HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE6518 Issued Date : 1993.02.24 Revised Date : 2002.02.20 Page No. : 1/4 HSD471A NPN EPITAXIAL PLANAR TRANSISTOR Description The HSD471A is designed for use in drive and output stage of frequency amplifier applications. Absolute Maximum Ratings TO-92 • Maximum Temperatures Storage Temperature ............................................................................................ -55 ~ +150 °C Junction Temperature ...................................................................................... 150 °C Maximum • Maximum Power Dissipation Total Power Dissipation (Ta=25°C) ................................................................................ 800 mW • Maximum Voltages and Currents (Ta=25°C) VCBO Collector to Base Voltage ......................................................................................... 40 V VCEO Collector to Emitter Voltage ...................................................................................... 30 V VEBO Emitter to Base Voltage .............................................................................................. 5 V IC Collector Current............................................................................................................... 1 A Characteristics (Ta=25°C) Symbol BVCBO BVCEO BVEBO ICBO *VCE(sat) *VBE(sat) *hFE fT Cob Min. 40 30 5 70 - Typ. 130 16 Max. 100 0.5 1.2 400 - Unit V V V nA V V MHz pF Test Conditions IC=100uA, IE=0 IC=10mA, IB=0 IE=100uA, IC=0 VCB=30V, IE=0 IC=1A, IB=100mA IC=1A, IB=100mA VCE=1V, IC=100mA VCE=6V, IC=10mA VCB=6V, f=1MHz, IE=0 *Pulse Test: Pulse Width ≤380us, Duty Cycle≤2% Classification of hFE Rank Range HSD471A O 70-140 Y 120-240 GR 200-400 HSMC Product Specification HI-SINCERITY Spec. No. : HE6518 Issued Date : 1993.02.24 Revised Date : 2002.02.20 Page No. : 2/4 MICROELECTRONICS CORP. Characteristics Curve Current Gain & Collector Current Saturation Voltage & Collector Current 1000 1000 Saturation Voltage (mV) VCE(s at) @ IC=10IB o hFE 125 C o 25 C o 75 C 100 o 75 C o o 125 C hFE @ VCE=1V 25 C 10 100 1 10 100 1 1000 10 Collector Current-IC (mA) 100 1000 Collector Current-IC (mA) Capacitance & Reverse-Biased Voltage Saturation Voltage & Collector Current 1000 100 o Capacitance (pF) Saturation Voltage (mV) 25 C o 75 C o 125 C 10 Cob VBE(sat) @ IC=10IB 100 1 1 10 100 1000 0.1 1 Collector Current-IC (mA) 10 100 1000 Reverse Biased Voltage (V) Cutoff Frequency & Ic Safe Operating Area 10000 1000 Collector Current-IC (mA) Cutoff Frequency (MHz)... PT=1ms VCE=6V 100 PT=100ms 1000 PT=1s 100 10 1 10 1 10 100 Collector Current (mA) HSD471A 1000 1 10 100 Forward Biased Voltage-VCE (V) HSMC Product Specification HI-SINCERITY Spec. No. : HE6518 Issued Date : 1993.02.24 Revised Date : 2002.02.20 Page No. : 3/4 MICROELECTRONICS CORP. Temperature Profile for Dip Soldering IR Reflow Profile 260 300 10+/-2 sec 240 10+/-2 sec 220 250 180 o Temperature( C) o Temperature( C) 200 160 40+/-20 sec 140 120 100 80 200 150 100 150+/-30 60 120+/-20 sec 50 40 20 0 0 0 50 100 150 200 250 300 Time(sec) 0 50 100 150 200 250 300 350 Time(sec) Power Temperature Derating 900 PD , Power Dissipation (mW) 800 700 600 500 400 300 200 100 0 0 20 40 60 80 100 120 140 160 o Ta , Case Temperature ( C) HSD471A HSMC Product Specification HI-SINCERITY Spec. No. : HE6518 Issued Date : 1993.02.24 Revised Date : 2002.02.20 Page No. : 4/4 MICROELECTRONICS CORP. TO-92 Dimension α2 A Marking: H SD 4 7 1 A B 1 2 Rank 3 Date Code Control Code α3 Style: Pin 1.Emitter 2.Collector 3.Base C D H I G α1 E F 3-Lead TO-92 Plastic Package HSMC Package Code: A *: Typical Inches Min. Max. 0.1704 0.1902 0.1704 0.1902 0.5000 0.0142 0.0220 *0.0500 0.1323 0.1480 DIM A B C D E F Millimeters Min. Max. 4.33 4.83 4.33 4.83 12.70 0.36 0.56 *1.27 3.36 3.76 DIM G H I α1 α2 α3 Inches Min. Max. 0.0142 0.0220 *0.1000 *0.0500 *5° *2° *2° Millimeters Min. Max. 0.36 0.56 *2.54 *1.27 *5° *2° *2° Notes: 1.Dimension and tolerance based on our Spec. dated Apr. 25,1996. 2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material: • Lead: 42 Alloy; solder plating • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. • HSMC reserves the right to make changes to its products without notice. • HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory: • Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 • Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931 HSD471A HSMC Product Specification