AVAGO HLMP-HG62-TX0DD 5mm mini oval and standard oval alingap led Datasheet

HLMP-AG62/AG63, AH62/AH63, AL62/AL63
HLMP-HG62/HG63, HH62/HH63, HL62/HL63
5mm Mini Oval and Standard Oval AlInGaP LEDs
Data Sheet
Description
Features
These Precision Optical Performance AlInGaP Oval
LEDs are specifically designed for full color/video and
passenger information signs. The oval shaped radiation
pattern and high luminous intensity ensure that these
devices are excellent for wide field of view outdoor applications where a wide viewing angle and readability in
sunlight are essential. The package epoxy contains both
UV-A and UV-B inhibitors to reduce the effects of long
term exposure to direct sunlight.
• Viewing Angle: 30°x70° and 40°x100°
Applications
• Package options:
Stand-off and Non Stand-off Leads
• Full color signs
• Colors:
590nm Amber
615nm Red-Orange
626nm Red
• Well defined spatial radiation pattern
• High brightness material
• Superior resistance to moisture
• Tinted and diffused
Package Dimensions
For 5mm Mini Oval 30°x70°
Package Drawing A
0.8 max.
0.032
8.70 ± 0.20
0.342 ± 0.008
3.80 ± 0.200
0.150 ± 0.008
0.50 ± 0.10 sq. typ.
0.020 ± 0.004
0.70 max.
0.028
5.20 ± 0.200
0.205 ± 0.008
2.54 ± 0.3
0.100 ± 0.012
cathode lead
1.00 min.
0.038
24.00 min.
0.945
Package Drawing B
11.70 ± 0.50
0.4606 ± 0.020
1.50 ± 0.15
0.0591 ± 0.006
0.70 max.
0.028
0.50 ± 0.10 sq. typ.
0.020 ± 0.004
3.80 ± 0.200
0.150 ± 0.008
5.20 ± 0.20
0.205 ± 0.008
2.54 ± 0.3
0.100 ± 0.012
8.70 ± 0.20
0.342 ± 0.008
0.8
max.
0.032
cathode lead
24.00
min.
0.945
1.00 min.
0.038
For 5mm Standard Oval 40°x100°
Package Drawing C
1.02
max.
0.040
3.80
0.150
0.50±0.10
sq. typ.
.020±.004
0.70 max.
.028
5.20
0.205
cathode lead
7.00
0.276
25.00
min.
0.984
10.80±0.50
0.425±0.020
1.50±0.15
0.059±0.006
1.00 min.
.039
2.54
0.10
Package Drawing D
3.80
0.150
0.50±0.10 sq. typ.
0.020±0.004
5.20
0.205
7.00
0.276
Notes:
All dimensions in millimeters (inches).
2
1.02 max.
0.040
cathode lead
24.00
min.
0.945
1.00 min.
0.039
2.54±0.30
0.10±0.012
Device Selection Guide
5mm Mini Oval 30°x70°
Part Number
Color and Dominant
Wavelength λd (nm)
Typ.
Luminous Intensity
Iv (mcd) at 20 mA
Min.
Luminous Intensity
Iv (mcd) at 20 mA
Max.
Stand-Off
Package
Drawing
HLMP-AL62-UX0DD
Amber 590
960
1990
No
A
HLMP-AL62-X10DD
Amber 590
1660
3500
No
A
HLMP-AH62-UX0DD
Red-Orange 615
960
1990
No
A
HLMP-AH62-X10DD
Red-Orange 615
1660
3500
No
A
HLMP-AG62-UX0DD
Red 626
960
1990
No
A
HLMP-AG62-X10DD
Red 626
1660
3500
No
A
HLMP-AL63-UX0DD
Amber 590
960
1990
Yes
B
HLMP-AL63-X10DD
Amber 590
1660
3500
Yes
B
HLMP-AH63-UX0DD
Red-Orange 615
960
1990
Yes
B
HLMP-AH63-X10DD
Red-Orange 615
1660
3500
Yes
B
HLMP-AG63-UX0DD
Red 626
960
1990
Yes
B
HLMP-AG63-X10DD
Red 626
1660
3500
Yes
B
Part Number
Color and Dominant
Wavelength λd (nm)
Typ
Luminous Intensity
Iv (mcd) at 20 mA
Min.
Luminous Intensity
Iv (mcd) at 20 mA
Max.
Stand-Off
Package
Drawing
HLMP-HL62-TX0DD
Amber 590
800
1990
No
C
HLMP-HH62-TX0DD
Red-Orange 615
800
1990
No
C
HLMP-HG62-TX0DD
Red 626
800
1990
No
C
HLMP-HL63-TX0DD
Amber 590
800
1990
Yes
D
HLMP-HH63-TX0DD
Red-Orange 615
800
1990
Yes
D
HLMP-HG63-TX0DD
Red 626
800
1990
Yes
D
5mm Standard Oval 40°x100°
Notes:
1. The luminous intensity is measured on the mechanical axis of the lamp package.
2. Tolerance for each intensity limit is ± 15%.
3. Please refer to AN 5352 for detail information on features of stand-off and non stand-off LEDs.
3
Part Numbering System
HLMP- x x 62/63 - x x x x x
Packaging Option
DD: Ammopacks
Color Bin Selection
0: Open distribution
Maximum Intensity Bin
Refer to Device Selection Guide
Minimum Intensity Bin
Refer to Device Selection Guide.
Color
G: Red 626nm
H: Red Orange 615nm
L: Amber 590nm
Package
A: 5mm Mini Oval 30° x 70°
H: 5mm Standard Oval 40°x100°
Note: Please refer to AB 5337 for complete information on part numbering system.
Absolute Maximum Ratings
TA = 25°C
Parameter
Value
Unit
DC Forward Current [1]
50
mA
Peak Forward Current
100 [2]
mA
Power Dissipation
120
mW
Reverse Voltage
5 (IR = 100 μA)
V
LED Junction Temperature
130
°C
Operating Temperature Range
-40 to +100
°C
Storage Temperature Range
-40 to +100
°C
Notes:
1. Derate linearly as shown in Figure 4.
2. Duty Factor 30%, frequency 1kHz.
4
Electrical / Optical Characteristics
TA = 25°C
Parameter
Forward Voltage
Amber
Red
Red-Orange
Reverse Voltage
Dominant Wavelength [1]
Amber
Red
Red-Orange
Peak Wavelength
Amber
Red
Red-Orange
Thermal Resistance
Luminous Efficacy [2]
Amber
Red
Red-Orange
Symbol
Min.
Typ.
Max.
Units
Test Conditions
VF
1.8
2.2
2.1
2.0
2.4
V
IF = 20 mA
VR
5
V
IR = 100 μA
λd
584.5
620
612
nm
IF = 20 mA
594.5
630
621.7
λPEAK
590
626
615
nm
Peak of Wavelength of Spectral
Distribution at IF = 20 mA
RθJ-PIN
240
°C/W
LED Junction-to-Anode Lead
ηV
480
150
260
lm/W
Emitted Luminous Power/Emitted
Radiant Power
Notes:
1. The dominant wavelength is derived from the chromaticity Diagram and represents the color of the lamp. Tolerance for each color of dominant
wavelength is ± 0.5nm.
2. The radiant intensity, Ie in watts per steradian, may be found from the equation Ie = IV/ηV where IV is the luminous intensity in candelas and ηV is
the luminous efficacy in lumens/watt.
Figure 1. Relative intensity vs. peak wavelength
5
RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20 mA)
60
RED
50
FORWARD CURRENT - mA
RED-ORANGE
40
AMBER
30
20
10
0
0
0.5
1
1.5
2
FORWARD VOLTAGE - V
2.5
1
0.5
0
10
20
30
40
50
DC FORWARD CURRENT - mA
Figure 3. Relative luminous intensity vs. forward current
1
50
0.9
45
0.8
40
NORMALIZED INTENSITY
IF - FORWARD CURRENT - mA
1.5
0
55
35
30
25
20
15
0.7
0.6
0.5
0.4
0.3
10
0.2
5
0.1
0
0
20
40
60
80
T A - AMBIENT TEMPERATURE - ºC
100
-60
-30
0
30
ANGULAR DISPLACEMENT - DEGREES
-60
-30
0
30
ANGULAR DISPLACEMENT - DEGREES
60
90
Figure 5. Representative Radiation pattern for 30°x70° Lamp -Major Axis
NORMALIZED INTENSITY
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
-90
0
-90
120
Figure 4. Maximum forward current vs. ambient temperature
NORMALIZED INTENSITY
2
3
Figure 2. Forward current vs. forward voltage
60
Figure 6. Representative Radiation pattern 30°x70° Lamp -Minor Axis
6
2.5
90
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
-90
-60
-30
0
30
ANGULAR DISPLACEMENT - DEGREES
60
Figure 7. Representative Radiation pattern for 40°x100° Lamp -Major Axis
90
10
RELATIVE LOP (NORMALIZE AT 25 °C )
NORMALIZED INTENSITY
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
-90
AMBER
RED-ORANGE
1
0.1
-60
-30
0
30
60
90
-50
-25
0
ANGULAR DISPLACEMENT - DEGREES
25
50
75
100
JUNCTION TEMPERATURE - °C
Figure 8. Representative Radiation pattern 40°x100° Lamp –Minor Axis
Figure 9. Relative Light Output vs Junction temperature
Intensity Bin Limit Table (1.2: 1 Iv Bin Ratio)
VF Bin Table (V at 20mA)
Intensity (mcd) at 20 mA
125
Bin ID
Min
Max
1.8
2.0
Bin
Min
Max
VD
U
960
1150
VA
2.0
2.2
V
1150
1380
VB
2.2
2.4
W
1380
1660
X
1660
1990
Y
1990
2400
Z
2400
2900
Bin
Min
Max
1
2900
3500
1
584.5
587.0
2
587.0
589.5
4
589.5
592.0
6
592.0
594.5
Tolerance for each bin limit is ± 15%
Tolerance for each bin limit is ±0.05V
Amber Color Bin Limits
Tolerance for each bin limit is ± 0.5nm.
7
RED
150
Precautions:
Lead Forming:
• The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering on PC board.
• For better control, it is recommended to use proper
tool to precisely form and cut the leads to applicable
length rather than doing it manually.
• If manual lead cutting is necessary, cut the leads after
the soldering process. The solder connection forms
a mechanical ground which prevents mechanical
stress due to lead cutting from traveling into LED
package. This is highly recommended for hand solder
operation, as the excess lead length also acts as small
heat sink.
Note:
1. PCB with different size and design (component density) will have
different heat mass (heat capacity). This might cause a change in
temperature experienced by the board if same wave soldering
setting is used. So, it is recommended to re-calibrate the soldering
profile again before loading a new type of PCB.
2. Avago Technologies’ high brightness LED are using high efficiency
LED die with single wire bond as shown below. Customer is advised
to take extra precaution during wave soldering to ensure that the
maximum wave temperature does not exceed 250°C and the solder
contact time does not exceeding 3sec. Over-stressing the LED
during soldering process might cause premature failure to the LED
due to delamination.
Avago Technologies LED configuration
Soldering and Handling:
• Care must be taken during PCB assembly and
soldering process to prevent damage to the LED
component.
• LED component may be effectively hand soldered
to PCB. However, it is only recommended under
unavoidable circumstances such as rework. The
closest manual soldering distance of the soldering
heat source (soldering iron’s tip) to the body is
1.59mm. Soldering the LED using soldering iron tip
1.59mm
closer than 1.59mm might damage the LED.
• ESD precaution must be properly applied on the
soldering station and personnel to prevent ESD
damage to the LED component that is ESD sensitive.
Do refer to Avago application note AN 1142 for details.
The soldering iron used should have grounded tip to
ensure electrostatic charge is properly grounded.
• Recommended soldering condition:
Wave
Soldering [1, 2]
Manual Solder
Dipping
Pre-heat temperature
105 °C Max.
-
Preheat time
60 sec Max
-
Peak temperature
250 °C Max.
260 °C Max.
Dwell time
3 sec Max.
5 sec Max
Anode
Note: Electrical connection between bottom surface of LED die and
the lead frame is achieved through conductive paste.
• Any alignment fixture that is being applied during
wave soldering should be loosely fitted and should
not apply weight or force on LED. Non metal material
is recommended as it will absorb less heat during
wave soldering process.
Note: In order to further assist customer in designing jig accurately
that fit Avago Technologies’ product, 3D model of the product is
available upon request.
• At elevated temperature, LED is more susceptible to
mechanical stress. Therefore, PCB must allowed to
cool down to room temperature prior to handling,
which includes removal of alignment fixture or pallet.
• If PCB board contains both through hole (TH) LED and
other surface mount components, it is recommended
that surface mount components be soldered on
the top side of the PCB. If surface mount need to be
on the bottom side, these components should be
soldered using reflow soldering prior to insertion the
TH LED.
• Recommended PC board plated through holes (PTH)
size for LED component leads.
Note:
1. Above conditions refers to measurement with thermocouple
mounted at the bottom of PCB.
2. It is recommended to use only bottom preheaters in order to reduce
thermal stress experienced by LED.
LED component
lead size
Diagonal
Plated through
hole diameter
0.45 x 0.45 mm
(0.018x 0.018 inch)
0.636 mm
(0.025 inch)
0.98 to 1.08 mm
(0.039 to 0.043 inch)
• Wave soldering parameters must be set and
maintained according to the recommended
temperature and dwell time. Customer is advised
to perform daily check on the soldering profile to
ensure that it is always conforming to recommended
soldering conditions.
0.50 x 0.50 mm
(0.020x 0.020 inch)
0.707 mm
(0.028 inch)
1.05 to 1.15 mm
(0.041 to 0.045 inch)
8
• Over-sizing the PTH can lead to twisted LED after
clinching. On the other hand under sizing the PTH can
cause difficulty inserting the TH LED
Example of Wave Soldering Temperature Profile for TH LED
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
LAMINAR WAVE
HOT AIR KNIFE
TURBULENT WAVE
250
TEMPERATURE (°C)
Flux: Rosin flux
200
Solder bath temperature:
245°C± 5°C (maximum peak
temperature = 250°C)
150
Dwell time: 1.5 sec - 3.0 sec
(maximum = 3sec)
Note: Allow for board to be
sufficiently cooled to room
temperature before exerting
mechanical force.
100
50
PREHEAT
0
10
20
30
40
60
50
TIME (MINUTES)
70
80
90
100
Ammo Packs Drawing
6.35±1.30
0.25±0.0512
12.70±1.00
0.50±0.0394
CATHODE
20.50±1.00
0.8071±0.0394
9.125±0.625
0.3593±0.0246
18.00±0.50
0.7087±0.0197
12.70±0.30
0.50±0.0118
9
A
0.70±0.20
0.0276±0.0079
A
VIEW A - A
Ø
4.00±0.20
TYP
0.1575±0.008
Packaging Box for Ammo Packs
FROM LEFT SIDE OF BOX
ADHESIVE TAPE MUST BE
FACING UPWARDS.
LABEL ON THIS
SIDE OF BOX
ANODE LEAD LEAVES
THE BOX FIRST.
Note: For InGaN device, the ammo pack packaging box contain ESD logo
Packaging Label
(i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box)
(1P) Item: Part Number
STANDARD LABEL LS0002
RoHS Compliant
e3
max temp 250C
(1T) Lot: Lot Number
(Q) QTY: Quantity
LPN:
CAT: Intensity Bin
(9D)MFG Date: Manufacturing Date
BIN: Refer to below information
(P) Customer Item:
10
(V) Vendor ID:
(9D) Date Code: Date Code
DeptID:
Made In: Country of Origin
(ii) Avago Baby Label (Only available on bulk packaging)
Lamps Baby Label
(1P) PART #: Part Number
RoHS Compliant
e3
max temp 250C
(1T) LOT #: Lot Number
(9D)MFG DATE: Manufacturing Date
QUANTITY: Packing Quantity
C/O: Country of Origin
Customer P/N:
CAT: Intensity Bin
Supplier Code:
BIN: Refer to below information
DATECODE: Date Code
Acronyms and Definition:
BIN:
Example:
(i) Color bin only or VF bin only
(i) Color bin only or VF bin only
(Applicable for part number with color bins but
without VF bin OR part number with VF bins and no
color bin)
OR
BIN: 2 (represent color bin 2 only)
BIN: VB (represent VF bin “VB” only)
(ii) Color bin incorporate with VF Bin
BIN: 2VB
(ii) Color bin incorporated with VF Bin
VB: VF bin “VB”
(Applicable for part number that have both color bin
and VF bin)
2: Color bin 2 only
DISCLAIMER: AVAGO’S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR
AUTHORIZED FOR SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE OR DIRECT OPERATION OF A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS.
CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE CLAIMS AGAINST AVAGO OR ITS SUPPLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE.
For product information and a complete list of distributors, please go to our web site:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2011 Avago Technologies. All rights reserved.
AV02-1314EN - April 19, 2011
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