HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE6822 Issued Date : 1993.06.30 Revised Date : 2002.10.25 Page No. : 1/4 HMBT2222A NPN EPITAXIAL PLANAR TRANSISTOR Description The HMBT2222A is designed for general purpose amplifier and high-speed switching, medium-power switching applications. Features SOT-23 • High frequency current gain • High Speed Switching Absolute Maximum Ratings • Maximum Temperatures Storage Temperature ........................................................................................... -55 ~ +150 °C Junction Temperature.................................................................................................... +150 °C • Maximum Power Dissipation Total Power Dissipation (Ta=25°C) ............................................................................... 225 mW • Maximum Voltages and Currents (Ta=25°C) VCBO Collector to Base Voltage ......................................................................................... 75 V VCEO Collector to Emitter Voltage...................................................................................... 40 V VEBO Emitter to Base Voltage.............................................................................................. 6 V IC Collector Current........................................................................................................ 600 mA Characteristics (Ta=25°C) Symbol BVCBO BVCEO BVEBO ICBO ICEX IEBO *VCE(sat)1 *VCE(sat)2 *VBE(sat)1 *VBE(sat)2 *hFE1 *hFE2 *hFE3 *hFE4 *hFE5 fT Min. 75 40 6 35 50 75 100 40 300 Typ. - Max. 10 10 10 500 1.0 1.2 2.0 300 - Unit V V V nA nA nA mV V V V MHz Test Conditions IC=10uA IC=10mA IC=10uA VCB=60V VCE=60V, VEB(OFF)=3V VEB=3V IC=380mA, IB=10mA IC=500mA, IB=50mA IC=150mA, IB=15mA IC=500mA, IB=50mA VCE=10V, IC=100uA VCE=10V, IC=1mA VCE=10V, IC=10mA VCE=10V, IC=150mA VCE=10V, IC=500mA VCB=20V, IC=20mA, f=100MHz *Pulse Test: Pulse Width ≤380us, Duty Cycle≤2% HMBT2222A HSMC Product Specification HI-SINCERITY Spec. No. : HE6822 Issued Date : 1993.06.30 Revised Date : 2002.10.25 Page No. : 2/4 MICROELECTRONICS CORP. Characteristics Curve Current Gain & Collector Current Current Gain & Collector Current 1000 1000 o 75 C o o o 125 C o 25 C 125 C o hFE hFE 25 C 100 100 hFE @ VCE=10V hFE @ VCE=1V 10 10 0.1 1 10 100 0.1 1000 Collector Current-IC (mA) 1 10 100 1000 Collector Current-IC (mA) Saturation Voltage & Collector Current Saturation Voltage & Collector Current 10000 1000 VCE(sat) @ IC=10IB VCE(sat) @ IC=38IB o Saturation Voltage (mV) Saturation Voltage (mV) 75 C 75 C o 125 C 100 o 25 C 1000 o 75 C o 25 C o 125 C 100 10 10 0.1 1 10 100 1 1000 Collector Current-IC (mA) 10 100 1000 Collector Current-IC (mA) Saturation Voltage & Collector Current Capacitance & Reverse-Biased Voltage 100 10000 Capacitance (pF) Saturation Voltage (mV) VBE(s at) @ IC=10IB o 75 C 1000 o 25 C 10 Cob o 125 C 100 1 0.1 1 10 Collector Current-IC (mA) HMBT2222A 100 1000 0.1 1 10 100 Reverse Biased Voltage (V) HSMC Product Specification HI-SINCERITY Spec. No. : HE6822 Issued Date : 1993.06.30 Revised Date : 2002.10.25 Page No. : 3/4 MICROELECTRONICS CORP. PD-Ta Cutoff Frequency & IC 250 Power Dissipation-PD (mW) Cutoff Frequency (MHz)... 1000 VCE=20V 100 200 150 100 50 0 10 1 10 100 Collector Current (mA) HMBT2222A 1000 0 50 100 150 200 o Ambient Temperature-Ta ( C) HSMC Product Specification HI-SINCERITY Spec. No. : HE6822 Issued Date : 1993.06.30 Revised Date : 2002.10.25 Page No. : 4/4 MICROELECTRONICS CORP. SOT-23 Dimension Marking: A L 1 P 3 B S 1 V Rank Code Control Code 2 G 3-Lead SOT-23 Plastic Surface Mounted Package HSMC Package Code: N C D H K J Style: Pin 1.Base 2.Emitter 3.Collector *: Typical Inches Min. Max. 0.1102 0.1204 0.0472 0.0630 0.0335 0.0512 0.0118 0.0197 0.0669 0.0910 0.0005 0.0040 DIM A B C D G H Millimeters Min. Max. 2.80 3.04 1.20 1.60 0.89 1.30 0.30 0.50 1.70 2.30 0.013 0.10 DIM J K L S V Inches Min. Max. 0.0034 0.0070 0.0128 0.0266 0.0335 0.0453 0.0830 0.1083 0.0098 0.0256 Millimeters Min. Max. 0.085 0.177 0.32 0.67 0.85 1.15 2.10 2.75 0.25 0.65 Notes: 1.Dimension and tolerance based on our Spec. dated Sep. 07,1997. 2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material: • Lead: 42 Alloy; solder plating • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. • HSMC reserves the right to make changes to its products without notice. • HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory: • Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 • Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931 HMBT2222A HSMC Product Specification