HI-SINCERITY Spec. No. : HE6306-B Issued Date : 1992.09.09 Revised Date : 2000.10.01 Page No. : 1/4 MICROELECTRONICS CORP. HMPSA18 NPN SILICON TRANSISTOR Description The HMPSA18 is designed for low noise stage of audio amplifiers. Features • Low Noise : 1.5 dB Max. Absolute Maximum Ratings • Maximum Temperatures Storage Temperature ............................................................................................ -55 ~ +150 °C Junction Temperature ................................................................................... +150 °C Maximum • Maximum Power Dissipation Total Power Dissipation (Ta=25°C) ............................................................................... 625 mW • Maximum Voltages and Currents (Ta=25°C) VCBO Collector to Base Voltage ........................................................................................ 45 V VCES Collector to Emitter Voltage...................................................................................... 45 V VEBO Emitter to Base Voltage .......................................................................................... 6.5 V IC Collector Current ...................................................................................................... 200 mA Characteristics (Ta=25°C) Symbol BVCBO BVCEO BVEBO ICBO *VCE(sat)1 *VCE(sat)2 VBE(on) *hFE1 *hFE2 *hFE3 fT Cob Min. 45 45 6.5 300 500 500 100 - Typ. 0.6 1100 1150 160 1.7 Max. 50 0.2 0.3 0.7 1500 3 Unit V V V nA V V V MHz pF Test Conditions IC=100uA, IE=0 IC=10mA, IB=0 IE=10uA, IC=0 VCB=30V, IE=0 IC=10mA, IB=0.5mA IC=50mA, IB=5mA VCE=5V, IC=1mA VCE=5V, IC=100uA VCE=5V, IC=1mA VCE=5V, IC=10mA VCE=5V, IC=1mA, f=100MHz VCB=5V, f=1MHz, IE=0 *Pulse Test : Pulse Width ≤380us, Duty Cycle≤2% Classification Of hFE1 Rank hFE A B >300 >500 HSMC Product Specification HI-SINCERITY Spec. No. : HE6306-B Issued Date : 1992.09.09 Revised Date : 2000.10.01 Page No. : 2/4 MICROELECTRONICS CORP. Characteristics Curve Current Gain & Collector Current Saturation Voltage & Collector Current 1000 1 Saturation Voltage (V) VCE=5V hFE 100 10 0.1 VCE(sat) @ IC=20IB 0.01 1 0.01 0.1 1 10 100 0.01 1000 0.1 1 10 100 1000 Collector Current (mA) C ollector Current (mA) On Voltage & Collector Current Cutoff Frequency & Collector Current 1000 10 Cutoff Frequency (MHz) On Voltage (mV) VCE=5V 1 VBE(ON) @ VCE=5V 100 10 0.1 1 0.01 0.1 1 10 100 1000 1 Collector Current (mA) 10 100 Collector Current (mA) Capacitance & Reverse-Biased Voltage Safe Operating Area 10 10000 PT=1m s PT=100ms Collector Current-IC (mA) Capacitance (pF) PT=1s Cob 1 1000 100 10 1 0.1 1 10 Reverse-Biased Voltage (V) 100 1 10 100 Forward Voltage-V CE (V) HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE6306-B Issued Date : 1992.09.09 Revised Date : 2000.10.01 Page No. : 3/4 PD-Ta 700 Power Dissipation-PD(mW) 600 500 400 300 200 100 0 0 20 40 60 80 100 120 140 160 o Ambient Temperature-Ta( C) HSMC Product Specification HI-SINCERITY Spec. No. : HE6306-B Issued Date : 1992.09.09 Revised Date : 2000.10.01 Page No. : 4/4 MICROELECTRONICS CORP. TO-92 Dimension α2 A Marking : HSMC Logo B 1 2 Product Series Part Number 3 Date Code Rank α3 C Laser Mark HSMC Logo Product Series D Part Number H I G Ink Mark α1 Style : Pin 1.Emitter 2.Base 3.Collector E F 3-Lead TO-92 Plastic Package HSMC Package Code : A *:Typical Inches Min. Max. 0.1704 0.1902 0.1704 0.1902 0.5000 0.0142 0.0220 *0.0500 0.1323 0.1480 DIM A B C D E F Millimeters Min. Max. 4.33 4.83 4.33 4.83 12.70 0.36 0.56 *1.27 3.36 3.76 DIM G H I α1 α2 α3 Inches Min. Max. 0.0142 0.0220 *0.1000 *0.0500 *5° *2° *2° Millimeters Min. Max. 0.36 0.56 *2.54 *1.27 *5° *2° *2° Notes : 1.Dimension and tolerance based on our Spec. dated Apr. 25,1996. 2.Controlling dimension : millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material : • Lead : 42 Alloy ; solder plating • Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. • HSMC reserves the right to make changes to its products without notice. • HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory : • Head Office (Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454 • Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel : 886-3-5983621~5 Fax : 886-3-5982931 • Factory 2 : No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel : 886-3-5977061 Fax : 886-3-5979220 HSMC Product Specification