CTS HP3-T03-44CB Metal case, case-mounted semiconductor Datasheet

Series HP3
Technical
METAL CASE, CASE-MOUNTED
SEMICONDUCTORS
HP3 Series for Single TO-3 or Stud Mount
DESCRIPTION OF CURVES
A.
B.
C.
D.
E.
•
•
N.C. Horiz. Device Only
Mounted to G-10.
N.C Horiz. & Vert. With
Dissipator.
200 FPM w/Diss.
500 FPM w/Diss.
1000 FPM w/Diss.
Thermal Resistance Case to Sink is 0.1-0.3 °C/W w/Joint Compound.
Derate 1.0 °C/watt for unplated part in natural convection only.
Ordering Information
Unplated
HP3-000-U
HP3-T03-U
HP3-T03-33U
CTS IERC PART NO.
Comm'l. Black
Anodize
HP3-000-CB
HP3-T03-CB
HP3-T03-33CB
Mil. Black Anodize
HP3-000-B
HP3-T03-B
HP3-T03-33B
Semiconductor
Accommodated
Undrilled
T0-3
T0-3 IC
Hole patt. ref.
no.
Max. Weight
(Grams)
-16
17
55.0
55.0
55.0
HP3-T03-44U
HP3-436-U
HP3-T015-U
HP3-T06-U
HP3-420-U
HP3-T03-44CB
HP3-436-CB
HP3-T015-CB
HP3-T06-CB
HP3-420-CB
HP3-T03-44B
HP3-436-B
HP3-T015-B
HP3-T06-B
HP3-420-B
T0-3 PANEL MOUNT
T0-3 (4 PIN)
T0-15, D0-5
T0-6, T0-36
UNIVERSAL
31
18
23
19
27
55.0
55.0
55.0
55.0
55.0
HP3 for Dual TO-3 Outline
DESCRIPTION OF CURVES
A.
B.
C.
D.
E.
•
•
N.C. Horiz. Device Only
Mounted to G-10.
N.C Horiz. & Vert. With
Dissipator.
200 FPM w/Diss.
500 FPM w/Diss.
1000 FPM w/Diss.
Thermal Resistance Case to Sink is 0.1-0.3 °C/W w/Joint Compound.
Derate 2.0 °C/watt for unplated part in natural convection only.
Ordering Information
Unplated
HP3-T03-4U
HP3-437-U
CTS IERC PART NO.
Comm'l. Black
Anodize
HP3-T03-4CB
HP3-437-CB
Mil. Black Anodize
HP3-T03-4B
HP3-437-B
Semiconductor
Accommodated
Two TO-3s
Two TO-3s (4 pin)
Hole patt. ref.
no.
Max. Weight
(Grams)
6
12
55.0
55.0
HP3 for Three TO-3 Outline
DESCRIPTION OF CURVES
A.
B.
C.
D.
E.
•
•
N.C. Horiz. Device Only
Mounted to G-10.
N.C Horiz. & Vert. With
Dissipator.
200 FPM w/Diss.
500 FPM w/Diss.
1000 FPM w/Diss.
Thermal Resistance Case to Sink is 0.1-0.3 °C/W w/Joint Compound.
Derate 3.0 °C/watt for unplated part in natural convection only.
Ordering Information
Unplated
HP3-T03-8U
CTS IERC PART NO.
Comm'l. Black
Anodize
HP3-T03-8CB
Mil. Black Anodize
HP3-T03-8B
Semiconductor
Accommodated
Three TO-3s
Hole patt. ref.
no.
Max. Weight
(Grams)
13
55.0
HOLE PATTERNS
6. Hole pattern no. 124 accomodates two TO-3s. Available in
12. Hole pattern no. 437 accommodates two TO-3s (4-pin).
HP3 series heat dissipators only.
Available in HP3 series heat dissipators only.
13. Hole pattern no. 186 accommodates three TO-3s. Available
in HP3 series heat dissipators only.
16. Hole pattern no. 1 accommodates T0-3s. Available in UP,
UP1, UP2, HP1, and HP3 series heat dissipators.
17. Hole pattern no. 202 accommodates T0-3 ICs. Available in
UP, UP1, UP2, HP1, and HP3 series heat dissipators.
18. Hole pattern no. 436 accomodates T0-3s (4-pin). Available
in UP, UP1, UP2, HP1, and HP3 series heat dissipators.
19. Hole pattern no. 2 accommodates T0-6s or T0-36s.
Available in UP, UP1, UP2, HP1, and HP3 series heat
dissipators.
23. Hole pattern no. 3 accommodates T0-15s, D0-5s and other
1/4" stud mount devices. Available in UP, UP1, UP2, HP1, and
HP3 series heat dissipators.
27. Hole pattern no. 420 (Universal) accommodates T0-3s, T066s, T0-126s, T0-127s, or T0-220s. Available in UP, UP1, UP2,
HP1, and HP3 series heat dissipators.
31. Hole pattern no. 213 accommodates one TO-3 (panel
mounted). Available in HP1 and HP3 series heat dissipators
only.
CTS IERC, Heat Sinks and Thermal Management Solutions
413 North Moss Street, Burbank, California 91502
Tel: (818) 842-7277
Fax: (818) 848-8872
Rev. 04-13-04
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