AVAGO HLMP-3350-L0NVX T-13/4 (5 mm), t-1 (3 mm), ultra-bright led lamp Datasheet

HLMP-3707, HLMP-3907, HLMP-3750, HLMP-3850,
HLMP-3950, HLMP-3960, HLMP-3390, HLMP-3490,
HLMP-3590, HLMP-1340, HLMP-1440, HLMP-1540,
HLMP-K640
T-13/4 (5 mm), T-1 (3 mm), Ultra-Bright LED Lamps
Data Sheet
Description
Features
These non-diffused lamps out-perform conventional
LED lamps. By utilizing new higher intensity material, we
achieve superior product performance.
x Improved brightness
The HLMP-3750/-3390/-1340 Series Lamps are Gallium
Arsenide Phosphide on Gallium Phosphide red light emitting diodes. The HLMP-3850/-3490/-1440 Series are Gallium Arsenide Phosphide on Gallium Phosphide yellow
light emitting diodes. The HLMP-3950/3590/3960/1540/
K640 Series Lamps are Gallium Phosphide green light
emitting diodes.
x New sturdy leads
x Improved color performance
x Available in popular T-1 and T-13/4 packages
x IC compatible/low current capability
x Reliable and rugged
x Choice of 3 bright colors
- High Efficiency Red
- High Brightness Yellow
- High Performance Green
Applications
x Lighted switches
x Backlighting front panels
x Light pipe sources
x Keyboard indicators
Selection Guide
Luminous Intensity Iv (mcd) @ 20mA
Package
Description
Color
Device
HLMP-
Min.
Typ.
Max.
2q1/2 Degree
Package
Outline
T-13/4
Red
3707-L00xx
90.2
-
-
24
F
3750
90.2
125.0
-
24
A
3750-L00xx
90.2
125.0
-
24
A
3850
96.2
140.0
-
24
A
3850-K00xx
96.2
140.0
-
24
A
3850-KL0xx
96.2
150.0
294.0
24
A
3907-K00xx
111.7
-
-
24
F
3914-K00xx
111.7
-
-
24
D
3950
111.7
265.0
-
24
A
3950-K00xx
111.7
265.0
-
24
A
3950-LM0xx
170.0
300.0
490.0
24
A
3960-K0xxx
111.7
265.0
-
24
E
Red
3390
35.2
55.0
-
32
B
Yellow
3490
37.6
55.0
-
32
B
Green
3590
43.6
55.0
-
32
B
Red
1340
35.2
55.0
-
45
C
1340-H00xx
13.8
-
-
45
C
1340-J00xx
35.2
55.0
-
45
C
1440
23.5
45.0
-
45
C
1440-H00xx
23.5
45.0
-
45
C
1540
27.3
45.0
-
45
C
1540-H00xx
27.3
45.0
-
45
C
1540-IJ0xx
43.6
60.0
139.6
45
C
K640
4.2
21.0
-
45
C
K640-FGNxx
10.6
20.0
34.0
45
C
Yellow
Green
T-13/4 Low Profile
T-1
Yellow
Green
Emerald Green
2
Package Dimensions
9.19 (0.362)
8.43 (0.332)
25.40
(1.00) MIN.
1.27 (0.050)
NOM.
9.07 (0.357)
8.56 (0.337)
12.47 (0.491)
11.71 (0.461)
0.89 (0.035)
0.64 (0.025)
0.89 (0.035)
0.64 (0.025)
0.102 (0.004)
MAX. TYP.
0.10 (0.004)
MAX.
0.46 (0.018)
SQUARE
NOMINAL
1.52 (0.060)
1.02 (0.040)
6.10 (0.240)
5.59 (0.220)
0.74 (0.029)
0.58 (0.023)
SQUARE
‡
6.10 (0.240)
5.60 (0.220)
CATHODE
FLAT
2.54 (0.100)
NOM.
PACKAGE OUTLINE "D"
HLMP-3914
3
9.07 (0.357)
8.56 (0.337)
13.11 (0.516)
12.34 (0.486)
0.89 (0.035)
0.64 (0.025)
1.02 (0.040)
MAX.
1.02 (0.040) MAX.
EPOXY
MENISCUS
1.32 (0.052)
1.02 (0.040)
23.0
MIN.
(0.900)
22.86
MIN.
(0.900)
CATHODE
LEAD
(NOTE 1)
5.08 (0.200)
4.78 (0.188)
5.08 (0.200)
4.78 (0.188)
5.08 (0.200)
4.57 (0.180)
2.54 (0.100)
NOM.
PACKAGE OUTLINE "E"
HLMP-3960
1.52 (0.060)
1.02 (0.040)
0.53 (0.021)
SQ.
0.43 (0.017)
6.10 (0.240)
5.60 (0.220)
CATHODE
FLAT
2.79 (0.110)
2.29 (0.090)
PACKAGE OUTLINE "F"
HLMP-3707/3907
Part Numbering System
HLMP - x x xx - x x x xx
Mechanical Options
00: Bulk
01: Tape & Reel, Crimped Leads
02, Bx: Tape & Reel, Straight Leads
A1, B1: Right Angle Housing, Uneven Leads
A2, B2: Right Angle Housing, Even Leads
Dx, Ex: Ammo Pack, Straight Leads
FH: 2 Iv Bin Select with Inventory Control
Vx: Ammo Pack, Crimped Leads
Color Bin Options
0: Full Color Bin Distribution
N: Color Bin 6 & 7 Only
Maximum Iv Bin Options
0: Open (No. Max. Limit)
Others: Please Refer to the Iv Bin Table
Minimum Iv Bin Options
Please Refer to the Iv Bin Table
Color Options
3, 7: GaP HER
4, 8: GaP Yellow (except K4xx series)
5, 9: GaP Green
6: GaP Emerald Green
Package Option
1, K: T-1 (3 mm)
3: T-13/4 (5 mm)
Absolute Maximum Ratings at TA = 25°C
Parameter
Red
Yellow
Green/Emerald Green
Units
Peak Forward Current
90
60
90
mA
Average Forward Current[1]
25
20
25
mA
DC Current[2]
30
20
30
mA
Transient Forward Current[3]
500
500
500
mA
Reverse Voltage (IR = 100 μA)
5
5
5
V
LED Junction Temperature
110
110
110
°C
Operating Temperature Range
-40 to +100
-40 to +100
-20 to +100
°C
Storage Temperature Range
-40 to +100
-40 to +100
-40 to +100
°C
(10 μs Pulse)
Notes:
1. See Figure 2 to establish pulsed operating conditions.
2. For Red and Green series derate linearly from 50°C at 0.5 mA/°C. For Yellow series derate linearly from 50°C at 0.2 mA/°C.
3. The transient peak current is the maximum non-recurring peak current the devices can withstand without damaging the LED die and wire bonds.
It is not recommended that the device be operated at peak currents beyond the Absolute Maximum Peak Forward Current.
4
Electrical/Optical Characteristics at TA = 25°C
T-13/4
Low Dome
Test
Conditions
Symbol
Description
T-13/4
OPEAK
Peak
Wavelength
37xx
38xx
39xx
3390
3490
3590
1340
1440
1540
K640
635
583
565
558
nm
Measurement
at Peak
Od
Dominant
Wavelength
37xx
38xx
39xx
3390
3490
3590
1340
1440
1540
K640
626
585
569
560
nm
Note 1
'O3/4
Spectral Line
Halfwidth
37xx
38xx
39xx
3390
3490
3590
1340
1440
1540
K640
40
36
28
24
nm
Ws
Speed of
Respond
37xx
38xx
39xx
3390
3490
3590
1340
1440
1540
K640
90
90
500
3100
ns
C
Capacitance
37xx
38xx
39xx
3390
3490
3590
1340
1440
1540
K640
11
15
18
35
pF
VF = 0,
f = 1 MHz
RTJ-PIN
Thermal
Resistance
37xx
38xx
39xx
3390
3490
3590
°C/W
Junction to
Cathode Lead
1340
1440
1540
K640
210
210
210
510
290
290
290
290
V
IF = 20 mA
(Figure 3)
V
IF = 100 μA
lumens
watt
Note 2
T-1
Min.
VF
Forward
Voltage
37xx
38xx
39xx
3390
3490
3590
1340
1440
1540
K640
1.5
1.5
1.5
VR
Reverse
Breakdown
Voltage
37xx
38xx
39xx
3390
3490
3590
1340
1440
1540
K640
5.0
Kv
Luminous
Efficacy
37xx
38xx
39xx
3390
3490
3590
1340
1440
1540
K640
Typ.
1.9
2.1
2.2
2.2
145
500
595
655
Max.
2.6
2.6
3.0
3.0
Units
Notes:
1. The dominant wavelength, Od, is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the
device.
2. The radiant intensity, Ie, in watts per steradian, may be found from the equation Ie = IV/KV , where IV is the luminous intensity in candelas and KV is
the luminous efficacy in lumens/watt.
5
Red, Yellow, and Green
1.0
EMERALD GREEN
T A= 25° C
RELATIVE INTENSITY
GREEN
HIGH EFFICIENCY RED
0.5
YELLOW
0
500
550
600
650
700
WAVELENGTH – nm
Figure 1. Relative intensity vs. wavelength.
Figure 2. Maximum tolerable peak current vs. pulse duration.
(IDC MAX as per MAX ratings).
Figure 3. Forward current vs. forward voltage.
Figure 4. Relative luminous intensity vs. forward current.
Figure 5. Relative efficiency (luminous intensity
per unit current) vs. peak current.
6
Figure 6. Relative luminous intensity vs. angular displacement.
T-13/4 lamp.
Figure 7. Relative luminous intensity vs. angular displacement.
T-13/4 low profile lamp.
Intensity Bin Limits
Figure 8. Relative luminous intensity vs. angular displacement.
T-1 lamp.
Color
Bin
Intensity Range (mcd)
Min.
Max.
Red
G
9.7
15.5
H
15.5
24.8
I
24.8
39.6
J
39.6
63.4
K
63.4
101.5
L
101.5
162.4
M
162.4
234.6
N
234.6
340.0
O
340.0
540.0
P
540.0
850.0
Q
850.0
1200.0
R
1200.0
1700.0
S
1700.0
2400.0
T
2400.0
3400.0
U
3400.0
4900.0
V
4900.0
7100.0
W
7100.0
10200.0
X
10200.0
14800.0
Y
14800.0
21400.0
Z
21400.0
30900.0
Maximum tolerance for each bin limit is ±18%.
7
Intensity Bin Limits (continued)
Color Categories
Color
Bin
Intensity Range (mcd)
Min.
Max.
Yellow
F
10.3
16.6
G
16.6
H
Cat #
Lambda (nm)
Min.
Max.
9
552.5
555.5
26.5
8
555.5
558.5
26.5
42.3
7
558.5
561.5
I
42.3
67.7
6
561.5
564.5
J
67.7
108.2
6
561.5
564.5
K
108.2
173.2
5
564.5
567.5
L
173.2
250.0
4
567.5
570.5
M
250.0
360.0
3
570.5
573.5
N
360.0
510.0
2
573.5
576.5
O
510.0
800.0
1
582.0
584.5
P
800.0
1250.0
3
584.5
587.0
Q
1250.0
1800.0
2
587.0
589.5
R
1800.0
2900.0
4
589.5
592.0
S
2900.0
4700.0
5
592.0
593.0
T
4700.0
7200.0
1
597.0
599.5
U
7200.0
11700.0
2
599.5
602.0
V
11700.0
18000.0
3
602.0
604.5
W
18000.0
27000.0
4
604.5
607.5
Green/
A
1.1
1.8
5
607.5
610.5
Emerald
B
1.8
2.9
6
610.5
613.5
Green
C
2.9
4.7
7
613.5
616.5
D
4.7
7.6
8
616.5
619.5
E
7.6
12.0
F
12.0
19.1
G
19.1
30.7
H
30.7
49.1
I
49.1
78.5
J
78.5
125.7
K
125.7
201.1
L
201.1
289.0
M
289.0
417.0
N
417.0
680.0
O
680.0
1100.0
P
1100.0
1800.0
Q
1800.0
2700.0
R
2700.0
4300.0
S
4300.0
6800.0
T
6800.0
10800.0
U
10800.0
16000.0
V
16000.0
25000.0
W
25000.0
40000.0
Maximum tolerance for each bin limit is ±18%.
8
Color
Emerald Green
Green
Yellow
Orange
Maximum tolerance for each bin limit is ±0.5 nm.
Mechanical Option Matrix
Mechanical
Option Code
Definition
00
Bulk Packaging, minimum increment 500 pcs/bag
01
Tape & Reel, crimped leads, min. increment 1300 pcs/bag for T-13/4, 1800 pcs/bag for T-1
02
Tape & Reel, straight leads, min. increment 1300 pcs/bag for T-13/4, 1800 pcs/bag for T-1
A1
T-1, Right Angle Housing, uneven leads, minimum increment 500 pcs/bag
A2
T-1, Right Angle Housing, even leads, minimum increment 500 psc/bag
B1
T-13/4, Right Angle Housing, uneven leads, minimum increment 500 pcs/bag
B2
T-13/4, Right Angle Housing, even leads, minimum increment 500 psc/bag
BJ
T-1, Tape & Reel, straight leads, minimum increment 2000 pcs/bag
EG
Ammo Pack, straight leads in 5 K increment
FH
Devices that require inventory control and 2 Iv bin select
VR
Ammo Pack, crimped leads, min. increment 2 k for T-13/4 and T-1
Note:
All categories are established for classification of products. Products may not be available in all categories. Please contact your local Avago representative for further clarification/information.
9
Precautions:
Lead Forming:
x The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering on PC board.
x For better control, it is recommended to use proper
tool to precisely form and cut the leads to applicable
length rather than doing it manually.
x If manual lead cutting is necessary, cut the leads after
the soldering process. The solder connection forms a
mechanical ground which prevents mechanical stress
due to lead cutting from traveling into LED package.
This is highly recommended for hand solder operation,
as the excess lead length also acts as small heat sink.
Soldering and Handling:
x Care must be taken during PCB assembly and soldering
process to prevent damage to the LED component.
x LED component may be effectively hand soldered
to PCB. However, it is only recommended under
unavoidable circumstances such as rework. The closest
manual soldering distance of the soldering heat source
(soldering iron’s tip) to the body is 1.59mm. Soldering
the LED using soldering iron tip closer than 1.59mm
might damage the LED.
1.59 mm
x ESD precaution must be properly applied on the
soldering station and personnel to prevent ESD
damage to the LED component that is ESD sensitive.
Do refer to Avago application note AN 1142 for details.
The soldering iron used should have grounded tip to
ensure electrostatic charge is properly grounded.
x Recommended soldering condition:
Wave
Soldering[1],[2]
Manual Solder
Dipping
Pre-heat Temperature 105°C Max.
–
Pre-heat Time
60 sec Max.
–
Peak Temperature
250°C Max.
260°C Max.
Dwell Time
3 sec Max.
5 sec Max.
Note:
1. Above conditions refers to measurement with thermocouple
mounted at the bottom of PCB.
2. It is recommended to use only bottom preheaters in order to
reduce thermal stress experienced by LED.
10
x Wave soldering parameters must be set and maintained
according to the recommended temperature and dwell
time. Customer is advised to perform daily check on the
soldering profile to ensure that it is always conforming
to recommended soldering conditions.
Note:
1. PCB with different size and design (component density) will
have different heat mass (heat capacity). This might cause a
change in temperature experienced by the board if same wave
soldering setting is used. So, it is recommended to re-calibrate
the soldering profile again before loading a new type of PCB.
2. Customer is advised to take extra precaution during wave
soldering to ensure that the maximum wave temperature
does not exceed 250°C and the solder contact time does not
exceeding 3sec. Over-stressing the LED during soldering process
might cause premature failure to the LED due to delamination.
x Any alignment fixture that is being applied during
wave soldering should be loosely fitted and should
not apply weight or force on LED. Non metal material
is recommended as it will absorb less heat during wave
soldering process.
x At elevated temperature, LED is more susceptible to
mechanical stress. Therefore, PCB must allowed to cool
down to room temperature prior to handling, which
includes removal of alignment fixture or pallet.
x If PCB board contains both through hole (TH) LED and
other surface mount components, it is recommended
that surface mount components be soldered on the
top side of the PCB. If surface mount need to be on the
bottom side, these components should be soldered
using reflow soldering prior to insertion the TH LED.
x Recommended PC board plated through holes (PTH)
size for LED component leads.
LED Component
Lead Size
Diagonal
Plated Through
Hole Diameter
0.45 x 0.45 mm
(0.018 x 0.018 inch)
0.636 mm
(0.025 inch)
0.98 to 1.08 mm
(0.039 to 0.043 inch)
0.50 x 0.50 mm
(0.020 x 0.020 inch)
0.707 mm
(0.028 inch)
1.05 to 1.15 mm
(0.041 to 0.045 inch)
x Over-sizing the PTH can lead to twisted LED after
clinching. On the other hand under sizing the PTH can
cause difficulty inserting the TH LED.
Refer to application note AN5334 for more information
about soldering and handling of TH LED lamps.
Example of Wave Soldering Temperature Profile for TH LED
LAMINAR
HOT AIR KNIFE
TURBULENT WAVE
250
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
Flux: Rosin flux
Solder bath temperature:
245°C± 5°C (maximum peak temperature = 250°C)
TEMPERATURE (°C)
200
Dwell time: 1.5 sec – 3.0 sec (maximum = 3sec)
150
Note: Allow for board to be sufficiently cooled to
room temperature before exerting mechanical force.
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
100
Flux: Rosin flux
Solder bath temperature:
245°C± 5°C (maximum peak temperature = 250°C)
50
PREHEAT
Dwell time: 1.5 sec – 3.0 sec (maximum = 3sec)
0
10
20
30
40
50
60
TIME (MINUTES)
70
80
90
100 Note: Allow for board to be sufficiently cooled to
room temperature before exerting mechanical force.
Packaging Label:
(i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box)
(1P) Item: Part Number
STANDARD LABEL LS0002
RoHS Compliant
e3
max temp 250C
(1T) Lot: Lot Number
(Q) QTY: Quantity
LPN:
CAT: Intensity Bin
(9D)MFG Date: Manufacturing Date
BIN: Color Bin
(P) Customer Item:
11
(V) Vendor ID:
(9D) Date Code: Date Code
DeptID:
Made In: Country of Origin
(ii) Avago Baby Label (Only available on bulk packaging)
Lamps Baby Label
(1P) PART #: Part Number
RoHS Compliant
e3
max temp 250C
(1T) LOT #: Lot Number
(9D)MFG DATE: Manufacturing Date
QUANTITY: Packing Quantity
C/O: Country of Origin
Customer P/N:
CAT: Intensity Bin
Supplier Code:
BIN: Color Bin
DATECODE: Date Code
For product information and a complete list of distributors, please go to our web site:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2010 Avago Technologies. All rights reserved. Obsoletes 5989-4254EN
AV02-1556EN - May 10, 2010
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