PHILIPS HEF4555B 1-of-4 decoder/demultiplexer Datasheet

HEF4555B
1-of-4 decoder/demultiplexer
Rev. 5 — 18 November 2011
Product data sheet
1. General description
The HEF4555B contains two 1-of-4 decoders/demultiplexers. Each has two address
inputs (nA0 and nA1, an active LOW enable input (nE) and four mutually exclusive
outputs which are active HIGH (nY0 to nY3). When used as a decoder, nE when HIGH,
forces nY0 to nY3 LOW. When used as a demultiplexer, the appropriate output is selected
by the information on nA0 and nA1 with nE as data input. All unselected outputs are LOW.
It operates over a recommended VDD power supply range of 3 V to 15 V referenced to VSS
(usually ground). Unused inputs must be connected to VDD, VSS, or another input.
2. Features and benefits





Fully static operation
5 V, 10 V, and 15 V parametric ratings
Standardized symmetrical output characteristics
Specified from 40 C to +85 C
Complies with JEDEC standard JESD 13-B
3. Applications
 Code conversion
 Address decoding
 Demultiplexing: when using the enable input as data input
4. Ordering information
Table 1.
Ordering information
All types operate from 40 C to +85 C.
Type number
Package
Name
Description
Version
HEF4555BP
DIP16
plastic dual in-line package; 16 leads (300 mil)
SOT38-4
HEF4555BT
SO16
plastic small outline package; 16 leads; body width 3.9 mm
SOT109-1
HEF4555B
NXP Semiconductors
1-of-4 decoder/demultiplexer
5. Functional diagram
1Y0 4
nY0
2 1A0
1Y1 5
DECODER
nA0
1Y2 6
3 1A1
1Y3 7
nY1
1 1E
nA1
2Y0 12
14 2A0
nY2
2Y1 11
DECODER
2Y2 10
13 2A1
2Y3 9
nE
nY3
15 2E
001aae753
001aae751
Fig 1.
Functional diagram
Fig 2.
Logic diagram for one decoder/multiplexer
6. Pinning information
6.1 Pinning
HEF4555B
1E
1
16 VDD
1A0
2
15 2E
1A1
3
14 2A0
1Y0
4
13 2A1
1Y1
5
12 2Y0
1Y2
6
11 2Y1
1Y3
7
10 2Y2
VSS
8
9
2Y3
001aae752
Fig 3.
Pin configuration
HEF4555B
Product data sheet
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Rev. 5 — 18 November 2011
© NXP B.V. 2011. All rights reserved.
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6.2 Pin description
Table 2.
Pin description
Symbol
Pin
Description
1A0, 1A1, 2A0, 2A1
2, 3, 14, 13
address input
1E, 2E
1, 15
enable input (active LOW
1Y0, 1Y1, 1Y2, 1Y3, 2Y0, 2Y1, 2Y2, 2Y3
4, 5, 6, 7, 12, 11, 10, 9
output (active HIGH)
VDD
16
supply voltage
VSS
8
ground (GND)
7. Functional description
Table 3.
Function selection[1]
Inputs
Outputs
nE
nA0
nA1
nY0
nY1
nY2
nY3
L
L
L
H
L
L
L
L
H
L
L
H
L
L
L
L
H
L
L
H
L
L
H
H
L
L
L
H
H
X
X
L
L
L
L
[1]
H = HIGH voltage level; L = LOW voltage level; X = don’t care.
8. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
VDD
supply voltage
IIK
input clamping current
Conditions
Min
Max
Unit
0.5
+18
V
VI < 0.5 V or VI > VDD + 0.5 V
-
10
mA
0.5
VDD + 0.5
V
VO < 0.5 V or VO > VDD + 0.5 V
-
10
mA
VI
input voltage
IOK
output clamping current
II/O
input/output current
-
10
mA
IDD
supply current
-
50
mA
Tstg
storage temperature
65
+150
C
Tamb
ambient temperature
40
+85
C
DIP16 package
[1]
-
750
mW
SO16 package
[2]
-
500
mW
-
100
mW
total power dissipation
Ptot
P
power dissipation
per output
[1]
For DIP16 package: Ptot derates linearly with 12 mW/K above 70 C.
[2]
For SO16 package: Ptot derates linearly with 8 mW/K above 70 C.
HEF4555B
Product data sheet
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Rev. 5 — 18 November 2011
© NXP B.V. 2011. All rights reserved.
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9. Recommended operating conditions
Table 5.
Recommended operating conditions
Symbol
Parameter
VDD
Conditions
Min
Typ
Max
Unit
supply voltage
3
-
15
V
VI
input voltage
0
-
VDD
V
Tamb
ambient temperature
in free air
40
-
+85
C
t/V
input transition rise and fall rate
VDD = 5 V
-
-
3.75
s/V
VDD = 10 V
-
-
0.5
s/V
VDD = 15 V
-
-
0.08
s/V
10. Static characteristics
Table 6.
Static characteristics
VSS = 0 V; VI = VSS or VDD unless otherwise specified.
Symbol Parameter
VIH
VIL
VOH
VOL
IOH
IOL
HIGH-level input voltage
LOW-level input voltage
Conditions
Tamb = 25 C
Tamb = 85 C
Min
Max
Min
Max
Min
Max
5V
3.5
-
3.5
-
3.5
-
V
10 V
7.0
-
7.0
-
7.0
-
V
15 V
11.0
-
11.0
-
11.0
-
V
5V
-
1.5
-
1.5
-
1.5
V
10 V
-
3.0
-
3.0
-
3.0
V
15 V
-
4.0
-
4.0
-
4.0
V
VDD
IO < 1 A
IO < 1 A
HIGH-level output voltage IO < 1 A;
VI = VSS or VDD
Tamb = 40 C
Unit
5V
4.95
-
4.95
-
4.95
-
V
10 V
9.95
-
9.95
-
9.95
-
V
15 V
14.95
-
14.95
-
14.95
-
V
5V
-
0.05
-
0.05
-
0.05
V
10 V
-
0.05
-
0.05
-
0.05
V
15 V
-
0.05
-
0.05
-
0.05
V
HIGH-level output current VO = 2.5 V
5V
-
1.7
-
1.4
-
1.1
mA
VO = 4.6 V
5V
-
0.52
-
0.44
-
0.36 mA
VO = 9.5 V
10 V
-
1.3
-
1.1
-
0.9
mA
VO = 13.5 V
15 V
-
3.6
-
3.0
-
2.4
mA
VO = 0.4 V
5V
0.52
-
0.44
-
0.36
-
mA
VO = 0.5 V
10 V
1.3
-
1.1
-
0.9
-
mA
LOW-level output voltage
LOW-level output current
IO < 1 A;
VI = VSS or VDD
VO = 1.5 V
15 V
3.6
-
3.0
-
2.4
-
mA
II
input leakage current
VDD = 15 V
15 V
-
0.3
-
0.3
-
1.0
A
IDD
supply current
IO = 0 A;
VI = VSS or VDD
5V
-
20
-
20
-
150
A
10 V
-
40
-
40
-
300
A
15 V
-
80
-
80
-
600
A
-
-
-
-
7.5
-
-
pF
CI
input capacitance
HEF4555B
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 18 November 2011
© NXP B.V. 2011. All rights reserved.
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HEF4555B
NXP Semiconductors
1-of-4 decoder/demultiplexer
11. Dynamic characteristics
Table 7.
Dynamic characteristics
VSS = 0 V; Tamb = 25 C; for test circuit see Figure 5; unless otherwise specified.
Symbol
tPHL
Parameter
Conditions
HIGH to LOW
propagation delay
nAn  nYn;
see Figure 4
nE  nYn
VDD
Min
Typ
Max
Unit
88 ns + (0.55 ns/pF)CL
-
115
230
ns
10 V
34 ns + (0.23 ns/pF)CL
-
45
90
ns
15 V
22 ns + (0.16 ns/pF)CL
-
30
65
ns
5V
98 ns + (0.55 ns/pF)CL
-
125
250
ns
10 V
39 ns + (0.23 ns/pF)CL
-
50
95
ns
5V
Extrapolation formula
[1]
22 ns + (0.16 ns/pF CL
-
30
65
ns
113 ns + (0.55 ns/pF)CL
-
140
280
ns
10 V
44 ns + (0.23 ns/pF)CL
-
55
105
ns
15 V
32 ns + (0.16 ns/pF)CL
-
40
75
ns
5V
123 ns + (0.55 ns/pF)CL
-
150
295
ns
10 V
44 ns + (0.23 ns/pF)CL
-
55
110
ns
32 ns + (0.16 ns/pF)CL
-
40
75
ns
10 ns + (1.00 ns/pF)CL
-
60
120
ns
10 V
9 ns + (0.42 ns/pF)CL
-
30
60
ns
15 V
6 ns + (0.28 ns/pF)CL
-
20
40
ns
15 V
LOW to HIGH
propagation delay
tPLH
nAn  nYn
nE  nYn
5V
[1]
15 V
transition time
tt
on nYn
5V
[1][2]
[1]
The typical values of the propagation delay and transition times are calculated from the extrapolation formulas shown (CL in pF).
[2]
Transition time tt is the same as the HIGH to LOW and LOW to HIGH transition times tTHL and tTLH.
Table 8.
Dynamic power dissipation PD
PD can be calculated from the formulas shown. VSS = 0 V; tr = tf  20 ns; Tamb = 25 C.
Symbol
Parameter
PD
dynamic power
dissipation
VDD
Typical formula for PD (W)
Where:
PD = 4500  fi + (fo  CL)  VDD2
fi = input frequency in MHz,
10 V
PD = 18800  fi + (fo  CL) 
VDD2
fo = output frequency in MHz,
15 V
PD = 45700  fi + (fo  CL) 
VDD2
CL = output load capacitance in pF,
5V
VDD = supply voltage in V,
(fo  CL) = sum of the outputs.
HEF4555B
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 18 November 2011
© NXP B.V. 2011. All rights reserved.
5 of 13
HEF4555B
NXP Semiconductors
1-of-4 decoder/demultiplexer
12. Waveforms
VDD
0.5VM
nAn, nE input
GND
tPHL
tPLH
VOH
nYn output
0.5VM
VOL
tTHL
tTLH
001aal114
Measurement points are given in Table 9.
Logic levels: VOL and VOH are typical output voltage levels that occur with the output load.
Fig 4.
Inputs nAn and nE to output nYn propagation delays
Table 9.
Measurement points
Supply voltage
Input
Output
VDD
VM
VM
5 V to 15 V
0.5VDD
0.5VDD
HEF4555B
Product data sheet
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Rev. 5 — 18 November 2011
© NXP B.V. 2011. All rights reserved.
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VI
tW
90 %
negative
pulse
VM
0V
tf
tr
tr
tf
VI
90 %
positive
pulse
0V
VM
10 %
VM
VM
10 %
tW
VEXT
VDD
VI
VO
G
DUT
RT
CL
001aal115
Test data is given in Table 10.
Definitions for test circuit:
Device Under Test (DUT);
RL = Load resistance;
CL = Load capacitance including jig and probe capacitance;
RT = Termination resistance should be equal to the output impedance Zo of the pulse generator;
VEXT = External voltage for measuring switching times.
Fig 5.
Load circuitry for switching times
Table 10.
Test data
Supply voltage
5 V to 15 V
HEF4555B
Product data sheet
Input
Load
VEXT
VI
tr = tf
CL
tPLH, tPHL
tTHL, tTLH
VDD
 20 ns
50 pF
open
VDD
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Rev. 5 — 18 November 2011
© NXP B.V. 2011. All rights reserved.
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HEF4555B
NXP Semiconductors
1-of-4 decoder/demultiplexer
13. Package outline
DIP16: plastic dual in-line package; 16 leads (300 mil)
SOT38-4
ME
seating plane
D
A2
A
A1
L
c
e
Z
w M
b1
(e 1)
b
b2
MH
9
16
pin 1 index
E
1
8
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
min.
A2
max.
b
b1
b2
c
D (1)
E (1)
e
e1
L
ME
MH
w
Z (1)
max.
mm
4.2
0.51
3.2
1.73
1.30
0.53
0.38
1.25
0.85
0.36
0.23
19.50
18.55
6.48
6.20
2.54
7.62
3.60
3.05
8.25
7.80
10.0
8.3
0.254
0.76
inches
0.17
0.02
0.13
0.068
0.051
0.021
0.015
0.049
0.033
0.014
0.009
0.77
0.73
0.26
0.24
0.1
0.3
0.14
0.12
0.32
0.31
0.39
0.33
0.01
0.03
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
JEITA
ISSUE DATE
95-01-14
03-02-13
SOT38-4
Fig 6.
EUROPEAN
PROJECTION
Package outline SOT38-4 (DIP16)
HEF4555B
Product data sheet
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Rev. 5 — 18 November 2011
© NXP B.V. 2011. All rights reserved.
8 of 13
HEF4555B
NXP Semiconductors
1-of-4 decoder/demultiplexer
SO16: plastic small outline package; 16 leads; body width 3.9 mm
SOT109-1
D
E
A
X
c
y
HE
v M A
Z
16
9
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
1
L
8
e
0
detail X
w M
bp
2.5
5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
Z (1)
mm
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
10.0
9.8
4.0
3.8
1.27
6.2
5.8
1.05
1.0
0.4
0.7
0.6
0.25
0.25
0.1
0.7
0.3
0.01
0.019 0.0100 0.39
0.014 0.0075 0.38
0.039
0.016
0.028
0.020
inches
0.010 0.057
0.069
0.004 0.049
0.16
0.15
0.05
0.244
0.041
0.228
0.01
0.01
0.028
0.004
0.012
θ
8o
o
0
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
Fig 7.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT109-1
076E07
MS-012
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
Package outline SOT109-1 (SO16)
HEF4555B
Product data sheet
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Rev. 5 — 18 November 2011
© NXP B.V. 2011. All rights reserved.
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HEF4555B
NXP Semiconductors
1-of-4 decoder/demultiplexer
14. Revision history
Table 11.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
HEF4555B v.5
20111118
Product data sheet
-
HEF4555B v.4
Modifications:
•
Table 6: IOH minimum values changed to maximum
HEF4555B v.4
20100106
Product data sheet
-
HEF4555B_CNV v.3
HEF4555B_CNV v.3
19950101
Product specification
-
HEF4555B_CNV v.2
HEF4555B_CNV v.2
19950101
Product specification
-
-
HEF4555B
Product data sheet
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Rev. 5 — 18 November 2011
© NXP B.V. 2011. All rights reserved.
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HEF4555B
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1-of-4 decoder/demultiplexer
15. Legal information
15.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
15.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
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Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
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Notwithstanding any damages that customer might incur for any reason
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malfunction of an NXP Semiconductors product can reasonably be expected
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therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
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representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
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Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
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products are sold subject to the general terms and conditions of commercial
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Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
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Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
HEF4555B
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 18 November 2011
© NXP B.V. 2011. All rights reserved.
11 of 13
HEF4555B
NXP Semiconductors
1-of-4 decoder/demultiplexer
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
15.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
16. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
HEF4555B
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 18 November 2011
© NXP B.V. 2011. All rights reserved.
12 of 13
HEF4555B
NXP Semiconductors
1-of-4 decoder/demultiplexer
17. Contents
1
2
3
4
5
6
6.1
6.2
7
8
9
10
11
12
13
14
15
15.1
15.2
15.3
15.4
16
17
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 1
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
Functional description . . . . . . . . . . . . . . . . . . . 3
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Recommended operating conditions. . . . . . . . 4
Static characteristics. . . . . . . . . . . . . . . . . . . . . 4
Dynamic characteristics . . . . . . . . . . . . . . . . . . 5
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 10
Legal information. . . . . . . . . . . . . . . . . . . . . . . 11
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Contact information. . . . . . . . . . . . . . . . . . . . . 12
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2011.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 18 November 2011
Document identifier: HEF4555B
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