HP HSMG-C110 Surface mount chip led Datasheet

Surface Mount Chip LEDs
Technical Data
HSMx-C190/C170/
C150/C110
Features
Description
•
•
•
•
•
These chip LEDs are designed
in an industry standard package
for ease of handling and use. Five
different LED colors are available
in four compact, single color
packages.
Small Size
Industry Standard Footprint
Compatible with IR Solder
Diffused Optics
Operating Temperature
Range of -30°C to +85°C
• Right Angle Package
Available
• Five Colors Available
• Available in 8 mm Tape on
7 in. (178 mm) Diameter
Reels
Applications
•
•
•
•
•
Keypad Backlighting
Push-Button Backlighting
LCD Backlighting
Symbol Backlighting
Front Panel Indicator
The HSMx-C150 has the industry
standard 3.2 x 1.6 mm footprint
that is excellent for all around use.
The HSMx-C170 has the widely
used 2.0 x 1.25 mm footprint.
The HSMx-C190 has the industry
standard 1.6 x 0.8 mm footprint,
its low 0.8 mm profile and wide
viewing angle make this LED
exceptional for backlighting
applications.
The HSMx-C110 is a rightangle package with the universally accepted dimensions of
3.2 x 1.0 x 1.5 mm. This part is
ideal for LCD backlighting and
sidelighting applications.
All packages are compatible with
IR reflow solder processes. The
small size and wide viewing angle
make these LEDs prime choices
for backlighting applications and
front panel illumination especially
where space is a premium.
Device Selection Guide
Footprint
(mm)
3.20 x 1.60
2.00 x 1.25
1.60 x 0.80
3.20 x 1.00[1]
HER
HSMS-C150
HSMS-C170
HSMS-C190
HSMS-C110
Note: Right-angle package
Orange
HSMD-C150
HSMD-C170
HSMD-C190
HSMD-C110
Yellow
HSMY-C150
HSMY-C170
HSMY-C190
HSMY-C110
Green
HSMG-C150
HSMG-C170
HSMG-C190
HSMG-C110
AS AlGaAs
Red
HSMH-C150
HSMH-C170
HSMH-C190
HSMH-C110
Part per
Reel
3000
4000
4000
3000
2
Package Dimensions
CATHODE (ANODE MARK FOR
MARK
HSMH-C170)
CATHODE (ANODE MARK FOR
HSMH-C150)
MARK
LED DIE
LED DIE
1.25 (0.049)
1.6 (0.063)
0.8 (0.031)
0.62 (0.024)
2.0 (0.079 )
3.2 (0.126 )
DIFFUSED
EPOXY
POLARITY[3]
2.0 (0.079)
0.6 (0.024)
POLARITY[3]
1.4
(0.055)
DIFFUSED
EPOXY
0.3 (0.012)
1.1 (0.043)
PC BOARD
PC BOARD
0.8 (0.031)
CATHODE LINE
0.5 (0.020)
0.50 ± 0.2
(0.020 ± 0.008)
0.50 ± 0.2
(0.020 ± 0.008)
0.3 (0.012)
CATHODE LINE
0.4 ± 0.15
(0.016 ± 0.006)
0.4 ± 0.15
(0.016 ± 0.006)
SOLDERING
TERMINAL
SOLDERING
TERMINAL
HSMx-C150
HSMx-C170
CATHODE (ANODE MARK FOR
HSMH-C190)
MARK
LED DIE
CATHODE (ANODE MARK
MARK
FOR HSMH-C110)
LED DIE
1.0 (0.039)
0.8 (0.031)
2.6 (0.102 )
0.4 (0.016)
1.6
(0.063 )
3.2 (0.126 )
1.0
(0.039)
POLARITY[3]
POLARITY
CLEAR
EPOXY
1.5 (0.059)
0.3 (0.012)
PC BOARD
DIFFUSED EPOXY
PC BOARD
0.5 (0.020)
CATHODE LINE
1.6 (0.063 )
0.8 (0.031)
0.3 (0.012)
0.3 ± 0.15
(0.012 ± 0.006)
0.3 ± 0.15
(0.012 ± 0.006)
CATHODE LINE
0.9 (0.035)
1.0 (0.039)
0.7 (0.028) MIN.
SOLDERING
TERMINAL
HSMx-C190
Notes:
1. All dimensions in millimeters (inches).
2. Tolerance is ± 0.1 mm (± 0.004 in.) unless otherwise specified.
3. Polarity for HSMH-C1 x 0 will be the opposite of what is shown on above drawings.
SOLDERING
TERMINAL
HSMx-C110
3
Absolute Maximum Ratings at TA=25°C for HER, Orange, Yellow and Green
Parameter
DC Forward Current[1]
Peak Pulsing Current[2]
Power Dissipation
Reverse Voltage (IR=100 µA)
LED Junction Temperature
Operating Temperature Range
Storage Temperature Range
Soldering Temperature
HSMx-C150
25
100
65
5
95
-30 to +85
-40 to +85
HSMx-C170 HSMx-C190 HSMx-C110
20
20
25
100
100
100
52
52
65
5
5
5
95
95
95
-30 to +85
-30 to +85
-30 to +85
-40 to +85
-40 to +85
-40 to +85
See IR soldering profile (Figure 7)
Units
mA
mA
mW
V
°C
°C
°C
Absolute Maximum Ratings at TA=25°C for AS AlGaAs Red
Parameter
DC Forward Current[1]
Peak Pulsing Current[2]
Power Dissipation
Reverse Voltage (IR =100µA)
LED Junction Temperature
Operating Temperature Range
Storage Temperature Range
Soldering Temperature
HSMx-C150
30
100
78
5
95
-30 to +85
-40 to +85
HSMx-C170 HSMx-C190 HSMx-C110
25
25
30
100
100
100
65
65
78
5
5
5
95
95
95
-30 to +85
-30 to +85
-30 to +85
-40 to +85
-40 to +85
-40 to +85
See IR soldering profile (Figure 7)
Units
mA
mA
mW
V
°C
°C
°C
Notes:
1. Derate linearly as shown in Figure 4 for temperature above 25°C.
2. Pulse condition of 1/10 duty and 0.1 msec. width.
Electrical Characteristics at TA=25 °C
Part Number
HSMS-C150/110
HSMS-C170/190
HSMD-C150/110
HSMD-C170/190
HSMY-C150/110
HSMY-C170/190
HSMG-C150/110
HSMG-C170/190
HSMH-C150/110
HSMH-C170/190
Color
HER
Forward Voltage
VF(Volts)
@ IF = 20 mA
Typ.
Max.
2.1
2.6
Reverse
Breakdown
VR(Volts)
@ IR = 100 µA
Min.
5
Capacitance
C(pF),
@ VF = 0 V,
f = 1 MHz
Typ.
5
Orange
2.2
2.6
5
7
Yellow
2.1
2.6
5
6
Green
2.2
2.6
5
9
AlGaAs
1.8
2.6
5
18
Thermal
Resistance
RθJ-P ( °C/W)
Typ.
400
250
400
250
400
250
400
250
460
300
4
Optical Characteristics at TA =25°C
Part Number
Color
HSMS-C150/170/190
HSMD-C150/170/190
HSMY-C150/170/190
HSMG-C150/170/190
HSMH-C150/170/190
HSMS-C110
HSMD-C110
HSMY-C110
HSMG-C110
HSMH-C110
HER
Orange
Yellow
Green
AlGaAs
HER
Orange
Yellow
Green
AlGaAs
Luminous
Intensity[1]
Iv(mcd)@20mA
Min.
Typ.
2.50
10.0
2.50
8.0
2.50
8.0
4.00
15.0
6.30
17.0
2.50
11.0
2.50
9.0
2.50
9.0
4.00
16.0
6.30
19.0
Peak
Wavelength
l peak(nm)
Typ.
630
605
589
570
660
630
605
589
570
660
Dominant
Wavelength
l d(nm)
Typ.
626
604
586
572
639
626
604
586
572
639
Viewing
Angle 2u1/2(°) [2]
Typ.
170
170
170
170
170
130
130
130
130
130
Notes:
1. The luminous intensity, Iv, is measured at the peak of the spatial radiation pattern, which may not be aligned with the mechanical
axis of the lamp package.
2. u1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity.
Color Bin Limits[1]
Green Color Bins[1]
Dom. Wavelength (nm)
Min.
Max.
561.5
564.5
564.5
567.5
567.5
570.5
570.5
573.5
573.5
576.5
Bin ID
A
B
C
D
E
Tolerance: ± 0.5 nm
Yellow/Amber Color Bins[1]
Bin ID
A
B
C
D
E
F
Dom. Wavelength (nm)
Min.
Max.
582.0
584.5
584.5
587.0
587.0
589.5
589.5
592.0
592.0
594.5
594.5
597.0
Tolerance: ± 0.5 nm
Orange Color Bins[1]
Bin ID
A
B
C
D
E
F
Tolerance: ± 1 nm
Dom. Wavelength (nm)
Min.
Max.
597.0
600.0
600.0
603.0
603.0
606.0
606.0
609.0
609.0
612.0
612.0
615.0
5
Light Intensity (Iv) Bin Limits[1]
Intensity
Min.
0.11
0.18
0.29
0.45
0.72
1.10
1.80
2.80
4.50
7.20
11.20
18.00
Bin ID
A
B
C
D
E
F
G
H
J
K
L
M
(mcd)
Max.
0.18
0.29
0.45
0.72
1.10
1.80
2.80
4.50
7.20
11.20
18.00
28.50
Bin ID
N
P
Q
R
S
T
U
V
W
X
Y
Intensity
Min.
28.50
45.00
71.50
112.50
180.00
285.00
450.00
715.00
1125.00
1800.00
2850.00
(mcd)
Max.
45.00
71.50
112.50
180.00
285.00
450.00
715.00
1125.00
1800.00
2850.00
4500.00
Note:
1. Bin categories are established for classification of products. Products may not
be available in all categories. Please contact your Agilent representative for information on currently available bins.
Tolerance: ± 15%
1.0
RELATIVE INTENSITY
GREEN
AlGaAs
YELLOW
0.5
ORANGE
0
500
HER
550
600
650
700
750
WAVELENGTH – nm
1.6
AlGaAs
HER
AlGaAs
GREEN
10
1
YELLOW
0.1
LUMINOUS INTENSITY
(NORMALIZED AT 20 mA)
IF – FORWARD CURRENT – mA
100
1.2
0.8
0.4
GaP
ORANGE
1.5
1.7
1.9
2.1
VF – FORWARD VOLTAGE – V
Figure 2. Forward Current vs.
Forward Voltage.
2.3
0
0
10
20
30
IF – FORWARD CURRENT – mA
Figure 3. Luminous Intensity vs.
Forward Current.
40
IF MAX. – MAXIMUM FORWARD CURRENT – mA
Figure 1. Relative Intensity vs. Wavelength.
35
C150/C110
HER,
ORANGE,
YELLOW,
GREEN
C170/C190
AlGaAs
C150/C110
AlGaAs
30
25
20
RθJ-A =
600°C/W
C170/C190
HER,
ORANGE,
YELLOW,
GREEN
15
10
RθJ-A =
800°C/W
5
0
0
20
40
60
80
100
TA – AMBIENT TEMPERATURE – °C
Figure 4. Maximum Forward Current
vs. Ambient Temperature.
6
1.00
RELATIVE INTENSITY – %
0.90
0.80
0.70
0.60
0.50
0.40
0.30
0.20
0.10
0
-90 -80 -70 -60 -50 -40 -30 -20 -10
0
10 20 30 40 50 60 70 80 90
ANGLE
1.00
RELATIVE INTENSITY – %
0.90
0.80
0.70
0.60
0.50
0.40
0.30
0.20
0.10
0
-90 -80 -70 -60 -50 -40 -30 -20 -10
0
10 20 30 40 50 60 70 80 90
ANGLE
Figure 5. Relative Intensity vs. Angle for HSMx-C110.
1.00
0.70
10 SEC. MAX.
0.60
TEMPERATURE
RELATIVE INTENSITY – %
0.90
0.80
0.50
0.40
0.30
0.20
0.10
0
-90 -80 -70 -60 -50 -40 -30 -20 -10
230°C MAX.
4°C/SEC. MAX.
140-160°C
4°C/SEC.
MAX.
3°C/SEC. MAX.
OVER 2 MIN.
0
10 20 30 40 50 60 70 80 90
TIME
ANGLE
Figure 6. Relative Intensity vs. Angle for HSMx-C150, C170 and C190.
Note: All dimensions in millimeters (inches).
Figure 7. Recommended Reflow Soldering
Profile.
7
0.8 (0.031)
1.5 (0.059)
1.2 (0.047)
1.2
(0.047)
1.5
(0.059)
2.0
(0.079)
1.5
(0.059)
1.2
(0.047)
0.9
(0.035)
Figure 8. Recommended Soldering
Pattern for HSMx-C150.
0.8
(0.031)
0.8
(0.031)
0.7
(0.028)
Figure 9. Recommended Soldering
Pattern for HSMx-C170.
Figure 10. Recommended Soldering
Pattern for HSMx-C190.
USER FEED DIRECTION
5.0 (0.200)
0.9 (0.035)
0.9 (0.035)
1.0 (0.039)
CATHODE SIDE
0.2 (0.008)
CENTERING
BOARD
1.5
(0.059)
2.0
(0.079)
1.5
(0.059)
PRINTED LABEL
Figure 11. Recommended Soldering Pattern for
HSMx-C110.
Figure 12. Reeling Orientation.
8.0 ± 1.0 (0.315 ± 0.039)
10.50 ± 1.0 (0.413 ± 0.039)
Ø 20.20 MIN.
(Ø 0.795 MIN.)
Ø 13.1 ± 0.5
(Ø 0.516 ± 0.020)
3.0 ± 0.5
(0.118 ± 0.020)
59.60 ± 1.00
(2.346 ± 0.039)
178.40 ± 1.00
(7.024 ± 0.039)
4.0 ± 0.5
(0.157 ± 0.020)
6
PS
Figure 13. Reel Dimensions.
Note: All dimensions in millimeters (inches).
5.0 ± 0.5
(0.197 ± 0.020)
4.00 (0.157)
DIM. C
(SEE TABLE 1)
CATHODE
1.50 (0.059)
0.20 ± 0.05
(0.008 ± 0.002)
1.75 (0.069)
3.50 ± 0.05
(0.138 ± 0.002)
DIM. A
(SEE TABLE 1)
8.00 ± 0.30
(0.315 ± 0.012)
DIM. B
(SEE TABLE 1)
2.00 ± 0.05
(0.079 ± 0.002)
CARRIER TAPE
USER FEED
DIRECTION
4.00 (0.157)
COVER TAPE
TABLE 1
DIMENSIONS IN MILLIMETERS (INCHES)
DIM. A
DIM. B
DIM. C
± 0.10 (0.004) ± 0.10 (0.004) ± 0.10 (0.004)
HSMx-C110
POSITION IN
CARRIER TAPE
HSMx-C150 SERIES
3.75 (0.148)
2.10 (0.083)
1.30 (0.051)
DIM. A
(SEE TABLE 1)
HSMx-C170 SERIES
HSMx-C190 SERIES
HSMx-C110 SERIES
2.40 (0.094)
1.80 (0.071)
3.40 (0.134)
1.60 (0.063)
0.95 (0.037)
1.70 (0.067)
1.20 (0.047)
0.87 (0.034)
1.20 (0.047)
PART NUMBER
R 1.0 ± 0.05
(0.039 ± 0.002)
DIM. B
(SEE TABLE 1)
Figure 14. Tape Dimensions.
END
THERE SHALL BE A
MINIMUM OF 160 mm
(6.3 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
START
MOUNTED WITH
COMPONENTS
THERE SHALL BE A
MINIMUM OF 160 mm
(6.3 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
Figure 15. Tape Leader and Trailer Dimensions.
Notes:
1. All dimensions in millimeters (inches).
2. Tolerance is ± 0.1 mm (± 0.004 in.)unless otherwise specified.
Convective IR Reflow
Soldering
For more information on IR
reflow soldering, refer to
Application Note 1060, Surface
Mounting SMT LED Indicator
Components.
MINIMUM OF
230 mm
(9.05 INCH)
MAY CONSIST
OF CARRIER
AND/OR
COVER TAPE.
Storage Condition: 5 to 30˚ C
@ 60% RH max.
Baking is required under the
condition:
a) the blue silica gel indicator
becoming white/transparent color
b) the pack has been opened for
more than 1 week
Baking recommended condition:
60 +/– 5˚C for 20 hours.
www.agilent.com/semiconductors
For product information and a complete list of
distributors, please go to our web site.
For technical assistance call:
Americas/Canada: +1 (800) 235-0312 or
(408) 654-8675
Europe: +49 (0) 6441 92460
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Hong Kong: (+65) 6271 2451
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Korea: (+65) 6271 2194
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Taiwan: (+65) 6271 2654
Data subject to change.
Copyright © 2002 Agilent Technologies, Inc.
Obsoletes 5988-1858EN
April 30, 2002
5988-6271EN
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