Hitachi HN58C1001P-15 1m eeprom (128-kword x 8-bit) ready/busy and res function Datasheet

HN58C1001 Series
1M EEPROM (128-kword × 8-bit)
Ready/Busy and RES function
ADE-203-028G (Z)
Rev. 7.0
Oct. 31, 1997
Description
The Hitachi HN58C1001 is a electrically erasable and programmable ROM organized as 131072-word × 8bit. It has realized high speed, low power consumption and high reliability by employing advanced MNOS
memory technology and CMOS process and circuitry technology. It also has a 128-byte page programming
function to make the write operations faster.
Features
• Single supply: 5.0 V ± 10%
• Access time: 150 ns (max)
• Power dissipation
 Active: 20 mW/MHz, (typ)
 Standby: 110 µW (max)
• On-chip latches: address, data, CE, OE, WE
• Automatic byte write: 10 ms (max)
• Automatic page write (128 bytes): 10 ms (max)
• Data polling and RDY/Busy
• Data protection circuit on power on/off
• Conforms to JEDEC byte-wide standard
• Reliable CMOS with MNOS cell technology
• 104 erase/write cycles (in page mode)
• 10 years data retention
• Software data protection
• Write protection by RES pin
HN58C1001 Series
Ordering Information
Type No.
Access time
Package
HN58C1001P-15
150 ns
600 mil 32-pin plastic DIP (DP-32)
HN58C1001FP-15
150 ns
525 mil 32-pin plastic SOP (FP-32D)
HN58C1001T-15
150 ns
8 × 14 mm 32-pin plastic TSOP (TFP-32DA)
Pin Arrangement
HN58C1001P/FP Series
RDY/Busy
A16
A14
A12
A7
A6
A5
A4
A3
A2
A1
A0
I/O0
I/O1
I/O2
VSS
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
VCC
A15
RES
WE
A13
A8
A9
A11
OE
A10
CE
I/O7
I/O6
I/O5
I/O4
I/O3
(Top view)
Pin Description
Pin name
Function
A0 to A16
Address input
I/O0 to I/O7
Data input/output
OE
Output enable
CE
Chip enable
WE
Write enable
VCC
Power supply
VSS
Ground
RDY/Busy
Ready busy
RES
Reset
2
HN58C1001T Series
A3
A2
A1
A0
I/O0
I/O1
I/O2
VSS
I/O3
I/O4
I/O5
I/O6
I/O7
CE
A10
OE
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
(Top view)
A4
A5
A6
A7
A12
A14
A16
RDY/Busy
VCC
A15
RES
WE
A13
A8
A9
A11
HN58C1001 Series
Block Diagram
I/O0to
VCC
I/O7
RDY/Busy
High voltage generator
VSS
RES
I/O buffer
and
input latch
OE
CE
Control logic and timing
WE
RES
A0
to
Y decoder
Y gating
X decoder
Memory array
A6
Address
buffer and
latch
A7
to
A16
Data latch
Operation Table
Operation
CE
OE
WE
RES
1
RDY/Busy
I/O
High-Z
Dout
VIL
VIL
VIH
VH *
Standby
VIH
×*
×
×
High-Z
High-Z
Write
VIL
VIH
VIL
VH
High-Z to V OL
Din
Deselect
VIL
VIH
VIH
VH
High-Z
High-Z
Write Inhibit
×
×
VIH
×
—
—
×
VIL
×
×
—
—
Data Polling
VIL
VIL
VIH
VH
VOL
Dout (I/O7)
Program reset
×
×
×
VIL
High-Z
High-Z
Read
2
Notes: 1. Refer to the recommended DC operating conditions.
2. × : Don’t care
3
HN58C1001 Series
Absolute Maximum Ratings
Parameter
Symbol
Value
Unit
Supply voltage relative to VSS
VCC
–0.6 to +7.0
V
Vin
1
–0.5* to +7.0
V
Topr
0 to +70
°C
Tstg
–55 to +125
°C
Input voltage relative to V SS
Operating temperature range*
2
Storage temperature range
Notes: 1. Vin min = –3.0 V for pulse width ≤ 50 ns
2. Including electrical characteristics and data retention
Recommended DC Operating Conditions
Parameter
Symbol
Min
Typ
Max
Unit
Supply voltage
VCC
4.5
5.0
5.5
V
VSS
0
0
0
V
Input voltage
Operating temperature
Note:
1
VIL
–0.3*
—
0.8
V
VIH
2.2
—
VCC + 0.3
V
VH
Vcc – 0.5
—
VCC + 1.0
V
Topr
0
—
70
°C
1. VIL (min): –1.0 V for pulse width ≤ 50 ns
DC Characteristics (Ta = 0 to +70 °C, VCC = 5.0V ± 10%)
Parameter
Symbol
Min
Typ
Max
1
Unit
Test conditions
µA
VCC = 5.5 V, Vin =5.5 V
Input leakage current
I LI
—
—
2*
Output leakage current
I LO
—
—
2
µA
VCC = 5.5 V, Vout = 5.5/0.4 V
Standby V CC current
I CC1
—
—
20
µA
CE = VCC
I CC2
—
—
1
mA
CE = VIH
I CC3
—
—
15
mA
Iout = 0 mA, Duty = 100%,
Cycle = 1 µs at VCC = 5.5 V
—
—
50
mA
Iout = 0 mA, Duty = 100%,
Cycle = 150 ns at VCC = 5.5 V
Operating VCC current
Output low voltage
VOL
—
—
0.4
V
I OL = 2.1 mA
Output high voltage
VOH
2.4
—
—
V
I OH = –400 µA
Notes: 1. I LI on RES: 100 µA (max)
4
HN58C1001 Series
Capacitance (Ta = 25°C, f = 1 MHz)
Parameter
1
Input capacitance*
1
Output capacitance*
Note:
Symbol
Min
Typ
Max
Unit
Test conditions
Cin
—
—
6
pF
Vin = 0 V
Cout
—
—
12
pF
Vout = 0 V
1. This parameter is periodically sampled and not 100% tested.
AC Characteristics (Ta = 0 to +70 °C, VCC = 5.0 V ± 10%)
Test Conditions
• Input pulse levels: 0.4 V to 2.4 V
0 V to VCC (RES pin)
• Input rise and fall time: 20 ns
• Output load: 1TTL Gate +100 pF
• Reference levels for measuring timing: 0.8 V, 2.0 V
Read Cycle
HN58C1001-15
Parameter
Symbol
Min
Max
Unit
Test conditions
Address to output delay
t ACC
—
150
ns
CE = OE = VIL, WE = VIH
CE to output delay
t CE
—
150
ns
OE = VIL, WE = VIH
OE to output delay
t OE
10
75
ns
CE = VIL, WE = VIH
t OH
0
—
ns
CE = OE = VIL, WE = VIH
t DF
0
50
ns
CE = VIL, WE = VIH
RES low to output float
t DFR
0
350
ns
CE = OE = VIL, WE = VIH
RES to output delay
t RR
0
450
ns
CE = OE = VIL, WE = VIH
Address to output hold
OE (CE) high to output float*
*1
1
5
HN58C1001 Series
Write Cycle
Parameter
Symbol
Min*2
Typ
Max
Unit
Address setup time
t AS
0
—
—
ns
Address hold time
t AH
150
—
—
ns
CE to write setup time (WE controlled)
t CS
0
—
—
ns
CE hold time (WE controlled)
t CH
0
—
—
ns
WE to write setup time (CE controlled)
t WS
0
—
—
ns
WE hold time (CE controlled)
t WH
0
—
—
ns
OE to write setup time
t OES
0
—
—
ns
OE hold time
t OEH
0
—
—
ns
Data setup time
t DS
100
—
—
ns
Data hold time
t DH
10
—
—
ns
WE pulse width (WE controlled)
t WP
250
—
—
ns
CE pulse width (CE controlled)
t CW
250
—
—
ns
Data latch time
t DL
300
—
—
ns
Byte load cycle
t BLC
0.55
—
30
µs
Byte load window
t BL
100
—
—
Write cycle time
t WC
—
Time to device busy
t DB
120
Write start time
Reset protect time
5
Reset high time*
4
Test conditions
µs
3
—
10*
ms
—
—
ns
—
—
ns
t DW
150*
t RP
100
—
—
µs
t RES
1
—
—
µs
Notes: 1. t DF and t DFR are defined as the time at which the outputs achieve the open circuit conditions and are
no longer driven.
2. Use this device in longer cycle than this value.
3. t WC must be longer than this value unless polling techniques or RDY/Busy are used. This device
automatically completes the internal write operation within this value.
4. Next read or write operation can be initiated after t DW if polling techniques or RDY/Busy are used.
5. This parameter is sampled and not 100% tested.
6. A7 to A16 are page addresses and must be same within the page write operation.
7. See AC read characteristics.
6
HN58C1001 Series
Timing Waveforms
Read Timing Waveform
Address
tACC
CE
tOH
tCE
OE
tDF
tOE
WE
High
Data Out
Data out valid
tRR
tDFR
RES
7
HN58C1001 Series
Byte Write Timing Waveform (1) (WE Controlled)
tWC
Address
tCS
tAH
tCH
CE
tAS
tBL
tWP
WE
tOES
tOEH
OE
tDS
tDH
Din
tDW
High-Z
RDY/Busy
tRP
tRES
RES
VCC
8
tDB
High-Z
HN58C1001 Series
Byte Write Timing Waveform (2) (CE Controlled)
Address
tWS
tAH
tBL
tWC
tCW
CE
tAS
tWH
WE
tOES
tOEH
OE
tDS
tDH
Din
tDW
RDY/Busy
tDB
High-Z
High-Z
tRP
tRES
RES
VCC
9
HN58C1001 Series
Page Write Timing Waveform (1) (WE Controlled)
*6
Address
A0 to A16
tAS
tAH
tBL
tWP
WE
tDL
tCS
tBLC
tWC
tCH
CE
tOEH
tOES
OE
tDH
tDS
Din
RDY/Busy
High-Z
tRP
RES
VCC
10
tRES
tDB
tDW
High-Z
HN58C1001 Series
Page Write Timing Waveform (2) (CE Controlled)
*6
Address
A0 to A16
tAS
CE
tAH
tBL
tCW
tDL
tWS
tBLC
tWC
tWH
WE
tOEH
tOES
OE
tDH
tDS
Din
RDY/Busy
High-Z
tDB
tDW
High-Z
tRP
RES
tRES
VCC
11
HN58C1001 Series
Data Polling Timing Waveform
Address
An
An
CE
WE
tOEH
tCE *7
tOES
OE
tDW
tOE*7
I/O7
12
Din X
Dout X
Dout X
tWC
HN58C1001 Series
Toggle bit
This device provide another function to determine the internal programming cycle. If the EEPROM is set to
read mode during the internal programming cycle, I/O6 will charge from “1” to “0” (toggling) for each read.
When the internal programming cycle is finished, toggling of I/O6 will stop and the device can be accessible
for next read or program.
Notes: 1.
2.
3.
4.
I/O6 beginning state is “1”.
I/O6 ending state will vary.
See AC read characteristics.
Any location can be used, but the address must be fixed.
Toggle bit Waveform
Next mode
*4
Address
tCE *3
CE
WE
*3
tOE
OE
tOES
tOEH
*1
I/O6
Din
Dout
Dout
tWC
*2
*2
Dout
Dout
tDW
13
HN58C1001 Series
Software Data Protection Timing Waveform (1) (in protection mode)
VCC
CE
WE
tBLC
Address
5555
Data
AA
5555
AAAA or
2AAA
55
A0
tWC
Write address
Write data
Software Data Protection Timing Waveform (2) (in non-protection mode)
VCC
tWC
CE
WE
Address
Data
14
5555
AAAA
or
2AAA
5555
5555
AAAA
or
2AAA
5555
AA
55
80
AA
55
20
Normal active
mode
HN58C1001 Series
Functional Description
Automatic Page Write
Page-mode write feature allows 1 to 128 bytes of data to be written into the EEPROM in a single write cycle.
Following the initial byte cycle, an additional 1 to 127 bytes can be written in the same manner. Each
additional byte load cycle must be started within 30 µs from the preceding falling edge of WE or CE. When
CE or W E is kept high for 100 µs after data input, the EEPROM enters write mode automatically and the
input data are written into the EEPROM.
Data Polling
Data polling allows the status of the EEPROM to be determined. If EEPROM is set to read mode during a
write cycle, an inversion of the last byte of data to be loaded outputs from I/O7 to indicate that the EEPROM
is performing a write operation.
RDY/Busy Signal
RDY/Busy signal also allows status of the EEPROM to be determined. The RDY/Busy signal has high
impedance except in write cycle and is lowered to V OL after the first write signal. At the end of write cycle,
the RDY/Busy signal changes state to high impedance.
RES Signal
When RES is low, the EEPROM cannot be read or programmed. Therefore, data can be protected by keeping
RES low when VCC is switched. RES should be high during read and programming because it doesn’t provide
a latch function.
VCC
Read inhibit
Read inhibit
RES
Program inhibit
Program inhibit
WE, CE Pin Operation
During a write cycle, addresses are latched by the falling edge of WE or CE, and data is latched by the rising
edge of WE or CE.
15
HN58C1001 Series
Write/Erase Endurance and Data Retention Time
The endurance is 10 4 cycles in case of the page programming and 103 cycles in case of the byte programming
(1% cumulative failure rate). The data retention time is more than 10 years when a device is pageprogrammed less than 104 cycles.
Data Protection
1. Data Protection against Noise on Control Pins (CE, OE, WE) during Operation
During readout or standby, noise on the control pins may act as a trigger and turn the EEPROM to
programming mode by mistake.
To prevent this phenomenon, this device has a noise cancellation function that cuts noise if its width is 20 ns
or less in program mode.
Be careful not to allow noise of a width of more than 20 ns on the control pins.
WE
CE
VIH
0V
VIH
OE
0V
20 ns max
16
HN58C1001 Series
2. Data Protection at VCC On/Off
When VCC is turned on or off, noise on the control pins generated by external circuits (CPU, etc) may act as a
trigger and turn the EEPROM to program mode by mistake. To prevent this unintentional programming, the
EEPROM must be kept in an unprogrammable state while the CPU is in an unstable state.
Note: The EEPROM should be kept in unprogrammable state during V CC on/off by using CPU RESET
signal.
VCC
CPU
RESET
* Unprogrammable
* Unprogrammable
(1) Protection by RES
The unprogrammable state can be realized by that the CPU’s reset signal inputs directly to the EEPROM’s
RES pin. RES should be kept VSS level during VCC on/off.
The EEPROM brakes off programming operation when RES becomes low, programming operation doesn’t
finish correctly in case that RES falls low during programming operation. RES should be kept high for 10 ms
after the last data input.
VCC
RES
Program inhibit
WE
or CE
1 µs min 100 µs min
Program inhibit
10 ms min
17
HN58C1001 Series
3. Software data protection
To prevent unintentional programming, this device has the software data protection (SDP) mode. The SDP is
enabled by inputting the following 3 bytes code and write data. SDP is not enabled if only the 3 bytes code is
input. To program data in the SDP enable mode, 3 bytes code must be input before write data.
Address
Data
5555
AA
↓
↓
AAAA or 2AAA
55
↓
↓
5555
A0
↓
↓
Write address Write data } Normal data input
The SDP mode is disabled by inputting the following 6 bytes code. Note that, if data is input in the SDP
disable cycle, data can note be written.
Address
Data
5555
↓
AAAA or 2AAA
↓
5555
↓
5555
↓
AAAA or 2AAA
↓
5555
AA
↓
55
↓
80
↓
AA
↓
55
↓
20
The software data protection is not enabled at the shipment.
Note: There are some differences between Hitachi’s and other company’s for enable/disable sequence of
software data protection. If there are any questions , please contact with Hitachi sales offices.
18
HN58C1001 Series
Package Dimensions
HN58C1001P Series (DP-32)
Unit: mm
41.90
42.50 Max
17
13.4
13.7 Max
32
16
5.08 Max
1.20
2.30 Max
2.54 ± 0.25
0.48 ± 0.10
0.51 Min
2.54 Min
1
15.24
+ 0.11
0.25 – 0.05
0° – 15°
Hitachi Code
JEDEC
EIAJ
Weight (reference value)
DP-32
—
Conforms
5.1 g
19
HN58C1001 Series
Package Dimensions (cont.)
HN58C1001FP Series (FP-32D)
Unit: mm
20.45
20.95 Max
17
11.30
32
1
1.27
0.40 ± 0.08
0.38 ± 0.06
0.10
0.15 M
Dimension including the plating thickness
Base material dimension
20
0.12
0.15 +– 0.10
1.00 Max
0.22 ± 0.05
0.20 ± 0.04
3.00 Max
16
14.14 ± 0.30
1.42
0° – 8°
0.80 ± 0.20
Hitachi Code
JEDEC
EIAJ
Weight (reference value)
FP-32D
Conforms
—
1.3 g
HN58C1001 Series
Package Dimensions (cont.)
HN58C1001T Series (TFP-32DA)
Unit: mm
8.00
8.20 Max
17
1
16
12.40
32
0.50
0.08 M
Dimension including the plating thickness
Base material dimension
0.17 ± 0.05
0.125 ± 0.04
1.20 Max
0.10
0.80
14.00 ± 0.20
0.45 Max
0.13 ± 0.05
0.22 ± 0.08
0.20 ± 0.06
0° – 5°
Hitachi Code
JEDEC
EIAJ
Weight (reference value)
0.50 ± 0.10
TFP-32DA
Conforms
Conforms
0.26 g
21
HN58C1001 Series
When using this document, keep the following in mind:
1. This document may, wholly or partially, be subject to change without notice.
2. All rights are reserved: No one is permitted to reproduce or duplicate, in any form, the whole or part of
this document without Hitachi’s permission.
3. Hitachi will not be held responsible for any damage to the user that may result from accidents or any other
reasons during operation of the user’s unit according to this document.
4. Circuitry and other examples described herein are meant merely to indicate the characteristics and
performance of Hitachi’s semiconductor products. Hitachi assumes no responsibility for any intellectual
property claims or other problems that may result from applications based on the examples described
herein.
5. No license is granted by implication or otherwise under any patents or other rights of any third party or
Hitachi, Ltd.
6. MEDICAL APPLICATIONS: Hitachi’s products are not authorized for use in MEDICAL
APPLICATIONS without the written consent of the appropriate officer of Hitachi’s sales company. Such
use includes, but is not limited to, use in life support systems. Buyers of Hitachi’s products are requested
to notify the relevant Hitachi sales offices when planning to use the products in MEDICAL
APPLICATIONS.
Hitachi, Ltd.
Semiconductor & IC Div.
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100, Japan
Tel: Tokyo (03) 3270-2111
Fax: (03) 3270-5109
For further information write to:
Hitachi America, Ltd.
Semiconductor & IC Div.
2000 Sierra Point Parkway
Brisbane, CA. 94005-1835
USA
Tel: 415-589-8300
Fax: 415-583-4207
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Continental Europe
Dornacher Straße 3
D-85622 Feldkirchen
München
Tel: 089-9 91 80-0
Fax: 089-9 29 30-00
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United Kingdom
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Fax: 01628-585160
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Fax: 27306071
Copyright © Hitachi, Ltd., 1997. All rights reserved. Printed in Japan.
22
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