AVAGO HLMP-CM31-S0DXX T-13/4 (5 mm) precision optical performance ingan blue, green and cyan lamp Datasheet

HLMP-Cxxx
T-13/4 (5 mm) Extra Bright Precision Optical
Performance InGaN LED Lamps
Data Sheet
HLMP-CB11, HLMP-CB12, HLMP-CM11,
HLMP-CM12, HLMP-CE11, HLMP-CE12,
HLMP-CB26, HLMP-CB27, HLMP-CM26,
HLMP-CM27, HLMP-CE26, HLMP-CE27,
HLMP-CB36, HLMP-CB37, HLMP-CM36,
HLMP-CM37, HLMP-CE36, HLMP-CE37
Description
Features
These high intensity blue, green, and cyan LEDs
are based on the most efficient and cost effective
InGaN material technology. The 470 nm typical
dominant wave–length for blue and 525 nm typical
wavelength for green is well suited to color mixing
in full color signs. The 505 nm typical dominant
wavelength for cyan is suitable for traffic signal
application.
•
•
•
•
•
•
These LED lamps are untinted, non-diffused, T-13/4
packages incorporating second generation optics
which produce well-defined spatial radiation
patterns at specific viewing cone angles.
Applications
These lamps are made with an advanced optical
grade epoxy, offering superior temperature and
moisture resistance in outdoor signal and sign
applications. The high maximum LED junction
temperature limit of +110° C enables high
temperature operation in bright sunlight
conditions.
•
•
•
•
Well defined spatial radiation pattern
High luminous output
Available in blue, green, and cyan color
Viewing angle: 15°, 23° and 30°
Standoff or non-standoff leads
Superior resistance to moisture
Traffic signals
Commercial outdoor advertising
Front panel backlighting
Front panel indicator
CAUTION: Devices are Class I ESD sensitive. Please observe appropriate precautions during
handling and processing. Refer to Application Note AN-1142 for additional details.
Package Dimensions
Package A
2.35 (0.093)
MAX.
1.14 ± 0.20
(0.045 ± 0.008)
∅ 5.80 ± 0.20
(0.228 ± 0.008)
0.70 (0.028)
MAX.
4.90 ± 0.20
(0.193 ± 0.008)
2.54 ± 0.38
(0.100 ± 0.015)
CATHODE
LEAD
8.61 ± 0.20
(0.339 ± 0.008)
CATHODE
FLAT
31.60 MIN.
(1.244)
Package B
∅ 5.80 ± 0.20
(0.228 ± 0.008)
1.14 ± 0.20
(0.045 ± 0.008)
1.50 ± 0.15
(0.059 ± 0.006)
0.70 (0.028)
MAX.
0.50 ± 0.10 SQ. TYP.
(0.020 ± 0.004)
4.90 ± 0.20
NOTE 1
(0.192 ± 0.008)
2.54 ± 0.38
(0.100 ± 0.015)
CATHODE
LEAD
8.61 ± 0.20
(0.339 ± 0.008)
1.00 MIN.
(0.039)
DIMENSION H
31.60 MIN.
(1.244)
DIMENSION H:
15° = 10.80 ± 0.25 mm (0.425 ± 0.01 INCH)
23° = 10.00 ± 0.25 mm (0.394 ± 0.01 INCH)
30° = 11.27 ± 0.25 mm (0.444 ± 0.01 INCH)
NOTES:
1. MEASURED JUST ABOVE FLANGE.
2. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).
3. EPOXY MENISCUS MAY EXTEND ABOUT 1 mm (0.040") DOWN THE LEADS.
4. IF HEAT SINKING APPLICATION IS REQUIRED, THE TERMINAL FOR HEAT SINK IS ANODE.
2
CATHODE
FLAT
Device Selection Guide
Part Number
Color
Typical
Viewing Angle,
2q1/2 (Degree)
HLMP-CB11-TW0xx
Blue
15
2.5
7.2
No
A
Clear
HLMP-CB11-UVAxx
Blue
15
3.2
5.5
No
A
Clear
HLMP-CB12-TW0xx
Blue
15
2.5
7.2
Yes
B
Clear
HLMP-CM11-Y20xx
Green
15
9.3
27.0
No
A
Clear
HLMP-CM11-Z1Cxx
Green
15
12.0
21.0
No
A
Clear
HLMP-CM12-Y20xx
Green
15
9.3
27.0
Yes
B
Clear
HLMP-CE11-X10xx
Cyan
15
7.2
21.0
No
A
Clear
HLMP-CE12-X10xx
Cyan
15
7.2
21.0
Yes
B
Clear
HLMP-CB26-SV0xx
Blue
23
1.9
5.5
No
A
Clear
HLMP-CB26-TUDxx
Blue
23
2.5
4.2
No
A
Clear
HLMP-CB27-SV0xx
Blue
23
1.9
5.5
Yes
B
Clear
HLMP-CM26-X10xx
Green
23
7.2
21.0
No
A
Clear
HLMP-CM26-YZCxx
Green
23
9.3
16.0
No
A
Clear
HLMP-CM27-X10xx
Green
23
7.2
21.0
Yes
B
Clear
HLMP-CE26-WZ0xx
Cyan
23
5.5
16.0
No
A
Clear
HLMP-CE27-WZ0xx
Cyan
23
5.5
16.0
Yes
B
Clear
HLMP-CB36-QT0xx
Blue
30
1.15
3.2
No
A
Clear
HLMP-CB36-RSAxx
Blue
30
1.5
2.5
No
A
Clear
HLMP-CB36-RSBxx
Blue
30
1.5
2.5
No
A
Clear
HLMP-CB37-RU0xx
Blue
30
1.5
4.2
Yes
B
Clear
HLMP-CB37-RSDxx
Blue
30
1.5
2.5
Yes
B
Clear
HLMP-CM36-X10xx
Green
30
7.2
21.0
No
A
Clear
HLMP-CM36-XYCxx
Green
30
7.2
12.0
No
A
Clear
HLMP-CM37-X10xx
Green
30
7.2
21.0
Yes
B
Clear
HLMP-CM37-XYCxx
Green
30
7.2
12.0
Yes
B
Clear
HLMP-CM37-XYDxx
Green
30
7.2
12.0
Yes
B
Clear
HLMP-CE36-WZ0xx
Cyan
30
5.5
16.0
No
A
Clear
HLMP-CE37-WZ0xx
Cyan
30
5.5
16.0
Yes
B
Clear
Intensity (cd) at 20 mA
Min.
Max.
Standoff
Package
Dimension
Lens
Notes:
1. Tolerance for luminous intensity measurement is ±15%.
2. The luminous intensity is measured on the mechanical axis of the lamp package.
3. The optical axis is closely aligned with the package mechanical axis.
4. LED light output is bright enough to cause injuries to the eyes. Precautions must be taken to prevent looking directly at the LED without proper
safety equipment.
5. 2q1/2 is the off-axis angle where the luminous intensity is 1/2 the on-axis intensity.
3
Part Numbering System
HLMP - x x xx - x x x xx
Mechanical Options
00: Bulk
DD: Ammo Pack
Color Bin Options
0: Full Color Bin Distribution
A: Color Bin 1 and 2
B: Color Bin 2 and 3
C: Color Bin 3 and 4
D: Color Bin 4 and 5
Maximum Intensity Bin
0: No Maximum Intensity Bin Limitation
Others: Refer to Device Selection Guide
Minimum Intensity Bin
Refer to Device Selection Guide
Viewing Intensity Bin
11: 15° Without Standoff
12: 15° With Standoff
26: 23° Without Standoff
27: 23° With Standoff
36: 30° Without standoff
37: 30° With Standoff
Color
B: Blue 470 nm
M: Green 525 nm
E: Cyan 505 nm
Package
C: T-13/4 (5 mm) Round Lamp
4
Absolute Maximum Rating at TA = 25°C
Parameters
Value
Unit
DC Forward Current [1]
30
mA
Peak Pulsed Forward Current[2]
100
mA
Power Dissipation
116
mW
LED Junction Temperature
130
°C
Operating Temperature Range
–40 to +85
°C
Storage Temperature Range
–40 to +100
°C
Notes:
1. Derate linearly as shown in Figure 2.
2. Duty factor 10%, frequency 1 KHz.
Electrical/Optical Characteristics
TA = 25oC
Blue
Parameters
Symbol
Min. Typ. Max.
Forward Voltage
VF
Reverse Voltage[1]
VR
Thermal Resistance
RqJ-PIN
Dominant
Wavelength[2]
ld
Peak Wavelength
lPEAK
464
Spectral Half Width
Dl1/2
Luminous Efficacy[3]
hv
Green
Min. Typ. Max.
Units
Test Condition
V
IF = 20 mA
V
IR = 10 µA
oC/W
LED Junction to
Anode Lead
490 505 508
nm
IF = 20 mA
516
501
nm
Peak of Wavelength
of Spectral Distribution at IF = 20 mA
23
32
30
nm
Wavelength Width
at Spectral Distribution Power Point
at IF = 20 mA
74
484
319
lm/W Emitted Luminous
Power/Emitted
Radiant Power
3.2 3.85
5.0
470 480
Min. Typ. Max.
3.3 3.85
5.0
240
460
Cyan
240
520
3.2 3.85
5.0
525 540
240
Notes:
1. The reverse voltage of the product is equivalent to the forward voltage of the protective chip at IR = 10 µA.
2. The dominant wavelength, ld, is derived from the Chromaticity Diagram and represents the color of the lamp.
3. The radiant intensity, Ie in watts/steradian, may be found from the equation Ie = Iv/hv, where Iv is the luminous intensity in candelas and hv is the
luminous efficacy in lumens/watt.
5
CYAN
RELATIVE INTENSITY
0.8
GREEN
BLUE
0.6
0.4
0.2
0
380
430
480
530
580
630
680
IF MAX. – MAXIMUM FORWARD CURRENT – mA
1.0
35
30
25
RθJ-A = 780 °C/W
20
15
10
5
0
0
10
1.035
30
1.030
RELATIVE DOMINANT WAVELENGTH
FORWARD CURRENT – mA
35
25
20
15
10
5
1.0
FORWARD VOLTAGE – V
RELATIVE LUMINOUS INTENSITY
(NORMALIZED AT 20 mA)
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
5
10
15
20
25
30
DC FORWARD CURRENT – mA
Figure 5. Relative intensity vs. DC forward current.
6
60
70
80
90
CYAN
1.020
GREEN
1.015
1.010
1.005
BLUE
1.000
0.995
0
5
10
15
20
25
30
DC FORWARD CURRENT – mA
Figure 3. Forward current vs. forward voltage.
0
50
1.025
0.990
4.0
3.0
2.0
40
Figure 2. Forward current vs. ambient temperature.
Figure 1. Relative intensity vs. wavelength.
0
30
TA – AMBIENT TEMPERATURE – °C
WAVELENGTH – nm
0
20
Figure 4. Relative dominant wavelength vs. DC forward current.
NORMALIZED INTENSITY
1
0.5
0
-90
-60
-30
0
30
60
90
60
90
60
90
ANGULAR DISPLACEMENT – DEGREES
Figure 6. Spatial radiation pattern for Cx11 and Cx12.
NORMALIZED INTENSITY
1
0.5
0
-90
-60
-30
0
30
ANGULAR DISPLACEMENT – DEGREES
Figure 7. Spatial radiation pattern for Cx26 and Cx27.
NORMALIZED INTENSITY
1
0.5
0
-90
-60
-30
0
30
ANGULAR DISPLACEMENT – DEGREES
Figure 8. Spatial radiation pattern for Cx36 and Cx37.
7
Intensity Bin Limit Table
Blue Color Bin Table
Intensity (mcd) at 20 mA
Bin
Min Dom
Max Dom
Xmin
Ymin
Xmax
Ymax
Bin
Min
Max
1
460.0
464.0
0.1440
0.0297
0.1766
0.0966
N
680
880
0.1818
0.0904
0.1374
0.0374
P
880
1150
0.1374
0.0374
0.1699
0.1062
Q
1150
1500
0.1766
0.0966
0.1291
0.0495
R
1500
1900
0.1291
0.0495
0.1616
0.1209
S
1900
2500
0.1699
0.1062
0.1187
0.0671
T
2500
3200
0.1187
0.0671
0.1517
0.1423
U
3200
4200
0.1616
0.1209
0.1063
0.0945
V
4200
5500
0.1063
0.0945
0.1397
0.1728
W
5500
7200
0.1517
0.1423
0.0913
0.1327
X
7200
9300
Y
9300
12000
Z
12000
16000
1
16000
21000
Tolerance for each bin limit is ±15%.
2
3
4
5
464.0
468.0
472.0
476.0
468.0
472.0
476.0
480.0
Tolerance for each bin limit is ±0.5 nm.
Green Color Bin Table
Bin
Min Dom
Max Dom
Xmin
Ymin
Xmax
Ymax
1
520.0
524.0
0.0743
0.8338
0.1856
0.6556
0.1650
0.6586
0.1060
0.8292
0.1060
0.8292
0.2068
0.6463
0.1856
0.6556
0.1387
0.8148
0.1387
0.8148
0.2273
0.6344
0.2068
0.6463
0.1702
0.7965
0.1702
0.7965
0.2469
0.6213
0.2273
0.6344
0.2003
0.7764
0.2003
0.7764
0.2659
0.6070
0.2469
0.6213
0.2296
0.7543
2
3
4
5
524.0
528.0
532.0
536.0
528.0
532.0
536.0
540.0
Tolerance for each bin limit is ±0.5 nm.
Cyan Color Bin Table
Bin
Min Dom
Max Dom
Xmin
Ymin
Xmax
Ymax
1
490.0
495.0
0.0454
0.2945
0.1164
0.3889
0.1318
0.306
0.0235
0.4127
0.0345
0.4127
0.1057
0.4769
0.1164
0.3889
0.0082
0.5384
0.0082
0.5384
0.1027
0.5584
0.1057
0.4769
0.0039
0.6548
2
3
4
7
8
495.0
500.0
505.0
498.0
503.0
500.0
505.0
510.0
503.0
508.0
Tolerance for each bin limit is ±0.5 nm.
8
0.0039
0.6548
0.1097
0.6251
0.1027
0.5584
0.0139
0.7502
0.0132
0.4882
0.1028
0.5273
0.1092
0.4417
0.0040
0.6104
0.0040
0.6104
0.1056
0.6007
0.1028
0.5273
0.0080
0.7153
Precautions
Lead Forming
• The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering into PC board.
• If lead forming is required before soldering, care must
be taken to avoid any excessive mechanical stress
induced to LED package. Otherwise, cut the leads of
LED to length after soldering process at room
temperature. The solder joint formed will absorb the
mechanical stress of the lead cutting from traveling to
the LED chip die attach and wirebond.
• It is recommended that tooling made to precisely
form and cut the leads to length rather than rely upon
hand operation.
Soldering Conditions
• Care must be taken during PCB assembly and
soldering process to prevent damage to LED
component.
• Wave soldering parameter must be set and
maintained according to recommended temperature
and dwell time in the solder wave. Customer is
advised to periodically check on the soldering profile
to ensure the soldering profile used is always
conforming to recommended soldering condition.
• If necessary, use fixture to hold the LED component
in proper orientation with respect to the PCB during
soldering process.
• Proper handling is imperative to avoid excessive
thermal stresses to LED components when heated.
Therefore, the soldered PCB must be allowed to cool
to room temperature, 25°C, before handling.
• Special attention must be given to board fabrication,
solder masking, surface plating and lead holes size
and component orientation to assure solderability.
• Recommended PC board plated through hole sizes for
LED component leads:
LED Component
Lead Size
0.457 x 0.457 mm
(0.018 x 0.018 inch)
0.508 x 0.508 mm
(0.020 x 0.020 inch)
• The closest LED is allowed to solder on board is 1.59
mm below the body (encapsulant epoxy) for those
parts without standoff.
• Recommended soldering conditions:
Wave Soldering
105 °C Max.
30 sec Max.
250 °C Max.
3 sec Max.
Pre-heat Temperature
Pre-heat Time
Peak Temperature
Dwell Time
LAMINAR WAVE
HOT AIR KNIFE
TURBULENT WAVE
TEMPERATURE – °C
250
BOTTOM SIDE
OF PC BOARD
200
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)
PREHEAT SETTING = 150°C (100°C PCB)
SOLDER WAVE TEMPERATURE = 245°C
AIR KNIFE AIR TEMPERATURE = 390°C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40°
SOLDER: SN63; FLUX: RMA
150
FLUXING
100
0
NOTE: ALLOW FOR BOARDS TO BE
SUFFICIENTLY COOLED BEFORE EXERTING
MECHANICAL FORCE.
PREHEAT
10
20
30
40
50
60
70
80
TIME – SECONDS
Figure 9. Recommended wave soldering profile.
90
100
Plated Through
Hole Diameter
0.976 to 1.078 mm
(0.038 to 0.042 inch)
1.049 to 1.150 mm
(0.041 to 0.045 inch)
Note: Refer to application note AN1027 for more
information on soldering LED components.
TOP SIDE OF
PC BOARD
50
30
9
Manual Solder
Dipping
–
–
260 °C Max.
5 sec Max.
Diagonal
0.646 mm
(0.025 inch)
0.718 mm
(0.028 inch)
For product information and a complete list of distributors, please go to our website:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries.
Data subject to change. Copyright © 2006 Avago Technologies Limited. All rights reserved. Obsoletes 5989-3337EN
5989-4115EN June 26, 2006
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