BOARDCOM HSMP-4810 Surface mount rf pin low distortion attenuator diode Datasheet

HSMP-381x, 481x
Surface Mount RF PIN
Low Distortion Attenuator Diodes
Data Sheet
Description/Applications
Features
The HSMP-381x series is specifically designed for low distortion attenuator applications. The HSMP-481x products
feature ultra low parasitic inductance in the SOT-23 and
SOT-323 packages. They are specifically designed for use
at frequencies which are much higher than the upper limit
for conventional diodes.
x Diodes Optimized for:
– Low Distortion Attenuating
– Microwave Frequency Operation
x Surface Mount Packages
– Single and Dual Versions
– Tape and Reel Options Available
x Low Failure in Time (FIT) Rate[1]
A SPICE model is not available for PIN diodes as SPICE
does not provide for a key PIN diode characteristic, carrier
lifetime.
x Lead free
Note:
1. For more information see the Surface Mount PIN Reliability Data
Sheet.
Package Lead Code Identification,
SOT-23
(Top View)
SINGLE
3
SERIES
3
1
1
#0
2
COMMON
ANODE
3
1
#3
2
REVERSE
SERIES
3
1
#5
2
#2
2
COMMON
CATHODE
3
1
#4
SINGLE
SERIES
B
C
COMMON
ANODE
COMMON
CATHODE
E
F
2
DUAL
CATHODE
3
1
Package Lead Code Identification,
SOT-323
(Top View)
2
4810
DUAL CATHODE
481B
Absolute Maximum Ratings[1] TC = +25°C
Symbol
Parameter
Unit
SOT-23
SOT-323
If
Forward Current (1 μs Pulse)
Amp
1
1
PIV
Peak Inverse Voltage
V
Same as VBR
Same as VBR
Tj
Junction Temperature
°C
150
150
Tstg
Storage Temperature
°C
-65 to 150
-65 to 150
Tjc
Thermal Resistance [2]
°C/W
500
150
Notes:
1. Operation in excess of any one of these conditions may result in permanent damage to the device.
2. TC = +25°C, where TC is defined to be the temperature at the package pins where contact is made to the circuit board.
Electrical Specifications TC = +25°C (Each Diode)
Conventional Diodes
Part
Number
HSMP-
Package
Marking
Code
Lead
Code
3810
E0
0
Single
3812
E2
2
Series
3813
E3
3
Common Anode
3814
E4
4
Common Cathode
3815
E5
5
Reverse Series
381B
E0
B
Single
Configuration
381C
E2
C
Series
381E
E3
E
Common Anode
381F
E4
F
Common Cathode
Test Conditions
Minimum
Breakdown
Voltage VBR
(V)
Maximum
Total
Capacitance
CT (pF)
Minimum
Resistance
at
IF = 0.01mA,
RH (Ω)
Maximum
Resistance
at
IF = 20mA,
RL (Ω)
100
0.35
1500
VR = VBR
Measure
IR≤ 10uA
VR = 50V
f = 1MHz
IF = 0.01mA IF = 20mA
f = 100MHz f = 100MHz
10
Maximum
Resistance
at
IF = 100mA,
RT (Ω)
Resistance
at
IF = 1mA,
RM (Ω)
3.0
48 to 70
IF = 100mA
f = 100MHz
IF = 1mA
f = 100MHz
High Frequency (Low Inductance, 500 MHz – 3 GHz) PIN Diodes
Part
Number
HSMP-
Package
Marking
Code
Lead
Code
Configuration
4810
EB
B
Dual Cathode
481B
EB
B
Dual Cathode
Test Conditions
2
Minimum
Breakdown
Voltage
VBR (V)
Maximum
Series
Resistance
RS (Ω)
Series
Resistance
IF = 1mA,
RM (Ω)
Typical
Total
Capacitance
CT (pF)
Maximum
Total
Capacitance
CT (pF)
Typical
Total
Inductance
LT (nH)
100
3
48 - 70
0.35
0.4
1
VR = VBR
Measure
IR ≤ 10μA
IF = 100mA
f=
100MHz
IF = 1mA
f = 100MHz
VR = 50V
f = 1MHz
VR = 50V
f = 1MHz
f=
500MHz
- 3GHz
Typical Parameters at TC = 25°C
Part Number
Total
Capacitance
Series Resistance
Carrier Lifetime
Reverse Recovery Time
HSMP-
RS (Ω)
W (ns)
Trr (ns)
CT (pF)
381x
53
1500
300
0.27 @ 50 V
IF = 1 mA
f = 100 MHz
IF = 50 mA
IR = 250 mA
VR = 10 V
IF = 20 mA
90% Recovery
f = 1 MHz
Test Conditions
Typical Parameters at TC = 25°C (unless otherwise noted), Single Diode
0.35
1 MHz
0.30
0.25
30 MHz
0.20
INPUT INTERCEPT POINT (dBm)
0.40
RF RESISTANCE (OHMS)
TOTAL CAPACITANCE (pF)
120
10000
0.45
TA = +85 C
TA = +25 C
TA = –55 C
1000
100
10
frequency>100 MHz
0.15
0
2
4
6
8
1
0.01
10 12 14 16 18 20
1
10
100
90
80
70
60
50
40
1000
IF – FORWARD BIAS CURRENT (mA)
REVERSE VOLTAGE (V)
Figure 1. RF Capacitance vs. Reverse
Bias.
100
IF – FORWARD CURRENT (mA)
0.1
Diode Mounted as a
110 Series Attenuator
in a 50 Ohm Microstrip
100 and Tested at 123 MHz
Figure 2. RF Resistance vs. Forward
Bias Current, f = 100MHz
100
10
DIODE RF RESISTANCE (OHMS)
Figure 3. 2nd Harmonic Input
Intercept Point vs. Diode RF
Resistance.
Typical Applications for Multiple Diode Products
VARIABLE BIAS
10
1
RF IN/OUT
INPUT
0.1
125 C 25 C –50 C
0.01
0
0.2
0.4
0.6
0.8
1.0
1.2
VF – FORWARD VOLTAGE (mA)
Figure 4. Forward Current vs. Forward
Voltage.
FIXED
BIAS
VOLTAGE
Figure 5. Four Diode π Attenuator. See Application Note 1048
for Details.
Notes:
3. Typical values were derived using limited samples during initial product characterization and may not be representative of the overall distribution.
3
Typical Applications for HSMP-481x Low Inductance Series
Microstrip Series Connection for HSMP-481x Series
In order to take full advantage of the low inductance of the
HSMP-481x series when using them in series applications,
both lead 1 and lead 2 should be connected together, as
shown in Figure 7.
3
1
2
HSMP-481x
Figure 6. Internal Connections.
Figure 7. Circuit Layout.
Microstrip Shunt Connections for HSMP-481x Series
In Figure 8, the center conductor of the microstrip
line is interrupted and leads 1 and 2 of the HSMP-481x
series diode are placed across the resulting gap. This forces
the 1.5 nH lead inductance of leads 1 and 2 to appear as
part of a low pass filter, reducing the shunt
parasitic inductance and increasing the maximum available
attenuation. The 0.3 nHof shunt inductance external to the
diode is created by the via holes, and is a good estimate
for 0.032" thick material.
1.5 nH
1.5 nH
50 OHM MICROSTRIP LINES
Rj
0.3 pF
0.3 nH
PAD CONNECTED TO
GROUND BY TWO
VIA HOLES
Figure 8. Circuit Layout.
4
Rj
0.08
+ 2.5
I b0.9
Figure 9. Equivalent Circuit.
0.3 nH
Typical Applications for HSMP-481x Low Inductance Series (continued)
Co-Planar Waveguide Shunt Connection for HSMP-481x
Series
Equivalent Circuit Model
HSMP-381x Chip*
Co-Planar waveguide, with ground on the top side of the
printed circuit board, is shown in Figure 10. Since it eliminates the need for via holes to ground, it offers lower shunt
parasitic inductance and higher maximum attenuation
when compared to microstrip circuit.
Co-Planar Waveguide
Groundplane
Center Conductor
Groundplane
Rs
Rj
2.5 Ω
Cj
RT = 2.5 + R j
CT = CP + Cj
0.18 pF*
* Measured at -20 V
80
R j = 0.9 Ω
I
I = Forward Bias Current in mA
*See AN1124 for package models.
Figure 10. Circuit Layout.
Rj
0.3 pF
0.75 nH
Figure 11. Equivalent Circuit.
5
Assembly Information
SOT-323 PCB Footprint
A recommended PCB pad layout for the miniature SOT-323
(SC-70) package is shown in Figure 12 (dimensions are in
inches). This layout provides ample allowance for package
placement by automated assembly equipment without
adding parasitics that could impair the performance.
0.026
After ramping up from room temperature, the circuit board
with components attached to it (held in place with solder
paste) passes through one or more preheat zones. The
preheat zones increase the temperature of the board and
components to prevent thermal shock and begin evaporating solvents from the solder paste. The reflow zone briefly
elevates the temperature sufficiently to produce a reflow
of the solder.
0.079
0.039
0.022
Dimensions in inches
Figure 12. Recommended PCB Pad Layout
for Avago’s SC70 3L/SOT-323 Products.
SOT-23 PCB Footprint
0.039
1
0.039
1
0.079
2.0
0.035
0.9
0.031
0.8
Dimensions in
inches
mm
Figure 13. Recommended PCB Pad Layout for Avago’s SOT-23 Products.
6
SMT Assembly
Reliable assembly of surface mount components is a
complex process that involves many material, process, and
equipment factors, including: method of heating (e.g., IR
or vapor phase reflow, wave soldering, etc.) circuit board
material, conductor thickness and pattern, type of solder
alloy, and the thermal conductivity and thermal mass of
components. Components with a low mass, such as the
SOT-323/-23 package, will reach solder reflow temperatures faster than those with a greater mass.
The rates of change of temperature for the ramp-up and
cool-down zones are chosen to be low enough to not
cause deformation of the board or damage to components
due to thermal shock. The maximum temperature in the
reflow zone (TMAX) should not exceed 260°C.
These parameters are typical for a surface mount assembly
process for Avago diodes. As a general guideline, the circuit
board and components should be exposed only to the
minimum temperatures and times necessary to achieve a
uniform reflow of solder.
Package Dimensions
Outline SOT-323 (SC-70)
Outline 23 (SOT-23)
e1
e2
e1
E
E
XXX
XXX
E1
E1
e
e
L
B
L
C
D
B
DIMENSIONS (mm)
D
A
A1
Notes:
XXX-package marking
Drawings are not to scale
SYMBOL
A
A1
B
C
D
E1
e
e1
e2
E
L
MIN.
0.79
0.000
0.30
0.08
2.73
1.15
0.89
1.78
0.45
2.10
0.45
MAX.
1.20
0.100
0.54
0.20
3.13
1.50
1.02
2.04
0.60
2.70
0.69
A
A1
Notes:
XXX-package marking
Drawings are not to scale
Package Characteristics
Lead Material .................................................... Copper (SOT-323); Alloy 42 (SOT-23)
Lead Finish ......................................................................... Tin 100% (Lead-free option)
Maximum Soldering Temperature ............................................ 260°C for 5 seconds
Minimum Lead Strength........................................................................... 2 pounds pull
Typical Package Inductance ...................................................................................... 2 nH
Typical Package Capacitance ..............................................0.08 pF (opposite leads)
Ordering Information
Specify part number followed by option. For example:
HSMP - 381x - XXX
Bulk or Tape and Reel Option
Part Number; x = Lead Code
Surface Mount PIN
Option Descriptions
-BLKG = Bulk, 100 pcs. per antistatic bag
-TR1G = Tape and Reel, 3000 devices per 7" reel
-TR2G = Tape and Reel, 10,000 devices per 13" reel
Tape and Reeling conforms to Electronic Industries RS-481, “Taping of Surface
Mounted Components for Automated Placement.”
7
DIMENSIONS (mm)
C
SYMBOL
A
A1
B
C
D
E1
e
e1
E
L
MIN.
MAX.
0.80
1.00
0.00
0.10
0.15
0.40
0.08
0.25
1.80
2.25
1.10
1.40
0.65 typical
1.30 typical
1.80
2.40
0.26
0.46
Device Orientation
For Outlines SOT-23/323
TOP VIEW
REEL
END VIEW
4 mm
8 mm
ABC
ABC
ABC
ABC
CARRIER
TAPE
USER
FEED
DIRECTION
Note: "AB" represents package marking code.
"C" represents date code.
COVER TAPE
Tape Dimensions and Product Orientation
For Outline SOT-23
P
P2
D
E
P0
F
W
D1
t1
Ko
9 MAX
B0
A0
DESCRIPTION
8
13.5 MAX
8 MAX
SYMBOL
SIZE (mm)
SIZE (INCHES)
CAVITY
LENGTH
WIDTH
DEPTH
PITCH
BOTTOM HOLE DIAMETER
A0
B0
K0
P
D1
3.15 ±
2.77 ±
1.22 ±
4.00 ±
1.00 +
PERFORATION
DIAMETER
PITCH
POSITION
D
P0
E
1.50 + 0.10
4.00 ± 0.10
1.75 ± 0.10
0.059 + 0.004
0.157 ± 0.004
0.069 ± 0.004
CARRIER TAPE
WIDTH
THICKNESS
W
t1
8.00 + 0.30 - 0.10
0.229 ± 0.013
0.315 + 0.012 - 0.004
0.009 ± 0.0005
DISTANCE
BETWEEN
CENTERLINE
CAVITY TO PERFORATION
(WIDTH DIRECTION)
F
3.50 ± 0.05
0.138 ± 0.002
CAVITY TO PERFORATION
(LENGTH DIRECTION)
P2
2.00 ± 0.05
0.079 ± 0.002
0.10
0.10
0.10
0.10
0.05
0.124 ±
0.109 ±
0.048 ±
0.157 ±
0.039 ±
0.004
0.004
0.004
0.004
0.002
Tape Dimensions and Product Orientation
For Outline SOT-323
P
P2
D
P0
E
F
W
C
D1
t1 (CARRIER TAPE THICKNESS)
Tt (COVER TAPE THICKNESS)
K0
An
A0
DESCRIPTION
B0
SYMBOL
SIZE (mm)
SIZE (INCHES)
CAVITY
LENGTH
WIDTH
DEPTH
PITCH
BOTTOM HOLE DIAMETER
A0
B0
K0
P
D1
2.40 ± 0.10
2.40 ± 0.10
1.20 ± 0.10
4.00 ± 0.10
1.00 + 0.25
0.094 ± 0.004
0.094 ± 0.004
0.047 ± 0.004
0.157 ± 0.004
0.039 + 0.010
PERFORATION
DIAMETER
PITCH
POSITION
D
P0
E
1.55 ± 0.05
4.00 ± 0.10
1.75 ± 0.10
0.061 ± 0.002
0.157 ± 0.004
0.069 ± 0.004
CARRIER TAPE
WIDTH
THICKNESS
W
t1
8.00 ± 0.30
0.254 ± 0.02
0.315 ± 0.012
0.0100 ± 0.0008
COVER TAPE
WIDTH
TAPE THICKNESS
C
Tt
5.4 ± 0.10
0.062 ± 0.001
0.205 ± 0.004
0.0025 ± 0.00004
DISTANCE
CAVITY TO PERFORATION
(WIDTH DIRECTION)
F
3.50 ± 0.05
0.138 ± 0.002
CAVITY TO PERFORATION
(LENGTH DIRECTION)
P2
2.00 ± 0.05
0.079 ± 0.002
FOR SOT-323 (SC70-3 LEAD)
An
8 C MAX
ANGLE
FOR SOT-363 (SC70-6 LEAD)
An
10 C MAX
For product information and a complete list of distributors, please go to our web site:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2009 Avago Technologies. All rights reserved. Obsoletes AV01-0378EN
AV02-0402EN - December 22, 2009
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