Renesas HN58X2532TIAG Serial peripheral interface electrically erasable and programmable read only memory Datasheet

HN58X2532IAG
HN58X2564IAG
Serial Peripheral Interface
32k EEPROM (4-kword × 8-bit)
64k EEPROM (8-kword × 8-bit)
Electrically Erasable and Programmable Read Only Memory
REJ03C0306-0100
Rev.1.00
Nov.16.2006
Description
HN58X25xxx Series is the Serial Peripheral Interface compatible (SPI) EEPROM (Electrically Erasable and
Programmable ROM). It realizes high speed, low power consumption and a high level of reliability by employing
advanced MONOS memory technology and CMOS process and low voltage circuitry technology. It also has a 32-byte
page programming function to make it’s write operation faster.
Features
• Single supply: 1.8 V to 5.5 V
• Serial Peripheral Interface compatible (SPI bus)
 SPI mode 0 (0,0), 3 (1,1)
• Clock frequency: 5 MHz (2.5 V to 5.5 V), 3 MHz (1.8 V to 5.5 V)
• Power dissipation:
 Standby: 3 µA (max)
 Active (Read): 3.0 mA (max)
 Active (Write): 3.5 mA (max)
• Automatic page write: 32-byte/page
• Write cycle time: 5 ms (2.5 V min), 8 ms (1.8 V min)
• Endurance: 106 Erase/Write Cycles
• Data retention: 10 Years
• Small size packages: SOP-8pin, TSSOP-8pin
• Shipping tape and reel
 TSSOP-8pin : 3,000 IC/reel
 SOP-8pin
: 2,500 IC/reel
• Temperature range: −40 to +85°C
• Lead free product.
Rev.1.00, Nov.16.2006, page 1 of 20
HN58X2532IAG/HN58X2564IAG
Ordering Information
Type No.
Internal organization
HN58X2532FPIAG
32-kbit (4096 × 8-bit)
HN58X2564FPIAG
64-kbit (8192 × 8-bit)
HN58X2532TIAG
32-kbit (4096 × 8-bit)
HN58X2564TIAG
64-kbit (8192 × 8-bit)
Operating voltage
Frequency
1.8 V to 5.5 V
5 MHz
(2.5 V to 5.5 V)
3 MHz
(1.8 V to 5.5V)
1.8 V to 5.5 V
5 MHz
(2.5 V to 5.5 V)
3 MHz
(1.8 V to 5.5 V)
Pin Arrangement
8-pin SOP/TSSOP
S
1
8
VCC
Q
2
7
HOLD
W
3
6
C
VSS
4
5
D
(Top view)
Pin Description
Pin name
C
D
Q
S
W
HOLD
VCC
VSS
Function
Serial clock
Serial data input
Serial data output
Chip select
Write protect
Hold
Supply voltage
Ground
Rev.1.00, Nov.16.2006, page 2 of 20
Package
150mil 8-pin plastic SOP
PRSP0008DF-B
(FP-8DBV)
Lead free
8-pin plastic TSSOP
PTSP0008JC-B
(TTP-8DAV)
Lead free
HN58X2532IAG/HN58X2564IAG
Block Diagram
High voltage generator
C
HOLD
D
Y
decoder
W
Address generator
S
Control logic
VSS
X
decoder
VCC
Memory array
Y-select & Sense amp.
Serial-parallel converter
Q
Absolute Maximum Ratings
Parameter
Symbol
Supply voltage relative to VSS
VCC
Input voltage relative to VSS
VIN
Operating temperature range*1
Topr
Storage temperature range
Tstg
Notes: 1. Including electrical characteristics and data retention.
2. VIN (min): −3.0 V for pulse width ≤ 50 ns.
3. Should not exceed VCC + 1.0 V.
Value
−0.6 to + 7.0
−0.5*2 to +7.0*3
−40 to +85
−65 to +125
Unit
V
V
°C
°C
DC Operating Conditions
Parameter
Supply voltage
Input voltage
Operating temperature range
Symbol
VCC
VSS
VIH
VIL
Topr
Notes: 1. VIN (min): −1.0 V for pulse width ≤ 50 ns.
2. VIN (max): VCC + 1.0 V for pulse width ≤ 50 ns.
Rev.1.00, Nov.16.2006, page 3 of 20
Min
1.8
0
VCC × 0.7
−0.3*1
−40
Typ

0



Max
5.5
0
VCC + 0.5*2
VCC × 0.3
+85
Unit
V
V
V
V
°C
HN58X2532IAG/HN58X2564IAG
DC Characteristics
Parameter
Input leakage current
Symbol
ILI
Min

Max
2
Unit
µA
ILO

2
µA
VCC = 5.5 V, VOUT = 0 to 5.5 V
(Q)
Standby
ISB

3
µA
VIN = VSS or VCC,
VCC = 5.5 V
Active
ICC1

2
mA
VCC = 3.6 V, Read at 5 MHz
VIN = VCC × 0.1/VCC × 0.9 Q =
OPEN

3
mA
VCC = 5.5 V, Read at 5 MHz
VIN = VCC × 0.1/VCC × 0.9 Q =
OPEN

2
mA
VCC = 3.6 V, Write at 5 MHz
VIN = VCC × 0.1/VCC × 0.9

3.5
mA
VCC = 5.5 V, Write at 5 MHz
VIN = VCC × 0.1/VCC × 0.9
VOL1
VOL2


0.4
0.4
V
V
VCC = 5.5 V, IOL = 2 mA
VCC = 2.5 V, IOL = 1.5 mA
VOH1
VOH2
VCC × 0.8
VCC × 0.8


V
V
VCC = 5.5 V, IOL = −2 mA
VCC = 2.5 V, IOL = −0.4 mA
Output leakage current
VCC current
ICC2
Output voltage
Rev.1.00, Nov.16.2006, page 4 of 20
Test conditions
VCC = 5.5 V, VIN = 0 to 5.5 V
(S, D, C, HOLD, W)
HN58X2532IAG/HN58X2564IAG
AC Characteristics
Test Conditions
• Input pules levels:
 VIL = VCC × 0.2
 VIH = VCC × 0.8
• Input rise and fall time: ≤ 10 ns
• Input and output timing reference levels: VCC × 0.3, VCC × 0.7
• Output reference levels: VCC × 0.5
• Output load: 100 pF
Parameter
Clock frequency
S active setup time
S not active setup time
S deselect time
S active hold time
S not active hold time
Clock high time
Clock low time
Clock rise time
Clock fall time
Data in setup time
Data in hold time
Clock low hold time after HOLD not active
Clock low hold time after HOLD active
Clock high setup time before HOLD active
Clock high setup time before HOLD not
active
(Ta = −40 to +85°C, VCC = 2.5 V to 5.5 V)
Symbol
fC
tSLCH
tSHCH
tSHSL
tCHSH
tCHSL
tCH
tCL
Alt
fSCK
tCSS1
tCSS2
tCS
tCSH

tCLH
tCLL
Min

90
90
90
90
90
90
90
Max
5







Unit
MHz
ns
ns
ns
ns
ns
ns
ns
Notes
tCLCH
tCHCL
tDVCH
tCHDX
tHHCH
tHLCH
tCHHL
tCHHH
tRC
tFC
tDSU
tDH






20
30
70
40
60
60
1
1






µs
µs
ns
ns
ns
ns
ns
ns
2
2
ns
ns
ns
ns
ns
ns
ns
ms
cycles
2
Output disable time
tSHQZ
tDIS

100
Clock low to output valid
tCLQV
tV

70
Output hold time
tCLQX
tHO
0

Output rise time
tQLQH
tRO

50
Output fall time
tQHQL
tFO

50
HOLD high to output low-Z
tHHQX
tLZ

50
HOLD low to output high-Z
tHLQZ
tHZ

100
Write time
tW
tWC

5
Erase / Write Endurance


106

Notes: 1. tCH + tCL ≥ 1/fC
2. Value guaranteed by characterization, not 100% tested in production.
3. Value guaranteed by characterization, not 100% tested in products (Ta = 25°C).
Rev.1.00, Nov.16.2006, page 5 of 20
1
1
2
2
2
2
3
HN58X2532IAG/HN58X2564IAG
(Ta = −40 to +85°C, VCC = 1.8 V to 5.5 V)
Parameter
Clock frequency
S active setup time
S not active setup time
S deselect time
S active hold time
S not active hold time
Clock high time
Clock low time
Clock rise time
Clock fall time
Data in setup time
Data in hold time
Clock low hold time after HOLD not active
Clock low hold time after HOLD active
Clock high setup time before HOLD active
Clock high setup time before HOLD not
active
Output disable time
Symbol
fC
tSLCH
tSHCH
tSHSL
tCHSH
tCHSL
tCH
tCL
tCLCH
tCHCL
tDVCH
tCHDX
tHHCH
tHLCH
tCHHL
tCHHH
Alt
fSCK
tCSS1
tCSS2
tCS
tCSH

tCLH
tCLL
tRC
tFC
tDSU
tDH




Min

100
100
150
100
100
150
150


30
50
140
90
120
120
Max
3







1
1
—





Unit
MHz
ns
ns
ns
ns
ns
ns
ns
µs
µs
ns
ns
ns
ns
ns
ns
Notes
tSHQZ
tDIS

200
ns
2
ns
ns
ns
ns
ns
ns
ms
cycles
2
2
2
2
Clock low to output valid
tCLQV
tV

120
Output hold time
tCLQX
tHO
0

Output rise time
tQLQH
tRO

100
Output fall time
tQHQL
tFO

100
HOLD high to output low-Z
tHHQX
tLZ

100
HOLD low to output high-Z
tHLQZ
tHZ

100
Write time
tW
tWC

8
Erase / Write Endurance


106

Notes: 1. tCH + tCL ≥ 1/fC
2. Value guaranteed by characterization, not 100% tested in production.
3. Value guaranteed by characterization, not 100% tested in products (Ta = 25°C).
Rev.1.00, Nov.16.2006, page 6 of 20
1
1
2
2
3
HN58X2532IAG/HN58X2564IAG
Timing Waveforms
Serial Input Timing
tSHSL
S
tCHSL
tCHSH
tSHCH
tSLCH
C
tDVCH
D
tCHCL
tCLCH
tCHDX
MSB IN
LSB IN
High Impedance
Q
Hold Timing
S
tHHCH
tHLCH
tCHHL
C
tCHHH
D
tHLQZ
tHHQX
Q
HOLD
Output Timing
S
tSHQZ
tCH
C
tCL
D
ADDR
LSB IN
tCLQV
tCLQX
Q
tCLQX
tCLQV
LSB OUT
tQLQH
tQHQL
Rev.1.00, Nov.16.2006, page 7 of 20
HN58X2532IAG/HN58X2564IAG
Pin Function
Serial data output (Q)
This output signal is used to transfer data serially out of the device. Data is shifted out on the falling edge of serial
clock (C).
Serial data input (D)
This input signal is used to transfer data serially into the device. It receives instructions, addresses, and the data to be
written. Values are latched on the rising edge of serial clock (C).
Serial clock (C)
This input signal provides the timing of the serial interface. Instructions, addresses, or data present at serial data input
(D) are latched on the rising edge of serial clock (C). Data on serial data output (Q) changes after the falling edge of
serial clock (C).
Chip select (S)
When this input signal is high, the device is deselected and serial data output (Q) is at high impedance. Unless an
internal write cycle is in progress, the device will be in the standby mode. Driving chip select (S) low enables the
device, placing it in the active power mode. After power-up, a falling edge on chip select (S) is required prior to the
start of any instruction.
Hold (HOLD)
The hold (HOLD) signal is used to pause any serial communications with the device without deselecting the device.
During the hold condition, the serial data output (Q) is high impedance, and serial data input (D) and serial clock (C)
are don’t care. To start the hold condition, the device must be selected, with chip select (S) driven low.
Write protect (W)
The main purpose of this input signal is to freeze the size of the area of memory that is protected against write
instructions (as specified by the values in the BP1 and BP0 bits of the status register). This pin must be driven either
high or low, and must be stable during all write operations.
Rev.1.00, Nov.16.2006, page 8 of 20
HN58X2532IAG/HN58X2564IAG
Functional Description
Status Register
The following figure shows the Status Register Format. The Status Register contains a number of status and control
bits that can be read or set (as appropriate) by specific instructions.
Status Register Format
b7
SRWD
b0
0
0
0
BP1
BP0
WEL
WIP
Status Register Write Disable
Block Protect Bits
Write Enable Latch Bits
Write In Progress Bits
WIP bit: The Write In Progress (WIP) bit indicates whether the memory is busy with a Write or Write Status Register
cycle.
WEL bit: The Write Enable Latch (WEL) bit indicates the status of the internal Write Enable Latch.
BP1, BP0 bits: The Block Protect (BP1, BP0) bits are non-volatile. They define the size of the area to be software
protected against Write instructions.
SRWD bit: The Status Register Write Disable (SRWD) bit is operated in conjunction with the write protect (W) signal.
The Status Register Write Disable (SRWD) bit and write protect (W) signal allow the device to be put in the Hardware
Protected mode. In this mode, the non-volatile bits of the Status Register (SRWD, BP1, BP0) become read-only bits.
Instructions
Each instruction starts with a single-byte code, as summarized in the following table. If an invalid instruction is sent
(one not contained in the following table), the device automatically deselects itself.
Instruction Set
Instruction
Description
WREN
WRDI
RDSR
WRSR
READ
Write Enable
Write Disable
Read Status Register
Write Status Register
Read from Memory Array
WRITE
Write to Memory Array
Rev.1.00, Nov.16.2006, page 9 of 20
Instruction Format
0000 0110
0000 0100
0000 0101
0000 0001
0000 0011
0000 0010
HN58X2532IAG/HN58X2564IAG
Write Enable (WREN):
The Write Enable Latch (WEL) bit must be set prior to each WRITE and WRSR instruction. The only way to do this is
to send a Write Enable instruction to the device. As shown in the following figure, to send this instruction to the
device, chip select (S) is driven low, and the bits of the instruction byte are shifted in, on serial data input (D). The
device then enters a wait state. It waits for the device to be deselected, by chip select (S) being driven high.
Write Enable (WREN) Sequence
S
W
VIH
VIL
VIH
VIL
0
C
1
2
3
4
VIL
Instruction
VIH
D
Q
Rev.1.00, Nov.16.2006, page 10 of 20
5
VIH
VIL
High-Z
6
7
HN58X2532IAG/HN58X2564IAG
Write Disable (WRDI):
One way of resetting the Write Enable Latch (WEL) bit is to send a Write Disable instruction to the device. As shown
in the following figure, to send this instruction to the device, chip select (S) is driven low, and the bits of the instruction
byte are shifted in, on serial data input (D).
The device then enters a wait state. It waits for the device to be deselected, by chip select (S) being driven high. The
Write Enable Latch (WEL) bit, in fact, becomes reset by any of the following events:




Power-up
WRDI instruction execution
WRSR instruction completion
WRITE instruction completion
Write Disable (WRDI) Sequence
S
W
VIH
VIL
VIH
VIL
0
C
1
2
3
4
VIL
Instruction
VIH
D
Q
Rev.1.00, Nov.16.2006, page 11 of 20
5
VIH
VIL
High-Z
6
7
HN58X2532IAG/HN58X2564IAG
Read Status Register (RDSR):
The Read Status Register (RDSR) instruction allows the Status Register to be read. The Status Register may be read at
any time, even while a Write or Write Status Register cycle is in progress. When one of these cycles is in progress, it is
recommended to check the Write In Progress (WIP) bit before sending a new instruction to the device. It is also
possible to read the Status Register continuously, as shown in the following figure.
Read Status Register (RDSR) Sequence
S
W
VIH
VIL
VIH
VIL
0
C
1
2
3
4
5
6
7
8
9
10 11 12 13 14
15
VIH
VIL
VIH
D
VIL
Status Register Out
Q
High-Z
7
6
5
4
3
2
1
0
7
The status and control bits of the Status Register are as follows:
WIP bit: The Write In Progress (WIP) bit indicates whether the memory is busy with a Write or Write Status Register
cycle. When set to 1, such a cycle is in progress. When reset to 0, no such cycles are in progress.
WEL bit: The Write Enable Latch (WEL) bit indicates the status of the internal Write Enable Latch. When set to 1, the
internal Write Enable Latch is set. When set to 0, the internal Write Enable Latch is reset and no Write or Write Status
Register instructions are accepted.
BP1, BP0 bits: The Block Protect (BP1, BP0) bits are non-volatile. They define the size of the area to be software
protected against Write instructions. These bits are written with the Write Status Register (WRSR) instruction. When
one or both of the Block Protect (BP1, BP0) bits are set to 1, the relevant memory area (as defined in the Status
Register Format table) becomes protected against Write (WRITE) instructions. The Block Protect (BP1, BP0) bits can
be written provided that the Hardware Protected mode has not been set.
SRWD bit: The Status Register Write Disable (SRWD) bit is operated in conjunction with the write protect (W) signal.
The Status Register Write Disable (SRWD) bit and write protect (W) signal allows the device to be put in the Hardware
Protected mode (When the Status Register Write Disable (SRWD) bit is set to 1, and write protect (W) signal is driven
low). In this mode, the non-volatile bits of the Status Register (SRWD, BP1, BP0) become read-only bits and the Write
Status Register (WRSR) instruction is no longer accepted for execution.
Rev.1.00, Nov.16.2006, page 12 of 20
HN58X2532IAG/HN58X2564IAG
Write Status Register (WRSR):
The Write Status Register (WRSR) instruction allows new values to be written to the Status Register. Before it can be
accepted, a Write Enable (WREN) instruction must previously have been executed. After the Write Enable (WREN)
instruction has been decoded and executed, the device sets the Write Enable Latch(WEL). The instruction sequence is
shown in the following figure. The Write Status Register (WRSR) instruction has no effect on b6, b5, b4, b1 and b0 of
the Status Register. b6, b5 and b4 are always read as 0. Chip select (S) must be driven high after the rising edge of
serial clock (C) that latches in the eighth bit of the data byte, and before the next rising edge of serial clock (C).
Otherwise, the Write Status Register (WRSR) instruction is not executed. As soon as chip select (S) is driven high, the
self-timed Write Status Register cycle (whose duration is tW) is initiated. While the Write Status Register cycle is in
progress, the Status Register may still be read to check the value of the Write In Progress (WIP) bit. The Write In
Progress (WIP) bit is 1 during the self-timed Write Status Register cycle, and is 0 when it is completed. When the
cycle is completed, Write Enable Latch (WEL) is reset. The Write Status Register (WRSR) instruction allows the user
to change the values of the Block Protect (BP1, BP0) bits, to define the size of the area that is to be treated as read-only,
as defined in the Status Register Format table.
The Write Status Register (WRSR) instruction also allows the user to set or reset the Status Register Write Disable
(SRWD) bit in accordance with the write protect (W) signal. The Status Register Write Disable (SRWD) bit and write
protect (W) signal allows the device to be put in the Hardware Protected Mode (HPM). The Write Status Register
(WRSR) instruction is not executed once the Hardware Protected Mode (HPM) is entered.
The contents of the Status Register Write Disable (SRWD) and Block Protect (BP1, BP0) bits are frozen at their current
values just before the start of the execution of the Write Status Register (WRSR) instruction. The new, updated values
take effect at the moment of completion of the execution of Write Status Register (WRSR) instruction.
Write Status Register (WRSR) Sequence
S
W
VIH
VIL
VIH
VIL
0
C
1
2
3
4
5
6
7
8
9
10 11 12 13 14
15
VIH
VIL
Status Register In
VIH
D
VIL
Q
Rev.1.00, Nov.16.2006, page 13 of 20
7
MSB
High-Z
6
5
4
3
2
1
0
HN58X2532IAG/HN58X2564IAG
Read from Memory Array (READ):
As shown in the following figure, to send this instruction to the device, chip select (S) is first driven low. The bits of
the instruction byte and the address bytes are then shifted in, on serial data input (D). The addresses are loaded into an
internal address register, and the byte of data at that address is shifted out, on serial data output (Q).
If chip select (S) continues to be driven low, the internal address register is automatically incremented, and the byte of
data at the new address is shifted out.
When the highest address is reached, the address counter rolls over to zero, allowing the Read cycle to be continued
indefinitely. The whole memory can, therefore, be read with a single READ instruction.
The Read cycle is terminated by driving chip select (S) high. The rising edge of the chip select (S) signal can occur at
any time during the cycle. The addressed first byte can be any byte within any page. The instruction is not accepted,
and is not executed, if a Write cycle is currently in progress.
Read from Memory Array (READ) Sequence
S
W
C
VIH
VIL
VIH
VIL
VIH
0
1
2
3
4
5
6
8
9 10
20 21 22 23 24 25 26 27 28 29 30 31
VIL
16-Bit Address
Instruction
VIH
D
7
A15 A14 A13
A3 A2 A1
A0
VIL
Data Out 1
Q
Note:
Data Out 2
High-Z
7
6
5
4
3
2
1
0
7
1. Depending on the memory size, as shown in the following table, the most significant address bits are don’t
care.
Address Range Bits
Device
HN58X2564IAG
Address bits
A12 to A0
Notes: 1. b15-b13 are don’t care on the HN58X2564IAG
2. b15-b12 are don’t care on the HN58X2532IAG
Rev.1.00, Nov.16.2006, page 14 of 20
HN58X2532IAG
A11 to A0
HN58X2532IAG/HN58X2564IAG
Write to Memory Array (WRITE):
As shown in the following figure, to send this instruction to the device, chip select (S) is first driven low. The bits of
the instruction byte, address byte, and at least one data byte are then shifted in, on serial data input (D).
The instruction is terminated by driving chip select (S) high at a byte boundary of the input data. In the case of the
following figure, this occurs after the eighth bit of the data byte has been latched in, indicating that the instruction is
being used to write a single byte. The self-timed Write cycle starts, and continues for a period tWC (as specified in AC
Characteristics). At the end of the cycle, the Write In Progress (WIP) bit is reset to 0.
If, though, chip select (S) continues to be driven low, as shown in the following figure, the next byte of the input data is
shifted in, so that more than a single byte, starting from the given address towards the end of the same page, can be
written in a single internal Write cycle.
Each time a new data byte is shifted in, the least significant bits of the internal address counter are incremented. If the
number of data bytes sent to the device exceeds the page boundary, the internal address counter rolls over to the
beginning of the page, and the previous data there are overwritten with the incoming data. (The page size of these
device is 32 bytes).
The instruction is not accepted, and is not executed, under the following conditions:
 If the Write Enable Latch (WEL) bit has not been set to 1 (by executing a Write Enable instruction just before)
 If a Write cycle is already in progress
 If the addressed page is in the region protected by the Block Protect (BP1 and BP0) bits.
Byte Write (WRITE) Sequence (1 Byte)
S
W
C
VIH
VIL
VIH
VIL
VIH
0
1
2
3
4
VIH
7
8
9
10
20 21 22 23 24 25 26 27 28 29 30 31
16-Bit Address
15 14 13
3
2
Data Byte 1
1
0
7
6
5
4
3
2
1
0
VIL
Q
Note:
6
VIL
Instruction
D
5
High-Z
1. Depending on the memory size, as shown in Address Range Bits table, the most significant address bits are
don’t care.
Rev.1.00, Nov.16.2006, page 15 of 20
HN58X2532IAG/HN58X2564IAG
Byte Write (WRITE) Sequence (Page)
S
W
C
VIH
VIL
VIH
VIL
0
VIH
1
2
3
4
5
6
7
8
9
16-Bit Address
VIH
15 14 13
W
C
1
0
7
6
5
4
3
2
1
1
0
0
VIH
VIL
VIH
VIL
VIH
32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47
VIL
7
6
5
4
3
Q
Note:
2
High-Z
Data Byte 2
D
3
Data Byte 1
VIL
Q
S
20 21 22 23 24 25 26 27 28 29 30 31
VIL
Instruction
D
10
2
Data Byte 3
1
0
7
6
5
4
3
2
Data Byte N
1
0
6
5
4
3
2
High-Z
1. Depending on the memory size, as shown in Address Range Bits table, the most significant address bits are
don’t care.
Rev.1.00, Nov.16.2006, page 16 of 20
HN58X2532IAG/HN58X2564IAG
Data Protect
The protection features of the device are summarized in the following table. When the Status Register Write Disable
(SRWD) bit of the Status Register is 0 (its initial delivery state), it is possible to write to the Status Register provided
that the Write Enable Latch (WEL) bit has previously been set by a Write Enable (WREN) instruction, regardless
weather write protect (W) is driven high or low.
When the Status Register Write Disable (SRWD) bit of the Status Register is set to 1, two cases need to be considered,
depending on the state of write protect (W):
 If write protect (W) is driven high, it is possible to write to the Status Register provided that the Write Enable
Latch (WEL) bit has previously been set by a Write Enable (WREN) instruction.
 If write protect (W) is driven low, it is not possible to write to the Status Register even if the Write Enable Latch
(WEL) bit has previously been set by a Write Enable (WREN) instruction. (Attempts to write to the Status
Register are rejected, and are not accepted for execution). As a consequence, all the data bytes in the memory
area that are software protected (SPM) by the Block Protect (BP1, BP0) bits of the Status Register, are also
hardware protected against data modification.
Regardless of the order of the two events, the Hardware Protected Mode (HPM) can be entered:
 By setting the Status Register Write Disable (SRWD) bit after driving write protect (W) low.
 By driving write protect (W) low after setting the Status Register Write Disable (SRWD) bit.
The only way to exit the Hardware Protected Mode (HPM) once entered is to pull write protect (W) high.
If write protect (W) is permanently tied high, the Hardware Protected Mode (HPM) can never be activated, and only the
Software Protected Mode (SPM), using the Block Protect (BP1, BP0) bits of the Status Register, can be used.
Write Protected Block Size
0
0
1
1
Status register bits
BP1
BP0
0
1
0
1
Protected blocks
None
Upper quarter
Upper half
Whole memory
Array addresses protected
HN58X2564IAG
HN58X2532IAG
None
None
1800h − 1FFFh
0C00h − 0FFFh
1000h − 1FFFh
0800h − 0FFFh
0000h − 1FFFh
0000h − 0FFFh
Protection Modes
W signal
SRWD bit
1
0
0
0
1
1
0
1
Note:
Mode
Write protection of the
status register
Memory protect
Protected area*1
Unprotected area*1
Software
Status register is writable Write protected
protected (SPM) (if the WREN) instruction
has set the WEL bit).
The values in the BP1
and BP0 bits can be
changed.
Ready to accept Write
instructions
Write protected
Hardware
Status register is
protected (HPM) hardware write
protected. The values in
the BP1 and BP0 bits
cannot be changed.
Ready to accept Write
instructions
1. As defined by the values in the Block Protected (BP1, BP0) bits of the Status Register, as shown in the
former table.
Rev.1.00, Nov.16.2006, page 17 of 20
HN58X2532IAG/HN58X2564IAG
Hold Condition
The hold (HOLD) signal is used to pause any serial communications with the device without resetting the clocking
sequence.
During the hold condition, the serial data output (Q) is high impedance, and serial data input (D) and serial clock (C)
are don’t care.
To enter the hold condition, the device must be selected, with chip select (S) low.
Normally, the device is kept selected, for the whole duration of the hold condition. Deselecting the device while it is in
the hold condition, has the effect of resetting the state of the device, and this mechanism can be used if it is required to
reset any processes that had been in progress.
The hold condition starts when the hold (HOLD) signal is driven low at the same time as serial clock (C) already being
low (as shown in the following figure).
The hold condition ends when the hold (HOLD) signal is driven high at the same time as serial clock (C) already being
low.
The following figure also shows what happens if the rising and falling edges are not timed to coincide with serial clock
(C) being low.
Hold Condition Activation
HOLD status
HOLD status
C
HOLD
Notes
Data Protection at VCC On/Off
When VCC is turned on or off, noise on S inputs generated by external circuits (CPU, etc) may act as a trigger and turn
the EEPROM to unintentional program mode. To prevent this unintentional programming, this EEPROM have a power
on reset function. Be careful of the notices described below in order for the power on reset function to operate
correctly.
• S should be fixed to VCC during VCC on/off. Low to high or high to low transition during VCC on/off may
cause the trigger for the unintentional programming.
• VCC should be turned on/off after the EEPROM is placed in a standby state.
• VCC should be turned on from the ground level (VSS) in order for the EEPROM not to enter the unintentional
programming mode.
• VCC turn on speed should be slower than 10 µs/V.
• When WRSR or WRITE instruction is executed before VCC turns off, VCC should be turned off after waiting
write cycle time (tW).
Rev.1.00, Nov.16.2006, page 18 of 20
HN58X2532IAG/HN58X2564IAG
Package Dimensions
HN58X2532FPIAG/HN58X2564FPIAG (PRSP0008DF-B / Previous Code: FP-8DBV)
JEITA Package Code
P-SOP8-3.9x4.89-1.27
RENESAS Code
PRSP0008DF-B
*1
Previous Code
FP-8DBV
MASS[Typ.]
0.08g
D
8
F
NOTE)
1. DIMENSIONS"*1 (Nom)"AND"*2"
DO NOT INCLUDE MOLD FLASH.
2. DIMENSION"*3"DOES NOT
INCLUDE TRIM OFFSET.
5
*2
c
E
HE
bp
Index mark
Terminal cross section
( Ni/Pd/Au plating )
1
Z
Reference
Symbol
4
e
*3
bp
x
M
A
L1
A1
θ
L
y
Detail F
Rev.1.00, Nov.16.2006, page 19 of 20
D
E
A2
A1
A
bp
b1
c
c1
θ
HE
e
x
y
Z
L
L1
Dimension in Millimeters
Min Nom Max
4.89 5.15
3.90
0.102 0.14 0.254
1.73
0.35 0.40 0.45
0.15 0.20 0.25
0°
8°
5.84 6.02 6.20
1.27
0.25
0.10
0.69
0.406 0.60 0.889
1.06
HN58X2532IAG/HN58X2564IAG
HN58X2532TIAG/HN58X2564TIAG (PTSP0008JC-B / Previous Code: TTP-8DAV)
JEITA Package Code
P-TSSOP8-4.4x3-0.65
RENESAS Code
PTSP0008JC-B
*1
Previous Code
TTP-8DAV
MASS[Typ.]
0.034g
D
8
F
5
NOTE)
1. DIMENSIONS"*1 (Nom)"AND"*2"
DO NOT INCLUDE MOLD FLASH.
2. DIMENSION"*3"DOES NOT
INCLUDE TRIM OFFSET.
c
*2
E
HE
bp
Terminal cross section
( Ni/Pd/Au plating )
Reference
Symbol
Index mark
L1
1
*3
bp
x
M
θ
A1
A
Z
4
e
L
Detail F
y
Rev.1.00, Nov.16.2006, page 20 of 20
D
E
A2
A1
A
bp
b1
c
c1
θ
HE
e
x
y
Z
L
L1
Dimension in Millimeters
Min Nom Max
3.00 3.30
4.40
0.03 0.07 0.10
1.10
0.15 0.20 0.25
0.10 0.15 0.20
0°
8°
6.20 6.40 6.60
0.65
0.13
0.10
0.805
0.40 0.50 0.60
1.00
Revision History
Rev.
Date
1.00
Nov. 16, 2006
Page

Initial issue
HN58X2532IAG/HN58X2564IAG
Data Sheet
Contents of Modification
Description
Sales Strategic Planning Div.
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
Notes:
1. This document is provided for reference purposes only so that Renesas customers may select the appropriate Renesas products for their use. Renesas neither makes
warranties or representations with respect to the accuracy or completeness of the information contained in this document nor grants any license to any intellectual property
rights or any other rights of Renesas or any third party with respect to the information in this document.
2. Renesas shall have no liability for damages or infringement of any intellectual property or other rights arising out of the use of any information in this document, including,
but not limited to, product data, diagrams, charts, programs, algorithms, and application circuit examples.
3. You should not use the products or the technology described in this document for the purpose of military applications such as the development of weapons of mass
destruction or for the purpose of any other military use. When exporting the products or technology described herein, you should follow the applicable export control laws
and regulations, and procedures required by such laws and regulations.
4. All information included in this document such as product data, diagrams, charts, programs, algorithms, and application circuit examples, is current as of the date this
document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas products listed in this document,
please confirm the latest product information with a Renesas sales office. Also, please pay regular and careful attention to additional and different information to be
disclosed by Renesas such as that disclosed through our website. (http://www.renesas.com )
5. Renesas has used reasonable care in compiling the information included in this document, but Renesas assumes no liability whatsoever for any damages incurred as a
result of errors or omissions in the information included in this document.
6. When using or otherwise relying on the information in this document, you should evaluate the information in light of the total system before deciding about the applicability
of such information to the intended application. Renesas makes no representations, warranties or guaranties regarding the suitability of its products for any particular
application and specifically disclaims any liability arising out of the application and use of the information in this document or Renesas products.
7. With the exception of products specified by Renesas as suitable for automobile applications, Renesas products are not designed, manufactured or tested for applications
or otherwise in systems the failure or malfunction of which may cause a direct threat to human life or create a risk of human injury or which require especially high quality
and reliability such as safety systems, or equipment or systems for transportation and traffic, healthcare, combustion control, aerospace and aeronautics, nuclear power, or
undersea communication transmission. If you are considering the use of our products for such purposes, please contact a Renesas sales office beforehand. Renesas shall
have no liability for damages arising out of the uses set forth above.
8. Notwithstanding the preceding paragraph, you should not use Renesas products for the purposes listed below:
(1) artificial life support devices or systems
(2) surgical implantations
(3) healthcare intervention (e.g., excision, administration of medication, etc.)
(4) any other purposes that pose a direct threat to human life
Renesas shall have no liability for damages arising out of the uses set forth in the above and purchasers who elect to use Renesas products in any of the foregoing
applications shall indemnify and hold harmless Renesas Technology Corp., its affiliated companies and their officers, directors, and employees against any and all
damages arising out of such applications.
9. You should use the products described herein within the range specified by Renesas, especially with respect to the maximum rating, operating supply voltage range,
movement power voltage range, heat radiation characteristics, installation and other product characteristics. Renesas shall have no liability for malfunctions or damages
arising out of the use of Renesas products beyond such specified ranges.
10. Although Renesas endeavors to improve the quality and reliability of its products, IC products have specific characteristics such as the occurrence of failure at a certain
rate and malfunctions under certain use conditions. Please be sure to implement safety measures to guard against the possibility of physical injury, and injury or damage
caused by fire in the event of the failure of a Renesas product, such as safety design for hardware and software including but not limited to redundancy, fire control and
malfunction prevention, appropriate treatment for aging degradation or any other applicable measures. Among others, since the evaluation of microcomputer software
alone is very difficult, please evaluate the safety of the final products or system manufactured by you.
11. In case Renesas products listed in this document are detached from the products to which the Renesas products are attached or affixed, the risk of accident such as
swallowing by infants and small children is very high. You should implement safety measures so that Renesas products may not be easily detached from your products.
Renesas shall have no liability for damages arising out of such detachment.
12. This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written approval from Renesas.
13. Please contact a Renesas sales office if you have any questions regarding the information contained in this document, Renesas semiconductor products, or if you have
any other inquiries.
http://www.renesas.com
RENESAS SALES OFFICES
Refer to "http://www.renesas.com/en/network" for the latest and detailed information.
Renesas Technology America, Inc.
450 Holger Way, San Jose, CA 95134-1368, U.S.A
Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501
Renesas Technology Europe Limited
Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K.
Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900
Renesas Technology (Shanghai) Co., Ltd.
Unit 204, 205, AZIACenter, No.1233 Lujiazui Ring Rd, Pudong District, Shanghai, China 200120
Tel: <86> (21) 5877-1818, Fax: <86> (21) 6887-7898
Renesas Technology Hong Kong Ltd.
7th Floor, North Tower, World Finance Centre, Harbour City, 1 Canton Road, Tsimshatsui, Kowloon, Hong Kong
Tel: <852> 2265-6688, Fax: <852> 2730-6071
Renesas Technology Taiwan Co., Ltd.
10th Floor, No.99, Fushing North Road, Taipei, Taiwan
Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999
Renesas Technology Singapore Pte. Ltd.
1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632
Tel: <65> 6213-0200, Fax: <65> 6278-8001
Renesas Technology Korea Co., Ltd.
Kukje Center Bldg. 18th Fl., 191, 2-ka, Hangang-ro, Yongsan-ku, Seoul 140-702, Korea
Tel: <82> (2) 796-3115, Fax: <82> (2) 796-2145
Renesas Technology Malaysia Sdn. Bhd
Unit 906, Block B, Menara Amcorp, Amcorp Trade Centre, No.18, Jalan Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia
Tel: <603> 7955-9390, Fax: <603> 7955-9510
© 2006. Renesas Technology Corp., All rights reserved. Printed in Japan.
Colophon .7.0
Similar pages