Vishay HFB32PA120CPBF Ultrafast soft recovery diode, 2 x 16 a Datasheet

HFA32PA120CPbF
Vishay High Power Products
HEXFRED®
Ultrafast Soft Recovery Diode, 2 x 16 A
FEATURES
•
•
•
•
•
•
•
Base
common
cathode
2
Ultrafast recovery
Ultrasoft recovery
Very low IRRM
Very low Qrr
Specified at operating conditions
Lead (Pb)-free
Designed and qualified for industrial level
Pb-free
Available
RoHS*
COMPLIANT
BENEFITS
TO-247AC
•
•
•
•
•
1
3
Anode
Anode
2
1
2
Common
cathode
Reduced RFI and EMI
Reduced power loss in diode and switching transistor
Higher frequency operation
Reduced snubbing
Reduced parts count
DESCRIPTION
HFA32PA120C is a state of the art ultrafast recovery diode.
Employing the latest in epitaxial construction and advanced
processing techniques it features a superb combination of
characteristics which result in performance which is
unsurpassed by any rectifier previously available. With basic
ratings of 1200 V and 16 A per leg continuous current, the
HFA32PA120C is especially well suited for use as the
companion diode for IGBTs and MOSFETs. In addition to
ultrafast recovery time, the HEXFRED® product line features
extremely low values of peak recovery current (IRRM) and
does not exhibit any tendency to “snap-off” during the
tb portion of recovery. The HEXFRED features combine to
offer designers a rectifier with lower noise and significantly
lower switching losses in both the diode and the switching
transistor. These HEXFRED advantages can help to
significantly reduce snubbing, component count and
heatsink sizes. The HEXFRED HFA32PA120C is ideally
suited for applications in power supplies and power
conversion systems (such as inverters), motor drives, and
many other similar applications where high speed, high
efficiency is needed.
PRODUCT SUMMARY
VR per leg
1200 V
VF at 16 A at 25 °C
3.0 V
IF(AV)
2 x 16 A
trr (typical) per leg
30 ns
TJ (maximum)
150 °C
Qrr (typical) per leg
260 nC
IRRM (typical) per leg
5.8 A
ABSOLUTE MAXIMUM RATINGS
PARAMETER
SYMBOL
Cathode to anode voltage
Maximum continuous forward current
TEST CONDITIONS
VR
per leg
per device
IF
TC = 100 °C
VALUES
UNITS
1200
V
16
32
Single pulse forward current
IFSM
190
Maximum repetitive forward current
IFRM
64
Maximum power dissipation
PD
Operating junction and storage temperature range
TC = 25 °C
151
TC = 100 °C
60
TJ, TStg
- 55 to + 150
A
°C
W
* Pb containing terminations are not RoHS compliant, exemptions may apply
Document Number: 94073
Revision: 06-Aug-08
For technical questions, contact: [email protected]
www.vishay.com
1
HFA32PA120CPbF
Vishay High Power Products
HEXFRED®
Ultrafast Soft Recovery Diode, 2 x 16 A
ELECTRICAL SPECIFICATIONS PER LEG (TJ = 25 °C unless otherwise specified)
PARAMETER
SYMBOL
TEST CONDITIONS
Cathode to anode
breakdown voltage
VBR
IR = 100 µA
Maximum forward voltage
VFM
IF = 32 A
IF = 16 A
See fig. 1
MIN.
TYP.
MAX.
1200
-
-
-
2.5
3.0
-
3.2
3.93
UNITS
V
IF = 16 A, TJ = 125 °C
-
2.3
2.7
VR = VR rated
-
0.75
20
-
375
2000
-
27
40
pF
-
8.0
-
nH
Maximum reverse
leakage current
IRM
Junction capacitance
CT
VR = 200 V
Series inductance
LS
Measured lead to lead 5 mm from package body
TJ = 125 °C, VR = 0.8 x VR rated
See fig. 2
See fig. 3
µA
DYNAMIC RECOVERY CHARACTERISTICS PER LEG (TJ = 25 °C unless otherwise specified)
PARAMETER
Reverse recovery time
See fig. 5, 10
Peak recovery current
See fig. 6
Reverse recovery charge
See fig. 7
Peak rate of fall of recovery
current during tb
See fig. 8
SYMBOL
TEST CONDITIONS
MIN.
TYP.
MAX.
-
30
-
trr
IF = 1.0 A, dIF/dt = 200 A/µs, VR = 30 V
trr1
TJ = 25 °C
-
90
135
trr2
TJ = 125 °C
-
164
245
-
5.8
10
-
8.3
15
-
260
675
-
680
1838
IRRM1
TJ = 25 °C
IRRM2
TJ = 125 °C
IF = 16 A
dIF/dt = 200 A/µs
VR = 200 V
UNITS
ns
A
Qrr1
TJ = 25 °C
Qrr2
TJ = 125 °C
dI(rec)M/dt1
TJ = 25 °C
-
120
-
dI(rec)M/dt2
TJ = 125 °C
-
76
-
MIN.
TYP.
MAX.
UNITS
-
-
300
°C
-
-
0.83
nC
A/µs
THERMAL - MECHANICAL SPECIFICATIONS
PARAMETER
SYMBOL
TEST CONDITIONS
0.063" from case (1.6 mm) for 10 s
Lead temperature
Tlead
Thermal resistance,
junction to case
RthJC
Thermal resistance,
junction to ambient
RthJA
Typical socket mount
-
-
80
Thermal resistance,
case to heatsink
RthCS
Mounting surface, flat, smooth and greased
-
0.50
-
-
2.0
-
-
0.07
-
oz.
-
12
(10)
kgf · cm
(lbf · in)
Weight
6.0
(5.0)
Mounting torque
Marking device
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Case style TO-247AC (JEDEC)
For technical questions, contact: [email protected]
K/W
g
HFA32PA120C
Document Number: 94073
Revision: 06-Aug-08
HFA32PA120CPbF
HEXFRED®
Vishay High Power Products
Ultrafast Soft Recovery Diode, 2 x 16 A
1000
TJ = 150°C
100
100
T = 125°C
J
10
1
TJ = 25°C
0.1
A
0.01
0
200
400
600
800
1000
1200
10
Fig. 2 - Typical Reverse Current vs.
Reverse Voltage
T = 150°C
J
T = 125°C
J
1000
T = 25°C
J
1
100
T J = 25°C
10
0.1
0
2
4
6
A
1
8
1
10
100
1000
10000
Forward Voltage Drop - V FM (V)
Fig. 3 - Typical Junction Capacitance vs.
Reverse Voltage
Fig. 1 - Maximum Forward Voltage Drop vs. Instantaneous
Forward Current
1
0.1
D
D
D
D
D
D
=
=
=
=
=
=
0.50
0.20
0.10
0.05
0.02
0.01
PDM
Single Pulse
(Thermal Resistance)
t1
t2
Notes:
1. Duty factor D = t1/ t 2
2. Peak TJ = Pdm x ZthJC + Tc
0.01
0.00001
0.0001
0.001
0.01
0.1
1
10
100
Fig. 4 - Maximum Thermal Impedance ZthJC Characteristics
Document Number: 94073
Revision: 06-Aug-08
For technical questions, contact: [email protected]
www.vishay.com
3
HFA32PA120CPbF
Vishay High Power Products
HEXFRED®
Ultrafast Soft Recovery Diode, 2 x 16 A
1600
270
V R = 200V
T J = 125 °C
T J = 25 °C
1400
220
1200
If = 16 A
If = 8 A
If = 16A
If = 8A
1000
170
800
120
600
400
70
200
VR = 200V
TJ = 125°C
TJ = 25°C
20
100
1000
Fig. 5 - Typical Reverse Recovery Time vs. dIF/dt (Per Leg)
30
25
20
0
100
1000
Fig. 7 - Typical Stored Charge vs. dIF/dt (Per Leg)
10000
V R = 200V
T J = 125°C
T J = 25°C
V R = 200V
T J = 125°C
T J = 25°C
1000
If = 16 A
If = 8 A
If = 16A
If = 8A
15
100
10
5
0
100
1000
10
100
1000
di f
Fig. 6 - Typical Recovery Current vs. dIF/dt (Per Leg)
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Fig. 8 - Typical dI(rec)M/dt vs. dIF/dt (Per Leg)
For technical questions, contact: [email protected]
Document Number: 94073
Revision: 06-Aug-08
HFA32PA120CPbF
HEXFRED®
Vishay High Power Products
Ultrafast Soft Recovery Diode, 2 x 16 A
VR = 200 V
0.01 Ω
L = 70 µH
D.U.T.
dIF/dt
adjust
D
IRFP250
G
S
Fig. 9 - Reverse Recovery Parameter Test Circuit
(3)
trr
IF
ta
tb
0
Qrr
(2)
IRRM
(4)
0.5 IRRM
dI(rec)M/dt (5)
0.75 IRRM
(1) dIF/dt
(1) dIF/dt - rate of change of current
through zero crossing
(2) IRRM - peak reverse recovery current
(3) trr - reverse recovery time measured
from zero crossing point of negative
going IF to point where a line passing
through 0.75 IRRM and 0.50 IRRM
extrapolated to zero current.
(4) Qrr - area under curve defined by trr
and IRRM
Qrr =
trr x IRRM
2
(5) dI(rec)M/dt - peak rate of change of
current during tb portion of trr
Fig. 10 - Reverse Recovery Waveform and Definitions
Document Number: 94073
Revision: 06-Aug-08
For technical questions, contact: [email protected]
www.vishay.com
5
HFA32PA120CPbF
Vishay High Power Products
HEXFRED®
Ultrafast Soft Recovery Diode, 2 x 16 A
ORDERING INFORMATION TABLE
Device code
HF
A
32
PA
120
C
PbF
1
2
3
4
5
6
7
1
-
HEXFRED® family
2
-
Process designator: A = Subs. electron irradiated
B = Subs. platinum
3
-
Current rating (32 = 32 A)
4
-
Package outline (PA = TO-247, 3 pins)
5
-
Voltage rating (120 = 1200 V)
6
-
Configuration (C = Center tap common cathode)
7
-
None = Standard production
PbF = Lead (Pb)-free
LINKS TO RELATED DOCUMENTS
Dimensions
http://www.vishay.com/doc?95223
Part marking information
http://www.vishay.com/doc?95226
www.vishay.com
6
For technical questions, contact: [email protected]
Document Number: 94073
Revision: 06-Aug-08
Legal Disclaimer Notice
Vishay
Disclaimer
All product specifications and data are subject to change without notice.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf
(collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein
or in any other disclosure relating to any product.
Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any
information provided herein to the maximum extent permitted by law. The product specifications do not expand or
otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed
therein, which apply to these products.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this
document or by any conduct of Vishay.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless
otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such
applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting
from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding
products designed for such applications.
Product names and markings noted herein may be trademarks of their respective owners.
Document Number: 91000
Revision: 18-Jul-08
www.vishay.com
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