Intersil HIN231IB 5v powered rs-232 transmitters/receiver Datasheet

HIN230 thru HIN241
TM
Data Sheet
May 2000
+5V Powered RS-232
Transmitters/Receivers
File Number
3138.7
Features
• Meets All RS-232E and V.28 Specifications
The HIN230-HIN241 family of RS-232 transmitters/receivers
interface circuits meet all ElA RS-232E and V.28 specifications,
and are particularly suited for those applications where ±12V is
not available. They require a single +5V power supply (except
HIN231 and HIN239) and feature onboard charge pump
voltage converters which generate +10V and -10V supplies
from the 5V supply. The HIN233 and HIN235 require no
external capacitors and are ideally suited for applications where
circuit board space is critical. The family of devices offer a wide
variety of RS-232 transmitter/receiver combinations to
accommodate various applications (see Selection Table).
• Requires Only Single +5V Power Supply
- (+5V and +12V - HIN231 and HIN239)
• High Data Rate. . . . . . . . . . . . . . . . . . . . . . . . . . . 120kbps
• HIN233 and HIN235 Require No External Capacitors
• Onboard Voltage Doubler/Inverter
• Low Power Consumption
• Low Power Shutdown Function
• Three-State TTL/CMOS Receiver Outputs
• Multiple Drivers
- ±10V Output Swing for 5V lnput
- 300Ω Power-Off Source Impedance
- Output Current Limiting
- TTL/CMOS Compatible
- 30V/µs Maximum Slew Rate
The drivers feature true TTL/CMOS input compatibility, slewrate-limited output, and 300Ω power-off source impedance.
The receivers can handle up to ±30V, and have a 3kΩ to 7kΩ
input impedance. The receivers also feature hysteresis to
greatly improve noise rejection.
• Multiple Receivers
- ±30V Input Voltage Range
- 3kΩ to 7kΩ Input Impedance
- 0.5V Hysteresis to Improve Noise Rejection
Applications
• Any System Requiring RS-232 Communication Ports
- Computer - Portable, Mainframe, Laptop
- Peripheral - Printers and Terminals
- Instrumentation
- Modems
Selection Table
PART
NUMBER
NUMBER OF
RS-232
DRIVERS
POWER SUPPLY
VOLTAGE
NUMBER OF
RS-232
RECEIVERS
EXTERNAL
COMPONENTS
LOW POWER
SHUTDOWN/TTL
THREE-STATE
NUMBER OF
LEADS
HIN230
+5V
5
0
4 Capacitors
Yes/No
20
HIN231
+5V and +7.5V to 13.2V
2
2
2 Capacitors
No/No
16
HIN232
+5V
2
2
4 Capacitors
No/No
16
HIN233
+5V
2
2
None
No/No
20
HIN234
+5V
4
0
4 Capacitors
No/No
16
HIN235
+5V
5
5
None
Yes/Yes
24
HIN236
+5V
4
3
4 Capacitors
Yes/Yes
24
HIN237
+5V
5
3
4 Capacitors
No/No
24
HIN238
+5V
4
4
4 Capacitors
No/No
24
HIN239
+5V and +7.5V to 13.2V
3
5
2 Capacitors
No/Yes
24
HIN240
+5V
5
5
4 Capacitors
Yes/Yes
44
HIN241
+5V
4
5
4 Capacitors
Yes/Yes
28
3-1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143 | Intersil and Design is a trademark of Intersil Corporation. | Copyright © Intersil Corporation 2000
HIN230 thru HIN241
Ordering Information
PART
NUMBER
TEMP.
RANGE (oC)
PACKAGE
PART
NUMBER
PKG. NO.
TEMP.
RANGE (oC)
PACKAGE
PKG. NO.
HIN230CB
0 to 70
20 Ld SOIC
M20.3
HIN237CP
0 to 70
24 Ld PDIP
E24.3
HIN230IB
-40 to 85
20 Ld SOIC
M20.3
HIN237CB
0 to 70
24 Ld SOIC
M24.3
HIN231CB
0 to 70
16 Ld SOIC
M16.3
HIN237IP
-40 to 85
24 Ld PDIP
E24.3
HIN231CP
0 to 70
14 Ld PDIP
E14.3
HIN237IB
-40 to 85
24 Ld SOIC
M24.3
HIN231IB
-40 to 85
16 Ld SOIC
M16.3
HIN238CP
0 to 70
24 Ld PDIP
E24.3
HIN231IP
-40 to 85
14 Ld PDIP
E14.3
HIN238CB
0 to 70
24 Ld SOIC
M24.3
HIN232CP
0 to 70
16 Ld PDIP
E16.3
HIN238IP
-40 to 85
24 Ld PDIP
E24.3
HIN232CB
0 to 70
16 Ld SOIC
M16.3
HIN238IB
-40 to 85
24 Ld SOIC
M24.3
HIN232IP
-40 to 85
16 Ld PDIP
E16.3
HIN239CB
0 to 70
24 Ld SOIC
M24.3
HIN232IB
-40 to 85
16 Ld SOIC
M16.3
HIN239CP
0 to 70
24 Ld PDIP
E24.3
HIN233CP
0 to 70
20 Ld PDIP
E20.3
HIN239IB
-40 to 85
24 Ld SOIC
M24.3
HIN234CB
0 to 70
16 Ld SOIC
M16.3
HIN240CN
0 to 70
44 Ld MQFP
Q44.10X10
HIN234IB
-40 to 85
16 Ld SOIC
M16.3
HIN240IN
-40 to 85
44 Ld MQFP
Q44.10X10
HIN235CP
0 to 70
24 Ld PDIP
E24.6
HIN241CB
0 to 70
28 Ld SOIC
M28.3
HIN236CP
0 to 70
24 Ld PDIP
E24.3
HIN241IB
-40 to 85
28 Ld SOIC
M28.3
HIN236CB
0 to 70
24 Ld SOIC
M24.3
HIN241CA
0 to 70
28 Ld SSOP
M28.209
HIN236IP
-40 to 85
24 Ld PDIP
E24.3
HIN241IA
-40 to 85
28 Ld SSOP
M28.209
HIN236IB
-40 to 85
24 Ld SOIC
M24.3
NOTE: Many of the surface mount devices are available on tape and
reel; add -T to suffix.
Pin Descriptions
PIN
VCC
FUNCTION
Power Supply Input 5V ±10%.
V+
Internally generated positive supply (+10V nominal), HIN231 and HIN239 require +7.5V to +13.2V.
V-
Internally generated negative supply (-10V nominal).
GND
Ground lead. Connect to 0V.
C1+
External capacitor (+ terminal) is connected to this lead.
C1-
External capacitor (- terminal) is connected to this lead.
C2+
External capacitor (+ terminal) is connected to this lead.
C2-
External capacitor (- terminal) is connected to this lead.
TIN
Transmitter Inputs. These leads accept TTL/CMOS levels. An internal 400kΩ pull-up resistor to VCC is connected to each lead.
TOUT
RIN
ROUT
Transmitter Outputs. These are RS-232 levels (nominally ±10V).
Receiver Inputs. These inputs accept RS-232 input levels. An internal 5kΩ pull-down resistor to GND is connected to each input.
Receiver Outputs. These are TTL/CMOS levels.
EN
Enable input. This is an active low input which enables the receiver outputs. With EN = 5V, the outputs are placed in a high
impedance state.
SHUTDOWN
Shutdown Input. With SHUTDOWN = 5V, the charge pump is disabled, the receiver outputs are in a high impedance state
and the transmitters are shut off.
NC
No Connect. No connections are made to these leads.
3-2
HIN230 thru HIN241
Pinouts
HIN230 (SOIC)
TOP VIEW
HIN231 (SOIC)
TOP VIEW
T3OUT
1
T1OUT
2
20 T4OUT
19 T5IN
T2OUT
3
18 NC
T2IN
4
17 SHUTDOWN
T1IN
5
GND
6
16 T5OUT
15 T4IN
VCC
7
14 T3IN
C1+
8
13 V-
V+
9
12 C2-
C1- 10
11 C2+
C+
1
16 V+
(14)
C-
2
15 VCC
(13)
V-
3
14 GND
(12)
T2OUT
4
13 T1OUT (11)
R2IN
5
12 R1IN
R2OUT
6
11 R1OUT (9)
T2IN
7
10 T1IN
NC
8
9 NC
(10)
(8)
NOTE: Pin numbers in parentheses are for PDIP Package.
+5V
+5V
15
7
8
1µF
1µF
T1IN
T2IN
T3IN
T4IN
T5IN
+
10
VCC
C1+
C1-
11
C2+
+
12
C2-
+5V TO 10V
VOLTAGE DOUBLER
+5V
400kΩ
T2
4
14
+5V
400kΩ
T3
19
+
VCC
1
+5V
400kΩ
+5V
400kΩ
V- 13
+
+5V
400kΩ
T1
5
15
V+
9
1µF
1µF
+10V TO -10V
VOLTAGE INVERTER
+7.5V TO +13.2V
2
3
+
2
C+
C-
V+
+12V TO -12V
VOLTAGE INVERTER
V- 3
+
1µF
T1OUT
T1IN
T2OUT
T2IN
+5V
400kΩ
T1
10
+5V
400kΩ
T2
7
13
4
11
1
16
1µF
T1OUT
T2OUT
12
R1IN
R1OUT
T3OUT
5kΩ
R1
T4
20
T4OUT
R2OUT
6
5
5kΩ
R2
T5
16
17
T5OUT
14
SHUTDOWN
6
NOTE: SOIC pin numbers shown.
3-3
R2IN
HIN230 thru HIN241
Pinouts
(Continued)
HIN232 (PDIP, SOIC)
TOP VIEW
C1+ 1
V+ 2
HIN233 (PDIP, SOIC)
TOP VIEW
16 VCC
T2IN
1
20 R2OUT
15 GND
T1IN
2
19 R2IN
R1OUT
3
18 T2OUT
C1- 3
14 T1OUT
C2+ 4
13 R1IN
12 R1OUT
C2- 5
6
11 T1IN
T2OUT 7
10 T2IN
V-
9 R2OUT
R2IN 8
R1IN
4
17 V-
T1OUT
5
16 C2-
GND
6
15 C2+
VCC
7
14 V+ (C1-)
(V+) C1+
8
13 C1- (C1+)
GND
9
12 V- (C2+)
(V-) C2- 10
11 C2+ (C2-)
NOTE: Pin names in parentheses are for SOIC Package.
+5V
+5V
+
1µF
16
+
0.1µF
6
1
1µF
+
3
4
1µF
T1IN
T2IN
+
5
VCC
C1+
C1C2+
C2-
+5V TO 10V
VOLTAGE DOUBLER
V+
2
T1IN
2
400kΩ
+5V
1
+10V TO -10V
VOLTAGE INVERTER
T1
11
+5V
400kΩ
T2
10
+5V
400kΩ
14
1µF
T1OUT
8
5kΩ
R2
T2
18
T2OUT
T2OUT
R2IN
19
R2IN
NO
13 (14)
CONNECT
INTERNAL
-10V
SUPPLY
INTERNAL
+10V
SUPPLY
12 (10)
17
14 (8)
R2
C1+
5kΩ
C1-
C2+
15
16
V-
C2-
VV+
C2+
11 (12)
C2GND
6
10 (11)
GND
9
15
NOTE: Pin numbers in parentheses are for SOIC Package.
3-4
R1IN
5kΩ
20
8 (13)
5kΩ
9
T1OUT
4
R1
R1IN
R1
5
3
13
R1OUT
T1
R1OUT
R2OUT
7
400kΩ
T2IN
V- 6
+
12
R2OUT
+
VCC
+5V
1µF
HIN230 thru HIN241
Pinouts
(Continued)
HIN234 (SOIC)
TOP VIEW
HIN235 (PDIP)
TOP VIEW
T1OUT
1
16 T3OUT
T4OUT 1
24 R3IN
T2OUT
2
15 T4OUT
T3OUT 2
23 R3OUT
14 T4IN
T1OUT 3
22 T5IN
T2OUT 4
21 SHUTDOWN
T2IN
3
T1IN
4
13 T3IN
GND
5
12 V-
VCC
6
11 C2-
C1+
7
10 C2+
V+
8
9 C1-
20 EN
R2IN 5
19 T5OUT
R2OUT 6
T2IN 7
18 R4IN
T1IN 8
17 R4OUT
R1OUT 9
16 T4IN
R1IN 10
15 T3IN
GND 11
14 R5OUT
VCC 12
13 R5IN
+5V
+5V
12
6
7
1µF
1µF
T1IN
T2IN
T3IN
+
VCC
C1+
8
+5V TO 10V
VOLTAGE DOUBLER
V+
C1-
10
C2+
+
11
C2-
+10V TO -10V
VOLTAGE INVERTER
V- 12
9
4
3
+5V
400kΩ
+5V
400kΩ
+5V
400kΩ
13
+
VCC
+5V
T1IN
+
T1
1µF
1
T2IN
1µF
T1OUT
T4IN
T2
2
T3IN
T5IN
T3
16
T3OUT
R1OUT
T1
8
400kΩ
7
+5V
400kΩ
T2
15
+5V
400kΩ
T3
16
+5V
400kΩ
T4
22
+5V
400kΩ
T5
T2OUT
+
3
4
2
1
19
10
9
14
+5V
400kΩ
T4
15
T4OUT
R2OUT
5
6
23
T3OUT
T4OUT
T5OUT
R1IN
R2IN
24
R3OUT
R3IN
5kΩ
R3
17
18
R4OUT
R4IN
5kΩ
R4
14
13
R5OUT
R5IN
20
5kΩ
R5
21
EN
SHUTDOWN
GND
11
3-5
T2OUT
5kΩ
R2
5
T1OUT
5kΩ
R1
T4IN
0.1µF
HIN230 thru HIN241
Pinouts
(Continued)
HIN236 (PDIP, SOIC)
TOP VIEW
HIN237 (PDIP, SOIC)
TOP VIEW
T3OUT
1
1
24 T4OUT
T1OUT
24 T4OUT
23 R2IN
T3OUT
2
T1OUT
2
23 R2IN
T2OUT
3
22 R2OUT
T2OUT
3
22 R2OUT
R1IN
4
21 SHUTDOWN
R1IN
4
21 T5IN
R1OUT
5
20 EN
R1OUT
5
20 T5OUT
T2IN
6
19 T4IN
T2IN
6
19 T4IN
T1IN
7
18 T3IN
T1IN
7
18 T3IN
GND
8
17 R3OUT
GND
8
17 R3OUT
VCC
9
16 R3IN
VCC
9
16 R3IN
15 V-
C1+ 10
C1+ 10
14 C2-
V+ 11
14 C2-
C1- 12
13 C2+
C1- 12
13 C2+
+5V
+5V
9
9
1µF
1µF
T1IN
T2IN
T3IN
T4IN
10
C1+
+
12
C113
C2+
+
14
C2-
VCC
11
+5V TO 10V
VOLTAGE DOUBLER
V+
+10V TO -10V
VOLTAGE INVERTER
V- 15
+5V
400kΩ
T1
+5V
400kΩ
T2
6
18
+5V
400kΩ
T3
+5V
400kΩ
+
2
3
1
1µF
1µF
1µF
+
7
19
15 V-
V+ 11
1µF
T1OUT
T2OUT
T3OUT
T4
24
5
T4OUT
T1IN
T2IN
T3IN
T4IN
4
R1IN
R1OUT
T5IN
5kΩ
R1
22
10
C1+
+
12
C113
C2+
+
14
C2-
V+
+10V TO -10V
VOLTAGE INVERTER
V- 15
+5V
400kΩ
7
T1
+5V
400kΩ
T2
6
18
+5V
400kΩ
T3
+5V
400kΩ
19
T4
+5V
400kΩ
21
T5
2
3
1
24
20
20
EN
21
8
16
R3IN
R3OUT
5kΩ
R3
8
3-6
T5OUT
5kΩ
17
SHUTDOWN
T4OUT
23
R2
R3IN
5kΩ
T3OUT
R2IN
16
R3
T2OUT
R1IN
22
R3OUT
T1OUT
5kΩ
R2OUT
17
1µF
4
R1
5kΩ
+
1µF
+
R1OUT
R2IN
R2OUT
11
+5V TO 10V
VOLTAGE DOUBLER
5
23
R2
VCC
HIN230 thru HIN241
Pinouts
(Continued)
HIN238 (PDIP, SOIC)
TOP VIEW
HIN239 (SOIC)
TOP VIEW
T2OUT
1
24 T3OUT
R1OUT 1
24 T1IN
T1OUT
2
23 R3IN
R1IN 2
23 T2IN
R2IN
3
22 R3OUT
GND 3
22 R2OUT
R2OUT
4
21 T4IN
VCC 4
21 R2IN
T1IN
5
20 T4OUT
R1OUT
6
R1IN
GND
VCC
V+ 5
20 T2OUT
19 T3IN
C1+ 6
19 T1OUT
7
18 T2IN
C1- 7
18 R3IN
8
17 R4OUT
9
16 R4IN
17 R3OUT
V- 8
16 T3IN
R5IN 9
15 V-
R5OUT 10
15 NC (NOTE)
V+ 11
14 C2-
R4OUT 11
14 EN
C1- 12
13 C2+
R4IN 12
C1+ 10
13 T3OUT
NOTE: No Connect
+5V
1µF
1µF
T1IN
T2IN
T3IN
T4IN
10
C1+
+
12
C113
C2+
+
14
C2-
VCC
11
+5V TO 10V
VOLTAGE DOUBLER
V+
+10V TO -10V
VOLTAGE INVERTER
V- 15
+5V
400kΩ
5
+5V
400kΩ
18
+7.5V TO +13.2V
+5V
9
+
2
1µF
1µF
T2IN
1
T3
+5V
400kΩ
21
T4
T1IN
T1OUT
T2
+5V
400kΩ
19
6
1µF
+
T1
4
T2OUT
T3IN
24
T3OUT
R1OUT
+
7
VCC
C1+
C1-
+10V TO -10V
VOLTAGE INVERTER
6
T4OUT
7
R1IN
R1OUT
T1
+5V
400kΩ
T2
23
16
+5V
400kΩ
T3
20
13
3
R2IN
R2OUT
23
R3IN
22
R2IN
5kΩ
18
R3IN
R3OUT
R3
5kΩ
12
R4IN
R4OUT
R4
5kΩ
10
17
16
R4IN
R4OUT
5kΩ
R4
8
3-7
T3OUT
21
R2
5kΩ
R3
T2OUT
R1IN
11
22
R3OUT
T1OUT
5kΩ
R2OUT
5kΩ
R2
1µF
2
17
4
8
19
1
5kΩ
R1
V-
5
+
+5V
400kΩ
24
R1
20
V+
9
R5IN
R5OUT
14
R5
EN
3
5kΩ
HIN230 thru HIN241
Pinouts
(Continued)
HIN241 (SOIC, SSOP)
TOP VIEW
R5IN
NC
R5OUT
T3IN
T4IN
R4OUT
T5OUT
R4IN
NC
SHUT
DOWN
EN
HIN240 (MQFP)
44 43 42 41 40 39 38 37 36 35 34
33
2
32
NC
1
T5IN
R3IN
4
30
V-
T4OUT
5
29
C2-
T3OUT
6
28
C2+
27
C1-
26
NC
R2IN
24 EN
T2IN 6
23 R4IN
T1IN 7
22 R4OUT
21 T4IN
R1IN 9
20 T3IN
GND 10
19 R5OUT
C1+
VCC 11
18 R5IN
NC
C1+ 12
17 V-
NC
V+ 13
16 C2-
C1- 14
15 C2+
NC
NC
NC
VCC
R1IN
GND
T1IN
R1OUT
T2IN
NC
R2OUT
24
10
11
23
12 13 14 15 16 17 18 19 20 21 22
NC
25 SHUTDOWN
R1OUT 8
V+
25
9
26 R3OUT
R2OUT 5
NC
8
T2OUT 3
NC
31
T2OUT
27 R3IN
R2IN 4
3
7
28 T4OUT
T1OUT 2
NC
R3OUT
T1OUT
T3OUT 1
+5V
+5V
19
1µF
1µF
T1IN
T2IN
T3IN
T4IN
T5IN
R1OUT
25
VCC
C1+
+
+5V
TO 10V
27
C1- VOLTAGE DOUBLER
28
C2+
+10V TO -10V
+
29
VOLTAGE INVERTER
C2+5V
T1
400kΩ
15
+5V
400kΩ
14
+5V
400kΩ
37
+5V
400kΩ
38
+5V
400kΩ
2
11
V+
V-
26
+
1µF
1µF
30
1µF
1µF
7
T1OUT
T1IN
T2
8
T3
6
T4
5
T5
41
17
16
R1
T2OUT
T3OUT
T4OUT
T5OUT
T3IN
T4IN
R1OUT
T2
+5V
400kΩ
T3
+5V
400kΩ
21
T4
R5IN
R3IN
3-8
23
R4IN
5kΩ
18
R5IN
24
5kΩ
R5
25
EN
SHUTDOWN
10
SHUTDOWN
R1IN
5kΩ
5kΩ
43
T4OUT
27
19
35
T3OUT
5kΩ
R5OUT
R5OUT
T2OUT
4
22
R4IN
T1OUT
5kΩ
R4
5kΩ
1µF
R2IN
40
18
9
R4OUT
R4OUT
EN
28
26
R3IN
R5
1
R3
5kΩ
36
3
8
4
R4
2
R3OUT
R3OUT
42
+5V
400kΩ
6
20
+
+ 1µF
T1
R2
5kΩ
39
V- 17
5
R2IN
R3
+10V TO -10V
VOLTAGE INVERTER
+5V
400kΩ
7
10
3
V+
13
R2OUT
R2OUT
R2
VCC
+5V TO 10V
VOLTAGE DOUBLER
R1
R1IN
5kΩ
13
T2IN
12
C1+
+
14
C115
C2+
+
16
C2-
HIN230 thru HIN241
Absolute Maximum Ratings
Thermal Information
VCC to Ground. . . . . . . . . . . . . . . . . . . . . . (GND -0.3V) < VCC < 6V
V+ to Ground . . . . . . . . . . . . . . . . . . . . . . . .(VCC -0.3V) < V+ < 12V
V- to Ground. . . . . . . . . . . . . . . . . . . . . . . . -12V < V- < (GND +0.3V)
Input Voltages
TIN . . . . . . . . . . . . . . . . . . . . . . . . . (V- -0.3V) < VIN < (V+ +0.3V)
RIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±30V
Output Voltages
TOUT . . . . . . . . . . . . . . . . . . . .(V- -0.3V) < VTXOUT < (V+ +0.3V)
ROUT . . . . . . . . . . . . . . . . . (GND -0.3V) < VRXOUT < (V+ +0.3V)
Short Circuit Duration
TOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Continuous
ROUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Continuous
Thermal Resistance (Typical, Note 1)
θJA (oC/W)
14 Ld PDIP Package . . . . . . . . . . . . . . . . . . . . . . . .
90
16 Ld PDIP Package . . . . . . . . . . . . . . . . . . . . . . . .
90
20 Ld PDIP Package . . . . . . . . . . . . . . . . . . . . . . . .
80
24 Ld PDIP Package . . . . . . . . . . . . . . . . . . . . . . . .
70
16 Ld SOIC (W) Package. . . . . . . . . . . . . . . . . . . . .
100
20 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . .
120
24 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . .
75
28 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . .
70
28 Ld SSOP Package . . . . . . . . . . . . . . . . . . . . . . .
95
44 Ld MQFP Package . . . . . . . . . . . . . . . . . . . . . . .
80
Maximum Junction Temperature (Plastic Package) . . . . . . . .150oC
Maximum Storage Temperature Range . . . . . . . . . . -65oC to 150oC
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . .300oC
(SOIC, SSOP, MQFP - Lead Tips Only)
Operating Conditions
Temperature Range
HIN2XXCX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0oC to 70oC
HIN2XXIX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40oC to 85oC
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. θJA is measured with the component mounted on an evaluation PC board in free air.
Electrical Specifications
Test Conditions: VCC = +5V ±10%, TA = Operating Temperature Range
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNITS
HIN232-233
-
5
10
mA
HIN230, HIN234-238, HIN240-241
-
7
15
mA
HIN231, HIN239
-
0.4
1
mA
HIN231
-
1.8
5
mA
HIN239
-
5.0
15
mA
-
1
10
µA
-
-
0.8
V
SUPPLY CURRENTS
Power Supply Current, ICC
No Load,
TA = 25oC
V+ Power Supply Current, ICC
No Load, TA = 25oC
No Load,
TA = 25oC
Shutdown Supply Current, ICC(SD)
TA = 25oC
LOGIC AND TRANSMITTER INPUTS, RECEIVER OUTPUTS
Input Logic Low, VlL
TIN , EN, Shutdown
Input Logic High, VlH
TIN
2.0
-
-
V
EN, Shutdown
2.4
-
-
V
Transmitter Input Pullup Current, IP
TIN = 0V
-
15
200
µA
TTL/CMOS Receiver Output Voltage Low, VOL
IOUT = 1.6mA
(HIN231-HIN233 IOUT = 3.2mA)
-
0.1
0.4
V
TTL/CMOS Receiver Output Voltage High, VOH
IOUT = -1.0mA
3.5
4.6
-
V
-30
-
+30
V
7.0
kΩ
RECEIVER INPUTS
RS-232 Input Voltage Range VIN
Receiver Input Impedance RIN
VIN = ±3V
3.0
5.0
Receiver Input Low Threshold, VlN (H-L)
VCC = 5V, TA = 25oC
VCC = 5V, TA = 25oC
0.8
1.2
-
V
-
1.7
2.4
V
0.2
0.5
1.0
V
Receiver Input High Threshold, VIN (L-H)
Receiver Input Hysteresis VHYST
TIMING CHARACTERISTICS
Baud Rate (1 Transmitter Switching)
RL = 3kΩ
120
-
-
kbps
Output Enable Time, tEN
HIN235, 236, 239, 240, 241
-
400
-
ns
Output Disable Time, tDIS
HIN235, 236, 239, 240, 241
-
250
-
ns
3-9
HIN230 thru HIN241
Electrical Specifications
Test Conditions: VCC = +5V ±10%, TA = Operating Temperature Range (Continued)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNITS
Propagation Delay, tPD
RS-232 to TTL
-
0.5
-
µs
Instantaneous Slew Rate SR
CL = 10pF, RL = 3kΩ, TA = 25oC
-
-
30
V/µs
RL = 3kΩ, CL = 2500pF Measured
from +3V to -3V or -3V to +3V, 1
Transmitter Switching
-
3
-
V/µs
Output Voltage Swing, TOUT
Transmitter Outputs, 3kΩ to Ground
±5
±9
±10
V
Output Resistance, ROUT
VCC = V+ = V- = 0V, VOUT = ±2V
300
-
-
Ω
RS-232 Output Short Circuit Current, ISC
TOUT shorted to GND
-
±10
-
mA
(Note 2)
Transition Region Slew Rate, SRT
TRANSMITTER OUTPUTS
NOTE:
2. Guaranteed by design.
3-10
HIN230 thru HIN241
VOLTAGE DOUBLER
C1+
S1
VOLTAGE INVERTER
S2
V+ = 2VCC
S5
C2+
S6
VCC
GND
+
-
+
C1
-
+
C3
VCC
GND
C1-
S3
S4
GND
+
C2
-
-
V- = -(V+)
C2-
S7
C4
S8
RC
OSCILLATOR
FIGURE 1. CHARGE PUMP
Detailed Description
The HIN230 thru HIN241 family of RS-232
transmitters/receivers are powered by a single +5V power
supply (except HIN231 and HIN239), feature low power
consumption, and meet all ElA RS-232C and V.28
specifications. The circuit is divided into three sections: The
charge pump, transmitter, and receiver.
Charge Pump
An equivalent circuit of the charge pump is illustrated in Figure
1. The charge pump contains two sections: the voltage
doubler and the voltage inverter. Each section is driven by a
two phase, internally generated clock to generate +10V and 10V. The nominal clock frequency is 16kHz. During phase one
of the clock, capacitor C1 is charged to VCC . During phase
two, the voltage on C1 is added to VCC , producing a signal
across C3 equal to twice VCC . During phase one, C2 is also
charged to 2VCC , and then during phase two, it is inverted
with respect to ground to produce a signal across C4 equal to
-2VCC . The charge pump accepts input voltages up to 5.5V.
The output impedance of the voltage doubler section (V+) is
approximately 200Ω, and the output impedance of the voltage
inverter section (V-) is approximately 450Ω. A typical
application uses 1µF capacitors for C1-C4, however, the value
is not critical. Increasing the values of C1 and C2 will lower the
output impedance of the voltage doubler and inverter,
increasing the values of the reservoir capacitors, C3 and C4,
lowers the ripple on the V+ and V- supplies.
During shutdown mode (HIN230, 235, 236, 240 and 241),
SHUTDOWN control line set to logic “1”, the charge pump is
turned off, V+ is pulled down to VCC , V- is pulled up to GND,
and the supply current is reduced to less than 10µA. The
transmitter outputs are disabled and the receiver outputs are
placed in the high impedance state.
resistor so any unused input can be left unconnected and its
output remains in its low state. The output voltage swing meets
the RS-232C specifications of ±5V minimum with the worst
case conditions of: all transmitters driving 3kΩ minimum load
impedance, VCC = 4.5V, and maximum allowable operating
temperature. The transmitters have an internally limited output
slew rate which is less than 30V/µs. The outputs are short
circuit protected and can be shorted to ground indefinitely. The
powered down output impedance is a minimum of 300Ω with
±2V applied to the outputs and VCC = 0V.
V+
VCC
400kΩ
300Ω
TXIN
TOUT
GND < TXIN < VCC
V- < VTOUT < V+
V-
FIGURE 2. TRANSMITTER
Receivers
The receiver inputs accept up to ±30V while presenting the
required 3kΩ to 7kΩ input impedance even if the power is off
(VCC = 0V). The receivers have a typical input threshold of
1.3V which is within the ±3V limits, known as the transition
region, of the RS-232 specifications. The receiver output is
0V to VCC . The output will be low whenever the input is
greater than 2.4V and high whenever the input is floating or
driven between +0.8V and -30V. The receivers feature 0.5V
hysteresis to improve noise rejection. The receiver Enable
line EN, when set to logic “1”, (HIN235, 236, 239, 240, and
241) disables the receiver outputs, placing them in the high
impedance mode. The receiver outputs are also placed in
the high impedance state when in shutdown mode.
VCC
Transmitters
The transmitters are TTL/CMOS compatible inverters which
translate the inputs to RS-232 outputs. The input logic
threshold is about 26% of VCC, or 1.3V for VCC = 5V. A logic 1
at the input results in a voltage of between -5V and V- at the
output, and a logic 0 results in a voltage between +5V and (V+ 0.6V). Each transmitter input has an internal 400kΩ pullup
3-11
RXIN
-30V < RXIN < +30V
ROUT
5kΩ
GND < VROUT < VCC
GND
FIGURE 3. RECEIVER
HIN230 thru HIN241
TIN
OR
RIN
TOUT
OR
ROUT
VOL
VOL
tPHL
tPLH
Average Propagation Delay =
tPHL + tPLH
2
FIGURE 4. PROPAGATION DELAY DEFINITION
Typical Performance Curves
TA = 25oC
12
12
TRANSMITTER OUTPUTS
OPEN CIRCUIT
SUPPLY VOLTAGE (|V|)
V- SUPPLY VOLTAGE
1µF
10
0.47µF
8
0.10µF
6
4
10
V+ (VCC = 5V)
8
6
V+ (VCC = 4.5V)
V- (VCC = 4.5V)
4
V- (VCC = 5V)
2
2
0
0
3.0
4.0
3.5
4.5
5.0
5.5
6.0
0
5
10
VCC
FIGURE 5. V- SUPPLY VOLTAGE vs VCC , VARYING
CAPACITORS
15
20
|ILOAD| (mA)
25
FIGURE 6. V+, V- OUTPUT VOLTAGE vs LOAD (HIN232)
Test Circuits (HIN232)
+4.5V TO
+5.5V INPUT
-
1µF
C3
1µF
C1
+
+
-
1µF +
C2 -
-
+
3kΩ
1µF C4
1 C1+
VCC 16
2 V+
GND 15
3kΩ
3 C1-
T1OUT 14
4 C2+
R1IN 13
RS-232 ±30V INPUT
5 C2-
R1OUT 12
TTL/CMOS OUTPUT
6 V7 T2OUT
8 R2IN
T1 OUTPUT
T1IN 11
TTL/CMOS INPUT
T2IN 10
TTL/CMOS INPUT
R2OUT 9
TTL/CMOS OUTPUT
1 C1+
VCC 16
2 V+
GND 15
3 C1-
T1OUT 14
4 C2+
R1IN 13
5 C2-
R1OUT 12
6 V7 T2OUT
8 R2IN
T1IN 11
T2IN 10
R2OUT 9
ROUT = VIN/1 T2OUT
T2
OUTPUT
T1OUT
VIN = ±2V
RS-232
±30V INPUT
FIGURE 7. GENERAL TEST CIRCUIT
3-12
30
A
FIGURE 8. POWER-OFF SOURCE RESISTANCE
CONFIGURATION
35
HIN230 thru HIN241
Applications
+5V
The HIN2XX may be used for all RS-232 data terminal and
communication links. It is particularly useful in applications
where ±12V power supplies are not available for
conventional RS-232 interface circuits. The applications
presented represent typical interface configurations.
TD
TTL/CMOS
INPUTS AND
OUTPUTS
RTS
6
5
11
-
RS-232
INPUTS AND OUTPUTS
+
T1
14
T2
10
TTL/CMOS RTS
INPUTS AND
12
RD
OUTPUTS
R2
9
CTS
7
13
R1
8
15
TD (2) TRANSMIT DATA
RTS (4) REQUEST TO SEND
RD (3) RECEIVE DATA
CTS (5) CLEAR TO SEND
SIGNAL GROUND (7)
FIGURE 9. SIMPLE DUPLEX RS-232 PORT WITH CTS/RTS
HANDSHAKING
-
14
T2
10
+ C2
1µF
5
T1
11
12
TD (2) TRANSMIT DATA
7
RTS (4) REQUEST TO SEND
13
RD (3) RECEIVE DATA
RD
CTS
HIN232
4
HIN232
3
9
3
C2 +
1µF TD
DTR (20) DATA
TERMINAL READY
DSRS (24) DATA
SIGNALING RATE
SELECT
2
4
In applications requiring four RS-232 inputs and outputs
(Figure 10), note that each circuit requires two charge pump
capacitors (C1 and C2) but can share common reservoir
capacitors (C3 and C4). The benefit of sharing common
reservoir capacitors is the elimination of two capacitors and
the reduction of the charge pump source impedance which
effectively increases the output swing of the transmitters.
1
16
1
C1 +
1µF -
A simple duplex RS-232 port with CTS/RTS handshaking is
illustrated in Figure 9. Fixed output signals such as DTR
(data terminal ready) and DSRS (data signaling rate select)
is generated by driving them through a 5kΩ resistor
connected to V+.
C1 +
1µF -
+
R2
R1
8
CTS (5) CLEAR TO SEND
15
16
6
2
-
C3
+
+
C4
V- V+
2µF
6
-
2µF
2
16
+5V
RS-232
INPUTS AND OUTPUTS
HIN232
C1 +
1µF DTR
TTL/CMOS
INPUTS AND
OUTPUTS
DSRS
1
4
3
5
T1
11
14
T2
10
12
7
13
DCD
R1
9
R2
R1
15
8
+ C2
1µF
-
DTR (20) DATA TERMINAL READY
DSRS (24) DATA SIGNALING RATE SELECT
DCD (8) DATA CARRIER DETECT
R1 (22) RING INDICATOR
SIGNAL GROUND (7)
FIGURE 10. COMBINING TWO HIN232s FOR 4 PAIRS OF RS-232 INPUTS AND OUTPUTS
3-13
HIN230 thru HIN241
Die Characteristics
DIE DIMENSIONS:
PASSIVATION:
160 mils x 140 mils
Type: Nitride over Silox
Nitride Thickness: 8kÅ
Silox Thickness: 7kÅ
METALLIZATION:
Type: Al
Thickness: 10kÅ ±1kÅ
TRANSISTOR COUNT:
238
SUBSTRATE POTENTIAL
PROCESS:
V+
CMOS Metal Gate
Metallization Mask Layout
HIN240
T2OUT T1OUT
T3OUT T4OUT
R3OUT
R3IN
T5IN
R2IN
SHUTDOWN
R2OUT
EN
T2IN
T5OUT
T1IN
R4IN
R1OUT
R4OUT
R1IN
T4IN
GND
T3IN
R5OUT
VCC
R5IN
C1+
3-14
V+
C1-
C2+
C2-
V-
HIN230 thru HIN241
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Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
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3-15
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