AgilentHSMW-C191/130/265/197/120 White ChipLEDs Data Sheet Features • White color • Small size • Industry standard footprint • Compatible with IR soldering • Compatible with automatic placement equipment • Operating temperature range –30˚C to +85˚C Description These white ChipLEDs come in unique shades of white and provide product differentiation for backlighting application. They are designed in industry standard package for ease of handling and use. These chipLEDs come in either top emitting packages (HSMW-C191, 130, 265, & 197) or in a side emitting package (HSMW-C120). The packages all compatible with IR reflow soldering process and come in 8 mm tape on 7" diameter reel. They are compatible with automatic placement equipment. • Come in 8 mm tape on 7" diameter reels In order to facilitate pick and place operation, these chipLEDs are shipped in tape and reel with 4000 units per reel for HSMW-C191, 130, 197, and 120 packages, and 3000 units per reel for HSMW-C265 package. • Keypad backlighting Applications • LCD backlighting • Pushbutton backlighting • Symbol backlighting CAUTION: HSMW-Cxxx LEDs are Class 1 ESD sensitive per MIL-STD-1686. Please observe appropriate precautions during handling and processing. Refer to Agilent Technologies Application Note AN-1142 for additional details. Package Dimensions CATHODE MARK LED DIE CATHODE MARK LED DIE 0.8 (0.031) 1.25 (0.049) 0.4 (0.016) 1.6 (0.063 ) 3.4 (0.134 ) 1.0 (0.039) POLARITY 0.3 (0.012) DIFFUSED EPOXY POLARITY 1.2 (0.047) 1.1 (0.043) DIFFUSED EPOXY 1.1 (0.043) PC BOARD PC BOARD 0.6 (0.023) 0.3 (0.012) CATHODE LINE 0.30 ± 0.15 (0.012 ± 0.006) 0.30 ± 0.15 (0.012 ± 0.006) 0.3 (0.012) CATHODE LINE 0.50 ± 0.15 (0.020 ± 0.006) 0.50 ± 0.15 (0.020 ± 0.006) 0.7 (0.028) MIN. SOLDERING TERMINAL SOLDERING TERMINAL HSMW-C191 HSMW-C265 LED DIE LED DIE 0.3 (0.012) 0.6 (0.024) 0.8 (0.031) 1.6 (0.063) 1.6 (0.063 ) 0.4 (0.016) POLARITY POLARITY 0.16 (0.006) DIFFUSED EPOXY 1.2 (0.047) DIFFUSED EPOXY 1.0 (0.039) PC BOARD PC BOARD 0.4 (0.016) 0.5 (0.020) CATHODE LINE 0.3 ± 0.15 (0.012 ± 0.006) CATHODE LINE 0.7 (0.028) MIN. SOLDERING TERMINAL SOLDERING TERMINAL HSMW-C197 NOTES: 1. DIMENSIONS ARE IN MILLIMETERS (INCHES). 2. TOLERANCE ± 0.1 mm UNLESS OTHERWISE NOTED. 2 HSMW-C120 3 – 0.3 (0.012) Package Dimensions, continued Cathode Mark LED Die 0.8 0.031 (0.80) 1.6 0.063 Polarity 1.15 0.045 0.23 0.009 DIFFUSED EPOXY 0.35 0.014 PCB BOARD 0.12 0.005 Cathode Line 0.3`0.15 0.012`.006 0.3`0.15 0.012`.006 0.7 MIN. 0.028 Soldering Terminal HSMW-C130 NOTES: 1. DIMENSIONS ARE IN MILLIMETERS (INCHES). 2. TOLERANCE ± 0.1 mm UNLESS OTHERWISE NOTED. 3 Device Selection Guide Package Dimension (mm) 1.6 (L) x 0.8 (W) x 0.6 (H) 1.6 (L) x 0.8 (W) x 0.35 (H) 3.4 (L) x 1.25 (W) x 1.1 (H)[2] 1.6 (L) x 0.8 (W) x 0.4 (H) 1.6 (L) x 0.6 (W) x 1.0 (H) White HSMW-C191 HSMW-C130 HSMW-C265 HSMW-C197 HSMW-C120 Package Untinted, Untinted, Untinted, Untinted, Untinted, Description Diffused Diffused Diffused Diffused Diffused Notes: 1. Right angle package. 2. Reverse mount package. Absolute Maximum Ratings at TA = 25˚C Parameter DC Forward Current[1] Power Dissipation Reverse Voltage (IR = 100 µA) LED Junction Temperature Operating Temperature Range Storage Temperature Range Soldering Temperature HSMW-Cxxx Units 20 mA 78 mW 5 V 95 ˚C –30 to +85 ˚C –40 to +85 ˚C See reflow soldering profile (Figures 10 & 11) Note: 1. Derate linearly as shown in Figure 4. Electrical Characteristics at TA = 25˚C Part Number HSMW-Cxxx Note: 1. VF tolerance: ± 0.1 V. 4 Forward Voltage VF (Volts) @ IF = 20 mA[1] Typ. Max. 3.6 3.9 Reverse Breakdown VR (Volts) @ IR = 100 µA Min. 5 Capacitance C (pF), VF = 0, f = 1 MHz Typ. 55 Thermal Resistance RθJ-PIN (˚C/W) Typ. 450 Optical Characteristics at TA = 25˚C Part Number HSMW-C130 HSMW-C191 HSMW-C265 HSMW-C120 HSMW-C197 Luminous Intensity Iv (mcd) @ 20 mA[1, 4] Min. Typ. 45 150 71.5 200 71.5 180 45 160 45 160 Chromaticity Coordinates[2] Typ. x y 0.29 0.27 0.29 0.27 0.29 0.27 0.29 0.27 0.29 0.27 Viewing Angle 2 θ1/2 Degrees[3] Typ. 145 140 150 155 130 Luminous Efficacy ηv (lm/w) Typ. 240 240 240 240 240 Notes: 1. The luminous intensity, Iv, is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the lamp package. 2. The dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the perceived color of the device. 3. θ1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. 4. Luminous intensity (Iv) tolerance: ± 15%. Light Intensity (Iv) Bin Limits[1] Intensity (mcd) Bin ID Min. Max. A 0.11 0.18 B 0.18 0.29 C 0.29 0.45 D 0.45 0.72 E 0.72 1.10 F 1.10 1.80 G 1.80 2.80 H 2.80 4.50 J 4.50 7.20 K 7.20 11.20 L 11.20 18.00 M 18.00 28.50 N 28.50 45.00 P 45.00 71.50 Q 71.50 112.50 R 112.50 180.00 S 180.00 285.00 T 285.00 450.00 U 450.00 715.00 V 715.00 1125.00 W 1125.00 1800.00 X 1800.00 2850.00 Y 2850.00 4500.00 Tolerance: ± 15% 5 Note: 1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Agilent representative for information on currently available bins. SMT WHITE COLOR BIN STRUCTURES 0.40 100 D1 C1 0.28 0.26 0.24 0.22 B1 A1 D2 C2 B2 A2 0.20 0.18 0.16 0.24 0.26 0.28 0.30 0.32 10 1 0.1 0.34 2.0 X-COORDINATE 2.5 3.0 25 0.8 0.6 0.4 0.2 0 5 10 15 Figure 3. Luminous intensity vs. forward current. 90 RELATIVE INTENSITY – % 20 15 10 5 80 70 60 50 40 30 20 10 0 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 TA – AMBIENT TEMPERATURE – °C 0 10 20 30 40 50 60 70 80 90 ANGLE Figure 5. Relative intensity vs. angle for HSMW-C191. 90 80 70 60 50 40 30 20 10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE Figure 6. Relative intensity vs. angle for HSMW-C130. 20 IF – FORWARD CURRENT – mA 100 100 RELATIVE INTENSITY – % 1.0 0 4.0 Figure 2. Forward current vs. forward voltage. Figure 4. Maximum forward current vs. ambient temperature. 6 3.5 VF – FORWARD VOLTAGE – V Figure 1. Color bin limits (CIE 1931 Chromaticity Diagram) [Tolerance: ± 0.02]. IF MAX. – MAXIMUM FORWARD CURRENT – mA 1.2 LUMINOUS INTENSITY (NORMALIZED AT 20 mA) 0.36 0.34 0.32 0.30 IF – FORWARD CURRENT – mA Y-COORDINATE 0.38 25 100 RELATIVE INTENSITY – % 90 80 70 60 50 40 30 20 10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE Figure 7. Relative intensity vs. angle for HSMW-C265. 100 RELATIVE INTENSITY – % 90 80 70 60 50 40 30 20 10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE Figure 8. Relative intensity vs. angle for HSMW-C197. 7 100 RELATIVE INTENSITY 90 80 70 60 50 40 30 20 10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE 100 RELATIVE INTENSITY 90 80 70 60 50 40 30 20 10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE Figure 9. Relative intensity vs. angle for HSMW-C120. 8 10 to 20 SEC. 255 °C (+5/-0) TEMPERATURE 217 °C TEMPERATURE 10 SEC. MAX. 230°C MAX. 4°C/SEC. MAX. 140-160°C 3 °C/SEC. MAX. 6 °C/SEC. MAX. 100 - 150 °C 60 to 150 SEC. MAX. 120 SEC. –3°C/SEC. 4°C/SEC. MAX. TIME OVER 2 MIN. TIME * THE TIME FROM 25 °C TO PEAK TEMPERATURE = 6 MINUTES MAX. Figure 11. Recommended Pb-free reflow soldering profile. Figure 10. Recommended reflow soldering profile. 2.2 (0.087) DIA. PCB HOLE 0.8 (0.031) 0.8 (0.031) 0.7 (0.028) 1.25 (0.049) 0.8 (0.031) 1.4 (0.055) 0.4 (0.016) 0.4 (0.016) 0.7 (0.028) 0.15 (0.006) CENTERING BOARD 1.2 (0.047) 0.8 (0.031) Figure 14. Recommended soldering pad pattern for HSMW-C120. NOTE: 1. DIMENSIONS ARE IN MILLIMETERS (INCHES). 9 1.4 (0.055) Figure 13. Recommended soldering pad pattern for HSMW-C265. Figure 12. Recommended soldering pattern for HSMW-C191, HSMW-C130, and HSMW-C197. 0.8 (0.031) 2.3 (0.091) USER FEED DIRECTION CATHODE SIDE xxx xxxxx xxxxx xxxxx xxxxx xx PRINTED LABEL Figure 15. Reeling orientation. 8.0 ± 1.0 (0.315 ± 0.039) 10.50 ± 1.0 (0.413 ± 0.039) Ø 13.1 ± 0.5 (Ø 0.516 ± 0.020) Ø 20.20 MIN. (Ø 0.795 MIN.) 3.0 ± 0.5 (0.118 ± 0.020) 59.60 ± 1.00 (2.346 ± 0.039) 178.40 ± 1.00 (7.024 ± 0.039) 4.0 ± 0.5 (0.157 ± 0.020) 6 PS Figure 16. Reel dimensions. NOTE: 1. DIMENSIONS ARE IN MILLIMETERS (INCHES). 10 5.0 ± 0.5 (0.197 ± 0.020) 4.00 (0.157) DIM. C (SEE TABLE 1) CATHODE 1.50 (0.059) 0.20 ± 0.05 (0.008 ± 0.002) 1.75 (0.069) 3.50 ± 0.05 (0.138 ± 0.002) DIM. A (SEE TABLE 1) 8.00 ± 0.30 (0.315 ± 0.012) DIM. B (SEE TABLE 1) CARRIER TAPE USER FEED DIRECTION 2.00 ± 0.05 (0.079 ± 0.002) COVER TAPE 4.00 (0.157) TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) DIM. A DIM. B DIM. C ± 0.10 (± 0.004) ± 0.10 (± 0.004) ± 0.10 (± 0.004) PART NUMBER HSMW-C120 POSITION IN CARRIER TAPE DIM. A (SEE TABLE 1) DIM. B (SEE TABLE 1) HSMW-C191 SERIES 1.85 (0.073) 0.88 (0.035) 0.85 (0.033) HSMW-C197 SERIES 1.75 (0.069) 0.95 (0.037) 0.60 (0.024) HSMW-C120 SERIES 1.90 (0.075) 1.15 (0.045) 0.80 (0.031) HSMW-C130 SERIES 1.75 (0.069) 0.90 (0.035) 0.60 (0.024) HSMW-C120 R 0.5 ± 0.05 (0.020 ± 0.002) 4.00 (0.157) CATHODE 1.50 (0.059) DIM. C (SEE TABLE 1) 0.20 ± 0.05 (0.008 ± 0.002) 1.75 (0.069) 3.50 ± 0.05 (0.138 ± 0.002) DIM. A (SEE TABLE 1) 8.00 ± 0.30 (0.315 ± 0.012) DIM. B (SEE TABLE 1) 2.00 ± 0.05 (0.079 ± 0.002) CARRIER TAPE USER FEED DIRECTION 4.00 (0.157) PART NUMBER DIM. A DIM. B DIM. C ± 0.10 (0.004) ± 0.10 (0.004) ± 0.10 (0.004) HSMx-C265 SERIES 3.70 (0.146) 1.45 (0.057) Figure 17. Tape dimensions. NOTE: 1. DIMENSIONS ARE IN MILLIMETERS (INCHES). 11 COVER TAPE TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) 1.30 (0.051) END THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. START MOUNTED WITH COMPONENTS THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. Figure 18. Tape leader and trailer dimensions. www.agilent.com/semiconductors For product information and a complete list of distributors, please go to our web site. For technical assistance call: Americas/Canada: +1 (800) 235-0312 or (916) 788-6763 Europe: +49 (0) 6441 92460 China: 10800 650 0017 Hong Kong: (+65) 6756 2394 India, Australia, New Zealand: (+65) 6755 1939 Japan: (+81 3) 3335-8152 (Domestic/International), or 0120-61-1280 (Domestic Only) Korea: (+65) 6755 1989 Singapore, Malaysia, Vietnam, Thailand, Philippines, Indonesia: (+65) 6755 2044 Taiwan: (+65) 6755 1843 Data subject to change. Copyright © 2004 Agilent Technologies, Inc. Obsoletes 5988-9580EN April 29, 2004 5989-0395EN Convective IR Reflow Soldering For more information on IR reflow soldering, refer to Application Note 1060, Surface Mounting SMT LED Indicator Components. MINIMUM OF 230 mm (9.05 INCH) MAY CONSIST OF CARRIER AND/OR COVER TAPE. Storage Condition: 5 to 30°C @ 60% RH max. Baking is required under the condition: a) the blue silica gel indicator becoming white/transparent color b) the pack has been open for more than 1 week Baking recommended condition: 60 ± 5°C for 20 hours.