AVAGO HLMP-CE35-Y1QDD T-1 â¾ (5mm) extra bright cyan led Datasheet

HLMP-CExx
T-1 ¾ (5mm) Extra Bright Cyan LEDs
Data Sheet
Description
Features
The high intensity Cyan LEDs are based on the most
efficient and cost effective InGaN material technology. The 505nm typical dominant wavelength is most
suitable for traffic signal application. These LED lamps
are untinted, non-diffused, T-1¾ packages incorporating
second generation optics which produce well-defined
spatial radiation patterns at specific viewing cone angles.
x Viewing Angle: 15°, 23° and 30°
These lamps are made with an advanced optical grade
epoxy, offering superior temperature and moisture resistance in outdoor sign and signals applications.
x Well defined spatial radiation pattern
x High brightness material
x Superior resistance to moisture
x Package options:
– Stand-off and Non Stand-off Leads
x Untinted and non diffused
Applications
x Traffic signals
Package Dimensions
A: Non stand-off
1.0 ±0.20
0.039 ±0.008
Ø
Dimension A
5.00 ±0.20
0.197 ±0.008
5.80 ±0.20
0.228 ±0.008
0.50 ±0.20 sq. typ.
.020 ±.008
2.540 ±0.2
0.100 ±0.008
Note 1
Cathode
1.00
min
.039
25.40
min
0.901
cathode
flat
B: Stand-off
1.0 ±0.20
0.039 ±0.008
1.30 ±0.15
0.051 ±0.006
Dimension A
5.00 ±0.20
0.197 ±0.008
Ø
5.80 ±0.20
0.228 ±0.008
0.50 ±0.20 sq. typ.
.020 ±.008
2.540 ±0.2
0.100 ±0.008
Note 1
Cathode
Dimension d
Package
Dimension A
Dimension d
15°
8.70 ± 0.20 mm
13.00 ± 0.20 mm
23°
8.65 ± 0.20 mm
12.25 ± 0.20 mm
30°
8.65 ± 0.20 mm
12.05 ± 0.20 mm
25.40
min
0.901
1.00
min
.039
cathode
flat
Notes:
1. Measured above flange.
2. All dimensions in millimeters (inches).
CAUTION: InGaN devices are Class 1C HBM ESD sensitive per JEDEC Standard. Please observe appropriate
precautions during handling and processing. Refer to Application Note AN-1142 for additional details.
Device Selection Guide
Part Number
Luminous Intensity
Iv (mcd) at 20 mA Min.
Luminous Intensity
Iv (mcd) at 20 mA Max.
Stand-Off
HLMP-CE13-35CDD
27000
59000
No
HLMP-CE13-35QDD
27000
59000
No
HLMP-CE22-Z2CDD
12000
27000
No
HLMP-CE22-Z2QDD
12000
27000
No
HLMP-CE34-Y1CDD
9300
21000
No
HLMP-CE34-Y1QDD
9300
21000
No
HLMP-CE14-35CDD
27000
59000
Yes
HLMP-CE14-35QDD
27000
59000
Yes
HLMP-CE25-Z2CDD
12000
27000
Yes
HLMP-CE25-Z2QDD
12000
27000
Yes
HLMP-CE35-Y1CDD
9300
21000
Yes
HLMP-CE35-Y1QDD
9300
21000
Yes
Tolerance for each intensity limit is ± 15%.
Notes:
1. The luminous intensity is measured on the mechanical axis of the lamp package.
2. Tolerance for each intensity limit is ± 15%.
3. Please refer to AN 5352 for detail information on features of stand-off and non stand-off LEDs.
Part Numbering System
HLMP-C E xx – x x x xx
Packaging Option
DD: Ammopack
Color Bin Selection
C: Color bin 3 & 4
Q: Color bin 7 & 8
Maximum Intensity Bin
Refer to Device Selection Guide
Minimum Intensity Bin
Refer to Device Selection Guide
Viewing Angle and Lead Stands-offs
13: 15° without stand-off
14: 15° with stand-off
22: 23° without stand-off
25: 23° with stand-off
34: 30° without stand-off
35: 30° with stand-off
Note:
Please refer to AB 5337 for complete information about part numbering system.
2
Absolute Maximum Ratings
TJ = 25°C
Parameter
Value
Unit
DC Forward Current [1]
30
mA
Peak Forward Current
100 [2]
mA
Power Dissipation
107
mW
Reverse Voltage
Not recommended for reverse bias
Operating Temperature Range
-40 to +85
°C
Storage Temperature Range
-40 to +85
°C
Notes:
1. Derate linearly as shown in Figure 5.
2. Duty Factor 10%, frequency 1KHz.
Electrical / Optical Characteristics
TA = 25°C
Parameter
Symbol
Min.
Typ.
Max.
Units
Test Conditions
Forward Voltage
VF
2.8
3.2
3.5
V
IF = 20 mA
Dominant Wavelength[1]
Od
505
nm
IF = 20 mA
Peak Wavelength
OPEAK
501
nm
Peak of Wavelength of Spectral
Distribution at IF = 20 mA
Spectral Halfwidth
'O1/2
30
Thermal Resistance
RTJ-PIN
240
°C/W
LED Junction-to-Cathode Lead
Luminous Efficacy [2]
KV
326
lm/W
Emitted Luminous Power/Emitted
Radiant Power
Luminous Flux
MV
2.1
lm
IF = 20 mA
Luminous Efficiency [3]
Ke
34
lm/W
Emitted Luminous Flux/Electrical
Power
Wavelength width at spectral distribution ½ power point at IF = 20 mA
Notes:
1. The dominant wavelength is derived from the chromaticity Diagram and represents the color of the lamp. Tolerance for each color of dominant
wavelength is ± 0.5nm.
2. The radiant intensity, Ie in watts per steradian, may be found from the equation Ie = IV/ηV where IV is the luminous intensity in candelas and KV is
the luminous efficacy in lumens/watt.
3. Ke =MV/ IF x VF where MV is the emitted luminous flux, IF is electrical forward current and VF is the forward voltage.
3
25
FORWARD CURRENT - mA
RELATIVE INTENSITY
30
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
400
500
550
600
WAVELENGTH - nm
650
0
700
DOMINANT WAVELENGTH SHIFT - nm
RELATIVE LUMINOUS INTENSITY
(NORMALIZED AT 20 mA)
1.2
1
0.8
0.6
0.4
0.2
0
5
10
15
20
DC FORWARD CURRENT - mA
1
2
FORWARD VOLTAGE - V
3
4
Figure 2. Forward Current vs Forward Voltage
0
25
16
14
12
10
8
6
4
2
0
-2
-4
30
Figure 3. Relative Intensity vs Forward Current
0
5
10
15
20
FORWARD CURRENT - mA
25
30
60
90
Figure 4. Relative Dominant Wavelength vs Forward Current
1
35
30
NORMALIZED INTENSITY
IDC MAX -MAX. ALLOWABLE DC CURRENT - mA
10
0
450
1.4
25
20
15
10
5
0
20
40
60
80
TA - AMBIENT TEMPERATURE - °C
Figure 5. Maximum Forward Current vs Ambient Temperature
4
15
5
Figure 1. Relative Intensity vs Wavelength
0
20
100
0.8
0.6
0.4
0.2
0
-90
-60
-30
0
30
ANGULAR DISPLACEMENT - DEG
Figure 6. Representative Spatial Radiation Pattern – 15° Lamps
1
0.8
0.8
NORMALIZED INTENSITY
NORMALIZED INTENSITY
1
0.6
0.4
0.2
0.6
0.4
0.2
0
0
-90
-60
-30
0
30
ANGULAR DISPLACEMENT - DEG
60
90
-90
Figure 7. Representative Spatial Radiation Pattern – 23° Lamps
-60
-30
0
30
ANGULAR DISPLACEMENT - DEG
Figure 8. Representative Spatial Radiation Pattern – 30° Lamps
Relative Light Output vs Junction Temperature
RELATIVE LIGHT OUTPUT (NORMALIZED AT TJ = 25°C)
10
1
0.1
-40
-20
0
20
40
TJ - JUNCTION TEMPERATURE - °C
Intensity Bin Limit Table (1.3: 1 Iv Bin Ratio)
60
80
100
Cyan Color Bin Limits
Intensity (mcd) at 20 mA
Bin
Min
Max
Bin
Min
Max
3
500
505
Y
9300
12000
4
505
510
Z
12000
16000
7
498
503
1
16000
21000
8
503
508
2
21000
27000
3
27000
35000
4
35000
45000
5
45000
59000
Tolerance for each bin limit is ± 15%
5
60
Tolerance for each bin limit is ± 0.5nm.
90
Precautions:
Lead Forming:
x The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering on PC board.
x For better control, it is recommended to use proper
tool to precisely form and cut the leads to applicable
length rather than doing it manually.
x If manual lead cutting is necessary, cut the leads after
the soldering process. The solder connection forms a
mechanical ground which prevents mechanical stress
due to lead cutting from traveling into LED package.
This is highly recommended for hand solder operation,
as the excess lead length also acts as small heat sink.
Note:
1. PCB with different size and design (component density) will have
different heat mass (heat capacity). This might cause a change in
temperature experienced by the board if same wave soldering
setting is used. So, it is recommended to re-calibrate the soldering
profile again before loading a new type of PCB.
2. Customer is advised to take extra precaution during wave soldering
to ensure that the maximum wave temperature does not exceed
260°C and the solder contact time does not exceeding 5sec. Overstressing the LED during soldering process might cause premature
failure to the LED due to delamination.
Avago Technologies LED Configuration
Soldering and Handling:
x Care must be taken during PCB assembly and soldering
process to prevent damage to the LED component.
x LED component may be effectively hand soldered
to PCB. However, it is only recommended under
unavoidable circumstances such as rework. The closest
manual soldering distance of the soldering heat source
(soldering iron’s tip) to the body is 1.59mm. Soldering
the LED using soldering iron tip closer than 1.59mm
might damage the LED.
1.59 mm
x ESD precaution must be properly applied on the
soldering station and personnel to prevent ESD
damage to the LED component that is ESD sensitive.
Do refer to Avago application note AN 1142 for details.
The soldering iron used should have grounded tip to
ensure electrostatic charge is properly grounded.
x Recommended soldering condition:
Wave
Soldering [1, 2]
Manual Solder
Dipping
Pre-heat temperature
105°C Max.
-
Preheat time
60 sec Max
-
Peak temperature
260°C Max.
260°C Max.
Dwell time
5 sec Max.
5 sec Max
Note:
1) Above conditions refers to measurement with thermocouple
mounted at the bottom of PCB.
2) It is recommended to use only bottom preheaters in order to
reduce thermal stress experienced by LED.
x Wave soldering parameters must be set and maintained
according to the recommended temperature and dwell
time. Customer is advised to perform daily check on the
soldering profile to ensure that it is always conforming
to recommended soldering conditions.
6
x Any alignment fixture that is being applied during
wave soldering should be loosely fitted and should
not apply weight or force on LED. Non metal material
is recommended as it will absorb less heat during wave
soldering process.
x At elevated temperature, LED is more susceptible to
mechanical stress. Therefore, PCB must allowed to cool
down to room temperature prior to handling, which
includes removal of alignment fixture or pallet.
x If PCB board contains both through hole (TH) LED and
other surface mount components, it is recommended
that surface mount components be soldered on the
top side of the PCB. If surface mount need to be on the
bottom side, these components should be soldered
using reflow soldering prior to insertion the TH LED.
x Recommended PC board plated through holes (PTH)
size for LED component leads.
LED component
lead size
Diagonal
Plated through
hole diameter
0.45 x 0.45 mm
(0.018x 0.018 inch)
0.636 mm
(0.025 inch)
0.98 to 1.08 mm
(0.039 to 0.043 inch)
0.50 x 0.50 mm
(0.020x 0.020 inch)
0.707 mm
(0.028 inch)
1.05 to 1.15 mm
(0.041 to 0.045 inch)
x Over-sizing the PTH can lead to twisted LED after
clinching. On the other hand under sizing the PTH can
cause difficulty inserting the TH LED.
Refer to application note AN5334 for more information about soldering and handling of high brightness TH LED lamps.
Example of Wave Soldering Temperature Profile for TH LED
260°C Max
TEMPERATURE (°C)
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
Flux: Rosin flux
Solder bath temperature: 255°C ± 5°C
(maximum peak temperature = 260°C)
105°C Max
Dwell time: 3 sec - 5 sec
(maximum = 5 sec)
60 sec Max
Note: Allow for board to be sufficiently
cooled to room temperature before
exerting mechanical force.
TIME (sec)
Ammo Packs Drawing
12.70±1.00
0.50±0.0394
6.35±1.30
0.25±0.0512
CATHODE
20.50±1.00
0.807±0.039
9.125±0.625
0.3593±0.0246
18.00±0.50
0.7087±0.0197
12.70±0.30
0.50±0.0118
Note: All dimensions are in milimeters (inches).
7
A
0.70±0.20
0.0276±0.0079
A
VIEW A-A
ø 4.00±0.20TYP.
0.1575±0.008
Packaging Box for Ammo Packs
FROM LEFT SIDE OF BOX
ADHESIVE TAPE MUST BE
FACING UPWARDS.
LABEL ON THIS
SIDE OF BOX
ANODE LEAD LEAVES
THE BOX FIRST.
Note: The dimension for ammo pack is applicable for the device with standoff and without standoff.
Packaging Label:
(i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box)
(1P) Item: Part Number
STANDARD LABEL LS0002
RoHS Compliant
e3
max temp 260C
(1T) Lot: Lot Number
(Q) QTY: Quantity
LPN:
CAT: Intensity Bin
(9D)MFG Date: Manufacturing Date
BIN: Color Bin
(P) Customer Item:
8
(V) Vendor ID:
(9D) Date Code: Date Code
DeptID:
Made In: Country of Origin
(ii) Avago Baby Label (Only available on bulk packaging)
Lamps Baby Label
(1P) PART #: Part Number
RoHS Compliant
e3
max temp 260C
(1T) LOT #: Lot Number
(9D)MFG DATE: Manufacturing Date
QUANTITY: Packing Quantity
C/O: Country of Origin
Customer P/N:
CAT: Intensity Bin
Supplier Code:
BIN: Color Bin
DATECODE: Date Code
DISCLAIMER: Avago’s products and software are not specifically designed, manufactured or authorized for
sale as parts, components or assemblies for the planning, construction, maintenenace or direct operation of a
nuclear facility or for use in medical devices or applications. Customer is solely responsible, and waives all rights
to make claims against avago or its suppliers, fo all loss, damage, expense or liability in connection with such use.
For product information and a complete list of distributors, please go to our web site:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2010 Avago Technologies. All rights reserved.
AV02-1823EN - January 20, 2010
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