HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE6512-B Issued Date : 1992.11.25 Revised Date : 2000.09.15 Page No. : 1/3 HSA1015 PNP EPITAXIAL PLANAR TRANSISTOR Description The HSA1015 is designed for use in driver stage of AF amplifier and general purpose amplification. Absolute Maximum Ratings • Maximum Temperatures Storage Temperature ............................................................................................ -55 ~ +150 °C Junction Temperature ................................................................................... +150 °C Maximum • Maximum Power Dissipation Total Power Dissipation (Ta=25°C) ............................................................................... 400 mW • Maximum Voltages and Currents (Ta=25°C) VCBO Collector to Base Voltage ....................................................................................... -50 V VCEO Collector to Emitter Voltage .................................................................................... -50 V VEBO Emitter to Base Voltage ............................................................................................ -5 V IC Collector Current ..................................................................................................... -150 mA Characteristics (Ta=25°C) Symbol BVCBO BVCEO BVEBO ICBO IEBO *VCE(sat) *VBE(sat) *hFE1 *hFE2 fT Cob Min. -50 -50 -5 120 25 80 - Typ. - Max. -100 -100 -300 -1.1 700 7 Unit V V V nA nA mV V MHz pF Test Conditions IC=-100uA, IE=0 IC=-1mA, IB=0 IE=-10uA, IC=0 VCB=-50V, IE=0 VEB=-5V, IC=0 IC=-100mA, IB=-10mA IC=-100mA, IB=-10mA VCE=-6V, IC=-2mA VCE=-6V, IC=-150mA VCE=-10V, IC=-1mA, f=100MHz VCB=-10V, f=1MHz, IE=0 *Pulse Test : Pulse Width ≤380us, Duty Cycle≤2% Classification Of hFE1 Rank Range Y 120-240 GR 200-400 BL 350-700 HSMC Product Specification HI-SINCERITY Spec. No. : HE6512-B Issued Date : 1992.11.25 Revised Date : 2000.09.15 Page No. : 2/3 MICROELECTRONICS CORP. Characteristics Curve Current Gain & Collector Current Saturation Voltage & Collector Current 1 1000.0 VBE(sat) @ IC=10IB Saturation Voltage (V) VCE=6V hFE 100.0 10.0 0.1 VCE(sat) @ IC=10IB 1.0 0.1 0.01 1 10 100 1000 0.01 0.1 1 Collector Current (mA) Capacitance & Reverse-Biased Voltage 100 1000 Cutoff Frequency & Collector Current Cutoff Frequency (MHz) 1000 Capacitance (pF) 10.00 Cob 1.00 0.1 VCE=10V 100 10 1 1 10 1 100 10 100 1000 Collector Current (mA) Reverse-Biased Voltage (V) Safe Operating Area PD-Ta 10000 450 400 Power Dissipation-PD(mW) PT=1ms Cpllector Current-IC (mA) 10 Collector Current (mA) PT=100ms 1000 PT=1s 100 10 350 300 250 200 150 100 50 0 1 1 10 Forward Biased Voltage-VCE (V) 100 0 50 100 150 200 o Ambient Temperature-Ta( C) HSMC Product Specification HI-SINCERITY Spec. No. : HE6512-B Issued Date : 1992.11.25 Revised Date : 2000.09.15 Page No. : 3/3 MICROELECTRONICS CORP. TO-92 Dimension α2 A Marking : HSMC Logo B 1 2 Product Series Part Number 3 Date Code Rank α3 C Laser Mark HSMC Logo Product Series D Part Number H I G Ink Mark α1 Style : Pin 1.Emitter 2.Collector 3.Base E F 3-Lead TO-92 Plastic Package HSMC Package Code : A *:Typical Inches Min. Max. 0.1704 0.1902 0.1704 0.1902 0.5000 0.0142 0.0220 *0.0500 0.1323 0.1480 DIM A B C D E F Millimeters Min. Max. 4.33 4.83 4.33 4.83 12.70 0.36 0.56 *1.27 3.36 3.76 DIM G H I α1 α2 α3 Inches Min. Max. 0.0142 0.0220 *0.1000 *0.0500 *5° *2° *2° Millimeters Min. Max. 0.36 0.56 *2.54 *1.27 *5° *2° *2° Notes : 1.Dimension and tolerance based on our Spec. dated Apr. 25,1996. 2.Controlling dimension : millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material : • Lead : 42 Alloy ; solder plating • Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. • HSMC reserves the right to make changes to its products without notice. • HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory : • Head Office (Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454 • Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel : 886-3-5983621~5 Fax : 886-3-5982931 • Factory 2 : No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel : 886-3-5977061 Fax : 886-3-5979220 HSMC Product Specification