 -991.50 -991.50 -991.50 -991.50 -991.50 501.80 Y= -991.50 PIN Number 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 5 PIN Name COM[1] COM[0] LC1 LC2 LV1 LV2 LV3 GND VO OPIN OPIP OPO RSTP_N FXO FXI TSTP_P SXO SXI VDD PRTD[7] PRTD[6] PRTD[5] PRTD[4] PRTD[3] PRTD[2] PRTD[1] PRTD[0] X Coordinate X= X= X= X= X= X= X= X= X= X= X= X= X= X= X= X= X= X= X= X= X= X= X= X= X= X= X= 617.20 732.80 848.20 963.80 1079.20 1173.50 1173.50 1173.50 1173.50 1173.50 1173.50 1173.50 1173.50 1173.50 1173.50 1173.50 738.40 622.90 507.40 391.90 276.40 160.80 45.40 -70.20 -185.70 -301.10 -416.60 Y Coordinate Y= Y= Y= Y= Y= Y= Y= Y= Y= Y= Y= Y= Y= Y= Y= Y= Y= Y= Y= Y= Y= Y= Y= Y= Y= Y= Y= -991.50 -991.50 -991.50 -991.50 -991.50 -702.80 -587.20 -471.80 -356.20 -240.80 -125.20 -9.80 105.80 221.20 336.80 452.20 991.60 991.60 991.60 991.60 991.60 991.60 991.60 991.60 991.60 991.60 991.60 V3.3E KING BILLION ELECTRONICS CO., LTD 駿 億 電 子 股 份 有 限 公 司 HE83115 HE80000 SERIES Version A2: PIN PIN Number Name X Coordinate Y PIN PIN Coordinate Number Name X Coordinate Y Coordinate 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 PRTC[3] X= -485.65 Y= 1024.20 PRTC[2] X= -601.75 Y= 1024.20 PRTC[1] X= -717.50 Y= 1024.20 PRTC[0] X= -833.50 Y= 1024.20 PWMP X= -1115.90 Y= 259.30 PWMN X= -1115.90 Y= 95.95 PRT14[7] X= -1115.75 Y= -47.85 PRT14[6] X= -1115.75 Y= -163.35 PRT14[5] X= -1115.75 Y= -279.70 PRT14[4] X= -1115.75 Y= -395.15 PRT14[3] X= -1115.75 Y= -510.65 PRT14[2] X= -1115.75 Y= -627.60 PRT14[1] X= -1115.75 Y= -743.10 PRT14[0] X= -1101.25 Y= -1009.00 SEG[11] X= -985.75 Y= -1009.00 SEG[10] X= -869.45 Y= -1009.00 SEG[9] X= -753.95 Y= -1009.00 SEG[8] X= -637.60 Y= -1009.00 SEG[7] X= -522.10 Y= -1009.00 SEG[6] X= -405.95 Y= -1009.00 SEG[5] X= -290.45 Y= -1009.00 SEG[4] X= -173.85 Y= -1009.00 SEG[3] X= -58.35 Y= -1009.00 SEG[2] X= 57.15 Y= -1009.00 SEG[1] X= 173.80 Y= -1009.00 SEG[0] X= 289.30 Y= -1009.00 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 COM[1] X= COM[0] X= LC1 X= LC2 X= LV1 X= LV2 X= LV3 X= GND X= VO X= OPIN X= OPIP X= OPO X= RSTP_N X= FXO X= FXI X= TSTP_P X= SXO X= SXI X= VDD X= PRTD[7] X= PRTD[6] X= PRTD[5] X= PRTD[4] X= PRTD[3] X= PRTD[2] X= PRTD[1] X= 27 COM[3] X= 405.45 Y= -1009.00 55 PRTD[0] X= -369.70 Y= 1024.20 28 COM[2] X= 520.95 Y= -1009.00 6 637.85 Y= -1009.00 753.35 Y= -1009.00 868.85 Y= -1009.00 985.35 Y= -1009.00 1100.85 Y= -1009.00 1135.70 Y= -717.30 1135.70 Y= -601.50 1135.70 Y= -486.00 1135.70 Y= -370.50 1135.70 Y= -254.00 1135.70 Y= -137.80 1135.70 Y= -21.90 1135.70 Y= 93.60 1135.70 Y= 209.95 1135.70 Y= 325.45 1135.70 Y= 440.95 789.00 Y= 1024.20 673.20 Y= 1024.00 558.00 Y= 1024.20 441.80 Y= 1023.80 325.75 Y= 1023.90 209.75 Y= 1023.85 94.00 Y= 1023.90 -22.00 Y= 1024.20 -138.05 Y= 1024.20 -253.95 Y= 1024.20 V3.3E KING BILLION ELECTRONICS CO., LTD 駿 億 電 子 股 份 有 限 公 司 HE83115 HE80000 SERIES H. DC/AC Characteristics Absolute Maximum Rating Item Supply Voltage Input Voltage Output Voltage Operating Temperature Storage Temperature Sym. Rating Vdd -0.5V ~ 8V Vin -0.5V ~ Vdd+0.5V Vo -0.5V ~ Vdd+0.5V Top 00C ~ 700C Tst -500C ~ 1000C Condition Recommended Operating Conditions Item Supply Voltage Input Voltage Operating Frequency Operating Temperature Storage Temperature Sym. Vdd Vih Vil Rating 2.4V ~ 5.5V 0.9 Vdd ~ Vdd 0.0V ~ 0.1Vdd 8MHz Fmax 4MHz Top 00C ~ 700C Tst -500C ~ 1000C 7 Condition Vdd =5.0V Vdd =2.4V V3.3E KING BILLION ELECTRONICS CO., LTD 駿 億 電 子 股 份 有 限 公 司 HE83115 HE80000 SERIES Testing Condition : TEMP=25℃, VDD=3V+/-10%, GND=0V IFast PARAMETER NORMAL Mode Current System ISlow SLOW Mode Current System IIdle IDLE Mode Current System ILCD Extra Current if LCD ON System System ISleep Sleep Mode Current IoHPWM PWM Output Drive Current PWMP, PWMN*2 IoLPWM PWM Output Sink Current PWMP, PWMN*2 VO IoVO DAC Output Current ViH Input High Voltage I/O pins ViL Input Low Voltage I/O pins Vhys Input Hysteresis Width I/O, RSTP_N IoH IoL_1 Output Drive Current Output Sink Current I/O pull-high*1 I/O pull-low*1 IiL_1 Input Low Current RSTP_N IiL_2 Input Low Current I/O Note: CONDITION 2M ext. R/C 32.768K X’tal LCD Disable 32.769K X’tal LCD Disable LCD Enable MIN TYP MAX UNIT 0.75 1 mA 6 9 μA 4 7 μA 2 3 1 VDD=3V; Voh=2V 12 15 μA μA mA VDD=3V; VoL=1V 33 40 mA 3 mA VDD=3V;VO=0~2V,Data=7F 2.5 0.8 VDD V 0.2 VDD Threshold=2/3VDD(input from low to high) Threshold=1/3VDD(input from high to low) VoL=2.0V VoL=0.4V ViL=GND, pull high Internally ViL=GND, if pull high Internally by user 1/3 VDD V V μA mA 50 1.0 20 μA 100 μA *1: Drive Current Spec. for Push-Pull I/O port only Sink Current Spec. for both Push-Pull and Open-Drain I/O port. *2: This Spec. base on one driver only. There are five build-in driver, so user just multiply the number of driver he used to one driver current to get the total amount of current. ( IoHPWM、IoLPWM * N; N=0,1,2,3,4,5) 8 V3.3E KING BILLION ELECTRONICS CO., LTD 駿 億 電 子 股 份 有 限 公 司 HE83115 HE80000 SERIES I. Application Circuit Tripple Charge Pump is selected Tripple Charge Pump is selected Tripple Charge Pump is selected LCD Max. Voltage=LV3=3*VDD LCD Max. Voltage=LV3=3/2*VDD LCD Max. Voltage=LV3=VDD VDD VDD VDD LV1 LV2 LC1 LV3 LC1 C4 LC1 C4 0.1uF C4 0.1uF LC2 0.1uF LC2 LC2 No External Parts is necessary if user adopt Internal Fast RC Clock VDD VDD FXI R1 50K 3V C1 FXO FXO C2 SXI SXI RSTP_N 0.1uF 100uF C3 SW1 0.1uF RESET LC2 C5 0.1uF C6 0.1uF C7 0.1uF 20P FXI PRTD[7:0] GND LC1 External Fast Clock: Crystal osc. SXO SXO PRTC[3:0] 2MHZ 20P FXO LC1 LC2 LV1 COM[3:0] SEG[11:0] PRT14[7:0]/SEG[19:12] External Fast Clock: RC osc. LCD PANEL VDD LV2 LV3 < 9 Volt OPIN OPIP OPO R > 8.2 KOhm FXI C: Please Ref . AN016 Buzzer or Speaker Circuit PWMP PWMN Passive Bias & Filter Circuit VO TSTP_P BATTERY 1 FXI VDD SP1 20P SXI Q1 NPN Please Refer AN022 for Speech Output Circuit HE83115 External Slow Clock: Crystal osc. SPEAKER 32.768K SXO 20P External Slow Clock: RC osc. SXI R: Please ref . AN016 SXO 9 V3.3E KING BILLION ELECTRONICS CO., LTD 駿 億 電 子 股 份 有 限 公 司 HE83115 HE80000 SERIES J. Important Note 1. LCD driving circuit must be turn off before IC goes into sleep mode. 2. Please bonds the TSTP_P, RSTP_N and PRTD[7:0] with test point on PCB (can be soldered and probed) as you can, then KB can do some IC testing job on PCB. Neither VDD nor GND connection is necessary for TSTP_P. The following figure is an example (Testing point with through hole). K. Updated Record Version Date V3.3 Nov 28, 2001 Section Original Content B, H 2.2V (VDD operation voltage) J, K New Content 2.4V New Section 10 V3.3E