AVAGO HLMP-CM16-VY000 T-13/4 (5 mm) precision optical performance ingan blue, green and cyan lamp Datasheet

HLMP-Cxxx
T-13/4 (5 mm) Precision Optical Performance
InGaN Blue, Green and Cyan Lamps
Data Sheet
HLMP-CB15, HLMP-CB16, HLMP-CB30, HLMP-CB31, HLMP-CM15, HLMP-CM16, HLMP-CM30,
HLMP-CM31, HLMP-CE15, HLMP-CE16, HLMP-CE23, HLMP-CE24, HLMP-CE30, HLMP-CE31
Description
Features
These high intensity blue, green and cyan LEDs are based
on InGaN material technology. InGaN is the most efficient
and cost effective material for LEDs in the blue and green
region of the spectrum. The 472 nm typical dominant
wavelength for blue and 526 nm typical dominant wavelength for green are well suited to color mixing in full
color signs. The 505 nm typical dominant wavelength
matches international specifications for green traffic
signals. These LED lamps are untinted, nondiffused, T13/4 packages incorporating second generation optics
which produce well defined spatial radiation patterns
at specific viewing cone angles. These lamps are made
with an advanced optical grade epoxy, offering superior
high temperature and high moisture resistance performance in outdoor signal and sign applications. The high
maximum LED junction temperature limit of +130°C
enables high temperature operation in bright sunlight
conditions. The package epoxy contains both UV-A
and UV-B inhibitors to reduce the effects of long term
exposure to direct sunlight. These lamps are available
in two viewing angle for Green and Blue, and 3 viewing
angles options for Cyan to give the designer flexibility
with optical design.
• Well defined spatial radiation pattern
• Viewing angles: 15° , 23º and 30°
• High luminous output
• Colors: 472 nm Blue, 526 nm Green, 505 nm Cyan
• Superior resistance to moisture
• UV resistant epoxy
Benefits
• Superior performance in outdoor environments
• Wavelengths suitable for color mixing in full color
(RGB) signs
Applications
• Commercial outdoor signs
• Automotive interior lights
• Front panel indicators
• Front panel backlighting
CAUTION: HLMP-CBxx, HLMP-CMxx and HLMP-CExx LEDs are Class 1C ESD sensitive. Please observe appropriate
precautions during handling and processing. Refer to Avago Application Note AN-1142 for additional details.
Device Selection Guide
Color and Typ.
Dominant Wavelength
λd (nm) [2]
Min.
Max.
Leads with
Stand-Offs
Package
Drawing
HLMP-CB15-P00xx
15°
Blue 472
880
-
No
A
HLMP-CB15-QT0xx
15°
Blue 472
1150
3200
No
A
HLMP-CB15-R00xx
15°
Blue 472
1500
-
No
A
HLMP-CB15-RSCxx
15°
Blue 472
1500
2500
No
A
HLMP-CB16-P00xx
15°
Blue 472
880
-
Yes
B
HLMP-CB16-QT0xx
15°
Blue 472
1150
3200
Yes
B
HLMP-CM15-S00xx
15°
Green 526
1900
-
No
A
Part Number
Luminous Intensity,
Iv (mcd) at 20 mA [3,4,5]
Typical
Viewing Angle
2q1/2 (Deg)[1]
HLMP-CM15-SV0xx
15°
Green 526
1900
5500
No
A
HLMP-CM15-VY0xx
15°
Green 526
4200
12000
No
A
HLMP-CM15-W00xx
15°
Green 526
5500
-
No
A
HLMP-CM15-WXBxx
15°
Green 526
5500
9300
No
A
HLMP-CM15-WZ0xx
15°
Green 526
5500
16000
No
A
HLMP-CM16-S00xx
15°
Green 526
1900
-
Yes
B
HLMP-CM16-VY0xx
15°
Green 526
4200
12000
Yes
B
HLMP-CM16-WYGxx
15°
Green 526
5500
12000
Yes
B
HLMP-CE15-VWCxx
15°
Cyan 505
4200
7200
No
A
HLMP-CE15-WZCxx
15°
Cyan 505
5500
16000
No
A
HLMP-CE15-WZQxx
15°
Cyan 505
5500
16000
No
A
HLMP-CE16-UXQxx
15°
Cyan 505
3200
9300
Yes
B
HLMP-CE16-WZBxx
15°
Cyan 505
5500
16000
Yes
B
HLMP-CE16-WZCxx
15°
Cyan 505
5500
16000
Yes
B
HLMP-CE16-WZQxx
15°
Cyan 505
5500
16000
Yes
B
HLMP-CE23-UVQxx
23°
Cyan 505
3200
5500
No
A
HLMP-CE23-UXCxx
23°
Cyan 505
3200
9300
No
A
HLMP-CE23-UXQxx
23°
Cyan 505
3200
9300
No
A
HLMP-CE23-VWCxx
23°
Cyan 505
4200
7200
No
A
HLMP-CE23-VWQxx
23°
Cyan 505
4200
7200
No
A
HLMP-CE23-VXQxx
23°
Cyan 505
4200
9300
No
A
HLMP-CE23-VYCxx
23°
Cyan 505
4200
12000
No
A
HLMP-CE24-UX0xx
23°
Cyan 505
3200
9300
Yes
B
HLMP-CE24-UXCxx
23°
Cyan 505
3200
9300
Yes
B
HLMP-CE24-UXQxx
23°
Cyan 505
3200
9300
Yes
B
HLMP-CE24-VXQxx
23°
Cyan 505
4200
9300
Yes
B
HLMP-CE24-VYCxx
23°
Cyan 505
4200
12000
Yes
B
HLMP-CE24-VYQxx
23°
Cyan 505
4200
12000
Yes
B
Device Selection Guide (Continued)
Luminous Intensity,
Iv (mcd) at 20 mA [3,4,5]
Typical
Viewing Angle
2q1/2 (Deg)[1]
Color and Typ.
Dominant Wavelength
λd (nm) [2]
Min.
Max.
Leads with
Stand-Offs
Package
Drawing
HLMP-CB30-K00xx
30°
Blue 472
310
-
No
A
HLMP-CB30-M00xx
30°
Blue 472
520
-
No
A
HLMP-CB30-NPCxx
30°
Blue 472
680
1150
No
A
HLMP-CB30-NRGxx
30°
Blue 472
680
1900
No
A
HLMP-CB30-PQCxx
30°
Blue 472
880
1500
No
A
HLMP-CB31-M00xx
30°
Blue 472
520
-
Yes
B
HLMP-CB31-NRGxx
30°
Blue 472
680
1900
Yes
B
HLMP-CB31-PQCxx
30°
Blue 472
880
1500
Yes
B
HLMP-CM30-M00xx
30°
Green 526
520
-
No
A
HLMP-CM30-RSBxx
30°
Green 526
1500
2500
No
A
HLMP-CM30-S00xx
30°
Green 526
1900
-
No
A
HLMP-CM30-TUCxx
30°
Green 526
2500
4200
No
A
HLMP-CM30-TW0xx
30°
Green 526
2500
7200
No
A
HLMP-CM30-TWAxx
30°
Green 526
2500
7200
No
A
HLMP-CM30-UVAxx
30°
Green 526
3200
5500
No
A
HLMP-CM30-UVCxx
30°
Green 526
3200
5500
No
A
HLMP-CM31-M00xx
30°
Green 526
520
-
Yes
B
HLMP-CM31-S00xx
30°
Green 526
1900
-
Yes
B
HLMP-CM31-S0Dxx
30°
Green 526
1900
-
Yes
B
HLMP-CM31-TUCxx
30°
Green 526
2500
4200
Yes
B
HLMP-CM31-TW0xx
30°
Green 526
2500
7200
Yes
B
HLMP-CM31-TWAxx
30°
Green 526
2500
7200
Yes
B
HLMP-CM31-UVCxx
30°
Green 526
3200
5500
Yes
B
HLMP-CM31-VWCxx
30°
Green 526
4200
7200
Yes
B
HLMP-CE30-RSCxx
30°
Cyan 505
1500
2500
No
A
HLMP-CE30-RUCxx
30°
Cyan 505
1500
4200
No
A
HLMP-CE30-STQxx
30°
Cyan 505
1900
3200
No
A
HLMP-CE30-SVCxx
30°
Cyan 505
1900
5500
No
A
HLMP-CE30-SVQxx
30°
Cyan 505
1900
5500
No
A
HLMP-CE31-SVCxx
30°
Cyan 505
1900
5500
Yes
B
HLMP-CE31-SVQxx
30°
Cyan 505
1900
5500
Yes
B
Part Number
Notes:
1. q1/2 is the off-axis angle where the luminous intensity is one half the on-axis intensity.
2. Dominant Wavelength, λd, is derived from the CIE Chromaticity. Diagram and represents the color of the lamp.
3. The luminous intensity is measured on the mechanical axis of the lamp package.
4. The optical axis is closely aligned with the package mechanical axis.
5. Tolerance for each intensity bin limit is ±15%.
Part Numbering System
HLMP - X X XX - X X X XX
Mechanical Options
00: Bulk
DD: Ammo Pack
YY: Flexi bin, Bulk
ZZ: Flexi bin, Ammo Pack
Color Bin Selection
0: Full color range
A: Color bin 1 & 2 only
B: Color bin 2 & 3 only
C: Color bin 3 & 4 only
G: Color bin 2, 3 & 4 only
Q: Color bin 7 & 8 only
Maximum Intensity Bin
0: No maximum Iv bin limit
Others: Refer to Intensity Bin Limit Table
Minimum Intensity Bin
Refer to Device Selection Guide
Viewing Angle and Standoff Options
15: 15 degree without standoff
16: 15 degree with standoff
23: 23 degree without standoff
24: 23 degree with standoff
30: 30 degree without standoff
31: 30 degree with standoff
Color
B: Blue
M: Green
E: Cyan
Package
C: T-1 3/4 (5 mm) round lamp
Package Dimensions
Package B
Package A
5.00 ± 0.20
(0.197 ± 0.008)
5.00 ± 0.20
(0.197 ± 0.008)
8.71 ± 0.20
(0.343 ± 0.008)
1.14 ± 0.20
(0.045 ± 0.008)
0.70 (0.028)
MAX.
d
31.60
MIN.
(1.244)
CATHODE
LEAD
CATHODE
LEAD
CATHODE
FLAT
0.50 ± 0.10
(0.020 ± 0.004)
SQ. TYP.
5.80 ± 0.20
(0.228 ± 0.008)
1.00 MIN.
(0.039)
CATHODE
FLAT
2.54 ± 0.38
(0.100 ± 0.015)
HLMP-Cx16
HLMP-Cx24
HLMP-Cx31
d = 12.6 ± 0.18
d = 12.40 ± 0.25
d = 12.22 ± 0.50
(0.496 ± 0.007)
(0.488 ± 0.010)
(0.481 ± 0.020)
Notes:
1. Dimensions in mm.
2. Tolerance ± 0.1 mm unless otherwise noted.
1.14 ± 0.20
(0.045 ± 0.008)
2.35 (0.093)
MAX.
31.60 MIN.
(1.244)
1.00 MIN.
(0.039)
8.71 ± 0.20
(0.343 ± 0.008)
1.50 ± 0.15
(0.059 ± 0.006)
0.70 (0.028)
MAX.
0.50 ± 0.10
(0.020 ± 0.004)
SQ. TYP.
5.80 ± 0.20
(0.228 ± 0.008)
2.54 ± 0.38
(0.100 ± 0.015)
Absolute Maximum Ratings at TA= 25°C
Parameter
Value
Units
DC Forward Current [1]
30
mA
Peak Forward Current
100
mA
Power Dissipation
Blue
Green / Cyan
111
117
Reverse Voltage (IR= 100 µA)
5
V
LED Junction Temperature
130
°C
Operating Temperature Range
-40 to +80
°C
Storage Temperature Range
-40 to +100
°C
mW
Note:
1. Derate linearly as shown in Figure 4 for temperatures above 50°C.
2. Duty Factor 10%, 1kHz
Electrical/Optical Characteristics at TA = 25°C
Parameter
Symbol
Forward Voltage
Blue
Green / Cyan
VF
Reverse Voltage
VR
Peak Wavelength
Blue (λd = 472 nm)
Green (λd = 526 nm)
Cyan (λd = 505 nm)
lpeak
Spectral Halfwidth
Blue (λd = 472 nm)
Green (λd = 526 nm)
Cyan (λd = 505 nm)
Dl1/2
Capacitance
Blue/ Green
Cyan
C
Luminous Efficacy
Blue (λd = 472 nm)
Green (λd = 526 nm)
Cyan (λd = 505 nm)
ηv
Thermal Resistance
RqJ-PIN
Min.
Typ.
Max.
3.2
3.2
3.7
3.9
Units
Test Conditions
V
IF= 20 mA
5
IR = 100 µA
nm
Peak of Wavelength of
Spectral Distribution at IF = 20 mA
nm
Wavelength Width at Spectral Power
Point at IF = 20 mA
pF
VF = 0, F = 1 MHz
lm/W
Emitted Luminous Power/Emitted
Radiant Power
°C/W
LED Junction-to-Cathode Lead
470
524
502
35
47
35
43
40
75
520
350
240
Notes:
1. The dominant wavelength, ld, is derived from the CIE Chromaticity Diagram and represents the perceived color of the device.
2. The radiant intensity, le in watts per steradian, may be found from the equation le = IV/hV, where Iv is the luminous intensity in candelas and hV is
the luminous efficacy in lumens/watt.
35
Cyan
FORWARD CURRENT - mA
RELATIVE INTENSITY
1.0
0.9
Blue
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
380
430
Green
480
530
580
630
WAVELENGTH - nm
680
730
15
Blue
10
5
0
0.5
1
1.5
2
2.5
FORWARD VOLTAGE - V
3
3.5
4
40
I F - FORWARD CURRENT - mA
INTENSITY NORMALIZED AT 20 mA
Green/ Cyan
20
Figure 2 : Forward current vs. forward voltage.
1.5
1.0
0.5
0
10
20
15
I F - FORWARD CURRENT - mA
5
25
35
30
25
20
15
10
5
0
30
Figure 3. Relative luminous intensity vs. forward current.
0
20
40
60
80
TA - AMBIENT TEMPERATURE - oC
100
Figure 4. Maximum forward current vs. ambient temperature.
1.030
0.9
1.025
1.020
NORMALIZED INTENSITY
RELATIVE DOMINANT WAVELENGTH - nm
25
0
780
Figure 1. Relative intensity vs. wavelength.
0
30
1.015
1.010
Blue
Cyan
1.005
Green
1.000
0.995
0.990
0
5
10
15
20
25
30
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
-30
35
DC FORWARD CURRENT - mA
-20
-10
0
10
30
20
ANGULAR DISPLACEMENT - DEGREES
Figure 5. Color vs. forward current
Figure 6. Spatial radiation pattern – 15° lamps.
1.0
NORMALIZED INTENSITY
RELATIVE INTENSITY
0.9
0.5
0
-50
-40
-30
-20
-10
0
10
ANGLE - DEGREES
Figure 7. Spatial radiation pattern – 23° lamps.
20
30
40
50
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
-40
-30
-20
-10
0
10
20
ANGULAR DISPLACEMENT - DEGREES
Figure 8. Spatial radiation pattern – 30° lamps.
30
40
Color Bin Limits (nm at 20 mA)
Blue
Bin ID
1
2
3
4
5
Intensity Bin Limits
Color Range (nm)
Min.
460.0
464.0
468.0
472.0
476.0
Bin Name
K
L
M
N
P
Q
R
S
T
U
V
W
X
Y
Z
Max.
464.0
468.0
472.0
476.0
480.0
Tolerance for each bin limit is ± 0.5 nm.
Green
Bin ID
1
2
3
4
5
Color Range (nm at 20mA)
Min.
Max.
520.0
524.0
524.0
528.0
528.0
532.0
532.0
536.0
536.0
540.0
Note:
1. All bin categories are established for classification of products.
Products may not be available in all bin categories. Please contact
your Avago representatives for further information.
Color Range (nm)
Min.
Max.
495
500
505
498
503
500
505
510
503
508
Tolerance for each bin limit is ± 0.5 nm
Relative Light Output vs. Junction Temperature
1.6
RELATIVE LIGHT OUTPUT
( NORMALIZED AT TJ = ºC)
1.4
Cyan
1.2
Green
Blue
1
0.8
0.6
0.4
0.2
0
-40
-20
0
20
40
60
80
TJ - JUNCTION TEMPERATURE -°C
Max.
400
520
680
880
1150
1500
1900
2500
3200
4200
5500
7200
9300
12000
16000
Tolerance for each intensity bin limit is ± 15%.
Tolerance for each bin limit is ± 0.5 nm.
Cyan
Bin ID
1
2
3
4
7
8
Min.
310
400
520
680
880
1150
1500
1900
2500
3200
4200
5500
7200
9300
12000
100
120
140
Precautions:
Avago Technologies LED configuration
Lead Forming:
• The leads of an LED lamp may be performed or cut to
length prior to insertion and soldering on PC board.
• If lead forming is required before soldering, care must
be taken to avoid any excessive mechanical stress that
induced into the LED package. Otherwise, cut the
leads to applicable length after soldering process at
room temperature. The solder joint formed will absorb
the mechanical stress, due to the lead cutting, from
traveling to the LED chip die attach and wirebond.
• For better control, it is recommended to use proper
tool to precisely form and cut the leads to applicable
length rather than doing it manually.
Soldering condition:
• Care must be taken during PCB assembly and
soldering process to prevent damage to the LED
component.
• The closest manual soldering distance of the soldering
heat source (soldering iron’s tip) to the body is
1.59mm. Soldering the LED closer than 1.59mm might
damage the LED.
1.59mm
Cathode
Note: Electrical connection between bottom surface of LED die and
the lead frame material through conductive paste of solder.
• If necessary, use fixture to hold the LED component
in proper orientation with respect to the PCB during
soldering process.
• At elevated temperature, the LED is more susceptible
to mechanical stress. Therefore, PCB must allowed to
cool down to room temperature prior to handling,
which includes removal of jigs, fixtures or pallet.
• Special attention must be given to board fabrication,
solder masking, surface platting and lead holes size
and component orientation to assure the solderability.
• Recommended PC board plated through holes size for
LED component leads.
• Recommended soldering condition:
Wave Soldering
Manual Solder
Dipping
Pre-heat temperature
105 °C Max.
-
Preheat time
30 sec Max
-
Peak temperature
250 °C Max.
260 °C Max.
Dwell time
3 sec Max.
5 sec Max
• Wave soldering parameter must be set and maintain
according to the recommended temperature and
dwell time. Customer is advised to daily check on the
soldering profile to ensure that the soldering profile
is always conforming to recommended soldering
condition.
Note:
1. PCB with different size and design (component density) will
have different heat mass (heat capacity). This might cause a
change in temperature experienced by the board if same wave
soldering setting is used. So, it is recommended to re-calibrate
the soldering profile again before loading a new type of PCB.
2. Avago Technologies’ high brightness LED are using high
efficiency LED die with single wire bond as shown below.
Customer is advised to take extra precaution during wave
soldering to ensure that the maximum wave temperature is
not exceeding 250°C. Over-stressing the LED during soldering
process might cause premature failure to the LED due to
delamination.
LED component
lead size
Diagonal
Plated through
hole diameter
0.457 x 0.457 mm
(0.018 x 0.018 inch)
0.646 mm
(0.025 inch)
0.976 to 1.078 mm
(0.038 to 0.042 inch)
0.508 x 0.508 mm
(0.020 x 0.020 inch)
0.718 mm
(0.028 inch)
1.049 to 1.150 mm
(0.041 to 0.045 inch)
• Over sizing of plated through hole can lead to twisting
or improper LED placement during auto insertion.
Under sizing plated through hole can lead to
mechanical stress on the epoxy lens during clinching.
Note: Refer to application note AN1027 for more information on
soldering LED components.
Recommended Wave Soldering Profile
LAMINAR WAVE
TURBULENT WAVE
HOT AIR KNIFE
250
TEMPERATURE - °C
200
TOP SIDE
OF PC BOARD
BOTTOM SIDE
OF PC BOARD
150
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)
PREHEAT SETTING = 150°C (100°C PCB)
SOLDER WAVE TEMPERATURE = 245°C ± 5˚C
AIR KNIFE AIR TEMPERATURE = 390°C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40
SOLDER: SN63; FLUX: RMA
LEAD FREE SOLDER
96.5%Sn; 3.0%Ag; 0.5% Cu
FLUXING
100
50
30
NOTE: ALLOW FOR BOARDS TO BE
SUFFICIENTLY COOLED BEFORE
EXERTING MECHANICAL FORCE.
PREHEAT
0
10
20
30
40
50
60
70
80
90
100
TIME - SECONDS
Ammo Packs Drawing
6.35±1.30
0.25±0.0512
12.70±1.00
0.50±0.0394
CATHODE
20.50±1.00
0.807±0.039
9.125±0.625
0.3593±0.0246
18.00±0.50
0.7087±0.0197
12.70±0.30
0.50±0.0118
A
0.70±0.20
0.0276±0.0079
A
∅4.00±0.20TYP.
0.1575±0.008
VIEW A-A
Note: The ammo-packs drawing is applicable for packaging option –DD & -ZZ and regardless standoff or non-standoff
10
Packaging Box for Ammo Packs
Note: For InGaN device, the ammo pack packaging box contain ESD logo
DISCLAIMER
AVAGO TECHNOLOGIES’ PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR AUTHORIZED FOR SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE
OR DIRECT OPERATION OF A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS
SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE CLAIMS AGAINST AVAGO OR ITS SUPPLIERS, FOR ALL LOSS,
DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE.
For product information and a complete list of distributors, please go to our web site:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited in the United States and other countries.
Data subject to change. Copyright © 2007 Avago Technologies Limited. All rights reserved.
AV02-0213EN - March 21, 2007
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