AVAGO HLMP-BD06-RSTXX 5mm mini oval precision optical performance alingap lamp Datasheet

HLMP-ADxx/AGxx/ALxx/BDxx/BGxx/BLxx
5mm mini Oval Precision Optical Performance
AlInGaP Lamps
Data Sheet
Description
Features
These Precision Optical Performance Oval LEDs are specifically designed for full color/video and passenger information signs. The oval shaped radiation pattern (35° x 70°)
and high luminous intensity ensure that these devices
are excellent for wide field of view outdoor application
where a wide viewing angle and readability in sunlight
are essential. These lamps have very smooth, matched
radiation patterns ensuring consistent color mixing in full
color applications, message uniformity across the viewing
angle of the sign.
• Well defined spatial radiation pattern
High efficiency LED material is used in these lamps:
Aluminum Indium Gallium Phosphide (AlInGaP) for amber
and red. Each lamp is made with an advance optical grade
epoxy offering superior high temperature and high
moisture resistance in outdoor applications. The package
epoxy contains both UV-A and UV-B inhibitors to reduce
the effects of long term exposure to direct sunlight.
Designers can select parallel or perpendicular orientation.
Both lamps are available in tinted version.
Benefits
• Viewing angle designed for wide field of view
application
• Superior performance in outdoor environments
• Viewing angles:
Major axis 70°
Minor axis 35°
• High luminous output
• Red and Amber intensity are available for:
AlInGaP (Bright) AlInGaP II (Brightest)
• Colors:
626 nm red
630 nm red
590 nm amber
592 nm amber
• Superior resistance to moisture
• UV resistant epoxy
Applications
• Full color/video signs
Table 1. Device Selection Guide for AlInGaP II
Part Number
Color and Dominant
Wavelength
ld (nm) Typ.
Luminous
Intensity
Iv (mcd)
at 20 mA Min.
Luminous
Intensity
Iv (mcd)
at 20 mA Max.
Stand-Off
Leadframe
Orientation
Package
Drawing
HLMP-AD06-NSTxx
Red 630
680
2500
No
Parallel
A
HLMP-AD06-P00xx
Red 630
880
No
Parallel
A
HLMP-AD06-P0Txx
Red 630
880
No
Parallel
A
HLMP-AD06-PQ0xx
Red 630
880
1500
No
Parallel
A
HLMP-AD06-RSTxx
Red 630
1500
2500
No
Parallel
A
HLMP-AD06-STTxx
Red 630
1900
3200
No
Parallel
A
HLMP-AD16-P00xx
Red 630
880
Yes
Parallel
B
HLMP-AD16-QTTxx
Red 630
1150
3200
Yes
Parallel
B
HLMP-AD16-RS0xx
Red 630
1500
2500
Yes
Parallel
B
HLMP-AD16-RSTxx
Red 630
1500
2500
Yes
Parallel
B
HLMP-AD16-RUTxx
Red 630
1500
4200
Yes
Parallel
B
HLMP-AD16-ST0xx
Red 630
1900
3200
Yes
Parallel
B
HLMP-AD16-STTxx
Red 630
1900
3200
Yes
Parallel
B
HLMP-AL16-RSRxx
Amber 592
1500
2500
Yes
Parallel
B
HLMP-AL16-RSKxx
Amber 592
1500
2500
Yes
Parallel
B
HLMP-BD06-L00xx
Red 630
400
No
Perpendicular
C
HLMP-BD06-P00xx
Red 630
880
No
Perpendicular
C
HLMP-BD06-RS0xx
Red 630
1500
2500
No
Perpendicular
C
HLMP-BD06-RSTxx
Red 630
1500
2500
No
Perpendicular
C
HLMP-BD06-STTxx
Red 630
1900
3200
No
Perpendicular
C
HLMP-BD16-NP0xx
Red 630
680
1150
Yes
Perpendicular
D
HLMP-BD16-QRTxx
Red 630
1150
1900
Yes
Perpendicular
D
HLMP-BD16-RU0xx
Red 630
1500
4200
Yes
Perpendicular
D
HLMP-BD16-RUTxx
Red 630
1500
4200
Yes
Perpendicular
D
HLMP-BD16-ST0xx
Red 630
1900
3200
Yes
Perpendicular
D
HLMP-BD16-STTxx
Red 630
1900
3200
Yes
Perpendicular
D
HLMP-BL06-N00xx
Amber 592
680
No
Perpendicular
C
Table 2. Device Selection Guide for AlInGaP
Part Number
Color and Dominant
Wavelength
ld (nm) Typ.
Luminous
Intensity
Iv (mcd)
at 20 mA Min.
Luminous
Intensity
Iv (mcd)
at 20 mA Max.
HLMP-AG01-K00xx
Red 626
HLMP-AL01-L00xx
Amber 590
HLMP-AL01-LP0xx
Amber 590
400
HLMP-AL01-N00xx
Amber 590
680
HLMP-AL01-NR0xx
Amber 590
680
1900
HLMP-AL01-PQKxx
Amber 590
880
HLMP-AL11-NR0xx
Amber 590
HLMP-BG01-LM0xx
Red 626
HLMP-BG01-MN0xx
Stand-Off
Leadframe
Orientation
Package
Drawing
310
No
Parallel
A
400
No
Parallel
A
No
Parallel
A
No
Parallel
A
No
Parallel
A
1150
No
Parallel
A
880
1900
Yes
Parallel
B
400
520
No
Perpendicular
C
Red 626
520
680
No
Perpendicular
C
HLMP-BL01-NR0xx
Red 626
680
1900
No
Perpendicular
C
HLMP-BL11-KN0xx
Red 626
310
880
Yes
Perpendicular
D
HLMP-BL11-NR0xx
Red 626
680
1900
Yes
Perpendicular
D
1150
Part Numbering System
HLMP - X X X X - X X X XX
Mechanical Options
00: Bulk Packaging
DD: Ammo Pack
YY: Flexi-Bin; Bulk Packaging
ZZ: Flexi-Bin; Ammo Pack
Color Bin
0: No Color Bin Limitation
B: Color bin 2 and 3 only
K: Color bins 2 and 4 only
R: Color Bins 1, 2, 4, and 6 with VF max of 2.6 V
S: Color bins 2 and 4 with VF max of 2.6 V
T: Red Color with VF max of 2.6 V
Maximum Intensity Bin
0: No Iv Bin Limitation
Minimum Intensity Bin
Tint Option
1 or 6: Matching Color Tints
Standoff Option
0: Without
1: With
Color
D: 630 nm Red
G: 626 nm Red
L: 590 or 592 nm Amber
Package
A: 5 mm Mini Oval, Parallel
B: 5 mm Mini Oval, Perpendicular
Note: Please refer to AB 5337 for complete information on part numbering system.
Package Dimensions
8.71 ± 0.20
(0.343 ± 0.008)
5.00 ± 0.20
(0.197 ± 0.008)
0.50 ± 0.10 SQ. TYP.
(0.020 ± 0.004)
2.54 ± 0.38
(0.100 ± 0.015)
0.70 (0.028)
MAX.
A
1.00 MIN.
(0.039)
CATHODE
LEAD
31.60
MIN.
(1.244)
8.71 ± 0.20
(0.343 ± 0.008)
5.00 ± 0.20
(0.197 ± 0.008)
1.50 ±0.15
(0.059 ± 0.006)
0.50 ± 0.10 SQ. TYP.
(0.020 ± 0.004)
0.70 (0.028)
MAX.
2.54 ± 0.38
(0.100 ± 0.015)
B
+ 0.13
11.70 – 0.08
0.005
(0.461 +– 0.003
)
1.00 MIN.
(0.039)
CATHODE
LEAD
31.60
MIN.
(1.244)
8.71 ± 0.20
(0.343 ± 0.008)
5.00 ± 0.20
(0.197 ± 0.008)
0.50 ± 0.10 SQ. TYP.
(0.020 ± 0.004)
2.54 ± 0.38
(0.100 ± 0.015)
0.70 (0.028)
MAX.
C
1.00 MIN.
(0.039)
CATHODE
LEAD
31.60 MIN.
(1.244)
8.71 ± 0.20
(0.343 ± 0.008)
5.00 ± 0.20
(0.197 ± 0.008)
1.50 ±0.15
(0.059 ± 0.006)
0.50 ± 0.10 SQ. TYP.
(0.020 ± 0.004)
0.70 (0.028)
MAX.
D
CATHODE
LEAD
1.00 MIN.
(0.039)
31.60 MIN.
(1.244)
HLMP-ALXX Pkg Dimensions
NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).
2. TAPERS SHOWN AT TOP OF LEADS (BOTTOM OF LAMP PACKAGE) INDICATE AN EPOXY
MENISCUS THAT MAY EXTEND ABOUT 1 mm (0.040 IN.) DOWN THE LEADS.
3. RECOMMENDED PC BOARD HOLE DIAMETERS:
– LAMP PACKAGES A AND C WITHOUT STAND-OFFS: FLUSH MOUNTING AT BASE OF
LAMP PACKAGE = 1.143/1.067 mm (0.044/0.042 IN.).
– LAMP PACKAGES B AND D WITH STAND-OFFS: MOUNTING AT LEAD STAND-OFFS.
2.54 ± 0.38
(0.100 ± 0.015)
Absolute Maximum Ratings at TA = 25˚C
Parameter
Red and Amber
DC Forward Current[1]
50 mA
Peak Pulsed Forward Current[2]
100 mA
Average Forward Current
30 mA
Reverse Voltage (IR = 100 µA)
5V
Power Dissipation
120 mW
LED Junction Temperature
130°C
Operating Temperature Range
–40°C to +100°C
Storage Temperature Range
–40°C to +100°C
Notes: 1. Derate linearly as shown in figure 4. 2. Duty Factor 30%, Frequency 1kHz.
Electrical/Optical Characteristics at TA = 25°C
Parameter
Symbol
Typical Viewing Angle
Major
Minor
2q1/2
Forward Voltage
Red (ld = 626 nm)
Red (ld = 630 nm)
Option xx0xx
Option xxTxx
Amber (ld = 590 nm)
Amber (ld = 592 nm)
Option xx0xx
Option xxRxx, xxSxx
Reverse Voltage
Amber, Red
Min.
Max.
70
35
VF
VR
Typ.
5
Units
Test Conditions
deg
V
IF = 20 mA
20
V
IR = 100 µA
2.0
2.4
2.2
2.3
2.0
2.4
2.6
2.4
2.2
2.3
2.4
2.6
Peak Wavelength
Amber (ld = 592 nm)
Red (ld = 630 nm)
lpeak
594
639
nm
Peak of Wavelength of
Spectral Distribution
at IF = 20 mA
Spectral Halfwidth
Amber (ld = 592 nm)
Red (ld = 630 nm)
∆l1/2
17
17
nm
Wavelength Width at
Spectral Distribution 1/2
Power Point at IF = 20 mA
C
40
pF
Luminous Efficacy
Amber (ld = 592 nm)
Red (ld = 630 nm)
hv
500
155
lm/W
Thermal Resistance
RQJ-PIN
240
°C/W
Capacitance
Amber, Red
VF = 0, F = 1 MHz
Emitted Luminous
Power/Emitted Radiant
Power at IF = 20 mA
LED Junction-toCathode Lead
Notes:
1. 2q1/2 is the off-axis angle where the luminous intensity is 1/2 the on-axis intensity.
2. The radiant intensity, Ie in watts per steradian, may be found from the equation Ie = Iv/hv where Iv is the luminous intensity in candelas and hv is
the luminous efficacy in lumens/watt.
3. The luminous intensity is measured on the mechanical axis of the lamp package.
4. The optical axis is closely aligned with the package mechanical axis.
5. The dominant wavelength, ld, is derived from the CIE Chromaticity Diagram and represents the color of the lamp.
6. For Options -xxRxx, -xxSxx and -xxTxx, max. forward voltage (Vf ) is 2.6 V. Refer to Vf bin table.
1
AMBER
RELATIVE INTENSITY
0.9
RED
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
500
550
600
650
700
WAVELENGTH - nm
Figure 1. Relative intensity vs. wavelength.
70
CURRENT – mA
60
DC FORWARD CURRENT – mA
50
RED
50
40
AMBER
30
20
10
0
1.0
1.5
2.0
2.5
40
30
20
AMBER
10
RED
0
3.0
0
0.5
VF – FORWARD VOLTAGE – V
1.0
1.5
2.0
2.5
3.0
FORWARD VOLTAGE – V
Figure 2a. Amber, red forward current vs.
forward voltage.
Figure 2b. Forward current vs. forward voltage
for option -xxTxx red, and option -xxRxx and -xxSxx amber.
HLMP-ALXX fig 3
2.0
IF – FORWARD CURRENT – mA
RELATIVE INTENSITY
(NORMALIZED AT 20 mA)
2.5
RED
1.5
AMBER
1.0
0.5
0
0
10
20
30
40
50
FORWARD CURRENT – mA
Figure 3. Amber, red relative luminous intensity
vs. forward current.
50
40
RθJA = 585° C/W
30
RθJA = 780° C/W
20
10
0
0
20
40
60
80
Figure 4. Amber, red maximum forward current
vs. ambient temperature.
HLMP-ALXX fig 7
100
TA – AMBIENT TEMPERATURE – °C
100
90
90
RELATIVE INTENSITY – %
RELATIVE INTENSITY – %
100
80
70
60
50
40
30
20
10
0
50
80
70
60
50
40
30
20
10
40
30
20
10
0
-10
-20
-30
-40
0
50
-50
VERTICAL ANGULAR DISPLACEMENT – DEGREES
40
30
Figure 5. Spatial radiation patternHLMP-ALXX
– 35 x 70 degree
lamps.
fig 8a
Intensity Bin Limits (mcd at 20 mA)
20
10
0
-10
-20
-50
Vf Bin Table [2,3]
Min.
Max.
Bin Id
Min.
Max.
K
310
400
VA
2.0
2.2
L
400
520
VB
2.2
2.4
M
520
680
VC
2.4
2.6
N
680
880
P
880
1150
Q
1150
1500
R
1500
1900
S
1900
2500
T
2500
3200
U
3200
4200
Tolerance for each bin limit is ±15%.
Amber Color Bin Limits (nm at 20 mA)
Bin Name
Min.
Max.
1
584.5
587.0
2
587.0
589.5
4
589.5
592.0
6
592.0
594.5
-40
HLMP-ALXX fig 8b
Bin Name
Tolerance for each bin limit is ± 0.5 nm.
-30
HORIZONTAL ANGULAR DISPLACEMENT – DEGREES
Notes:
1. All bin categories are established for classification of products.
Products may not be available in all bin categories. Please contact
your Avago representative for further information.
2. Vf bin table only available for those numbers with options -xxRxx,
-xxSxx, -xxTxx.
3. Tolerance for each bin limit is ± 0.05V
Precautions:
Lead Forming:
• The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering on PC board.
• For better control, it is recommended to use proper
tool to precisely form and cut the leads to applicable
length rather than doing it manually.
• If manual lead cutting is necessary, cut the leads after
the soldering process. The solder connection forms a
mechanical ground which prevents mechanical stress
due to lead cutting from traveling into LED package.
This is highly recommended for hand solder operation,
as the excess lead length also acts as small heat sink.
Note:
1. PCB with different size and design (component density) will have
different heat mass (heat capacity). This might cause a change in
temperature experienced by the board if same wave soldering
setting is used. So, it is recommended to re-calibrate the soldering
profile again before loading a new type of PCB.
2. Avago Technologies’ high brightness LED are using high efficiency
LED die with single wire bond as shown below. Customer is advised
to take extra precaution during wave soldering to ensure that the
maximum wave temperature does not exceed 250°C and the solder
contact time does not exceeding 3sec. Over-stressing the LED during
soldering process might cause premature failure to the LED due to
delamination.
Avago Technologies LED configuration
Soldering and Handling:
• Care must be taken during PCB assembly and soldering
process to prevent damage to the LED component.
• LED component may be effectively hand soldered
to PCB. However, it is only recommended under
unavoidable circumstances such as rework. The closest
manual soldering distance of the soldering heat source
(soldering iron’s tip) to the body is 1.59mm. Soldering
the LED using soldering iron tip closer than 1.59mm
might damage the LED.
1.59mm
• ESD precaution must be properly applied on the
soldering station and personnel to prevent ESD
damage to the LED component that is ESD sensitive.
Do refer to Avago application note AN 1142 for details.
The soldering iron used should have grounded tip to
ensure electrostatic charge is properly grounded.
• Recommended soldering condition:
Wave
Soldering [1, 2]
Manual Solder
Dipping
Pre-heat temperature
105 °C Max.
-
Preheat time
60 sec Max
-
Peak temperature
250 °C Max.
260 °C Max.
Dwell time
3 sec Max.
5 sec Max
Note:
1) Above conditions refers to measurement with thermocouple
mounted at the bottom of PCB.
2) It is recommended to use only bottom preheaters in order to reduce
thermal stress experienced by LED.
• Wave soldering parameters must be set and maintained
according to the recommended temperature and dwell
time. Customer is advised to perform daily check on the
soldering profile to ensure that it is always conforming
to recommended soldering conditions.
CATHODE
Note: Electrical
connection
AllnGaP
Devicebetween bottom surface of LED die and
the lead frame is achieved through conductive paste.
• Any alignment fixture that is being applied during
wave soldering should be loosely fitted and should
not apply weight or force on LED. Non metal material
is recommended as it will absorb less heat during wave
soldering process.
• At elevated temperature, LED is more susceptible to
mechanical stress. Therefore, PCB must allowed to cool
down to room temperature prior to handling, which
includes removal of alignment fixture or pallet.
• If PCB board contains both through hole (TH) LED and
other surface mount components, it is recommended
that surface mount components be soldered on the
top side of the PCB. If surface mount need to be on the
bottom side, these components should be soldered
using reflow soldering prior to insertion the TH LED.
• Recommended PC board plated through holes (PTH)
size for LED component leads.
LED component
lead size
Diagonal
Plated through
hole diameter
0.45 x 0.45 mm
(0.018x 0.018 inch)
0.636 mm
(0.025 inch)
0.98 to 1.08 mm
(0.039 to 0.043 inch)
0.50 x 0.50 mm
(0.020x 0.020 inch)
0.707 mm
(0.028 inch)
1.05 to 1.15 mm
(0.041 to 0.045 inch)
• Over-sizing the PTH can lead to twisted LED after
clinching. On the other hand under sizing the PTH can
cause difficulty inserting the TH LED.
Refer to application note AN5334 for more information about soldering and handling of high brightness TH LED lamps.
Example of Wave Soldering Temperature Profile for TH LED
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
LAMINAR WAVE
TURBULENT WAVE
HOT AIR KNIFE
250
Flux: Rosin flux
Solder bath temperature:
245°C± 5°C (maximum peak
temperature = 250°C)
200
150
Dwell time: 1.5 sec - 3.0 sec
(maximum = 3sec)
100
Note: Allow for board to be sufficiently
cooled to room temperature before
exerting mechanical force.
50
PREHEAT
0
10
20
30
40
50
60
TIME (MINUTES)
70
80
90
100
Ammo Packs Drawing
Note: The ammo-packs drawing is applicable for packaging option –DD & –ZZ and regardless of standoff or non-standoff.
10
Packaging Box for Ammo Packs
LABEL ON
THIS SIDE
OF BOX.
FROM LEFT SIDE OF BOX,
ADHESIVE TAPE MUST BE
FACING UPWARD.
A
O
AG IES
AV LOG
E
NO
HOD
CH
CAT
E
T
+
DE
ANO
–
ANODE LEAD LEAVES
THE BOX FIRST.
C
R LA
THE
MO
BEL
Note: For InGaN device, the ammo pack packaging box contains ESD logo.
Packaging Label
(i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box)
(1P) Item: Part Number
STANDARD LABEL LS0002
RoHS Compliant
e3
max temp 250C
(1T) Lot: Lot Number
(Q) QTY: Quantity
LPN:
CAT: Intensity Bin
(9D)MFG Date: Manufacturing Date
BIN: Refer to below information
(P) Customer Item:
11
(V) Vendor ID:
(9D) Date Code: Date Code
DeptID:
Made In: Country of Origin
Lamps Baby Label
(1P) PART #: Part Number
RoHS Compliant
e3
max temp 250C
DeptID:
Made In: Country of Origin
(ii) Avago Baby Label (Only available on bulk packaging)
Lamps Baby Label
(1P) PART #: Part Number
RoHS Compliant
e3
max temp 250C
(1T) LOT #: Lot Number
(9D)MFG DATE: Manufacturing Date
QUANTITY: Packing Quantity
C/O: Country of Origin
Customer P/N:
CAT: Intensity Bin
Supplier Code:
BIN: Refer to below information
DATECODE: Date Code
Acronyms and Definition:
BIN:
Example:
(i) Color bin only or VF bin only
(i) Color bin only or VF bin only
(Applicable for part number with color bins but
without VF bin OR part number with VF bins and no
color bin)
OR (ii) Color bin incorporated with VF Bin
BIN: 2 (represent color bin 2 only)
BIN: VB (represent VF bin “VB” only)
(ii) Color bin incorporate with VF Bin
BIN: 2VB VB: VF bin “VB”
(Applicable for part number that have both color bin
and VF bin)
2: Color bin 2 only
DISCLAIMER: AVAGO’S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR AUTHORIZED FOR
SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE OR DIRECT OPERATION OF
A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL
RIGHTS TO MAKE CLAIMS AGAINST AVAGO OR ITS SUPPLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH
For product information and a complete list of distributors, please go to our web site:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2008 Avago Technologies. All rights reserved. Obsoletes 5989-1903EN
AV02-1542EN - September 16, 2008
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