AVAGO HLMP-EL25-RU000 Precision optical performance alingap ii led lamp Datasheet

HLMP-ELxx, HLMP-EHxx, HLMP-EDxx
Precision Optical Performance AlInGaP II LED Lamps
Data Sheet
Description
Features
Precision Optical Perform­ance AlInGaP II (aluminum indium gallium phosphide) LEDs offer superior light output
for excellent readability in sunlight and dependable performance. The AlInGaP II technology provides extremely
stable light output over long periods of time.
• Well defined spatial radiation patterns
These LED lamps are untinted, nondiffused, T-13/4 packages incorporating second generation optics which produce well defined radiation patterns at specific viewing
cone angles.
These lamps are made with an advanced optical grade
epoxy offering superior high tempera­ture and high
moisture resistance performance in outdoor signal and
sign applications. The maximum LED junction tempera­
ture limit of +130°C enables high temperature operation
in bright sunlight conditions. The epoxy contains both
uv-a and uv‑b inhibitors to reduce the effects of long
term exposure to direct sunlight.
Benefits
• Viewing angles match traffic management requirements
• Colors meet automotive and traffic signal specifications
• Superior light output performance in outdoor environments
• Suitable for autoinsertion into PC boards
• Viewing angles: 15°, 23°, 30°
• High luminous output
• Colors:
592 nm Amber
617 nm Reddish-Orange
630 nm Red
• High operating temperature:
TJLED = +130°C
• Superior resistance to moisture
Applications
• Traffic management:
Traffic signals
Work zone warning lights
Variable message signs
• Commercial outdoor advertising:
Signs
Marquees
• Automotive:
Exterior and interior lights
T-13/4 (5 mm) Precision Optical Performance AlInGaP II LED Lamps
Selection Guide
Typical Viewing
Angle
2q1/2
(Deg.)[2]
Color and
Dominant
Wavelength
(nm), Typ.[1]
Lamps Without Standoffs
(Outline Drawing A)
Lamps With Standoffs
(Outline Drawing B)
15°
Amber 592
HLMP-EL16-S0000
HLMP-EL18-S0000
HLMP-EL16-TW000
HLMP-EL16-UX000
HLMP-EL18-UX000
Max.
1900
–
2500
7200
3200
9300
3200
9300
HLMP-EL16-VW000
4200
7200
7200
21000
HLMP-EL16-VY000
HLMP-EL18-VY000
4200
12000
HLMP-EL16-VYR00
HLMP-EL18-VYR00
4200
12000
4200
12000
4200
12000
2500
7200
3200
9300
HLMP-EL16-VYK00
HLMP-EL16-VYS00
HLMP-EL18-VYS00
HLMP-EH16-TW000
HLMP-EH16-UX000
HLMP-EH18-UX000
HLMP-EH16-VX0DD
Red 630
Min.
HLMP-EL16-UXR00
HLMP-EL16-VX400
Red-Orange 617
Luminous
Intensity Iv (mcd) [3,4,5]
@ I(f) = 20 mA
4200
9300
HLMP-ED16-S0000
HLMP-ED18-S0000
1900
–
HLMP-ED16-TW000
HLMP-ED18-TW000
2500
7200
HLMP-ED18-TWT00
2500
7200
HLMP-ED16-UX000
HLMP-ED18-UX000
3200
9300
HLMP-ED16-UXT00
HLMP-ED18-UXT00
3200
9300
HLMP-ED16-VX000
HLMP-ED18-VX000
4200
9300
Notes:
1. Dominant Wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the color of the lamp.
2. θ1/2 is the off-axis angle where the luminous intensity is one half the on-axis intensity.
3. The luminous intensity is measured on the mechanical axis of the lamp package.
4. The optical axis is closely aligned with the package mechanical axis.
5. Tolerance for each intensity bin limit is ± 15%.
T-13/4 (5 mm) Precision Optical Performance AlInGaP II Led Lamps (Continued)
Selection Guide
Luminous
Intensity Iv (mcd) [3,4,5]
@ I(f) = 20 mA
Typical Viewing
Angle
2q1/2
(Deg.)[2]
Color and
Dominant
Wavelength
(nm), Typ.[1]
Lamps Without Standoffs
(Outline Drawing A)
Lamps With Standoffs
(Outline Drawing B)
Min.
Max.
23°
Amber 592
HLMP-EL25-Q0000
HLMP-EL27-Q0000
1150
–
HLMP-EL27-QTR00
1150
3200
HLMP-EL27-RU000
HLMP-EL25-RU000
Red-Orange 617
1500
4200
HLMP-EL25-SU000
1900
4200
HLMP-EL25-SVK00
1900
5500
HLMP-EL25-SV000
HLMP-EL27-SV000
1900
5500
HLMP-EL25-SVR00
HLMP-EL27-SVR00
1900
5500
HLMP-EL25-TW000
HLMP-EL27-TW000
2500
7200
HLMP-EL25-TWR00
HLMP-EL27-TWR00
2500
7200
HLMP-EL25-TWK00
2500
7200
HLMP-EL25-TWS00
2500
7200
HLMP-EL25-UX000
3200
9300
1150
3200
1900
5500
2500
7200
HLMP-ED25-RU000
3200
9300
HLMP-ED25-RUT00
3200
9300
HLMP-EH25-QT000
HLMP-EH27-QT000
HLMP-EH25-SV000
HLMP-EH25-TW000
Red 630
HLMP-EH27-TW000
HLMP-ED25-SV000
HLMP-ED27-SV000
1900
5500
HLMP-ED25-TW000
HLMP-ED27-TW000
2500
7200
HLMP-ED25-TWT00
HLMP-ED27-TWT00
2500
7200
Notes:
1. Dominant Wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the color of the lamp.
2. θ1/2 is the off-axis angle where the luminous intensity is one half the on-axis intensity.
3. The luminous intensity is measured on the mechanical axis of the lamp package.
4. The optical axis is closely aligned with the package mechanical axis.
5. Tolerance for each intensity bin limit is ± 15%.
T-13/4 (5 mm) Precision Optical Performance AlInGaP II Led Lamps (Continued)
Selection Guide
Typical Viewing
Angle
2q1/2
(Deg.)[2]
Color and
Dominant
Wavelength
(nm), Typ.[1]
Lamps Without Standoffs
(Outline Drawing A)
30°
Amber 592
HLMP-EL31-P0000
HLMP-EL31-QT000
Lamps With Standoffs
(Outline Drawing B)
HLMP-EL33-QT000
HLMP-EL31-QTR00
HLMP-EL31-SV000
HLMP-EL33-SV000
HLMP-EL31-SVK00
HLMP-EL31-SVR00
Red-Orange 617
Red 630
HLMP-EL33-SVR00
Luminous
Intensity Iv (mcd) [3,4,5]
@ I(f) = 20 mA
Min.
Max.
880
–
1150
3200
1150
3200
1900
5500
1900
5500
1900
5500
HLMP-EL31-STR00
1900
3200
HLMP-EL31-SUK00
1900
4200
HLMP-EL31-SUS00
1900
4200
HLMP-EL31-SUR00
1900
4200
HLMP-EL31-SVK00
1900
5500
HLMP-EL31-SVS00
1900
5500
HLMP-EH31-QT000
1150
3200
HLMP-EH33-RU000
1500
4200
HLMP-EH31-SV000
HLMP-EH33-SV000
1900
5500
HLMP-ED31-Q0000
HLMP-ED33-Q0000
1150
–
HLMP-ED31-QTT00
1150
3200
HLMP-ED31-ST000
1900
3200
HLMP-ED31-SUT00
1900
4200
HLMP-ED31-RU000
1500
4200
HLMP-ED31-RUT00
HLMP-ED33-RUT00
1500
4200
HLMP-ED31-SV000
HLMP-ED33-SV000
1900
5500
HLMP-ED31-SVT00
HLMP-ED33-SVT00
1900
5500
Notes:
1. Dominant Wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the color of the lamp.
2. θ1/2 is the off-axis angle where the luminous intensity is one half the on-axis intensity.
3. The luminous intensity is measured on the mechanical axis of the lamp package.
4. The optical axis is closely aligned with the package mechanical axis.
5. Tolerance for each intensity bin limit is ± 15%.
Part Numbering System
HLMP- x x xx - x x x xx
Mechanical Options
00: Bulk Packaging
DD: Ammo Pack
YY: Flexi-Bin, Bulk Packaging
ZZ: Flexi-Bin; Ammo Pack
Color Bin & VF Selections
0: No color bin limitation
4: Amber color bin 4 only
K: Amber color bins 2 and 4 only
L: Color bins 4 and 6
R: Amber color bins 1, 2, 4, and 6 with VF max of 2.6 V
S: Amber color bins 2 and 4 with VF max of 2.6 V
T: Red color with VF max of 2.6 V
U: Amber color bin 4 with VF max of 2.6 V
W: Color bins 2, 4 and 6 with VF max of 2.6 V
Y: Color bins 4 and 6 with VF max of 2.6 V
Maximum Intensity Bin
0: No Iv bin limitation
Minimum Intensity Bin
Viewing Angle and Lead Standoffs
16: 15 degree without lead standoffs
18: 15 degree with lead standoffs
25: 23 degree without lead standoffs
27: 23 degree with lead standoffs
31: 30 degree without lead standoffs
33: 30 degree with lead standoffs
Color
D: 630 nm Red
H: 617 nm Red-Orange
L: 592 nm Amber
Package
E: 5 mm Round
Note: Please refer to AB 5337 for complete information on part numbering system.
Package Dimensions
A
B
5.00 ± 0.20
(0.197 ± 0.008)
5.00 ± 0.20
(0.197 ± 0.008)
8.71 ± 0.20
(0.343 ± 0.008
1.14 ± 0.20
(0.045 ± 0.008)
d
8.71 ± 0.20
(0.343 ± 0.008)
1.14 ± 0.20
(0.045 ± 0.008)
2.35 (0.093)
MAX.
31.60
(1.244) MIN.
0.70 (0.028)
MAX.
31.60
(1.244) MIN.
1.50 ± 0.15
(0.059 ± 0.006)
0.70 (0.028)
MAX.
CATHODE
LEAD
CATHODE
LEAD
PART NO.
HLMP-EX18-xxxxx
HLMP-EX27-xxxxx
HLMP-EX33-xxxxx
1.00 MIN.
(0.039)
CATHODE
FLAT
0.50 ± 0.10 SQ. TYP.
(0.020 ± 0.004)
5.80 ± 0.20
(0.228 ± 0.008)
1.00 MIN.
(0.039)
CATHODE
FLAT
2.54 ± 0.38
(0.100 ± 0.015)
Absolute Maximum Ratings at TA = 25°C
DC Forward Current[1,2,3] . .................................................................................... 50 mA
Peak Pulsed Forward Current[2,3] . ......................................................................100 mA
Average Forward Current . ..................................................................................... 30 mA
Reverse Voltage (IR = 100 µA)......................................................................................... 5 V
LED Junction Temperature........................................................................................ 130°C
Operating Temperature..........................................................................-40°C to +100°C
Storage Temperature...............................................................................-40°C to +100°C
Notes:
1. Derate linearly as shown in Figure 4.
2. For long term performance with minimal light output degradation, drive currents between
10 mA and 30 mA are recommended. For more information on recommended drive conditions, please refer to Application Brief I-024 (5966-3087E).
3. Please contact your sales representative about operating currents below 10 mA.
0.50 ± 0.10 SQ. TYP.
(0.020 ± 0.004)
5.80 ± 0.20
(0.228 ± 0.008)
2.54 ± 0.38
(0.100 ± 0.015)
d
12.60 ± 0.18
(0.496 ± 0.007)
11.33 ± 0.25
(0.446 ± 0.010)
11.99 ± 0.25
(0.472 ± 0.010)
Electrical/Optical Characteristics at TA = 25°C
Parameter
Symbol
Min.
Typ.
Max.
Units
Test Conditions
Forward Voltage
Amber (ld = 592 nm)
2.3
Red-Orange (ld = 617 nm)
VF
2.35
2.6[1]
V
Red (ld = 630 nm)
2.4
IF = 20 mA
Reverse Voltage
IR = 100 µA
VR
5
20
V
Peak Wavelength
Amber
594
Red-Orange
lPEAK
623
nm
Red
639
Peak of Wavelength of
Spectral Distribution
at IF = 20 mA
Spectral Halfwidth
∆l1/2
17
nm
Wavelength Width at Spectral Distribution 1/2 Power Point at IF = 20 mA
Speed of Response
ts
20
ns
Exponential Time
Constant, e-t/ts
Capacitance
C
40
pF
VF = 0, f = 1 MHz
Thermal Resistance
RQJ-PIN
240
°C/W
LED Junction-to-Cathode Lead
Luminous Efficacy[2]
500
235
lm/W
155
Emitted Luminous
Power/Emitted Radiant Power
at If = 20 mA
Luminous Flux
jV
1000mlm
IF = 20 mA
Amber
Red-Orange
hv
Red
Luminous Efficiency [3]
he
Amber
22
Red-Orange
22
lm/W
Red
21
Emitted
Luminous Flux/
Electrical Power
Notes:
1. For options -xxRxx, -xxSxx, -xxTxx, -xxUxx, -xxWxx, -xxYxx, max forward voltage (Vf ) is 2.6 V. Refer to Vf bin table.
2. The radiant intensity, Ie, in watts per steradian, may be found from the equation Ie = Iv/hv, where Iv is the luminous intensity in candelas and hv
is the luminous efficacy in lumens/watt.
3. he = jV / IF x VF, where jV is the emitted luminous flux, IF is electrical forward current and VF is the forward voltage.
1.0
DC FORWARD CURRENT – mA
RELATIVE INTENSITY
RED
0.5
0
550
50
40
30
AMBER
20
10
RED
600
650
WAVELENGTH – nm
Figure 1. Relative Intensity vs. Peak Wavelength.
60
RED-ORANGE
AMBER
700
0
0
0.5
1.0
1.5
2.0
2.5
FORWARD VOLTAGE – V
Figure 2a. Forward Current vs. Forward Voltage for
Option -xxRxx, -xxSxx, -xxTxx, -xxUxx, -xxWxx and
-xxYxx.
3.0
90
CURRENT – mA
70
RELATIVE INTENSITY
(NORMALIZED AT 20 mA)
80
RED
60
50
40
30
AMBER
20
2.0
RED & RED-ORANGE
1.5
AMBER
1.0
0.5
10
0
1.0
1.5
2.0
2.5
0
3.0
10
20
NORMALIZED INTENSITY – %
0.8
0.6
0.4
0.2
-50
0
50
100
ANGULAR DISPLACEMENT – DEGREES
Figure 5. Representative Spatial Radiation Pattern for 15° Viewing Angle Lamps.
NORMALIZED INTENSITY – %
1.0
0.8
0.6
0.4
0.2
0
-100
-50
0
50
100
ANGULAR DISPLACEMENT – DEGREES
Figure 6. Representative Spatial Radiation Pattern for 23° Viewing Angle Lamps.
40
Figure 3. Relative Luminous Intensity vs. Forward
Current.
1.0
0
-100
30
FORWARD CURRENT – mA
VF – FORWARD VOLTAGE – V
Figure 2b. Forward Current vs. Forward Voltage.
0
50
IF MAX. – MAXIMUM FORWARD CURRENT – mA
2.5
100
55
50
45
40
35
30
25
20
15
10
5
0
0
20
40
60
80
100
120
TA – AMBIENT TEMPERATURE – C
Figure 4. Maximum Forward Current vs. Ambient Temperature. Derating Based on TJMAX = 130°C.
NORMALIZED INTENSITY – %
1.0
0.8
0.6
0.4
0.2
0
-100
-50
0
50
100
ANGULAR DISPLACEMENT – DEGREES
Figure 7. Representative Spatial Radiation Pattern for 30° Viewing Angle Lamps.
RELATIVE LOP
(NORMALIZED AT 25 C)
10
RED-ORANGE
1
RED
AMBER
0.1
-50
-25
0
25
50
75
100
125
150
JUNCTION TEMPERATURE – C
Figure 8. Relative light output vs. junction temperature
Max.
Amber Color Bin Limits (nm at 20 mA)
Bin Name
Min.
Max.
Vf Bin Table[2]
Bin Name
Min.
Max.
880
1150
1
584.5
587.0
VA
2.0
2.2
Q
1150
1500
2
587.0
589.5
VB
2.2
2.4
R
1500
1900
4
589.5
592.0
VC
2.4
2.6
S
1900
2500
6
592.0
594.5
T
2500
3200
U
3200
4200
V
4200
5500
W
5500
7200
X
7200
9300
Y
9300
12000
Z
12000
16000
Intensity Bin Limits
(mcd at 20 mA)
Bin Name
Min.
P
Tolerance for each bin limit is ±15%.
Tolerance for each bin limit is ±0.5 nm.
Notes:
1. Bin categories are established for classification of products. Products may not be
available in all bin categories.
2. Vf Bin table only available for those part
number with options -xxRxx, -xxSxx, -xxTxx, -xxUxx, -xxWxx, -xxYxx.
Tolerance for each bin limit is ±0.05 V.
Precautions:
Lead Forming:
• The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering on PC board.
• For better control, it is recommended to use proper
tool to precisely form and cut the leads to applicable
length rather than doing it manually.
• If manual lead cutting is necessary, cut the leads after
the soldering process. The solder connection forms
a mechanical ground which prevents mechanical
stress due to lead cutting from traveling into LED
package. This is highly recommended for hand solder
operation, as the excess lead length also acts as small
heat sink.
Note:
1. PCB with different size and design (component density) will have
different heat mass (heat capacity). This might cause a change in
temperature experienced by the board if same wave soldering
setting is used. So, it is recommended to re-calibrate the soldering
profile again before loading a new type of PCB.
2. Avago Technologies’ high brightness LED are using high efficiency
LED die with single wire bond as shown below. Customer is advised
to take extra precaution during wave soldering to ensure that the
maximum wave temperature does not exceed 250°C and the solder
contact time does not exceeding 3sec. Over-stressing the LED
during soldering process might cause premature failure to the LED
due to delamination.
Avago Technologies LED configuration
Soldering and Handling:
• Care must be taken during PCB assembly and soldering
process to prevent damage to the LED component.
• LED component may be effectively hand soldered
to PCB. However, it is only recommended under
unavoidable circumstances such as rework. The
closest manual soldering distance of the soldering
heat source (soldering iron’s tip) to the body is
1.59mm. Soldering the LED using soldering iron tip
closer than 1.59mm might damage the LED.
1.59m­m­
• ESD precaution must be properly applied on the
soldering station and personnel to prevent ESD
damage to the LED component that is ESD sensitive.
Do refer to Avago application note AN 1142 for details.
The soldering iron used should have grounded tip to
ensure electrostatic charge is properly grounded.
• Recommended soldering condition:
Wave
Soldering [1, 2]
Manual Solder
Dipping
Pre-heat temperature
105 °C Max.
-
Preheat time
60 sec Max
-
Peak temperature
250 °C Max.
260 °C Max.
Dwell time
3 sec Max.
5 sec Max
Note:
1. Above conditions refers to measurement with thermocouple
mounted at the bottom of PCB.
2. It is recommended to use only bottom preheaters in order to reduce
thermal stress experienced by LED.
• Wave soldering parameters must be set and
maintained according to the recommended
temperature and dwell time. Customer is advised
to perform daily check on the soldering profile to
ensure that it is always conforming to recommended
soldering conditions.
10
CATHODE
AllnGaP
Devicebetween bottom surface of LED die and
Note: Electrical
connection
the lead frame is achieved through conductive paste.
• Any alignment fixture that is being applied during
wave soldering should be loosely fitted and should
not apply weight or force on LED. Non metal material
is recommended as it will absorb less heat during
wave soldering process.
• At elevated temperature, LED is more susceptible to
mechanical stress. Therefore, PCB must allowed to
cool down to room temperature prior to handling,
which includes removal of alignment fixture or pallet.
• If PCB board contains both through hole (TH) LED and
other surface mount components, it is recommended
that surface mount components be soldered on the
top side of the PCB. If surface mount need to be on the
bottom side, these components should be soldered
using reflow soldering prior to insertion the TH LED.
• Recommended PC board plated through holes (PTH)
size for LED component leads.
LED component
lead size
Diagonal
Plated through
hole diameter
0.45 x 0.45 mm
(0.018x 0.018 inch)
0.636 mm
(0.025 inch)
0.98 to 1.08 mm
(0.039 to 0.043 inch)
0.50 x 0.50 mm
(0.020x 0.020 inch)
0.707 mm
(0.028 inch)
1.05 to 1.15 mm
(0.041 to 0.045 inch)
• Over-sizing the PTH can lead to twisted LED after
clinching. On the other hand under sizing the PTH can
cause difficulty inserting the TH LED.
Refer to application note AN5334 for more information about soldering and handling of high brightness TH LED lamps.
Example of Wave Soldering Temperature Profile for TH LED
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
LAMINAR WAVE
HOT AIR KNIFE
TURBULENT WAVE
250
TEMPERATURE (°C)
Flux: Rosin flux
200
Solder bath temperature:
245°C± 5°C (maximum peak
temperature = 250°C)
150
Dwell time: 1.5 sec - 3.0 sec
(maximum = 3sec)
Note: Allow for board to be
sufficiently cooled to room
temperature before exerting
mechanical force.
100
50
PREHEAT
0
10
20
30
40
50
60
TIME (MINUTES)
80
70
90
100
Ammo Pack Drawing
6.35 ± 1.30
(0.25 ± 0.0512)
12.70 ± 1.00
(0.50 ± 0.0394)
CATHODE
20.50 ± 1.00
(0.807 ± 0.039)
9.125 ± 0.625
(0.3593 ± 0.0246)
18.00 ± 0.50
(0.7087 ± 0.0197)
A
12.70 ± 0.30
(0.50 ± 0.0118)
0.70 ± 0.20
(0.0276 ± 0.0079)
A
VIEW A–A
ALL DIMENSIONS IN MILLIMETERS (INCHES).
NOTE: THE AMMO-PACKS DRAWING IS APPLICABLE FOR PACKAGING OPTION -DD & -ZZ AND REGARDLESS OF STANDOFF OR NON-STANDOFF.
11
∅ 4.00 ± 0.20 TYP.
(0.1575 ± 0.008)
Packaging Box for Ammo Packs
LABEL ON
THIS SIDE
OF BOX.
FROM LEFT SIDE OF BOX,
ADHESIVE TAPE MUST BE
FACING UPWARD.
A
GO
AVA OGIES
OL
HN
C
E
T
+
DE
ANO
E
HOD –
CAT
ANODE LEAD LEAVES
THE BOX FIRST.
C
MO
THE
R LA
B EL
NOTE: THE DIMENSION FOR AMMO PACK IS APPLICABLE FOR THE DEVICE WITH STANDOFF AND WITHOUT STANDOFF.
Packaging Label:
(i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box)
(1P) Item: Part Number
STANDARD LABEL LS0002
RoHS Compliant
e3
max temp 250C
(1T) Lot: Lot Number
(Q) QTY: Quantity
LPN:
CAT: Intensity Bin
(9D)MFG Date: Manufacturing Date
BIN: Refer to below information
(P) Customer Item:
(V) Vendor ID:
(9D) Date Code: Date Code
DeptID:
Made In: Country of Origin
12
Lamps Baby Label
(1P) PART #: Part Number
RoHS Compliant
e3
max temp 250C
DeptID:
Made In: Country of Origin
(ii) Avago Baby Label (Only available on bulk packaging)
Lamps Baby Label
(1P) PART #: Part Number
RoHS Compliant
e3
max temp 250C
(1T) LOT #: Lot Number
(9D)MFG DATE: Manufacturing Date
QUANTITY: Packing Quantity
C/O: Country of Origin
Customer P/N:
CAT: Intensity Bin
Supplier Code:
BIN: Refer to below information
DATECODE: Date Code
Acronyms and Definition:
BIN:
Example:
(i) Color bin only or VF bin only
(Applicable for part number with color bins but
without VF bin OR part number with VF bins and
no color bin)
(i) Color bin only or VF bin only
BIN: 2 (represent color bin 2 only)
BIN: VB (represent VF bin “VB” only)
(ii) Color bin incorporate with VF Bin
OR
(ii) Color bin incorporated with VF Bin
BIN: 2VB
VB: VF bin “VB”
(Applicable for part number that have both color
bin and VF bin)
2: Color bin 2 only
DISCLAIMER: AVAGO’S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR AUTHORIZED FOR SALE
AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE OR DIRECT OPERATION OF A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO
MAKE CLAIMS AGAINST AVAGO OR ITS SUPPLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE.
For product information and a complete list of distributors, please go to our website:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2009 Avago Technologies. All rights reserved. Obsoletes AVO1-0701EN
AV02-342EN - January 15, 2009
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