HP HSME-A100-M3PJ1 Surface mount led indicator Datasheet

Agilent HSMx-A10x-xxxxx PLCC-2
Surface Mount LED Indicator
Data Sheet
Features
• Industry standard PLCC-2
package
• High reliability LED package
• High brightness using AlInGaP
and InGaN dice technologies
Description
This family of SMT LEDs is
packaged in the industry standard
PLCC-2 package. These SMT
LEDs have high reliability
performance and are designed to
work under a wide range of
environmental conditions. This
high reliability feature makes
them ideally suited to be used
under harsh interior automotive
as well as interior signs
application conditions.
To facilitate easy pick & place
assembly, the LEDs are packed in
EIA-compliant tape and reel.
Every reel will be shipped in
single intensity and color bin,
except red color, to provide close
uniformity.
• Available in full selection of
colors
These LEDs are compatible with
IR solder reflow process. Due to
the high reliability feature of
these products, they can also be
mounted using through-the-wave
soldering process.
• Super wide viewing angle at 120˚
The super wide viewing angle at
120˚ makes these LEDs ideally
suited for panel, push button, or
general backlighting in
automotive interior, office
equipment, industrial equipment,
and home appliances. The flat top
emitting surface makes it easy for
these LEDs to mate with light
pipes. With the built-in reflector
pushing up the intensity of the
light output, these LEDs are also
suitable to be used as LED pixels
in interior electronic signs.
Applications
• Available in 8 mm carrier tape on
7 inch reel (2000 pieces)
• Compatible with both IR and TTW
soldering process
• Interior automotive
–Instrument panel backlighting
–Central console backlighting
–Cabin backlighting
• Electronic signs and signals
–Interior full color sign
–Variable message sign
• Office automation, home appliances, industrial equipment
–Front panel backlighting
–Push button backlighting
–Display backlighting
CAUTION: HSMN,M,K and E-A10x-xxxxx LEDs are Class 2 ESD sensitive. Please observe appropriate
precautions during handling and processing. Refer to Agilent Application Note AN-1142 for
additional details.
Package Dimensions
2.8 ± 0.2
2.2 ± 0.2
3.2 ± 0.2
1.9 ± 0.2
0.1 TYP.
0.8 ± 0.1
3.5 ± 0.2
0.8 ± 0.3
0.5 ± 0.1
CATHODE MARKING
(ANODE MARKING FOR AlGaAs DEVICES)
TOP MOUNT
2.8 ± 0.2
2.2 ± 0.2
1.9 ± 0.2
5.2 ± 0.2
3.2 ± 0.2
0.1 TYP.
CATHODE MARKING
REVERSE MOUNT
NOTE: ALL DIMENSIONS IN MILLIMETERS.
2
0.5 ± 0.1
Device Selection Guide
Red
Part Number
Min. Iv (mcd)
Typ. Iv (mcd)
Max. Iv (mcd)
Test Current (mA)
Dice Technology
HSMS-A100-J00J1
4.0
15.0
-
20
GaP
HSMS-A100-L00J1
10.0
15.0
-
20
GaP
HSMS-A100-H70J2
3.0
-
8.0
10
GaP
HSMS-A100-J80J2
5.0
-
15.5
10
GaP
HSMH-A100-L00J1
10.0
15.0
-
20
AlGaAs
HSMH-A100-N00J1
25.0
50.0
-
20
AlGaAs
HSMH-A100-L70J2
12.5
-
32.0
10
AlGaAs
HSMH-A100-M80J2
20.0
-
62.0
10
AlGaAs
HSMH-A100-P30J1
40.0
-
100.0
20
AlGaAs
HSMC-A100-J00J1
4.0
100.0
-
20
AlInGaP
HSMC-A100-Q00J1
63.0
100.0
-
20
AlInGaP
HSMC-A100-R00J1
100.0
140.0
-
20
AlInGaP
HSMC-A101-S00J1
160.0
220.0
-
20
AlInGaP
HSMZ-A100-T00J1
250.0
350.0
-
20
AlInGaP
HSMC-A100-P30J1
40.0
-
100.0
20
AlInGaP
HSMC-A100-Q40J1
63.0
-
200.0
20
AlInGaP
HSMC-A101-R80J1
125.0
-
395.0
20
AlInGaP
HSMZ-A100-S80J1
200.0
-
620.0
20
AlInGaP
Part Number
Min. Iv (mcd)
Typ. Iv (mcd)
Max. Iv (mcd)
Test Current (mA)
Dice Technology
HSMJ-A100-Q00J1
63.0
100.0
-
20
AlInGaP
HSMJ-A101-S00J1
160.0
200.0
-
20
AlInGaP
HSMV-A100-T00J1
250.0
350.0
-
20
AlInGaP
HSMJ-A100-Q30J1
63.0
-
155.0
20
AlInGaP
HSMJ-A100-R40J1
100.0
-
315.0
20
AlInGaP
HSMJ-A101-R80J1
125.0
-
395.0
20
AlInGaP
HSMV-A100-S80J1
200.0
-
620.0
20
AlInGaP
Part Number
Min. Iv (mcd)
Typ. Iv (mcd)
Max. Iv (mcd)
Test Current (mA)
Dice Technology
HSMD-A100-J00J1
4.0
15.0
-
20
GaP
HSMD-A100-L00J1
10.0
15.0
-
20
GaP
HSMD-A100-J7PJ2
5.0
-
12.5
10
GaP
HSMD-A100-K4PJ2
6.3
-
20.0
10
GaP
HSML-A100-Q00J1
63.0
100.0
-
20
AlInGaP
HSML-A101-S00J1
160.0
220.0
-
20
AlInGaP
HSML-A100-Q7PJ1
80.0
-
200.0
20
AlInGaP
HSML-A100-R7PJ1
125.0
-
315.0
20
AlInGaP
HSML-A101-R8WJ1
125.0
-
395.0
20
AlInGaP
Red Orange
Orange
3
Device Selection Guide, continued
Yellow/Amber
Part Number
Min. Iv (mcd)
Typ. Iv (mcd)
Max. Iv (mcd)
Test Current (mA)
Dice Technology
HSMY-A100-J00J1
4.0
12.0
-
20
GaP
HSMY-A100-L00J1
10.0
12.0
-
20
GaP
HSMY-A100-J35J2
4.0
-
10.0
10
GaP
HSMY-A100-K45J2
6.3
-
20.0
10
GaP
HSMA-A100-Q00J1
63.0
100.0
-
20
AlInGaP
HSMA-A101-S00J1
160.0
220.0
-
20
AlInGaP
HSMU-A100-S00J1
160.0
320.0
-
20
AlInGaP
HSMA-A100-Q35J1
63.0
-
155.0
20
AlInGaP
HSMA-A100-R45J1
100.0
-
315.0
20
AlInGaP
HSMA-A101-R8WJ1
125.0
-
395.0
20
AlInGaP
HSMU-A100-S4WJ1
160.0
-
500.0
20
AlInGaP
Part Number
Min. Iv (mcd)
Typ. Iv (mcd)
Max. Iv (mcd)
Test Current (mA)
Dice Technology
HSMG-A100-J02J1
4.0
18.0
-
20
GaP
HSMG-A100-K72J2
8.0
-
20.0
10
GaP
HSME-A100-M02J1
16.0
70.0
-
20
AlInGaP
HSME-A100-N82J1
30.0
-
100.0
20
AlInGaP
Part Number
Min. Iv (mcd)
Typ. Iv (mcd)
Max. Iv (mcd)
Test Current (mA)
Dice Technology
HSMG-A100-H01J1
2.5
8.0
-
20
GaP
HSMG-A100-G31J2
1.6
-
4.0
10
GaP
HSMG-A100-H41J2
2.5
-
8.0
10
GaP
HSME-A100-L01J1
10.0
40.0
-
20
AlInGaP
HSME-A100-M3PJ1
16.0
-
40.0
20
AlInGaP
Part Number
Min. Iv (mcd)
Typ. Iv (mcd)
Max. Iv (mcd)
Test Current (mA)
Dice Technology
HSMM-A101-R00J1
100.0
200.0
-
20
InGaN
HSMM-A100-S00J1
160.0
350.0
-
20
InGaN
HSMM-A101-Q7PJ1
80.0
-
200.0
20
InGaN
HSMM-A101-R7PJ1
125.0
-
315.0
20
InGaN
HSMM-A101-R8PJ1
125.0
-
395.0
20
InGaN
HSMM-A100-S8PJ1
200.0
-
620.0
20
InGaN
Yellow Green
Emerald Green
Green
4
Device Selection Guide, continued
Cyan
Part Number
Min. Iv (mcd)
Typ. Iv (mcd)
Max. Iv (mcd)
Test Current (mA)
Dice Technology
HSMK-A101-R00J1
100.0
170.0
-
20
InGaN
HSMK-A100-S00J1
160.0
280.0
-
20
InGaN
HSMK-A100-S8WJ1
200.0
-
620.0
20
InGaN
HSMK-A101-Q3WJ1
63.0
-
155.0
20
InGaN
HSMK-A101-R4WJ1
100.0
-
315.0
20
InGaN
Part Number
Min. Iv (mcd)
Typ. Iv (mcd)
Max. Iv (mcd)
Test Current (mA)
Dice Technology
HSMB-A100-J00J1
4.0
15.0
-
20
GaN
HSMB-A100-J70J2
5.0
-
12.5
10
GaN
HSMB-A100-K80J2
8.0
-
25.0
10
GaN
HSMN-A101-N00J1
25.0
50.0
-
20
InGaN
HSMN-A100-P00J1
40.0
70.0
-
20
InGaN
HSMN-A101-N7YJ1
30.0
-
80.0
20
InGaN
HSMN-A101-N8YJ1
30.0
-
100.0
20
InGaN
HSMN-A100-P8YJ1
50.0
-
155.0
20
InGaN
Blue
Note:
1. The luminous intensity, I v, is measured at the mechanical axis of the lamp package. The actual peak of the spatial radiation pattern may not be
aligned with this axis.
5
Part Numbering System
HSM x 1 - A x2 x 3 x 4 - x 5x 6 x 7 x 8x 9
Packaging Option
Color Bin Selection
Intensity Bin Select
Device Specific Configuration
Package Type
LED Chip Color
Absolute Maximum Ratings (TA = 25°C)
Parameters
HSMS/D/Y/G
DC Forward Current[1]
30 mA
[2]
Peak Forward Current
100 mA
Power Dissipation
63 mW
Reverse Voltage
Junction Temperature
Operating Temperature
Storage Temperature
HSMH
30 mA
100 mA
60 mW
HSMC/J/L/A HSME
30 mA[3,4]
20 mA[3,4]
100 mA
100 mA
63 mW
48 mW
5V
110°C
–55°C to +100°C
–55°C to +100°C
Notes:
1. Derate linearly as shown in Figure 4.
2. Duty factor = 10%, Frequency = 1 kHz.
3. Drive current between 10 mA and 30 mA is recommended for best long term performance.
4. Operation at current below 5 mA is not recommended.
6
HSMZ/V/U
30 mA[3,4]
100 mA
72 mW
HSMM/K/B/N
30 mA
100 mA
114 mW
Optical Characteristics (TA = 25˚C)
Color
Red
Part Number
HSMS-A100
HSMH-A100
HSMC-A10x
HSMZ-A100
Red Orange
HSMJ-A10x
HSMV-A100
Orange
HSMD-A100
HSML-A10x
Amber
HSMY-A100
HSMA-A10x
HSMU-A100
Yellow Green HSMG-A100
HSME-A100
Emerald Green HSMG-A100
HSME-A100
Green
HSMM-A10x
Cyan
HSMK-A10x
Blue
HSMB-A100
HSMN-A10x
Dice
Technology
GaP
AlGaAs
AlInGaP
AlInGaP
AlInGaP
AlInGaP
GaP
AlInGaP
GaP
AlInGaP
AlInGaP
GaP
AlInGaP
GaP
AlInGaP
InGaN
InGaN
GaN
InGaN
Peak
Wavelength
λPEAK (nm)
Typ.
635
645
635
639
621
623
600
609
583
592
594
565
575
558
566
523
502
428
468
Dominant
Wavelength[1]
λD (nm)
Typ.
626
637
626
630
615
617
602
605
585
590
592
569
570
560
560
525
505
462
470
Viewing
Angle
2 θ1/2[2]
(Degrees)
Typ.
120
120
120
120
120
120
120
120
120
120
120
120
120
120
120
120
120
120
120
Luminous
Efficacy ηv[3]
(lm/W)
Typ.
120
63
150
155
240
263
380
320
520
480
500
590
560
650
610
500
300
65
75
Luminous
Intensity/
Total Flux
Iv(mcd)/Φv(mlm)
Typ.
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
Notes:
1. The dominant wavelength, λD, is derived from the CIE Chromaticity Diagram and represents the color of the device.
2. θ 1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity.
3. Radiant intensity, I e in watts/steradian, may be calculated from the equation Ie = Iv/ηv, where Iv is the luminous intensity in candelas and ηv is
the luminous efficacy in lumens/watt.
Electrical Characteristics (TA = 25˚C)
Part Number
HSMS/D/Y/G
HSMH
HSMC/J/L/A/E
HSMZ/V/U
HSMB
HSMM/K/N
7
Forward Voltage
VF (Volts) @ IF = 20 mA
Typ.
Max.
2.2
2.6
1.9
2.6
1.9
2.4
2.2
2.6
3.9
4.3
3.4
4.05
Reverse Voltage
VR @ 100 µA
Min.
5
5
5
5
—
—
Reverse Voltage
VR @ 10 µA
Min.
—
—
—
—
5
5
Thermal
Resistance
RθJP (°C/W)
180
180
280
280
280
280
1.0
RELATIVE INTENSITY
0.9
BLUE
EMERALD GREEN
CYAN
YELLOW GREEN
0.8
GREEN
0.7
AMBER
0.6
0.5
ORANGE
0.4
RED ORANGE
0.3
RED
0.2
0.1
0
380
430
530
480
580
630
680
730
780
WAVELENGTH – nm
35
GaP
EMERALD
GREEN
0.8
GaP
YELLOW
GREEN
0.6
FORWARD CURRENT – mA
RELATIVE INTENSITY
1.0
GaP YELLOW
GaP ORANGE
GaN BLUE
0.4
GaP RED
0.2
0
30
20
HSMH
15
530
480
580
630
680
730
HSMC/J/L/A/E
HSMM/K/N
10
HSMB
5
0
430
380
HSMS/D/Y/G
HSMZ/V/U
25
780
0
1
Figure 1. Relative intensity vs. wavelength.
35
GaN
1.0
0.8
0.6
HSMS/D/G/
Y/U/V/Z
25
HSMH
HSMC/J/L/A/E
20
HSMM/K/B/N
15
10
0.4
5
0.2
0
0
5
10
15
20
25
30
DC FORWARD CURRENT – mA
Figure 3. Relative intensity vs. forward
current.
8
DOMINANT WAVELENGTH – nm
InGaN
1.2
4
5
540
30
CURRENT – mA
RELATIVE LUMINOUS INTENSITY
(NORMALIZED AT 20 mA)
Gap
AlInGaP
AlGaAs
1.4
3
Figure 2. Forward current vs. forward voltage.
1.8
1.6
2
FORWARD VOLTAGE – V
WAVELENGTH – nm
35
0
0
20
40
60
80
100
TEMPERATURE – °C
Figure 4. Maximum forward current vs.
ambient temperature. Derated based on
T JMAX = 110˚C, Rθ JA = 500˚C/W.
120
530
GREEN
520
510
CYAN
500
490
480
BLUE
470
460
0
5
10
15
20
25
30
35
CURRENT – mA
Figure 5. Dominant wavelength vs. forward
current – InGaN devices.
1.0
0.4
NORMALIZED INTENSITY
DELTA VF (NORMALIZED AT 25°C)
0.5
0.3
0.2
0.1
GaP/AlGaAs/
AlInGaP
0
-0.1
0.8
0.6
0.4
0.2
-0.2
-0.3
-100
InGaN/GaN
-50
50
0
100
0
-90 -80 -70 -60 -50 -40 -30 -20 -10
150
0
10 20 30 40 50 60 70 80 90
ANGULAR DISPLACEMENT – DEGREES
TEMPERATURE – °C
Figure 6. Forward voltage shift vs. temperature.
Figure 7. Radiation Pattern.
10 to 20 SEC.
217 °C
240°C MAX.
3°C/SEC. MAX.
100-150°C
TEMPERATURE
TEMPERATURE
20 SEC. MAX.
183°C
–6°C/SEC.
MAX.
3°C/SEC.
MAX.
255 °C
+5 °C
-0 °C
3 °C/SEC. MAX.
125 °C ± 25 °C
6 °C/SEC. MAX.
MAX. 120 SEC.
60 to 150 SEC.
120 SEC. MAX. 60-150 SEC.
TIME
TIME
* THE TIME FROM 25 °C TO PEAK TEMPERATURE = 6 MINUTES MAX.
Figure 8a. Recommended SnPb reflow soldering profile.
Figure 8b. Recommended Pb-free reflow soldering profile.
4.50
1.50
LAMINAR WAVE
HOT AIR KNIFE
TURBULENT WAVE
TEMPERATURE – °C
250
2.60
200
150
FLUXING
100
;;
;;
;;
;;;
;;
BOTTOM SIDE
OF PC BOARD
50
30
TOP SIDE OF
PC BOARD
PREHEAT
0
10
20
30
40
50
60
70
80
90
TIME – SECONDS
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)
PREHEAT SETTING = 150°C (100°C PCB)
SOLDER WAVE TEMPERATURE = 245°C
AIR KNIFE AIR TEMPERATURE = 390°C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40°
SOLDER: SN63; FLUX: RMA
NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED
BEFORE EXERTING MECHANICAL FORCE.
100
SOLDER RESIST
Figure 9. Recommended wave soldering profile.
Figure 10. Recommended soldering pad pattern.
9
TRAILER
COMPONENT
LEADER
480 mm MIN. FOR ∅180 REEL.
960 mm MIN. FOR ∅330 REEL.
200 mm MIN. FOR ∅180 REEL.
200 mm MIN. FOR ∅330 REEL.
C
A
USER FEED DIRECTION
Figure 11. Tape leader and trailer dimensions.
4 ± 0.1
4 ± 0.1
2 ± 0.05
2.29 ± 0.1
1.75 ± 0.1
+0.1
∅1.5 –0
C
3.5 ± 0.05
+0.3
8 –0.1
3.81 ± 0.1
A
3.05 ± 0.1
+0.1
∅1 –0
8°
0.229 ± 0.01
Figure 12. Tape dimensions.
10
2 +0.5
–0
Ø 20.5 ± 0.3
62.5
180
+0
–2.5
Ø 13 ± 0.2
8.4
+1.50
(MEASURED AT OUTER EDGE)
–0.00
14.4 (MAX. MEASURED AT HUB)
LABEL AREA (111 mm x 57 mm)
WITH DEPRESSION (0.25 mm)
7.9 (MIN.)
10.9 (MAX.)
Figure 13. Reel dimensions.
USER FEED DIRECTION
CATHODE SIDE
PRINTED LABEL
Figure 14. Reeling orientation.
11
Baking is required under the following conditions:
a) the humidity indicator turns
pink
b) the pack has been opened for
more than four weeks.
Baking recommended condition:
60 ± 5˚C for 20 hours.
This product is qualified as Moisture Sensitive JEDEC Level 2A.
Intensity Bin Select (X5X6)
Individual reel will contain parts from
one half bin only.
Color Bin Select (X 7)
Individual reel will contain parts from
one full bin only.
X5
X7
0
Z
Y
W
V
U
T
S
Q
P
N
M
L
K
1
2
3
4
5
6
X6
0
3
4
5
7
8
9
Min Iv Bin
Full Distribution
3 half bins starting from X51
4 half bins starting from X51
5 half bins starting from X51
3 half bins starting from X52
4 half bins starting from X52
5 half bins starting from X52
Intensity Bin Limits
Bin ID
G1
G2
H1
H2
J1
J2
K1
K2
L1
L2
M1
M2
N1
N2
P1
P2
Q1
Q2
R1
R2
S1
S2
T1
T2
U1
U2
V1
V2
Min. (mcd)
1.80
2.24
2.80
3.55
4.50
5.60
7.20
9.00
11.20
14.00
18.00
22.40
28.50
35.50
45.00
56.00
71.50
90.00
112.50
140.00
180.00
224.00
285.00
355.00
450.00
560.00
715.00
900.00
Max. (mcd)
2.24
2.80
3.55
4.50
5.60
7.20
9.00
11.20
14.00
18.00
22.40
28.50
35.50
45.00
56.00
71.50
90.00
112.50
140.00
180.00
224.00
285.00
355.00
450.00
560.00
715.00
900.00
1125.00
Tolerance of each bin limit = ± 12%.
12
Full Distribution
A and B only
B and C only
C and D only
D and E only
E and F only
F and G only
G and H only
A, B, and C only
B, C, and D only
C, D, and E only
D, E, and F only
E, F, and G only
F, G, and H only
A, B, C, and D only
E, F, G, and H only
B, C, D, and E only
C, D, E, and F only
A, B, C, D, and E only
B, C, D, E, and F only
Color Bin Limits
Blue
A
B
C
D
Cyan
A
B
C
D
Min. (nm)
460.0
465.0
470.0
475.0
Min. (nm)
490.0
495.0
500.0
505.0
Max. (nm)
465.0
470.0
475.0
480.0
Max. (nm)
495.0
500.0
505.0
510.0
Color Bin Limits
Emerald
Green
A
B
C
D
Min. (nm)
552.5
555.5
558.5
561.5
Max. (nm)
555.5
558.5
561.5
564.5
Yellow
Green
E
F
G
H
Min. (nm)
564.5
567.5
570.5
573.5
Max. (nm)
567.5
570.5
573.5
576.5
Amber
A
B
C
D
E
F
Min. (nm)
582.0
584.5
587.0
589.5
592.0
594.5
Max. (nm)
584.5
587.0
589.5
592.0
594.5
597.0
Orange
A
B
C
D
E
Min. (nm)
597.0
600.0
603.0
606.0
609.0
Max. (nm)
600.0
603.0
606.0
609.0
612.0
Red Orange Min. (nm)
A
611.0
B
616.0
Max. (nm)
616.0
620.0
Red
Min. (nm)
Full Distribution
Max. (nm)
Tolerance of each bin limit = ± 1 nm.
Green
A
B
C
D
Min. (nm)
515.0
520.0
525.0
530.0
Max. (nm)
520.0
525.0
530.0
535.0
Packaging Option (X8X9)
Option
Test Current
Package Type
Reel Size
J1
20 mA
Top Mount
7 inch
J4
20 mA
Top Mount
13 inch
H1
20 mA
Reverse Mount
7 inch
H4
20 mA
Reverse Mount
13 inch
J2
10 mA
Top Mount
7 inch
J5
10 mA
Top Mount
13 inch
H2
10 mA
Reverse Mount
7 inch
H5
10 mA
Reverse Mount
13 inch
www.agilent.com/semiconductors
For product information and a complete list of
distributors, please go to our web site.
For technical assistance call:
Americas/Canada: +1 (800) 235-0312 or
(916) 788-6763
Europe: +49 (0) 6441 92460
China: 10800 650 0017
Hong Kong: (+65) 6756 2394
India, Australia, New Zealand: (+65) 6755 1939
Japan: (+81 3) 3335-8152 (Domestic/International), or 0120-61-1280 (Domestic Only)
Korea: (+65) 6755 1989
Singapore, Malaysia, Vietnam, Thailand,
Philippines, Indonesia: (+65) 6755 2044
Taiwan: (+65) 6755 1843
Data subject to change.
Copyright © 2004-2005 Agilent Technologies, Inc.
Obsoletes 5989-1207EN
May 15, 2005
5989-3100EN
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