HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE6836 Issued Date : 1994.07.20 Revised Date : 2002.10.25 Page No. : 1/3 HMBT6517 NPN EPITAXIAL PLANAR TRANSISTOR Description The HMBT6517 is designed for general purpose applications requiring high breakdown voltages. Features SOT-23 • High Collector-Emitter Breakdown Voltage • Low Collector-Emitter Saturation Voltage • The HMBT6517 is complementary to HMBT6520 Absolute Maximum Ratings • Maximum Temperatures Storage Temperature........................................................................................................ -55 ~ +150 °C Junction Temperature................................................................................................ +150 °C Maximum • Maximum Power Dissipation Total Power Dissipation (Ta=25°C)............................................................................................ 225 mW • Maximum Voltages and Currents (Ta=25°C) VCBO Collector to Base Voltage ................................................................................................... 350 V VCEO Collector to Emitter Voltage ................................................................................................ 350 V VEBO Emitter to Base Voltage ......................................................................................................... 5 V IC Collector Current ................................................................................................................... 500 mA IB Base Current ......................................................................................................................... 250 mA Characteristics (Ta=25°C) Symbol BVCBO BVCEO BVEBO ICBO IEBO *VCE(sat)1 *VCE(sat)2 *VCE(sat)3 *VCE(sat)4 VBE(on) *VBE(sat)1 *VBE(sat)2 *VBE(sat)3 *hFE1 *hFE2 *hFE3 *hFE4 *hFE5 fT Cob Min. 350 350 5 20 30 30 20 15 40 - Typ. - Max. 50 50 300 350 500 1 2 750 850 900 200 200 200 6 Unit V V V nA nA mV mV mV V V mV mV mV MHz pF Test Conditions IC=100uA IC=1mA IE=10uA VCB=250V VEB=5V IC=10mA, IB=1mA IC=20mA, IB=2mA IC=30mA, IB=3mA IC=50mA, IB=5mA VCE=10V, IC=100mA IB=1mA, IC=10mA IB=2mA, IC=20mA IB=3mA, IC=30mA VCE=10V, IC=1mA VCE=10V, IC=10mA VCE=10V, IC=30mA VCE=10V, IC=50mA VCE=10V, IC=100mA IC=10mA, VCE=20V, f=20MHz VCB=20V, f=1MHz *Pulse Test: Pulse Width ≤380us, Duty Cycle≤2% HMBT6517 HSMC Product Specification HI-SINCERITY Spec. No. : HE6836 Issued Date : 1994.07.20 Revised Date : 2002.10.25 Page No. : 2/3 MICROELECTRONICS CORP. Characteristics Curve Current Gain & Collector Current Saturation Voltage & Collector Current 1000 Saturation Voltage (mV) 100000 hFE 100 hFE @ VCE=10V 10 10000 1000 VBE(sat) @ IC=10IB 100 VCE(s at) @ IC=10IB 10 1 0.1 1 10 100 0.1 1000 1 10 Collector Current (mA) On Voltage & Collector Current 1000 Capacitance & Reverse-Biased Voltage 10000 10 Capacitance (pF) On Voltage (mV) 100 Collector Current (mA) 1000 VBE(on) @ VCE=10V 100 Cob 1 1 10 100 1000 0.1 1 Collector Current (mA) 10 100 Reverse-Biased Voltage (V) Cutoff Frequency & Collector Current Safe Operating Area 10000 100 PT=100ms VCE=20V Cutoff Frequency (MHz) Collector Current-IC (mA) PT=1s 1000 PT=1ms 100 10 1 10 1 10 Collector Current (mA) HMBT6517 100 1 10 100 1000 Forward Voltage-VCE (V) HSMC Product Specification HI-SINCERITY Spec. No. : HE6836 Issued Date : 1994.07.20 Revised Date : 2002.10.25 Page No. : 3/3 MICROELECTRONICS CORP. SOT-23 Dimension Marking: A L 1 Z 3 B S 1 V Rank Code Control Code 2 G 3-Lead SOT-23 Plastic Surface Mounted Package HSMC Package Code: N C D H K J Style: Pin 1.Base 2.Emitter 3.Collector *: Typical Inches Min. Max. 0.1102 0.1204 0.0472 0.0630 0.0335 0.0512 0.0118 0.0197 0.0669 0.0910 0.0005 0.0040 DIM A B C D G H Millimeters Min. Max. 2.80 3.04 1.20 1.60 0.89 1.30 0.30 0.50 1.70 2.30 0.013 0.10 DIM J K L S V Inches Min. Max. 0.0034 0.0070 0.0128 0.0266 0.0335 0.0453 0.0830 0.1083 0.0098 0.0256 Millimeters Min. Max. 0.085 0.177 0.32 0.67 0.85 1.15 2.10 2.75 0.25 0.65 Notes: 1.Dimension and tolerance based on our Spec. dated Sep. 07,1997. 2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material: • Lead: 42 Alloy; solder plating • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. • HSMC reserves the right to make changes to its products without notice. • HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory: • Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 • Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931 HMBT6517 HSMC Product Specification