AVAGO HSMN-A400-S8QM2 Smt led surface mount led indicator high brightness using alingap and ingan dice Datasheet

HSMx-A4xx-xxxxx
SMT LED Surface Mount LED Indicator
Data Sheet
Description
Features
Avago Power PLCC-4 is an extension of our PLCC‑2 SMT
LEDs. The package can be driven at higher current due to
its superior package design. The product is able to dissipate heat more efficiently compared to the conventional
PLCC-2 SMT LEDs. In proportion to the increase in driving
current, this family of LEDs is able to produce higher light
output compared to the conventional PLCC-2 SMT LEDs.
• Industry standard PLCC-4
• High reliability LED package
• High brightness using AlInGaP and InGaN dice
technologies
• High optical efficiency
• Higher ambient temperature at the same current
possible compared to PLCC-2
• Available in full selection of colors
• Super wide viewing angle at 120˚
• Available in 8mm carrier tape on 7-inch reel
• Compatible with both IR and TTW soldering process
• JEDEC MSL 2a
• High reliability LED package due to enhanced silicone
resin material for InGaN family
These SMT LEDs have higher reliability and better performance and are designed to work under a wide range of
environmental conditions. This higher reliability makes
them suitable for use under harsh environment and conditions like automotive. In addition, they are also suitable
to be used in electronic signs and signals.
To facilitate easy pick and place assembly, the LEDs are
packed in EIA-compliant tape and reel. Every reel will be
shipped in single intensity and color bin (except for red
color), to provide close uniformity.
These LEDs are compatible with IR solder reflow process.
Due to the high reliability feature of these products, they
also can be mounted using through-the-wave soldering
process.
There are a variety of colors and various viewing angles
(30°, 60° and 120°) available in these SMT LEDs. Ideally, the
30° parts are suitable for light piping where focused intensities are required. As for the 60° and 120°, they are most
suitable for automotive interior and exterior lighting and
electronic signs applications.
Applications
• Interior automotive
– Instrument panel backlighting
– Central console backlighting – Cabin backlighting
– Navigation and audio system – Dome lighting
– Push button backlighting
• Exterior automotive
– Turn signals
– CHMSL
– Rear combination lamp
– Puddle light
• Electronic signs and signals
– Interior full color sign
– Variable message sign
• Office automation, home appliances, industrial
equipment
– Front panel backlighting
– Push button backlighting
– Display backlighting
CAUTION: HSMN-, HSMK-, HSMM-A40x-xxxxx LEDs are Class 2 ESD sensitive. Please observe appropriate
precautions during handling and processing. Refer to Avago Application Note AN-1142 for additional details.
Package Dimensions
2.8 ± 0.2
1.9 ± 0.2
2.2 ± 0.2
0.1 TYP.
A
0.8 ± 0.1
C
3.2 0.2
3.5 0.2
0.8 0.3
C
C
0.5 ± 0.1
0.7 0.1
CATHODE MARKING
NOTES:
ALL DIMENSIONS IN mm.
ELECTRICAL CONNECTION BETWEEN ALL CATHODES IS RECOMMENDED.
Device Selection Guide
Color
Part Number
Min. IV (mcd)
Max. IV (mcd)
Test Current (mA)
Dice Technology
Red
HSMC-A400-S30M1
180.00
355.00
50
AlInGaP
HSMC-A401-U80M1
560.00
1400.00
50
AllnGaP
HSMJ-A401-T40M1
285.00
715.00
50
AlInGaP
Red Orange
HSMJ-A401-U40M1
450.00
1125.00
50
AlInGaP
Orange
HSML-A401-U40M1
450.00
1125.00
50
AlInGaP
Amber
HSMA-A401-U45M1
450.00
1125.00
50
AlInGaP
Emerald Green
HSME-A401-P4PM1
45.00
112.50
50
AlInGaP
Blue
HSMN-A400-S8QM2
224.00
560.00
30
InGaN
HSMN-A400-S8PM2
224.00
560.00
30
InGaN
HSMN-A400-S4QM2
180.00
450.00
30
InGaN
HSMM-A400-U4QM2
450.00
1125.00
30
InGaN
HSMM-A400-V8QM2
900.00
2240.00
30
InGaN
Green
Notes:
1. The luminous intensity IV, is measured at the mechanical axis of the lamp package. The actual peak of the spatial radiation pattern may not be
aligned with this axis.
2. IV tolerance = ±12 %.
2
Part Numbering System
HSM x1 – A x2 x3x4 – x5x6 x7 x8x9
Packaging Option
Color Bin Selection
Intensity Bin Select
Device Specific Configuration
Package Type
LED Chip Color
Absolute Maximum Ratings (TA = 25°C)
Parameters
HSMC/J/L/A/E
HSMZ/V/U
HSMM/K/N
DC Forward Current[1]
70 mA[3,4]
70 mA[3,4]
30 mA
Peak Forward Current [2]
200 mA
200 mA
90 mA
Power Dissipation
180 mW
240 mW
114 mW
Reverse Voltage
Junction Temperature
5V
110°C
Operating Temperature
–40°C to +100°C
Storage Temperature
–40°C to +100°C
Notes:
1. Derate linearly as shown in figure 5.
2. Duty factor = 10%, Frequency = 1 kHz.
3. Drive current between 10 mA and 70 mA is recommended for best long-term performance.
4. Operation at currents below 5 mA is not recommended.
3
Optical Characteristics (TA = 25°C)
Part
Color
Number
Peak
Wavelength
λPEAK (nm)
Typ.
Dominant
Wavelength
Viewing Angle
λD[1] (nm)
2θ1/2[2] (Degrees)
Typ.
Typ.
Luminous
Efficacy ηv[3]
(lm/W)
Typ.
Luminous Intensity/
Total Flux
Iv (mcd)/Φv (mlm)
Typ.
Red
HSMC
635
626
120
150
0.45
HSMZ
639
630
120
155
0.45
HSMJ
621
615
120
240
0.45
Red Orange
HSMV
623
617
120
263
0.45
Orange
HSML
609
605
120
320
0.45
Amber
HSMA
592
590
120
480
0.45
HSMU
594
592
120
500
0.45
Yellow Green
HSME
576
575
120
560
0.45
Emerald Green
HSME
568
567
120
610
0.45
Green
HSMM
518
525
120
500
0.45
Cyan
HSMK
502
505
120
300
0.45
Blue
HSMN
468
470
120
75
0.45
Notes:
1. The dominant wavelength, λD, is derived from the CIE Chromaticity Diagram and represents the color of the device.
2. θ1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity.
3. Radiant intensity, Ie in watts/steradian, may be calculated from the equation Ie = Iv/ηv, where Iv is the luminous intensity in candelas and ηv is the
luminous efficacy in lumens/watt.
Electrical Characteristics (TA = 25°C)
Part Number
Forward Voltage
VF (Volts) @ IF = 50 mA
Typ.
Max.
Reverse Voltage
VR @ 100 µA
Min.
HSMC/J/L/A/E
2.2
2.5
5
HSMZ/V/U
2.8
3.4
5
Part Number
Forward Voltage
VF (Volts) @ IF = 30 mA
Typ.
Max.
Reverse Voltage
VR @ 10 µA
Min.
HSMM/K/N
3.8
5
1.0
0.9
RELATIVE INTENSITY
0.8
0.7
4.6
BLUE
EMERALD GREEN
CYAN
YELLOW GREEN
GREEN
AMBER
0.6
0.5
ORANGE
0.4
RED ORANGE
0.3
RED
0.2
0.1
0
380
430
480
530
580
630
WAVELENGTH – nm
Figure 1. Relative intensity vs. wavelength
4
HSMx-Axxxx fig 1
680
730
780
70
1.2
60
HSMC/J/L/A/E
HSMZ/V/U
50
40
30
20
10
0
1.0
0.8
0.6
0.4
0.2
HSMM/K/N
0
1
2
3
4
1.2
RELATIVE LUMINOUS INTENSITY
(NORMALIZED AT 30 mA)
1.4
RELATIVE INTENSITY
(NORMALIZED AT 50 mA)
FORWARD CURRENT – mA
80
0
5
FORWARD VOLTAGE – V
1.0
0.8
0.6
0.4
0.2
0
0
10
20
30
40
50
60
70
80
5
0
FORWARD CURRENT – mA
Figure 2. Forward current vs. forward voltage
Figure 3. Relative intensity vs. forward current
(AlInGaP)
10
15
20
25
30
35
FORWARD CURRENT – mA
Figure 4. Relative intensity vs. forward current
(InGaN)
HSMx-Axxxx fig 3
35
70
60
300C/W
350C/W
50
40
470C/W
30
20
10
0
0
40
20
60
80
100
120
540
30
300C/W
25
350C/W
20
470C/W
15
10
5
0
0
20
40
60
80
Figure 5a. Maximum forward current vs. ambient temperature, derated based on TJmax =
110°C (AlInGaP)
0.9
RELATIVE INTENSITY
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
-50
-30
-10
10
ANGLE – DEGREES
Figure 7. Radiation pattern
HSMx-Axxxx fig 7
5
120
Figure 5b. Maximum forward current vs. ambient temperature, derated based on TJmax =
110°C (InGaN)
1.0
-70
100
AMBIENT TEMPERATURE – C
AMBIENT TEMPERATURE – C
0
-90
DOMINANT WAVELENGTH – nm
MAXIMUM FORWARD CURRENT – mA
MAXIMUM FORWARD CURRENT – mA
80
30
50
70
90
530
InGaN GREEN
520
510
500
InGaN CYAN
490
480
InGaN BLUE
470
460
0
5
10
15
20
25
30
CURRENT – mA
Figure 6. Dominant wavelength vs. forward
current – InGaN devices
HSMx-Axxxx fig 6
35
X
2.60
(0.103)
X
0.40 (0.016)
1.10
(0.043)
0.50
(0.020)
Y
4.50 (0.178)
1.50 (0.059)
Y
DIMENSIONS IN mm (INCHES).
SOLDER RESIST
REPRESENTS ELECTRICAL
CONNECTIVITY BETWEEN PADS
Figure 8a. Recommended soldering pad pattern
X
0.5 (0.020)
6.1 (0.240)
2.8 (0.110)
Y
2.0 (0.079)
6.0 (0.236)
3.0 (0.118)
Thermal Resistance
300°C/W
350°C/W
470°C/W
Y
REPRESENTS ELECTRICAL
CONNECTIVITY BETWEEN PADS
Solder Pad Area (xy)
>16 mm2
>12 mm2
>8 mm2
Figure 8b. Recommended soldering pad pattern (TTW)
6
1.0 (0.039)
2.0 (0.079)
DIMENSIONS IN mm (INCHES).
X
10 to 20 SEC.
+5 °C
255 °C
-0 °C
217 °C
TEMPERATURE
3 °C/SEC. MAX.
125 °C ± 25 °C
6 °C/SEC. MAX.
60 to 150 SEC.
MAX. 120 SEC.
TIME
Figure
Recommended
profile. = 6 MINUTES MAX.
* THE9.TIME
FROM 25Pb-free
°C TO reflow
PEAK soldering
TEMPERATURE
Note: For detailed information on reflow soldering of Avago surface mount LEDs,
refer to Avago Application Note AN 1060 Surface Mounting SMT LED Indicator Components.
LAMINAR WAVE
HOT AIR KNIFE
TURBULENT WAVE
250
BOTTOM SIDE
OF PC BOARD
TEMPERATURE – C
200
TOP SIDE OF
PC BOARD
150
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)
PREHEAT SETTING = 150C (100C PCB)
SOLDER WAVE TEMPERATURE = 245C
AIR KNIFE AIR TEMPERATURE = 390C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40
SOLDER: SN63; FLUX: RMA
FLUXING
100
50
30
NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED
BEFORE EXERTING MECHANICAL FORCE.
PREHEAT
0
10
20
30
40
50
60
70
TIME – SECONDS
Figure 10. Recommended wave soldering profile
ID
Note : Diameter "ID" should
be bigger than 2.3mm
Figure 11. Recommended Pick and Place Nozzle Size for InGaN Family
7
80
90
100
TRAILER
COMPONENT
LEADER
480 mm MIN. FOR Ø180 REEL.
960 mm MIN. FOR Ø330 REEL.
200 mm MIN. FOR Ø180 REEL.
200 mm MIN. FOR Ø330 REEL.
C
A
USER FEED DIRECTION
Figure 12. Tape leader and trailer dimensions
Ø1.5
+0.1
–0
4 ± 0.1
2 ± 0.05
B
3.6 ± 0.1
1.75 ± 0.1
5.5 ± 0.05
A
C
C
C
A
A
3.8 ± 0.1
12
Ø1
8 ± 0.1
+0.1
–0
+0.3
–0.1
B
0.229 ± 0.01
3.45 ± 0.1
VIEW B-B
VIEW A-A
ALL DIMENSIONS IN mm.
Figure 13. Tape dimensions
USER FEED DIRECTION
CATHODE SIDE
PRINTED LABEL
Figure 14. Reeling orientation
8
Intensity Bin Select (X5X6)
Color Bin Select (X7)
X5
X7
Individual reel will contain parts from one half bin only.
Min. Iv Bin
Individual reel will contain parts from one full bin only.
0
Full Distribution
X6
Z
A and B only
0
Full Distribution
Y
B and C only
2
2 half bins starting from X51
3
3 half bins starting from X51
W
C and D only
4
4 half bins starting from X51
V
D and E only
5
5 half bins starting from X51
U
E and F only
6
2 half bins starting from X52
T
F and G only
7
3 half bins starting from X52
S
G and H only
8
4 half bins starting from X52
Q
A, B and C only
9
5 half bins starting from X52
P
B, C and D only
N
C, D and E only
M
D, E and F only
L
E, F and G only
K
F, G and H only
Intensity Bin Limits
1
A, B, C and D only
Bin ID
Min. (mcd)
Max. (mcd)
2
E, F, G and H only
N1
28.50
35.50
3
B, C, D and E only
N2
35.50
45.00
4
C, D, E and F only
P1
45.00
56.00
P2
56.00
71.50
5
A, B, C, D and E only
Q1
71.50
90.00
6
B, C, D, E and F only
Q2
90.00
112.50
R1
112.50
140.00
R2
140.00
180.00
S1
180.00
224.00
S2
224.00
285.00
T1
285.00
355.00
T2
355.00
450.00
U1
450.00
560.00
U2
560.00
715.00
V1
715.00
900.00
V2
900.00
1125.00
W1
1125.00
1400.00
W2
1400.00
1800.00
X1
1800.00
2240.00
X2
2240.00
2850.00
Tolerance of each bin limit = ± 12%
9
Color Bin Limits
Color Bin Limits
Blue
Min. (nm)
Max. (nm)
Orange
Min. (nm)
Max. (nm)
A
460.0
465.0
A
597.0
600.0
B
465.0
470.0
B
600.0
603.0
C
470.0
475.0
C
603.0
606.0
D
475.0
480.0
D
606.0
609.0
E
609.0
612.0
Cyan
Min. (nm)
Max. (nm)
A
490.0
495.0
B
495.0
500.0
Red
Orange
Min. (nm)
Max. (nm)
611.0
616.0
C
500.0
505.0
A
D
505.0
510.0
B
616.0
620.0
Green
Min. (nm)
Max. (nm)
Red
Min. (nm)
Max. (nm)
A
515.0
520.0
Full Distribution
B
520.0
525.0
Tolerance of each bin limit = ± 1 nm
C
525.0
530.0
D
530.0
535.0
Emerald
Green
Min. (nm)
Max. (nm)
Packaging Option (X8X9)
Test
Current
Package
Type
Reel
Size
A
552.5
555.5
Option
B
555.5
558.5
M1
50 mA
Top Mount
7 inch
C
558.5
561.5
M2
30 mA
Top Mount
7 inch
D
561.5
564.5
Yellow
Green
Min. (nm)
Max. (nm)
E
564.5
567.5
F
567.5
570.5
Forward Voltage Bin Table
For HSMZ/V/U – A4xx-xxxxx only
G
570.5
573.5
H
573.5
576.5
BIN
MIN.
MAX.
VA
1.9
2.2
VB
2.2
2.5
VC
2.5
2.8
Amber/
Yellow
Min. (nm)
Max. (nm)
A
582.0
584.5
VD
2.8
3.1
B
584.5
587.0
VE
3.1
3.4
C
587.0
589.5
Tolerance of each bin limit = ± 0.1
D
589.5
592.0
E
592.0
594.5
F
594.5
597.0
10
Moisture Sensitivity
This product is qualified as Moisture Sensitive Level 2a per
JEDEC J-STD-020. Precaution when handling this moisture
sensitive product is important to ensure the reliability of
the product. Refer to Avago Application Note AN 5305
Handling of Moisture Sensitive Surface Mount Devices for
details.
D. Control of assembled boards
A. Storage before use
E. Baking is required if:
– Unopen moisture barrier bag (MBB) can be stored at
<40°C/90% RH for 12 months. If the actual shelf life
has exceeded 12 months and the HIC indicates that
baking is not required, then it is safe to reflow the
LEDs per the original MSL rating.
– It is not recommended to open the MBB prior to
assembly (e.g., for IQC).
B. Control after opening the MBB
– The humidity indicator card (HIC) shall be read
immediately upon opening of MBB.
– The LEDs must be kept at <30°C/60% RH at all
times and all high temperature related processes,
including soldering, curing or rework, need to be
completed within 672 hours.
C. Control of unfinished reel
– If the PCB soldered with the LEDs is to be subjected
to other high temperature processes, the PCB
needs to be stored in sealed MBB with desiccant
or in desiccator at <5% RH to ensure no LEDs have
exceeded their floor life of 672 hours.
– “10%” is Not blue and “5%” HIC indicator turns pink.
– The LEDs are exposed to conditions of >30°C/60%
RH at any time.
– The LEDs' floor life exceeds 672 hours.
Recommended baking conditions: 60±5°C for 20 hours.
Handling Precautions
The encapsulation material of the InGaN family product
is made of silicone for better reliability of the product.
As silicone is a soft material, please do not press on the
silicone or poke a sharp object onto the silicone. These
might damage the product and cause premature failure.
During assembly or handling, the unit should be held on
the body only. Please refer to Avago Application Note AN
5288 for detail information.
– Unused LEDs need to be stored in sealed MBB with
desiccant or in desiccator at <5% RH.
For product information and a complete list of distributors, please go to our website:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2013 Avago Technologies. All rights reserved. Obsoletes AV01-0312EN
AV02-0479EN - March 20, 2013
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