Renesas HKT100U μ-chip (rfid) Datasheet

HKT100***U/HKT100Y01U
µ-Chip (RFID)
REJ03P0006-0101
Rev.1.01
Feb 23, 2007
Overview
• HKT100***U/HKT100Y01U is RFID (Radio Frequency Identification) for 2.45 GHz.
• It has a unique ID inside, then it is applicable for management of individual object.
Note: "***" or "Y01" is a ROM code.
Feature
• Thin and small package: URP (PTSP0002ZA-A)
• Including unique µ-Chip ID which is not alterable
• Communication without contact
Note: "µ-Chip" and the µ-Chip Logo are either registered Trademarks or Trademarks of Hitachi,Ltd. in Japan and in
other countries.
Rev.1.01 Feb 23, 2007 page 1 of 13
HKT100***U/HKT100Y01U
Order Part No.
Order Part No.
HKT100***U
HKT100Y01U
Unit of Packaging
3,000
3,000
Packing Form
Taping
Taping
Outline and Mark
Mark
ROM code is indicated.
Rev.1.01 Feb 23, 2007 page 2 of 13
Unit of Order
75,000
3,000
Note
HKT100***U/HKT100Y01U
Absolute Maximum Ratings
Item
Symbol
Storage temperature
Specification
Tstg
Min
–30
Typ
—-
Max
75
Ta
Pr
0
—
25
—
40
13.8
Ambient operation temperature
Received power
Unit
Condition
Remark
°C
°C
dBm
No condensation
Electrical Characteristics
Measurement conditions:
Unless otherwise specified, Ta = 25°C, fc = 2.416 ± 0.010 GHz, reader power = 150 mW
Single-patch antenna, linearity polarized waves, clock cycle =10 µs, clock duty cycle = 85%
Period of reading operations: 8 clock cycles, number of read bits: 128 bits
Product is measured under the condition that it is pressed onto the antenna shown in figure 1.
Please refer the preceding sheet.
Item
Communication distance
µ-Chip ID Check
Notes: 1.
2.
3.
4.
Min
Specification
Typ
Max
6.5
—
—
Passed
13
—
Unit
cm
—
Condition
Remark
Note4
Note1
EDC Check
Note2, Note3
The distance at which the read µ-Chip ID value matches the indicated value and the EDC check is passed.
Verification value calculated from the read µ-Chip ID value.
Detail data of µ-Chip ID is describe on the commodity specification.
Relation between the evaluation antenna and antenna positions;
The planes of the gilded pattern for the evaluation antenna and the antenna itself should be parallel, the
center of the evaluation antenna should be on the line that passes through the center of the antenna plane,
and the gilded pattern’s longer side should be within the antenna’s plane of polarization.
Glass epoxy
Thickness 1.5 mm
1
2
5
W = 0.5
5
5
1
Gilding
5
3
φ3 × 4
29
29
100
Figure 1 Evaluation Antenna
Rev.1.01 Feb 23, 2007 page 3 of 13
10
φ3 × 4
HKT100***U/HKT100Y01U
Reader Specifications and Type No.: MR-STD2
Item
Symbol
Specification
Unit
Ta
fc
25
2.416 ± 0.010
°C
GHz
Power
Clock cycle
Pw
Tclk
150
10
mW
µs
Clock duty ratio
Data read cycle
duty
Tfm
85
8
%
Clock
Nb
128
Bits
Symbol
Specification
Unit
—
L
semi-rigid
20
—
cm
Operation temperature
Carrier frequency
Data read bit count
Remarks
Cable Specifications
Item
Cable material
Total length of cable
Remarks
Antenna Specifications and Type No.: PA1-2450AS
Item
Operation temperature
Symbol
Ta
Specification
25
Unit
°C
Polarization
Number of patches
—
—
Linear
1
—
pcs
Gain
—
7
dBi
Rev.1.01 Feb 23, 2007 page 4 of 13
Remarks
HKT100***U/HKT100Y01U
Dimension of Inlet Outline
Cathode mark
Unit: mm
Type No.
1.25 ± 0.15
0.3 ± 0.15
1.7 ± 0.15
2.5 ± 0.15
0.9 ± 0.15
0 to 0.10
Note: Cathode mark indicates GND side.
Rev.1.01 Feb 23, 2007 page 5 of 13
HKT100***U/HKT100Y01U
Packing Specifications
Taping Specification
1. Direction of Device
Carrier tape
Cathode mark
Device
Unreeling direction
2. Taping Dimensions
a. Carrier Tape and Cover Tape
Unit: mm
(1.5)
2.0 ± 0.08
( ): Reference only.
Device
Note: There are two kind of
carrier tape thickness used.
(φ1.1)
*0.20 ± 0.05
0.25 ± 0.05
(2.9)
(5.6)
4.0 ± 0.1
8.0 ± 0.2
1.75 ± 0.1
φ1.5 +− 0.1
0.0
3.5 ± 0.1
4.0 ± 0.1
Cover tape
(t 0.065)
Carrier tape
b. Leader and Trailer
Unit: mm
100 to 200
Trailer
Device
100 to 350
Carrier tape
200 to 1000
Cover tape
Leader
Rev.1.01 Feb 23, 2007 page 6 of 13
HKT100***U/HKT100Y01U
c. Reel Dimensions
2.0 ± 0.5
φ21.0 ± 0.8
Label
d. Example of Labeling
(For adapted lead free)
JAPAN
(1)
INT.C: HZU2.0BTRF-E
(2)
W/C:3D4 LOT: EC40020-0H
(3)
QTY:3000
Pb-Free T.
P/N:
RENESAS
Notes: 1.
2.
3.
4.
5.
Part No.
Management No. (Year, Month and Weekly code)
Quantity
Lot No.
Country of origin
Japan → JAPAN
Malaysia → MALAYSIA
Rev.1.01 Feb 23, 2007 page 7 of 13
(5)
(4)
φ178 ± 2
+ 0.5
− 1.0
φ13.0 ± 0.5
2.0
10.0 ± 1.5
Unit: mm
HKT100***U/HKT100Y01U
3. Specifications
Item
Breaking force (F) of cover tape
Rated Value
Breaking force (F) = 0.10 to 0.69 N (10 to 70 g)
<Measurement condition>
Cover tape
Peeling angle
= 0° to 10°
Carrier tape
Peeling speed = 5 mm/s
Carrier tape (enclosed device) flexibility
Bending radius ≥ 30 mm
Continuity
1. Missing devices ≤ 0.2% / Reel
2. Continuous miss = 0 / Reel
4. Material
Item
Material
Carrier tape
Conductive plastics
Cover tape
Reel
Plastics
Polystyrene
5. Quantity of Devices
3,000 pieces/Reel
Rev.1.01 Feb 23, 2007 page 8 of 13
HKT100***U/HKT100Y01U
Inner Packing Box
1 Reel
Unit: mm
Label
(185)
(185)
or
Label
(16)
(16)
(185)
(185)
2 ∼ 6 Reels
(185)
(77)
Label
( ): Reference only.
(185)
Example of Labeling
(9)
(1)
PID
06100P10CV-001
(2)
D/N
RKZ6.8TKJR1
(3)
QTY 8000
(4)
(5)
(6)
SPN RKZ6.8TKJR1 ZZZZ
Pb-Free T.
(7)
WP MADE IN JAPAN T/C 6C2 FL90030E0
AS MADE IN JAPAN S.LOT FL90030E0
(8)
(1) Pack-ID
(2) Device Name
Note: Indicate "Q" the end of a device name only in the
case of direct sale in Malaysia
(3) Quantity
(4) SAP Name
(5) Country of Wafer Process
(6) Country of Assembly
Japan → MADE IN JAPAN
Malaysia → MADE IN MALAYSIA
(7) Trace code
(8) Lot code
(9) Pb-Free indication (Only for Pb-free product)
(10) Date of Label issuance
Rev.1.01 Feb 23, 2007 page 9 of 13
2006/03/06
(10)
HKT100***U/HKT100Y01U
Appearance
There should not be any scratch or/and dirt that affect characteristics.
Quality Level
(Compliant with the JIS Z 9015)
Electrical characteristics: AQL = 4.0%
Appearance: AQL = 4.0%
Precautions on Usage
1. Renesas Technology does not guarantee the product characteristics after it has been through assembly on the
customer side.
2. Please refer to the mounting manual. (Document No.: REJ11P0006-0101)
3. As for this product, the electrostatic destruction prevention measures are not done because of the communication
characteristic priority. Therefore, the electrostatic destruction voltage is about 50 V in machine model (EIAJ), and
the static electricity level management in the process until a metallic antenna connecting is especially necessary.
System Outline
µ-Chip Inlet
µ-Chip
Antenna
Supply voltage / modulator
Logic circuit
Reader
Reset circuit
128-bit ROM
Clock demodulator
Function Blocks
Block Name
Supply voltage/modulator
Description of Functions
Generates power-supply voltage from carrier signals, varies the output impedance of the
modulator circuit to match the input impedance of the antenna, and handles
communications. The IC incorporates a power limiter for the protection of internal devices.
Reset circuit
Determines whether or not a clock signal is being supplied and cancels the reset mode in
synchronization with the first clock cycle.
Clock demodulator
Logic circuit
Demodulates the clock signal from the envelope signal of the received signal.
The IC includes an on-chip 128-bit ROM from which data signals are sent out in
synchronization with the clock signal.
Rev.1.01 Feb 23, 2007 page 10 of 13
HKT100***U/HKT100Y01U
Precautions for Storage, Transportation and Measuring
Note: These notes indicate a general item.
Please give priority to the notation in each C.S with Various kinds of notes originating in a product.
1. Other Precaution Involve Problems Occurring During Storage, Transportation and Measurement.
Although the general precautions for storage and transportation of electronic components can be applied as they are to
semiconductor devices, the latter require certain special precautions in addition to these. The following account
includes the general precautions.
1.1
Storage of Semiconductor Devices
The following methods of storage are advisable for semiconductor devices. If the precautions are not observed, faults
in electrical characteristics, solderability, external appearance and other attributes may occur. In some cases, failure
may also result. Precautions for storage are as follows,
(1) The storage location should be kept within the optimum ranges of temperature and humidity: 5 to 35°C and 45 to
75% R.H. are the optimal conditions.
(2) The atmosphere in the storage location should not contain any noxious gases, and the amount of dust should be
minimal.
(3) Storage containers should not be susceptible to static electricity.
(4) Semiconductor devices should not be subjected to loads.
(5) When strong for long periods, store in the non-processed state. When leads have already been formed, corrosion at
their bent portion of leads may occur.
(6) Be sure that sudden temperature changes sufficient to cause condensation do not occur during storage of the devices.
1.2
Precautions for Transportation
When transporting semiconductor devices or their assembly units or subsystems, the same precautions as for other
electronic components should be taken. The items listed in 1.1 and 1.2 have to be followed.
(1) Transportation containers, jigs etc., should not pick up static charge due to vibration en route.
(2) Persons handling semiconductor devices should be grounded via a high resistance to discharge any static electricity
that may be adhering to their clothing. The resistance value should be around 1 Mٶ and no other person should
come between the person being discharged and ground (GND).
(3) When transporting semiconductor devices and PCBs, try to keep mechanical vibration and shocks to an absolute
minimum.
Rev.1.01 Feb 23, 2007 page 11 of 13
HKT100***U/HKT100Y01U
2. Soldering
2.1
SMD Diodes are Formed in Consideration of PCB Mount Ability, and can be Mounted without
Modification.
(1) When mounting on PCB, adhesive is used to temporarily hold diodes in place before solder is applied. When as
SMD diodes is held by adhesive, be sure that it is not subjected to undue stress.
(2) Using a mounter to fix SMD diodes to a PCB can result in bending of the leads, and diode package destroy, so make
sure that a force of no more than 3 N is applied and also required to not apply any force on the leads as being
mounted, especially for flat package.
(3) When mounting diodes to circuit board, so make sure that flatten on the PCB. (Not becoming rough by wiring
under diode body.)
(4) Please superfluous power does not join a product by the curvature of a circuit board or bending by circuit board
bread etc.
(5) Since SMD diodes come in small package, be aware of thermal stress from soldering as small as possible. Keep to
the following conditions.
 When flow soldering: 260°C max. for 10 s
 When using a soldering iron: 350°C max. for 3 s
(6) The material of lead is exposed for cutting plane. Therefore, soldering nature of lead tip part is considered as
unquestioned. Please kindly consider soldering nature.
(7) When the SMD is mounted through reflow soldering, avoid incorrect positioning and floating-type failures due to
bad mounting balance by taking care on the following points.
 The left and right land patterns must have the same shape.
 The left and right land areas, including the wiring sections, must take up the same area and include the same
amount of solder.
 The land position should become symmetrical.
 Heat must be applied to both soldering sections at the same time (the direction shown in follow is recommended).
Product
Reflow direction
Substrate
Soldering Conditions Using Reflow Soldering Method
Lead plating
Solder paste
Sn-Pb / Au / Sn-Bi
Sn-Pb eutectic / Sn-Ag system
Package surface temperature (Upper limit)
Temperature profile
Peak temperature: 260°C 220°C or greater for 60 s or less
Package surface
temperature
(7)
(6)
(4)
(5)
(1)
(2)
(3)
(4)
(2)
(5) 220°C 60 s Max
(6) 255°C 16 s Max
(7) 260°C Max
Reflow cycle: 2 times max.
(3)
(1)
Time
Rev.1.01 Feb 23, 2007 page 12 of 13
110 ± 30 s
160°C
190°C
1 to 4°C/s
HKT100***U/HKT100Y01U
3. Cleaning
3.1
Fading of the Marking and Color Codes
Clearness of marking and color-fastness of color codes may be lost due to cleaning.
Be sure to check these after using cleaning agents.
3.2
Electrical and Mechanical Characteristics (Discoloration, Deformation, Denaturation, etc.)
After cleaning a PCB, some corrosive material contained in the cleaning agent or flux may remain on semiconductor
devices, causing corrosion of device wiring and leads with resulting loss of reliability.
Thorough cleaning is therefore required for PCBs. It is recommended that level of purity of the PCB after cleaning
should conform with the MIL standard below.
PCB Level of Purity after Cleaning
Item
Standard
Remaining Cl volume
Resistance of solvent (after extraction)
≤ 1 µg/cm
6
≥ 2 × 10 Ω.cm
2
Notes: 1. PCB surface area: Both sides of the PCB + mounted components.
2. Extract solvent: Isopropyl alcohol (75 vol%) + H2O (25 vol%)
(Resistance of solvent before extraction is ≥ 6 × 106 Ω.cm)
3. Extraction method: Clean both sides of PCB with 10 ml / 2.54 × 2.54 cm2 (minimum of 1 min.)
4. Measuring extracted solvent resistance: Conductivity meter
See MIL-P-28809A for details of the MIL standard.
3.3
Ultrasonic Cleaning
It should be avoid resonation of the devices to prevent the device being destroyed.
• SMD
Frequency:
Ultrasonic power output:
Time:
Others:
28 to 29 kHz (device should not be resonated)
15 W/1 (1 time)
Up to 30 s
Make sure that neither devices not PCB come into contact with the vibration source.
Note: To ensure prompt handling of customer queries, the following information should be provided concerning the
diode product used;
(1) Product Name (INT.C)
(2) Lot No. (LOT)
(3) Weekly Code (W/C)
Items (1), (2) and (3) above are printed on the label attached to the packing case, reel, etc.
Rev.1.01 Feb 23, 2007 page 13 of 13
Sales Strategic Planning Div.
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
Notes:
1. This document is provided for reference purposes only so that Renesas customers may select the appropriate Renesas products for their use. Renesas neither makes
warranties or representations with respect to the accuracy or completeness of the information contained in this document nor grants any license to any intellectual property
rights or any other rights of Renesas or any third party with respect to the information in this document.
2. Renesas shall have no liability for damages or infringement of any intellectual property or other rights arising out of the use of any information in this document, including,
but not limited to, product data, diagrams, charts, programs, algorithms, and application circuit examples.
3. You should not use the products or the technology described in this document for the purpose of military applications such as the development of weapons of mass
destruction or for the purpose of any other military use. When exporting the products or technology described herein, you should follow the applicable export control laws
and regulations, and procedures required by such laws and regulations.
4. All information included in this document such as product data, diagrams, charts, programs, algorithms, and application circuit examples, is current as of the date this
document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas products listed in this document,
please confirm the latest product information with a Renesas sales office. Also, please pay regular and careful attention to additional and different information to be
disclosed by Renesas such as that disclosed through our website. (http://www.renesas.com )
5. Renesas has used reasonable care in compiling the information included in this document, but Renesas assumes no liability whatsoever for any damages incurred as a
result of errors or omissions in the information included in this document.
6. When using or otherwise relying on the information in this document, you should evaluate the information in light of the total system before deciding about the applicability
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or otherwise in systems the failure or malfunction of which may cause a direct threat to human life or create a risk of human injury or which require especially high quality
and reliability such as safety systems, or equipment or systems for transportation and traffic, healthcare, combustion control, aerospace and aeronautics, nuclear power, or
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(1) artificial life support devices or systems
(2) surgical implantations
(3) healthcare intervention (e.g., excision, administration of medication, etc.)
(4) any other purposes that pose a direct threat to human life
Renesas shall have no liability for damages arising out of the uses set forth in the above and purchasers who elect to use Renesas products in any of the foregoing
applications shall indemnify and hold harmless Renesas Technology Corp., its affiliated companies and their officers, directors, and employees against any and all
damages arising out of such applications.
9. You should use the products described herein within the range specified by Renesas, especially with respect to the maximum rating, operating supply voltage range,
movement power voltage range, heat radiation characteristics, installation and other product characteristics. Renesas shall have no liability for malfunctions or damages
arising out of the use of Renesas products beyond such specified ranges.
10. Although Renesas endeavors to improve the quality and reliability of its products, IC products have specific characteristics such as the occurrence of failure at a certain
rate and malfunctions under certain use conditions. Please be sure to implement safety measures to guard against the possibility of physical injury, and injury or damage
caused by fire in the event of the failure of a Renesas product, such as safety design for hardware and software including but not limited to redundancy, fire control and
malfunction prevention, appropriate treatment for aging degradation or any other applicable measures. Among others, since the evaluation of microcomputer software
alone is very difficult, please evaluate the safety of the final products or system manufactured by you.
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Renesas shall have no liability for damages arising out of such detachment.
12. This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written approval from Renesas.
13. Please contact a Renesas sales office if you have any questions regarding the information contained in this document, Renesas semiconductor products, or if you have
any other inquiries.
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RENESAS SALES OFFICES
Refer to "http://www.renesas.com/en/network" for the latest and detailed information.
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© 2007. Renesas Technology Corp., All rights reserved. Printed in Japan.
Colophon .7.0