HI-SINCERITY MICROELECTRONICS CORP. Spec. No. :HE9526-A Issued Date : 1998.07.01 Revised Date : 2000.10.01 Page No. : 1/2 HM3019 NPN EPITAXIAL PLANAR TRANSISTOR Description This device is designed for use as general purpose amplifier and switching requiring collector currents 1A Absolute Maximum Ratings • Maximum Temperatures Storage Temperature ............................................................................................ -55 ~ +150 °C Junction Temperature ................................................................................... +150 °C Maximum • Maximum Power Dissipation Total Power Dissipation (Ta=25°C) ................................................................................... 1.2 W • Maximum Voltages and Currents (Ta=25°C) VCBO Collector to Base Voltage ...................................................................................... 140 V VCEO Collector to Emitter Voltage ..................................................................................... 80 V VEBO Emitter to Base Voltage ............................................................................................. 7 V IC Collector Current .............................................................................................................. 1 A Characteristics (Ta=25°C) Symbol BVCBO BVCEO BVEBO ICBO IEBO *VCE(sat) *VBE(sat) *hFE1 *hFE2 *hFE3 *hFE4 *hFE5 fT Cob Min. 140 80 7 50 90 100 50 15 100 - Typ. - Max. 50 50 0.2 1.1 300 12 Unit V V V nA nA V V MHz pF Test Conditions IC=100uA IC=30mA IE=100uA VCB=90V VEB=5V IC=150mA, IB=15mA IC=150mA, IB=15mA IC=0.1mA, VCE=10V IC=10mA, VCE=10V IC=150mA, VCE=10V IC=500mA, VCE=10V IC=1000mA, VCE=10V IC=50mA, VCE=10V, f=100MHz VCE=10V, f=1MHz, IE=0 *Pulse Test : Pulse Width ≤380us, Duty Cycle≤2% HSMC Product Specification HI-SINCERITY Spec. No. :HE9526-A Issued Date : 1998.07.01 Revised Date : 2000.10.01 Page No. : 2/2 MICROELECTRONICS CORP. SOT-89 Dimension Marking : C H HSMC Logo Date Code Package Code Part Number D B 1 2 3 Style : Pin 1.Base 2.Collector 3.Emitter I E F G A 3-Lead SOT-89 Plastic Surface Mounted Package HSMC Package Code : M *:Typical Inches Min. Max. 0.1732 0.1811 0.1594 0.1673 0.0591 0.0663 0.0945 0.1024 0.0141 0.0201 DIM A B C D E Millimeters Min. Max. 4.40 4.60 4.05 4.25 1.50 1.70 2.40 2.60 0.36 0.51 DIM F G H I Inches Min. Max. 0.0583 0.0598 0.1165 0.1197 0.0551 0.0630 0.0138 0.0161 Millimeters Min. Max. 1.48 1.52 2.96 3.04 1.40 1.60 0.35 0.41 Notes : 1.Dimension and tolerance based on our Spec. dated May. 05,1996. 2.Controlling dimension : millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material : • Lead : 42 Alloy ; solder plating • Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. • HSMC reserves the right to make changes to its products without notice. • HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory : • Head Office (Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454 • Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel : 886-3-5983621~5 Fax : 886-3-5982931 • Factory 2 : No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel : 886-3-5977061 Fax : 886-3-5979220 HSMC Product Specification